CN114597631A - Electronic device - Google Patents
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- CN114597631A CN114597631A CN202011437225.5A CN202011437225A CN114597631A CN 114597631 A CN114597631 A CN 114597631A CN 202011437225 A CN202011437225 A CN 202011437225A CN 114597631 A CN114597631 A CN 114597631A
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- metal
- electronic device
- metal coil
- coil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
- H01Q1/244—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas extendable from a housing along a given path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
An embodiment of the present application provides an electronic device, including: the camera module comprises a metal rear shell, a camera module and a camera module, wherein the metal rear shell is provided with a camera hole for mounting the camera module; the near field communication chip is used for providing differential excitation current; a first conductor structure; the first metal coil at least partially covers a partial area of the camera hole; the first conductor structure and the first metal coil are used to transmit a differential excitation current in common. Among the electronic equipment, both can outwards radiate the NFC signal through the position at first conductor structure place, can outwards radiate the signal through the position at camera hole place again, consequently can both outwards radiate the NFC signal through electronic equipment's different positions to can increase electronic equipment's NFC signal radiation area, and need not to set up extra trompil on the metal backshell, thereby can guarantee the integrality of metal backshell.
Description
Technical Field
The present application relates to the field of communications technologies, and in particular, to an electronic device.
Background
With the development of communication technology, electronic devices such as smart phones have more and more functions, and communication modes of the electronic devices are more diversified. For example, recently, electronic devices are increasingly available to implement Near Field Communication (NFC) functions. Therefore, how to reasonably design the NFC antenna of the electronic device becomes a difficult problem.
Disclosure of Invention
The embodiment of the application provides an electronic device, which can increase the NFC signal radiation area of the electronic device and simultaneously ensure the integrity of a metal rear shell.
An embodiment of the present application provides an electronic device, including:
the camera comprises a metal rear shell, a camera body and a camera module, wherein the metal rear shell is provided with a camera hole, and the camera hole is used for installing the camera module;
the near field communication chip comprises a first differential signal end and a second differential signal end, wherein the first differential signal end and the second differential signal end are used for providing differential excitation current;
a first conductor structure comprising a first electrical connection point and a second electrical connection point, the first electrical connection point being electrically connected to the first differential signal terminal;
the first metal coil at least partially covers a partial area of the camera hole, a first end of the first metal coil is electrically connected with the second electrical connection point, and a second end of the first metal coil is electrically connected with the second differential signal end;
wherein the first conductor structure and the first metal coil are configured to transmit the differential excitation current in common.
The electronic equipment that this application embodiment provided both can outwards radiate the NFC signal through the position at first conductor structure place, can outwards radiate the signal through the position at camera hole place again, consequently can both outwards radiate the NFC signal through electronic equipment's different positions to can increase electronic equipment's NFC signal radiation area, and need not to set up extra trompil on the metal backshell, thereby can guarantee the integrality of metal backshell.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a first structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a rear view of an electronic device provided in an embodiment of the present application.
Fig. 3 is a first structural schematic diagram of a housing of an electronic device according to an embodiment of the present application.
Fig. 4 is a second structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 5 is a third schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 6 is a fourth schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a camera module of an electronic device according to an embodiment of the present application.
Fig. 8 is a second structural schematic diagram of a housing of an electronic device according to an embodiment of the present application.
Fig. 9 is a fifth structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 10 is a sixth structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 11 is a schematic structural diagram of a first metal coil of an electronic device according to an embodiment of the present application.
Fig. 12 is a seventh structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 13 is a schematic structural diagram of a first metal coil, a flexible circuit board, and a radiation field enhancement member of an electronic device according to an embodiment of the present disclosure.
Fig. 14 is an eighth structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 15 is a ninth structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 16 is a schematic diagram of a tenth structure of an electronic device according to an embodiment of the present application.
Fig. 17 is an eleventh structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 18 is a twelfth schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 19 is a schematic diagram of a first principle of an antenna device of an electronic device according to an embodiment of the present application.
Fig. 20 is a schematic diagram of a second principle of an antenna device of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides electronic equipment. The electronic device may be a smart phone, a tablet computer, or other devices, and may also be a game device, an AR (Augmented Reality) device, an automobile device, a data storage device, an audio playing device, a video playing device, a notebook computer, a desktop computing device, or other devices.
Referring to fig. 1, fig. 1 is a schematic view of a first structure of an electronic device 100 according to an embodiment of the present disclosure.
The electronic device 100 includes a display 11, a case 12, a circuit board 13, and a battery 14.
The display screen 11 is disposed on the casing 12 to form a display surface of the electronic device 100, and is used for displaying information such as images and texts. The Display screen 11 may include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) Display screen.
It is understood that a cover plate may be further disposed on the display screen 11 to protect the display screen 11 and prevent the display screen 11 from being scratched or damaged by water. The cover plate may be a transparent glass cover plate, so that a user can observe contents displayed by the display screen 11 through the cover plate. For example, the cover plate may be a glass cover plate made of sapphire.
The housing 12 is used to form an outer contour of the electronic apparatus 100 so as to accommodate electronic devices, functional components, and the like of the electronic apparatus 100, while providing sealing and protecting functions for the electronic devices and functional components inside the electronic apparatus. For example, functional components of the electronic device 100 such as circuit boards, batteries, motors, acceleration sensors, etc. may be disposed inside the housing 12.
The circuit board 13 is disposed inside the housing 12. The circuit board 13 may be a main board of the electronic device 100. One or more of the functional components such as a processor, a headset interface, an acceleration sensor, a gyroscope, and a motor may be integrated on the circuit board 13. Meanwhile, the display screen 11 may be electrically connected to the circuit board 13 to control the display of the display screen 11 by a processor on the circuit board 13.
The battery 14 is disposed inside the housing 12. Meanwhile, the battery 14 is electrically connected to the circuit board 13 to enable the battery 14 to power the electronic device 100. Wherein, the circuit board 13 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by battery 14 to the various electronic devices in electronic apparatus 100.
In some embodiments, referring to fig. 2, fig. 2 is a rear view of an electronic device 100 provided by an embodiment of the present application.
The electronic device 100 further includes a camera module 15. The camera module 15 can be used to realize the photographing function of the electronic device 100. The camera module 15 may be a rear camera module, for example, to implement a rear photographing function of the electronic device 100.
In some embodiments, referring to fig. 3 at the same time, fig. 3 is a first structural schematic diagram of the housing 12 of the electronic device provided in the embodiments of the present application. The housing 12 includes a metal back case 121 and a metal frame 122.
The metal rear case 121 may serve as a rear cover of the electronic apparatus 100 for sealing electronic devices or functional components such as the circuit board 13, the battery 14, and the like inside the electronic apparatus 100. The material of the metal back case 121 may include, for example, magnesium alloy, aluminum alloy, and the like.
The metal bezel 122 surrounds the outer periphery of the electronic device 100, thereby forming a side bezel of the electronic device 100. The material of the metal frame 122 may also include magnesium alloy, aluminum alloy, and the like.
It will be appreciated that the housing 12 may also include a middle frame. The middle frame may have a thin plate-like or sheet-like structure, or may have a hollow frame structure. The middle frame is used for providing a supporting function for the electronic devices or functional components of the electronic device 100 so as to mount the electronic devices or functional components of the electronic device 100 together. The material of the middle frame may include metal or plastic. It is understood that, in order to enhance the structural strength of the middle frame, a metal material such as magnesium alloy, aluminum alloy, etc. may be selected to form the middle frame. The metal back case 121 may be connected to the middle frame, for example, by adhering, clipping, etc. The metal bezel 122 may surround the periphery of the middle frame, thereby forming a side bezel of the electronic device 100.
In some embodiments, a camera hole 1211 is formed on the metal rear case 121. The camera hole 1211 may be used to mount the camera module 15, so that the camera module 15 may collect external light through the camera hole 1211, thereby implementing a photographing function. It is understood that the size and shape of the camera aperture 1211 can be adapted to the camera module 15.
In some embodiments, an antenna device is also provided in the electronic device 100. The antenna device is used to implement a wireless Communication function of the electronic device 100, and may be used to implement a Near Field Communication (NFC) function, for example. In the following, various implementations of the antenna device integrated in the electronic device 100 are explained.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a second electronic device 100 according to an embodiment of the present disclosure.
The electronic device 100 further includes a Near Field Communication Integrated circuit (NFC IC)21, a first conductor structure 22, and a first metal coil 23.
Among other things, the NFC IC 21 may be used to provide a differential excitation current. The differential excitation current includes two current signals. The two current signals are identical in amplitude and opposite in phase, or are understood to be 180 degrees out of phase. In addition, the differential excitation current is a balanced signal. It can be understood that the analog signal is an unbalanced signal if directly transmitted during the transmission process; if the original analog signal is inverted and then the inverted analog signal and the original analog signal are transmitted simultaneously, the inverted analog signal and the original analog signal are called balanced signals. Compared with an unbalanced signal, the balanced signal has better anti-interference performance.
The NFC IC 21 may be provided on the circuit board 13 of the electronic device 100, or a smaller separate circuit board may be provided in the electronic device 100 and the NFC IC 21 may be integrated onto the separate circuit board. The separate circuit board may be, for example, a flexible circuit board in the electronic device 100.
The NFC IC 21 includes a first differential signal terminal 211 and a second differential signal terminal 212. For example, the first differential signal terminal 211 may be a positive (+) port of the NFC IC 21, and the second differential signal terminal 212 may be a negative (-) port of the NFC IC 21. The first differential signal terminal 211 and the second differential signal terminal 212 are used to provide the differential excitation current. For example, the differential excitation current provided by the NFC IC 21 may be output via the first differential signal terminal 211 and flow back into the NFC IC 21 via the second differential signal terminal 212, thereby forming a current loop.
In the description of the embodiments of the present application, it is to be understood that terms such as "first", "second", and the like are used merely for distinguishing between similar elements and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.
The first conductor structure 22 may be a metal structure in the electronic device 100 or a metal trace on the circuit board 13. Therein, the first conductor structure 22 comprises a first electrical connection point 221 and a second electrical connection point 222. The first electrical connection point 221 and the second electrical connection point 222 are disposed at an interval. The first electrical connection point 221 and the second electrical connection point 222 can be used to feed an excitation current to the first conductor arrangement 22. The first electrical connection point 221 is electrically connected to the first differential signal terminal 211 of the NFC IC 21. The first differential signal terminal 211 can thus feed a differential excitation current to the first conductor arrangement 22 via the first electrical connection point 221.
The first metal coil 23 may be a coil formed of a metal material such as a wire. The number of turns of the first metal coil 23 may be one or more turns, e.g. 10 turns, 20 turns, etc. Wherein the first metal coil 23 comprises two free ends, a first end 231 and a second end 232. The first end 231 is electrically connected to the second electrical connection point 222 of the first conductor structure 22, and the second end 232 is electrically connected to the second differential signal end 212 of the NFC IC 21.
Thus, the NFC IC 21, the first conductor structure 22, and the first metal coil 23 may form a current loop, so that the first conductor structure 22 and the first metal coil 23 may be used to jointly transmit the differential excitation current provided by the NFC IC 21 and radiate an NFC signal outward. Therefore, the first conductor structure 22 and the first metal coil 23 may serve as an NFC antenna of the electronic device 100, implementing an NFC function of the electronic device 100.
The first metal coil 23 and the first conductor structure 22 are disposed at an interval, that is, the first metal coil 23 and the first conductor structure 22 are disposed at different positions of the electronic device 100. The first conductor structure 22 may radiate an NFC signal to the outside when transmitting a differential excitation current. The first metal coil 23 at least partially covers a partial region of the camera hole 1211, for example, the first metal coil 23 may partially or completely cover a region of the camera hole 1211 on a side close to the NFC IC 21. Thus, the first metal coil 23 may radiate an NFC signal to the outside through the camera hole 1211 while transmitting the differential excitation current.
In the embodiment of the present application, the camera hole 1211 may be disposed on the metal rear case 121 in the center, or may be disposed near a side edge of the metal rear case 121, that is, not disposed in the center. When the camera hole 1211 is not centrally disposed on the metal rear case 121, for example, when the camera hole 1211 is disposed near a side of the metal rear case 121, a good NFC performance cannot be achieved in a conventional manner of disposing an NFC coil around the camera hole, and a sufficient space for the NFC coil to run cannot be provided on a structure stack of the electronic device. Furthermore, when the camera hole 1211 is centrally located on the metal rear case 121, the solution of the present application may also provide good NFC performance.
In some embodiments, referring to fig. 5, fig. 5 is a schematic structural diagram of a third electronic device 100 provided in the embodiments of the present application.
The electronic device 100 also includes a second conductor structure 26. The second conductor structure 26 may also be a metal structure in the electronic device 100 or a metal trace on the circuit board 13.
Wherein the second conductor structure 26 comprises a third electrical connection point 261 and a fourth electrical connection point 262. The third electrical connection point 261 is electrically connected to the second end 232 of the first metal coil 23, and the fourth electrical connection point 262 is electrically connected to the second differential signal terminal 212 of the NFC IC 21, so that the second end 232 of the first metal coil 23 is electrically connected to the second differential signal terminal 212.
Therefore, the differential excitation current supplied from the NFC IC 21 can be transmitted through the first conductor structure 22, the first metal coil 23, and the second conductor structure 26, and the transmission path length of the differential excitation current can be effectively increased. In addition, since the first conductor structure 22 and the second conductor structure 26 can be formed at different positions in the electronic device, the coverage of the NFC signal can be increased, and the NFC card swiping area can be increased.
In some embodiments, referring to fig. 6, fig. 6 is a fourth structural schematic diagram of the electronic device 100 provided in this embodiment of the present application.
The electronic device 100 further comprises a second metal coil 27. The second metal coil 27 may be a coil formed of a metal material such as a wire. The number of turns of the second metal coil 27 may also be one or more.
The second metal coil 27 includes two free ends, a third end 271 and a fourth end 272. The third end 271 is electrically connected to the second end 232 of the first metal coil 23, and the fourth end 272 is electrically connected to the third electrical connection point 261, so that the third electrical connection point 261 is electrically connected to the second end 232 of the first metal coil 23.
Therefore, the differential excitation current supplied from the NFC IC 21 can be transmitted collectively through the first conductor structure 22, the first metal coil 23, the second metal coil 27, and the second conductor structure 26, and the transmission path length of the differential excitation current can be further increased.
Wherein the second metal coil 27 at least partially covers a partial area of the camera hole 1211. For example, the second metal coil 27 may partially or entirely cover a region on the camera hole 1211 side. Therefore, the second metal coil 27 can also radiate the NFC signal to the outside through the camera hole 1211 when transmitting the differential excitation current.
In practical applications, the first metal coil 23 and the second metal coil 27 respectively cover different areas of the camera hole 1211. For example, the first metal coil 23 may cover a right region of the camera hole 1211, and the second metal coil 27 may cover a left region of the camera hole 1211.
It can be understood that when the first conductor structure 22, the first metal coil 23, the second metal coil 27 and the second conductor structure 26 jointly transmit the differential excitation current provided by the NFC IC 21, the directions of the currents in the first metal coil 23 and the second metal coil 27 can be the same, so that the NFC radiation field generated by the first metal coil 23 and the NFC radiation field generated by the second metal coil 27 are the same. Therefore, the NFC radiation field generated by the first metal coil 23 and the NFC radiation field generated by the second metal coil 27 can be superimposed on each other to enhance the NFC field strength at the camera hole 1211, thereby improving the NFC signal strength.
It can be understood that, since the metal back case 121 is made of a metal material, and the metal material can form a shielding effect on a wireless signal such as an NFC signal, the NFC signal radiated by the first metal coil 23 cannot be transmitted to the outside through the metal back case 121. Meanwhile, since the camera hole 1211 needs to be formed in the metal rear case 121 to install the camera module 15, the NFC signal radiated by the first metal coil 23 can be transmitted to the outside through the camera hole 1211, so that the NFC signal can be prevented from being shielded by the metal rear case 121, the structural strength and the aesthetic property of the metal rear case 121 can be prevented from being affected by forming an additional opening in the metal rear case 121, and the NFC function can be realized through the position where the camera hole 1211 is located.
Therefore, the electronic device 100 provided in the embodiment of the application can radiate the NFC signal outwards through the position where the first conductor structure 22 is located, and can radiate the NFC signal outwards through the position where the camera hole 1211 is located, so that the NFC signal can be radiated outwards through different positions of the electronic device 100, thereby increasing the NFC signal radiation area of the electronic device 100, and there is no need to provide an additional opening hole on the metal rear shell 121, thereby ensuring the integrity of the metal rear shell 121.
It will be appreciated that the first conductor structure 22 forms a first near field communication radiation field (first NFC radiation field) when transmitting the differential excitation current, which may cover a region of space around the electronic device 100. The first metal coil 23 forms a second near field communication radiation field (second NFC radiation field) when transmitting the differential excitation current, which may also cover a region of a certain space around the electronic device 100. Wherein the second NFC radiated field at least partially overlaps the first NFC radiated field. It will be appreciated that the second NFC radiation field has a component with the same direction as the first NFC radiation field, as seen from the direction of the current in the first conductor structure 22 and the direction of the current in the first metal coil 23. Thus, both the range of the NFC radiated field around the electronic device 100 and the NFC field strength of the overlap region may be enhanced. Therefore, the effective read-write (card swiping) area of the NFC antenna of the electronic device 100 can be increased, and the stability of the NFC antenna of the electronic device 100 during read-write (card swiping) can be improved.
For example, in practical applications, when an NFC receiver (e.g., a subway swipe card) reads an NFC signal near the position of the first conductor structure 22, the first NFC radiation field formed by the first conductor structure 22 serves as a main radiation field, and the second NFC radiation field formed by the first metal coil 23 can compensate for the main radiation field, so that a position with a weaker field strength in the main radiation field can be compensated to enhance the field strength of the entire area of the main radiation field. Similarly, when the NFC receiver reads the NFC signal near the position of the first metal coil 23, that is, near the position of the camera hole 1211, the second NFC radiation field formed by the first metal coil 23 serves as the main radiation field, and the first NFC radiation field formed by the first conductor structure 22 can compensate for the main radiation field. Therefore, any position of the NFC radiation field formed by the first conductor structure 22 and the first metal coil 23 can implement transceiving of the NFC signal, thereby implementing NFC communication between the electronic device 100 and other electronic devices.
In some embodiments, referring to fig. 7, fig. 7 is a schematic structural diagram of a camera module 15 of an electronic device according to an embodiment of the present disclosure.
The camera module 15 includes one or more cameras 151 and a non-metal element 152. The number of cameras 151 may be, for example, 1, 2, 3, or 4, and so on. The non-metallic element 152 can be, for example, a non-metallic decorative ring, such as a plastic decorative ring, and the non-metallic decorative ring 152 can be disposed around the periphery of the one or more cameras 151.
Wherein the first metal coil 23 at least partially covers a portion of the non-metallic element 152, such as the first metal coil 23 at least partially covers a portion of the non-metallic decorative ring. Thus, when the first metal coil 23 transmits the differential excitation current, the radiated NFC signal may be transmitted to the outside through the covered portion of the non-metal element 152, so as to implement NFC communication between the electronic device 100 and other electronic devices.
In some embodiments, referring to fig. 8, fig. 8 is a second structural schematic diagram of the housing 12 of the electronic device provided in the embodiments of the present application.
Among them, metal branches 1221 are formed on the metal frame 122 of the housing 12, and for example, the metal branches 1221 may be formed of magnesium alloy or aluminum alloy. Metal branches 1221 may form the first conductor structure 22. Therefore, the first conductor structure 22 can be formed through the metal frame 122 of the electronic device 100, and the first conductor structure or the NFC antenna does not need to be separately arranged in the electronic device 100, so that multiplexing of the metal frame 122 can be realized, and the design of the NFC antenna is simplified.
For example, in some embodiments, a first gap 1222 and a second gap 1223 may be spaced apart from each other on the metal bezel 122, and both the first gap 1222 and the second gap 1223 may penetrate through the metal bezel 122. Thus, the metal branch 1221 may be formed between the first gap 1222 and the second gap 1223.
In some embodiments, referring to fig. 9, fig. 9 is a schematic diagram of a fifth structure of an electronic device 100 according to an embodiment of the present disclosure.
Wherein the number of turns of the first metal coil 23 is one turn, the first metal coil 23 can be understood as an unsealed coil, and there is no overlapping portion between the two ends of the first metal coil 23. The loop of the first metal coil 23 covers a partial area of the camera hole 1211. For example, in practical applications, the first metal coil 23 may be a linear section of conductive wire or a printed circuit.
When the NFC IC 21, the first conductor structure 22, and the first metal coil 23 form a current loop, the current direction may be the direction shown by the arrow in fig. 9. Here, the current flowing through the first metal coil 23 may be represented as I1,I1Is directed from the first conductor structure 22 towards the NFC IC 21 via the first metal coil 23.
It can be understood that, in practical applications, when the number of turns of the first metal coil 23 is one, the first metal coil 23 may be distributed in the non-metal area as much as possible, and the diameter of the wire of the first metal coil 23 or the flexible circuit board carrying the first metal coil 23 may be set as wide as possible to enhance the current strength, so as to enhance the field strength of the NFC radiation field generated by the first metal coil 23, so as to enhance the NFC signal strength.
In some embodiments, referring to fig. 10 and fig. 11 simultaneously, fig. 10 is a sixth schematic structural diagram of the electronic device 100 provided in the embodiment of the present application, and fig. 11 is a schematic structural diagram of the first metal coil 23 of the electronic device provided in the embodiment of the present application.
The number of turns of the first metal coil 23 is multiple, for example, 10 turns, 20 turns, etc. When the number of turns of the first metal coil 23 is plural, the first metal coil 23 may be understood as a closed coil in which there is an overlapping portion between both ends of the first metal coil 23. The plurality of turns of the first metal coil 23 form the first coil portion 233 and the second coil portion 234, and each turn of the first coil portion 233 and each turn of the second coil portion 234 are sequentially connected end to end. The first coil portion 233 covers a partial region of the camera hole 1211, and the second coil portion 234 covers a partial region of the metal rear case 121.
When the NFC IC 21, the first conductor structure 22, and the first metal coil 23 form a current loop, a current flows through both the first coil portion 233 and the second coil portion 234. For example, the current flowing in the first coil portion 233 is denoted as I1The current flowing through the second coil part 234 is represented as I2. As can be appreciated, the first coilCurrent I in section 2331And the current I in the second coil portion 2342In the opposite direction. For example, current I1Is directed from the first conductor structure 22 towards the first metal coil 23, and the current I2Is directed from the first metal coil 23 towards the first conductor structure 22. The direction of current when the NFC IC 21, the first conductor structure 22, and the first metal coil 23 form a current loop is as indicated by the arrow in fig. 10.
It can be understood that, since the second coil part 234 covers a partial area of the metal back case 121, that is, the second coil part 234 is close to the covered partial area of the metal back case 121, the current I flows in the second coil part 2342At this time, the partial region of the metal back case 121 covered by the second coil part 234 is under the current I2Generates an induced current, such as an eddy current, which can be expressed as I3. Understandably, the induced current I3And the current I flowing in the second coil part 2342In opposite directions, so that an electric current I is induced3And the direction of the current I flowing in the first coil portion 2331In the same direction.
The first coil portion 233 radiates the NFC signal outward when transmitting the differential excitation current, thereby generating an NFC radiation field, for example, a third NFC radiation field, which may cover a region of space around the electronic device 100. The partial region of the metal rear case 121 covered by the second coil part 234 transmits the induction current I3In this case, the partial region may also radiate the NFC signal outwards, so as to generate an NFC radiation field, for example, a fourth NFC radiation field, which may also cover a certain spatial region around the electronic device 100. Wherein the fourth NFC radiated field at least partially overlaps the third NFC radiated field. Understandably, due to the induced current I3And the direction of the current I flowing in the first coil portion 2331Is identical, so that the direction of the fourth NFC radiated field is identical to the direction of the third NFC radiated field. Therefore, the fourth NFC radiation field and the third NFC radiation field may be superimposed on each other, so as to further enhance the range of the NFC radiation field around the electronic device 100, and may also enhance the NFC field strength in the overlapping region. Thus, it is possible to prevent the occurrence of,the effective read-write (card swiping) area of the NFC antenna of the electronic device 100 can be further increased, and the stability of the NFC antenna of the electronic device 100 during reading and writing (card swiping) can be improved.
In some embodiments, referring to fig. 12, fig. 12 is a schematic diagram illustrating a seventh structure of an electronic device 100 according to an embodiment of the present disclosure.
The electronic device 100 further includes a Flexible Printed Circuit (FPC) 241. The FPC 241 is electrically connected to the circuit board 13. The FPC 241 may be, for example, an FPC of a display screen, an FPC of a camera, an FPC of a motor, or the like, or the FPC 241 may be an independent FPC for implementing an NFC antenna function. The FPC 241 may be fixed within the housing of the electronic device 100. The FPC 241 is provided with metal wirings for transmitting signals, for example, control signals of a display screen, control signals of a camera, control signals of a motor, and the like. Wherein, the metal wiring on the FPC 241 forms the first metal coil 23. Therefore, the first metal coil 23 can be formed by metal wiring on the existing FPC in the electronic device 100, the first metal coil does not need to be separately provided, and the function multiplexing of the FPC can be realized, so that the design of the NFC antenna can be further simplified.
In some embodiments, referring to fig. 13, fig. 13 is a schematic structural diagram of the first metal coil 23, the flexible circuit board 241, and the radiation field enhancer 242 of the electronic device provided in the embodiment of the present application.
The electronic device 100 further comprises a radiation field enhancer 242. The material of the radiation field enhancer 242 may include an insulating material. For example, the radiation field enhancements 242 may comprise a ferrite layer. The ferrite layer is formed of a ferrite material, and the ferrite material may be a nickel-copper-zinc-based material having a predetermined content of iron oxide, copper oxide, zinc oxide, and nickel oxide. In addition, the ferrite material may further include auxiliary materials such as bismuth oxide, silicon oxide, magnesium oxide, cobalt oxide, etc. in a predetermined amount. The radiation field enhancer 242 may be used to enhance the strength of the NFC radiation field.
Here, the radiation field reinforcement member 242 is provided on the FPC 241 side, for example, on the side where the FPC 241 radiates the NFC signal to the outside, and the radiation field reinforcement member 242 abuts against the FPC 241. The radiation field enhancer 242 may be configured to enhance the strength of the NFC radiation field generated when the first metal coil 23 transmits the differential excitation current, so as to improve the strength of the NFC signal radiated to the outside by the first metal coil 23, thereby improving the performance of the NFC antenna.
In some embodiments, referring to fig. 14, fig. 14 is an eighth structural schematic diagram of an electronic device 100 provided in the embodiments of the present application.
The electronic device 100 further comprises a ground plane 251 and a metal connection 252. The ground plane 251 is used to form a common ground. The ground plane 251 may be formed by a conductor, a printed circuit, a metal printed layer, or the like in the electronic device 100. For example, the ground plane 251 may be disposed on the circuit board 13 of the electronic device 100. For another example, the ground plane 251 may be formed by a middle frame made of a metal material. The metal connecting member 252 may be a rib formed of a metal material such as magnesium alloy, aluminum alloy, etc.
The first conductor structure 22 further comprises a grounding point 223, the grounding point 223 being used for realizing the grounding of the first conductor structure 22. The grounding point 223 is located between the first electrical connection point 221 and the second electrical connection point 222. It will be appreciated that when the first conductor structure 22 is grounded, the strength of the NFC signal radiated by the first conductor structure 22 can be increased relative to when the first conductor structure 22 is not grounded, thereby increasing the performance of the NFC antenna.
The grounding point 223 is connected to the grounding plane 251 through the metal connecting element 252, so as to realize grounding of the first conductor structure 22. For example, in practical applications, the ground plane 251 may be a middle frame, the first conductor structure 22 may be a metal branch formed on the metal frame 122, and the metal connecting member 252 may be a rib formed between the middle frame and the metal frame 122, so that on one hand, the grounding of the first conductor structure 22 may be achieved through the rib, and on the other hand, the connection stability between the middle frame and the metal frame 122 may also be enhanced through the rib.
In some embodiments, referring to fig. 15, fig. 15 is a schematic diagram of a ninth structure of the electronic device 100 according to an embodiment of the present disclosure.
The metal connecting member 252 is provided with a slit 2521, and the metal connecting member 252 is divided into two parts, i.e., a first part 2522 and a second part 2523, by the slit 2521. The first portion 2522 may provide a current to the first conductor structure 22 for flowing back to ground, and the second portion 2523 may provide a current to the first conductor structure 22 for flowing back to ground. The current flowing back to ground on the first portion 2522 is greater than the current flowing back to the first conductor structure 22 on the second portion 2523.
As can be appreciated, since the metal connection element 252 is divided into the first portion 2522 and the second portion 2523 by the slot 2521, the second portion 2523 can make a part of the current returning to the ground flow back to the first conductor structure 22, so that the current level finally returning to the ground can be reduced, that is, the current loss of the first conductor structure 22 when transmitting the differential excitation current is reduced, and therefore the field strength of the NFC radiation field generated by the first conductor structure 22 when transmitting the differential excitation current can be increased, thereby enhancing the NFC signal strength.
In some embodiments, referring to fig. 16, fig. 16 is a schematic diagram of a tenth structure of the electronic device 100 according to an embodiment of the present disclosure.
The electronic device 100 also includes a non-near-field communication chip IC 1. The IC1 may be one of a cellular communication chip, a Wi-Fi (Wireless Fidelity) chip, a GPS (Global Positioning System) chip, and a BT (Bluetooth) chip. The IC1 is used to provide a non-near-field communication excitation current. Accordingly, the non-near-field communication excitation current may be one of a cellular communication excitation current, a Wi-Fi communication excitation current, a GPS communication excitation current, a BT communication excitation current. The non-near-field communication chip IC1 may be disposed on the circuit board 13 of the electronic device 100, or may be integrated on a separate circuit board in the electronic device 100.
The first conductor structure 22 further comprises a fifth electrical connection point 224. The fifth electrical connection point 224 can also be used for feeding an excitation current to the first conductor structure 22. The fifth electrical connection point 224 may be disposed between the first electrical connection point 221 and the second electrical connection point 222. Wherein the fifth electrical connection point 224 is electrically connected with the non-near-field communication chip IC 1. Thus, the non-near-field communication chip IC1 may feed a non-near-field communication excitation current to the first conductor structure 22 through the fifth electrical connection point 224. The first conductor structure 22 may also be used to transmit the non-near-field communication excitation current and radiate a corresponding wireless signal outward to implement a corresponding communication function.
Therefore, the non-near-field communication chip IC1 and the NFC IC 21 may implement multiplexing of the first conductor structure 22, so that the first conductor structure 22 simultaneously implements functions of two antennas, thereby reducing the number of antennas in the electronic device 100 and facilitating the overall antenna design of the electronic device 100.
In some embodiments, referring to fig. 17, fig. 17 is an eleventh structural schematic diagram of an electronic device 100 according to an embodiment of the present disclosure.
The electronic device 100 further includes a first matching circuit M1 and a second matching circuit M2. The matching circuit may also be referred to as a matching network, a tuning circuit, a tuning network, etc. It is understood that both the first matching circuit M1 and the second matching circuit M2 may include circuits formed by series or parallel connection of capacitors and inductors.
The NFC IC 21 is electrically connected to the first conductor structure 22 and the first metal coil 23 through the first matching circuit M1. In some embodiments, the first electrical connection point 221 of the first conductor structure 22 is electrically connected with the first differential signal terminal 211 of the NFC IC 21 through the first matching circuit M1. The second end 232 of the first metal coil 23 is electrically connected to the second differential signal end 212 of the NFC IC 21 through the first matching circuit M1. The first matching circuit M1 is used to match the impedance when the first conductor structure 22 and the first metal coil 23 transmit the differential excitation current.
In some embodiments, the first matching circuit M1 includes a first input terminal P1, a second input terminal P2, a first output terminal P3, and a second output terminal P4. The first input terminal P1 is electrically connected to the first differential signal terminal 211. The second input terminal P2 is electrically connected to the second differential signal terminal 212. The first output P3 is electrically connected to the first electrical connection point 221 of the first conductor arrangement 22. The second output terminal P4 is electrically connected to the second terminal 232 of the first metal coil 23.
The fifth electrical connection point 224 of the first conductor structure 22 is electrically connected to the non-near-field communication chip IC1 through the second matching circuit M2. The second matching circuit M2 is used to match the impedance of the first conductor structure 22 when transmitting a non-near-field communication excitation current.
In some embodiments, referring to fig. 18, fig. 18 is a schematic view of a twelfth structure of the electronic device 100 according to the embodiment of the present application.
The electronic device 100 further comprises a first filter circuit LC1, a second filter circuit LC2 and a third filter circuit LC 3. The filter circuit may also be referred to as a filter network. It is understood that the first filter circuit LC1, the second filter circuit LC2 and the third filter circuit LC3 may all comprise a circuit formed by a series connection or a parallel connection of a capacitor and an inductor.
Wherein the first filter circuit LC1 is disposed between the first differential signal terminal 211 and the first input terminal P1. The first filter circuit LC1 is used for filtering out a first interference signal between the first differential signal terminal 211 and the first input terminal P1. The first interference signal is an electrical signal other than the differential excitation current supplied from the NFC IC 21.
The second filter circuit LC2 is disposed between the second differential signal terminal 212 and the second input terminal P2. The second filter circuit LC2 is used for filtering out a second interference signal between the second differential signal terminal 212 and the second input terminal P2. The second interference signal is an electrical signal other than the differential excitation current supplied from the NFC IC 21.
The third filter circuit LC3 is disposed between the non-near-field communication chip IC1 and the second matching circuit M2. The third filter circuit LC3 is used to filter out a third interference signal between the non-near-field communication chip IC1 and the second matching circuit M2. The third interference signal is an electrical signal other than the non-near-field communication excitation current provided by the non-near-field communication chip IC 1.
In some embodiments, referring to fig. 19, fig. 19 is a first schematic diagram of an antenna apparatus of an electronic device 100 according to an embodiment of the present disclosure.
The first matching circuit M1 may include, for example, capacitances C1, C2, C3, C4, C5, and C6. The capacitor C1 is connected in series with the first differential signal terminal 211 of the NFC IC 21, and the capacitor C2 is connected in series with the second differential signal terminal 212 of the NFC IC 21. The capacitor C3 is connected in series with the capacitor C4 and after the series connection is connected in parallel with the NFC IC 21, and the capacitor C3 is connected to ground with the capacitor C4. The capacitor C5 is connected in series with the capacitor C6 and after the series connection is connected in parallel with the NFC IC 21, and the capacitor C5 is connected to ground with the capacitor C6. It is understood that the capacitance values of the capacitors C1, C2, C3, C4, C5 and C6 can be set according to actual needs.
The first filter circuit LC1 may include, for example, an inductor L1 and a capacitor C7. Wherein the inductor L1 is connected in series between the first differential signal terminal 211 and the first matching circuit M1, and the capacitor C7 is connected in parallel with the NFC IC 21 and is connected to ground. It is understood that the inductance of the inductor L1 and the capacitance of the capacitor C7 can be set according to actual needs.
The second filter circuit LC2 may include, for example, an inductor L2 and a capacitor C8. Wherein the inductor L2 is connected in series between the second differential signal terminal 212 and the first matching circuit M1, and the capacitor C8 is connected in parallel with the NFC IC 21 and is connected to ground. It is understood that the inductance of the inductor L2 and the capacitance of the capacitor C8 can be set according to actual needs.
The second matching circuit M2 may for example comprise capacitors C9, C10. Wherein the capacitor C9 is connected in series between the fifth electrical connection point 224 of the first conductor structure 22 and the non-near-field communication chip IC1, and the capacitor C10 is connected in parallel with the non-near-field communication chip IC1 and is connected to ground. It is understood that the capacitance values of the capacitors C9 and C10 can be set according to actual needs.
The third filter circuit LC3 may include, for example, an inductor L3 and a capacitor C11. The inductor L3 is connected in series between the non-near-field communication chip IC1 and the second matching circuit M2, and the capacitor C11 is connected in parallel with the non-near-field communication chip IC1 and is connected to ground. It is understood that the inductance of the inductor L3 and the capacitance of the capacitor C11 can be set according to actual needs.
In some embodiments, referring to fig. 20, fig. 20 is a second schematic diagram of an antenna apparatus of an electronic device 100 according to an embodiment of the present disclosure.
Fig. 20 differs from fig. 19 in that: the first matching circuit M1 includes only capacitors C1, C2, C3, C5. The capacitor C1 is connected in series with the first differential signal terminal 211 of the NFC IC 21, and the capacitor C2 is connected in series with the second differential signal terminal 212 of the NFC IC 21. The capacitor C3 is connected in parallel with the NFC IC 21, and the capacitor C5 is also connected in parallel with the NFC IC 21. It is understood that the capacitance values of the capacitors C1, C2, C3 and C5 can be set according to actual needs.
The electronic device provided by the embodiment of the application is described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (20)
1. An electronic device, comprising:
the camera comprises a metal rear shell, a camera body and a camera module, wherein the metal rear shell is provided with a camera hole, and the camera hole is used for installing the camera module;
the near field communication chip comprises a first differential signal end and a second differential signal end, wherein the first differential signal end and the second differential signal end are used for providing differential excitation current;
a first conductor structure comprising a first electrical connection point and a second electrical connection point, the first electrical connection point being electrically connected to the first differential signal terminal;
the first metal coil at least partially covers a partial area of the camera hole, a first end of the first metal coil is electrically connected with the second electric connection point, and a second end of the first metal coil is electrically connected with the second differential signal end;
wherein the first conductor structure and the first metal coil are configured to transmit the differential excitation current in common.
2. The electronic device of claim 1, wherein the first conductor structure forms a first near-field communication radiating field when transmitting the differential excitation current and the first metal coil forms a second near-field communication radiating field when transmitting the differential excitation current, the second near-field communication radiating field at least partially overlapping the first near-field communication radiating field.
3. The electronic apparatus according to claim 1, wherein the first metal coil has a number of turns, the number of turns of the first metal coil forming a first coil portion covering a partial area of the camera hole and a second coil portion covering a partial area of the metal rear case, a direction of a current in the first coil portion being opposite to a direction of a current in the second coil portion.
4. The electronic apparatus according to claim 3, wherein the partial region of the metal rear case generates an induced current by a current in the second coil portion, the induced current having a direction same as a direction of a current in the first coil portion.
5. The electronic device of claim 4, wherein the first coil portion generates a third near-field communication radiation field when transmitting the differential excitation current, wherein the induced current generates a fourth near-field communication radiation field when transmitting in the metallic back case, and wherein the fourth near-field communication radiation field at least partially overlaps the third near-field communication radiation field.
6. The electronic device according to claim 1, wherein the number of turns of the first metal coil is one, and the one turn of the first metal coil covers a partial area of the camera hole.
7. The electronic device of any of claims 1-6, further comprising:
the flexible circuit board is provided with a metal wire, and the metal wire forms the first metal coil.
8. The electronic device of claim 7, further comprising:
the radiation field enhancement body is arranged on one side of the flexible circuit board and used for enhancing the intensity of a near field communication radiation field generated when the first metal coil transmits the differential excitation current.
9. The electronic device of any of claims 1-6, further comprising:
a second conductor structure including a third electrical connection point electrically connected to the second end of the first metal coil and a fourth electrical connection point electrically connected to the second differential signal terminal, such that the second end of the first metal coil is electrically connected to the second differential signal terminal;
wherein the first conductor structure, the first metal coil, and the second conductor structure are to collectively transmit the differential excitation current.
10. The electronic device of claim 9, further comprising:
a second metal coil at least partially covering a partial region of the camera hole, a third end of the second metal coil being electrically connected to a second end of the first metal coil, and a fourth end of the second metal coil being electrically connected to the third electrical connection point, so that the third electrical connection point is electrically connected to the second end of the first metal coil;
the first conductor structure, the first metal coil, the second metal coil and the second conductor structure are used for transmitting the differential excitation current together, and the first metal coil and the second metal coil cover different areas of the camera hole.
11. The electronic device of any of claims 1-6, further comprising:
the camera module is installed in the camera hole and comprises a non-metal element, and the first metal coil at least partially covers one part of the non-metal element.
12. The electronic device of claim 11, wherein the camera module is a rear camera module.
13. The electronic device of any of claims 1-6, further comprising:
a ground plane;
the first conductor structure further comprises a grounding point, and the grounding point is connected with the grounding plane through a metal connecting piece.
14. The electronic device of claim 13, wherein the ground point is located between the first electrical connection point and the second electrical connection point.
15. The electronic device of any of claims 1-6, further comprising:
the first electrical connection point is electrically connected with the first differential signal end through the first matching circuit, the second end of the first metal coil is electrically connected with the second differential signal end through the first matching circuit, and the first matching circuit is used for matching impedance when the first conductor structure and the first metal coil transmit the differential excitation current.
16. The electronic device of claim 15, wherein:
the first matching circuit comprises a first input end, a second input end, a first output end and a second output end;
the first input end is electrically connected with the first differential signal end, the second input end is electrically connected with the second differential signal end, the first output end is electrically connected with the first electric connection point, and the second output end is electrically connected with the second end of the first metal coil.
17. The electronic device of any of claims 1-6, further comprising:
the non-near-field communication chip is used for providing a non-near-field communication excitation current;
the first conductor structure further comprises a fifth electrical connection point electrically connected to the non-near-field communication chip, and the first conductor structure is further configured to transmit the non-near-field communication excitation current.
18. The electronic device of claim 17, further comprising:
the fifth electrical connection point is electrically connected with the non-near-field communication chip through the second matching circuit, and the second matching circuit is used for matching impedance when the first conductor structure transmits the non-near-field communication excitation current.
19. The electronic device of any of claims 1-6, further comprising:
the metal frame is provided with metal branches, and the metal branches form the first conductor structure.
20. The electronic device of claim 19, wherein a first gap and a second gap are disposed at an interval on the metal bezel, and the metal stub is formed between the first gap and the second gap.
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CN114978246A (en) * | 2022-06-14 | 2022-08-30 | 维沃移动通信有限公司 | Electronic device |
WO2024001097A1 (en) * | 2022-06-27 | 2024-01-04 | Oppo广东移动通信有限公司 | Antenna apparatus and terminal |
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US9685910B2 (en) * | 2014-10-03 | 2017-06-20 | Short Circuit Technologies Llc | Transformer based impedance matching network and related power amplifier, ADPLL and transmitter based thereon |
US10247406B2 (en) * | 2015-10-30 | 2019-04-02 | Extenet Systems, Inc. | Lighting fixture having an integrated communications system |
US10431872B1 (en) * | 2018-04-05 | 2019-10-01 | Lg Electronics Inc. | Mobile terminal |
CN210838090U (en) * | 2019-12-26 | 2020-06-23 | Oppo广东移动通信有限公司 | Antenna device and electronic apparatus |
CN210805996U (en) * | 2019-12-31 | 2020-06-19 | Oppo广东移动通信有限公司 | Antenna device and electronic apparatus |
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2020
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CN114978246A (en) * | 2022-06-14 | 2022-08-30 | 维沃移动通信有限公司 | Electronic device |
WO2024001097A1 (en) * | 2022-06-27 | 2024-01-04 | Oppo广东移动通信有限公司 | Antenna apparatus and terminal |
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