CN114605867A - Photosensitive solder resist ink and preparation method thereof - Google Patents
Photosensitive solder resist ink and preparation method thereof Download PDFInfo
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- CN114605867A CN114605867A CN202210280879.4A CN202210280879A CN114605867A CN 114605867 A CN114605867 A CN 114605867A CN 202210280879 A CN202210280879 A CN 202210280879A CN 114605867 A CN114605867 A CN 114605867A
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- stirrer
- photosensitizer
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 110
- 238000000034 method Methods 0.000 claims abstract description 77
- 230000008569 process Effects 0.000 claims abstract description 64
- 239000000945 filler Substances 0.000 claims abstract description 63
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 63
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000005011 phenolic resin Substances 0.000 claims abstract description 61
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 60
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims abstract description 60
- 238000001723 curing Methods 0.000 claims abstract description 50
- 239000003504 photosensitizing agent Substances 0.000 claims abstract description 49
- 239000000049 pigment Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 9
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 7
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims description 51
- 230000015572 biosynthetic process Effects 0.000 claims description 48
- 238000003786 synthesis reaction Methods 0.000 claims description 48
- 230000002194 synthesizing effect Effects 0.000 claims description 35
- 238000002156 mixing Methods 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- 239000003085 diluting agent Substances 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 7
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- 239000003963 antioxidant agent Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 6
- 239000001023 inorganic pigment Substances 0.000 claims description 6
- 239000011707 mineral Substances 0.000 claims description 6
- 239000012860 organic pigment Substances 0.000 claims description 6
- -1 red earth Inorganic materials 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 4
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- 238000004132 cross linking Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 3
- 230000002745 absorbent Effects 0.000 claims description 3
- 239000002250 absorbent Substances 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 3
- 150000004056 anthraquinones Chemical class 0.000 claims description 3
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052956 cinnabar Inorganic materials 0.000 claims description 3
- PPSZHCXTGRHULJ-UHFFFAOYSA-N dioxazine Chemical compound O1ON=CC=C1 PPSZHCXTGRHULJ-UHFFFAOYSA-N 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 238000005485 electric heating Methods 0.000 claims description 3
- 238000005886 esterification reaction Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- 235000021388 linseed oil Nutrition 0.000 claims description 3
- 239000000944 linseed oil Substances 0.000 claims description 3
- 229940107698 malachite green Drugs 0.000 claims description 3
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 239000002480 mineral oil Substances 0.000 claims description 3
- 235000010446 mineral oil Nutrition 0.000 claims description 3
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000003367 polycyclic group Chemical group 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 235000007686 potassium Nutrition 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 239000012279 sodium borohydride Substances 0.000 claims description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
- 239000001119 stannous chloride Substances 0.000 claims description 3
- 235000011150 stannous chloride Nutrition 0.000 claims description 3
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010456 wollastonite Substances 0.000 claims description 3
- 229910052882 wollastonite Inorganic materials 0.000 claims description 3
- 238000005282 brightening Methods 0.000 claims description 2
- YAGKRVSRTSUGEY-UHFFFAOYSA-N ferricyanide Chemical compound [Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] YAGKRVSRTSUGEY-UHFFFAOYSA-N 0.000 claims description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012760 heat stabilizer Substances 0.000 claims description 2
- 238000012643 polycondensation polymerization Methods 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 229910052957 realgar Inorganic materials 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 2
- 235000000177 Indigofera tinctoria Nutrition 0.000 claims 1
- 229940097275 indigo Drugs 0.000 claims 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 claims 1
- 239000003518 caustics Substances 0.000 abstract description 7
- 125000003700 epoxy group Chemical group 0.000 abstract description 7
- 238000001035 drying Methods 0.000 abstract description 5
- 238000000016 photochemical curing Methods 0.000 abstract description 3
- 229920001225 polyester resin Polymers 0.000 abstract description 3
- 239000004645 polyester resin Substances 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract description 3
- 239000004640 Melamine resin Substances 0.000 abstract 2
- 238000005336 cracking Methods 0.000 abstract 1
- 230000001276 controlling effect Effects 0.000 description 8
- 239000002253 acid Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005518 electrochemistry Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 206010034960 Photophobia Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000010428 baryte Substances 0.000 description 1
- 229910052601 baryte Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- UZUJHVIPEZFEKR-UHFFFAOYSA-L iron(2+);dicyanate Chemical compound [Fe+2].[O-]C#N.[O-]C#N UZUJHVIPEZFEKR-UHFFFAOYSA-L 0.000 description 1
- 229910001710 laterite Inorganic materials 0.000 description 1
- 239000011504 laterite Substances 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052958 orpiment Inorganic materials 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/103—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds of aldehydes, e.g. phenol-formaldehyde resins
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to the technical field of photosensitive solder resist ink and discloses photosensitive solder resist ink and a preparation method thereof; the photosensitive solder resist ink and the preparation method thereof comprise the following materials: the epoxy acrylate resin, the phenolic resin, the filling agent, the anti-skinning agent, the photosensitizer, the curing agent, the environment-friendly solvent, the pigment and the defoaming agent are used, the photocuring speed of the epoxy acrylate resin is the fastest among various oligomers, the influence of corrosive substances released by a circuit board on ink can be effectively reduced, the melamine copolymer resin, the epoxy resin and the polyester resin are added into the curing agent, the molecular structure of the epoxy resin is characterized in that active epoxy groups are contained in molecular chains, compared with the traditional melamine resin, the melamine copolymer resin improves the cracking resistance and the stain resistance of the melamine resin, and avoids the influence of mechanical drying and film forming of the ink on the integrity and the attractiveness of the ink in the spraying process.
Description
Technical Field
The invention belongs to the technical field of photosensitive solder resist ink, and particularly relates to photosensitive solder resist ink and a preparation method thereof.
Background
The liquid photosensitive solder resist ink is a two-component dilute alkali solution developing ink and has double functions of light sensitivity and heat curing; the developing solution is used for manufacturing double-sided and multi-layer circuit board solder mask patterns, and the developed solder mask has high brightness, hardness and adhesive force, excellent thermal shock resistance, acid and alkali resistance and solvent resistance. Has green, blue, gold, red, black, etc.
The existing photosensitive solder resist ink has certain defects when in use, and when the existing photosensitive solder resist ink is in contact with a circuit board for a long time, corrosive substances are easy to generate after the circuit board is aged, and the corrosive substances can cause certain influence on the photosensitive solder resist ink; therefore, improvements are now needed in view of the current situation.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the invention provides the photosensitive solder resist ink and the preparation method thereof, which effectively solve the problems that the conventional photosensitive solder resist ink is in long-term contact with a circuit board, corrosive substances are easy to generate after the circuit board is aged, and the corrosive substances can affect the photosensitive solder resist ink to a certain extent.
In order to achieve the purpose, the invention provides the following technical scheme: the photosensitive solder resist ink comprises the following materials: epoxy acrylate resin, phenolic resin, a filler, an anti-skinning agent, a photosensitizer, a curing agent, an environment-friendly solvent, a pigment and a defoaming agent.
Preferably, the weight parts of the raw materials are as follows: 100-150 parts of epoxy acrylate resin, 20-30 parts of phenolic resin, 50-75 parts of filler, 5-10 parts of anti-skinning agent, 10-20 parts of photosensitizer, 5-10 parts of curing agent, 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent.
Preferably, the epoxy acrylate resin is prepared by esterification reaction of phenolic resin and acrylic acid or methacrylic acid, and the phenolic resin is prepared by condensation polymerization of phenol aldehyde or derivatives thereof.
Preferably, the filler is one or a combination of several of a diluent or a diluent, the anti-skinning agent is one or a combination of several of an organic reducing agent or an antioxidant, the sensitizer is one or a combination of several of an antioxidant, a heat stabilizer, an ultraviolet light (UV light) absorbent or an inhibitor, the curing agent is an acrylate monomer obtained by crosslinking one or several of melamine copolymer resin, epoxy resin and polyurethane, the acrylate monomer is one or a combination of several of methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate or n-butyl methacrylate, and the pigment is one or a combination of several of natural minerals, organic pigments or inorganic pigments.
Preferably, the diluent comprises one or a combination of several of mineral oil or oligomeric linseed oil, the thinner is specifically one or a combination of several of white ink, transparent glaze or brightening slurry, the organic reducing agent is specifically one or a combination of several of stannous chloride, oxalic acid, potassium borohydride, sodium borohydride or ethanol, the natural mineral is specifically one or a combination of several of cinnabar, laterite, realgar, malachite green and heavy calcium carbonate, wollastonite, baryte powder, talcum powder, mica powder and kaolin, the organic pigment is specifically one or a combination of several of azo pigment, phthalocyanine pigment, anthraquinone, indigoid, quinacridone, dioxazine and other polycyclic pigments or arylmethane series pigment, and the inorganic pigment is specifically one or a combination of several of oxide, chromate, sulfate, silicate, borate, molybdate, phosphate, vanadate, iron cyanate, and the like, Hydroxide, sulfide or metal, or a combination of several of them.
Preferably, the method sequentially comprises the following steps: preparing materials, synthesizing resin, synthesizing a filling agent, synthesizing an anti-skinning agent, synthesizing a photosensitizer, synthesizing a curing agent, and mixing and defoaming;
the preparation process of the material comprises the following specific steps: preparing 100-150 parts of epoxy acrylate resin, 20-30 parts of phenolic resin, 50-75 parts of filler, 5-10 parts of anti-skinning agent, 10-20 parts of photosensitizer, 5-10 parts of curing agent, 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent for later use;
the resin synthesis process comprises the following specific steps: 150 parts of prepared epoxy acrylate resin 100-one and 20-30 parts of phenolic resin are put into a stirrer for stirring, the temperature in the stirrer is kept at 25-35 ℃ for stirring for 5-10min, and the rotating speed of the stirrer is controlled at 1500-one/min;
the filler synthesis process specifically comprises the following steps: 50-75 parts of filler is put into a stirrer for mixing epoxy acrylate resin and phenolic resin, the temperature is kept at 25-35 ℃, the rotating speed of the stirrer is adjusted to 700 and 800r/min, and the stirring is carried out for 10-15 min;
the anti-skinning agent synthesis process specifically comprises the following steps: 5-10 parts of anti-skinning agent is put into a stirrer which is already mixed with epoxy acrylate resin, phenolic resin and filler, the temperature is controlled at 30-40 ℃, the rotating speed is adjusted to 650r/min for stirring for 5-8 min;
the photosensitizer synthesis process comprises the following specific steps: 10-20 parts of photosensitizer are put into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, filler and anti-skinning agent, the rotating speed is adjusted to 1000-1200r/min, the temperature is controlled at 30-35 ℃, and the stirring is carried out for 7-10 min;
the synthesis process of the curing agent comprises the following specific steps: 5-10 parts of curing agent is put into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent and photosensitizer, the temperature is kept at 25-30 ℃, the rotating speed of the stirrer is controlled at 900r/min, and the stirring is carried out for 10-15 min;
the mixing and defoaming working procedures are as follows: 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent are added into a stirring machine mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent, photosensitizer and curing agent, the temperature is kept at 30-35 ℃, the rotating speed of the stirring machine is controlled at 600r/min, and the stirring time is 15-20 min.
Preferably, the material preparation process, the resin synthesis process, the filler synthesis process, the anti-skinning agent synthesis process, the photosensitizer synthesis process, the curing agent synthesis process and the material transportation in the mixed defoaming process are all one or more modes of manual transportation, cart transportation, conveyor belt transportation or automobile transportation.
Preferably, the model of the stirrer used in the resin synthesis process, the filler synthesis process, the antiskinning agent synthesis process, the photosensitizer synthesis process, the curing agent synthesis process and the mixing and defoaming process is a stainless steel reaction kettle electric heating stirring tank, and the stirrer is made of 316L stainless steel.
Compared with the prior art, the invention has the beneficial effects that: 1. according to the invention, the epoxy acrylate resin and the phenolic resin are mixed to form the basic mixed solution, the photocuring speed of the epoxy acrylate resin is the fastest among various oligomers, and the cured coating has the characteristics of high hardness, good glossiness, excellent corrosion resistance, excellent heat resistance, excellent electrochemistry and the like, the phenolic resin has good acid resistance, mechanical property and heat resistance, and the epoxy acrylate resin and the phenolic resin have excellent acid resistance and corrosion resistance, so that the influence of corrosive substances released by a circuit board on ink can be effectively reduced.
2. The melamine copolymer resin, the epoxy resin and the polyester resin are added into the curing agent, the molecular structure of the epoxy resin is characterized in that a molecular chain contains active epoxy groups, the epoxy groups can be positioned at the tail end, the middle or in a ring structure of the molecular chain, and the molecular structure of the epoxy resin contains active epoxy groups, so that the epoxy resin and the curing agent can generate cross-linking reaction to form insoluble and infusible high polymers with a three-dimensional network structure.
3. According to the invention, the anti-skinning agent is added into the mixed solution, and the drying speed of the ink is inhibited by adding the anti-skinning agent, so that the ink is prevented from drying and forming a film on a machine, and the integrity and the attractiveness of the ink in the spraying process are prevented from being influenced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
In the drawings:
FIG. 1 is a process flow chart of a photosensitive solder resist ink and a preparation method thereof according to the present invention;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In order to achieve the purpose, the invention provides the following technical scheme: the photosensitive solder resist ink comprises the following materials: epoxy acrylate resin, phenolic resin, a filler, an anti-skinning agent, a photosensitizer, a curing agent, an environment-friendly solvent, a pigment and a defoaming agent.
Wherein, the epoxy acrylate resin comprises 100-150 parts of epoxy acrylate resin, 20-30 parts of phenolic resin, 50-75 parts of filler, 5-10 parts of anti-skinning agent, 10-20 parts of photosensitizer, 5-10 parts of curing agent, 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent, the epoxy acrylate resin is prepared by esterification reaction of phenolic resin and acrylic acid or methacrylic acid, the phenolic resin is prepared by polycondensation of phenol formaldehyde or derivatives thereof, the filler is specifically one or a combination of a plurality of diluents or thinner, the anti-skinning agent is specifically one or a combination of a plurality of organic reducing agents or antioxidants, the photosensitizer is specifically a combination of one or a plurality of antioxidants, a thermal stabilizer, an Ultraviolet (UV) absorbent or inhibitor, and the curing agent is specifically a combination of one or a plurality of melamine copolymer resin, and an acrylic ester monomer added, The acrylic ester monomer is one or a combination of a plurality of acrylic ester monomers, such as methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate or n-butyl methacrylate, the pigment is one or a combination of a plurality of natural minerals, organic pigments or inorganic pigments, the diluent comprises one or a combination of a plurality of mineral oil or oligomeric linseed oil, the diluent is one or a combination of a plurality of white ink, transparent glaze or bright slurry, the organic reducing agent is one or a combination of a plurality of stannous chloride, oxalic acid, potassium borohydride, sodium borohydride or ethanol, the natural minerals are cinnabar, red orpiment, malachite green and one or a combination of a plurality of heavy calcium carbonate, wollastonite, barite powder, talcum powder, mica powder and kaolin, and the organic pigment is azo pigment, Phthalocyanine pigment, anthraquinone, indigoid, quinacridone, dioxazine and other polycyclic pigments or one or more of arylmethane pigments, and the inorganic pigment is one or more of oxide, chromate, sulfate, silicate, borate, molybdate, phosphate, vanadate, ferricyanate, hydroxide, sulfide or metal.
As shown in FIG. 1, a photosensitive solder resist ink and a preparation method thereof sequentially comprise the following steps: preparing materials, synthesizing resin, synthesizing a filling agent, synthesizing an anti-skinning agent, synthesizing a photosensitizer, synthesizing a curing agent, and mixing and defoaming;
the preparation process of the material comprises the following specific steps: preparing 100-150 parts of epoxy acrylate resin, 20-30 parts of phenolic resin, 50-75 parts of filler, 5-10 parts of anti-skinning agent, 10-20 parts of photosensitizer, 5-10 parts of curing agent, 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent for later use;
the resin synthesis process comprises the following specific steps: 150 parts of prepared epoxy acrylate resin 100-one and 20-30 parts of phenolic resin are put into a stirrer for stirring, the temperature in the stirrer is kept at 25-35 ℃ for stirring for 5-10min, and the rotating speed of the stirrer is controlled at 1500-one/min;
the filler synthesis process specifically comprises the following steps: 50-75 parts of filler is put into a stirrer for mixing epoxy acrylate resin and phenolic resin, the temperature is kept at 25-35 ℃, the rotating speed of the stirrer is adjusted to 700 and 800r/min, and the stirring is carried out for 10-15 min;
the anti-skinning agent synthesis process specifically comprises the following steps: 5-10 parts of anti-skinning agent is put into a stirrer mixed with epoxy acrylate resin, phenolic resin and filler, the temperature is controlled at 30-40 ℃, the rotating speed is adjusted to 500-650r/min, and the stirring is carried out for 5-8 min;
the photosensitizer synthesis process comprises the following specific steps: 10-20 parts of photosensitizer are put into a stirrer which is uniformly mixed with the epoxy acrylate resin, the phenolic resin, the filling agent and the anti-skinning agent, the rotating speed is regulated to 1000-1200r/min, the temperature is controlled to be 30-35 ℃, and the stirring is carried out for 7-10 min;
the process for synthesizing the curing agent comprises the following specific steps: 5-10 parts of curing agent is put into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent and photosensitizer, the temperature is kept at 25-30 ℃, the rotating speed of the stirrer is controlled at 900r/min, and the stirring is carried out for 10-15 min;
the mixing and defoaming working procedures are as follows: 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent are added into a stirring machine mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent, photosensitizer and curing agent, the temperature is kept at 30-35 ℃, the rotating speed of the stirring machine is controlled at 600r/min, and the stirring time is 15-20 min.
The stirring machine model used in the resin synthesis process, the filler synthesis process, the curing agent synthesis process and the mixing defoaming process is specifically a stainless steel reaction kettle electric heating stirring tank, and the stirring machine is specifically made of 316L stainless steel.
Example one
A photosensitive solder resist ink and a preparation method thereof sequentially comprise the following steps: preparing materials, synthesizing resin, synthesizing a filling agent, synthesizing an anti-skinning agent, synthesizing a photosensitizer, synthesizing a curing agent, and mixing and defoaming;
the preparation process of the material comprises the following specific steps: preparing 100 parts of epoxy acrylate resin, 20 parts of phenolic resin, 50 parts of filler, 5 parts of anti-skinning agent, 10 parts of photosensitizer, 5 parts of curing agent, 6 parts of environment-friendly solvent, 5 parts of pigment and 7 parts of defoaming agent for later use;
the resin synthesis process comprises the following specific steps: 100 parts of prepared epoxy acrylate resin and 20 parts of phenolic resin are put into a stirrer to be stirred, the temperature in the stirrer body is kept at 25 ℃ and stirred for 5min, and the rotating speed of the stirrer is controlled at 1200 r/min;
the filler synthesis process specifically comprises the following steps: 50 parts of filler is put into a stirrer for mixing epoxy acrylate resin and phenolic resin, the temperature is kept at 25 ℃, the rotating speed of the stirrer is adjusted to 700r/min, and the stirring is carried out for 10 min;
the anti-skinning agent synthesis process specifically comprises the following steps: 5 parts of anti-skinning agent is put into a stirrer mixed with epoxy acrylate resin, phenolic resin and filler, the temperature is controlled at 30 ℃, the rotating speed is adjusted to 500r/min, and the stirring is carried out for 5 min;
the photosensitizer synthesis process comprises the following specific steps: putting 10 parts of photosensitizer into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, a filling agent and an anti-skinning agent, adjusting the rotating speed to 1000r/min, controlling the temperature to be 30 ℃, and stirring for 7 min;
the process for synthesizing the curing agent comprises the following specific steps: 5 parts of curing agent is put into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent and photosensitizer, the temperature is kept at 25 ℃, the rotating speed of the stirrer is controlled at 750r/min, and the stirring is carried out for 10 min;
the mixing and defoaming working procedures are as follows: 6 parts of environment-friendly solvent, 5 parts of pigment and 7 parts of defoaming agent are added into a stirring machine mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent, photosensitizer and curing agent, the temperature is kept at 30 ℃, the rotating speed of the stirring machine is controlled at 500r/min, and stirring is carried out for 15 min.
The photosensitive solder resist ink prepared by the method is prepared by mixing the epoxy acrylate resin and the phenolic resin to form a basic mixed solution, the photocuring speed of the epoxy acrylate resin is the fastest among various oligomers, a cured coating film has the characteristics of high hardness, good glossiness, corrosion resistance, heat resistance, excellent electrochemistry and the like, the phenolic resin has good acid resistance, mechanical property and heat resistance, the epoxy acrylate resin and the phenolic resin have excellent acid resistance and corrosion resistance, and the influence of corrosive substances released by a circuit board on the ink can be effectively reduced.
Example two
A photosensitive solder resist ink and a preparation method thereof sequentially comprise the following steps: preparing materials, synthesizing resin, synthesizing a filling agent, synthesizing an anti-skinning agent, synthesizing a photosensitizer, synthesizing a curing agent, and mixing and defoaming;
the preparation process of the material comprises the following specific steps: preparing 120 parts of epoxy acrylate resin, 25 parts of phenolic resin, 60 parts of filler, 7 parts of anti-skinning agent, 15 parts of photosensitizer, 7 parts of curing agent, 7 parts of environment-friendly solvent, 7 parts of pigment and 10 parts of defoaming agent for later use;
the resin synthesis process comprises the following specific steps: putting 120 parts of prepared epoxy acrylate resin and 25 parts of prepared phenolic resin into a stirrer for stirring, keeping the temperature in a stirrer body at 30 ℃ and stirring for 7min, and controlling the rotating speed of the stirrer at 1300 r/min;
the filler synthesis process specifically comprises the following steps: adding 60 parts of filler into a stirrer for mixing epoxy acrylate resin and phenolic resin, keeping the temperature at 30 ℃, adjusting the rotating speed of the stirrer to 750r/min, and stirring for 12 min;
the anti-skinning agent synthesis process specifically comprises the following steps: putting 7 parts of anti-skinning agent into a stirrer mixed with epoxy acrylate resin, phenolic resin and filler, controlling the temperature at 35 ℃, adjusting the rotating speed to 600r/min, and stirring for 7 min;
the photosensitizer synthesis process comprises the following specific steps: putting 15 parts of photosensitizer into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, a filling agent and an anti-skinning agent, adjusting the rotating speed to 1100r/min, controlling the temperature to be 32 ℃, and stirring for 8 min;
the process for synthesizing the curing agent comprises the following specific steps: adding 7 parts of curing agent into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent and photosensitizer, keeping the temperature at 28 ℃, controlling the rotating speed of the stirrer at 800r/min, and stirring for 13 min;
the mixing and defoaming working procedures are as follows: adding 7 parts of environment-friendly solvent, 7 parts of pigment and 7 parts of defoaming agent into a stirrer mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent, photosensitizer and curing agent, keeping the temperature at 32 ℃, controlling the rotating speed of the stirrer at 550r/min, and stirring for 18 min.
The photosensitive solder resist ink is prepared by the method, the melamine copolymer resin, the epoxy resin and the polyester resin are added into the curing agent, the molecular structure of the epoxy resin is characterized in that a molecular chain contains active epoxy groups, the epoxy groups can be positioned at the tail end, the middle or the ring structure of the molecular chain, and the molecular structure of the epoxy resin contains active epoxy groups, so that the epoxy resin and the curing agent can generate cross-linking reaction to form insoluble and infusible high polymers with a three-dimensional network structure.
EXAMPLE III
A photosensitive solder resist ink and a preparation method thereof sequentially comprise the following steps: preparing materials, synthesizing resin, synthesizing a filling agent, synthesizing an anti-skinning agent, synthesizing a photosensitizer, synthesizing a curing agent, mixing and defoaming;
the preparation process of the material comprises the following specific steps: preparing 150 parts of epoxy acrylate resin, 30 parts of phenolic resin, 75 parts of filler, 10 parts of anti-skinning agent, 20 parts of photosensitizer, 10 parts of curing agent, 8 parts of environment-friendly solvent, 10 parts of pigment and 15 parts of defoaming agent for later use;
the resin synthesis process comprises the following specific steps: 150 parts of prepared epoxy acrylate resin and 30 parts of prepared phenolic resin are put into a stirrer to be stirred, the temperature in the stirrer body is kept at 35 ℃ and stirred for 10min, and the rotating speed of the stirrer is controlled at 1500 r/min;
the filler synthesis process specifically comprises the following steps: putting 75 parts of filler into a stirrer for mixing epoxy acrylate resin and phenolic resin, keeping the temperature at 35 ℃, adjusting the rotating speed of the stirrer to 800r/min, and stirring for 15 min;
the anti-skinning agent synthesis process specifically comprises the following steps: 10 parts of anti-skinning agent is put into a stirrer mixed with epoxy acrylate resin, phenolic resin and filler, the temperature is controlled at 40 ℃, the rotating speed is adjusted to 650r/min, and the stirring is carried out for 8 min;
the photosensitizer synthesis process comprises the following specific steps: 20 parts of photosensitizer are put into a stirrer which is uniformly mixed with the epoxy acrylate resin, the phenolic resin, the filling agent and the anti-skinning agent, the rotating speed is regulated to 1200r/min, the temperature is controlled at 35 ℃, and the stirring is carried out for 10 min;
the process for synthesizing the curing agent comprises the following specific steps: adding 10 parts of curing agent into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent and photosensitizer, keeping the temperature at 30 ℃, controlling the rotating speed of the stirrer at 900r/min, and stirring for 15 min;
the mixing and defoaming working procedures are as follows: adding 8 parts of environment-friendly solvent, 10 parts of pigment and 15 parts of defoaming agent into a stirrer mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent, photosensitizer and curing agent, keeping the temperature at 35 ℃, controlling the rotating speed of the stirrer at 600r/min, and stirring for 20 min.
The photosensitive solder resist ink is prepared by the method, and the anti-skinning agent is added into the mixed solution to inhibit the drying speed of the ink by adding the anti-skinning agent, so that the ink is prevented from drying and forming a film mechanically, and the integrity and the attractiveness of the ink in the spraying process are prevented from being influenced.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A photosensitive solder resist ink and a preparation method thereof are characterized in that: the photosensitive solder resist ink comprises the following materials: epoxy acrylate resin, phenolic resin, a filler, an anti-skinning agent, a photosensitizer, a curing agent, an environment-friendly solvent, a pigment and a defoaming agent.
2. The photosensitive solder resist ink and the preparation method thereof according to claim 1, wherein: the weight parts of the raw materials are as follows: 100-150 parts of epoxy acrylate resin, 20-30 parts of phenolic resin, 50-75 parts of filler, 5-10 parts of anti-skinning agent, 10-20 parts of photosensitizer, 5-10 parts of curing agent, 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent.
3. The photosensitive solder resist ink and the preparation method thereof according to claim 1, wherein: the epoxy acrylate resin is prepared by esterification reaction of phenolic resin and acrylic acid or methacrylic acid, and the phenolic resin is prepared by condensation polymerization of phenol formaldehyde or derivatives thereof.
4. The photosensitive solder resist ink and the preparation method thereof according to claim 1, wherein: the filling agent is specifically one or a combination of more of a diluent or a diluent, the anti-skinning agent is specifically one or a combination of more of an organic reducing agent or an antioxidant, the photosensitizer is specifically one or a combination of more of an antioxidant, a heat stabilizer, an ultraviolet light (UV light) absorbent or an inhibitor, the curing agent is specifically obtained by performing a crosslinking reaction on an acrylate monomer through one or more of added melamine copolymer resin, epoxy resin and polyurethane, the acrylate monomer is specifically one or a combination of more of methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate or n-butyl methacrylate, and the pigment is specifically one or a combination of more of natural minerals, organic pigments or inorganic pigments.
5. The photosensitive solder resist ink and the preparation method thereof according to claim 4, wherein: the thinner comprises one or a combination of a plurality of mineral oil or oligomeric linseed oil, the thinner is one or a combination of a plurality of white ink, transparent glaze or brightening slurry, the organic reducing agent is one or a combination of a plurality of stannous chloride, oxalic acid, potassium borohydride, sodium borohydride or ethanol, the natural mineral is one or a combination of a plurality of cinnabar, red earth, realgar, malachite green and heavy calcium carbonate, wollastonite, barite powder, talcum powder, mica powder and kaolin, the organic pigment is one or a combination of a plurality of azo pigment, phthalocyanine pigment, anthraquinone, indigo family, quinacridone, dioxazine and other polycyclic pigment or methane pigment, and the inorganic pigment is one or a combination of a plurality of oxide, chromate, sulfate, silicate, borate, molybdate, phosphate, vanadate, ferricyanate, hydroxide and the like, Sulfide or metal or combination of a plurality of sulfide or metal.
6. The photosensitive solder resist ink and the preparation method thereof according to claim 1, wherein: the method sequentially comprises the following steps: preparing materials, synthesizing resin, synthesizing a filling agent, synthesizing an anti-skinning agent, synthesizing a photosensitizer, synthesizing a curing agent, and mixing and defoaming;
the preparation process of the material comprises the following specific steps: preparing 100-150 parts of epoxy acrylate resin, 20-30 parts of phenolic resin, 50-75 parts of filler, 5-10 parts of anti-skinning agent, 10-20 parts of photosensitizer, 5-10 parts of curing agent, 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent for later use;
the resin synthesis process comprises the following specific steps: 150 parts of prepared epoxy acrylate resin 100-one and 20-30 parts of phenolic resin are put into a stirrer for stirring, the temperature in the stirrer is kept at 25-35 ℃ for stirring for 5-10min, and the rotating speed of the stirrer is controlled at 1500-one/min;
the filler synthesis process specifically comprises the following steps: 50-75 parts of filler is put into a stirrer for mixing epoxy acrylate resin and phenolic resin, the temperature is kept at 25-35 ℃, the rotating speed of the stirrer is adjusted to 700 and 800r/min, and the stirring is carried out for 10-15 min;
the anti-skinning agent synthesis process specifically comprises the following steps: 5-10 parts of anti-skinning agent is put into a stirrer which is already mixed with epoxy acrylate resin, phenolic resin and filler, the temperature is controlled at 30-40 ℃, the rotating speed is adjusted to 650r/min for stirring for 5-8 min;
the photosensitizer synthesis process comprises the following specific steps: 10-20 parts of photosensitizer are put into a stirrer which is uniformly mixed with the epoxy acrylate resin, the phenolic resin, the filling agent and the anti-skinning agent, the rotating speed is regulated to 1000-1200r/min, the temperature is controlled to be 30-35 ℃, and the stirring is carried out for 7-10 min;
the process for synthesizing the curing agent comprises the following specific steps: 5-10 parts of curing agent is put into a stirrer which is uniformly mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent and photosensitizer, the temperature is kept at 25-30 ℃, the rotating speed of the stirrer is controlled at 900r/min, and the stirring is carried out for 10-15 min;
the mixing and defoaming working procedures are as follows: 6-8 parts of environment-friendly solvent, 5-10 parts of pigment and 7-15 parts of defoaming agent are added into a stirring machine mixed with epoxy acrylate resin, phenolic resin, filler, anti-skinning agent, photosensitizer and curing agent, the temperature is kept at 30-35 ℃, the rotating speed of the stirring machine is controlled at 600r/min, and the stirring time is 15-20 min.
7. The photosensitive solder resist ink and the preparation method thereof according to claim 6, wherein: the material preparation process, the resin synthesis process, the filler synthesis process, the anti-skinning agent synthesis process, the photosensitizer synthesis process, the curing agent synthesis process and the material transportation in the mixed defoaming process are all one or more modes of manual transportation, cart transportation, conveyor belt transportation or automobile transportation.
8. The photosensitive solder resist ink and the preparation method thereof according to claim 6, wherein: the model of the stirrer used in the resin synthesis process, the filler synthesis process, the anti-skinning agent synthesis process, the photosensitizer synthesis process, the curing agent synthesis process and the mixing and defoaming process is specifically a stainless steel reaction kettle electric heating stirring tank, and the stirrer is specifically made of 316L stainless steel.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6136506A (en) * | 1996-02-28 | 2000-10-24 | Goo Chemical Co., Ltd. | Ultraviolet-curable and alkali-developing type photo solder resist ink |
| CN1971419A (en) * | 2006-11-30 | 2007-05-30 | 华南理工大学 | Liquid photo-imaging alkali developable electronic solder-proof ink and its preparing method |
| CN110673442A (en) * | 2019-11-11 | 2020-01-10 | 新东方油墨有限公司 | Photosensitive resin and application thereof in preparation of liquid photosensitive solder resist ink |
-
2022
- 2022-03-21 CN CN202210280879.4A patent/CN114605867A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6136506A (en) * | 1996-02-28 | 2000-10-24 | Goo Chemical Co., Ltd. | Ultraviolet-curable and alkali-developing type photo solder resist ink |
| CN1971419A (en) * | 2006-11-30 | 2007-05-30 | 华南理工大学 | Liquid photo-imaging alkali developable electronic solder-proof ink and its preparing method |
| CN110673442A (en) * | 2019-11-11 | 2020-01-10 | 新东方油墨有限公司 | Photosensitive resin and application thereof in preparation of liquid photosensitive solder resist ink |
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