CN114589427B - Method for obtaining laser processing parameters of unoriented silicon steel sheet - Google Patents
Method for obtaining laser processing parameters of unoriented silicon steel sheet Download PDFInfo
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- 238000012545 processing Methods 0.000 title claims abstract description 145
- 229910000976 Electrical steel Inorganic materials 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000003698 laser cutting Methods 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 13
- 238000013178 mathematical model Methods 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 230000001419 dependent effect Effects 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 238000007796 conventional method Methods 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 13
- 238000000137 annealing Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 238000004080 punching Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 230000004927 fusion Effects 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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Abstract
The application relates to the technical field of laser processing, and discloses a method for obtaining laser processing parameters of unoriented silicon steel sheets. The method comprises the following steps: acquiring a plurality of groups of laser processing parameters as candidate laser processing parameters; respectively processing unoriented silicon steel sheets with the same target mark according to the multiple groups of candidate laser processing parameters to obtain multiple corresponding magnetic property samples; detecting and calculating the corresponding specific total loss of the magnetic performance samples; and selecting target laser processing parameters from the plurality of groups of candidate laser processing parameters according to the total specific loss corresponding to the magnetic performance samples, wherein the target laser processing parameters are used for processing the unoriented silicon steel sheets with the target brands in batches. The non-oriented silicon steel sheet is processed by a laser processing technology by acquiring qualified laser processing parameters of the non-oriented silicon steel sheet, so that a traditional matched annealing device is saved to eliminate processing stress, and the processing of the medium-low grade non-oriented silicon steel sheet for the small micro-motor iron core is faster and more efficient.
Description
Technical Field
The application relates to the technical field of laser processing, in particular to a method for acquiring laser processing parameters of unoriented silicon steel sheets.
Background
Cold rolled non-oriented silicon steel is a raw material for manufacturing various motor iron cores because of excellent magnetic performance, and in order to obtain iron cores with certain sizes and shapes, a manufacturer usually needs to punch and shear and stack the whole roll of silicon steel sheets. In the production process of the motor iron core, firstly, the original coil stock of silicon steel is required to be cut into corresponding widths according to requirements, and then blanking and overlapping riveting are carried out. The specific production process of the iron core comprises the following steps:
1) Large-scale motor core: cutting parent rolls, blanking, deburring, cleaning, painting, stacking, electrical property detection, winding and assembly.
2) Miniature motor core: mother coil slitting, lamination punching, annealing, electrical property detection, winding and assembly.
The cold-rolled non-oriented silicon steel can cause various blanking defects of parts due to unreasonable selection of a stamping process in the blanking process, and the performance of a motor iron core is influenced. For example, residual stress can be introduced at the edge of the silicon steel sheet during blanking, so that the magnetic performance of the silicon steel sheet is deteriorated, and the motor efficiency is reduced; the blanking burrs can cause local eddy current of the lamination, and influence the magnetic conductivity of the iron core; the ovality of the part after punching the silicon steel sheet can increase the noise of the motor under high-speed rotation, and the service life of the motor is reduced.
The magnetic conductivity of the unoriented silicon steel stamping sheet has sensitivity to the residual stress of stamping and shearing, so that the magnetic conductivity of the silicon steel after stamping is reduced and the loss is increased. In addition, the abrasion state of the blanking die has an influence on the magnetic performance of the non-oriented silicon steel blanking piece, and the more serious the die abrasion is, the larger the influence on the magnetic performance of the blanking piece is.
Therefore, in order to prevent the magnetic property deterioration caused by punching shear stress and to eliminate the processing stress by matching with an annealing device, the processing mode of punching shear needs to be innovated, which becomes the core of the technology.
Disclosure of Invention
The application aims to provide a method for acquiring laser processing parameters of a non-oriented silicon steel sheet, which solves the problems of magnetic property deterioration caused by punching shear stress and the condition of needing a matched annealing device to eliminate processing stress by acquiring the laser processing parameters.
Other features and advantages of the application will be apparent from the following detailed description, or may be learned by the practice of the application.
According to an aspect of the embodiment of the present application, there is provided a method for obtaining laser processing parameters of a non-oriented silicon steel sheet, the method comprising: acquiring a plurality of groups of laser processing parameters as candidate laser processing parameters; respectively processing unoriented silicon steel sheets with the same target mark according to the multiple groups of candidate laser processing parameters to obtain multiple corresponding magnetic property samples; detecting and calculating the corresponding specific total loss of the magnetic performance samples; and selecting target laser processing parameters from the plurality of groups of candidate laser processing parameters according to the total specific loss corresponding to the magnetic performance samples, wherein the target laser processing parameters are used for processing the unoriented silicon steel sheets with the target brands in batches.
According to some embodiments of the invention, the laser processing parameters include laser average power, laser focal radius, laser focal defocus, laser cutting speed, laser processing assist gas, and processing ambient pressure.
According to some embodiments of the invention, the method of selecting a target laser machining parameter from the plurality of sets of candidate laser machining parameters comprises: and acquiring a qualified ratio total loss preset threshold, screening out the ratio total loss in the preset threshold from the plurality of groups of ratio total loss according to the preset threshold, and acquiring a target laser processing parameter corresponding to the ratio total loss in the preset threshold.
According to some embodiments of the present invention, a plurality of specific total losses after processing a plurality of unoriented silicon steel sheets of the same grade corresponding to at least 11 sets of laser processing parameters are obtained, and a target laser processing parameter threshold interval is calculated according to the plurality of specific total losses within the preset threshold.
According to some embodiments of the invention, the target laser processing parameter threshold interval comprises: the average power of the laser is 800W to 3000W, the radius of the laser focus is 1 mu m to 3 mu m, the defocus amount of the laser focus is 0 to 1mm, the laser cutting speed is 10m/min to 40m/min, the auxiliary gas for laser processing is nitrogen, and the pressure of the processing environment is 1MPa to 3MPa.
According to some embodiments of the present invention, a minimum value of the specific total loss within the preset threshold is selected as a preferred value, and a target laser processing parameter corresponding to the preferred value is used for batch processing of the unoriented silicon steel sheets of the target grade.
According to some embodiments of the invention, the preset threshold value is a specific total loss value of the unoriented silicon steel sheet processed by a traditional method.
According to some embodiments of the present invention, a relative deviation Δps between the total specific loss corresponding to the laser processing parameter and the preset threshold is calculated, the relative deviation Δps is taken as a dependent variable, the corresponding laser processing parameter is taken as an independent variable, a mathematical model is built through a least square method, and if the mathematical model R 2 is lower than 0.8, the mathematical model is re-modeled.
According to some embodiments of the invention, the mathematical model of the relative deviation Δps of the laser processing parameters from the total loss satisfies:
Wherein: a 1、a2、b1、b2、c1、c2、c3, d and e are correlation coefficients; c is a constant term; y 1 is the average laser power; y 2 is the laser cutting speed; y 3 is the defocus amount of the laser focus; y 4 is the process ambient pressure; y 5 is the laser focal radius.
According to some embodiments of the invention, the laser processing employs a fiber laser.
Compared with the prior art, the technical scheme of the application has the remarkable beneficial effects that: the application aims to develop a processing technology suitable for low-medium grade non-oriented silicon steel sheets for small micro-motor iron cores, which can effectively inhibit the problem of deterioration of specific total loss caused by the processing process, and does not need a matched annealing device to eliminate processing stress, so that the processing of the low-medium grade non-oriented silicon steel sheets for small micro-motor iron cores is faster and more efficient.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.
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The above and other features and advantages of the present application will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
FIG. 1 shows a block flow diagram of a method according to one embodiment of the application;
Figure 2 shows a table of optimal laser processing parameters according to one embodiment of the application.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the application may be practiced without one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the application.
The block diagrams depicted in the figures are merely functional entities and do not necessarily correspond to physically separate entities. That is, the functional entities may be implemented in software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor devices and/or microcontroller devices.
The flow diagrams depicted in the figures are exemplary only, and do not necessarily include all of the elements and operations/steps, nor must they be performed in the order described. For example, some operations/steps may be decomposed, and some operations/steps may be combined or partially combined, so that the order of actual execution may be changed according to actual situations.
According to some embodiments of the present invention, a method for obtaining laser processing parameters of unoriented silicon steel sheet comprises: step 110: acquiring a plurality of groups of laser processing parameters as candidate laser processing parameters;
Step 120: respectively processing unoriented silicon steel sheets with the same target mark according to the multiple groups of candidate laser processing parameters to obtain multiple corresponding magnetic property samples;
step 130: detecting and calculating the corresponding specific total loss of the magnetic performance samples;
step 140: and selecting target laser processing parameters from the plurality of groups of candidate laser processing parameters according to the total specific loss corresponding to the magnetic performance samples, wherein the target laser processing parameters are used for processing the unoriented silicon steel sheets with the target brands in batches.
Based on the embodiment, the application adopts the laser processing technology to replace the traditional stamping or punching shear and stress relief annealing technology to process the medium-low grade unoriented silicon steel sheet for the small micro-motor iron core. The method comprises the steps of selecting a plurality of unoriented silicon steel sheets with the same brand, preparing a plurality of groups of laser processing parameters, processing one or more unoriented silicon steel sheets according to each group of laser processing parameters, and obtaining one or more magnetic property samples corresponding to each group of laser processing parameters. And detecting and calculating corresponding specific total loss of one or more magnetic property samples corresponding to each group of laser processing parameters, selecting a plurality of groups of laser processing parameters which are qualified in the specific total loss as target laser processing parameters, recording the target laser processing parameters, and processing non-oriented silicon steel sheets in batches by using the target laser processing parameters on a production line to obtain the small micro-motor iron core. The processing technology can effectively suppress the problem of deterioration of specific total loss caused by the processing process, and the traditional matched annealing device is not needed to eliminate the processing stress, so that the processing of the medium-low grade unoriented silicon steel sheet for the small micro-motor iron core is faster and more efficient.
According to some embodiments, the laser processing parameters include laser average power, laser focus radius, laser focus defocus, laser cutting speed, laser processing assist gas, and processing ambient pressure.
Based on the above embodiments, by adjusting the laser average power, the laser focal radius, the laser focal defocus amount, the laser cutting speed, the laser processing assist gas, and the processing ambient pressure to appropriate parameters, and then performing laser processing on the unoriented silicon steel sheet, a small micro-motor core that is more qualified than the total loss can be obtained.
According to some embodiments, the method of selecting the target laser processing parameter from the plurality of sets of candidate laser processing parameters in step 140 comprises: and acquiring a qualified ratio total loss preset threshold, screening out the ratio total loss in the preset threshold from the plurality of groups of ratio total loss according to the preset threshold, and acquiring a target laser processing parameter corresponding to the ratio total loss in the preset threshold.
Based on the above embodiment, the ratio total loss preset threshold value corresponding to the unoriented silicon steel sheets of different grades is different, the medium and low grade unoriented silicon steel sheets for the small micro-motor iron core mainly refer to unoriented silicon steel (strip) with the mass fraction of Si element of 2.0% or below, and the common representative grades mainly include: 50W470, 50W600, 50W800, 50W1000, 50W1300, 65W530, 65W600, 65W800, etc. and other grades of unoriented silicon steel sheets of comparable grades are suitable. When a brand of unoriented silicon steel sheet is selected, one or more unoriented silicon steel sheets are processed according to each set of laser processing parameters by preparing a plurality of sets of laser processing parameters, and one or more magnetic property samples corresponding to each set of laser processing parameters are obtained. And detecting and calculating corresponding specific total loss of one or more magnetic property samples corresponding to each group of laser processing parameters, and selecting a plurality of groups of laser processing parameters, wherein the specific total loss is all within a preset threshold value, as target laser processing parameters.
According to some embodiments, a plurality of specific total losses after processing a plurality of unoriented silicon steel sheets corresponding to the same grade by at least 11 sets of laser processing parameters are obtained, and a target laser processing parameter threshold interval is calculated according to the plurality of specific total losses within the preset threshold.
Based on the above embodiments, the parameter boundaries are determined by minimum laser average power, fastest laser cutting speed, maximum laser focus defocus amount, and minimum laser processing assist gas pressure, with at least 11 parameter combinations. In some embodiments, the same brand of unoriented silicon steel sheet target laser processing parameter threshold interval has: the average power of the laser is 800W to 3000W, the radius of the laser focus is 1 mu m to 3 mu m, the defocus amount of the laser focus is 0 to 1mm, the laser cutting speed is 10m/min to 40m/min, the auxiliary gas for laser processing is nitrogen, and the pressure of the processing environment is 1MPa to 3MPa.
According to some embodiments, a minimum value of the specific total loss in the preset threshold is selected as a preferred value, and a target laser processing parameter corresponding to the preferred value is used for batch processing of the unoriented silicon steel sheets of the target grade.
Based on the embodiment, the unoriented silicon steel sheet is processed through a plurality of groups of laser processing parameters, wherein the target laser processing parameters with the total loss within a preset threshold value are more than one group, and the target laser processing parameter with the minimum total loss is selected as a recommended value, so that the unoriented silicon steel sheet is processed in batches by a production line, and the quality of laser processing is improved.
According to some embodiments, the preset threshold value is a specific total loss value of the unoriented silicon steel sheet processed by a traditional method.
Based on the above embodiment, magnetic property samples of the conventional method and the laser processing method are compared, and magnetic property detection is performed under the same measurement condition and equipment respectively; and respectively calculating the relative deviation of the specific total loss of the sample under different laser processing parameters relative to the traditional method by taking the specific total loss result of the processed sample by the traditional method as a reference, and selecting the laser processing parameter with the relative deviation deltaPs less than or equal to 0% as the target laser processing parameter.
According to some embodiments, calculating a relative deviation Δps of the total specific loss corresponding to the laser processing parameter and the preset threshold, taking the relative deviation Δps as a dependent variable, taking the corresponding laser processing parameter as an independent variable, and establishing a mathematical model by a least square method, wherein if the mathematical model R 2 is lower than 0.8, other potential independent variables which may be ignored are to be modeled again and considered.
Further, the mathematical model of the relative deviation Δps of the laser processing parameters from the specific total loss satisfies:
Wherein: a 1、a2、b1、b2、c1、c2、c3, d and e are correlation coefficients; c is a constant term; y 1 is the average laser power; y 2 is the laser cutting speed; y 3 is the defocus amount of the laser focus; y 4 is the process ambient pressure; y 5 is the laser focal radius. Setting the relative deviation DeltaPs of the dependent variable ratio total loss result to be less than or equal to 0 percent, and solving an optimal solution for a logarithmic model to obtain the optimal independent variable level combination.
In some embodiments, the optimal laser processing parameters corresponding to different non-oriented silicon steel grades are recommended as shown in fig. 2:
The grade of the brand is 50W1300 or equivalent grade, the density of unoriented silicon steel sheets is 7.85, the average power of laser is 1700W, the laser cutting speed is 30M/Min, the defocusing amount of a laser focus is 0, the pressure of a processing environment is 2MPa, and the radius of the laser focus is 1 mu M; and the density, the average laser power, the laser cutting speed, the laser focus defocus amount, the processing environment pressure and the laser focus radius of the unoriented silicon steel sheet of 50W800 or equivalent grade are respectively as follows: 7.8, 1500W, 40M/Min, 0, 2MPa, 1 μm; and the density, the average laser power, the laser cutting speed, the laser focus defocus amount, the processing environment pressure and the laser focus radius of the unoriented silicon steel sheet of 50W600 or equivalent grade are respectively as follows: 7.75, 1000W, 30M/Min, 1mm, 2MPa, 1 μm; and the density, the average laser power, the laser cutting speed, the laser focus defocus amount, the processing environment pressure and the laser focus radius of the unoriented silicon steel sheet of 65W600 or equivalent grade are respectively: 7.75, 2000W, 40M/Min, 1mm, 2MPa, 1 μm; and the density, the average laser power, the laser cutting speed, the laser focus defocus amount, the processing environment pressure and the laser focus radius of the 50W470 or equivalent grade unoriented silicon steel sheet are respectively as follows: 7.7, 1000W, 20M/Min, 0, 2MPa, 1 μm.
According to some embodiments, the laser processing employs a fiber laser.
Based on the above embodiments, the fiber laser has the following advantages:
(1) The quality of the light beam is good.
The waveguide structure of the optical fiber determines that the optical fiber laser is easy to obtain single transverse mode output, is little influenced by external factors, and can realize high-brightness laser output.
(2) High efficiency.
The fiber laser can realize high light-light conversion efficiency by selecting the semiconductor laser with the emission wavelength matched with the absorption characteristic of the doped rare earth element as a pumping source. For ytterbium-doped high-power fiber lasers, 915 nm or 975 nm semiconductor lasers are generally selected, so that the fluorescence lifetime is long, and energy can be effectively stored to realize high-power operation. The total electro-optic efficiency of the commercial fiber laser is up to 25%, which is beneficial to reducing the cost, saving energy and protecting environment.
(3) The heat dissipation characteristic is good.
The fiber laser adopts slender rare earth element doped fiber as a laser gain medium, and the surface area and volume ratio of the fiber laser are very large. About 1000 times that of a solid block laser, and has natural advantages in terms of heat dissipation capability. The special cooling of the optical fiber is not needed under the condition of medium and low power, and the water cooling heat dissipation is adopted under the condition of high power, so that the common light beam quality degradation and efficiency degradation caused by the thermal effect in the solid laser can be effectively avoided.
(4) Compact structure and high reliability.
Because the optical fiber laser adopts tiny and soft optical fibers as the laser gain medium, the optical fiber laser is beneficial to volume compression and cost saving. The pump source is also a semiconductor laser which is small in size and easy to modularize, commercial products can generally output with tail fibers, and all-fiber devices such as fiber Bragg gratings can be realized by combining the devices through fusion, so that the pump source has high immunity to environmental disturbance, high stability and maintenance time and cost saving.
Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains.
It is to be understood that the application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (7)
1. A method of obtaining laser processing parameters of a non-oriented silicon steel sheet, the method comprising:
acquiring a plurality of groups of laser processing parameters as candidate laser processing parameters;
Respectively processing unoriented silicon steel sheets with the same target mark according to the multiple groups of candidate laser processing parameters to obtain multiple corresponding magnetic property samples;
detecting and calculating the corresponding specific total loss of the magnetic performance samples;
Selecting target laser processing parameters from the plurality of groups of candidate laser processing parameters according to the total specific loss corresponding to the magnetic performance samples, wherein the target laser processing parameters are used for processing the unoriented silicon steel sheets with the target brands in batches;
The method for selecting the target laser processing parameters in the plurality of groups of candidate laser processing parameters comprises the following steps: acquiring a qualified ratio total loss preset threshold, screening out the ratio total loss in the preset threshold according to the preset threshold from the plurality of groups of ratio total loss, and acquiring a target laser processing parameter corresponding to the ratio total loss in the preset threshold;
Calculating the relative deviation delta Ps of the total specific loss corresponding to the laser processing parameters and the preset threshold, taking the relative deviation delta Ps as a dependent variable, taking the corresponding laser processing parameters as independent variables, establishing a mathematical model through a least square method, and re-modeling if the mathematical model R 2 is lower than 0.8;
the mathematical model of the relative deviation Δps of the laser processing parameters from the total loss satisfies:
Wherein: a 1、a2、b1、b2、c1、c2、c3, d, e and f are correlation coefficients; c is a constant term; y 1 is the average laser power; y 2 is the laser cutting speed; y 3 is the defocus amount of the laser focus; y 4 is the process ambient pressure; y 5 is the laser focal radius.
2. The method of claim 1, wherein the laser processing parameters include laser average power, laser focal radius, laser focal defocus, laser cutting speed, laser processing assist gas, and processing ambient pressure.
3. The method according to claim 1, wherein a plurality of specific total losses after processing a corresponding plurality of non-oriented silicon steel sheets of the same grade by at least 11 sets of laser processing parameters are obtained, and a target laser processing parameter threshold interval is calculated according to the plurality of specific total losses within the preset threshold.
4. The method of claim 3, wherein the target laser processing parameter threshold interval comprises: the average power of the laser is 800W to 3000W, the radius of the laser focus is 1 mu m to 3 mu m, the defocus amount of the laser focus is 0to 1mm, the laser cutting speed is 10m/min to 40m/min, the auxiliary gas for laser processing is nitrogen, and the pressure of the processing environment is 1MPa to 3MPa.
5. The method according to any one of claims 3 to 4, wherein a minimum value of the specific total loss within the preset threshold is selected as a preferred value, and a target laser processing parameter corresponding to the preferred value is used for batch processing of the non-oriented silicon steel sheet of the target grade.
6. The method according to claim 1, wherein the preset threshold value is a specific total loss value of the unoriented silicon steel sheet processed by a conventional method.
7. The method of claim 1, wherein the laser processing employs a fiber laser.
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| CN101722371A (en) * | 2009-12-10 | 2010-06-09 | 江苏大学 | Laser welding weld joint/ heat affected zone shape and crystalline grain size prediction method |
| EP3671373A1 (en) * | 2018-12-19 | 2020-06-24 | Bystronic Laser AG | Forecasting method for predicting the machining result for a laser machining method |
| CN111366702A (en) * | 2020-03-24 | 2020-07-03 | 包头钢铁（集团）有限责任公司 | Online intelligent accurate slitting system and online intelligent accurate slitting method for non-oriented silicon steel |
| CN113203641A (en) * | 2021-03-25 | 2021-08-03 | 武汉钢铁有限公司 | Processing parameter determination method, sample processing method, device and equipment |
| CN113902269A (en) * | 2021-09-24 | 2022-01-07 | 北京航空航天大学 | Laser processing parameter determination method and device, electronic equipment and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101722371A (en) * | 2009-12-10 | 2010-06-09 | 江苏大学 | Laser welding weld joint/ heat affected zone shape and crystalline grain size prediction method |
| EP3671373A1 (en) * | 2018-12-19 | 2020-06-24 | Bystronic Laser AG | Forecasting method for predicting the machining result for a laser machining method |
| CN111366702A (en) * | 2020-03-24 | 2020-07-03 | 包头钢铁（集团）有限责任公司 | Online intelligent accurate slitting system and online intelligent accurate slitting method for non-oriented silicon steel |
| CN113203641A (en) * | 2021-03-25 | 2021-08-03 | 武汉钢铁有限公司 | Processing parameter determination method, sample processing method, device and equipment |
| CN113902269A (en) * | 2021-09-24 | 2022-01-07 | 北京航空航天大学 | Laser processing parameter determination method and device, electronic equipment and storage medium |
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