CN114574153A - Organosilicon sealant and preparation method thereof - Google Patents

Organosilicon sealant and preparation method thereof Download PDF

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Publication number
CN114574153A
CN114574153A CN202210233027.XA CN202210233027A CN114574153A CN 114574153 A CN114574153 A CN 114574153A CN 202210233027 A CN202210233027 A CN 202210233027A CN 114574153 A CN114574153 A CN 114574153A
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Prior art keywords
silicone oil
hydrogen
sealant
compound
containing silicone
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Inventor
李吉明
王昌勇
杨群武
孙大鹏
柯海岚
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Suzhou Aidihensi Adhesive Technology Co ltd
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Suzhou Aidihensi Adhesive Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention belongs to the field of bonding materials, and particularly relates to an organosilicon sealant and a preparation method thereof. The invention provides an organosilicon sealant which does not contain an inhibitor and comprises the following components in parts by weight: 80-120 parts of vinyl silicone oil; 1-5 parts of fumed silica; 0.5-10 parts of hydrogen-containing silicone oil; 0.1-0.5 part of platinum catalyst; 1-5 parts of a tackifier; 200 portions and 300 portions of heat-conducting filler; 0.01-0.05 part of organic titanium catalyst. The invention has good process operability, thermal conductivity, good mechanical strength, higher bonding strength to materials such as aluminum alloy, stainless steel, PC and the like, and is suitable for the electronic industry. The single-component addition type silicone rubber has the advantages of stable storage, lower curing temperature, shorter curing time, self-adhesiveness, suitability for materials such as stainless steel, aluminum alloy, PC and the like, low compression set and suitability for CIPG process.

Description

Organosilicon sealant and preparation method thereof
Technical Field
The invention belongs to the field of bonding materials, and particularly relates to an organosilicon sealant and a preparation method thereof.
Background
In the prior art, polyvinyl siloxane is used as a base polymer, polymethylhydrosiloxane is used as a cross-linking agent, and an elastomer with a network structure is formed through a cross-linking reaction under the catalytic action of a transition metal compound in a group VIII (such as a platinum catalyst). The addition type organic silicon sealing adhesive has the characteristics of no byproduct generated in the curing process, small shrinkage rate, deep curing, heating, quick curing and the like, and is widely applied. The addition type organosilicon sealing adhesive can be divided into two components and single component according to the proportion. The single-component addition type organic silicon sealing adhesive is simple in construction, does not need to be mixed, can be completely cured at 120-150 ℃ for 15-30 min, has good adhesion, gradually replaces the traditional room-temperature condensation type silicon rubber in the fields of electronic appliances and new energy, greatly shortens the production period, improves the production efficiency, and solves multiple problems of work efficiency, environmental protection, energy conservation and the like.
In the application aspect, the addition type silicone rubber has low surface energy, poor wettability to various base materials, lack of groups with reactivity, weak molecular acting force with the base materials and poor bonding performance due to the fact that the whole molecule is in a highly saturated state because of the spiral curl of a molecule chain segment and the polarity of a silicon-oxygen bond shielded by a nonpolar side group, and is easy to fall off between the silicone rubber and the base materials particularly under the influence of an external humid environment (such as damp). Previous studies have demonstrated that addition-type liquid silicone rubber has poor adhesion to most substrates for the reasons described above. Therefore, in order to enhance the adhesion between the silicone rubber and the substrate, a primer needs to be applied to the contact surface of the silicone rubber and the substrate, which greatly limits the application range of the addition type silicone rubber. But the adoption of the base coating technology not only increases the production difficulty, but also seriously affects the production efficiency; moreover, the components of the primer generally contain flammable organic solvents, so that the danger is increased in the using, storing and transporting processes of the primer; meanwhile, the organic solvent in the primer is also volatile, thereby causing environmental pollution.
For example, in the field of electronic and electrical appliances, in order to increase the color and brightness of the appearance of the electrical appliance, resin powder is usually sprayed on a substrate to perform surface treatment on the substrate, and the resin powder is melted and leveled into a layer of compact protective coating after being baked at high temperature, so that the protective coating is firmly attached to the surface of the substrate. The resin powder generally contains low surface energy substances such as paraffin wax and leveling agent, and these substances are liable to migrate to the surface of the coating layer, resulting in a decrease in the surface energy of the coating layer and difficulty in adhesion. At present, the single-component addition type organic silicon sealing adhesive on the market has poor adhesion to the base materials, a primer is required to be used for treating the base materials in advance, the production efficiency is reduced, and the primer contains a large amount of organic solvents, so that the environmental pollution and the human body injury are caused.
Disclosure of Invention
The invention provides an organosilicon sealant which comprises the following components in parts by weight:
Figure BDA0003539288720000021
the tackifier consists of a compound A and a compound B;
wherein the compound A has a general formula:
Figure BDA0003539288720000022
wherein R is1is-OCH3；
R2is-CH3or-OCH3；
R3is-CH3、-OCH3or-OCH2CH3；
The compound B has the general formula:
Figure BDA0003539288720000023
preferably, the mass ratio of the compound A to the compound B is 1: 0.5-2.
Preferably, the surface of the fumed silica is treated by dimethyldichlorosilane, and the specific surface area is 150-300m2(ii)/g, the average primary particle diameter is 7 to 20 nm.
Preferably, the viscosity of the vinyl silicone oil is 5000-.
Preferably, the hydrogen-containing silicone oil comprises the complex formulation of lateral hydrogen-containing silicone oil and other hydrogen-containing silicone oil, and the other hydrogen-containing silicone oil is one or more of terminal hydrogen-containing silicone oil and terminal hydrogen-containing silicone oil;
the general formula of the lateral hydrogen-containing silicone oil is as follows:
Figure BDA0003539288720000031
m and t are independently selected from any integer from 1 to 200;
preferably, the pendant hydrogen-containing silicone oil has a CAS number of 68073-59-2, and is selected from SH series of Jiangskoke Qi Polymer materials research institute, Inc.
The general formula of the hydrogen-terminated silicone oil is as follows:
Figure BDA0003539288720000032
n is any integer of 1-200;
preferably, the CAS number of the hydrogen-terminated silicone oil is 70900-21-9, and the hydrogen-terminated silicone oil is selected from D series of Jiangsuchi high polymer materials research institute, Inc.
The end side hydrogen-containing silicone oil has the general formula:
Figure BDA0003539288720000033
p and q are independently selected from any integer from 1 to 200;
preferably, the side hydrogen-containing silicone oil has a CAS number of 69013-23-6, and is selected from DSH series of Jiangskoku Qi Polymer materials research institute, Inc.
The special hydrogen-containing polysiloxane (silicone oil containing hydrogen on the side and hydrogen on the end side) is compounded for chain extension and crosslinking, so that the reaction activity is improved; multifunctional tackifiers with tackifying groups (such as epoxy, vinyl, phenyl, etc.) -reactive groups (such as vinyl, allyl, hydrosilyl) were developed to form reactive bridges. The end hydrogen-containing polysiloxane is used for chain extension and crosslinking, and the crosslinking density can be adjusted in the reaction, so that the hardness, modulus and mechanical strength of the vulcanized silicone rubber are controlled; the end side hydrogen-containing silicone oil has different hydrogen contents and viscosities, and the side hydrogen-containing chain links are distributed in molecules very uniformly and have high reactivity. The position of the silicon-hydrogen bond in the cross-linking agent molecule will directly affect the mechanical properties of the addition type organosilicon sealing adhesive. When the hydrogen-terminated cross-linking agent is used, the tear strength of the obtained silicone rubber is greatly improved due to the higher activity of the terminal hydrosilyl group, and when the hydrogen-terminated cross-linking agent is used, the tear strength of the obtained silicone rubber is greatly improved due to the higher activity of the terminal hydrosilyl group and the higher reaction rate, and the mechanical strength of the polysiloxane is increased along with a chain growth reaction while a polysiloxane molecular chain is crosslinked.
Preferably, the thermally conductive filler includes aluminum oxide and/or zinc oxide.
Further, the mass ratio of the aluminum oxide to the zinc oxide is 1-4: 1.
further, the alumina consists of spherical alumina and conventional alumina; the mass ratio of the spherical alumina to the conventional alumina is 1-2: 1-2.
The aluminum oxide used as the heat-conducting filler in the current market is mostly conventional aluminum oxide, the shape is flaky, ellipsoidal, vermicular or irregular, the performance is stable, the price is low, and the increase of the filling amount is an effective way for improving the heat-conducting capacity. Compared with common-shape alumina, the spherical alumina can greatly improve the filling amount under the condition of keeping the same viscosity, and further improve the heat conductivity of the organic silicon heat-conducting adhesive. The large-particle-size spherical alumina filler and the small-particle-size spherical alumina filler are mixed, so that a heat conduction path is favorably formed, and the mechanical property can be well maintained. The key to improving the thermal conductivity is the increase of the packing density and the better formation of the thermal conductive network. The conventional alumina has irregular shape, and after the filling amount is increased to a certain degree, filler particles are easy to adhere together, so that the flow resistance is large, and the increase of the filling amount is limited; the alumina with spherical appearance has small surface energy, the glue solution has good fluidity on the surface, the filler particles are not easy to adhere to each other, the flow resistance is small, and the filling amount can be obviously improved on the premise of keeping good fluidity; when the spherical alumina with the particle size of a proper proportion is adopted for compounding, the small spherical particles are filled among the large spherical particles, so that the filling density is further improved, and more heat conduction channels are formed.
Preferably, the organotitanium catalyst comprises one or more of tetra-n-butyl titanate, isopropyl titanate and titanium tetrakis (2-ethylhexanol).
Organic alkoxy titanate (such as titanium tetra (2-ethyl hexanol)) is used as a Lewis acid catalyst, so that adhesion promotion and polymer crosslinking are influenced, and high temperature resistance is improved. In the self-adhesion technology, the organic alkoxy titanate is uniquely applied to the project to promote the self-adhesion effect. The titanate is formulated with other ingredients for catalytic, crosslinking applications, and is usually added as a final ingredient to prevent unwanted pre-reaction with water or other ingredients. When the tackifier used in the project plays a self-adhesive role in the liquid silicone rubber, the vinyl group or the hydrosilyl group participates in the vulcanization reaction, and the alkoxy group plays a role in bonding with the surface of the base material through hydrolysis to the hydroxyl group. In the process, the organic alkoxy titanate catalyzes hydrolysis reaction to promote adhesion or modify the surface.
Preferably, the platinum catalyst is selected from PT-2500DZ, a silicon friendly New materials science and technology Co.
The invention also provides a preparation method of the modified silane sealant, which comprises the following steps:
(1) mixing vinyl silicone oil and heat-conducting filler at the temperature of 100 ℃ and 140 ℃ for 2-6h, cooling, and adding hydrogen-containing silicone oil and gas-phase silicon dioxide to obtain a mixture;
(2) and adding a tackifier, a platinum catalyst and an organic titanium catalyst into the mixture at the temperature of 25-35 ℃, and mixing to obtain the modified silane sealant.
The preparation method of the single-component thermosetting heat-conducting organosilicon sealant has the advantages of good process operability, heat conductivity, good mechanical strength and higher bonding strength to materials such as aluminum alloy, stainless steel, PC and the like, and is suitable for the electronic industry. The technical problem to be solved is as follows: the storage stability of the single-component addition type silicone rubber product; lower curing temperature and shorter curing time; the coating has self-adhesion and is suitable for materials such as stainless steel, aluminum alloy, PC and the like; the compression set is low, and the CIPG technology is suitable for CIPG technology.
Compared with the prior art, the technical scheme of the invention has the following advantages:
1. single-component packaging, good process operability and suitability for CIPG process.
2. The special tackifier is adopted for compounding, the addition type silicone rubber self-adhesion technology is provided, and the adhesive has good applicability to base materials.
3. The hydrogen-containing cross-linking agent at the end and the side is adopted for compounding, so that the high-strength polyurethane composite material has high cross-linking density and improved compression permanent deformation.
4. The special grade platinum catalyst is adopted, the curing speed is high, and the curing can be realized at 120 ℃ for 15 min.
5. Has thermal conductivity and is suitable for heat dissipation application.
6. No inhibitor is needed and has room temperature storage property.
Detailed Description
The present invention is further described below in conjunction with specific examples to enable those skilled in the art to better understand the present invention and to practice it, but the examples are not intended to limit the present invention.
Example 1
100g of vinyl silicone oil having a viscosity of 500 mPas, 150g of alumina and 150g of zinc oxide were mixed at 120 ℃ in vacuum for 4 hours; after cooling to room temperature, adding 2g of hydrogen-containing silicone oil SH-75 on the side and 3g of hydrogen-containing silicone oil DSH-100 on the side, and mixing uniformly; adding 1g of fumed silica, and uniformly mixing; 5g of tackifier (the mass ratio of the compound A to the compound B in the tackifier is 1: 1), 0.5g of platinum catalyst PT-2500DZ and 0.05g of organic titanium catalyst tetrabutyl titanate are added at the temperature of 30 ℃, and the materials are uniformly mixed under the vacuum condition; discharging, sealing and packaging according to specifications, and storing at room temperature of 28 ℃.
Example 2
100g of vinyl silicone oil with viscosity of 20000mPa s, 75g of alumina and 75g of zinc oxide are mixed for 4 hours in vacuum at 120 ℃; after cooling to room temperature, 0.3g of end hydrogen-containing silicone oil D-15, 0.3g of side hydrogen-containing silicone oil SH-75 and 0.3g of end hydrogen-containing silicone oil DSH-100 are added and mixed evenly; adding 5g of fumed silica, and uniformly mixing; ensuring that the material temperature is 30 ℃, adding 1g of tackifier (the mass ratio of the compound A to the compound B in the tackifier is 1: 2), 0.1g of platinum catalyst PT-2500DZ and 0.01g of organic titanium catalyst isopropyl titanate, and uniformly mixing under a vacuum condition; discharging, sealing and packaging according to specifications, and storing at room temperature of 28 ℃.
Example 3
100g of vinyl silicone oil with a viscosity of 50000 mPa.s, 100g of alumina and 100g of zinc oxide are mixed for 4 hours in vacuum at 120 ℃; after cooling to room temperature, 0.25g of side hydrogen-containing silicone oil SH-75 and 0.25g of side hydrogen-containing silicone oil DSH-100 are added and mixed evenly; adding 2g of fumed silica, and uniformly mixing; 1g of tackifier (the mass ratio of the compound A to the compound B in the tackifier is 1: 0.5), 0.2g of platinum catalyst PT-2500DZ and 0.03g of organic titanium catalyst tetra (2-ethylhexanol) titanium are added at the temperature of 30 ℃, and the materials are uniformly mixed under the vacuum condition; discharging, sealing and packaging according to specifications, and storing at room temperature of 28 ℃.
Comparative example 1
100g of vinyl silicone oil with viscosity of 20000 mPa.s, 75g of alumina and 75g of zinc oxide are mixed for 4 hours in vacuum at 120 ℃; after cooling to room temperature, adding 0.9g of side hydrogen-containing silicone oil SH-75, and uniformly mixing; adding 5g of fumed silica, and uniformly mixing; ensuring that the material temperature is 30 ℃, adding 1g of tackifier (the mass ratio of the compound A to the compound B in the tackifier is 1: 1), 0.1g of platinum catalyst PT-2500DZ and 0.01g of organic titanium catalyst tetrabutyl titanate, and uniformly mixing under a vacuum condition; discharging, sealing and packaging according to specifications, and storing at room temperature of 28 ℃.
Comparative example 2
100g of vinyl silicone oil with a viscosity of 50000 mPa.s, 100g of alumina and 100g of zinc oxide are mixed for 4 hours in vacuum at 120 ℃; after cooling to room temperature, 0.25g of side hydrogen-containing silicone oil SH-75 and 0.25g of side hydrogen-containing silicone oil DSH-100 are added and mixed evenly; adding 2g of fumed silica, and uniformly mixing; ensuring that the material temperature is 30 ℃, adding 1g of tackifier (the mass ratio of the compound A to the compound B in the tackifier is 1: 1) and 0.2g of platinum catalyst PT-2500DZ, and uniformly mixing under a vacuum condition; discharging, sealing and packaging according to specifications, and storing at room temperature of 28 ℃.
Effect evaluation 1
The single-component thermosetting heat-conducting silicone sealants prepared in examples 1 to 3 and comparative examples 1 to 2 were tested by the methods shown in table 1, and the test results shown in table 2 were obtained.
TABLE 1 Performance test method for single-component thermosetting heat-conducting organosilicon sealant
Figure BDA0003539288720000061
TABLE 2 comparison data table of performance of single-component thermosetting heat-conducting organosilicon sealant
Figure BDA0003539288720000062
Figure BDA0003539288720000071
The examples and the comparative examples can be stored at normal temperature, and have 6-month storage period; the example has a faster vulcanization rate than comparative example 1; the recommended vulcanization temperature of the commercial product is 150 ℃, the vulcanization speed is slow at 120 ℃, and the storage period of the commercial product at normal temperature is only 3 months; comparative example 2, in which no organotitanium catalyst was added, had poor adhesion and exhibited low tensile shear strength. Overall, the vulcanization speed, the mechanical properties after curing and the thermal conductivity of the examples are all significantly better than those of the commercial products.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.

Claims (10)

1. The organic silicon sealant is characterized by comprising the following components in parts by weight:
Figure FDA0003539288710000011
the tackifier consists of a compound A and a compound B;
wherein the compound A has a general formula:
Figure FDA0003539288710000012
wherein R is1is-OCH3；
R2is-CH3or-OCH3；
R3is-CH3、-OCH3or-OCH2CH3；
The compound B has the general formula:
Figure FDA0003539288710000013
2. the silicone sealant of claim 1 wherein the mass ratio of compound a to compound B is 1: 0.5-2.
3. The silicone sealant of claim 1 wherein the fumed silica has a surface treated with dimethyldichlorosilane and a specific surface area of 150-300m2(ii)/g, the primary particle diameter is 7-20 nm.
4. The silicone sealant of claim 1 wherein the vinyl silicone oil has a viscosity of 5000-.
5. The silicone sealant of claim 1 wherein the hydrogen-containing silicone oil comprises one or more of a side hydrogen-containing silicone oil, a terminal hydrogen-containing silicone oil, and a terminal side hydrogen-containing silicone oil;
the general formula of the lateral hydrogen-containing silicone oil is as follows:
Figure FDA0003539288710000021
m and t are independently selected from any integer from 1 to 200;
the general formula of the hydrogen-terminated silicone oil is as follows:
Figure FDA0003539288710000022
n is any integer of 1-200;
the end side hydrogen-containing silicone oil has the general formula:
Figure FDA0003539288710000023
p and q are independently selected from any integer from 1 to 200.
6. The silicone sealant of claim 1 wherein said thermally conductive filler comprises aluminum oxide and/or zinc oxide.
7. The silicone sealant of claim 6 wherein the mass ratio of aluminum oxide to zinc oxide is from 1 to 4: 1.
8. the silicone sealant of claim 6 wherein said alumina is comprised of spherical alumina and conventional alumina; the mass ratio of the spherical alumina to the conventional alumina is 1-2: 1-2.
9. The silicone sealant of claim 1 wherein the organotitanium catalyst comprises one or more of tetra-n-butyl titanate, isopropyl titanate and titanium tetrakis (2-ethylhexanol).
10. A method of preparing the silicone sealant according to any one of claims 1 to 9 comprising the steps of:
(1) mixing vinyl silicone oil and heat-conducting filler at the temperature of 100 ℃ and 140 ℃ for 2-6h, cooling, and adding hydrogen-containing silicone oil and gas-phase silicon dioxide to obtain a mixture;
(2) and adding a tackifier, a platinum catalyst and an organic titanium catalyst into the mixture at the temperature of 25-35 ℃, and mixing to obtain the organosilicon sealant.
CN202210233027.XA 2022-03-09 2022-03-09 Organosilicon sealant and preparation method thereof Pending CN114574153A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102093839A (en) * 2010-12-28 2011-06-15 成都硅宝科技股份有限公司 Additive pouring sealant used for wind driven generator and preparation method thereof
CN102559133A (en) * 2011-12-23 2012-07-11 成都硅宝科技股份有限公司 Addition type single component organosilicon sealant and processing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102093839A (en) * 2010-12-28 2011-06-15 成都硅宝科技股份有限公司 Additive pouring sealant used for wind driven generator and preparation method thereof
CN102559133A (en) * 2011-12-23 2012-07-11 成都硅宝科技股份有限公司 Addition type single component organosilicon sealant and processing method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
方炜;蘧建星;林浩军;: "含氢硅油结构对硅橡胶性能的影响", 有机硅材料, no. 1, pages 1 *

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