CN114602351A - Wafer processing cleaning fluid, production method and equipment - Google Patents
Wafer processing cleaning fluid, production method and equipment Download PDFInfo
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- CN114602351A CN114602351A CN202210246437.8A CN202210246437A CN114602351A CN 114602351 A CN114602351 A CN 114602351A CN 202210246437 A CN202210246437 A CN 202210246437A CN 114602351 A CN114602351 A CN 114602351A
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- heat dissipation
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- 238000004140 cleaning Methods 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 239000012530 fluid Substances 0.000 title abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 65
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 238000002360 preparation method Methods 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 22
- 239000000428 dust Substances 0.000 claims description 21
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 10
- 244000309464 bull Species 0.000 claims description 8
- 239000011259 mixed solution Substances 0.000 claims description 6
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 5
- BEGBSFPALGFMJI-UHFFFAOYSA-N ethene;sodium Chemical group [Na].C=C BEGBSFPALGFMJI-UHFFFAOYSA-N 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- -1 sulfonated dioctyl sodium succinate Chemical compound 0.000 claims description 3
- 229940074404 sodium succinate Drugs 0.000 claims description 2
- 238000005057 refrigeration Methods 0.000 abstract description 7
- 238000005406 washing Methods 0.000 abstract 5
- 230000009977 dual effect Effects 0.000 abstract 1
- 238000004904 shortening Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 5
- CDOUZKKFHVEKRI-UHFFFAOYSA-N 3-bromo-n-[(prop-2-enoylamino)methyl]propanamide Chemical compound BrCCC(=O)NCNC(=O)C=C CDOUZKKFHVEKRI-UHFFFAOYSA-N 0.000 description 3
- 235000019329 dioctyl sodium sulphosuccinate Nutrition 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- AFCIMSXHQSIHQW-UHFFFAOYSA-N [O].[P] Chemical group [O].[P] AFCIMSXHQSIHQW-UHFFFAOYSA-N 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- ONJQDTZCDSESIW-UHFFFAOYSA-N polidocanol Chemical compound CCCCCCCCCCCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO ONJQDTZCDSESIW-UHFFFAOYSA-N 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000012224 working solution Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/83—Mixtures of non-ionic with anionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/36—Organic compounds containing phosphorus
- C11D3/364—Organic compounds containing phosphorus containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/123—Sulfonic acids or sulfuric acid esters; Salts thereof derived from carboxylic acids, e.g. sulfosuccinates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of cleaning fluid production, in particular to a wafer processing cleaning fluid, a production method and equipment; including preparation jar and cooler bin, the cooler bin includes the box, heat exchanger and forced air cooler, the forced air cooler includes the fan, the cold-blast pipe, go out tuber plate and check valve, constitute raw materials with the washing liquid and lead to in proper order and prepare mixed liquid in the preparation jar internal mixing heating, mix the leading-in box back of liquid, absorb mixed liquid heat and carry out the heat exchange with the outside air through the heat exchanger, the fan function blows towards the cold-blast intraductal wind of cold-blast pipe simultaneously, the cold-blast pipe is with leading-in tuber plate after the air refrigeration, it blows off cold wind and carries out the forced air cooling heat dissipation to mixed liquid to go out the tuber plate, through the dual heat dissipation of heat exchanger and forced air cooler, great shortening the cool time of mixed liquid, thereby the effectual production efficiency that improves the washing liquid, solve traditional washing liquid production facility production washing liquid, the problem that the washing liquid natural cooling reduces production efficiency.
Description
Technical Field
The invention relates to the technical field of cleaning fluid production, in particular to a wafer processing cleaning fluid, a production method and equipment.
Background
The wafer generally refers to a silicon wafer, and grease lubricated by mechanical equipment, carborundum or metal ions in working solution, an oxide layer formed after the silicon wafer is contacted with air and the like can cause pollution to the silicon wafer to different degrees in the production process, and the silicon wafer needs to be cleaned by using cleaning solution.
The production of the cleaning liquid is a complex process, after the cleaning liquid is prepared by the traditional cleaning liquid production equipment, the cleaning liquid is led out and stored after being naturally cooled, the preparation efficiency is low, and the enterprise benefit is not met, so that the production equipment is required to be improved.
Disclosure of Invention
The invention aims to provide a wafer processing cleaning solution, a production method and equipment, and aims to solve the problem that the production efficiency is reduced because the cleaning solution is naturally cooled when the cleaning solution is produced by the traditional cleaning solution production equipment.
In order to achieve the above object, in a first aspect, the present invention provides a wafer processing cleaning liquid production apparatus for preparing a wafer processing cleaning liquid, characterized in that,
the cooling tank is arranged on one side of the preparation tank;
the cooler bin includes box, heat exchanger and forced air cooler, the box set up in preparation jar one side, the heat exchanger set up in box one side, the forced air cooler includes fan, cold air pipe, goes out aerofoil and check valve, the fan with box fixed connection just is located the box outside, go out the aerofoil with box fixed connection just is located in the box, the cold air pipe with the fan intercommunication, and with go out aerofoil intercommunication, and run through the box, the check valve set up in the cold air pipe is close to go out aerofoil one side.
The heat exchanger comprises a plurality of heat conduction columns, a heat dissipation plate and a plurality of heat dissipation fins, the heat dissipation plate is fixedly connected with the box body and located at the top of the box body, the heat conduction columns are fixedly connected with the heat dissipation plate respectively and penetrate through the box body, and the heat dissipation fins are fixedly connected with the heat dissipation plate respectively and located on one side away from the heat conduction columns.
The cooling box further comprises a first dust screen and a second dust screen, the first dust screen is fixedly connected with the fan and located far away from one side of the cold air pipe, and the second dust screen is fixedly connected with the box body and located close to one side of the heating panel.
The preparation tank comprises a tank body, a stirrer and a heating assembly, wherein the tank body is arranged on one side of the tank body, the stirrer is arranged on one side of the tank body, and the heating assembly is respectively arranged on the tank body and one side of the stirrer.
Wherein, the agitator includes motor, bull stick and a plurality of puddler, the motor with jar body fixed connection, and be located jar body top, the bull stick with motor output end fixed connection, and run through jar body, it is a plurality of the puddler respectively with bull stick fixed connection all is located the bull stick outside.
Wherein, heating element includes electromagnetic disk and a plurality of piece that generates heat, electromagnetic disk with jar body fixed connection, and be located jar body bottom, it is a plurality of the piece that generates heat respectively with a plurality of puddler fixed connection, all are located the puddler outside.
In a second aspect, the present invention further provides a method for producing a wafer processing cleaning solution, comprising the following steps:
introducing the raw materials into a preparation tank for mixing preparation to obtain a mixed solution;
the mixed liquid is guided into the box body and is cooled through double heat dissipation of the heat exchanger and the air cooling assembly, and the cleaning liquid is obtained.
In a third aspect, the invention also provides a wafer processing cleaning solution,
comprises 60 percent of amino trimethylene phosphonic acid, 6 percent of sulfonated dioctyl sodium succinate, 5 percent of hydrofluoric acid, AEO-93 percent, 6 percent of sodium ethylene diamine tetracetate and 20 percent of pure water.
According to the wafer processing cleaning liquid production equipment, the preparation tank is communicated with the cooling box through the guide pipe, raw materials are sequentially introduced into the preparation tank to be mixed and heated to prepare mixed liquid, the mixed liquid is introduced into the box body through the guide pipe after the preparation of the mixed liquid is finished, the mixed liquid in the box body absorbs the heat of the mixed liquid through the heat exchanger and exchanges heat with the outside air, the fan blows air into the cold air pipe at the same time, the cold air pipe cools the air and then introduces the cooled air into the air outlet plate, the air outlet plate blows cold air into the box body, so that the mixed liquid is cooled and dissipated, the cleaning liquid is obtained after the mixed liquid is cooled, the mixed liquid is prevented from flowing into the cold air pipe through the one-way valve, the cooling box dissipates heat through the heat exchanger and the air cooler, and the cooling time of the mixed liquid is greatly shortened, the production efficiency of the cleaning liquid is effectively improved, meanwhile, the equipment separately carries out preparation and cooling, can prepare new mixed liquid and cool the mixed liquid in the box body at the same time, further improves the production efficiency of the cleaning liquid, and solves the problem that the production efficiency is reduced due to natural cooling of the cleaning liquid produced by the traditional cleaning liquid production equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a wafer processing cleaning solution production apparatus according to the present invention.
Fig. 2 is a side view of a wafer processing cleaning solution production apparatus according to the present invention.
Fig. 3 is a cross-sectional view taken along plane a-a of fig. 2.
FIG. 4 is a flow chart of a method for producing a wafer processing cleaning solution according to the present invention.
In the figure: 1-preparing a tank, 2-cooling box, 3-tank body, 4-stirrer, 5-heating component, 6-motor, 7-rotating rod, 8-stirring rod, 9-electromagnetic disc, 10-heating block, 11-box body, 12-heat exchanger, 13-air cooler, 14-fan, 15-cold air pipe, 16-air outlet plate, 17-one-way valve, 18-heat conducting column, 19-heat radiating plate, 20-heat radiating fin, 21-first dust screen, 22-second dust screen, 23-cooling pipe, 24-air supply pipe, 25-spiral pipe and 26-refrigerating piece.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 3, in a first aspect, the present invention provides a wafer processing cleaning solution production apparatus for preparing a wafer processing cleaning solution, which is characterized in that the apparatus includes a preparation tank 1 and a cooling tank 2, wherein the cooling tank 2 is disposed on one side of the preparation tank 1;
cooler bin 2 includes box 11, heat exchanger 12 and air cooler 13, box 11 set up in preparation jar 1 one side, heat exchanger 12 set up in box 11 one side, air cooler 13 includes fan 14, cold air duct 15, goes out aerofoil 16 and check valve 17, fan 14 with box 11 fixed connection, and be located the box 11 outside, go out aerofoil 16 with box 11 fixed connection, and be located in the box 11, cold air duct 15 with fan 14 intercommunication, and with it communicates to go out aerofoil 16, and runs through box 11, check valve 17 set up in cold air duct 15 is close to go out aerofoil 16 one side.
In the embodiment, the preparation tank 1 and the cooling tank 2 are communicated through a conduit, after the preparation of the mixed liquid is completed, the mixed liquid is guided into the tank 11 through the conduit, the mixed liquid in the tank 11 absorbs the heat of the mixed liquid through the heat exchanger 12 and exchanges heat with the outside air, at the same time, the fan 14 operates to blow air into the cold air pipe 15, the cold air pipe 15 cools the air and then guides the cooled air into the air outlet plate 16, the air outlet plate 16 blows cold air into the tank 11, so that the mixed liquid is cooled and dissipated, after the mixed liquid is cooled, the cleaning liquid is obtained, the check valve 17 prevents the mixed liquid from flowing into the cold air pipe 15, the cooling tank 2 cools through the heat exchanger 12 and the air cooler 13, the cooling time of the mixed liquid is greatly shortened, the production efficiency of the cleaning liquid is effectively improved, and simultaneously, the equipment separately carries out preparation and cooling, can prepare new mixed liquid and cool the mixed liquid in the box body 11 at the same time, further improves the production efficiency of the cleaning liquid, and solves the problems that the production efficiency is reduced due to natural cooling of the cleaning liquid when the cleaning liquid is produced by the traditional cleaning liquid production equipment.
Further, the heat exchanger 12 includes a plurality of heat conduction columns 18, a heat dissipation plate 19 and a plurality of heat dissipation fins 20, the heat dissipation plate 19 is fixedly connected with the box body 11 and is located at the top of the box body 11, the plurality of heat conduction columns 18 are respectively fixedly connected with the heat dissipation plate 19 and penetrate through the box body 11, and the plurality of heat dissipation fins 20 are respectively fixedly connected with the heat dissipation plate 19 and are located on one side far away from the heat conduction columns 18; the cooling box 2 further comprises a first dust screen 21 and a second dust screen 22, the first dust screen 21 is fixedly connected with the fan 14 and located far away from one side of the cold air pipe 15, and the second dust screen 22 is fixedly connected with the box body 11 and located near one side of the heat dissipation plate 19.
In this embodiment, the heat conduction column 18 and the heat dissipation plate 19 are made of copper-aluminum alloy, so as to achieve uniform and good heat conduction and dissipation performance, the heat conduction column 18 absorbs the heat of the mixed liquid and transmits the heat to the heat dissipation plate 19 to be in contact with the outside air for heat dissipation, the arrangement of the heat dissipation fins 20 increases the area of the heat dissipation plate 19, so as to improve the heat dissipation efficiency of the heat dissipation plate 19, the first dust screen 21 prevents the fan 14 from sucking the dust in the air, the air outlet plate 16 blows in the box 11, and the wind passes through the heat dissipation holes at the top of the box 11 to be discharged, and the second dust screen 22 prevents the dust from entering the box 11 from the heat dissipation holes to affect the quality of the cleaning liquid.
Further, the preparation tank 1 comprises a tank body 3, a stirrer 4 and a heating assembly 5, wherein the tank body 3 is arranged on one side of the box body 11, the stirrer 4 is arranged on one side of the tank body 3, and the heating assembly 5 is respectively arranged on one sides of the tank body 3 and the stirrer 4; the stirrer 4 comprises a motor 6, a rotating rod 7 and a plurality of stirring rods 8, the motor 6 is fixedly connected with the tank body 3 and is positioned at the top of the tank body 3, the rotating rod 7 is fixedly connected with the output end of the motor 6 and penetrates through the tank body 3, and the plurality of stirring rods 8 are respectively fixedly connected with the rotating rod 7 and are positioned outside the rotating rod 7; heating element 5 includes electromagnetic disk 9 and a plurality of piece 10 that generates heat, electromagnetic disk 9 with jar 3 fixed connection of body, and be located jar 3 bottoms of body, it is a plurality of generate heat piece 10 respectively with a plurality of puddler 8 fixed connection all is located the puddler 8 outside.
In this embodiment, the tank 3 is used for preparing a mixed liquid, the stirrer 4 is used for stirring a raw material, the heating assembly 5 is used for heating the raw material, specifically, the motor 6 operates to rotate the rotating rod 7, the rotating rod 7 rotates to drive the stirring rod 8 to rotate and mix the raw material in the tank 3, and meanwhile, the electromagnetic disc 9 is electrified to enable the tank 3 to generate an eddy current, so that the raw material in the tank 3 is heated, the heating block 10 is made of a resistance wire, and the heating block 10 is electrified to generate heat to heat the raw material in the middle of the tank 3, so that the time required for heating is shortened.
Further, the cold air pipe 15 includes a cooling pipe 23 and an air supply pipe 24, the cooling pipe 23 is communicated with the fan 14 and is located on one side of the fan 14, the air supply pipe 24 is communicated with the cooling pipe 23 and is communicated with the air outlet plate 16 and penetrates through the box body 11, and the check valve 17 is arranged in the air supply pipe 24.
In the present embodiment, the cooling pipe 23 cools the air blown by the fan 14, and the air supply pipe 24 introduces cool air into the air outlet plate 16 and blows the cooled mixed liquid through the air outlet plate 16.
Further, the cooling pipe 23 includes a spiral pipe 25 and a plurality of refrigeration pieces 26, the spiral pipe 25 with the fan 14 communicates, and with the blast pipe 24 communicates, and is located the blast pipe 24 with fan 14 one side, a plurality of refrigeration pieces 26 respectively with spiral pipe 25 fixed connection all runs through spiral pipe 25.
In this embodiment, the model of the refrigeration piece 26 is TEC1-12704, the refrigeration piece 26 is used for refrigerating the air in the spiral pipe 25, the spiral pipe 25 prolongs the circulation time of the air, and the refrigeration effect of the refrigeration piece 26 is improved.
Referring to fig. 4, in a second aspect, the present invention further provides a method for producing a wafer processing cleaning solution, comprising the following steps:
s1, introducing the raw materials into a preparation tank 1, and mixing to obtain a mixed solution;
the raw materials are introduced into the tank body 3, mixed by the stirrer 4 and heated by the heating component 5 to prepare the mixed solution.
And S2, introducing the mixed solution into the box body 11, and performing double heat dissipation and cooling through the heat exchanger 12 and the air cooling assembly to obtain the cleaning solution.
After the preparation of the mixed liquid is finished, the mixed liquid is guided into the box body 11 through a guide pipe, and the mixed liquid is rapidly cooled through the double heat dissipation of the heat exchanger 12 and the air cooling assembly, so that the cleaning liquid is obtained.
In a third aspect, the invention also provides a wafer processing cleaning solution, which comprises 60% of amino trimethylene phosphonic acid, 6% of dioctyl sodium sulfosuccinate, 5% of hydrofluoric acid, AEO-93%, 6% of sodium ethylene diamine tetracetate and 20% of pure water.
In the embodiment, raw materials such as aminotrimethylene phosphonic acid, dioctyl sodium sulfosuccinate, hydrofluoric acid, sodium ethylene diamine tetracetate and pure water are sequentially introduced into the preparation tank 1 by weight, mixed and heated to prepare a mixed solution, the phosphorus-oxygen functional group of the aminotrimethylene phosphonic acid has stronger selectivity to silicon atoms and has excellent cleaning effect on the fixed glue and dust on the silicon wafer, the dioctyl sodium sulfosuccinate has excellent permeability and can accelerate the removal of the fixed glue and the dust, and the sodium ethylene diamine tetracetate complex metal ions, the hydrofluoric acid removal oxide layer and the AEO-9 emulsified oil stain have synergistic effect, so that the fixed glue, metal impurities, oxides, dust, oil stains and other pollutants on the surface of the silicon wafer can be cleaned and removed at one time, the production efficiency is greatly improved, and the production cost is reduced.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A wafer processing cleaning solution production device, which is characterized in that,
the cooling tank is arranged on one side of the preparation tank;
the cooler bin includes box, heat exchanger and forced air cooler, the box set up in preparation jar one side, the heat exchanger set up in box one side, the forced air cooler includes fan, cold air pipe, goes out aerofoil and check valve, the fan with box fixed connection just is located the box outside, go out the aerofoil with box fixed connection just is located in the box, the cold air pipe with the fan intercommunication, and with go out aerofoil intercommunication, and run through the box, the check valve set up in the cold air pipe is close to go out aerofoil one side.
2. Wafer processing cleaning solution production apparatus as set forth in claim 1,
the heat exchanger comprises a plurality of heat conduction columns, a heat dissipation plate and a plurality of radiating fins, wherein the heat dissipation plate is fixedly connected with the box body and is positioned at the top of the box body, the heat conduction columns are fixedly connected with the heat dissipation plate respectively and penetrate through the box body, and the radiating fins are fixedly connected with the heat dissipation plate respectively and are positioned on one side of the heat conduction columns.
3. Wafer processing cleaning solution production apparatus as set forth in claim 2,
the cooling box further comprises a first dust screen and a second dust screen, the first dust screen is fixedly connected with the fan and located far away from one side of the cold air pipe, and the second dust screen is fixedly connected with the box body and located close to one side of the heating panel.
4. Wafer processing cleaning solution production apparatus as set forth in claim 1,
the preparation tank comprises a tank body, a stirrer and a heating assembly, wherein the tank body is arranged on one side of the box body, the stirrer is arranged on one side of the tank body, and the heating assembly is respectively arranged on the tank body and one side of the stirrer.
5. Wafer processing cleaning solution production apparatus as set forth in claim 4,
the agitator includes motor, bull stick and a plurality of puddler, the motor with jar body fixed connection, and be located jar body top, the bull stick with motor output end fixed connection to run through jar body, it is a plurality of the puddler respectively with bull stick fixed connection all is located the bull stick outside.
6. Wafer processing cleaning solution production apparatus as set forth in claim 5,
heating element includes electromagnetic disk and a plurality of piece that generates heat, electromagnetic disk with jar body fixed connection, and be located jar body bottom, it is a plurality of the piece that generates heat respectively with a plurality of puddler fixed connection, all are located the puddler outside.
7. A wafer processing cleaning liquid production method using the wafer processing cleaning liquid production apparatus as claimed in claim 1, characterized by comprising the steps of:
introducing the raw materials into a preparation tank for mixing preparation to obtain a mixed solution;
the mixed liquid is guided into the box body and is cooled through double heat dissipation of the heat exchanger and the air cooling assembly, and the cleaning liquid is obtained.
8. A wafer processing cleaning liquid prepared by using the wafer processing cleaning liquid production apparatus as claimed in claim 1,
comprises 60 percent of amino trimethylene phosphonic acid, 6 percent of sulfonated dioctyl sodium succinate, 5 percent of hydrofluoric acid, AEO-93 percent, 6 percent of sodium ethylene diamine tetracetate and 20 percent of pure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210246437.8A CN114602351A (en) | 2022-03-14 | 2022-03-14 | Wafer processing cleaning fluid, production method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210246437.8A CN114602351A (en) | 2022-03-14 | 2022-03-14 | Wafer processing cleaning fluid, production method and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114602351A true CN114602351A (en) | 2022-06-10 |
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ID=81862533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210246437.8A Pending CN114602351A (en) | 2022-03-14 | 2022-03-14 | Wafer processing cleaning fluid, production method and equipment |
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| CN (1) | CN114602351A (en) |
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| CN213890940U (en) * | 2020-11-20 | 2021-08-06 | 济源市海益特种陶瓷有限公司 | Ceramic seal circle forming device |
| CN113249968A (en) * | 2021-06-30 | 2021-08-13 | 南京君越化工有限公司 | Softening agent for enhancing antibacterial and antistatic functions of clothes and preparation device |
| CN113546564A (en) * | 2021-07-06 | 2021-10-26 | 南京玖泰新材料科技有限公司 | Preparation device and method of ultraviolet-curable resin and application thereof |
| CN113637532A (en) * | 2021-07-22 | 2021-11-12 | 镌致实业(重庆)有限公司 | Wafer processing cleaning solution, production method and equipment |
| CN113662161A (en) * | 2021-08-23 | 2021-11-19 | 秀山县火郎食品开发有限公司 | Method and device for making cold-sunning type hotpot condiment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN213890940U (en) * | 2020-11-20 | 2021-08-06 | 济源市海益特种陶瓷有限公司 | Ceramic seal circle forming device |
| CN113249968A (en) * | 2021-06-30 | 2021-08-13 | 南京君越化工有限公司 | Softening agent for enhancing antibacterial and antistatic functions of clothes and preparation device |
| CN113546564A (en) * | 2021-07-06 | 2021-10-26 | 南京玖泰新材料科技有限公司 | Preparation device and method of ultraviolet-curable resin and application thereof |
| CN113637532A (en) * | 2021-07-22 | 2021-11-12 | 镌致实业(重庆)有限公司 | Wafer processing cleaning solution, production method and equipment |
| CN113662161A (en) * | 2021-08-23 | 2021-11-19 | 秀山县火郎食品开发有限公司 | Method and device for making cold-sunning type hotpot condiment |
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