CN114554715B - Circuit board surface treatment method - Google Patents
Circuit board surface treatment method Download PDFInfo
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- CN114554715B CN114554715B CN202210025468.0A CN202210025468A CN114554715B CN 114554715 B CN114554715 B CN 114554715B CN 202210025468 A CN202210025468 A CN 202210025468A CN 114554715 B CN114554715 B CN 114554715B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The utility model relates to the technical field of circuit board surface treatment, in particular to a novel circuit board surface treatment method, which comprises the following steps of; performing single-sided etching on the printed circuit board, and forming a conductor pattern; placing the printed circuit board in a processing groove, and cleaning the conductor pattern on the surface of the etched cleaned printed circuit board for the first time; removing bubbles attached to the surface of the printed circuit board during the cleaning process; spraying a preflux liquid into the processing tank, and forming a preflux film on the conductor pattern on the surface of the bubble-removed printed circuit board; taking the printed circuit board out of the treatment tank, and removing pre-flux liquid adhered to the printed circuit board; finally, the printed circuit board is cleaned for the second time; the processing device comprises a limiting plate, a motor, a cleaning mechanism, a fixing plate, a cleaning main body and a conveying belt. The method has the advantages of short surface treatment process flow, batch production and good market prospect.
Description
Technical Field
The utility model relates to the technical field of circuit board surface treatment, in particular to a novel circuit board surface treatment method.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, ultra-thin circuit boards, printed circuit boards, and the like.
The utility model provides equipment for surface treatment of a printed circuit board, which is applicable to the field of printed circuit board manufacturing and comprises a spraying device, a water tank and a transmission device. The surface of the printed circuit board is provided with a plurality of copper pads. The spraying device is used for spraying copper protection lotion to the surface of the printed circuit board so as to break the water films on the surfaces of the copper pads. Copper protection liquid medicine used for forming an organic protection film on the surfaces of the copper pads is arranged in the liquid medicine tank. The transmission device is arranged in the copper protection groove and used for conveying the printed circuit board to the spraying device for spraying, immersing the sprayed printed circuit board in the liquid medicine groove and removing the printed circuit board forming the organic protection film out of the liquid medicine groove. The equipment for surface treatment of the printed circuit board can effectively improve the production efficiency of the printed circuit board.
The utility model relates to a circuit board surface treatment device with the patent number of CN201920788482.X, which comprises a moving component, a transmitter for transmitting laser and a mounting fixture for fixing a test piece to be processed, wherein the mounting fixture is connected with the moving component and moves under the driving of the moving component so that the laser emitted by the transmitter irradiates the surface of the test piece. According to the circuit board surface treatment equipment, the adhesive film on the surface of the test piece is cut off in a laser irradiation mode, the relative position between the test piece and the laser beam emitted by the laser is adjusted through the moving assembly, the adhesive film is gasified and eliminated from the surface of the test piece under the irradiation of laser, the surface treatment of the test piece is finished, the processing process is simple and quick, the production efficiency is high, the test piece cannot be damaged, and the production yield is improved.
The utility model discloses printed circuit board surface treatment equipment with a patent number of CN202022495893.5, which comprises a top plate, a second hydraulic cylinder and a cooling fan, wherein a first dust suction fan is arranged on the left side of the top end of the top plate, an upper dust suction opening is connected to the right side of the first dust suction fan, first guide check blocks are arranged on the left side and the right side of the upper dust suction opening, a side plate is connected to one side, far away from the vertical central axis of the top plate, of the first guide check blocks, an abutting plate is fixed to one side, close to the vertical central axis of the top plate, of the side plate, the upper end and the lower end of the other end of the abutting plate are respectively provided with the first hydraulic cylinder, and electromagnet clamping pieces are arranged on the left side of the first hydraulic cylinder. The setting of this printed circuit board surface treatment equipment radiator fan makes fresh air can get into inside the base, can be evenly diffused all around after fresh air hits the surface of water conservancy diversion lid to this makes the inside air of base circulate fully, avoids the second dust absorption fan to be in airtight space for a long time and receives moisture to take place to damage influence life.
However, the existing surface treatment device for circuit boards has some disadvantages in the use process, such as: the removal of bubbles adhering to the surface of the printed circuit board cannot be performed, and a preflux film cannot be formed on the conductor pattern on the printed circuit board from which the bubbles have been removed, and cleaning is not sufficiently thorough, so that a novel circuit board surface treatment method is required to solve the problems set forth in the above.
Disclosure of Invention
The utility model aims to provide a novel circuit board surface treatment method for solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the surface treatment method of the novel circuit board comprises the following steps:
s1, single-sided etching is carried out on a printed circuit board, the temperature of etching solution is controlled between 40 ℃ and 60 ℃, the etching time is controlled between 3min and 5min, and a conductor pattern is formed;
s2, placing the printed circuit board in a treatment tank, and cleaning the conductor pattern on the surface of the etched printed circuit board for the first time, wherein the temperature of purified water is 35-40 ℃ in the cleaning process;
s3, removing bubbles attached to the surface of the printed circuit board in the cleaning process;
s4, spraying a preflux liquid into the treatment tank, wherein the preflux liquid is made of imidazole compounds, the imidazole compounds are selected from one or more of 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and triazine addition imidazole, and then a preflux film is formed on the conductor patterns on the surface of the bubble-removed printed circuit board, and the thickness of the preflux film is not less than 0.2 mu m;
s5, taking the printed circuit board out of the processing groove, and removing pre-flux liquid adhered to the printed circuit board;
and S6, finally, carrying out second cleaning on the printed circuit board, and conveying to the next working procedure after the cleaning is finished.
The novel circuit board surface treatment method comprises a limiting plate, a motor, a cleaning mechanism, a fixing plate, a cleaning main body and a conveying belt, wherein the fixing plate is fixedly connected to two ends of the cleaning main body, the cleaning mechanism is fixedly installed on the upper part of one end of the cleaning main body, the limiting plate is fixedly connected to the middle part of one end of the cleaning main body, the motor is fixedly installed outside one end of the limiting plate, and the conveying belt is rotatably installed inside one end of the cleaning main body through the limiting plate;
the two ends of the conveying belt are internally provided with driving wheels in a rotating way, the conveying belt is rotatably clamped in clamping grooves formed in the driving wheels, and conveying clamping grooves are uniformly formed in the outer end face of the conveying belt;
the cleaning mechanism comprises a first fixed mounting plate, a cleaning part, a supporting mounting plate, a conveying pipe, a first liquid storage tank, a first air pump, a first nozzle, a second fixed mounting plate, an air blower and a second nozzle, wherein the first fixed mounting plate and the second fixed mounting plate are distributed on two sides of the supporting mounting plate, the air blower is fixedly mounted at one end bottoms of the first fixed mounting plate and the second fixed mounting plate, the second nozzle is uniformly and fixedly mounted at the bottom end of the supporting mounting plate, the second nozzle is communicated with the air blower through the conveying pipe, the first liquid storage tank is fixedly mounted at one end upper part of the second fixed mounting plate, the first air pump is fixedly connected with the outer end of the first liquid storage tank, the first nozzle is uniformly and fixedly mounted at one end bottom of the second fixed mounting plate, and the first nozzle is communicated with the inner bottom end of the first liquid storage tank through a control valve, and the cleaning part is fixedly mounted inside the first fixed mounting plate;
the cleaning part comprises a rotating shaft, an adsorption cleaning strip, a speed reducer and a first motor, wherein the first motor is fixedly connected to the upper end of the speed reducer, the rotating shaft is fixedly connected to the bottom end of the speed reducer, and the adsorption cleaning strip is uniformly and fixedly arranged at the edge of the bottom end of the rotating shaft;
the cleaning main body comprises a conveying groove, a bottom supporting plate and a protective frame, wherein the protective frame is fixedly arranged at the upper end of the bottom supporting plate, and the conveying groove is formed in the middle of one end of the protective frame;
the two sides of the bottom supporting plate are symmetrically provided with discharge grooves, a sliding rail is fixedly arranged in the bottom supporting plate, a sliding plate adjusting frame is slidably arranged in the sliding rail, a second motor is fixedly arranged at one end of the bottom supporting plate, and a threaded rod is rotatably clamped in the bottom supporting plate;
the one end fixed mounting of sliding plate regulating frame has the second liquid storage pot, the one end fixedly connected with second air pump of second liquid storage pot, the inside of sliding plate regulating frame evenly fixed mounting has the transport spray tube, the transport spray tube passes through the inside intercommunication of coupling hose with the second liquid storage pot, the equal fixedly connected with spray tube of front end of transport spray tube.
Preferably, the threaded rod is rotationally inserted into the bottom end of the sliding plate adjusting frame.
Preferably, the material of the adsorption cleaning strip is water-absorbing fabric.
Preferably, the first fixed mounting plate and the supporting mounting plate are fixedly connected to the upper end of the protection frame.
Preferably, the conveyor belt is rotatably mounted inside the conveying trough.
Preferably, the front end of the second nozzle is arranged in an inwards buckling inclined mode, and the second nozzle, the first nozzle and the cleaning part are located right above the conveying belt.
Preferably, the front end of the motor is fixedly connected with a driving wheel at one end.
Preferably, the two sides of the bottom supporting plate are fixedly provided with water collecting frames, and the middle part of the outer end of each water collecting frame is provided with a discharge connecting pipe.
Preferably, in the step S1, the etching solution comprises the following raw materials in parts by weight: 30-40 parts of polymeric ferric chloride, 3-8 parts of sulfuric acid, 10-15 parts of hydrochloric acid, 2-5 parts of copper nitrate and 50-60 parts of pure water; wherein sulfuric acid is a sulfuric acid solution with a concentration of 60%, and hydrochloric acid is a hydrochloric acid solution with a concentration of 37%.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the rotating conveying belt is arranged, and the conveying clamping grooves formed in the conveying belt can be used for continuously conveying the circuit board and cleaning the continuous outer surface, so that the efficiency is improved.
2. According to the utility model, the first liquid storage tank, the first air pump and the first nozzle are arranged to pre-clean the circuit board, and the second nozzle is arranged to remove bubbles on the surface of the printed circuit board, so that the cleaning of the outer surface of the circuit board is facilitated.
3. The utility model can form a preflux film on the outer surface of the circuit board by arranging the conveying spray pipe and the spray pipe and utilize the spray pipe, and can remove the preflux film on the outer surface of the circuit board by arranging the cleaning part.
4. The utility model firstly utilizes etching liquid to carry out single-sided etching on the circuit board, can further remove an oxide layer on the surface of the circuit board on the basis of etching conductor patterns, provides a flat surface, provides preparation for forming a preflux film, is thin and thick uniformly after shaping the preflux film, is beneficial to improving the comprehensive performance of the circuit board, and meanwhile, has short flow of the whole surface treatment process, can be put into mass production and has good market prospect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of the surface treatment of a circuit board according to the present utility model;
FIG. 2 is a schematic diagram of the main structure of the present utility model;
FIG. 3 is a side view of the body of the present utility model;
FIG. 4 is a schematic view of the structure of the conveyor belt of the present utility model;
FIG. 5 is a schematic view of a cleaning mechanism according to the present utility model;
FIG. 6 is a schematic view of the bottom structure of the cleaning mechanism of the present utility model;
FIG. 7 is a schematic view of a cleaning portion according to the present utility model;
FIG. 8 is a schematic view of the cleaning body of the present utility model;
FIG. 9 is a schematic view showing the internal structure of the bottom support plate of the present utility model;
FIG. 10 is a schematic view showing the internal structure of the sliding plate adjusting frame of the present utility model;
fig. 11 is a schematic structural view of a second embodiment of the body of the present utility model.
In the figure: 1-limiting plate, 2-motor, 3-cleaning mechanism, 4-fixed plate, 5-cleaning main body, 7-conveyer belt, 8-conveying clamping groove, 9-driving wheel, 10-first fixed mounting plate, 11-cleaning part, 12-supporting mounting plate, 13-conveying pipe, 14-first liquid storage tank, 15-first air pump, 16-first nozzle, 17-second fixed mounting plate, 18-blower, 19-second nozzle, 20-rotating shaft, 21-adsorption cleaning strip, 22-speed reducer, 23-first motor, 24-conveying groove, 25-bottom supporting plate, 26-protective frame, 27-threaded rod, 28-sliding rail, 29-sliding plate adjusting frame, 30-second motor, 31-discharging groove, 32-spraying pipe, 33-conveying spraying pipe, 34-connecting hose, 35-second liquid storage tank, 36-second air pump, 37-discharging connecting pipe, 38-water collecting frame.
Detailed Description
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the present application described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The utility model is further described below with reference to the accompanying drawings.
Example 1
A novel circuit board, as shown in figure 1, the surface treatment method comprises the following steps:
s1, single-sided etching is carried out on a printed circuit board, the temperature of etching solution is controlled to be 40 ℃, the etching time is controlled to be 3min, and a conductor pattern is formed;
s2, placing the printed circuit board in a treatment tank, and cleaning the conductor pattern on the surface of the etched printed circuit board for the first time, wherein the temperature of purified water in the cleaning process is 35 ℃;
s3, removing bubbles attached to the surface of the printed circuit board in the cleaning process;
s4, spraying a preflux liquid into the treatment tank, wherein the preflux liquid is made of imidazole compounds, the imidazole compounds are selected from 2-methylimidazole, and then a preflux film is formed on the conductor patterns on the surface of the bubble-removed printed circuit board, and the thickness of the preflux film is not less than 0.2 mu m;
s5, taking the printed circuit board out of the processing groove, and removing pre-flux liquid adhered to the printed circuit board;
and S6, finally, carrying out second cleaning on the printed circuit board, and conveying to the next working procedure after the cleaning is finished.
In the step S1, the etching solution comprises the following raw materials in parts by weight: 30 parts of polymeric ferric chloride, 4 parts of sulfuric acid, 10 parts of hydrochloric acid, 3 parts of copper nitrate and 52 parts of pure water; wherein sulfuric acid is a sulfuric acid solution with a concentration of 60%, and hydrochloric acid is a hydrochloric acid solution with a concentration of 37%.
Example 2
A novel circuit board, as shown in figure 1, the surface treatment method comprises the following steps:
s1, single-sided etching is carried out on a printed circuit board, the temperature of etching solution is controlled to be 50 ℃, the etching time is controlled to be 4 minutes, and a conductor pattern is formed;
s2, placing the printed circuit board in a treatment tank, and cleaning the conductor pattern on the surface of the etched printed circuit board for the first time, wherein the temperature of purified water in the cleaning process is 38 ℃;
s3, removing bubbles attached to the surface of the printed circuit board in the cleaning process;
s4, spraying a preflux liquid into the treatment tank, wherein the preflux liquid is made of imidazole compounds, the imidazole compounds are selected from 2-phenylimidazole, and then a preflux film is formed on the conductor patterns on the surface of the bubble-removed printed circuit board, and the thickness of the preflux film is not less than 0.2 mu m;
s5, taking the printed circuit board out of the processing groove, and removing pre-flux liquid adhered to the printed circuit board;
and S6, finally, carrying out second cleaning on the printed circuit board, and conveying to the next working procedure after the cleaning is finished.
In the step S1, the etching solution comprises the following raw materials in parts by weight: 35 parts of polymeric ferric chloride, 6 parts of sulfuric acid, 14 parts of hydrochloric acid, 2 parts of copper nitrate and 58 parts of pure water; wherein sulfuric acid is a sulfuric acid solution with a concentration of 60%, and hydrochloric acid is a hydrochloric acid solution with a concentration of 37%.
Example 3
A novel circuit board, as shown in figure 1, the surface treatment method comprises the following steps:
s1, single-sided etching is carried out on a printed circuit board, the temperature of etching solution is controlled at 60 ℃, the etching time is controlled at 3min, and a conductor pattern is formed;
s2, placing the printed circuit board in a treatment tank, and cleaning the conductor pattern on the surface of the etched printed circuit board for the first time, wherein the temperature of purified water in the cleaning process is 40 ℃;
s3, removing bubbles attached to the surface of the printed circuit board in the cleaning process;
s4, spraying a preflux liquid into the treatment tank, wherein the preflux liquid is prepared from imidazole compounds, the imidazole compounds are prepared by compounding 2-methylimidazole and 2-phenylimidazole according to a mass ratio of 1:1, and then forming a preflux film on a conductor pattern on the surface of the bubble-removed printed circuit board, wherein the thickness of the preflux film is not less than 0.2 mu m;
s5, taking the printed circuit board out of the processing groove, and removing pre-flux liquid adhered to the printed circuit board;
and S6, finally, carrying out second cleaning on the printed circuit board, and conveying to the next working procedure after the cleaning is finished.
In the step S1, the etching solution comprises the following raw materials in parts by weight: 40 parts of polymeric ferric chloride, 8 parts of sulfuric acid, 10-15 parts of hydrochloric acid, 4 parts of copper nitrate and 60 parts of pure water; wherein sulfuric acid is a sulfuric acid solution with a concentration of 60%, and hydrochloric acid is a hydrochloric acid solution with a concentration of 37%.
According to the comprehensive embodiments 1-3, the single-sided etching is performed on the circuit board by using the etching solution, the oxide layer on the surface of the circuit board can be further removed on the basis of etching the conductor pattern, a flat surface is provided, a preparation is provided for forming a preflux film, after the preflux film is shaped, the preflux film is thin and uniform in thickness, the comprehensive performance of the circuit board is improved, meanwhile, the whole surface treatment process is short, the batch production can be performed, and the market prospect is good.
Example 4
Referring to fig. 2 and 3, an embodiment of the present utility model is provided: the utility model provides a novel circuit board surface treatment method, including limiting plate 1, motor 2, cleaning mechanism 3, fixed plate 4, cleaning main part 5 and conveyer belt 7, fixed plate 4 fixed connection is at the both ends of cleaning main part 5, cleaning mechanism 3 fixed mounting is in the one end upper portion of cleaning main part 5, limiting plate 1 fixed connection is in the one end middle part of cleaning main part 5, motor 2 fixed mounting is outside one end of limiting plate 1, conveyer belt 7 is installed in the one end of cleaning main part 5 through limiting plate 1 rotation, can be with the continuous transportation of circuit board and continuous surface clearance by setting up conveyer belt 7 and utilizing the transport draw-in groove 8 that sets up on conveyer belt 7, the efficiency is improved, can be to the circuit board pre-cleaning through setting up first liquid storage pot 14 and first air pump 15 and first nozzle 16, can get rid of the bubble on the surface of printed circuit board through setting up second nozzle 19, the clearance to the surface of circuit board is convenient, can be to the surface of circuit board form the prefilming through setting up transport spray tube 33 and spray tube 32 and use 32 to the surface of circuit board can be made to get rid of the prefilming on the surface after the circuit board through setting up cleaning portion 11;
referring to fig. 4, driving wheels 9 are rotatably mounted inside two ends of a conveying belt 7, the conveying belt 7 is rotatably clamped inside clamping grooves formed in the driving wheels 9, conveying clamping grooves 8 are uniformly formed in the outer end face of the conveying belt 7, a circuit board to be cleaned is clamped and placed inside the conveying clamping grooves 8, and a motor 2 is started to drive the driving wheels 9 to rotate so that the conveying belt 7 and the conveying clamping grooves 8 rotate to enable the circuit board to be conveyed to the position right below a first nozzle 16;
referring to fig. 5 and 6, the cleaning mechanism 3 includes a first fixed mounting plate 10, a cleaning portion 11, a supporting mounting plate 12, a conveying pipe 13, a first liquid storage tank 14, a first air pump 15, a first nozzle 16, a second fixed mounting plate 17, an air blower 18 and a second nozzle 19, wherein the first fixed mounting plate 10 and the second fixed mounting plate 17 are distributed on two sides of the supporting mounting plate 12, the air blower 18 is fixedly mounted at one end bottoms of the first fixed mounting plate 10 and the second fixed mounting plate 17, the second nozzle 19 is uniformly and fixedly mounted at the bottom end of the supporting mounting plate 12, the second nozzle 19 is communicated with the air blower 18 through the conveying pipe 13, the first liquid storage tank 14 is fixedly mounted at one end upper portion of the second fixed mounting plate 17, the first air pump 15 is fixedly connected to the outer end of the first liquid storage tank 14, the first nozzle 16 is uniformly and fixedly mounted at one end bottom of the second fixed mounting plate 17, the first nozzle 16 is communicated with the inner bottom end of the first liquid storage tank 14 through a control valve, the cleaning portion 11 is fixedly mounted inside the first fixed mounting plate 10, the cleaning portion 19 plays a role of removing air bubbles through the second nozzle 19, the cleaning role is played through the cleaning role through the first nozzle 16, and the cleaning role is played through the pre-adsorption role;
referring to fig. 7, the cleaning part 11 includes a rotating shaft 20, an adsorption cleaning bar 21, a speed reducer 22 and a first motor 23, the first motor 23 is fixedly connected to the upper end of the speed reducer 22, the rotating shaft 20 is fixedly connected to the bottom end of the speed reducer 22, the adsorption cleaning bar 21 is uniformly and fixedly installed at the bottom edge of the rotating shaft 20, the rotating shaft 20 and the adsorption cleaning bar 21 are rotated by the first motor 23, and the rotating adsorption cleaning bar 21 can remove a preflux film on a circuit board, so that the circuit board is cleaned and cleaned;
referring to fig. 8, the cleaning main body 5 includes a conveying groove 24, a bottom supporting plate 25 and a protecting frame 26, the protecting frame 26 is fixedly installed at the upper end of the bottom supporting plate 25, and the conveying groove 24 is formed at the middle part of one end of the protecting frame 26;
referring to fig. 9, the bottom support plate 25 is symmetrically provided with discharge grooves 31 on both sides, a sliding rail 28 is fixedly installed in the bottom support plate 25, a sliding plate adjusting frame 29 is slidably installed in the sliding rail 28, a second motor 30 is fixedly installed at one end of the bottom support plate 25, a threaded rod 27 is rotatably clamped in the bottom support plate 25, and the discharge grooves 31 play a role in water and sewage drainage;
referring to fig. 10, a second liquid storage tank 35 is fixedly installed at one end of the sliding plate adjusting frame 29, a second air pump 36 is fixedly connected to one end of the second liquid storage tank 35, a conveying spray pipe 33 is uniformly and fixedly installed in the sliding plate adjusting frame 29, the conveying spray pipe 33 is communicated with the interior of the second liquid storage tank 35 through a connecting hose 34, spray pipes 32 are fixedly connected to the front ends of the conveying spray pipes 33, and a preflux film is formed on a circuit board by spraying preflux outwards through a discharge groove 31 at the front end of the conveying spray pipe 33 through the second air pump 36.
Referring to fig. 9, the threaded rod 27 is screwed into the bottom end of the sliding plate adjusting frame 29 for adjusting.
Referring to fig. 7, the material of the adsorption cleaning strip 21 is water-absorbing fabric, so that the adsorption cleaning strip 21 has a good adsorption cleaning effect and plays a role in cleaning.
Referring to fig. 2 and 3, the first fixing and mounting plate 10, the supporting and mounting plate 12 and the second fixing and mounting plate 17 are fixedly connected to the upper end of the protection frame 26, and play a role of fixing and supporting.
Referring to fig. 2 and 3, the conveyor belt 7 is rotatably installed inside the conveying groove 24, and the conveyor belt 7 is rotated to perform a conveying function.
Referring to fig. 2 and 3, the front end of the second nozzle 19 is inclined inward, the second nozzle 19, the first nozzle 16 and the cleaning portion 11 are located right above the conveyor belt 7, and the second nozzle 19 is used for cleaning bubbles.
Referring to fig. 2 and 3, the front end of the motor 2 is fixedly connected with a driving wheel 9 at one end, and the driving wheel 9 can be driven to rotate by the motor 2.
When the device is implemented, the conveying clamping groove 8 formed in the conveying belt 7 is utilized by the conveying belt 7 to continuously convey and clean the outer surface of the circuit board, the efficiency is improved, the circuit board can be pre-cleaned by the first liquid storage tank 14, the first air pump 15 and the first nozzle 16, bubbles on the surface of the printed circuit board can be removed by the second nozzle 19, the outer surface of the circuit board can be cleaned conveniently, a pre-flux film can be formed on the outer surface of the circuit board by the conveying spray pipe 33 and the spray pipe 32, and the pre-flux film on the outer surface can be removed by the cleaning part 11.
Example 5
On the basis of embodiment 4, as shown in fig. 11, water collecting frames 38 are fixedly installed at both sides of the bottom supporting plate 25, and a discharge connection pipe 37 is provided at the middle of the outer end of the water collecting frame 38.
In the present embodiment, in practice, the cleaning liquid discharged through the drain tank 31 can be collected through the water collecting frame 38, the cleaning and cleaning liquid drops are placed, and the cleaning liquid collected inside the water collecting frame 38 can be discharged through the drain connection pipe 37.
Working principle: firstly, the circuit board to be cleaned is clamped and placed in the conveying clamping groove 8, the motor 2 is started to drive the driving wheel 9 to rotate, so that the conveying belt 7 and the conveying clamping groove 8 rotate, the circuit board is conveyed to the position right below the first nozzle 16, at the moment, the cleaning solution in the first liquid storage tank 14 is sprayed out of the first nozzle 16 by the first air pump 15 to pre-clean the circuit board, the cleaned circuit board moves to the position right below the second nozzle 19 along with the rotation of the conveying belt 7, at the moment, the second nozzle 19 downwards sprays out a high-wind-speed wind body by the air blower 18 through the conveying pipe 13, residual bubbles on the circuit board are removed, at the moment, the rotating threaded rod 27 can enable the sliding plate adjusting frame 29 to slide to be close to one side of the conveying belt 7 by starting the second motor 30, then the discharging groove 31 at the front end of the conveying spray pipe 33 is enabled to spray out pre-flux through the second air pump 36, the circuit board is enabled to form a pre-flux film on the circuit board, the circuit board is enabled to rotate to the position right below the adsorption cleaning strip 21, at the moment, the first motor 23 enables the second nozzle 19 to spray out of high-wind speed wind body by the second nozzle 19 downwards through the conveying pipe 13, the residual bubbles on the circuit board are enabled to rotate, the residual bubbles on the circuit board can be cleaned through the rotating the rotary rod 20, the pre-cleaning solution can be cleaned through the rotary rod and the water collecting strip 21, the cleaning solution can be discharged through the water collecting groove 38, and the cleaning solution can be cleaned through the cleaning and the collecting and the cleaning strip can be discharged through the rotary rod 38, and the cleaning solution can be cleaned.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. The utility model provides a surface treatment device of circuit board, includes limiting plate (1), motor (2), clearance mechanism (3), fixed plate (4), clearance main part (5) and conveyer belt (7), its characterized in that: the cleaning device comprises a cleaning main body (5), a fixing plate (4), a limiting plate (1), a motor (2) and a conveyer belt (7), wherein the fixing plate is fixedly connected to two ends of the cleaning main body (5), the cleaning mechanism (3) is fixedly installed on the upper portion of one end of the cleaning main body (5), the limiting plate (1) is fixedly connected to the middle portion of one end of the cleaning main body (5), the motor (2) is fixedly installed outside one end of the limiting plate (1), and the conveyer belt (7) is rotatably installed inside one end of the cleaning main body (5) through the limiting plate (1);
the two ends of the conveying belt (7) are internally provided with driving wheels (9) in a rotating way, the conveying belt (7) is rotationally clamped in clamping grooves formed in the driving wheels (9), and conveying clamping grooves (8) are uniformly formed in the outer end face of the conveying belt (7);
the cleaning mechanism (3) comprises a first fixed mounting plate (10), a cleaning part (11), a supporting mounting plate (12), a conveying pipe (13), a first liquid storage tank (14), a first air pump (15), a first nozzle (16), a second fixed mounting plate (17), an air blower (18) and a second nozzle (19), wherein the first fixed mounting plate (10) and the second fixed mounting plate (17) are distributed on two sides of the supporting mounting plate (12), the air blower (18) is fixedly mounted at one end bottom of the first fixed mounting plate (10) and the second fixed mounting plate (17), the second nozzle (19) is uniformly and fixedly mounted at the bottom end of the supporting mounting plate (12), the second nozzle (19) is communicated with the air blower (18) through the conveying pipe (13), the first liquid storage tank (14) is fixedly mounted at one end upper part of the second fixed mounting plate (17), the first air pump (15) is fixedly connected with the outer end of the first liquid storage tank (14), the first nozzle (16) is uniformly and fixedly mounted at one end bottom of the second fixed mounting plate (17) is communicated with the first liquid storage tank (14) through the bottom of the first nozzle (16), the cleaning part (11) is fixedly arranged in the first fixed mounting plate (10);
the cleaning part (11) comprises a rotating shaft (20), an adsorption cleaning strip (21), a speed reducer (22) and a first motor (23), wherein the first motor (23) is fixedly connected to the upper end of the speed reducer (22), the rotating shaft (20) is fixedly connected to the bottom end of the speed reducer (22), and the adsorption cleaning strip (21) is uniformly and fixedly arranged at the edge of the bottom end of the rotating shaft (20);
the cleaning main body (5) comprises a conveying groove (24), a bottom supporting plate (25) and a protective frame (26), wherein the protective frame (26) is fixedly arranged at the upper end of the bottom supporting plate (25), and the conveying groove (24) is formed in the middle of one end of the protective frame (26);
the two sides of the bottom supporting plate (25) are symmetrically provided with discharge grooves (31), a sliding rail (28) is fixedly arranged in the bottom supporting plate (25), a sliding plate adjusting frame (29) is slidably arranged in the sliding rail (28), a second motor (30) is fixedly arranged at one end of the bottom supporting plate (25), and a threaded rod (27) is rotatably clamped in the bottom supporting plate (25);
a second liquid storage tank (35) is fixedly arranged at one end of the sliding plate adjusting frame (29), a second air pump (36) is fixedly connected to one end of the second liquid storage tank (35), a conveying spray pipe (33) is uniformly and fixedly arranged in the sliding plate adjusting frame (29), the conveying spray pipe (33) is communicated with the inside of the second liquid storage tank (35) through a connecting hose (34), and spray pipes (32) are fixedly connected to the front ends of the conveying spray pipes (33); the threaded rod (27) is rotationally inserted into the bottom end of the sliding plate adjusting frame (29) in a threaded manner; the adsorption cleaning strips (21) are made of water-absorbing fabric; the first fixed mounting plate (10) and the supporting mounting plate (12) and the second fixed mounting plate (17) are fixedly connected to the upper end of the protective frame (26); the conveying belt (7) is rotatably arranged in the conveying groove (24); the front end of the second nozzle (19) is obliquely arranged inwards, and the second nozzle (19), the first nozzle (16) and the cleaning part (11) are positioned right above the conveying belt (7).
2. A surface treatment apparatus for a circuit board according to claim 1, wherein: the front end of the motor (2) is fixedly connected with a driving wheel (9) at one end.
3. A surface treatment apparatus for a circuit board according to claim 2, wherein: the two sides of the bottom supporting plate (25) are fixedly provided with water collecting frames (38), and the middle part of the outer end of each water collecting frame (38) is provided with a discharge connecting pipe (37).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210025468.0A CN114554715B (en) | 2022-01-11 | 2022-01-11 | Circuit board surface treatment method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210025468.0A CN114554715B (en) | 2022-01-11 | 2022-01-11 | Circuit board surface treatment method |
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| CN114554715A CN114554715A (en) | 2022-05-27 |
| CN114554715B true CN114554715B (en) | 2023-06-27 |
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| CN202210025468.0A Active CN114554715B (en) | 2022-01-11 | 2022-01-11 | Circuit board surface treatment method |
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| JPS624885A (en) * | 1985-06-28 | 1987-01-10 | Hitachi Plant Eng & Constr Co Ltd | Method and device for local etching of cu circuit pattern on printed circuit board |
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| CN212517121U (en) * | 2020-07-13 | 2021-02-09 | 贵州富士亲旺光电制造有限公司 | Surface dirt cleaning device is used in production of harmless formula integrated circuit board |
| CN214458338U (en) * | 2021-03-05 | 2021-10-22 | 扬博科技股份有限公司 | Etching device with pre-etching process |
| CN113564597A (en) * | 2021-09-28 | 2021-10-29 | 南通汉瑞通信科技有限公司 | Spraying type etching equipment for printed circuit |
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2022
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624885A (en) * | 1985-06-28 | 1987-01-10 | Hitachi Plant Eng & Constr Co Ltd | Method and device for local etching of cu circuit pattern on printed circuit board |
| CN101254638A (en) * | 2008-03-10 | 2008-09-03 | 株洲科力通用设备有限公司 | Heating roller heating method and heating roller |
| CN102646616A (en) * | 2011-02-21 | 2012-08-22 | 芝浦机械电子株式会社 | Substrate cleaning apparatus, substrate cleaning method, display manufacturing apparatus and display manufacturing method |
| CN106955861A (en) * | 2017-04-19 | 2017-07-18 | 东莞宇宙电路板设备有限公司 | Guidance quality water cutter device |
| CN108928963A (en) * | 2018-07-23 | 2018-12-04 | 徐州工程学院 | A kind of mine wastewater treatment device |
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| CN214458338U (en) * | 2021-03-05 | 2021-10-22 | 扬博科技股份有限公司 | Etching device with pre-etching process |
| CN113564597A (en) * | 2021-09-28 | 2021-10-29 | 南通汉瑞通信科技有限公司 | Spraying type etching equipment for printed circuit |
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|---|---|
| CN114554715A (en) | 2022-05-27 |
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