CN112449035B

CN112449035B - Electronic equipment

Info

Publication number: CN112449035B
Application number: CN201910819064.7A
Authority: CN
Inventors: 李偲
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-08-30
Filing date: 2019-08-30
Publication date: 2023-04-28
Anticipated expiration: 2039-08-30
Also published as: CN112449035A

Abstract

An embodiment of the present application provides an electronic device, including: a near field communication chip for providing a differential excitation current; a ground plane formed with a conductive path; a conductor structure; a capacitive sensor comprising a first plate; the conductor structure, the conductive path, and the first plate together form a conductive loop for transmission of the differential excitation current. In the electronic equipment, because the conductor structure and the first polar plate can be respectively arranged at different positions of the electronic equipment according to the requirements of the design of the internal space of the electronic equipment, and then the conductive paths formed on the ground plane are connected to form a loop, the design of the NFC antenna can be realized by matching the conductor structure and the capacitive sensor at different positions of the electronic equipment with the ground plane, so that the polar plate of the capacitive sensor can be reused as the NFC antenna, the occupied space of the NFC antenna can be saved, and the layout of the NFC antenna can be more flexible.

Description

Electronic equipment

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to an electronic device.

Background

With the development of communication technology, electronic devices such as smartphones are capable of realizing more and more functions, and communication modes of the electronic devices are also more diversified. For example, a typical electronic device may support multiple communication modes, such as cellular network communication, wireless fidelity (Wireless Fidelity, wi-Fi) communication, global positioning system (Global Positioning System, GPS) communication, bluetooth (BT) communication, and the like. Further, with the advancement of communication technology, near field communication (Near Field Communication, NFC) is increasingly available to electronic devices recently.

On the other hand, with the development of electronic technology, electronic devices are becoming smaller and thinner, and the internal space of electronic devices is also becoming smaller, and antennas of various communication systems and electronic devices such as sensors occupy a large amount of internal space in electronic devices. Thus, how to reasonably design NFC antennas of electronic devices has become a challenge.

Disclosure of Invention

The embodiment of the application provides an electronic device, which can save the occupied space of an NFC antenna in the electronic device, and the layout of the NFC antenna can be more flexible.

An embodiment of the present application provides an electronic device, including:

the near field communication chip comprises a first differential signal end and a second differential signal end, wherein the first differential signal end and the second differential signal end are used for providing differential excitation current;

a ground plane including first and second ground points disposed in spaced relation, the ground plane forming a conductive path between the first and second ground points;

the conductor structure comprises a first feed end and a first grounding end which are arranged at intervals, the first feed end is electrically connected with the first differential signal end, and the first grounding end is electrically connected with the first grounding point;

The capacitive sensor is used for detecting the distance between the external conductors and comprises a first polar plate, wherein the first polar plate comprises a second feed end and a second grounding end which are arranged at intervals, the second feed end is electrically connected with the second differential signal end, and the second grounding end is electrically connected with the second grounding point;

wherein the conductor structure, the conductive path, and the first plate together form a conductive loop for transmission of the differential excitation current.

According to the electronic device, the conductor structure and the first polar plate of the multiplexing capacitance sensor are arranged, the conductor structure and the first polar plate are connected to two different grounding points of the same grounding plane, and the conductive path is formed by utilizing the grounding plane between the two grounding points, so that a conductive loop for NFC differential excitation current transmission can be formed through the conductor structure, the first polar plate and the conductive path. Because conductor structure first polar plate can set up respectively in electronic equipment's different positions according to electronic equipment inner space design's demand, and then through the conductive path connection that forms on the ground plane forms the return circuit to can realize NFC antenna's design through the conductor structure of electronic equipment different positions and capacitive sensor cooperation ground plane, consequently can reuse capacitive sensor's polar plate as NFC antenna, not only can save NFC antenna's occupation space, make NFC antenna's overall arrangement more nimble moreover.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a second structure of an electronic device according to an embodiment of the present application.

Fig. 3 is a schematic diagram illustrating an antenna device in an electronic device according to an embodiment of the present application.

Fig. 4 is a schematic diagram of a third structure of an electronic device according to an embodiment of the present application.

Fig. 5 is a schematic diagram of a fourth structure of an electronic device according to an embodiment of the present application.

Fig. 6 is a schematic diagram of a fifth structure of an electronic device according to an embodiment of the present application.

Fig. 7 is a schematic diagram of a sixth structure of an electronic device according to an embodiment of the present application.

Fig. 8 is a schematic diagram of a seventh structure of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The embodiment of the application provides electronic equipment. The electronic device may be a smart phone, a tablet computer, or the like, and may also be a game device, an AR (Augmented Reality ) device, an automobile device, a data storage device, an audio playing device, a video playing device, a notebook computer, a desktop computing device, or the like.

Referring to fig. 1, fig. 1 is a schematic diagram of a first structure of an electronic device 100 according to an embodiment of the present application.

The electronic device 100 includes a display screen 10, a housing 20, a circuit board 30, and a battery 40.

The display screen 10 is disposed on the housing 20 to form a display surface of the electronic device 100, and is used for displaying information such as images and texts. The display screen 10 may include a liquid crystal display (Liquid Crystal Display, LCD) or an Organic Light-Emitting Diode (OLED) display, or the like.

It will be appreciated that the display screen 10 may include a display surface and a non-display surface opposite the display surface. The display surface is the surface of the display screen 10 facing the user, i.e. the surface of the display screen 10 visible to the user on the electronic device 100. The non-display surface is a surface of the display screen 10 facing the interior of the electronic device 100. The display surface is used for displaying information, and the non-display surface is not used for displaying information.

It will be appreciated that a cover plate may also be provided over the display 10 to protect the display 10 from scratches or water damage. The cover plate may be a transparent glass cover plate, so that a user can observe the content displayed on the display screen 10 through the cover plate. It is understood that the cover plate may be a glass cover plate made of sapphire.

The housing 20 is used to form the exterior contour of the electronic device 100 so as to accommodate the electronics, functional components, etc. of the electronic device 100 while providing sealing and protection for the electronics and functional components within the electronic device. For example, the camera, circuit board, vibration motor functional components of the electronic device 100 may all be disposed inside the housing 20. It will be appreciated that the housing 20 may include a center and a battery cover.

The middle frame may have a thin plate-like or sheet-like structure, or may have a hollow frame structure. The center frame is used to provide support for the electronics or functional components in the electronic device 100 to mount the electronics, functional components of the electronic device 100 together. For example, the middle frame may be provided with a groove, a protrusion, a through hole, etc. to facilitate the installation of the electronic device or the functional component of the electronic device 100. It is understood that the material of the middle frame may include metal or plastic.

The battery cover is connected with the middle frame. For example, the battery cover may be attached to the center frame by an adhesive such as double-sided tape to achieve connection with the center frame. The battery cover is used to seal the electronic devices and functional components of the electronic device 100 inside the electronic device 100 together with the middle frame and the display screen 10, so as to protect the electronic devices and functional components of the electronic device 100. It will be appreciated that the battery cover may be integrally formed. In the forming process of the battery cover, a rear camera mounting hole and other structures can be formed on the battery cover. It is understood that the material of the battery cover may also include metal or plastic.

A circuit board 30 is disposed inside the housing 20. For example, the circuit board 30 may be mounted on a center frame of the case 20 to be fixed, and the circuit board 30 is sealed inside the electronic device by a battery cover. The circuit board 30 may be a motherboard of the electronic device 100. One or more of the functional components of the processor, camera, earphone interface, acceleration sensor, gyroscope, motor, etc. may also be integrated on the circuit board 30. Meanwhile, the display screen 10 may be electrically connected to the circuit board 30 to control display of the display screen 10 by a processor on the circuit board 30. It will be appreciated that due to the limitation of the design space within the electronic device 100, the circuit board 30 may further include a plurality of separate circuit boards disposed at intervals, for example, a main circuit board and a sub circuit board disposed at intervals, where electronic devices or functional components may be integrated on both the main circuit board and the sub circuit board.

The battery 40 is disposed inside the housing 20. For example, the battery 40 may be mounted on a center frame of the case 20 to be fixed, and the battery 40 is sealed inside the electronic device by a battery cover. Meanwhile, the battery 40 is electrically connected to the circuit board 30 to enable the battery 40 to supply power to the electronic device 100. Wherein the circuit board 30 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 40 to the various electronic devices in the electronic device 100.

Wherein, the electronic device 100 is further provided with an antenna device. The antenna arrangement is for implementing a wireless communication function of the electronic device 100, for example the antenna arrangement may be for implementing a near field communication (NFC communication) function. The antenna device is disposed inside the housing 20 of the electronic device 100. It will be appreciated that, among other things, part of the components of the antenna arrangement may be integrated on the circuit board 30 inside the housing 20, for example, the signal processing chip and the signal processing circuitry in the antenna arrangement may be integrated on the circuit board 30. Furthermore, part of the components of the antenna device may also be arranged directly inside the housing 20. For example, the radiator or conductor structure of the antenna arrangement for radiating signals may be arranged directly inside the housing 20.

Referring to fig. 2, fig. 2 is a schematic diagram of a second structure of the electronic device 100 according to the embodiment of the present application. Wherein the antenna arrangement comprises a near field communication chip 21, a ground plane 22 and a conductor structure 23. The electronic device 100 further comprises a capacitive sensor 31 and a sensor processing circuit 32.

Wherein a near field communication chip (NFC chip) 21 may be used to provide the differential excitation current. The differential excitation current comprises two current signals. The two current signals are identical in amplitude and opposite in phase or understood to be 180 degrees out of phase. Furthermore, the differential excitation current is a balanced signal. It will be appreciated that an analog signal is an unbalanced signal if it is transmitted directly during transmission; if the original analog signal is inverted and then the inverted analog signal and the original analog signal are transmitted simultaneously, the inverted analog signal and the original analog signal are called balanced signals. The balanced signal is subtracted from the original analog signal through the differential amplifier in the transmission process to obtain the enhanced original analog signal, and the two transmission lines are subjected to the same interference in the transmission process, so that the same interference signal is subtracted in the subtraction process, and the anti-interference performance of the balanced signal is better.

The NFC chip 21 includes a first differential signal terminal 211 and a second differential signal terminal 212. For example, the first differential signal terminal 211 may be a positive (+) port of the NFC chip 21, and the second differential signal terminal 212 may be a negative (-) port of the NFC chip 21. The first differential signal terminal 211 and the second differential signal terminal 212 are configured to provide the differential excitation current. For example, the differential exciting current provided by the NFC chip 21 may be output to the antenna device via the first differential signal terminal 211 and reflowed to the NFC chip 21 via the second differential signal terminal 212, thereby forming a current loop.

It will be appreciated that the NFC chip 21 may be disposed on the circuit board 30 of the electronic device 100, or a smaller separate circuit board may be disposed in the electronic device 100 and the NFC chip 21 may be integrated onto the separate circuit board. The separate circuit board may be, for example, a secondary circuit board in the electronic device 100.

The ground plane 22 is used to form a common ground. Wherein the ground plane 22 may be formed by conductors, printed wiring, or metallic printed layers, etc. in the electronic device 100. For example, the ground plane 22 may be disposed on the circuit board 30 of the electronic device 100. The ground plane 22 may also be formed on the housing 20 of the electronic device 100, for example, the ground plane 22 may be formed by a center frame of the housing 20, or the ground plane 22 may also be formed by a battery cover of the housing 20.

The ground plane 22 includes first and second ground points 221, 222 disposed at intervals. The first ground point 221 and the second ground point 222 may be, for example, an end portion of the ground plane 22, or may be a bump structure on the ground plane 22, or may be a pad formed on the ground plane 22, or may be an area of a certain area on the ground plane 22, or the like.

Wherein the ground plane 22 forms an electrically conductive path between the first ground point 221 and the second ground point 222, which may be used for conducting electrical current. That is, when a voltage signal is applied between the first ground point 221 and the second ground point 222, a current may be generated between the first ground point 221 and the second ground point 222, thereby forming a current loop. It will be appreciated that when the NFC chip 21 provides a differential excitation current, the conductive path between the first ground point 221 and the second ground point 222 may be used to transmit the differential excitation current.

The conductor structure 23 includes a first feed end 231 and a first ground end 232 disposed in spaced apart relation. The first power feeding terminal 231 is electrically connected to the first differential signal terminal 211 of the NFC chip 21, so that the first differential signal terminal 211 feeds power to the first power feeding terminal 231. For example, the differential excitation current provided by the NFC chip 21 may be transmitted to the first feeding terminal 231 via the first differential signal terminal 211 to enable feeding the conductor structure 23. The first ground terminal 232 is electrically connected to the first ground point 221 of the ground plane 22, thereby achieving a return ground of the conductor structure 23.

It is understood that the conductor structure 23 may be a metal structure in the electronic device 100 or a metal trace on a circuit board. For example, the conductor structure 23 may be a metal branch formed on the housing 20, for example, the conductor structure 23 may be a metal branch formed on a middle frame of the housing 20, or the conductor structure 23 may be a metal branch formed on a battery cover of the housing 20. For another example, the electronic device 100 may include a camera, a decorative ring made of metal may be disposed around the camera, and the conductor structure 23 may be the decorative ring. For another example, the conductor structure 23 may be a metal trace on a flexible circuit board (Flexible Printed Circuit, FPC) in the electronic device 100, and the FPC may be a structure such as an FPC of a display screen, an FPC of a camera, and an FPC of a motor. As another example, the conductor structure 23 may also be a printed wire on the circuit board 30 of the electronic device 100.

The capacitive sensor 31 is disposed inside the housing 20. For example, the capacitive sensor 31 may be disposed on a center frame of the housing 20 for fixation. Alternatively, the capacitive sensor 31 may be disposed on the circuit board 30. Wherein the capacitive sensor 31 is used for detecting the distance of the outer conductor. The external conductor may be, for example, a human body such as a hand, face, or the like of a user. The external conductor may also be an external metal object or the like, such as an NFC receiver (such as a subway card reader) or the like. The capacitive sensor 31 may be used as a proximity sensor of the electronic device 100 for detecting a distance between external conductors, thereby detecting a proximity or a distance between external objects such as a human body or a metal object. In addition, the capacitive sensor 31 may also be used as a touch sensor of the electronic device 100 for detecting a touch operation of a user.

The capacitive sensor 31 includes a first plate, such as the first plate 24. The first plate 24 may be multiplexed as an NFC antenna to enable transmission of the differential excitation current through the first plate 24. The first electrode plate 24 includes a second feeding end 241 and a second grounding end 242 that are disposed at intervals. The second feeding terminal 241 is electrically connected to the second differential signal terminal 212 of the NFC chip 21, so that the second differential signal terminal 212 feeds power to the second feeding terminal 241. For example, the differential exciting current provided by the NFC chip 21 may be transmitted to the second differential signal terminal 212 via the second feeding terminal 241, so as to realize feeding to the first electrode plate 24. The second ground 242 is electrically connected to the second ground point 222 of the ground plane 22, thereby achieving the return of the first plate 24.

It will be appreciated that the capacitive sensor 31 also includes a second plate, such as second plate 311. The second electrode plate 311 is spaced from the first electrode plate 24. The second electrode plate 311 and the first electrode plate 24 are both metal electrode plates, for example, may be copper alloy electrode plates. The second plate 311 may be disposed in parallel with the first plate 24 to form a parallel plate capacitor; alternatively, the first plate 24 may be disposed around the outer periphery of the second plate 311. It will be appreciated that an insulating medium may be further disposed between the second electrode plate 311 and the first electrode plate 24.

The sensor processing circuit 32 is electrically connected to the capacitive sensor 31. It is understood that the sensor processing circuit 32 may be electrically connected to the first electrode plate 24 and the second electrode plate 311 of the capacitive sensor 31, so as to process the signal detected by the capacitive sensor 31. The sensor processing circuit 32 may be disposed on the circuit board 30 of the electronic device 100, or the sensor processing circuit 32 may be integrated into a processor of the electronic device 100.

In addition, in order to achieve isolation of the first plate 24 between transmitting the differential excitation current and transmitting the detected signal, or to improve isolation when transmitting both signals, a filter circuit may be provided between the first plate 24 and the sensor processing circuit 32. The filter circuit may allow the signal detected by the capacitive sensor 31 to pass and prevent the differential excitation current from passing.

Wherein the conductor structure 23, the conductive path on the ground plane 22 and the first plate 24 together form a conductive loop for the transmission of the differential excitation current. That is, the differential excitation current is output from one signal terminal of the NFC chip 21, for example, from the first differential signal terminal 211, and is then fed into the conductor structure 23, transferred to the conductive path on the ground plane 22 via the conductor structure 23, then transferred to the first plate 24 via the conductive path, and finally reflowed to the second differential signal terminal 212 of the NFC chip 21 through the first plate 24, thereby forming a complete current loop.

It will be appreciated that the conductive loop, when transmitting the differential excitation current, the conductor structure 23, the conductive path on the ground plane 22, and the first plate 24 may together generate an alternating electromagnetic field, thereby radiating NFC signals outwards to enable NFC communication of the electronic device 100.

Wherein the conductive loop generates a first near field communication radiation field (first NFC radiation field) when transmitting the differential excitation current, the conductor structure 23. The first NFC radiation field may cover an area of space around the electronic device 100. The first plate 24 generates a second near field communication radiation field (second NFC radiation field). The second NFC radiation field may also cover an area of space around the electronic device 100. Wherein the second NFC radiation field at least partially overlaps the first NFC radiation field, thereby enhancing both the area of the NFC radiation field around the electronic device 100 and the field strength of the overlapping area. Therefore, the effective read-write (card swiping) area of the NFC antenna of the electronic device 100 can be increased, and the stability of the NFC antenna of the electronic device 100 during read-write (card swiping) can be improved.

Furthermore, the ground plane 22 may generate a third near field communication radiation field (third NFC radiation field) when the conductive loop transmits the differential excitation current. The third NFC radiation field may also cover an area of space around the electronic device 100. Wherein the third NFC radiation field at least partially overlaps the first NFC radiation field and the third NFC radiation field at least partially overlaps the second NFC radiation field. Thus, the area of the NFC radiation field around the electronic device 100 can be further enhanced and the field strength of the overlapping area can be enhanced.

For example, in practical applications, when the NFC receiver (e.g. a subway card reader) reads the NFC signal near the position of the conductor structure 23, the first NFC radiation field formed by the conductor structure 23 is used as a main radiation field, and the second NFC radiation field formed by the first pole plate 24 and the third NFC radiation field formed by the ground plane 22 can compensate for the main radiation field, so that the position of the main radiation field with a weaker field strength can be compensated for enhancing the field strength of the whole area of the main radiation field. Similarly, when the NFC receiver reads the NFC signal near the first plate 24, the second NFC radiation field formed by the first plate 24 is used as the main radiation field, and both the first NFC radiation field and the third NFC radiation field can compensate for the main radiation field.

Therefore, in the electronic device 100 of the present application, it may be ensured that the NFC signal may be received and transmitted at any position of the NFC radiation field formed by the conductor structure 23, the first polar plate 24, and the ground plane 22, so as to implement NFC communication between the electronic device 100 and other electronic devices.

Referring to fig. 3 at the same time, fig. 3 is a schematic diagram illustrating the arrangement of an antenna device in the electronic device 100 according to the embodiment of the present application.

Wherein, near field communication chip (NFC chip) may be integrated on a circuit board of the electronic device, the conductor structure may be disposed at an end of the electronic device, for example, the conductor structure may be disposed at a top end of the electronic device, the ground plane may be formed on the circuit board of the electronic device, and the first polar plate may be disposed at one side of the electronic device, for example, the first polar plate may be disposed at a right side of the electronic device. The differential exciting current provided by the NFC chip can be transmitted to the conductor structure at the top end of the electronic equipment from the NFC chip, then transmitted to the ground plane on the circuit board of the electronic equipment from the conductor structure, then transmitted to the first polar plate on the right side of the electronic equipment from the ground plane on the circuit board, and finally reflowed to the NFC chip from the second conductor structure.

It should be noted that, the conductor structure is disposed at the top end of the electronic device, and the first electrode plate is disposed at the right side of the electronic device, which is merely for example, and is not meant to limit embodiments of the present application. It can be appreciated that the conductor structure may also be disposed at other locations of the electronic device, and the first electrode plate may also be disposed at other locations of the electronic device, so that NFC communication may be performed between other electronic devices through different locations of the electronic device, for example, NFC communication may be performed through a front side of the electronic device (i.e., a side of the electronic device on which a display screen of the electronic device is located) and NFC communication may also be performed through a back side of the electronic device (i.e., a side of the electronic device on which a battery cover of the electronic device is located).

It should be noted that, when the electronic device radiates the NFC signal outwards, the NFC chip in the electronic device may actively provide a differential exciting current. When the electronic device is used as an NFC receiver to receive NFC signals radiated by other electronic devices, an induced current may be generated in the electronic device, where the induced current may also be understood as a differential exciting current provided by the NFC chip or may be understood as a differential exciting current passively provided by the NFC chip. That is, the NFC chip in the electronic device may provide a differential excitation current whether the electronic device radiates NFC signals outward as an NFC transmitter or receives NFC signals radiated by other electronic devices as an NFC receiver.

Referring to fig. 4, fig. 4 is a schematic diagram of a third structure of the electronic device 100 according to the embodiment of the present application. The electronic device 100 shown in fig. 4 is different from the electronic device 100 shown in fig. 3 in that: the second plate 311 of the capacitive sensor 31 may be multiplexed as said conductor structure 23. That is, the conductor structure 23 includes the second plate 311. The first feeding end 231 and the first grounding end 232 of the conductor structure 23 are arranged on the second polar plate 311 at intervals.

It will be appreciated that the differential excitation current provided by the NFC chip 21 may include a first current and a second current, the phase of the first current being opposite to the phase of the second current. The first differential signal terminal 211 of the NFC chip 21 is configured to output the first current, and the second differential signal terminal 212 of the NFC chip 21 is configured to output the second current.

Since the first electrode plate 24 and the second electrode plate 311 together form the capacitive sensor 31, the distance between the first electrode plate 24 and the second electrode plate 311 is small. For example, the distance between the first electrode plate 24 and the second electrode plate 311 may be 3mm (millimeters). At this time, the NFC radiation field formed by the first plate 24 almost overlaps with the NFC radiation field formed by the second plate 311. When the phase between the current transmitted by the first polar plate 24 and the current transmitted by the second polar plate 311 is opposite, the direction of the NFC radiation field formed by the first polar plate 24 and the direction of the NFC radiation field formed by the second polar plate 311 are opposite, and the two NFC radiation fields are weakened or even offset.

In order to enhance the NFC radiation field formed by the first plate 24 and the NFC radiation field formed by the second plate 311, the NFC radiation field formed by the first plate 24 and the NFC radiation field formed by the second plate 311 need to have the same direction. Accordingly, the phase of the current transmitted by the second plate 311 may be adjusted by a phase shifter so that the phase of the current transmitted by the second plate 311 is the same as the phase of the current transmitted by the first plate 24.

Wherein the electronic device 100 comprises a phase shifter 234. The phase shifter 234 is electrically connected to the first differential signal terminal 211 and the first power supply terminal 231. That is, the first feeding terminal 231 is electrically connected to the first differential signal terminal 211 through the phase shifter 234. The phase shifter 234 is configured to adjust the phase of the first current output by the first differential signal terminal 211 so that the phase of the adjusted first current is the same as the phase of the second current output by the second differential signal terminal 212. Therefore, during the transmission of the first current by the second electrode plate 311 and the transmission of the second current by the first electrode plate 24, the direction of the NFC radiation field formed by the second electrode plate 311 may be the same as the direction of the NFC radiation field formed by the first electrode plate 24, so that the NFC radiation field formed by the second electrode plate 311 and the NFC radiation field formed by the first electrode plate 24 are mutually enhanced, so as to improve the signal strength when the electronic device 100 radiates the NFC signal.

Referring to fig. 5, fig. 5 is a schematic diagram of a fourth structure of an electronic device 100 according to an embodiment of the present application. The electronic device 100 shown in fig. 5 is different from the electronic device 100 shown in fig. 3 in that: the electronic apparatus 100 includes a main circuit board 33, a sub circuit board 34, and a flexible circuit board (FPC) 35. The main circuit board 33 and the sub circuit board 34 may be disposed at different positions in the electronic device 100 at intervals. Wherein the main circuit board 33 is electrically connected to the sub circuit board 34 through the FPC 35 to electrically connect the main circuit board 33 to the sub circuit board 34. The FPC 35 is provided with a metal wiring 351, and the metal wiring 351 may be multiplexed as the conductor structure 23. That is, the conductor structure 23 includes the metal trace 351. The first feeding end 231 and the first grounding end 232 are disposed on the metal wire 351 at intervals.

Wherein it is understood that both the near field communication chip 21 and the ground plane 22 may be provided on the main circuit board 33.

Referring to fig. 6, fig. 6 is a schematic diagram of a fifth structure of an electronic device 100 according to an embodiment of the present application. The antenna device of the electronic device 100 further includes a first non-near field communication chip 25 and a second non-near field communication chip 26. It will be appreciated that the first non-near field communication chip 25 and the second non-near field communication chip 26 may be integrated on the circuit board 30 of the electronic device 100.

In the description of the present application, it should be understood that terms such as "first," "second," and the like are used merely to distinguish between similar objects and should not be construed to indicate or imply relative importance or implying any particular order of magnitude of the technical features indicated.

The first non-near field communication chip 25 is configured to provide a first non-near field communication excitation signal. Wherein the first non-near field communication excitation signal is an unbalanced signal. The first non-near field communication excitation signal may include one of a cellular network signal, a Wi-Fi signal, a GPS signal, a BT signal. Accordingly, the first non-near field communication chip 25 may be a cellular communication chip for providing the cellular network signal; the first non-near field communication chip 25 may be a Wi-Fi chip for providing the Wi-Fi signal; the first non-near field communication chip 25 may be a GPS chip for providing the GPS signal; the first non-near field communication chip 25 may also be a BT chip for providing the BT signal.

The conductor structure 23 further comprises a third feed 233. The third feeding end 233 is spaced from the first feeding end 231 and the first grounding end 232. The third feeding terminal 233 is electrically connected to the first non-near field communication chip 25, and the first non-near field communication chip 25 is grounded. Thus, the first non-near field communication chip 25 may feed the first non-near field communication excitation signal to the conductor structure 23 via the third feeding terminal 233. Thus, the conductor structure 23 may also be used for transmitting the first non-near field communication excitation signal.

It will be appreciated that the conductor structure 23 may be used to transmit both the differential excitation current provided by the NFC chip 21 and the first non-near field communication excitation signal provided by the first non-near field communication chip 25, so that multiplexing of the conductor structure 23 may be achieved, the number of conductor structures used for transmitting wireless signals in the electronic device 100 may be reduced, and thus the internal space of the electronic device 100 may be saved.

The frequency of the NFC signal is typically 13.56MHz (megahertz), the frequency of the cellular network signal is typically 700MHz or more, the frequency of the Wi-Fi signal is typically 2.4GHz (gigahertz) or 5GHz, the frequency of the gps signal is typically 1.575GHz, 1.227GHz, 1.381GHz, 1.841GHz, and the frequency of the BT signal is typically 2.4GHz. Therefore, the NFC signal is a low frequency signal, and the cellular network signal, wi-Fi signal, GPS signal, and BT signal are all high frequency signals, relative to the cellular network signal, wi-Fi signal, GPS signal, and BT signal. Alternatively, it may be understood that the NFC signal is a low frequency signal, the first non-near field communication excitation signal is a high frequency signal, and the frequency of the NFC signal is smaller than the frequency of the first non-near field communication excitation signal.

In addition, when the radio signal is transmitted, the lower the frequency of the radio signal is, the longer the radiator length is required; while the higher the frequency of the wireless signal, the shorter the radiator length is required. That is, the length of the radiator required for transmitting the NFC signal is greater than the length of the radiator required for transmitting the first non-near field communication excitation signal.

Accordingly, in the conductor structure 23, the distance between the first feeding end 231 and the first ground end 232 is greater than the distance between the third feeding end 233 and the first ground end 232. Thus, the length of the radiator transmitting the NFC signal in the conductor structure 23 may be made larger than the length of the radiator transmitting the first non-near field communication excitation signal.

Further, in order to reduce the overall length of the conductor structure 23, it may be provided that the third feeding terminal 233 is located on the same side of the first ground terminal 232 as the first feeding terminal 231. That is, the third feeding terminal 233 is located between the first feeding terminal 231 and the first ground terminal 232. The third feeding end 233 and the first feeding end 231 may be disposed on the same side of the first ground end 232 as the third feeding end 233 and the first feeding end 231 are disposed on different sides of the first ground end 232, and a portion between the third feeding end 233 and the first ground end 232 may be multiplexed, so that the overall length of the conductor structure 23 may be reduced.

The second non-near field communication chip 26 is configured to provide a second non-near field communication excitation signal. Wherein the second non-near field communication excitation signal is an unbalanced signal. The second non-near field communication excitation signal may include one of a cellular network signal, a wireless fidelity signal (Wi-Fi signal), a global positioning system signal (GPS signal), a bluetooth signal (BT signal). Accordingly, the second non-near field communication chip 26 may be a cellular communication chip for providing the cellular network signal; the second non-near field communication chip 26 may be a Wi-Fi chip for providing the Wi-Fi signal; the second non-near field communication chip 26 may be a GPS chip for providing the GPS signal; the second non-near field communication chip 26 may also be a BT chip for providing the BT signal.

The second non-near field communication excitation signal and the first non-near field communication excitation signal may be signals of the same communication type or signals of different communication types. Accordingly, the second non-near field communication chip 26 and the first non-near field communication chip 25 may be the same type of chip or different types of chips.

The first plate 24 further includes a fourth feed end 243. The fourth feeding end 243 is spaced from the second feeding end 241 and the second grounding end 242. The fourth feeding terminal 243 is electrically connected to the second non-near-field communication chip 26, and the second non-near-field communication chip 26 is grounded. Thus, the second non-near field communication chip 26 may feed the second non-near field communication excitation signal to the first plate 24 through the fourth feeding terminal 243. Thus, the first plate 24 may also be used to transmit the second non-near field communication excitation signal.

It can be appreciated that the first polar plate 24 may be used to transmit the differential exciting current provided by the NFC chip 21 and the second non-near field communication exciting signal provided by the second non-near field communication chip 26, so that multiplexing of the first polar plate 24 may be achieved, the number of conductor structures used for transmitting wireless signals in the electronic device 100 may be further reduced, and thus the internal space of the electronic device 100 may be further saved.

Also, in the first electrode plate 24, the second feeding end 241 is spaced from the second ground end 242 by a distance greater than the fourth feeding end 243 is spaced from the second ground end 242. Thus, the length of the radiator transmitting the NFC signal in the first plate 24 may be made larger than the length of the radiator transmitting the second non-near field communication excitation signal.

In addition, in order to reduce the overall length of the first electrode plate 24, the fourth feeding end 243 may be disposed at the same side of the second ground end 242 as the second feeding end 241. That is, the fourth feeding terminal 243 is located between the second feeding terminal 241 and the second grounding terminal 242. The fourth feeding end 243 and the second feeding end 241 are located at the same side of the second grounding end 242 as compared to the fourth feeding end 243 and the second feeding end 241 are located at different sides of the second grounding end 242, and the portions between the fourth feeding end 243 and the second grounding end 242 can be multiplexed, so that the overall length of the first electrode plate 24 can be reduced.

Referring to fig. 7, fig. 7 is a schematic diagram of a sixth structure of an electronic device 100 according to an embodiment of the present application. The antenna device of the electronic device 100 further includes a first matching circuit 271, a second matching circuit 272, a third matching circuit 273, a first filtering circuit 281, a second filtering circuit 282, a third filtering circuit 283, and a fourth filtering circuit 284. It will be appreciated that the matching circuit may also be referred to as a matching network, tuning circuit, tuning network, etc. The filter circuit may also be referred to as a filter network.

The first matching circuit 271 is electrically connected to the first differential signal terminal 211 of the NFC chip 21, the second differential signal terminal 212 of the NFC chip 21, the first feeding terminal 231 of the conductor structure 23, and the second feeding terminal 241 of the first electrode plate 24. The first matching circuit 271 is configured to match an impedance of the conductive loop when the differential exciting current is transmitted.

The first matching circuit 271 includes a first input terminal 271a, a second input terminal 271b, a first output terminal 271c, and a second output terminal 271d. The first input terminal 271a is electrically connected to the first differential signal terminal 211 of the NFC chip 21, the second input terminal 271b is electrically connected to the second differential signal terminal 212 of the NFC chip 21, the first output terminal 271c is electrically connected to the first feeding terminal 231 of the conductor structure 23, and the second output terminal 271d is electrically connected to the second feeding terminal 241 of the first electrode plate 24.

The first filter circuit 281 is disposed between the first differential signal terminal 211 of the NFC chip 21 and the first input terminal 271a of the first matching circuit 271. The first filter circuit 281 is configured to filter a first interference signal between the first differential signal terminal 211 and the first input terminal 271 a. The first interference signal is an electrical signal other than the differential exciting current provided by the NFC chip 21.

The second filter circuit 282 is disposed between the second differential signal terminal 212 of the NFC chip 21 and the second input terminal 271b of the first matching circuit 271. The second filter circuit 282 is configured to filter a second interference signal between the second differential signal terminal 212 and the second input terminal 271 b. The second interference signal is an electrical signal other than the differential exciting current provided by the NFC chip 21.

The second matching circuit 272 is electrically connected to the first non-near field communication chip 25 and the third feeding end 233 of the conductor structure 23. The second matching circuit 272 is configured to match an impedance of the conductor structure 23 when transmitting the first non-near field communication excitation signal.

The third filter circuit 283 is arranged between the first non-near field communication chip 25 and the second matching circuit 272. The third filtering circuit 283 is configured to filter out a third interference signal between the first non-near field communication chip 25 and the second matching circuit 272. The third interference signal is an electrical signal other than the first non-near field communication excitation signal provided by the first non-near field communication chip 25.

The third matching circuit 273 is electrically connected to the second non-near field communication chip 26 and the fourth feeding terminal 243 of the first plate 24. The third matching circuit 273 is configured to match an impedance of the first plate 24 when the second non-near field communication excitation signal is transmitted.

The fourth filter circuit 284 is disposed between the second non-near field communication chip 26 and the third matching circuit 273. The fourth filter circuit 284 is configured to filter out a fourth interference signal between the second non-near field communication chip 26 and the third matching circuit 273. The fourth interference signal is an electrical signal other than the second non-near field communication excitation signal provided by the second non-near field communication chip 26.

It is understood that the first matching circuit 271, the second matching circuit 272, and the third matching circuit 273 may comprise circuits formed by any series connection or any parallel connection of capacitors and inductors. The first filter circuit 281, the second filter circuit 282, the third filter circuit 283, and the fourth filter circuit 284 may also include circuits composed of any series connection or any parallel connection of a capacitor and an inductor.

Referring to fig. 8, fig. 8 is a schematic view of a seventh structure of an electronic device 100 according to an embodiment of the present application.

The first matching circuit 271 may include, for example, four capacitors C1, C2, C3, C4. The capacitor C1 is connected in series with the first differential signal terminal 211 of the NFC chip 21, and the capacitor C2 is connected in series with the second differential signal terminal 212 of the NFC chip 21. The capacitor C3 is connected in series with the capacitor C4 and then connected in parallel with the NFC chip 21, and the capacitor C3 is grounded indirectly to the capacitor C4. It can be appreciated that the capacitance values of the capacitors C1, C2, C3, C4 can be set according to actual needs.

The first filter circuit 281 may include, for example, an inductance L1 and a capacitance C5. The inductance L1 is connected in series between the first differential signal terminal 211 and the first matching circuit 271, and the capacitor C5 is connected in parallel with the NFC chip 21 and grounded. It can be appreciated that the inductance value of the inductor L1 and the capacitance value of the capacitor C5 can be set according to actual needs.

The second filter circuit 282 may include, for example, an inductance L2 and a capacitance C6. The inductance L2 is connected in series between the second differential signal terminal 212 and the first matching circuit 271, and the capacitor C6 is connected in parallel with the NFC chip 21 and grounded. It can be appreciated that the inductance value of the inductor L2 and the capacitance value of the capacitor C6 can be set according to actual needs.

The second matching circuit 272 may include, for example, capacitors C7, C8. The capacitor C7 is connected in series between the third feeding end 233 of the conductor structure 23 and the first non-near-field communication chip 25, and the capacitor C8 is connected in parallel with the first non-near-field communication chip 25 and grounded. It can be appreciated that the capacitance values of the capacitors C7, C8 can be set according to actual needs.

The third filter circuit 283 may include, for example, an inductance L3 and a capacitance C9. The inductance L3 is connected in series between the first non-near-field communication chip 25 and the second matching circuit 272, and the capacitance C9 is connected in parallel with the first non-near-field communication chip 25 and grounded. It can be appreciated that the inductance value of the inductor L3 and the capacitance value of the capacitor C9 can be set according to actual needs.

The third matching circuit 273 may include, for example, capacitors C10, C11. The capacitor C10 is connected in series between the fourth feeding end 243 of the first polar plate 24 and the second non-near-field communication chip 26, and the capacitor C11 is connected in parallel with the second non-near-field communication chip 26 and grounded. It will be appreciated that the capacitance values of the capacitors C10, C11 may be set according to actual needs.

The fourth filter circuit 284 may include, for example, an inductance L4 and a capacitance C12. The inductance L4 is connected in series between the second non-near-field communication chip 26 and the third matching circuit 273, and the capacitor C12 is connected in parallel with the second non-near-field communication chip 26 and grounded. It can be appreciated that the inductance value of the inductor L4 and the capacitance value of the capacitor C12 can be set according to actual needs.

The electronic device provided by the embodiment of the application is described in detail above. Specific examples are set forth herein to illustrate the principles and embodiments of the present application, with the description of the examples given above only to assist in understanding the present application. Meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims

1. An electronic device, comprising:

the first non-near field communication chip is used for providing a first non-near field communication excitation signal;

the conductor structure comprises a first power supply end, a third power supply end and a first grounding end which are arranged at intervals, wherein the first power supply end is electrically connected with the first differential signal end, the third power supply end is electrically connected with the first non-near-field communication chip, and the first grounding end is electrically connected with the first grounding point;

the capacitive sensor is used for detecting the distance of an external conductor and comprises a first polar plate and a second polar plate, the second polar plate is arranged at intervals with the first polar plate, the first polar plate comprises a second feeding end and a second grounding end which are arranged at intervals, the second feeding end is electrically connected with the second differential signal end, the second grounding end is electrically connected with the second grounding point, the conductor structure comprises the second polar plate, and the first feeding end and the first grounding end are arranged on the second polar plate;

The conductor structure, the conductive path and the first polar plate together form a conductive loop for transmitting the differential excitation current, the conductive loop generates a first near field communication radiation field when transmitting the differential excitation current, the first polar plate generates a second near field communication radiation field, the second near field communication radiation field at least partially overlaps with the first near field communication radiation field, and the conductor structure is further used for transmitting the first non-near field communication excitation signal.

2. The electronic device of claim 1, wherein:

the differential excitation current comprises a first current and a second current, the phase of the first current is opposite to that of the second current, the first differential signal end is used for outputting the first current, and the second differential signal end is used for outputting the second current;

the electronic equipment further comprises a phase shifter, the first feed end is electrically connected with the first differential signal end through the phase shifter, and the phase shifter is used for adjusting the phase of the first current so that the adjusted phase of the first current is the same as the phase of the second current.

3. The electronic device of claim 1, further comprising a main circuit board, a secondary circuit board, and a flexible circuit board, wherein the main circuit board is electrically connected to the secondary circuit board through the flexible circuit board, a metal trace is disposed on the flexible circuit board, the conductor structure comprises the metal trace, and the first feeding end and the first grounding end are disposed on the metal trace.

4. The electronic device of claim 3, wherein the near field communication chip and the ground plane are both disposed on the main circuit board.

5. The electronic device of claim 1, wherein the ground plane generates a third near field communication radiation field that at least partially overlaps the first near field communication radiation field and the third near field communication radiation field at least partially overlaps the second near field communication radiation field.

6. The electronic device of any one of claims 1-5, wherein the third power supply terminal is on the same side of the first ground terminal as the first power supply terminal, and wherein a distance between the first power supply terminal and the first ground terminal is greater than a distance between the third power supply terminal and the first ground terminal.

7. The electronic device of any one of claims 1-5, further comprising:

the second non-near-field communication chip is used for providing a second non-near-field communication excitation signal;

the first polar plate further comprises a fourth feed end, the fourth feed end is electrically connected with the second non-near-field communication chip, and the first polar plate is further used for transmitting the second non-near-field communication excitation signal.

8. The electronic device of claim 7, wherein the fourth power supply terminal is on the same side of the second ground terminal as the second power supply terminal, the second power supply terminal being a greater distance from the second ground terminal than the fourth power supply terminal.

9. The electronic device of any one of claims 1-5, further comprising a first matching circuit electrically connected to the first differential signal terminal, the second differential signal terminal, the first feed terminal, the second feed terminal, the first matching circuit configured to match an impedance of the conductive loop when the differential excitation current is transmitted.

10. The electronic device of claim 9, wherein:

The first matching circuit comprises a first input end, a second input end, a first output end and a second output end;

the first input end is electrically connected with the first differential signal end, the second input end is electrically connected with the second differential signal end, the first output end is electrically connected with the first feed end, and the second output end is electrically connected with the second feed end.

11. The electronic device of claim 10, further comprising:

the first filter circuit is arranged between the first differential signal end and the first input end;

and the second filter circuit is arranged between the second differential signal end and the second input end.

12. The electronic device of any one of claims 1-5, further comprising a second matching circuit electrically connected to the first non-near field communication chip and the third feed, the second matching circuit configured to match an impedance of the conductor structure when the first non-near field communication excitation signal is transmitted.

13. The electronic device of claim 12, further comprising a third filter circuit disposed between the first non-near field communication chip and the second matching circuit.

14. The electronic device of claim 7, further comprising a third matching circuit electrically connected to the second non-near field communication chip and the fourth feed, the third matching circuit configured to match an impedance of the first plate when the second non-near field communication excitation signal is transmitted.

15. The electronic device of claim 14, further comprising a fourth filter circuit disposed between the second non-near field communication chip and the third matching circuit.