CN114584695B - Modularized matrix camera - Google Patents
Modularized matrix camera Download PDFInfo
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- CN114584695B CN114584695B CN202210252011.3A CN202210252011A CN114584695B CN 114584695 B CN114584695 B CN 114584695B CN 202210252011 A CN202210252011 A CN 202210252011A CN 114584695 B CN114584695 B CN 114584695B
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- 239000011159 matrix material Substances 0.000 title claims abstract description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 48
- 238000012545 processing Methods 0.000 claims abstract description 36
- 238000004891 communication Methods 0.000 claims abstract description 23
- 238000012805 post-processing Methods 0.000 claims abstract description 19
- 210000001503 joint Anatomy 0.000 claims abstract description 3
- 238000002791 soaking Methods 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 17
- 238000013461 design Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000012782 phase change material Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/65—Control of camera operation in relation to power supply
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
Abstract
The application discloses a modularized matrix camera, which comprises a plurality of basic optical units and a power supply communication guarantee unit, wherein the basic optical units comprise a plurality of lenses, image sensors, a signal processing circuit and a first interface module, the lenses are arranged in a row on a first plane, the image sensors receive the light rays of the lenses to form original image data and transmit the original image data to the signal processing circuit for processing, the first interface module comprises a power supply interface and an Ethernet interface, the signal processing circuit transmits the processed image data to the power supply communication guarantee unit through the Ethernet interface, the power supply communication guarantee unit comprises a power supply module, a network exchange module, a post-processing algorithm module and a plurality of second interface modules, the first interface module and the second interface module are in butt joint to enable the basic optical units to be orderly arranged along the second plane, the power supply module supplies power for all the modules, and the network exchange module is connected with the Ethernet interface and the post-processing algorithm module. The application is easy to expand and maintain and is beneficial to heat dissipation.
Description
Technical Field
The present application relates to a camera, and more particularly, to a modular matrix camera.
Background
Compared with the traditional dome camera and gun camera, the matrix camera has a larger visual field, and a plurality of lenses can be transversely arranged to enlarge a horizontal visual field angle and longitudinally arranged to enlarge a vertical visual field angle, so that the aim of simultaneously observing a large range of targets is fulfilled. As the requirements for the observation distance and the resolution of the observation target are improved, the resolution of 4k and above is generally adopted. Therefore, the high data volume generated by multi-lens imaging is one of the characteristics of high-definition matrix cameras.
Generally, a high-definition matrix camera adopts an integrated design, the extension lines of optical axes of all lenses are converged at the center point of a reference sphere, and the lenses are uniformly distributed on the sphere of the reference sphere. Imaging data of the plurality of cameras are connected to the signal processing board through the differential cable to perform image preprocessing work. This structure has the following problems:
(1) In the integrated structural design, the board card generates a large amount of heat due to processing of a large data volume video stream. The heat distribution calculation in the equipment has deviation from the actual situation, and after integration, the heat distribution in the equipment is uneven, so that the equipment is in fault and unstable in operation due to overhigh local temperature; the traditional air cooling design contradicts the whole sealing requirement of the equipment; (2) The cable wire of the camera sensor connected with the board card is disordered, and crosstalk is formed between transmission signals; (3) The maintenance and the maintenance of the integrated structural design need to disassemble and assemble the whole equipment, and the maintenance requirements on special environments (such as dangerous areas of highland and frontier defense) are higher; (4) The flexibility and adaptability to the requirements of users are insufficient, and in certain application scenes, the users need a larger monitoring view field than the traditional gun camera, but when the ultra-wide angle view field is not needed, a large-scale monitoring device is adopted, so that certain resource waste (high price, low pertinence and the like) is caused.
Disclosure of Invention
Aiming at the defects in the prior art, the application provides a modularized matrix camera which solves the problems that the heat dissipation of an integrated structure is poor and the maintenance and the expansion are difficult.
The technical scheme of the application is as follows: the modularized matrix camera comprises a plurality of basic optical units and a power supply communication guarantee unit, wherein the modularized matrix camera forms a required view field angle through different numbers of the basic optical units, the basic optical units comprise a plurality of lenses, image sensors, a signal processing circuit and a first interface module, the lenses are arranged in a row on a first plane, the image sensors receive lens light rays to form original image data and send the original image data to the signal processing circuit for processing, the first interface module comprises a power supply interface and an Ethernet interface, the signal processing circuit sends the processed image data to the power supply communication guarantee unit through the Ethernet interface, the power supply interface is used for supplying power to the image sensors and the signal processing circuit, the power supply communication guarantee unit comprises a power supply module, a network exchange module, a post-processing algorithm module and a plurality of second interface modules, the first interface module is in butt joint with the second interface module to enable the basic optical units to be sequentially arranged along the second plane, the first plane is orthogonal to the second plane, the power supply module is used for supplying power to the power supply interface, the network exchange module is used for processing the power supply algorithm module and the power supply algorithm module, and the power supply algorithm module is connected with the network exchange module.
According to the technical scheme, the plurality of lenses and the image sensors of the matrix camera are grouped to form the plurality of basic optical units, the signal processing circuit is independently arranged for original data processing of each basic optical unit, then the network exchange module and the post-processing algorithm module of the power supply communication guarantee unit are used for data overall processing, so that main heating components are dispersed in the basic optical units and the power supply communication guarantee unit, heat can be uniformly and rapidly discharged through heat dissipation design of the units, and a required view field angle can be rapidly formed according to requirements through combination of different numbers of basic optical units.
Further, the base optical unit is provided with a first sealed housing, the lens, the image sensor and the signal processing circuit are arranged in the first sealed housing, the first interface module is arranged on the first sealed housing, the power supply communication guarantee unit is provided with a second sealed housing, the power supply module, the network exchange module and the post-processing algorithm module are arranged in the second sealed housing, the second interface module is arranged on the second sealed housing, the front end face of the second sealed housing is a cylindrical surface, and the base optical unit is sequentially arranged on the front side of the front end face of the second sealed housing.
Further, in order to improve the tightness of the overall structure and reduce the sealing influence of the external environment on the connection position, the top of the second sealing shell is provided with a flange part extending forwards from the front end face, the second interface module is arranged on the lower surface of the flange part, and the first interface module is arranged on the top of the first sealing shell.
Further, in order to improve the heat dissipation effect of the matrix camera, the first sealing shell is provided with a plurality of capillary heat pipes, the capillary heat pipes extend from the side wall of the first sealing shell to the bottom plate, the signal processing circuit is arranged on the side wall to dissipate heat from the side wall, and the outer side face of the bottom plate is provided with heat dissipation fins.
Further, the signal processing circuit is arranged on the heat conducting support, and the heat conducting support is attached to the side wall.
Further, the bottom surface of the second sealing shell is provided with a plurality of vertical vapor chamber, and the power module, the network exchange module and the post-processing algorithm module are arranged on the vertical vapor chamber.
Further, the cross section of the first sealing shell is in a sector shape, and the side walls of the adjacent first sealing shells of the basic optical units are arranged in parallel.
The technical scheme provided by the application has the advantages that:
the optical component is provided with a basic signal processing circuit to perform image acquisition and preprocessing to form a modularized basic optical unit, so that a single basic optical unit can be accessed as a network node, the expansion of a matrix camera is facilitated, the optical path is not required to be redesigned and the image splicing algorithm is not required to be modified, and the data transmission interface resource is greatly saved.
The size of data acquisition can be determined according to the needs of a user through separation of the signal processing circuit and the post-processing algorithm module, whether mass data acquired by the high-definition lens array are transmitted after being compressed and the frame rate is adjusted by the post-processing algorithm module can be selected, and the data transmission efficiency is improved.
The array camera adopts the combination of a plurality of small unit sealing structures, the sealing interfaces of all the basic optical units and the power supply and communication guarantee units are intensively processed on the same structural surface, and the sealing and protection problems of all the small units are solved by adopting a single reliable sealing mode.
Each basic unit radiates heat through the soaking structure inside the respective sealed shell, the phase change material in the capillary heat pipe is relied on, the heat generated by the heating unit is conducted to the bottom through high-efficiency heat conduction, and then the heat is conducted to the external environment through the bottom, so that the sealing structure is not influenced under various expansion combinations, and the high-efficiency heat radiation is realized.
The equipment maintenance and the maintenance can be respectively operated aiming at the front and the back independent units, the requirement of quick replacement is realized, and the design also enables the after-sales and maintenance service of the product to be standardized and simplified.
Drawings
Fig. 1 is a schematic block diagram of a modular matrix camera.
Fig. 2 is a schematic structural view of the base optical unit.
Fig. 3 is a schematic diagram of the image sensor and signal processing circuitry of the base optical unit and the first sealed housing.
Fig. 4 is a schematic top view of the phase position relationship of the base optical unit and the power supply communication guarantee unit.
Fig. 5 is a schematic cross-sectional view of the base optical unit and the power supply communication guarantee unit mated.
Description of the embodiments
The present application is further described below with reference to examples, which are to be construed as merely illustrative of the present application and not limiting of its scope, and various modifications to the equivalent arrangements of the present application will become apparent to those skilled in the art upon reading the present description, which are within the scope of the application as defined in the appended claims.
As shown in fig. 1, the modular matrix camera of the present embodiment is composed of two main parts, namely a plurality of base optical units 1 and a power supply communication guarantee unit 2. Referring to fig. 2 again, the basic optical unit 1 includes basic optical components, each of which includes 3 high-definition lenses 101 arranged concentrically from top to bottom to form a 1*3 lens array, and the plane in which the high-definition lenses 101 are located is assumed to be the first plane. The high definition lens 101 is fixed on a metal bracket through a C-shaped camera interface, and forms a fixed cone-shaped view angle according to different specifications of the adopted lens and the angle of the metal bracket. Each lens-matched 4K high-definition CMOS image sensor 102 is fixed on a heat-conducting metal support 103 through bolts, and output signals of the CMOS image sensors 102 are connected with a signal processing circuit 104 through differential cables.
The shell of the basic optical unit 1 is made of aluminum alloy, the cross section of the shell of the basic optical unit 1 is fan-shaped, and the angle is fixed. The whole CNC processing of shell constitutes first sealed casing 3 for a sealed cavity, and camera lens front end protection casing adopts sapphire material lens, and the double-sided coating film, visible light and infrared band Gao Tou rate and the protection casing outside are waterproof, and the protection casing passes through double-deck waterproof construction and is connected with the cavity. The first interface module 105 of the basic optical unit is at the top of the first sealed housing 3, adopts a hard connection interface design, has a double-layer waterproof structure, and is convenient to connect and fix with the power supply communication guarantee unit 2. The first interface module 105 includes a power interface 105a and a gigabit ethernet interface 105b.
In the basic optical unit 1, the image sensor 102 collects original image data through a lens array, converts the original image data into digital MIPI interface data to output the digital MIPI interface data, and is connected to the signal processing circuit 104 through a special differential cable, the signal processing circuit 104 performs image processing on the input original data by using a built-in processor and an image algorithm, and transmits the data to the post-processing algorithm module 203 in the power supply communication guarantee unit 2 through the gigabit ethernet interface 105b to identify video and image content.
Referring to fig. 3, in the basic optical unit 1, the heating element is mainly from the CMOS image sensor 102 and the signal processing circuit 104, and the thermal stability of these two elements determines the stability of the system. The circuit board of the CMOS image sensor 102 is tightly attached to the heat conducting metal support 103, heat generated by the circuit board is conducted to the heat conducting metal support 103, the heat conducting metal support 103 is tightly attached to the side wall of the first sealing shell 3 through the side face, the heat is conducted to the side wall, the capillary heat pipes 301 are embedded in the side plate and the bottom plate to form a soaking plate structure, the phase change materials are filled in the capillary heat pipes 301, and the heat of the side wall is conducted to the bottom plate through the phase change materials of the internal capillary heat pipes 301.
The power supply communication guarantee unit 2 comprises an alternating current-direct current power supply module 201, a network switching module 202, a post-processing algorithm module 203 and 7 second interface modules 204. The shell of the power supply communication guarantee unit 2 is an aluminum alloy cavity integrally processed by CNC, and a second sealing shell 4 is formed, so that the sealing performance is guaranteed. As shown in fig. 4 and 5, the second sealed housing 4 is a substantially fan-shaped cylinder structure, and the front side surface thereof is a cylindrical surface, and the base optical unit 1 is arranged at the front side of the cylindrical surface. The top of the second seal housing 4 is provided with a flange portion 401 extending forward from the front end surface, and the second interface module 204 is provided on the lower surface of the flange portion 401, the lower surface of the flange portion 401 being a second plane. The second interface module 204 is similar to the first interface module 105 in that it is a hard-wired interface design, a two-layer waterproof structure, and interfaces with the first interface module 105. The interfacing of the first interface module 105 with the second interface module 204 also completes the connection of the base optical unit 1 with the power supply communication assurance unit 2. After being connected with the power supply communication guarantee unit 2, the side walls of the first sealed shells 3 of the adjacent basic optical units 1 are closely attached in parallel, and the first plane is orthogonal to the second plane, so that the high-definition lenses 101 of all the basic optical units 1 form a matrix in row and column arrangement. The number of base optical units 1 can be configured as desired, and the second interface module 204, to which the base optical units 1 are not connected, can be sealed by a waterproof cover.
The ac/dc power module 201, the network switching module 202, and the post-processing algorithm module 203 are located in the second sealed housing 4. The alternating current-direct current power supply module 201 is responsible for the power supply of the whole system, has the compatible alternating current 220V input and direct current 24V input capacity, and is suitable for all-weather scenes such as conventional mains supply power supply, outdoor battery power supply and the like. The power module can automatically recognize AC/DC input and output power of 250W at maximum, has various specifications of power outputs such as DC 24V@1A, DC 12V@2A, DC 12V@10A, DC 5V@1A and the like, and has the functions of overvoltage, overcurrent, undervoltage, overheat, short-circuit protection and the like. The ac/dc power module 201 supplies power to the network switching module 202 and the post-processing algorithm module 203, and supplies power to the CMOS image sensor 102 and the signal processing circuit 104 through the power supply interface 105a of the first interface module 105. The network switching module 202 implements data exchange between the base optical unit 1 and the post-processing algorithm module 203 through the gigabit ethernet interface 105b of the first interface module 105. The network switching module 202 has at least 12 gigabit ports, and is configured to accommodate a maximum of 9 basic optical units, and is configured to accommodate a maximum of 13 basic optical units by replacing the same-size switching module. The ac/dc power module 201, the network switching module 202, and the post-processing algorithm module 203 are heating elements, so in order to ensure heat dissipation, a plurality of vertical soaking plate structures 402 are installed on the bottom surface of the second sealed housing 4, the vertical soaking plate structures 402 may be heat conducting plates with built-in heat pipes, and the ac/dc power module 201, the network switching module 202, and the post-processing algorithm module 203 are respectively installed on the vertical soaking plate structures 402 to draw heat from the bottom surface of the second sealed housing 4. In order to enhance the heat dissipation effect, in some embodiments, heat dissipation fins may be processed on the outer sides of the bottoms of the first sealed housing 3 and the second sealed housing 4, and waterproof radiators are installed on the heat dissipation fins.
Claims (7)
1. The modularized matrix camera is characterized by comprising a plurality of basic optical units and a power supply communication guarantee unit, wherein the modularized matrix camera forms a required view field angle through different numbers of the basic optical units, the basic optical units comprise a plurality of lenses, image sensors, a signal processing circuit and a first interface module, the lenses are arranged in a row on a first plane, the image sensors receive light rays of the lenses to form original image data and send the original image data to the signal processing circuit for processing, the first interface module comprises a power supply interface and an Ethernet interface, the signal processing circuit sends the processed image data to the power supply communication guarantee unit through the Ethernet interface, the power supply interface is used for supplying power to the image sensors and the signal processing circuit, the power supply communication guarantee unit comprises a power supply module, a network exchange module, a post-processing algorithm module and a plurality of second interface modules, the first interface module and the second interface modules are in butt joint to enable the basic optical units to be arranged along a second plane in sequence, the first plane is orthogonal to the second plane, and the power supply module is used for exchanging power supply interfaces, the power supply module and the post-processing algorithm module and the power supply algorithm module are connected with the network exchange module.
2. The modular matrix camera of claim 1, wherein the base optical unit is provided with a first sealed housing, the lens, the image sensor and the signal processing circuit are disposed in the first sealed housing, the first interface module is disposed on the first sealed housing, the power supply communication guarantee unit is provided with a second sealed housing, the power module, the network exchange module and the post-processing algorithm module are disposed in the second sealed housing, the second interface module is disposed on the second sealed housing, a front end surface of the second sealed housing is a cylindrical surface, and the base optical unit is sequentially arranged on a front side of the front end surface of the second sealed housing.
3. The modular matrix camera of claim 2, wherein a top portion of the second sealed housing is provided with a flange portion extending forward from the front face, the second interface module is disposed on a lower surface of the flange portion, and the first interface module is disposed on a top portion of the first sealed housing.
4. The modular matrix camera of claim 2, wherein the first sealed housing is provided with a plurality of capillary heat pipes, the capillary heat pipes extend from a side wall of the first sealed housing to a bottom plate, the signal processing circuit is arranged on the side wall to radiate heat from the side wall, and the outer side surface of the bottom plate is provided with heat radiation fins.
5. The modular matrix camera of claim 4, wherein the signal processing circuitry is disposed on a thermally conductive mount that is attached to the side wall.
6. The modular matrix camera of claim 2, wherein the bottom surface of the second sealed housing is provided with a plurality of vertical soaking plates, and the power module, the network switching module, and the post-processing algorithm module are disposed on the vertical soaking plates.
7. The modular matrix camera of claim 2, wherein the first sealed housing has a sector-shaped cross section and the sidewalls of the first sealed housings of adjacent base optical units are disposed in parallel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210252011.3A CN114584695B (en) | 2022-03-15 | 2022-03-15 | Modularized matrix camera |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210252011.3A CN114584695B (en) | 2022-03-15 | 2022-03-15 | Modularized matrix camera |
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| CN114584695A CN114584695A (en) | 2022-06-03 |
| CN114584695B true CN114584695B (en) | 2023-11-07 |
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