CN114571359A

CN114571359A - Grinding head device for processing glass hole

Info

Publication number: CN114571359A
Application number: CN202210196562.2A
Authority: CN
Inventors: 李文学; 黄立; 金方来
Original assignee: Weidali Industry Chibi Co ltd; Wanjin Industrial Chibi Co Ltd
Current assignee: Weidali Industry Chibi Co ltd; Wanjin Industrial Chibi Co Ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-06-03

Abstract

The invention discloses a grinding head device for processing a glass hole. A bistrique device for glass spot facing work includes tool bit subassembly and handle of a knife subassembly, the tool bit subassembly includes trompil part and hole truing part, the trompil part with hole truing part connects, the terminal surface of trompil part outwards has the clearance hole, hole truing part with handle of a knife subassembly is connected, the outer peripheral face of hole truing part has the truing convex part. The grinding head device for processing the glass hole can reduce the phenomena of hole collapse and hole crack when the glass hole is processed, particularly the glass hole after glass is thermally bent, the service life of the grinding head is prolonged, and the product yield is improved.

Description

Grinding head device for processing glass hole

Technical Field

The invention relates to the field of electronic product processing, in particular to a grinding head device for processing a glass hole.

Background

The CNC machining of the glass holes needs to use grinding heads, and the grinding heads used in different glass hole structures are different in design and structure. When the existing grinding head is used for processing glass holes, particularly glass holes after glass is subjected to hot bending, the phenomena of hole collapse and hole crack are easy to occur, the yield is low and the cost is high due to the phenomena of hole collapse and hole crack of the glass holes, and the service life of the grinding head is greatly reduced. When the glass hole after the existing grinding head is used for processing the glass hot bending, the processing efficiency is low in order to ensure that the processing effect is free from hole collapse and hole crack as far as possible.

Disclosure of Invention

Based on this, it is necessary to provide a grinding head device for glass hole machining. The grinding head device for processing the glass hole can reduce the phenomena of hole collapse and hole crack when the glass hole is processed, particularly the glass hole after glass is subjected to hot bending, prolong the service life of the grinding head and improve the yield of products.

The utility model provides a bistrique device for glass spot facing work, includes tool bit subassembly and handle of a knife subassembly, the tool bit subassembly includes trompil part and hole truing part, the trompil part with hole truing part connects, the terminal surface of trompil part outwards has the clearance hole, hole truing part with handle of a knife subassembly is connected, the outer peripheral face of hole truing part has the truing convex part.

In some embodiments, the outer peripheral surface of the fenestration product is in a rounded transition with the outward facing end surface of the fenestration product.

In some embodiments, the inner circumferential surface of the clearance hole and the outward end surface of the apertured part are in arc transition.

In some embodiments, the inner circumferential surface of the clearance hole and the bottom surface of the clearance hole are in arc transition.

In some of these embodiments, the radius R1 of the arc transition between the inner circumference of the clearance hole and the outward facing end surface of the apertured member is the same as the radius R2 of the arc transition between the inner circumference of the clearance hole and the outward facing end surface of the apertured member.

In some embodiments, the arc radius R1 of the arc transition between the inner circumferential surface of the clearance hole and the outward end surface of the apertured part, and the arc radius R2 of the arc transition between the inner circumferential surface of the clearance hole and the outward end surface of the apertured part are 0.5-1 mm.

In some embodiments, the outer peripheral surface of the hole forming member has a recess groove surrounding the outer peripheral surface of the hole forming member, the recess groove divides the outer peripheral surface of the hole forming member along the axial direction to form a hole forming section and a hole expanding section, and the hole expanding section is closer to the tool holder assembly than the hole forming section.

In some embodiments, when R1 < thickness W of the glass to be processed, the length H1 of the perforated section is more than the thickness W of the glass to be processed, and when R1 is more than or equal to the thickness W of the glass to be processed, the length H1 of the perforated section is more than R1.

In some of these embodiments, the outer peripheral surface of the hole conditioning member has a plurality of conditioning grooves with the conditioning protrusions formed between adjacent conditioning grooves, and the diameter D2 of the hole conditioning member at the conditioning grooves < the radial maximum diameter D1-2C1 of the bit assembly, where C1 is the size of the conditioning groove chamfer. .

In some embodiments, the reaming stage bits have multiple layers, and the number of layers of the reaming stage bits Y1 is round dup (S1/S2), where S1 is the number of single-layer reaming stage bits, and S2 is the number of single-layer drilling of open-hole stage bits.

In some embodiments, the length H2 of the broaching section is greater than Y1 xw, where Y1 is the number of layers machined in the broaching section and W is the thickness of the glass to be machined.

In some embodiments, the hole conditioning member layer number Y2 is round dup (S1/S3), where S1 is the hole-expansion-stage single-layer processing number, and S3 is the hole conditioning member single-layer processing number.

In some of these embodiments, the depth of the clearance hole is 0.02-5.0 mm.

According to the grinding head device for processing the glass hole, the end face, facing outwards, of the hole forming component is provided with the clearance hole, the clearance hole is located at the bottom of the whole grinding head, and the clearance hole plays a role in reducing weight and reducing the contact area between the grinding head and glass during hole forming. During the trompil, the bottom of trompil part is at first with the article like glass contact, and area of contact is big, and cutting resistance is big, and the bistrique wearing and tearing are violent, and consequently, the clearance hole of trompil part bottommost can reduce area of contact, reduces cutting resistance, and then slows down the wearing and tearing of bistrique, reaches the life who promotes the trompil part, and can effectively reduce the hole that the trompil process produced and collapse and the hole phenomenon of splitting.

Above-mentioned a bistrique device for glass spot facing work adds the hole size that can set up the tool bit subassembly than treating processing and is little about 1mm, so can improve the life of tool bit subassembly.

Above-mentioned a bistrique device for glass spot facing work, the terminal surface that the trompil part of tool bit subassembly is outwards has clearance hole, and during the trompil part trompil, can reduce the bottom of trompil part and the area of contact of article like glass, reduce the cutting force, and then reduce the hole and break up and the hole.

According to the grinding head device for glass hole machining, the plurality of finishing convex parts enable the outer peripheral surface of the hole finishing component to be layered, and the service life of the grinding head can be prolonged under the condition that the machining life of each layer of finishing convex part is fixed through layered machining.

Above-mentioned a bistrique device for glass spot facing work, the diamond dust of 300#, 400#, 1200# can be plated respectively to the trompil section position of trompil part, the reaming section position and the hole finishing part of trompil part, and the sand grain of different processing positions is different to adapt to different processing requirements, improve the life of bistrique, reduce because the wearing and tearing of bistrique lead to the appearance that the hole collapses and the hole splits.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.

Fig. 1 is a schematic view of a grinding head device for processing a glass hole according to an embodiment of the invention;

fig. 2 is a bottom structural view of a holed part of the grinding head device for glass hole machining shown in fig. 1;

fig. 3 is a schematic view of a cutter head assembly of the grinding head device for glass hole machining shown in fig. 1.

Description of the reference numerals

10. The grinding head device is used for processing a glass hole; 100. a cutter head assembly; 110. a perforated member; 111. avoiding a void; 112. a yielding groove; 1121. opening a hole section; 1122. reaming the section; 120. a hole finishing member; 121. finely trimming the groove; 122. finishing the convex part; 200. a knife handle assembly.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The embodiment of the application provides a bistrique device 10 for glass spot facing work to the hole that appears collapses, the hole phenomenon of splitting in the current glass hole CNC processing of solution leads to the problem that the life of yield is low, with high costs and bistrique reduces by a wide margin. The following description will be made with reference to the accompanying drawings.

Fig. 1 shows an exemplary grinding head device 10 for glass hole machining according to an embodiment of the present application, and fig. 1 is a schematic structural diagram of the grinding head device 10 for glass hole machining according to an embodiment of the present application. The grinding head device 10 for glass hole machining of the application can be used for CNC machining of glass holes.

In order to more clearly explain the structure of the grinding head device 10 for glass hole machining, the grinding head device 10 for glass hole machining will be described below with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a grinding head device 10 for glass hole machining according to an embodiment of the present disclosure. A grinding head device 10 for glass hole machining comprises a tool bit assembly 100 and a tool shank assembly 200. The cutter head assembly 100 is generally cylindrical in configuration. The tool tip assembly 100 includes a bore component 110 and a hole conditioning component 120. The opening part 110 has a cylindrical structure as a whole. The opening part 110 is connected to the hole finishing part 120. Referring to fig. 2, the outward end surface of the opening member 110 has a clearance hole 111. The hole conditioning member 120 is connected to the shank assembly 200. The outer peripheral surface of the hole finishing member 120 has finishing protrusions 122. In the grinding head device 10 for glass hole machining according to the present embodiment, the outward end surface of the opening part 110 of the tool bit assembly 100 has the clearance hole 111, and when the opening part 110 opens the hole, the contact area between the bottom of the opening part 110 and an object such as glass can be reduced, and the cutting force can be reduced, thereby reducing the hole chipping and the hole cracking.

Referring to fig. 2, the clearance hole 111 is located at a middle position of the outward end surface of the opening member 110.

Referring to fig. 1, the opening unit 110 is located at the lowest end of the grinding head, the opening unit 110 is used to open a hole with a smaller size at a position where a hole needs to be processed on an object to be opened, such as glass, because the opening unit 110 removes more glass material and the coating wears quickly, the opening unit 110 needs to be coated with a suitable mesh of diamond grains, for example, 300# diamond grains are used for the opening unit 110 in one embodiment.

The grinding head device 10 for machining the glass hole can set the size of the tool bit assembly 100 to be about 1mm smaller than the size of the hole to be machined during machining, so that the service life of the tool bit assembly 100 can be prolonged.

Referring to fig. 3, the hole finishing member 120 may finish the finishing of the sidewall of the hole and the chamfering of the upper and lower portions of the hole, and the hole finishing member 120 is plated with diamond grains having a mesh number of 1000# -1500# and preferably 1200 #. The finer the diamond grains in the hole finishing member 120, the better the hole wall and hole edge effects after finishing, but the finer the grains, the lower the wear resistance of the grinding head, so setting the diamond grains mesh number to 1200# makes it possible to improve the life of hole finishing as much as possible without hole chipping and hole cracking. Specifically, the number of diamond grains at the hole finishing part 120 may be adjusted, for example, the number of diamond grains at the hole finishing part 120 may be 1000#, 1300#, 1500# or other parameters, as the machining effect allows.

Referring to FIG. 3, in some embodiments, the outer periphery of the apertured member 110 is radiused to the outward facing end of the apertured member 110. The arc radius of the arc transition between the inner circumferential surface of the clearance hole 111 and the outward end surface of the opening member 110 is R1.

Referring to fig. 3, in some embodiments, the inner circumferential surface of the clearance hole 111 and the outward end surface of the opening member 110 are in arc transition. The arc radius of the arc transition between the inner circumferential surface of clearance hole 111 and the bottom surface of clearance hole 111 is R2.

Referring to fig. 3, in some embodiments, the inner circumferential surface of the clearance hole 111 and the bottom surface of the clearance hole 111 are in arc transition.

Referring to fig. 3, in some embodiments, the arc radius R1 of the arc transition between the inner circumferential surface of the clearance hole 111 and the outward end surface of the opening part 110 is the same as the arc radius R2 of the arc transition between the inner circumferential surface of the clearance hole 111 and the outward end surface of the opening part 110.

In some embodiments, the arc radius R1 of the arc transition between the inner circumferential surface of the clearance hole 111 and the outward end surface of the apertured member 110 and the arc radius R2 of the arc transition between the inner circumferential surface of the clearance hole 111 and the outward end surface of the apertured member 110 are 0.5-1 mm. For example, in one embodiment, the arc radius R1 is 0.5mm and the arc radius R2 is 0.5mm, and in another embodiment, the arc radius R1 is 1mm and the arc radius R2 is 1 mm. It will be appreciated that in other embodiments, the arc radii R1, R2 may also be 0.6mm, 0.7mm, 0.8mm, 0.9mm, or other parameters.

The arc radius of the arc transition between the inner circumferential surface of clearance hole 111 and the bottom surface of clearance hole 111 is R3. The radius of the circular arc is R3 and is 0.5-1 mm. For example, in one embodiment, the arc radius R3 is 0.5mm, and in another embodiment, the arc radius R3 is 1 mm. It will be appreciated that in other embodiments, the radius of the circular arc R3 may also be 0.6mm, 0.7mm, 0.8mm, 0.9mm, or other parameters.

The above parameters of the arc radius R1 and the arc radius R2 are kept the same, for example, the arc radius R1 and the arc radius R2 are 0.75 mm. The arc radius R1 and R2 should not be too small, and too small a radius of the arc radius R1 and R2 would result in too small a hole wall in the hole area and reduced strength.

Referring to fig. 3, in some embodiments, the outer peripheral surface of the opening component 110 has an offset groove 112 surrounding the outer peripheral surface of the opening component 110, the offset groove 112 divides the outer peripheral surface of the opening component 110 along the axial direction into an opening section 1121 and a reaming section 1122, and the reaming section 1122 is closer to the tool holder assembly 200 than the opening section 1121.

A reaming section 1122 is located at the upper end of the opening section 1121 and at the lower end of the hole conditioning member 120. The reaming section 1122 is plated with 400# carborundum and is mainly used for reaming, and reaming is carried out after hole opening to reduce the allowance of the hole wall and keep a proper machining allowance for hole finish machining.

For example, in one embodiment, the opening section 1121 of the opening part 110, the reaming section 1122 of the opening part 110 and the hole finishing part 120 may be plated with diamond grains of # 300, # 400 and # 1200 respectively, and the sand grains of different processing parts are different to adapt to different processing requirements, thereby prolonging the service life of the grinding head and reducing the phenomena of hole collapse and hole crack caused by the abrasion of the grinding head.

In some embodiments, when R1 < the thickness W of the glass to be processed, the length H1 of the open pore segment 1121 is greater than the thickness W of the glass to be processed, and when R1 is greater than or equal to the thickness W of the glass to be processed, the length H1 of the open pore segment 1121 is greater than R1. For example, when the thickness W of the glass to be processed is 0.6mm, when R1 is less than 0.6mm, the length H1 of the hole 1121 is greater than 0.6mm, and when R1 is greater than or equal to 0.6mm, the length H1 of the hole 1121 is greater than R1. The diamond grains of the opening portion 1121 may be selected within a certain range, for example, the diamond grains of the opening portion 1121 are between 200# -350#, and the specific number of the diamond grains of the opening portion 1121 is selected according to the actual processing situation.

In some embodiments, the outer peripheral surface of the hole finishing member 120 has a plurality of finishing grooves 121, finishing protrusions 122 are formed between adjacent finishing grooves 121, a diameter D2 of the hole finishing member 120 at the finishing grooves 121 < a maximum radial diameter D1-2C1 of the cutter head assembly 100, wherein C1 is a chamfer of the clearance groove 121, and a chamfer C1 of the clearance groove 121 satisfies the following relationship C1 ═ C2+ C0. The chamfer angle C2 of the glass is generally 0.1mm, and may be equal to 0.05, 0.08, 0.12, and C1 and C2 satisfy the following relationship, where C1 is C2+ C0, and the value range of C0 is suggested to be 0.1-0.3mm, and may be adjusted according to actual conditions. When the diameter D2 < D1-2C1 of the hole finishing member 120 at the finishing groove 121 is D2, the hole finishing member 120 may be layered in 1 or more layers, and the upper limit is determined by the number of single-layer processes of the hole finishing member 120, for example, the opening section 1121 may be processed 1000 times, and the number of single-layer processes of the hole finishing member 120 is 500pcs, then the layered layers of the hole finishing member 120 may be 2 layers, and so on. It is understood that the hole finishing member 120 may be processed in 3 layers in order to strictly secure the processing effect of the hole finishing member 120.

The radial maximum diameter D1 of the cutter head assembly 100 needs to be determined according to the size of the hole to be machined, and if the number of holes to be machined is plural, the radial maximum diameter D1 of the cutter head assembly 100 is determined according to the hole diameter of the smallest hole. For example, if the smallest hole has a hole diameter of 10mm, calculated as a single-sided pre-reaming margin of 0.8mm maximum, and considering that the opening size cannot be smaller than the grater size, then it is reasonable to have a radial maximum diameter D1 of the cutter head assembly 100 of 8 mm.

Referring to fig. 3, in some embodiments, the number of the finishing protrusions 122 is plural, for example, in one embodiment, the number of the finishing protrusions 122 is three. In the above-described grinding head device 10 for glass hole machining, the plurality of finishing protrusions 122 make the outer peripheral surface of the hole finishing member 120 layered, and layered machining can improve the service life of the grinding head with the fixed machining life of each layer of finishing protrusions 122.

In some embodiments, the reaming stage 1122 has multiple layers, and the number of layers Y1 of the reaming stage 1122 is equal to round dup (S1/S2), where S1 is the number of single-layer processing of the reaming stage 1122, and S2 is the number of single-layer processing of the opening stage 1121. For example, in one embodiment, where a 3-layer process is designed, the layered process can effectively increase the useful life of the grinding head.

In some embodiments, the length H2 of the reamed segment 1122 is greater than Y1 xw, where Y1 is the number of layers machined in the reamed segment 1122 and W is the thickness of the glass to be machined.

In some embodiments, the hole conditioning element 120 has a number of layers Y2 equal to round dup (S1/S3), where S1 is the number of single-layer steps of the reaming step 1122, and S3 is the number of single-layer steps of the hole conditioning element 120.

Referring to fig. 3, in some embodiments, the depth of the clearance holes 111 is 0.02mm to 5.0 mm. For example, in one embodiment, the depth of the clearance holes 111 is 0.02mm, and in another embodiment, the depth of the clearance holes 111 is 5.0 mm. It will be appreciated that in other embodiments, the depth of clearance hole 111 may also be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, or other parameters. Preferably, the depth of the clearance hole 111 at the bottom middle position of the perforated member 110 is 2.75 mm. The clearance hole 111 can play the roles of reducing weight and reducing the contact area with glass during tapping, reduce the contact area, reduce cutting resistance, slow down the abrasion of the grinding head and effectively reduce the hole collapse and hole crack generated in the tapping process.

In the grinding head device 10 for processing the glass hole, the outward end face of the hole opening part 110 is provided with the clearance hole 111, the clearance hole 111 is positioned in the middle position of the bottom of the whole grinding head, and the clearance hole 111 plays a role in reducing weight and reducing the contact area between the grinding head and the glass during hole opening. During the trompil, trompil part 110's bottom is first with the contact of article such as glass, and area of contact is big, and cutting resistance is big, and bistrique wearing and tearing are violent, and consequently, the clearance hole 111 of trompil part 110 bottommost can reduce area of contact, reduces cutting resistance, and then slows down the wearing and tearing of bistrique, reaches the life who promotes trompil part 110, and can effectively reduce the hole that the trompil process produced and collapse and the hole phenomenon of splitting.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a bistrique device for glass spot facing (operation), its characterized in that includes tool bit subassembly and handle of a knife subassembly, the tool bit subassembly includes trompil part and hole finishing part, the trompil part with hole finishing part connects, the outside terminal surface of trompil part has clearance hole, hole finishing part with handle of a knife subassembly is connected, the outer peripheral face of hole finishing part has the finishing convex part.

2. The grinding head device for glass hole machining according to claim 1, wherein the outer peripheral surface of the apertured member is in circular arc transition with the outward end surface of the apertured member;

the inner circumferential surface of the clearance hole and the outward end surface of the perforated part form arc transition;

the inner circumferential surface of the clearance hole and the bottom surface of the clearance hole are in arc transition;

the arc radius R1 of the arc transition between the inner peripheral surface of the clearance hole and the outward end surface of the apertured part is the same as the arc radius R2 of the arc transition between the inner peripheral surface of the clearance hole and the outward end surface of the apertured part.

3. A grinding head device for glass hole machining according to claim 2, wherein a radius R1 of an arc transition between the inner peripheral surface of the clearance hole and the outward-facing end surface of the apertured member, and a radius R2 of an arc transition between the inner peripheral surface of the clearance hole and the outward-facing end surface of the apertured member are 0.5 to 1 mm.

4. The grinding head device for glass hole machining according to claim 2, wherein the outer peripheral surface of the hole forming member has a relief groove surrounding the outer peripheral surface of the hole forming member, the relief groove divides the outer peripheral surface of the hole forming member in an axial direction into a hole forming step and a hole enlarging step, and the hole enlarging step is closer to the tool shank assembly than the hole forming step.

5. The grinding head device for glass hole machining according to claim 4, wherein when R1 < thickness W of glass to be machined, length H1 of the opening section position is greater than thickness W of glass to be machined, and when R1 is greater than or equal to thickness W of glass to be machined, length H1 of the opening section position is greater than R1.

6. The grinding head device for glass hole machining according to claim 5, wherein the outer peripheral surface of the hole finishing member has a plurality of finishing grooves with the finishing protrusions formed between adjacent ones of the finishing grooves, and the hole finishing member has a diameter D2 at the finishing grooves < a radially largest diameter D1-2C1 of the head assembly, wherein C1 is a chamfer of the finishing grooves.

7. The grinding head device for glass hole machining according to claim 6, wherein the reaming stage is provided with a plurality of layers, and the number of layers of the reaming stage is Y1 ROUNDUP (S1/S2), wherein S1 is the single-layer machining number of the reaming stage, and S2 is the single-layer machining number of the opening stage.

8. The grinding head device for glass hole machining according to claim 7, wherein the length H2 of the reaming section is greater than Y1 xW, wherein Y1 is the number of machining layers of the reaming section, and W is the thickness of the glass to be machined.

9. The grinding head apparatus for glass hole machining according to claim 7, wherein the hole-finishing-member number of layers Y2 is round dup (S1/S3), wherein S1 is a hole-expanding-stage-level single-layer machining number, and S3 is the hole-finishing-member single-layer machining number.

10. A grinding head device for glass hole machining according to any one of claims 1 to 9, wherein the depth of the clearance hole is 0.02 to 5.0 mm.