CN114595489B - Anti-disassembly method and device - Google Patents
Anti-disassembly method and device Download PDFInfo
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- CN114595489B CN114595489B CN202210148298.5A CN202210148298A CN114595489B CN 114595489 B CN114595489 B CN 114595489B CN 202210148298 A CN202210148298 A CN 202210148298A CN 114595489 B CN114595489 B CN 114595489B
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000012545 processing Methods 0.000 claims description 57
- 238000005259 measurement Methods 0.000 claims description 36
- 239000012634 fragment Substances 0.000 claims description 8
- 239000003973 paint Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 7
- 230000002265 prevention Effects 0.000 abstract 8
- 230000006870 function Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/71—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information
- G06F21/77—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information in smart cards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q30/00—Commerce
- G06Q30/018—Certifying business or products
- G06Q30/0185—Product, service or business identity fraud
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention provides a disassembly prevention method and a disassembly prevention device, because the resistance value of each disassembly prevention resistor of each product is random, each disassembly prevention resistor is unclonable, if the product is disassembled, the resistance value of the disassembly prevention resistor is changed, if a chip is peeled off from the product and is mounted on another product, the resistance value of the disassembly prevention resistor is also changed, therefore, whether the disassembly prevention resistor is changed or not can be determined by calculating the resistance value of the disassembly prevention resistor, and whether the product is disassembled or not can be determined, so that the anti-counterfeiting function is realized.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to an anti-disassembly method and device.
Background
In the information age, information security is one of the most important issues. Packaging the chip in a suitable housing or device is a necessary step in using the chip. However, in the anti-counterfeiting problem of the article, some illegal merchants can detach the anti-counterfeiting chip and install the anti-counterfeiting chip into other shells, so that the reinstalled anti-counterfeiting chip can also achieve the anti-counterfeiting purpose. Therefore, it is necessary to avoid the chip being applied to other devices after being removed, and how to provide an anti-removal solution is a problem to be solved.
Disclosure of Invention
The present invention aims to solve the above-mentioned problems.
The invention mainly aims to provide an anti-dismantling method;
another object of the present invention is to provide a tamper evident device.
In order to achieve the above purpose, the technical scheme of the invention is specifically realized as follows:
In one aspect, the present invention provides a tamper-proof method applied to a tamper-proof device, where the tamper-proof device includes: the device comprises a reference resistor, an anti-disassembly resistor, a measurement module, a processing module and a storage module; the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with a reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-disassembly resistor is printed on the printing piece according to a preset mode, the resistance value of the anti-disassembly resistor is a random resistance value, and the preset mode comprises but is not limited to: the anti-disassembly resistor is printed unevenly in coating, printed unevenly in thickness, printed unevenly in width, randomly punched and/or cut randomly, and the printed piece is made of fragile materials and broken to form random fragments; the method comprises the following steps: in a first state, the measuring module measures the voltage value of the first end of the anti-disassembly resistor to obtain a first measured voltage value, the first measured voltage value is sent to the processing module, the processing module calculates the resistance value of the anti-disassembly resistor according to the resistance value of the reference resistor and the first measured voltage value to obtain a first anti-disassembly resistance value, the first anti-disassembly resistance value is used as an initial resistance value to be written into the storage module for storage, and the storage module is set to be undeletable and/or rewritable; in a second state, the measurement module measures the voltage value of the first end of the anti-disassembly resistor to obtain a second measurement voltage value, the second measurement voltage value is sent to the processing module, the processing module calculates the resistance value of the anti-disassembly resistor according to the resistance value of the reference resistor and the second measurement voltage value to obtain a second anti-disassembly resistance value, whether the second anti-disassembly resistance value and the initial resistance value meet a preset rule or not is judged, if the second anti-disassembly resistance value and the initial resistance value meet the preset rule, first output information is output, and otherwise, second output information is output or preset operation is executed.
Wherein the tamper resistance is randomly punched and/or randomly trimmed comprising: and (3) punching the positions and/or the hole sizes of the anti-disassembly resistors randomly and/or cutting the shapes of the anti-disassembly resistors randomly.
The anti-disassembly resistor is a carbon film resistor, and the printing piece is a brittle paint film.
The reference resistor, the measuring module, the processing module and the storage module are arranged as a chip; or the measuring module, the processing module and the storage module are arranged as one chip.
Wherein the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field, which is obtained after the chip enters the preset field.
In another aspect, the invention provides a tamper evident device comprising: the device comprises a reference resistor, an anti-disassembly resistor, a measurement module, a processing module and a storage module; the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with a reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-disassembly resistor is printed on the printing piece according to a preset mode, the resistance value of the anti-disassembly resistor is a random resistance value, and the preset mode comprises but is not limited to: the anti-disassembly resistor is printed unevenly in coating, printed unevenly in thickness, printed unevenly in width, randomly punched and/or cut randomly, and the printed piece is made of fragile materials and broken to form random fragments; in a first state, the measurement module is configured to measure a voltage value of a first end of the tamper resistance to obtain a first measured voltage value, send the first measured voltage value to the processing module, and the processing module is configured to calculate a resistance value of the tamper resistance according to a resistance value of the reference resistance and the first measured voltage value to obtain a first tamper resistance, write the first tamper resistance as an initial resistance value into the storage module for storage, and set the storage module to be undeletable and/or rewritable; in a second state, the measurement module is further configured to measure a voltage value of the first end of the tamper resistance to obtain a second measured voltage value, send the second measured voltage value to the processing module, and calculate the resistance of the tamper resistance according to the resistance of the reference resistance and the second measured voltage value to obtain a second tamper resistance, and determine whether the second tamper resistance and the initial resistance meet a preset rule, if the second tamper resistance and the initial resistance meet the preset rule, output first output information, otherwise output second output information or perform a preset operation.
Wherein, the anti-disassembly resistor is randomly punched and/or randomly cut by the following modes: and (3) punching the positions and/or the hole sizes of the anti-disassembly resistors randomly and/or cutting the shapes of the anti-disassembly resistors randomly.
The anti-disassembly resistor is a carbon film resistor, and the printing piece is a brittle paint film.
The reference resistor, the measuring module, the processing module and the storage module are arranged as a chip; or the measuring module, the processing module and the storage module are arranged as one chip.
Wherein the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field, which is obtained after the chip enters the preset field.
According to the technical scheme provided by the invention, the anti-disassembly method and the anti-disassembly device are provided, as the resistance value of the anti-disassembly resistor of each product is random, each anti-disassembly resistor is not reproducible, if the product is disassembled, the resistance value of the anti-disassembly resistor can be changed, and if the chip is peeled off from the product and mounted on another product, the resistance value of the anti-disassembly resistor can be changed, so that whether the anti-disassembly resistor is changed can be determined by calculating the resistance value of the anti-disassembly resistor, and whether the product is disassembled or not can be determined, thereby realizing the anti-counterfeiting function.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a tamper-proof device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
Fig. 1 shows a schematic structural diagram of a tamper-proof device provided by an embodiment of the present invention, referring to fig. 1, the tamper-proof device provided by the embodiment of the present invention includes: the device comprises a reference resistor, an anti-disassembly resistor, a measurement module, a processing module and a storage module; the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with the reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-disassembly resistor is printed on the printing piece according to a preset mode, the resistance value of the anti-disassembly resistor is a random resistance value, and the preset mode comprises but is not limited to: the coating of the anti-disassembly resistor is printed unevenly, the thickness of the anti-disassembly resistor is printed unevenly, the width of the anti-disassembly resistor is printed unevenly, the anti-disassembly resistor is punched randomly and/or the anti-disassembly resistor is cut randomly, the printed piece is made of fragile materials, and random fragments are formed after the printed piece is broken.
Specifically, the reference resistance may be a resistance or an equivalent resistance of a circuit, which is not particularly limited in the present invention, as long as it can be determined that the resistance value of the reference resistance is a fixed value. The resistance value of the reference resistor is prestored in the storage module, so that the processing module can acquire the resistance value of the reference resistor from the storage module when calculating the resistance value of the anti-dismantling resistor.
The tamper resistance is one or more resistances, which is not particularly limited in the present invention, and is a printed resistance and is printed on the printing member. As an alternative implementation of the embodiment of the invention, the tamper resistance is a carbon film resistance. Through adopting the mode of carbon film resistance to realize preventing tearing open the function of resistance, can make preventing tearing open the resistance and be destroyed more easily, can't destroy the problem of preventing tearing open the resistance when avoiding tearing open.
The printing piece is made of fragile materials, and random fragments are formed after the printing piece is broken, so that when a product provided with the anti-dismantling device is dismantled, the anti-dismantling resistor is easy to destroy and is damaged randomly and is irrecoverable. Wherein the printing member is a brittle paint film. The anti-dismantling resistor is sealed through a paint film, so that the stability of the anti-dismantling resistor can be ensured. Meanwhile, after the printed piece is damaged, incomplete cuts can be formed, and after a paint film is broken, the anti-dismantling resistor can be pulled to act in the X/Y/Z directions, so that random fragments are formed by the anti-dismantling resistor; in addition, the printing member can also produce a plurality of sections of cuts after being broken. Of course, the printing member may be made of breakable paper, and it is within the scope of the present invention as long as the printing member has breakable property. As an alternative implementation of the embodiment of the invention, the product provided with the tamper-proof device may be a wine bottle cap or the like, and once the wine bottle cap is opened, the tamper-proof resistor is destroyed and is not recoverable.
Meanwhile, the resistance value of the anti-disassembly resistor is random, when the anti-disassembly resistor is generated, the coating of the anti-disassembly resistor is printed unevenly, the thickness of the anti-disassembly resistor is printed unevenly, the width of the anti-disassembly resistor is printed unevenly, the anti-disassembly resistor is punched randomly and/or the anti-disassembly resistor is cut randomly, so that the anti-disassembly resistor has randomness, when the anti-disassembly resistor is punched randomly and/or cut randomly, the randomness of the anti-disassembly resistor can be increased by means of laser random punching and the like, or the randomness of the anti-disassembly resistor can be increased by random scraping of the anti-disassembly resistor. Therefore, the resistance of the anti-disassembly resistor cannot be known in advance, and the resistance of the anti-disassembly resistor cannot be reduced due to the fact that the resistance of the anti-disassembly resistor is random. Wherein the tamper resistance is randomly punched and/or randomly trimmed comprising: and (3) punching the positions and/or the hole sizes of the anti-disassembly resistors randomly and/or cutting the shapes of the anti-disassembly resistors randomly. As long as the random processing of the preset mode is carried out on the anti-dismantling resistor at random, the random resistance can be obtained and cannot be restored. Of course, any method that obtains a random resistance value by performing a preset method on the tamper resistance should fall within the protection scope of the present invention. At this time, even if the measurement module, the processing module, and the memory module in the tamper apparatus are partially taken out and mounted on another product, the resistance value of the tamper resistance cannot be restored. Of course, as an alternative implementation of the embodiment of the present invention, the reference resistor, the measurement module, the processing module and the memory module are provided as one chip; or the measuring module, the processing module and the storage module are arranged as one chip. Specifically, the reference resistor may be disposed inside the chip, or may be disposed outside the chip, which is not particularly limited in the present invention, and any component having the function of the reference resistor should be within the scope of the present invention. Thus, even if the chip is detached and mounted on another product, the resistance value of the tamper resistance cannot be restored.
As an alternative implementation of the embodiment of the present invention, the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field obtained after the chip enters the preset field. The chip in the invention can be a non-connected chip, and when the chip enters a non-connected field, the electric energy is provided for the anti-dismantling device by using the field energy of the non-connected field, for example, the chip is an NFC chip, and the electric energy is provided for the anti-dismantling device by the NFC field energy. Of course, the power supply provided by the invention can also be a battery or an external power supply or a non-connected power supply module.
The following describes an anti-disassembly method provided by the embodiment of the present invention, which is applied to the anti-disassembly device, and the anti-disassembly method provided by the embodiment of the present invention includes:
S1, in a first state, a measuring module measures a voltage value of a first end of an anti-disassembly resistor to obtain a first measured voltage value, the first measured voltage value is sent to a processing module, the processing module calculates the resistance value of the anti-disassembly resistor according to the resistance value of a reference resistor and the first measured voltage value to obtain a first anti-disassembly resistance value, the first anti-disassembly resistance value is used as an initial resistance value to be written into a storage module for storage, and the storage module is set to be undeletable and/or rewritable;
Specifically, the first state may be a state before leaving the factory, or in a process of producing a product provided with the anti-disassembly device, in the first state, the storage module does not write anti-disassembly resistance information, only in the first state, the processing module stores the calculated first anti-disassembly resistance as an initial resistance, and once the initial resistance is stored, deletion and modification cannot be performed, so that the product is prevented from being disassembled or the chip is prevented from being disassembled and rewritten into the initial resistance to cause the chip to form the first state and lose the anti-disassembly function.
S2, in a second state, the measuring module measures the voltage value of the first end of the anti-disassembly resistor to obtain a second measured voltage value, the second measured voltage value is sent to the processing module, the processing module calculates the resistance value of the anti-disassembly resistor according to the resistance value of the reference resistor and the second measured voltage value to obtain a second anti-disassembly resistance value, whether the second anti-disassembly resistance value and the initial resistance value meet preset rules or not is judged, if the second anti-disassembly resistance value and the initial resistance value meet the preset rules, the first output information is output, and otherwise, the second output information is output or preset operation is executed.
Specifically, after leaving the factory, as long as the chip is electrified (for example, anti-counterfeiting identification is performed on the wine bottle cap), the processing module can calculate the resistance value of the anti-disassembly resistor again, compare the anti-disassembly resistance value with the initial resistance value, consider that the risk exists once the situation that the anti-disassembly resistance value does not accord with the preset rule occurs, and output second output information to prompt that the risk exists in the product, or execute preset operations such as chip self-destruction and the like; if the condition meeting the preset rule occurs, the product is considered to be free of risk, the first output information can be output to indicate that the product is free of risk, or verification information is output after preset anti-counterfeiting verification operation in the chip is executed.
Wherein, the preset rules can include, but are not limited to: the second anti-disassembly resistance value is the same as the initial resistance value, or the comparison of the second anti-disassembly resistance value and the initial resistance value accords with a preset error range, or the ratio of the second anti-disassembly resistance value to the resistance value of the reference resistor accords with a preset ratio, and the like. As long as the second tamper resistance value can be determined, the scheme which accords with the detachment change does not occur, and the method belongs to the protection scope of the invention.
Therefore, according to the anti-disassembly method provided by the embodiment of the invention, as the resistance value of the anti-disassembly resistor of each product is random, each anti-disassembly resistor is not reproducible, if the product is disassembled, the resistance value of the anti-disassembly resistor can be changed, and if the chip is peeled off from the product and mounted on another product, the resistance value of the anti-disassembly resistor can be changed, so that whether the anti-disassembly resistor is changed can be determined by calculating the resistance value of the anti-disassembly resistor, and whether the product is disassembled or not can be determined, thereby realizing the anti-counterfeiting function.
Hereinafter, a function of the tamper-proof device provided by the embodiment of the present invention will be briefly described, and the tamper-proof device includes: the device comprises a reference resistor, an anti-disassembly resistor, a measurement module, a processing module and a storage module; the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with the reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-disassembly resistor is printed on the printing piece according to a preset mode, the resistance value of the anti-disassembly resistor is a random resistance value, and the preset mode comprises but is not limited to: the coating of the anti-disassembly resistor is printed unevenly, the thickness of the anti-disassembly resistor is printed unevenly, the width of the anti-disassembly resistor is printed unevenly, the anti-disassembly resistor is punched randomly and/or the anti-disassembly resistor is cut randomly, the printed piece is made of fragile materials, and random fragments are formed after the printed piece is broken; in a first state, a measuring module is used for measuring the voltage value of the first end of the anti-disassembly resistor to obtain a first measured voltage value, the first measured voltage value is sent to a processing module, the processing module is used for calculating the resistance value of the anti-disassembly resistor according to the resistance value of the reference resistor and the first measured voltage value to obtain a first anti-disassembly resistance value, the first anti-disassembly resistance value is used as an initial resistance value to be written into a storage module for storage, and the storage module is set to be undeletable and/or rewritable; in the second state, the measurement module is further configured to measure a voltage value of the first end of the tamper resistance to obtain a second measured voltage value, send the second measured voltage value to the processing module, and the processing module is further configured to calculate a resistance value of the tamper resistance according to a resistance value of the reference resistance and the second measured voltage value to obtain a second tamper resistance, determine whether the second tamper resistance and the initial resistance meet a preset rule, and output the first output information if the second tamper resistance and the initial resistance meet the preset rule, or output the second output information or execute a preset operation if the second tamper resistance and the initial resistance meet the preset rule.
As an alternative implementation of the embodiment of the present invention, the tamper resistance is randomly punched and/or randomly cut by: and (3) punching the positions and/or the hole sizes of the anti-disassembly resistors randomly and/or cutting the shapes of the anti-disassembly resistors randomly.
As an alternative implementation of the embodiment of the invention, the anti-dismantling resistor is a carbon film resistor, and the printing piece is a brittle paint film.
As an alternative implementation of the embodiment of the present invention, the reference resistor, the measurement module, the processing module and the memory module are provided as one chip; or the measuring module, the processing module and the storage module are arranged as one chip.
As an alternative implementation of the embodiment of the present invention, the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field obtained after the chip enters the preset field.
Therefore, according to the anti-disassembly device provided by the embodiment of the invention, as the resistance value of the anti-disassembly resistor of each product is random, each anti-disassembly resistor is not reproducible, if the product is disassembled, the resistance value of the anti-disassembly resistor can be changed, and if the chip is peeled off from the product and mounted on another product, the resistance value of the anti-disassembly resistor can be changed, so that whether the anti-disassembly resistor is changed can be determined by calculating the resistance value of the anti-disassembly resistor, and whether the product is disassembled or not can be determined, thereby realizing the anti-counterfeiting function.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations may be made in the above embodiments by those skilled in the art without departing from the spirit and principles of the invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A tamper evident method for use in a tamper evident device, the tamper evident device comprising: the device comprises a reference resistor, an anti-disassembly resistor, a measurement module, a processing module and a storage module; the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with a reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-disassembly resistor is printed on the printing piece according to a preset mode, the resistance value of the anti-disassembly resistor is a random resistance value, and the preset mode comprises but is not limited to: the anti-disassembly resistor is printed unevenly in coating, printed unevenly in thickness, printed unevenly in width, randomly punched and/or cut randomly, and the printed piece is made of fragile materials and broken to form random fragments;
The method comprises the following steps:
In a first state, the measuring module measures the voltage value of the first end of the anti-disassembly resistor to obtain a first measured voltage value, the first measured voltage value is sent to the processing module, the processing module calculates the resistance value of the anti-disassembly resistor according to the resistance value of the reference resistor and the first measured voltage value to obtain a first anti-disassembly resistance value, the first anti-disassembly resistance value is used as an initial resistance value to be written into the storage module for storage, and the storage module is set to be undeletable and/or rewritable;
in a second state, the measurement module measures the voltage value of the first end of the anti-disassembly resistor to obtain a second measurement voltage value, the second measurement voltage value is sent to the processing module, the processing module calculates the resistance value of the anti-disassembly resistor according to the resistance value of the reference resistor and the second measurement voltage value to obtain a second anti-disassembly resistance value, whether the second anti-disassembly resistance value and the initial resistance value meet a preset rule or not is judged, if the second anti-disassembly resistance value and the initial resistance value meet the preset rule, first output information is output, and otherwise, second output information is output or preset operation is executed.
2. The method of claim 1, wherein the tamper resistance is randomly punched and/or randomly trimmed comprising:
And (3) punching the positions and/or the hole sizes of the anti-disassembly resistors randomly and/or cutting the shapes of the anti-disassembly resistors randomly.
3. The method of claim 1, wherein the tamper resistance is a carbon film resistance and the printing is a brittle paint film.
4. The method of claim 1, wherein the reference resistor, the measurement module, the processing module, and the memory module are provided as one chip; or the measuring module, the processing module and the storage module are arranged as one chip.
5. The method of claim 4, wherein the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field, which is obtained after the chip enters the preset field.
6. A tamper evident device comprising:
the device comprises a reference resistor, an anti-disassembly resistor, a measurement module, a processing module and a storage module; wherein,
The first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with a reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-disassembly resistor is printed on the printing piece according to a preset mode, the resistance value of the anti-disassembly resistor is a random resistance value, and the preset mode comprises but is not limited to: the anti-disassembly resistor is printed unevenly in coating, printed unevenly in thickness, printed unevenly in width, randomly punched and/or cut randomly, and the printed piece is made of fragile materials and broken to form random fragments;
In a first state, the measurement module is configured to measure a voltage value of a first end of the tamper resistance to obtain a first measured voltage value, send the first measured voltage value to the processing module, and the processing module is configured to calculate a resistance value of the tamper resistance according to a resistance value of the reference resistance and the first measured voltage value to obtain a first tamper resistance, write the first tamper resistance as an initial resistance value into the storage module for storage, and set the storage module to be undeletable and/or rewritable;
In a second state, the measurement module is further configured to measure a voltage value of the first end of the tamper resistance to obtain a second measured voltage value, send the second measured voltage value to the processing module, and calculate the resistance of the tamper resistance according to the resistance of the reference resistance and the second measured voltage value to obtain a second tamper resistance, and determine whether the second tamper resistance and the initial resistance meet a preset rule, if the second tamper resistance and the initial resistance meet the preset rule, output first output information, otherwise output second output information or perform a preset operation.
7. The device according to claim 6, characterized in that the tamper resistance is randomly punched and/or randomly tailored by:
And (3) punching the positions and/or the hole sizes of the anti-disassembly resistors randomly and/or cutting the shapes of the anti-disassembly resistors randomly.
8. The apparatus of claim 6, wherein the tamper resistance is a carbon film resistance and the printing is a brittle paint film.
9. The apparatus of claim 6, wherein the reference resistor, the measurement module, the processing module, and the memory module are provided as one chip; or the measuring module, the processing module and the storage module are arranged as one chip.
10. The apparatus of claim 9, wherein the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field, which is obtained after the chip enters the preset field.
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