CN114602745A - Glue spraying device for semiconductor processing - Google Patents
Glue spraying device for semiconductor processing Download PDFInfo
- Publication number
- CN114602745A CN114602745A CN202210365154.5A CN202210365154A CN114602745A CN 114602745 A CN114602745 A CN 114602745A CN 202210365154 A CN202210365154 A CN 202210365154A CN 114602745 A CN114602745 A CN 114602745A
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- CN
- China
- Prior art keywords
- glue spraying
- workbench
- glue
- air pressure
- semiconductor processing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
Abstract
The invention discloses a glue spraying device for semiconductor processing, which relates to the technical field of semiconductor processing and comprises a workbench, a rotary disc, a glue spraying frame and a driving motor, wherein the rotary disc rotates with the workbench, the glue spraying frame is arranged at the central positions of the workbench and the rotary disc, and the driving motor drives the rotary disc to rotate. According to the invention, a plurality of mechanical linkage mechanisms are arranged among the workbench, the rotary plate, the glue spraying frame and the driving motor, wherein the driving motor is used for driving equipment to feed and spray glue simultaneously through the driving chain wheel and the driving cam respectively, so that continuous glue spraying work is realized; meanwhile, by arranging the pressing block and the air pressure rod, the pressing block is driven to revolve when the rotary disc rotates, the air pressure rod is sequentially extruded by the limiting grooves at different positions, and the material discharging push rod is driven by the piston structure to discharge materials, so that the material discharging, the material feeding and the glue spraying are carried out at the same time; because the sliding distance of the working slide block at each time is determined by the size of the driving cam, the glue spraying amount is strictly controlled, and the glue spraying quality of batches is ensured.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to a glue spraying device for semiconductor processing.
Background
In the prior art, semiconductors have great importance from the viewpoint of scientific and technological or economic development, and almost all electronic products, such as computers, mobile phones, digital recorders and other devices, have core modules in the semiconductor industry; in the production process of a semiconductor, because a carrier, namely a PCB (printed Circuit Board) of a semiconductor integrated circuit needs to be protected and fixed to a certain extent, glue is generally sprayed on the surface of the carrier, and the glue spraying operation is generally controlled by a piezoelectric valve in the conventional glue spraying machine or glue spraying equipment, so that the glue spraying amount is difficult to accurately control in actual work, and the phenomenon of uneven glue spraying quality can be caused; in addition, the existing full-automatic glue spraying equipment is generally controlled by a program, so that the production cost is high, and the existing full-automatic glue spraying equipment is not beneficial to the substitute production of small and medium-sized enterprises; in view of the above, we have devised a glue spraying device for semiconductor processing to solve the above problems.
Disclosure of Invention
The invention aims to provide a glue spraying device for semiconductor processing, which solves the problems that a piezoelectric valve in the existing glue spraying equipment is inconvenient to control glue spraying amount and the program-controlled full-automatic glue spraying equipment is high in production cost.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a glue spraying device for semiconductor processing, which comprises a workbench, a rotary disc, a glue spraying frame and a driving motor, wherein the upper surface of the workbench is provided with a transfer groove, and the interior of the transfer groove is connected with a bearing of the rotary disc; the upper surface of the workbench is connected with a glue spraying frame through bolts, and the glue spraying frame is arranged at the circle center of the transfer groove;
a feeding opening and a discharging opening are formed in the upper surface of the workbench and are communicated with the transfer groove; the upper surface of the rotary plate is provided with a plurality of limiting grooves, the two opposite inner side surfaces of each limiting groove are welded with elastic pressing plates, the limiting grooves, the feeding port and the discharging port are at the same height, and the elastic pressing plates on the two sides can be mutually extruded to fix the PCB inside the limiting grooves for glue spraying work;
a discharge cavity and an air pressure cavity channel are formed in the workbench and are communicated with each other; the discharging push rod is arranged in the discharging cavity, the air pressure rod is arranged in the air pressure cavity channel, the discharging push rod and the discharging cavity form a piston structure, the air pressure rod and the air pressure cavity channel form a piston structure, the air pressure cavity channel is of a U-shaped communicating vessel structure, and when the air pressure rod pushes inwards, the discharging push rod slides outwards to push out the PCB in the limiting groove; the position of the discharge push rod corresponds to that of the discharge port;
the inner side face of the rotary plate is welded with a plurality of pressing blocks, the pressing blocks are in contact with one end of the air pressure rod, the number and the positions of the pressing blocks and the limiting grooves are matched, and the pressing blocks can slide inwards when contacting and extruding the air pressure rod.
Furthermore, a material pushing chute is formed in the upper surface of the workbench, and a working slide block is clamped in the material pushing chute; and a glue spraying pressure rod and a material pushing rod are welded on one end face of the working slide block, wherein the material pushing rod corresponds to the material inlet.
Further, pan feeding mouth lower extreme bolt joint has the feed box, and the feed box internal surface has the feed board through spring coupling, and feed board and feed box sliding fit, places the PCB board of treating spouting the glue above the feed board in the feed box, utilizes spring force to make progress the feed, realizes continuous feed work.
Furthermore, one end of the glue spraying pressure rod extends into the glue spraying frame; a glue spraying channel is formed in the glue spraying frame, and the glue spraying channel and the glue spraying pressure rod are of a piston structure; a glue spraying pipe is welded and communicated with one side surface of the glue spraying frame, and a one-way valve pipe is arranged in the glue spraying pipe; the glue spraying frame is characterized in that a glue storage box is bolted on the peripheral side face of the glue spraying frame, a one-way valve plate is arranged between the glue storage box and the glue spraying channel, when the glue spraying pressure rod extrudes inwards, pressure can be simultaneously applied to the one-way valve plate and the one-way valve pipe, and quantitative glue is sprayed out through the glue spraying pipe on the premise of ensuring that the glue does not flow back; wherein the position of the glue spraying pipe corresponds to the position of the limiting groove.
Furthermore, a driven chain wheel is welded on the lower end face of the rotating shaft of the rotating disc, a driving chain wheel is welded on one end face of an output shaft of the driving motor, and a driving cam is welded on the other end face of the output shaft of the driving motor; the driving chain wheel and the driven chain wheel are mutually linked through the mounting chain, the driving cam is in contact with the working slide block, and the working slide block is periodically extruded when the driving cam rotates, so that feeding, discharging and glue spraying are simultaneously carried out.
The invention has the following beneficial effects:
according to the invention, a plurality of mechanical linkage mechanisms are arranged among the workbench, the rotary plate, the glue spraying frame and the driving motor, wherein the driving motor is used for driving equipment to feed and spray glue simultaneously through the driving chain wheel and the driving cam respectively, so that continuous glue spraying work is realized; meanwhile, by arranging the pressing block and the air pressure rod, the pressing block is driven to revolve when the rotary disc rotates, the air pressure rod is sequentially extruded by the limiting grooves at different positions, and the material discharging push rod is driven by the piston structure to discharge materials, so that the material discharging, the material feeding and the glue spraying are carried out at the same time; by the structure, the automation of glue spraying can be realized only by a simple assembly structure and a mechanical linkage structure, so that the production cost is greatly saved;
on the other hand, the distance of each sliding of the working slide block is determined by the size of the driving cam, so that the glue spraying amount is also strictly controlled, and the glue spraying quality of batches is ensured.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of a glue spraying device for semiconductor processing according to the present invention;
FIG. 2 is a top view of a glue spraying apparatus for semiconductor processing according to the present invention;
FIG. 3 is a schematic structural view of section A-A in FIG. 2;
FIG. 4 is a schematic structural view of section B-B of FIG. 3;
FIG. 5 is a schematic structural view of section C-C of FIG. 3;
FIG. 6 is a partial view of portion D of FIG. 5;
fig. 7 is a partial view of portion E of fig. 5.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a work table; 2. a rotating plate; 3. spraying a glue frame; 4. a drive motor; 101. a transfer tank; 102. a feeding port; 103. a discharge outlet; 201. a limiting groove; 104. a discharge chamber; 105. an air pressure cavity; 1041. a discharge push rod; 1051. a pneumatic rod; 202. briquetting; 106. a material pushing chute; 1061. a working slide block; 1062. spraying a glue compression bar; 1063. a material pushing rod; 1021. a feeding box; 1022. a feed plate; 301. a glue spraying channel; 302. a glue spraying pipe; 3021. a check valve tube; 303. a glue storage box; 304. a one-way valve plate; 203. a driven sprocket; 401. a drive sprocket; 402. a drive cam; 2011. and (6) elastic pressing of the plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate orientations or positional relationships, are used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example 1:
referring to fig. 1-7, the invention relates to a glue spraying device for semiconductor processing, which comprises a workbench 1, a rotating disc 2, a glue spraying frame 3 and a driving motor 4, wherein the upper surface of the workbench 1 is provided with a transfer groove 101, and the interior of the transfer groove 101 is connected with the rotating disc 2 through a bearing; the upper surface of the workbench 1 is connected with a glue spraying frame 3 through bolts, and the glue spraying frame 3 is arranged at the circle center position of the transfer groove 101;
a feeding opening 102 and a discharging opening 103 are formed in the upper surface of the workbench 1, and the feeding opening 102 and the discharging opening 103 are both communicated with the transfer groove 101; the upper surface of the rotary plate 2 is provided with a plurality of limiting grooves 201, the opposite inner side surfaces of the limiting grooves 201 are welded with elastic pressing plates 2011, the limiting grooves 201, the feeding port 102 and the discharging port 103 are at the same height, and the elastic pressing plates 2011 at the two sides are mutually extruded to fix the PCB inside the limiting grooves 201 for glue spraying work;
a discharge cavity 104 and a pressure cavity channel 105 are arranged in the workbench 1 and are communicated with each other; a discharging push rod 1041 is installed inside the discharging cavity 104, an air pressure rod 1051 is installed inside the air pressure cavity channel 105, the discharging push rod 1041 and the discharging cavity 104 form a piston structure, the air pressure rod 1051 and the air pressure cavity channel 105 form a piston structure, the air pressure cavity channel 105 is of a U-shaped communicating vessel structure, and when the air pressure rod 1051 pushes inwards, the discharging push rod 1041 slides outwards to push out the PCB in the limiting groove 201; the position of the discharge push rod 1041 corresponds to that of the discharge port 103;
the inner side surface of the rotating plate 2 is welded with a plurality of pressing blocks 202, the pressing blocks 202 are in contact with one end of the air pressure rod 1051, the number and the positions of the pressing blocks 202 and the limiting grooves 201 are matched, and when the pressing blocks 202 contact and extrude the air pressure rod 1051, the pressing blocks can slide inwards.
Preferably, the upper surface of the workbench 1 is provided with a material pushing chute 106, and a working slide block 1061 is clamped inside the material pushing chute 106; one end face of the working slide block 1061 is welded with a glue spraying pressure rod 1062 and a material pushing rod 1063, wherein the material pushing rod 1063 corresponds to the position of the feeding port 102.
Preferably, the feed box 1021 is bolted to the lower end of the feeding port 102, the inner surface of the feed box 1021 is connected with the feed plate 1022 through a spring, the feed plate 1022 is in sliding fit with the feed box 1021, the PCB board to be sprayed with glue is placed above the feed plate 1022 in the feed box 1021, and the continuous feeding work is realized by utilizing the spring force to feed upwards.
Preferably, a driven sprocket 203 is welded on the lower end face of the rotating shaft of the rotating disc 2, a driving sprocket 401 is welded on one end face of the output shaft of the driving motor 4, and a driving cam 402 is welded on the other end face; the driving chain wheel 401 and the driven chain wheel 203 are mutually linked through a mounting chain, the driving cam 402 is in contact with the working slide 1061, and when the driving cam 402 rotates, the working slide 1061 is periodically pressed, so that feeding, discharging and glue spraying are simultaneously carried out.
Example 2:
wherein, one end of the glue spraying pressure bar 1062 extends into the glue spraying frame 3; a glue spraying channel 301 is formed in the glue spraying frame 3, and the glue spraying channel 301 and the glue spraying pressure rod 1062 are of piston structures; a glue spraying pipe 302 is welded and communicated with one side surface of the glue spraying frame 3, and a one-way valve pipe 3021 is arranged in the glue spraying pipe 302; the peripheral side surface of the glue spraying frame 3 is bolted with a glue storage box 303, a one-way valve plate 304 is arranged between the glue storage box 303 and the glue spraying channel 301, when the glue spraying pressure rod 1062 extrudes inwards, pressure can be simultaneously applied to the one-way valve plate 304 and the one-way valve pipe 3021, and quantitative glue is sprayed out through the glue spraying pipe 302 on the premise of ensuring that the glue does not flow back; wherein the position of the glue injection pipe 302 corresponds to the position of the limiting groove 201.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (7)
1. The utility model provides a semiconductor processing is with spouting mucilage binding and puts, includes workstation (1), changes and is dish (2), spouts gluey frame (3) and driving motor (4), its characterized in that: the upper surface of the workbench (1) is provided with a transfer groove (101), and the interior of the transfer groove (101) is in bearing connection with the rotating disc (2); the upper surface of the workbench (1) is connected with the glue spraying frame (3) through bolts, and the glue spraying frame (3) is arranged at the circle center position of the transfer groove (101);
a feeding opening (102) and a discharging opening (103) are formed in the upper surface of the workbench (1), and the feeding opening (102) and the discharging opening (103) are communicated with the transfer groove (101); the upper surface of the rotary plate (2) is provided with a plurality of limiting grooves (201), and the limiting grooves (201) are at the same height with the material inlet (102) and the material outlet (103);
a discharging cavity (104) and an air pressure cavity channel (105) are formed in the workbench (1) and are communicated with each other; a discharging push rod (1041) is installed inside the discharging cavity (104), an air pressure rod (1051) is installed inside the air pressure cavity channel (105), the discharging push rod (1041) and the discharging cavity (104) form a piston structure, and the air pressure rod (1051) and the air pressure cavity channel (105) form a piston structure; the discharge push rod (1041) corresponds to the discharge opening (103);
the inner side surface of the rotary plate (2) is welded with a plurality of pressing blocks (202), the pressing blocks (202) are in contact with one end of the air pressure rod (1051), and the number and the positions of the pressing blocks (202) and the limiting grooves (201) are adaptive.
2. The glue spraying device for semiconductor processing according to claim 1, wherein a material pushing chute (106) is formed in the upper surface of the workbench (1), and a working slide block (1061) is clamped inside the material pushing chute (106); one end face of the working sliding block (1061) is welded with a glue spraying pressure rod (1062) and a material pushing rod (1063), wherein the material pushing rod (1063) corresponds to the position of the feeding port (102).
3. The glue spraying device for semiconductor processing according to claim 2, wherein a feed box (1021) is bolted to the lower end of the feed port (102), a feed plate (1022) is connected to the inner surface of the feed box (1021) through a spring, and the feed plate (1022) is in sliding fit with the feed box (1021).
4. The glue spraying device for semiconductor processing according to claim 3, wherein one end of the glue spraying pressure rod (1062) extends into the glue spraying frame (3); a glue spraying channel (301) is formed in the glue spraying frame (3), and the glue spraying channel (301) and the glue spraying pressure rod (1062) are of piston structures; one side surface of the glue spraying frame (3) is welded and communicated with a glue spraying pipe (302), and a one-way valve pipe (3021) is arranged inside the glue spraying pipe (302).
5. The glue spraying device for semiconductor processing according to claim 4, wherein a glue storage box (303) is bolted to the peripheral side surface of the glue spraying frame (3), and a check valve plate (304) is arranged between the glue storage box (303) and the glue spraying channel (301).
6. The glue spraying device for semiconductor processing according to claim 5, wherein a driven sprocket (203) is welded to the lower end face of the rotating shaft of the rotating disc (2), a driving sprocket (401) is welded to one end face of the output shaft of the driving motor (4), and a driving cam (402) is welded to the other end face; the driving chain wheel (401) and the driven chain wheel (203) are mutually linked through a mounting chain, and the driving cam (402) is in contact with the working slider (1061).
7. The glue spraying device for processing the semiconductor as claimed in claim 6, wherein the elastic pressing plates (2011) are welded on two opposite inner side surfaces of the limiting groove (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210365154.5A CN114602745B (en) | 2022-04-08 | 2022-04-08 | Glue spraying device for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210365154.5A CN114602745B (en) | 2022-04-08 | 2022-04-08 | Glue spraying device for semiconductor processing |
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| Publication Number | Publication Date |
|---|---|
| CN114602745A true CN114602745A (en) | 2022-06-10 |
| CN114602745B CN114602745B (en) | 2022-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210365154.5A Active CN114602745B (en) | 2022-04-08 | 2022-04-08 | Glue spraying device for semiconductor processing |
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| CN (1) | CN114602745B (en) |
Cited By (1)
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| CN117000524A (en) * | 2023-09-22 | 2023-11-07 | 南通华隆微电子股份有限公司 | Adhesive deposite device is used in semiconductor diode production |
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| CN114602745B (en) | 2022-12-23 |
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