CN114595489A - Anti-dismantling method and device - Google Patents
Anti-dismantling method and device Download PDFInfo
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- CN114595489A CN114595489A CN202210148298.5A CN202210148298A CN114595489A CN 114595489 A CN114595489 A CN 114595489A CN 202210148298 A CN202210148298 A CN 202210148298A CN 114595489 A CN114595489 A CN 114595489A
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000012545 processing Methods 0.000 claims description 58
- 238000005259 measurement Methods 0.000 claims description 19
- 238000004080 punching Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000003973 paint Substances 0.000 claims description 7
- 239000012634 fragment Substances 0.000 claims description 6
- 239000002966 varnish Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 abstract description 14
- 230000006870 function Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 238000007790 scraping Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/71—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information
- G06F21/77—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information in smart cards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q30/00—Commerce
- G06Q30/018—Certifying business or products
- G06Q30/0185—Product, service or business identity fraud
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention provides a disassembly prevention method and a disassembly prevention device, wherein the resistance value of the disassembly prevention resistor of each product is random, so that each disassembly prevention resistor is not reproducible, if the product is disassembled, the resistance value of the disassembly prevention resistor is changed, and if a chip is stripped from the product and installed on another product, the resistance value of the disassembly prevention resistor is also changed, so that whether the disassembly prevention resistor is changed or not can be determined by calculating the resistance value of the disassembly prevention resistor, and whether the product is disassembled or not can be determined, so that the anti-counterfeiting function is realized.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to an anti-dismantling method and an anti-dismantling device.
Background
In the information age, information security is one of the most important issues. Packaging the chip in a suitable housing or device is a necessary step in using the chip. However, some illegal merchants can remove the anti-counterfeiting chip and install the anti-counterfeiting chip into other shells in order to achieve the anti-counterfeiting purpose of the re-installed anti-counterfeiting chip. Therefore, it is necessary to avoid the application of the chip to other devices after the chip is removed, and how to arrange the anti-removal scheme becomes an urgent problem to be solved.
Disclosure of Invention
The present invention is directed to solving the above problems.
The invention mainly aims to provide a disassembly-preventing method;
another object of the present invention is to provide a tamper evident device.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the invention provides an anti-dismantling method which is applied to an anti-dismantling device on one hand, and the anti-dismantling device comprises: the device comprises a reference resistor, a disassembly-preventing resistor, a measuring module, a processing module and a storage module; the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with a reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-dismantling resistor is printed on the printing part according to a preset mode, the resistance value of the anti-dismantling resistor is a random resistance value, and the preset mode includes but is not limited to: the printing part is made of fragile materials and is broken into random fragments; the method comprises the following steps: in a first state, the measuring module measures a voltage value of a first end of the anti-tamper resistor to obtain a first measured voltage value, the first measured voltage value is sent to the processing module, the processing module calculates a resistance value of the anti-tamper resistor according to a resistance value of the reference resistor and the first measured voltage value to obtain a first anti-tamper resistance value, the first anti-tamper resistance value is written into the storage module as an initial resistance value to be stored, and the storage module is set to be undeletable and/or rewritable; in a second state, the measuring module measures a voltage value of the first end of the anti-tamper resistor to obtain a second measured voltage value, the second measured voltage value is sent to the processing module, the processing module calculates a resistance value of the anti-tamper resistor according to the resistance value of the reference resistor and the second measured voltage value to obtain a second anti-tamper resistance value, whether the second anti-tamper resistance value and the initial resistance value accord with a preset rule or not is judged, if the second anti-tamper resistance value and the initial resistance value accord with the preset rule, first output information is output, and if not, second output information is output or preset operation is executed.
Wherein the tamper resistance is randomly perforated and/or randomly tailored comprising: and randomly punching the position and/or the size of the hole of the anti-disassembly resistor and/or randomly cutting the shape of the anti-disassembly resistor.
Wherein, the anti-disassembly resistor is a carbon film resistor, and the printing part is a brittle paint film.
Wherein the reference resistor, the measurement module, the processing module and the storage module are arranged as one chip; or the measuring module, the processing module and the storage module are arranged as a chip.
Wherein the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field acquired after the chip enters the preset field.
In another aspect, the present invention provides a tamper device, including: the device comprises a reference resistor, a disassembly-preventing resistor, a measuring module, a processing module and a storage module; the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with a reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-dismantling resistor is printed on the printing part according to a preset mode, the resistance value of the anti-dismantling resistor is a random resistance value, and the preset mode includes but is not limited to: the printing part is made of fragile materials and is broken into random fragments; in a first state, the measuring module is used for measuring a voltage value of a first end of the tamper-proof resistor to obtain a first measured voltage value, and sending the first measured voltage value to the processing module, the processing module is used for calculating a resistance value of the tamper-proof resistor according to the resistance value of the reference resistor and the first measured voltage value to obtain a first tamper-proof resistance value, the first tamper-proof resistance value is written into the storage module as an initial resistance value to be stored, and the storage module is set to be undeletable and/or rewritable; in a second state, the measuring module is further configured to measure a voltage value of the first end of the tamper resistance to obtain a second measured voltage value, and send the second measured voltage value to the processing module, and the processing module is further configured to calculate a resistance value of the tamper resistance according to the resistance value of the reference resistor and the second measured voltage value to obtain a second tamper resistance value, determine whether the second tamper resistance value and the initial resistance value meet a preset rule, output first output information if the second tamper resistance value and the initial resistance value meet the preset rule, and otherwise output second output information or execute a preset operation.
Wherein, the tamper resistance is randomly punched and/or randomly cut by the following modes: and randomly punching the position and/or the size of the hole of the anti-disassembly resistor and/or randomly cutting the shape of the anti-disassembly resistor.
Wherein, the anti-disassembly resistor is a carbon film resistor, and the printing part is a brittle paint film.
Wherein the reference resistor, the measurement module, the processing module and the storage module are arranged as one chip; or the measuring module, the processing module and the storage module are arranged as a chip.
Wherein the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field acquired after the chip enters the preset field.
According to the technical scheme provided by the invention, the anti-disassembly method and the anti-disassembly device are provided, because the resistance value of the anti-disassembly resistor of each product is random, each anti-disassembly resistor is not reproducible, if the product is disassembled, the resistance value of the anti-disassembly resistor is changed, and if a chip is stripped from the product and installed on another product, the resistance value of the anti-disassembly resistor is also changed, so that whether the anti-disassembly resistor is changed or not can be determined in a mode of calculating the resistance value of the anti-disassembly resistor, and the anti-counterfeiting function is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a tamper evident device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a tamper-evident device according to an embodiment of the present invention, and referring to fig. 1, the tamper-evident device according to an embodiment of the present invention includes: the device comprises a reference resistor, a disassembly prevention resistor, a measuring module, a processing module and a storage module; the first end of the reference resistor is connected with the power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with the reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of reference resistance is preset fixed value, prevents tearing open the resistance and prints on printing member according to the preset mode, prevents that the resistance value of tearing open the resistance is random resistance value, and the preset mode includes but not limited to: the coating of preventing tearing open resistance is inhomogeneous the printing, the thickness of preventing tearing open resistance is inhomogeneous the printing, the width of preventing tearing open resistance is inhomogeneous the printing, prevent tearing open resistance and/or prevent tearing open resistance by random cutting, and the printing piece is fragile material, forms random piece after the breakage.
Specifically, the reference resistor may be a resistor or an equivalent resistor of the circuit, which is not particularly limited in the present invention as long as the resistance value of the reference resistor can be determined to be a fixed value. The resistance value of the reference resistor is pre-stored in the storage module, so that the processing module can obtain the resistance value of the reference resistor from the storage module when calculating the resistance value of the anti-disassembly resistor.
The tamper resistance is one or more resistors, which is not particularly limited in the present invention, and is a printed resistor, which is printed on the printed member. As an optional implementation manner of the embodiment of the present invention, the detachment prevention resistor is a carbon film resistor. The function of preventing tearing open the resistance is realized through the mode that adopts carbon film resistance, can be so that prevent tearing open the resistance and destroyed more easily, can't destroy the problem of preventing tearing open the resistance when avoiding demolising.
The printing piece is breakable material, forms random piece after the breakage to when demolising the product that sets up this anti-tear device, prevent that the resistance of tearing open destroys easily, and damage at random, can not recover. Wherein the printing member is a brittle paint film. The anti-disassembly resistor is sealed by the paint film, so that the stability of the anti-disassembly resistor can be ensured. Meanwhile, after the printing piece is damaged, an incomplete cut can be generated, the anti-dismantling resistor can be pulled after a paint film is broken, and the anti-dismantling resistor acts in the X \ Y \ Z three directions, so that random fragments are formed by the anti-dismantling resistor; in addition, the printing member can also be damaged and then be provided with a plurality of sections of cuts. Of course, the printing member may be a fragile paper, and the printing member should fall within the scope of the present invention as long as it has the fragile property. As an optional implementation manner of the embodiment of the invention, the product provided with the anti-dismantling device can be a wine bottle cap or the like, and once the wine bottle cap is opened, the anti-dismantling resistor is damaged and cannot be restored.
Meanwhile, the resistance value of the anti-disassembly resistor is random, when the anti-disassembly resistor is generated, the coating of the anti-disassembly resistor is printed unevenly, the thickness of the anti-disassembly resistor is printed unevenly, the width of the anti-disassembly resistor is printed unevenly, the anti-disassembly resistor is punched randomly and/or the anti-disassembly resistor is cut randomly, so that the anti-disassembly resistor has randomness, and when the anti-disassembly resistor is punched randomly and/or cut randomly, the randomness of the anti-disassembly resistor can be increased by means of random punching of laser and the like, or the randomness of the anti-disassembly resistor is increased by random scraping of the anti-disassembly resistor. Therefore, the resistance value of the anti-dismantling resistor cannot be known in advance, and the resistance value of the anti-dismantling resistor is random and cannot be restored. Wherein, the tamper resistance is randomly punched and/or randomly tailored to include: and randomly punching the position and/or the size of the hole of the anti-disassembly resistor and/or randomly cutting the shape of the anti-disassembly resistor. As long as the anti-dismantling resistor is randomly subjected to random treatment in a preset mode, random resistance values can be obtained and cannot be restored. Of course, any method that obtains a random resistance value by performing a predetermined treatment on the tamper resistance is within the scope of the present invention. At this time, even if the measurement module, the processing module, and the memory module in the detachment prevention device are partially removed and mounted on another product, the resistance value of the detachment prevention resistor cannot be restored. Of course, as an optional implementation manner of the embodiment of the present invention, the reference resistor, the measurement module, the processing module, and the storage module are configured as one chip; or the measuring module, the processing module and the storage module are arranged into a chip. Specifically, the reference resistor may be disposed inside the chip, or the reference resistor may be disposed outside the chip, which is not specifically limited in the present invention, as long as there is a functional component of the reference resistor, and the functional component is within the protection scope of the present invention. Therefore, even if the chip is removed and mounted on another product, the resistance of the removal prevention resistor cannot be restored.
As an optional implementation of the embodiment of the present invention, the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field acquired after the chip enters the preset field. The chip can be a non-connection chip, and when the chip enters a non-connection field, the field energy of the non-connection field is utilized to provide electric energy for the anti-dismounting device, for example, the chip is an NFC chip, and the electric energy is provided for the anti-dismounting device through the NFC field energy. Of course, the power supply provided by the invention can also provide power for a battery or an external power supply, or a non-power supply module.
Hereinafter, a tamper method according to an embodiment of the present invention will be described, where the tamper method is applied to the tamper device, and the tamper method according to an embodiment of the present invention includes:
s1, in the first state, the measuring module measures the voltage value of the first end of the anti-tamper resistor to obtain a first measured voltage value, the first measured voltage value is sent to the processing module, the processing module calculates the resistance value of the anti-tamper resistor according to the resistance value of the reference resistor and the first measured voltage value to obtain a first anti-tamper resistance value, the first anti-tamper resistance value is written into the storage module as an initial resistance value to be stored, and the storage module is set to be undeletable and/or rewritable;
specifically, this first state can be the state before dispatching from the factory, perhaps produces the product in-process that sets up this anti-disassembly device, and under this first state, the storage module does not write in anti-disassembly resistance information, and only under this state, processing module just can be with the first anti-disassembly resistance that obtains of calculation for initial resistance and save, this initial resistance once save, then can't delete and revise, avoids the product to be unpacked apart or the chip is dismantled the back and write in initial resistance again and make the chip form first state and lose and prevent tearing the function.
S2, in the second state, the measuring module measures the voltage value of the first end of the anti-tamper resistor to obtain a second measured voltage value, the second measured voltage value is sent to the processing module, the processing module calculates the resistance value of the anti-tamper resistor according to the resistance value of the reference resistor and the second measured voltage value to obtain a second anti-tamper resistance value, whether the second anti-tamper resistance value and the initial resistance value accord with a preset rule or not is judged, if the second anti-tamper resistance value and the initial resistance value accord with the preset rule, first output information is output, and if not, second output information is output or preset operation is executed.
Specifically, after leaving the factory, as long as the chip is powered on (for example, anti-counterfeiting recognition is performed on the wine bottle cap), the processing module calculates the resistance value of the anti-tamper resistor again, compares the anti-tamper resistance value with the initial resistance value, determines that a risk exists once a condition that the anti-tamper resistance value does not accord with a preset rule is generated, and outputs second output information to prompt that a product has a risk, or executes preset operation such as chip self-destruction and the like; if the condition that the product meets the preset rule is generated, the product is considered to have no risk, first output information can be output to indicate that the product has no risk, or verification information is output after the preset anti-counterfeiting verification operation in the chip is executed.
Wherein, the preset rules may include but are not limited to: the second anti-disassembly resistance value is the same as the initial resistance value, or the comparison between the second anti-disassembly resistance value and the initial resistance value accords with a preset error range, or the ratio between the second anti-disassembly resistance value and the resistance value of the reference resistor accords with a preset ratio, and the like. The protection scope of the present invention is intended to be covered as long as it can be determined that the second disassembly prevention resistance value does not have a scheme conforming to the disassembly change.
Therefore, by using the anti-disassembly method provided by the embodiment of the invention, the resistance value of the anti-disassembly resistor of each product is random, so that each anti-disassembly resistor is not reproducible, if the product is disassembled, the resistance value of the anti-disassembly resistor is changed, and if the chip is stripped from the product and installed on another product, the resistance value of the anti-disassembly resistor is also changed, therefore, whether the anti-disassembly resistor is changed or not can be determined by calculating the resistance value of the anti-disassembly resistor, so that whether the product is disassembled or not can be determined, and the anti-counterfeiting function can be realized.
Hereinafter, a function of a tamper-evident device according to an embodiment of the present invention will be briefly described, the tamper-evident device including: the device comprises a reference resistor, a disassembly-preventing resistor, a measuring module, a processing module and a storage module; the first end of the reference resistor is connected with the power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with the reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of reference resistance is preset fixed value, prevents tearing open the resistance and prints on printing member according to the preset mode, prevents that the resistance value of tearing open the resistance is random resistance value, and the preset mode includes but not limited to: the printing method comprises the following steps of (1) unevenly printing a coating of the anti-tamper resistor, unevenly printing the thickness of the anti-tamper resistor, unevenly printing the width of the anti-tamper resistor, randomly punching the anti-tamper resistor and/or randomly cutting the anti-tamper resistor, wherein a printing piece is made of fragile materials and is broken into random fragments; in a first state, the measuring module is used for measuring a voltage value of a first end of the anti-tamper resistor to obtain a first measured voltage value, the first measured voltage value is sent to the processing module, the processing module is used for calculating a resistance value of the anti-tamper resistor according to a resistance value of the reference resistor and the first measured voltage value to obtain a first anti-tamper resistance value, the first anti-tamper resistance value is written into the storage module as an initial resistance value to be stored, and the storage module is set to be undeletable and/or rewritable; in the second state, the measuring module is further used for measuring a voltage value of the first end of the anti-disassembly resistor to obtain a second measured voltage value, the second measured voltage value is sent to the processing module, the processing module is further used for calculating a resistance value of the anti-disassembly resistor according to the resistance value of the reference resistor and the second measured voltage value to obtain a second anti-disassembly resistance value, whether the second anti-disassembly resistance value and the initial resistance value accord with a preset rule or not is judged, if the second anti-disassembly resistance value and the initial resistance value accord with the preset rule, first output information is output, and if not, second output information is output or preset operation is executed.
As an optional implementation of the embodiment of the present invention, the tamper resistance is randomly punched and/or randomly trimmed by: and randomly punching the position and/or the size of the hole of the anti-disassembly resistor and/or randomly cutting the shape of the anti-disassembly resistor.
As an optional implementation manner of the embodiment of the invention, the anti-dismantling resistor is a carbon film resistor, and the printing part is a brittle paint film.
As an optional implementation manner of the embodiment of the present invention, the reference resistor, the measurement module, the processing module, and the storage module are configured as one chip; or the measuring module, the processing module and the storage module are arranged into a chip.
As an optional implementation of the embodiment of the present invention, the chip is a non-connected chip; the power supply is electric energy obtained by the field energy of the preset field acquired after the chip enters the preset field.
Therefore, with the anti-tamper device provided by the embodiment of the invention, the resistance value of the anti-tamper resistor of each product is random, so that each anti-tamper resistor is not reproducible, if the product is detached, the resistance value of the anti-tamper resistor is changed, and if a chip is peeled from the product and mounted on another product, the resistance value of the anti-tamper resistor is also changed, so that whether the anti-tamper resistor is changed or not can be determined by calculating the resistance value of the anti-tamper resistor, and thus whether the product is detached or not is determined, and the anti-tamper function is realized.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. An anti-disassembly method, characterized in that, applied to an anti-disassembly device, the anti-disassembly device comprises: the device comprises a reference resistor, a disassembly-preventing resistor, a measuring module, a processing module and a storage module; the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with a reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-dismantling resistor is printed on the printing part according to a preset mode, the resistance value of the anti-dismantling resistor is a random resistance value, and the preset mode includes but is not limited to: the printing part is made of fragile materials and is broken into random fragments;
the method comprises the following steps:
in a first state, the measuring module measures a voltage value of a first end of the anti-tamper resistor to obtain a first measured voltage value, the first measured voltage value is sent to the processing module, the processing module calculates a resistance value of the anti-tamper resistor according to a resistance value of the reference resistor and the first measured voltage value to obtain a first anti-tamper resistance value, the first anti-tamper resistance value is written into the storage module as an initial resistance value to be stored, and the storage module is set to be undeletable and/or rewritable;
in a second state, the measuring module measures a voltage value of the first end of the anti-tamper resistor to obtain a second measured voltage value, the second measured voltage value is sent to the processing module, the processing module calculates a resistance value of the anti-tamper resistor according to the resistance value of the reference resistor and the second measured voltage value to obtain a second anti-tamper resistance value, whether the second anti-tamper resistance value and the initial resistance value accord with a preset rule or not is judged, if the second anti-tamper resistance value and the initial resistance value accord with the preset rule, first output information is output, and if not, second output information is output or preset operation is executed.
2. The method of claim 1, wherein the tamper resistance being randomly perforated and/or randomly tailored comprises:
and randomly punching the position and/or the size of the hole of the anti-disassembly resistor and/or randomly cutting the shape of the anti-disassembly resistor.
3. The method of claim 1, wherein the tamper resistance is a carbon film resistor and the printed part is a brittle paint film.
4. The method of claim 1, wherein the reference resistance, the measurement module, the processing module, and the memory module are provided as one chip; or the measuring module, the processing module and the storage module are arranged as a chip.
5. The method of claim 4, wherein the chip is a non-bonded chip; the power supply is electric energy obtained by the field energy of the preset field acquired after the chip enters the preset field.
6. A tamper-evident device, comprising:
the device comprises a reference resistor, a disassembly-preventing resistor, a measuring module, a processing module and a storage module; wherein, the first and the second end of the pipe are connected with each other,
the first end of the reference resistor is connected with a power supply, the second end of the reference resistor is connected with the first end of the anti-disassembly resistor, the second end of the anti-disassembly resistor is connected with a reference ground, the first end of the measurement module is connected with the first end of the anti-disassembly resistor, the second end of the measurement module is connected with the first end of the processing module, and the second end of the processing module is connected with the storage module; the resistance value of the reference resistor is a preset fixed value, the anti-dismantling resistor is printed on the printing part according to a preset mode, the resistance value of the anti-dismantling resistor is a random resistance value, and the preset mode includes but is not limited to: the printing part is made of fragile materials and is broken into random fragments;
in a first state, the measuring module is used for measuring a voltage value of a first end of the tamper-proof resistor to obtain a first measured voltage value, and sending the first measured voltage value to the processing module, the processing module is used for calculating a resistance value of the tamper-proof resistor according to the resistance value of the reference resistor and the first measured voltage value to obtain a first tamper-proof resistance value, the first tamper-proof resistance value is written into the storage module as an initial resistance value to be stored, and the storage module is set to be undeletable and/or rewritable;
in a second state, the measuring module is further configured to measure a voltage value of the first end of the tamper resistance to obtain a second measured voltage value, and send the second measured voltage value to the processing module, and the processing module is further configured to calculate a resistance value of the tamper resistance according to the resistance value of the reference resistor and the second measured voltage value to obtain a second tamper resistance value, determine whether the second tamper resistance value and the initial resistance value meet a preset rule, output first output information if the second tamper resistance value and the initial resistance value meet the preset rule, and otherwise output second output information or execute a preset operation.
7. The device of claim 6, wherein the tamper-resistant resistor is randomly perforated and/or randomly tailored by:
and randomly punching the position and/or the size of the hole of the anti-disassembly resistor and/or randomly cutting the shape of the anti-disassembly resistor.
8. The apparatus of claim 6, wherein the tamper resistance is a carbon film resistor and the printing member is a brittle varnish film.
9. The apparatus of claim 6, wherein the reference resistance, the measurement module, the processing module, and the storage module are provided as one chip; or the measuring module, the processing module and the storage module are arranged as a chip.
10. The apparatus of claim 9, wherein the chip is a non-bonded chip; the power supply is electric energy obtained by the field energy of the preset field acquired after the chip enters the preset field.
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