CN114554677A - Flexible circuit board forming device and flexible circuit board forming method - Google Patents

Flexible circuit board forming device and flexible circuit board forming method Download PDF

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Publication number
CN114554677A
CN114554677A CN202110968931.0A CN202110968931A CN114554677A CN 114554677 A CN114554677 A CN 114554677A CN 202110968931 A CN202110968931 A CN 202110968931A CN 114554677 A CN114554677 A CN 114554677A
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CN
China
Prior art keywords
circuit board
flexible circuit
forming
jig
temperature
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CN202110968931.0A
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Chinese (zh)
Inventor
重冈赳志
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Nippon Mektron KK
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Nippon Mektron KK
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Publication of CN114554677A publication Critical patent/CN114554677A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Abstract

The invention provides a forming device and a forming method of a flexible circuit board. The forming device of the flexible circuit board comprises: the first forming clamp and the first bearing clamp the flexible circuit board borne by the first bearing clamp together, and the flexible circuit board is subjected to front forming at a first temperature at which the flexible circuit board does not generate plastic deformation; and a second forming jig which clamps the flexible circuit board, which is subjected to the pre-forming and is supported by the second supporting jig, together with a second supporting jig, and forms the flexible circuit board at a second temperature higher than the first temperature at which the flexible circuit board is plastically deformed.

Description

Flexible circuit board forming device and flexible circuit board forming method
Technical Field
The present invention relates to a flexible circuit board forming apparatus and a flexible circuit board forming method.
Background
Flexible circuit boards are widely used in electronic devices represented by smart phones and notebook computers.
In recent years, miniaturization of such electronic devices has been demanded. When manufacturing the electronic apparatus, bending or assembling of the flexible circuit board is performed. In manufacturing miniaturized electronic devices, space saving of flexible circuit boards is desired. That is, it is desirable to dispose the flexible circuit board in a limited space.
Therefore, it is required to form the flexible circuit board into a desired shape. Therefore, there is an increasing demand for forming such as bending of flexible circuit boards. In particular, a formation with a relatively small bending angle, bending radius and spring back is required. Based on these requirements, thermoforming of flexible circuit boards using thermoplastics is described in japanese patent laid-open nos. 2012-023133 and 2005-096408. In detail, japanese patent laid-open No. 2012-023133 describes forming of a flexible circuit board by heating using an oven. A forming apparatus for bending a flexible circuit board is described in japanese patent laid-open publication No. 2005-096408.
In the conventional thermoforming of a flexible circuit board, when the bending radius is small, internal destruction such as wiring breakage or interlayer peeling may occur due to bending stress of the flexible circuit board. In addition, when the thickness of the flexible circuit board is large due to a large insulating layer or a large number of layers, internal destruction or interlayer peeling due to the bending stress may occur.
Disclosure of Invention
The present invention has been completed based on the above-described technical recognition. The present invention aims to provide a flexible circuit board forming apparatus and a flexible circuit board forming method as described below. According to the molding apparatus and the molding method, even when the bending radius is small or the thickness of the flexible printed circuit board is large, the internal destruction and the interlayer peeling can be suppressed.
A flexible circuit board molding apparatus (first molding apparatus) according to a first aspect of the present invention molds a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated on each other, the flexible circuit board molding apparatus including: the first forming clamp and the first bearing clamp the flexible circuit board borne by the first bearing clamp together, and the flexible circuit board is subjected to front forming at a first temperature at which the flexible circuit board does not generate plastic deformation; and a second forming jig which clamps the flexible circuit board, which has been subjected to the pre-forming and is supported by the second supporting jig, together with a second supporting jig, and forms the flexible circuit board at a second temperature higher than the first temperature at which the flexible circuit board is plastically deformed.
In the first forming apparatus, it is preferable that the second forming jig is heated to the second temperature before the forming.
In addition, it is preferable that the first temperature is about 20 ℃ to about 30 ℃ and the second temperature is about 120 ℃ to about 200 ℃ in the first molding device.
Further, it is preferable that, in the first forming device, the second forming jig includes: the forming block and the second bearing clamp the flexible circuit board together; a support portion supporting the forming block; a thermocouple for measuring the temperature of the flexible circuit board clamped by the second bearing clamp and the forming block; and a heater heating the shaped block.
Further, it is preferable that, in the first forming apparatus, the second carrying jig includes a heater.
In addition, it is preferable that the first forming device further includes a restraining jig that maintains a bent state of the flexible circuit board carried on the second carrying jig.
In addition, the first forming device further includes a restricting jig stopper portion that fixes the restricting jig, which maintains the bent state of the flexible circuit board carried on the second carrying jig, to the second carrying jig.
In the first molding apparatus, it is preferable that the regulating jig further includes an opening portion for abutting the second molding jig against the flexible circuit board.
Further, it is preferable that, in the first forming apparatus, the first and second carrying jigs are respectively different carrying jigs.
Further, it is preferable that, in the first forming apparatus, the first carrying jig and the second carrying jig are the same carrying jig as each other.
Further, it is preferable that in the first molding device, the thermoplastic resin contains a liquid crystal polymer.
A flexible circuit board molding apparatus (second molding apparatus) according to a second aspect of the present invention is a flexible circuit board molding apparatus for molding a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated on each other, the flexible circuit board molding apparatus including: the first forming clamp and the first bearing clamp the flexible circuit board borne by the first bearing clamp together, and the flexible circuit board is formed at a first temperature at which the flexible circuit board is subjected to plastic deformation; and a second forming jig which clamps the flexible circuit board, which has been subjected to the forming and is supported by the second supporting jig, together with a second supporting jig, and post-forms the flexible circuit board at a second temperature lower than the first temperature and at which the flexible circuit board is not plastically deformed.
In the second molding apparatus, it is preferable that the first molding jig is heated to the first temperature before the molding is performed, and the second molding jig is cooled to the second temperature before the post-molding is performed.
In addition, it is preferable that the first temperature is about 120 ℃ to about 200 ℃ and the second temperature is about 20 ℃ to about 50 ℃ in the second forming device.
A flexible circuit board molding apparatus (third molding apparatus) according to a third aspect of the present invention is a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated on each other, the flexible circuit board molding apparatus including: the first forming clamp and the first bearing clamp the flexible circuit board borne by the first bearing clamp together, and the flexible circuit board is subjected to front forming at a first temperature at which the flexible circuit board does not generate plastic deformation; a second forming jig for clamping the flexible circuit board, which has been subjected to the pre-forming and is carried by the second carrying jig, together with a second carrying jig, and forming the flexible circuit board at a second temperature higher than the first temperature at which the flexible circuit board is plastically deformed; and a third forming jig which clamps the flexible circuit board, on which the forming has been performed and which is carried by the third carrying jig, together with a third carrying jig, and post-forms the flexible circuit board at a third temperature which is lower than the second temperature and at which the flexible circuit board does not undergo plastic deformation.
In the third molding apparatus, it is preferable that the second molding jig is heated to the second temperature before the molding is performed, and the third molding jig is cooled to the third temperature before the post-molding is performed.
In the third forming apparatus, the first temperature is preferably about 20 ℃ to about 30 ℃, the second temperature is preferably about 120 ℃ to about 200 ℃, and the third temperature is preferably about 20 ℃ to about 50 ℃.
Further, in the third forming apparatus, it is preferable that at least one of the first, second, and third carrying jigs is a carrying jig different from the other carrying jigs.
Further, it is preferable that, in the third forming apparatus, the first carrying jig, the second carrying jig, and the third carrying jig are the same carrying jig as each other.
In the first to third molding apparatuses, the plurality of insulating layers of the flexible printed circuit board are preferably laminated with each other via an adhesive layer.
A flexible circuit board forming method according to a first aspect of the present invention is a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated on each other, the flexible circuit board forming method including: a first step of clamping the flexible circuit board loaded on the first loading clamp by using a first loading clamp and a first forming clamp, and performing pre-forming on the flexible circuit board at a first temperature at which the flexible circuit board does not generate plastic deformation; and a second step of clamping the flexible circuit board, which has been subjected to the pre-forming and is carried by the second carrier jig, by a second carrier jig and a second forming jig, and forming the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board is plastically deformed.
A method of molding a flexible circuit board according to a second aspect of the present invention is a method of molding a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated to each other, the method including: a first step of clamping the flexible circuit board loaded on the first loading clamp by using a first loading clamp and a first forming clamp, and forming the flexible circuit board at a first temperature at which the flexible circuit board is plastically deformed; and a second step of clamping the flexible circuit board, which has been subjected to the forming and is carried by the second carrier jig, by a second carrier jig and a second forming jig, and post-forming the flexible circuit board at a second temperature lower than the first temperature and at which the flexible circuit board is not plastically deformed.
A method of molding a flexible circuit board according to a third aspect of the present invention is a method of molding a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated on each other, the method including: a first step of clamping the flexible circuit board loaded on the first loading clamp by using a first loading clamp and a first forming clamp, and performing pre-forming on the flexible circuit board at a first temperature at which the flexible circuit board does not generate plastic deformation; a second step of clamping the flexible circuit board, which has been subjected to the pre-forming and is carried by the second carrying jig, by a second carrying jig and a second forming jig, and forming the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board is plastically deformed; and a third step of clamping the flexible circuit board, which has been subjected to the forming and is carried by the third carrying jig, by a third carrying jig and a third forming jig, and post-forming the flexible circuit board at a third temperature lower than the second temperature and at which the flexible circuit board is not plastically deformed.
According to the present invention, it is possible to provide a flexible circuit board forming apparatus and a flexible circuit board forming method capable of suppressing internal destruction and interlayer peeling even when the bending radius is small or the thickness is thick.
Drawings
Fig. 1 is a configuration diagram of a flexible circuit board forming apparatus according to a first embodiment.
Fig. 2 is a configuration diagram of a first forming jig in the forming apparatus of the flexible circuit board according to the first embodiment.
Fig. 3 is a configuration diagram of a second forming jig in the forming apparatus for the flexible circuit board according to the first embodiment.
Fig. 4 is a configuration diagram of a first carrying jig in the flexible circuit board forming apparatus according to the first embodiment.
Fig. 5 is a flowchart showing a series of flows of the method of forming a flexible circuit board according to the first embodiment.
Fig. 6 (a) and (b) are diagrams for explaining a method of carrying the flexible circuit board in the first embodiment to the first carrying jig.
Fig. 7 is a diagram showing a state in which the flexible circuit board is carried by the first carrying jig in the first embodiment.
Fig. 8 is a diagram for explaining the front molding of the flexible circuit board in the first embodiment, and is a diagram showing a state before the flexible circuit board is clamped by the first carrying jig and the first molding jig.
Fig. 9 is a diagram for explaining the front molding of the flexible circuit board in the first embodiment, and is a diagram showing a state in which the flexible circuit board is sandwiched by a first carrying jig and a first molding jig.
Fig. 10 is a diagram for explaining front molding of the flexible circuit board in the first embodiment, and is a diagram showing a state after the flexible circuit board is clamped by the first carrying jig and the first molding jig.
Fig. 11 is a diagram for explaining the forming of the flexible circuit board in the first embodiment, and shows a state before the flexible circuit board is held by the second holding jig and the second forming jig.
Fig. 12 is a diagram for explaining the forming of the flexible circuit board in the first embodiment, and is a diagram showing a state in which the flexible circuit board is held by the second holding jig and the second forming jig.
Fig. 13 is a diagram for explaining the forming of the flexible circuit board in the first embodiment, and is a diagram showing a state after the flexible circuit board is held by the second holding jig and the second forming jig.
Fig. 14 is a configuration diagram of a flexible circuit board forming apparatus according to a second embodiment.
Fig. 15 is a structural diagram of a second forming jig in the forming apparatus for the flexible circuit board according to the second embodiment.
Fig. 16 is a flowchart showing a series of flows of a method of forming a flexible circuit board according to the second embodiment.
Fig. 17 is a diagram for explaining the post-forming of the flexible circuit board in the second embodiment, and is a diagram showing a state before the flexible circuit board is held by the second carrying jig and the second molding jig.
Fig. 18 is a diagram for explaining the post-forming of the flexible circuit board in the second embodiment, and is a diagram showing a state in which the flexible circuit board is held by the second carrying jig and the second molding jig.
Fig. 19 is a diagram for explaining the post-forming of the flexible circuit board in the second embodiment, and is a diagram showing a state after the flexible circuit board is held by the second carrying jig and the second molding jig.
Fig. 20 is a configuration diagram of a flexible circuit board forming apparatus according to a third embodiment.
Fig. 21 is a flowchart showing a series of flows of a method of forming a flexible circuit board according to a third embodiment.
Fig. 22 is a configuration diagram of a restricting jig of a flexible circuit board.
Fig. 23 is a perspective view for explaining a regulating jig for maintaining a bent state of the flexible circuit board.
Fig. 24 is a sectional view for explaining a restricting jig for maintaining a bent state of the flexible circuit board.
Fig. 25 is a configuration diagram of a restricting jig of a flexible circuit board having a restricting jig stopper.
Fig. 26 is a perspective view illustrating a restricting jig having a restricting jig stopper portion for maintaining a bent state of a flexible circuit board.
Fig. 27 is a sectional view illustrating a restricting jig having a restricting jig stopper portion for maintaining a bent state of a flexible circuit board.
Fig. 28 is a configuration diagram of a regulation jig of a flexible circuit board having an opening portion.
Fig. 29 is a perspective view illustrating a regulating jig having an opening portion for maintaining a bent state of a flexible circuit board.
Fig. 30 is a sectional view illustrating a regulating jig having an opening portion for maintaining a bent state of a flexible circuit board.
Fig. 31 is a sectional view showing an example of a flexible circuit board.
Fig. 32 is a diagram showing an example of the flexible circuit board after molding.
Fig. 33 is a graph showing an example of a change with time in the bending angle of the flexible circuit board.
Detailed Description
Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same reference numerals are given to components having equivalent functions. In addition, the drawings are schematically depicted. Therefore, in each drawing, the size of the components, the positional relationship, the size, the ratio, and the like of the components may be different from those in reality.
(first embodiment)
The structure of a flexible circuit board molding device (FPC molding device) 1 according to the present embodiment will be described with reference to fig. 1 to 4. Fig. 1 is a view showing the entire structure of an FPC molding device 1. Fig. 2 is a side view of the first forming jig 10 of the FPC forming device 1. Fig. 3 is a side view of the second forming clamp 20. Also, fig. 4 is a side view of the loading jig 40.
As shown in fig. 1, the FPC molding device 1 of the present embodiment includes a first molding jig 10, a second molding jig 20, a carrier jig 40, a case 50, and a rail 60.
As described below, the FPC molding device 1 of the present embodiment is configured to mold the flexible printed circuit FPC including a plurality of insulating layers which are laminated on each other and which contain a thermoplastic resin. The insulating layer may be formed to substantially contain only the thermoplastic resin.
In the flexible printed circuit FPC, the thermoplastic resin may be formed to contain a liquid crystal polymer or may be formed to substantially contain only a liquid crystal polymer. For example, as the thermoplastic resin, for example, a low melting point Liquid Crystal Polymer (LCP) material may also be applied. That is, a plurality of low melting point LCP materials may be laminated on each other without an adhesive layer, but may be laminated on each other by being thermally fused to each other. On the other hand, a plurality of insulating layers (insulators) of the flexible circuit board FPC may be laminated with each other via an adhesive layer.
Fig. 2 is a side view of the first forming jig 10 shown in fig. 1, as viewed from the positive Y-axis direction. The first molding jig 10 includes a support 11 movable in the Z-axis direction, a molding block 12 connected to a lower end of the support 11, and a thermocouple 13 fixed to the molding block 12. The first forming jig 10 and the carrying jig 40 clamp the flexible circuit board FPC together, and the flexible circuit board FPC is subjected to front forming.
The support portion 11 extends in the Z-axis direction and supports the forming weight 12. The support portion 11 is made of a rigid member such as aluminum, iron, or stainless steel. The forming block 12 abuts against the flexible circuit board FPC to form the flexible circuit board FPC. The forming block 12 is made of a member having rigidity capable of forming the flexible printed circuit FPC, such as aluminum, iron, or stainless steel, similarly to the support 11.
The thermocouple 13 measures the temperature of the shaped mass 12. In the present embodiment, the temperature of the flexible circuit board FPC is grasped based on the temperature of the molding block 12 measured by the thermocouple 13. Thus, the thermocouple 13 is disposed at one end of the forming block 12. However, the thermocouple 13 is not limited to be provided at one end of the forming block 12, and may be provided at any position suitable for measuring the temperature of the forming block 12.
Fig. 3 shows a side view of the second forming jig 20 as viewed from the positive Y-axis direction, similarly to the first forming jig 10 of fig. 2. The second molding jig 20 includes a support portion 21 movable in the Z-axis direction, a molding block 22 connected to a lower end of the support portion 21, and a thermocouple 23 fixed to the molding block 22, similarly to the first molding jig 10. The second molding jig 20 is provided with a heater 24. The second forming jig 20 and the carrying jig 40 clamp the flexible circuit board FPC together to form the flexible circuit board FPC.
The support portion 21 and the forming block 22 of the second forming jig 20 are made of aluminum, iron, stainless steel, or the like. However, since the second molding tool 20 is heated by the heater 24, the support portion 21 and the molding block 22 may be made of a member having heat resistance as well as rigidity. The thermocouple 23 also measures the temperature of the forming weight 22 in the same manner as the thermocouple 13 of the first forming jig 10. The temperature of the flexible circuit board FPC is grasped based on the temperature of the shaping block 22.
In fig. 3, a heater 24 is assembled to a forming block 22. Also, the forming block 22 is heated by the heater 24 to a temperature at which the flexible circuit board FPC is plastically deformed. The heater 24 may be an electrothermal heater, for example. The location of the heater 24 is not limited to the center of the forming block 22. That is, the heater 24 may be provided at any position suitable for heating and plastically deforming the flexible printed circuit FPC.
Fig. 4 is a side view of the carrier jig 40 as viewed from the positive Y-axis direction. The carrying jig 40 clamps the flexible circuit board FPC in cooperation with the first molding jig 10 or the second molding jig 20 described above. Therefore, the carrier jig 40 has rigidity capable of holding the flexible circuit board FPC and heat resistance capable of withstanding heating by the heater 24 of the second molding jig 20.
Therefore, the support jig 40 may be made of a high temperature resistant resin such as Polyetheretherketone (PEEK) in addition to a metal such as aluminum, iron, or stainless steel. That is, the bearing jig 40 may be made of a metal, a resin material, or the like having a heat-resistant temperature corresponding to the processing temperature. For example, acrylic resin may be selected when the material of the carrier jig 40 is processed at a low temperature of about 120 ℃ or lower, while metal such as aluminum may be selected when the material is processed at a high temperature of about 300 ℃ or higher. As shown in fig. 4, the load-bearing clamp 40 has a ramp 40F1 and a ramp 40F 2. These two inclined surfaces are opposed to the forming block 12 or the forming block 22, and together with them, clamp the flexible circuit board FPC.
As shown in fig. 1, a case 50 is provided to cover the first forming jig 10, the second forming jig 20, and the carrying jig 40 existing at a position opposite to each forming jig. The case 50 protects the flexible circuit board FPC from contamination by dust and the like. The case 50 is made of reinforced plastic or the like. The tank 50 has an inlet 50a and an outlet 50 b. The inlet 50a is used for carrying the flexible circuit board FPC before molding into the inside of the case. The outlet 50b is used for carrying out the flexible circuit board FPC after the molding.
A driving device (not shown) for moving the support portions 11 and 21 in the Z-axis direction is provided in the case 50. The upper ends of the support portions 11, 21 are connected to the drive mechanism. The support portions 11 and 21 may move up and down in the Z-axis direction in conjunction with each other.
As shown in fig. 1, the rail 60 is disposed along the Y-axis direction. The rail 60 moves the loading jig 40 in the positive Y-axis direction. In the present embodiment, the receiving jig 40 is attachable to and detachable from the rail 60.
Next, a method of forming a flexible circuit board by the FPC forming device 1 will be described with reference to fig. 5 to 13.
< method for Forming FPC of Flexible printed Circuit Board >
Fig. 5 is a flowchart showing a series of flows of the method of forming the flexible printed circuit FPC according to the present embodiment.
In the method of molding the flexible circuit board FPC according to the present embodiment, first, the flexible circuit board FPC is fixed to the carrier jig 40 (step S100). In detail, the flexible circuit board FPC is fixed to one inclined surface (inclined surface 40F1 or inclined surface 40F2) of the carrier jig 40.
Fig. 6 (a) shows a view of the support jig 40 shown in fig. 4 as viewed from the X-axis negative direction. In fig. 6 (a), the inclined surface 40F1 of the loading jig 40 is shown. Further, the inclined surface 40F1 has fixing guide pins 42a, 42b, 42c for fixing the flexible circuit board FPC.
On the other hand, fig. 6 (a) shows an inverted t-shaped flexible printed circuit FPC. Fig. 6 (a) also shows the fixing points P1, P2, P3 of the flexible circuit board FPC. When the flexible circuit board FPC is fixed to the mounting jig 40, the flexible circuit board FPC is mounted so that the fixing points P1, P2, and P3 correspond to the fixing guide pins 42a, 42b, and 42c of the inclined surface 40F 1.
Thereby, as shown in fig. 6 (b), the flexible circuit board FPC is fixed to the carrier jig 40 so as not to slip off the inclined surface 40F 1. Fig. 7 is a side view of the carrier jig 40 and the flexible printed circuit board FPC shown in fig. 6 (b) as viewed from the positive Y-axis direction.
In addition, the fixing method of fixing the flexible circuit board FPC to the carrier jig 40 is not limited to the above-described method. For example, the number of the fixed guide pins 42 is not limited to 3, and may be any number such as 2, 4, or 5. Instead of providing the fixed guide pins 42, a counter bore corresponding to the shape of the flexible circuit board FPC may be formed in the inclined surface of the carrier jig 40, or a counter bore corresponding to the shape of the flexible circuit board FPC may be formed in the inclined surface of the carrier jig 40 in addition to the fixed guide pins 42. That is, the flexible circuit board FPC may be fixed to the mounting jig 40 by fitting the flexible circuit board FPC to the counterbore processed portion.
Referring again to fig. 5, the description of the molding method of the present embodiment is continued. After the flexible circuit board FPC is fixed to the carrier jig 40 as described above, the carrier jig 40 carrying the flexible circuit board FPC is moved to a position corresponding to the first molding jig 10 (a position directly below the first molding jig 10 in the present embodiment) by the rail 60. Then, the flexible circuit board FPC carried on the carrying jig 40 is held by the carrying jig 40 and the first molding jig 10, and the pre-molding is performed at the first temperature (step S102).
In the present embodiment, the first temperature is a temperature to the extent that the flexible circuit board FPC does not undergo plastic deformation. Preferably, the first temperature is, for example, from about 20 ℃ to about 30 ℃. In addition, it is preferable that the holding time (forming time) at the first temperature for holding the flexible circuit board FPC is, for example, about 120 seconds. The pre-forming process includes a process of bending the flexible printed circuit FPC at a desired angle at the first temperature.
Here, the pre-forming in step S102 will be described in detail with reference to fig. 8 to 10. As shown in fig. 8 to 10, the first molding jig 10 is driven by a driving unit (not shown) to slide in the Z-axis direction. Fig. 8 shows that the carrier clamp 40 carrying the flexible circuit board FPC is located directly below the first forming clamp 10. Further, fig. 8 shows a state before the flexible circuit board FPC is held by the carrier jig 40 and the first molding jig 10.
In the state (clamped state) shown in fig. 9, the first mold 10 is moved from the state of fig. 8 in the negative Z-axis direction, and the flexible circuit board FPC is clamped by the carrier jig 40 and the first mold 10. The gap between the load-receiving jig 40 and the first molding jig 10 in the clamped state is controlled to a predetermined value. The gap is preferably set to the same extent as the thickness of the flexible circuit board FPC, for example. This can suppress the flexible circuit board FPC from being pressed excessively.
In fig. 9, the forming block 12 and the carrier jig 40 clamp the flexible circuit board FPC so that the bending portion (concave portion) E1 of the forming block 12 and the bending portion (convex portion) E2 of the carrier jig 40 are fitted to each other. Therefore, the flexible circuit board FPC is bent at the bending angle θ in the bending processed portions E1, E2. By freely setting the bending angle θ, the flexible printed circuit FPC can be bent at an arbitrary angle.
Fig. 10 shows a state where the first mold 10 moves in the positive Z-axis direction from the state of fig. 9, and the flexible printed circuit FPC is bent. That is, fig. 10 shows a state after the flexible circuit board FPC is sandwiched by the carrier jig 40 and the first molding jig 10. The above is the pre-forming of the flexible circuit board FPC according to step S102.
Referring again to fig. 5, the steps subsequent to step S102 will be described. The flexible circuit board FPC previously molded in step S102 is moved together with the carrier jig 40 to a position corresponding to the second molding jig 20 (a position directly below the second molding jig 20 in the present embodiment) by the rail 60. Then, the flexible circuit board FPC held by the holding jig 40 is held by the holding jig 40 and the second molding jig 20 and is molded at the second temperature (step S104).
In the present embodiment, the second temperature is higher than the first temperature. Specifically, the second temperature is a temperature at which the flexible printed circuit FPC is plastically deformed and at which the adhesive layer that bonds the insulating layers together does not dissolve out of the insulating layers. Preferably, the second temperature is, for example, from about 120 ℃ to about 200 ℃. In addition, it is preferable that the holding time for holding the flexible circuit board FPC at the second temperature is, for example, about 120 seconds. The forming process includes a process of plastically deforming the flexible printed circuit FPC at the second temperature and a process of maintaining the bent shape.
Here, the forming in step S104 will be described in detail with reference to fig. 11 to 13. As shown in fig. 11 to 13, the second mold 20 is driven by a driving unit (not shown) and slides in the Z-axis direction, similarly to the first mold 10. Preferably, the forming block 22 is preheated to the second temperature by the heater 24.
Fig. 11 shows a state before the carrier jig 40 is positioned right under the second molding jig 20 and the flexible circuit board FPC is held by the carrier jig 40 and the second molding jig 20.
In the state shown in fig. 12, the second jig 20 is moved from the state shown in fig. 11 in the negative Z-axis direction, and the flexible printed circuit FPC is held between the carrier jig 40 and the second jig 20. In this case, the gap between the support jig 40 and the second molding jig 20 is set in advance as in the case of the first molding jig 10. Preferably, the gap is set to the same extent as the thickness of the flexible circuit board FPC, for example. This can suppress the flexible circuit board FPC from being pressed excessively.
In fig. 12, similarly to the first mold 10, the molding block 22 and the carrier jig 40 clamp the flexible circuit board FPC so that the bending portion (concave portion) E3 of the molding block 22 and the bending portion (convex portion) E2 of the carrier jig 40 are fitted to each other. Therefore, the flexible circuit board FPC is bent at the bending angle θ in the bending processed portions E3, E2. By freely setting the bending angle θ, the flexible printed circuit FPC can be bent at an arbitrary angle. In addition, it is preferable that the shape of the bent processed portion E1 of the first molding jig 10 and the shape of the bent processed portion E3 of the second molding jig 20 are identical to each other.
Fig. 13 shows that the second forming jig 20 is moved in the positive Z-axis direction from the state shown in fig. 12, and the flexible printed circuit FPC is plastically deformed to maintain the bent state. That is, fig. 13 shows a state after the flexible circuit board FPC is held by the carrier jig 40 and the second molding jig 20. By completing this step S104, the formation of the flexible circuit board FPC of the present embodiment is ended.
The method of forming a flexible circuit board according to the present embodiment includes: a first step (step S102) of clamping the flexible circuit board FPC held by the holding jig 40 by using the holding jig 40 and the first forming jig 10, and performing pre-forming on the flexible circuit board FPC at a first temperature; and a second step (step S104) of holding the flexible printed circuit FPC, which has been molded before and is held by the holding jig 40 and the second molding jig 20, and molding the flexible printed circuit FPC at a second temperature higher than the first temperature and at which the flexible printed circuit FPC is plastically deformed.
In such a first embodiment, after the pre-forming is performed at the first temperature at which the flexible circuit board FPC does not undergo plastic deformation, the forming is performed at the second temperature at which the flexible circuit board FPC undergoes plastic deformation. Thus, according to the present embodiment, the bending stress acting on the flexible printed circuit FPC can be relaxed. As a result, even when a flexible printed circuit FPC having a large plate thickness is molded or when the bending radius is small, the occurrence of internal fracture and interlayer peeling can be suppressed.
Further, according to the first embodiment, the forming blocks 22 of the second forming jig 20 are heated in advance. Therefore, the molding in which the flexible circuit board FPC is plastically deformed can be performed immediately after the flexible circuit board FPC is sandwiched. Therefore, the time required for molding the flexible circuit board FPC can be shortened.
In addition, in the front molding and forming of the flexible circuit board FPC in the present embodiment, the first and second molding jigs 10 and 20 are slid in the direction perpendicular to the moving direction of the rail 60. That is, the first and second molding tools 10 and 20 slide in the Z-axis direction. But not limited thereto, the pre-forming and the forming may be performed in a direction parallel to the rail 60. In this case, the first and second molding tools 10 and 20 may be configured to slide in the X-axis direction or the Y-axis direction.
In addition, in the present embodiment, the support portion 11 of the first molding jig 10 and the support portion 21 of the second molding jig 20 slide in the Z-axis direction in conjunction with each other. Therefore, the holding time in the pre-forming performed at the first temperature and the holding time in the forming performed at the second temperature are both the same time (about 120 seconds). On the other hand, in the present embodiment, the first and second molding tools 10 and 20 may not slide in conjunction with each other. That is, the clamping time for the pre-forming and the clamping time for the forming may be set separately. For example, the respective clamping times (molding times) may be set independently according to any appropriate conditions for performing the pre-molding and the molding.
In addition, in the present embodiment, in the front molding and forming of the flexible circuit board FPC, the concave-shaped first molding jig 10 and the concave-shaped second molding jig 20 and the convex-shaped carrier jig 40 are fitted to each other. However, in the pre-forming and forming of the flexible circuit board FPC in the present embodiment, the above-described structure is not essential. For example, the front molding and forming of the flexible circuit board FPC may be performed by using the first and second molding jigs 10 and 20 having a convex shape and the carrier jig 40 having a concave shape. That is, the front molding and forming of the flexible circuit board FPC may also be performed using the first molding jig 10, the second molding jig 20, and the carrier jig 40 of any appropriate shape.
In addition, in the molding of the flexible circuit board FPC described above, the second molding jig 20 is heated by the heater 24. But not limited thereto, the carrying jig 40 may also be heated at the time of forming. That is, the carrier jig 40 may be provided with a heater, and the carrier jig 40 may be heated when the flexible circuit board FPC is molded.
In the FPC molding apparatus 1 and the FPC molding method according to the present embodiment described above, the same carrier jig 40 is used. That is, in a state where the flexible circuit board FPC is mounted on the same carrier jig 40, the carrier jig 40 is moved by the rails 60 in the positive Y-axis direction to positions corresponding to the first and second molding jigs 10 and 20. Then, the flexible circuit board is held at the respective positions by the first molding jig 10 and the carrier jig 40, or by the second molding jig 20 and the carrier jig 40. The former forming and shaping are carried out in this way.
The present embodiment is not limited to this, and can be implemented even if a plurality of different load-bearing jigs are used. That is, a pair of the first and second carrier jigs different from each other may be fixed to the positions corresponding to the first and second molding jigs 10 and 20, respectively. In this case, after the flexible circuit board FPC is sandwiched by the first carrier jig and the first molding jig 10 for front molding, the front molded flexible circuit board FPC is detached from the first carrier jig. Then, the flexible circuit board FPC detached from the first carrying jig is carried on the second carrying jig. Then, the flexible circuit board FPC is held by a second carrier jig and a second molding jig 20 for molding. The front forming and shaping of the flexible circuit board FPC can also be achieved as such.
(second embodiment)
Next, a second embodiment of the present invention will be explained. In the first embodiment described above, in the molding of the flexible printed circuit board FPC, the pre-molding is performed at a temperature at which the flexible printed circuit board FPC does not undergo plastic deformation, and then the molding is performed at a temperature at which the flexible printed circuit board FPC undergoes plastic deformation. In the second embodiment, the pre-forming is not performed, and after the forming is performed at a temperature at which the flexible printed circuit FPC is plastically deformed, the post-forming is performed while cooling the flexible printed circuit FPC. Hereinafter, the description will be focused on the differences from the first embodiment.
Fig. 14 is a structural view of the entire flexible circuit board molding apparatus (FPC molding apparatus) 1A according to the present embodiment. In fig. 14, the same components as those of the first embodiment are denoted by the same reference numerals.
The FPC molding device 1A of the present embodiment includes a first molding jig 20, a second molding jig 30, a carrier jig 40, a case 50, and a rail 60.
The first molding jig 20 is the same as the second molding jig 20 in the first embodiment. That is, the first molding jig 20 of the present embodiment includes the support portion 21, the molding block 22, the thermocouple 23, and the heater 24 as described with reference to fig. 3 in the first embodiment. Further, the first molding jig 20 and the carrier jig 40 clamp the flexible circuit board FPC together to mold the flexible circuit board FPC.
Fig. 15 is a side view of the second molding jig 30 as viewed from the positive Y-axis direction of fig. 14. The second molding jig 30 includes a support portion 31 movable in the Z-axis direction, a molding block 32 connected to a lower end of the support portion 31, and a thermocouple 33 fixed to the molding block 32. The second molding jig 30 further includes: a cooling section 34 for cooling the flexible circuit board FPC heated by the first mold 20; an inflow pipe 35 into which a cooling medium flows; and an outflow pipe 36 through which the cooling medium flows out. The second forming jig 30 and the carrying jig 40 clamp the flexible circuit board FPC together, and post-form the flexible circuit board FPC.
The cooling unit 34 of the second molding jig 30 can be a water-cooled or air-cooled cooling unit, for example. Therefore, water or air as the cooling medium flows through the inflow pipe 35 and the outflow pipe 36. However, the present invention is not limited to the water-cooled or air-cooled cooling unit, and peltier elements may be used as the cooling unit 34. In this case, the inflow tube 35 and the outflow tube 36 are not required.
The configuration of the FPC molding device 1A of the present embodiment is as described above. Next, a method of forming a flexible circuit board according to the present embodiment will be described with reference to fig. 16 to 19.
< method for Forming FPC of Flexible printed Circuit Board >
Next, a method of forming the flexible printed circuit FPC by the FPC forming apparatus 1A will be described. Fig. 16 is a flowchart showing a series of flows of the method of forming the flexible circuit board FPC according to the second embodiment.
In the method of molding the flexible circuit board FPC according to the present embodiment, first, the flexible circuit board FPC is fixed to the carrier jig 40 (step S200). This step is the same as step S100 of the first embodiment. That is, as in fig. 6 and 7, the flexible circuit board FPC is fixed to one inclined surface of the carrier jig 40.
Next, the carrier jig 40 carrying the flexible circuit board FPC is moved to a position corresponding to the first molding jig 20 (a position directly below the first molding jig 20 in the present embodiment) by the rail 60. Then, the flexible circuit board FPC held by the holding jig 40 is held by the holding jig 40 and the first molding jig 20 and is molded at the first temperature (step S202).
In the present embodiment, the first temperature is a temperature at which the flexible printed circuit FPC is plastically deformed and at which the adhesive layer that bonds the insulating layers together does not dissolve out of the insulating layers. Preferably, the first temperature is, for example, from about 120 ℃ to about 200 ℃. In addition, it is preferable that the holding time at the first temperature for holding the flexible circuit board FPC is, for example, about 120 seconds.
The operation of the first molding tool 20 in step S202 is the same as that described in the first embodiment with reference to fig. 8 to 10.
Next, the flexible circuit board FPC molded in step S202 is moved together with the carrier jig 40 to a position corresponding to the second molding jig 30 (in the present embodiment, a position directly below the second molding jig 30) by the rail 60. Then, the flexible circuit board FPC held by the holding jig 40 is held by the holding jig 40 and the second molding jig 30, and post-molding is performed at a second temperature (step S204).
In the present embodiment, the second temperature is a temperature lower than the first temperature. That is, the second temperature is a temperature at which the flexible circuit board FPC after the plastic deformation is cooled. Preferably, the second temperature is, for example, from about 20 ℃ to about 50 ℃. In addition, it is preferable that the holding time at the second temperature for holding the flexible circuit board FPC is, for example, about 120 seconds.
In some cases, the flexible printed circuit FPC includes a copper foil layer in addition to an insulating layer and an adhesive layer. There is a case where, in the case of cooling the flexible circuit board FPC from the first temperature to the second temperature, spring back occurs in the insulating layer due to the rigidity of the copper foil layer.
Therefore, in order to suppress occurrence of springback in the copper foil layer of the flexible circuit board FPC, in the present embodiment, the flexible circuit board FPC is sandwiched by the carrier jig 40 and the second molding jig 30 while the flexible circuit board FPC is cooled from the first temperature to the second temperature. That is, the post-forming is a process for suppressing the springback of the insulating layer by cooling the flexible circuit board FPC to the second temperature.
Here, the post-forming in step S204 will be described in detail with reference to fig. 17 to 19. As shown in fig. 17 to 19, the second forming jig 30 is driven by a driving unit (not shown) and slides in the Z-axis direction. Then, the forming block 32 is cooled to the second temperature by the cooling unit 34.
Fig. 17 shows a case where the carrier jig 40 carrying the flexible circuit board FPC is located directly below the second molding jig 30. Fig. 17 shows a state before the flexible circuit board FPC is held by the holding jig 40 and the second molding jig 30. In addition, the flexible circuit board FPC is already bent because it is molded in step S202.
In the state (clamped state) shown in fig. 18, the second mold 30 is moved from the state shown in fig. 17 in the negative Z-axis direction, and the flexible circuit board FPC is clamped by the carrier jig 40 and the second mold 30. The gap between the holding jig 40 and the second molding jig 30 in this clamped state is controlled to a predetermined value. Preferably, the gap is set to the same extent as the thickness of the flexible circuit board FPC, for example. This can suppress the flexible circuit board FPC from being pressed excessively.
In fig. 18, the forming block 32 and the carrier jig 40 clamp the flexible circuit board FPC so that the bending portion (concave portion) E4 of the forming block 32 and the bending portion (convex portion) E2 of the carrier jig 40 are fitted to each other. Therefore, the flexible circuit board FPC is bent at the bending angle θ in the bending processed portions E4, E2. By freely setting the bending angle θ, the flexible printed circuit FPC can be bent at an arbitrary angle. In addition, it is preferable that the shape of the bent processed portion E3 of the first molding jig 20 and the shape of the bent processed portion E4 of the second molding jig 30 are identical to each other.
In the state shown in fig. 19, the second jig 30 moves in the positive Z-axis direction from the state shown in fig. 18, and the flexible printed circuit FPC maintains the bent state. By completing step S204, the flexible circuit board forming of the present embodiment is terminated.
The method of forming a flexible circuit board according to the present embodiment includes: a first step (step S202) of clamping the flexible circuit board FPC held by the holding jig 40 by using the holding jig 40 and the first molding jig 20, and molding the flexible circuit board FPC at a first temperature at which the flexible circuit board FPC is plastically deformed; and a second step (step S204) of clamping the formed flexible circuit board FPC held by the holding jig 40 and the second molding jig 30, and post-molding the flexible circuit board FPC at a second temperature lower than the first temperature.
According to the second embodiment, after the forming is performed at the first temperature at which the flexible circuit board FPC is plastically deformed, the post-forming is performed at the second temperature at which the flexible circuit board FPC is cooled. This can suppress occurrence of springback in the insulating layer due to the rigidity of the copper foil layer of the flexible printed circuit FPC.
Further, according to the second embodiment, the forming blocks 22 of the first forming jig 20 are heated in advance, as in the first embodiment. Therefore, the forming of the plastic deformation of the flexible circuit board FPC can be performed immediately after the flexible circuit board FPC is sandwiched. Therefore, the time required for molding the flexible circuit board FPC can be shortened.
In addition, the forming block 32 of the second forming jig 30 is cooled in advance. Therefore, the post-forming of the flexible circuit board FPC can be performed immediately after the flexible circuit board FPC is sandwiched. Therefore, the time required for post-forming of the flexible circuit board FPC can be shortened.
In addition, as in the first embodiment, the forming and the post-forming in the present embodiment are not limited to the above-described direction perpendicular to the rail 60, and may be performed along the direction parallel to the rail 60. In this case, the first and second molding tools 20 and 30 may be configured to slide in the X-axis direction or the Y-axis direction. In addition. In the present embodiment, the time for the molding (clamping time) performed at the first temperature and the time for the post-molding (clamping time) performed at the second temperature are also about 120 seconds. On the other hand, the clamping time for molding and the clamping time for post-molding may be set independently. For example, the molding time may be set independently according to any appropriate conditions for performing the molding and the post-molding. Further, the first and second molding tools 20 and 30 may be slid independently of each other at set times.
In addition, in the molding of the flexible circuit board FPC described above, the first molding jig 20 is heated by the heater 24. But not limited thereto, the carrying jig 40 may also be heated at the time of forming. That is, the carrier jig 40 may be provided with a heater, and the carrier jig 40 may be heated when the flexible circuit board FPC is molded.
In the FPC molding device 1A and the FPC molding method according to the present embodiment, the same carrier jig 40 is used. However, the present embodiment is not limited to this, and can be implemented even by using a plurality of different load-bearing jigs 40. That is, a pair of the support jigs including the first support jig and the second support jig different from each other may be fixed to positions corresponding to the first mold 20 and the second mold 30, respectively.
In this case, as in the first embodiment, after the flexible circuit board FPC is sandwiched and shaped by the first carrier jig and the first shaping jig 20, the shaped flexible circuit board FPC is detached from the first carrier jig. Then, the flexible circuit board FPC detached from the first carrying jig is carried on the second carrying jig. Then, the flexible circuit board FPC is held by the second carrier jig and the second molding jig 30 for post-molding. The formation and post-formation of the flexible circuit board FPC can also be achieved as such.
(third embodiment)
Next, a third embodiment of the present invention will be explained. In the first embodiment described above, in the molding of the flexible printed circuit board FPC, the pre-molding is performed at a temperature at which the flexible printed circuit board FPC does not undergo plastic deformation, and then the molding is performed at a temperature at which the flexible printed circuit board FPC undergoes plastic deformation. In the third embodiment, after the pre-molding is performed at a temperature at which the flexible circuit board FPC does not undergo plastic deformation, the molding is performed at a temperature at which the flexible circuit board FPC undergoes plastic deformation, and then the post-molding is performed while the flexible circuit board FPC is cooled. Hereinafter, the description will be focused on the differences from the first embodiment.
Fig. 20 is a structural view of the entire flexible circuit board molding apparatus (FPC molding apparatus) 1B according to the present embodiment. In fig. 20, the same components as those of the first embodiment are denoted by the same reference numerals.
The FPC molding device 1B of the present embodiment includes a first molding jig 10, a second molding jig 20, a third molding jig 30, a carrier jig 40, a case 50, and a rail 60.
The first molding jig 10 is the same as the first molding jig 10 in the first embodiment. That is, the first molding jig 10 of the present embodiment includes the support portion 11, the molding block 12, and the thermocouple 13 as described with reference to fig. 2 in the first embodiment. Moreover, the first forming jig 10 and the carrying jig 40 clamp the flexible circuit board FPC together, and the flexible circuit board FPC is subjected to front forming.
The second molding jig 20 is the same as the second molding jig 20 in the first embodiment. That is, the second molding jig 20 of the present embodiment includes the support portion 21, the molding block 22, the thermocouple 23, and the heater 24 as described with reference to fig. 3 in the first embodiment. The second molding jig 20 and the carrier jig 40 hold the flexible circuit board FPC together, and mold the flexible circuit board FPC.
The third forming jig 30 is the same as the second forming jig 30 in the second embodiment. That is, the third molded clip 30 of the present embodiment includes the support portion 31, the molded block 32, the thermocouple 33, the cooling portion 34, the inflow pipe 35, and the outflow pipe 36, as described with reference to fig. 15 in the second embodiment. The third forming jig 30 and the carrier jig 40 clamp the flexible circuit board FPC together, and post-form the flexible circuit board FPC.
The configuration of the FPC molding device 1B of the present embodiment is as described above. Next, a method of forming a flexible circuit board according to the present embodiment will be described with reference to fig. 21.
< method for Forming FPC of Flexible printed Circuit Board >
Next, a method of forming the flexible printed circuit FPC by the FPC forming apparatus 1B will be described. Fig. 21 is a flowchart showing a series of flows of the method of forming the flexible circuit board FPC according to the third embodiment.
In the method of molding the flexible circuit board FPC according to the present embodiment, first, the flexible circuit board FPC is fixed to the carrier jig 40 (step S300). This step is the same as step S100 of the first embodiment. That is, as in fig. 6 and 7, the flexible circuit board FPC is fixed to one inclined surface of the carrier jig 40.
Next, the carrier jig 40 carrying the flexible circuit board FPC is moved to a position corresponding to the first molding jig 10 (a position directly below the first molding jig 10 in the present embodiment) by the rail 60. Then, the flexible circuit board FPC held by the holding jig 40 is held by the holding jig 40 and the first molding jig 10, and pre-molding is performed at the first temperature (step S302).
In the present embodiment, the first temperature is a temperature to the extent that the flexible circuit board FPC does not undergo plastic deformation. Preferably, the first temperature is, for example, from about 20 ℃ to about 30 ℃. In addition, it is preferable that the holding time at the first temperature for holding the flexible circuit board FPC is, for example, about 120 seconds. The operation of the first molding jig 10 in the pre-molding in step S302 is the same as the operation described with reference to fig. 8 to 10.
Next, the carrier jig 40 carrying the flexible circuit board FPC that has been subjected to the front molding is moved to a position corresponding to the second molding jig 20 (a position directly below the second molding jig 20 in the present embodiment) by the rail 60. Then, the flexible circuit board FPC, which is formed before, held by the holding jig 40 is held by the holding jig 40 and the second forming jig 20, and is formed at the second temperature (step S304).
In the present embodiment, the second temperature is higher than the first temperature. Specifically, the second temperature is a temperature at which the flexible printed circuit FPC is plastically deformed and at which the adhesive layer that bonds the insulating layers together does not dissolve out of the insulating layers. Preferably, the second temperature is, for example, from about 120 ℃ to about 200 ℃. In addition, it is preferable that the holding time at the second temperature for holding the flexible circuit board FPC is, for example, about 120 seconds. The operation of the second molding tool 20 in step S304 is the same as the operation described with reference to fig. 11 to 13.
Next, the carrier jig 40 carrying the molded flexible circuit board FPC is moved to a position corresponding to the third molding jig 30 (a position directly below the third molding jig 30 in the present embodiment) by the rail 60. Then, the formed flexible circuit board FPC held by the holding jig 40 is held by the holding jig 40 and the third forming jig 30, and post-forming is performed at a third temperature (step S306).
In the present embodiment, the third temperature is a temperature at which the flexible printed circuit FPC after the plastic deformation is cooled. In more detail, the third temperature is a temperature lower than the second temperature to such an extent that the flexible circuit board FPC does not undergo plastic deformation. Preferably, the third temperature is, for example, from about 20 ℃ to about 50 ℃. In addition, it is preferable that the holding time at the third temperature for holding the flexible circuit board FPC is, for example, about 120 seconds. The operation of the third molding jig 30 in step S306 is the same as the operation described with reference to fig. 17 to 19. By completing step S306, the formation of the flexible circuit board of the present embodiment is terminated.
The method of forming a flexible circuit board according to the above embodiment includes: a first step (step S302) of clamping the flexible circuit board FPC held by the holding jig 40 by using the holding jig 40 and the first molding jig 10, and performing pre-molding on the flexible circuit board FPC at a first temperature; a second step (step S304) of holding the flexible printed circuit FPC, which has been molded and is held by the holding jig 40 and the second molding jig 20, by the holding jig 40, and molding the flexible printed circuit FPC at a second temperature higher than the first temperature and at which the flexible printed circuit FPC is plastically deformed; and a third step (step S306) of clamping the flexible circuit board, which has been molded and is mounted on the carrier jig 40, by the carrier jig 40 and the third molding jig 30 having the cooling portion 34, and post-molding the flexible circuit board FPC at a third temperature lower than the second temperature.
In this way, in the third embodiment, after the pre-forming is performed at the first temperature at which the flexible circuit board FPC does not undergo plastic deformation, the forming is performed at the second temperature at which the flexible circuit board FPC undergoes plastic deformation. Then, post-forming is performed at a third temperature while cooling the flexible printed circuit board FPC while sandwiching the flexible printed circuit board FPC.
Thus, according to the third embodiment, as in the first embodiment, the bending stress acting on the flexible printed circuit FPC can be relaxed. Therefore, even when a flexible circuit board FPC having a large thickness is molded or a bending radius is small, occurrence of internal destruction and interlayer peeling can be suppressed. Further, as in the second embodiment, occurrence of springback in the insulating layer due to the rigidity of the copper foil layer of the flexible circuit board FPC can be suppressed.
Further, according to the present embodiment, the forming blocks 22 of the second forming jig 20 are heated in advance. Therefore, the molding in which the flexible circuit board FPC is plastically deformed can be performed immediately after the flexible circuit board FPC is sandwiched. Therefore, the time required for molding the flexible circuit board FPC can be shortened. In addition, according to the present embodiment, the forming block 32 of the third forming jig 30 is cooled in advance. Therefore, the post-forming of the flexible circuit board FPC can be performed immediately after the flexible circuit board FPC is sandwiched. Therefore, the time required for post-forming of the flexible circuit board FPC can also be shortened.
In addition, as in the first embodiment, the forming and the post-forming in the present embodiment are not limited to the above-described direction perpendicular to the rail 60, and may be performed in a direction parallel to the rail 60. In this case, the first forming jig 10, the second forming jig 20, and the third forming jig 30 may also be configured to slide in the X-axis direction or the Y-axis direction.
In addition, in the molding of the flexible circuit board FPC described above, the second molding jig 20 is heated by the heater 24. But not limited thereto, the carrying jig 40 may also be heated at the time of forming. That is, the carrier jig 40 may be provided with a heater, and the carrier jig 40 may be heated when the flexible circuit board FPC is molded.
In the present embodiment, the clamping time for the pre-forming performed at the first temperature, the clamping time for the forming performed at the second temperature, and the clamping time for the post-forming performed at the third temperature are also the same (about 120 seconds). On the other hand, the clamping time for the front molding, the clamping time for the molding, and the clamping time for the rear molding may be independently set. For example, the respective holding times may be set independently according to any appropriate conditions for performing the pre-forming, the forming, and the post-forming. Further, the first forming jig 10, the second forming jig 20, and the third forming jig 30 may be slid independently of each other at set times.
In addition, in the FPC molding device 1B and the FPC molding method according to the present embodiment described above, the same carrier jig 40 is used. However, the present embodiment is not limited to this, and can be realized even if a plurality of different load-bearing jigs 40 are used. That is, three carrier jigs including a first carrier jig, a second carrier jig, and a third carrier jig different from each other may be fixed at positions corresponding to the first forming jig 10, the second forming jig 20, and the third forming jig 30, respectively. In this case, after the flexible circuit board FPC is sandwiched by the first carrier jig and the first molding jig 10 and subjected to the front molding, the flexible circuit board FPC subjected to the front molding is detached from the first carrier jig. Then, after the flexible printed circuit FPC obtained by the previous molding is carried on the second carrying jig, the flexible printed circuit FPC is held between the second carrying jig and the second molding jig 20 and molded. Similarly, the formed flexible circuit board FPC is detached from the second carrier jig and carried on the third carrier jig. Then, the formed flexible circuit board FPC is sandwiched by a third carrier jig and a third forming jig 30, and post-forming is performed. Front forming, shaping, and rear forming of the flexible circuit board FPC may also be achieved as such.
(limiting jig of carrying jig)
A regulating jig 44 applicable to the first to third embodiments described above will be described with reference to fig. 22 to 24.
Fig. 22 is a structural diagram of the regulating jig 44. The restricting jig 44 includes a restricting jig plate 44a and a restricting jig plate 44 b. The restriction jig 44 is configured such that one end of the restriction jig plate 44a and one end of the restriction jig plate 44b are coupled to each other. The restraining clamp plate 44a has a front surface 44aF1 and a back surface 44aF 2. Likewise, the restraining clip plate 44b also has a surface 44bF1 and a back surface 44bF 2.
The restraining fixture 44 is used in conjunction with the load bearing fixture 40. Also, the restricting jig 44 maintains the bent state of the flexible circuit board FPC carried on the carrying jig 40. In detail, the restraining jig 44 maintains the shape of the flexible circuit board FPC that was previously formed and in a bent state by the first forming jig 10 and the carrying jig 40.
The restricting jig 44 has rigidity and heat resistance capable of withstanding the molding by clamping. Therefore, as with the holding jig 40, the regulating jig 44 may be made of a high-temperature resistant resin such as Polyetheretherketone (PEEK).
Fig. 23 shows an example in which the restricting jig 44 is applied to maintain the bent state of the flexible printed circuit FPC in the first to third embodiments. In this example, the flexible circuit board FPC is sandwiched by two restricting jigs 44U, 44L.
As shown in fig. 23, the restraining jig 44L is carried on the carrying jig 40. In detail, the regulating jig 44L is carried on the carrying jig 40 in such a manner that the inclined surface 40F1 of the carrying jig 40 is opposed to the back surface 44aF2 of the regulating jig plate 44a and the inclined surface 40F2 is opposed to the back surface 44bF 2.
Further, the flexible circuit board FPC is fixed to the surface 44aF1 and the surface 44bF1 of the restriction jig 44L. Further, a restraining jig 44U is carried on the flexible circuit board FPC. In this way, the flexible circuit board FPC is held by the restraining jig 44L and the restraining jig 44U, maintaining the bent shape of the flexible circuit board FPC.
As described above, the flexible circuit board FPC is carried on the carrying jig 40 so as to be sandwiched by the restricting jig 44U and the restricting jig 44L.
Fig. 24 is a cross-sectional view of fig. 23 viewed from the positive Y-axis direction. As shown in fig. 24, the restricting jig 44L, the flexible circuit board FPC, and the restricting jig 44U are carried on the carrying jig 40 in such a manner that the bending processed portion E2 of the carrying jig 40 and the bending processed portions E5 and E6 of the restricting jig 44U and 44L are fitted to each other. Therefore, the flexible circuit board FPC is bent at the bending angle θ in the bending processed portions E2, E5, E6. By freely setting the bending angle θ, the flexible printed circuit FPC can be bent at an arbitrary angle.
As described above, by applying the restricting jig 44 to the first to third embodiments, the bent state of the flexible printed circuit FPC previously molded can be firmly maintained. Therefore, the bending stress of the copper foil layer and the like can be relaxed, and therefore, the internal destruction of the flexible printed circuit FPC and the copper foil layer breakage can be suppressed.
(stopper of restricting clip in restricting clip)
A restricting jig stopper portion applicable to the above-described restricting jig 44 will be described with reference to fig. 25 to 27. The restricting jig stopper is a mechanism provided to enable the restricting jig 44 to more reliably restrict the flexible circuit board FPC.
Fig. 25 shows a restraining jig 44 and a restraining jig stopper pin 46 relating to the restraining jig stopper. In this example, the restricting jig stopper portion includes restricting jig stopper holes H1 to H4 provided in the restricting jig 44 and the restricting jig stopper pin 46. The restricting jig stopper is realized by fixing the restricting jig stopper pin 46 to the carrier jig 40 by passing through the restricting jig stopper holes H1 to H4.
Fig. 25 shows regulating jig stopper holes H1 to H4 provided in the regulating jig plate 44 a. Similarly, the opposing restricting clip plate 44b may be provided with restricting clip stopper holes H1 to H4. In addition, the restricting jig stopper pin 46 may be made of a high-temperature resistant resin such as polyetheretherketone, similarly to the restricting jig 44.
Fig. 26 shows an example of a case where the above-described restricting jig stopper is applied to the restricting jig 44. In fig. 26, as in fig. 23, the bent state of the flexible circuit board FPC is maintained using two restraining jigs 44U, 44L. In addition, the positional relationship of the regulating jig 44U and the regulating jig 44L, the flexible circuit board FPC, and the carrier jig 40 shown in fig. 26 is also the same as the positional relationship shown in fig. 23.
Fig. 27 is a cross-sectional view of fig. 26 as viewed from the positive Y-axis direction. As shown in fig. 27, a restricting jig stopper pin 46 penetrates the restricting jig 44U and the restricting jig 44L. Also, the restricting jig stopper pin 46 fixes the restricting jig 44 and the flexible circuit board FPC to the carrier jig 40.
Further, as shown in fig. 26 and 27, a restricting jig stopper pin 46 is provided to penetrate the restricting jig 44U and the restricting jig 44L. In detail, the restricting clip stopper hole H3U of the restricting clip 44U and the restricting clip stopper hole H1L of the restricting clip 44L are positioned opposite to each other. The restricting jig stopper pin 46a is provided so as to penetrate the opposing restricting jig stopper holes. Likewise, the restricting clip stopper hole H4U of the restricting clip 44U and the restricting clip stopper hole H2L of the restricting clip 44L are also positioned opposite to each other. The restricting jig stopper pin 46b is provided so as to penetrate both the restricting jig stopper holes.
The above-described example is an example in the case where the flexible circuit board FPC is fixed to the respective restricting jig plates 44a in the restricting jig 44U and the restricting jig 44L with the restricting jig stopper pins. The flexible circuit board FPC can be similarly fixed to the regulating jig plate 44b opposed to the regulating jig plate 44 a.
As described above, according to the restricting jig 44 to which the restricting jig stopper portion is applied, the restricting jig 44 and the flexible circuit board FPC can be firmly fixed to the carrier jig 40 using the restricting jig stopper pin 46. Therefore, the restraining jig 44 is more stably fixed to the carrying jig 40. Therefore, the bent state of the flexible circuit board FPC can be maintained.
(restricting opening in the jig)
The case where the regulating jig 44 further includes the opening a1 will be described with reference to fig. 28 to 30.
Fig. 28 shows a regulating jig 44 having an opening a 1. The opening portion a1 is provided for abutting the second and third molding jigs 20 and 30 against the flexible circuit board FPC. That is, the opening a1 is provided for bringing the heated molding block 22 and the cooled molding block 32 into direct contact with the flexible circuit board FPC. Thereby, the temperature of each of the forming blocks can be more directly conducted to the flexible circuit board FPC. As a result, the processing time (molding time) of each step can be shortened.
The opening a1 has a size such that a shaped block can abut against the flexible circuit board FPC. In other words, the lateral width of the opening a1 in the Y-axis direction and the vertical width in the Z-axis direction shown in fig. 28 are sized to include the lateral width of the forming block 22 and the forming block 32 in the Y-axis direction and the vertical width in the Z-axis direction.
Fig. 29 shows an example of the case where the regulating jig 44 having the opening a1 is applied to the first to third embodiments. The regulating jig 44U located at the upper portion of the flexible circuit board FPC has an opening portion a 1. On the other hand, the regulating jig 44L located at the lower portion of the flexible circuit board FPC does not have the opening portion a 1. The positional relationship of the restraining jig 44U and the restraining jig 44L, the flexible circuit board FPC, and the carrier jig 40 is the same as that shown in fig. 23.
As shown in fig. 29, since the regulating jig 44U has the opening portion a1, the bent portion of the flexible circuit board FPC is exposed. Thereby, the forming blocks 22 and the forming blocks 32 can be abutted against the flexible circuit board FPC.
Fig. 30 is a cross-sectional view of fig. 29 viewed from the positive Y-axis direction. As shown in fig. 30, the restricting jig 44U has an opening portion a1, and the flexible circuit board FPC is sandwiched between the restricting jig 44U and the restricting jig 44L. Therefore, the restraining jig 44U can maintain the bent state of the flexible circuit board FPC. That is, the flexible circuit board FPC can be fixed by a portion other than the opening portion a1 in the regulation jig 44. Therefore, the restricting jig 44U can maintain the bent state of the flexible printed circuit FPC as in the restricting jig 44 without the opening a 1.
In this way, according to the regulating jig 44 having the opening portion a1, the second and third mold jigs 20 and 30 abut against the flexible circuit board FPC. Thereby, the temperatures of the forming blocks 22 and 32 can be directly conducted to the flexible circuit board FPC. Therefore, the flexible circuit board FPC can be heated and cooled more efficiently.
The regulating jig 44 having the opening a1 may further have the regulating jig stopper described above. Thereby, the restraining jig 44 can effectively heat and cool the flexible circuit board FPC, and can maintain the bent state of the flexible circuit board FPC by fixing the flexible circuit board FPC to the carrying jig 40 more stably.
(examples)
An example of actually forming the flexible circuit board FPC according to the third embodiment described above will be described with reference to fig. 31 to 33.
Fig. 31 shows the configuration of the flexible circuit board FPC applied to the present embodiment. In this flexible printed circuit FPC, a liquid crystal polymer LCP1 having a copper foil layer CF1 provided on one surface thereof is bonded to a liquid crystal polymer LCP2 having copper foil layers CF2 and CF3 provided on both surfaces thereof by an adhesive layer Ad. The upper surface of the copper foil layer CF1 is covered with a cover film F1. The lower surface of the copper foil layer CF2 is covered with a cover film F2.
Fig. 32 is an image of the flexible circuit board FPC molded by the third embodiment. The bending angle of the flexible circuit board FPC shown in this image is about 51 °. In addition, the bending radius is about 0.64 mm. The thickness was about 0.32 mm. As shown in this image, under each of the above-described bending conditions, no interlayer peeling occurred between the liquid crystal polymer LCP1 and the liquid crystal polymer LCP 2.
Fig. 33 is a graph showing a transition of the bending angle of the flexible printed circuit FPC shown in fig. 32. In fig. 33, the horizontal axis represents elapsed days, and the vertical axis represents the bending angle. As shown in fig. 33, even after 30 days have elapsed from the date when the flexible circuit board FPC was formed, the bending angle of the flexible circuit board FPC is maintained at about 51 °. That is, even after 30 days have passed after the molding, no spring back occurs in the flexible printed circuit FPC.
As described above, according to the present example, using the flexible circuit board forming method of the third embodiment, it was confirmed that the flexible circuit board FPC can be formed in such a manner that the occurrence of internal chipping and interlayer peeling is suppressed, and no occurrence of springback occurs.
From the above description, those skilled in the art can find additional effects and various modifications of the present invention. The embodiments of the present invention are not limited to the above embodiments. The components according to the different embodiments may be appropriately combined. Various additions, modifications, and partial deletions can be made without departing from the spirit and scope of the invention as defined in the appended claims and equivalents thereof.
Description of the reference numerals
1. Forming device for 1A, 1B flexible circuit board
10. 20, 30 forming clamp
11. 21, 31 support part
12. 22, 32 forming block
13. 23, 33 thermocouple
24 heater
34 cooling part
35 inflow pipe
36 outflow pipe
40 load-bearing clamp
40F1, 40F2 inclined plane
42a, 42b, 42c fix the guide pin
44 limiting clamp
44a, 44b restrain clamp plate
44aF1, 44bF1 surface
44aF2, 44bF2 back
46. 46a, 46b, 46c restrain clamp stop pins
50 case body
60 track
FPC flexible circuit board
Fixing point of P1, P2 and P3 flexible circuit board
E1, E2, E3, E4, E5, E6 bending processing part
H1, H2, H3 and H4 limit clamp stop holes
Opening part A1
LCP1 and LCP2 liquid crystal polymers
CF1, CF2, CF3 copper foil layer
F1, F2 cover film
Ad adhesive layer
The theta bend angle.

Claims (23)

1. A forming apparatus for a flexible circuit board, which forms a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated on each other,
the forming device of the flexible circuit board comprises:
the first forming clamp and the first bearing clamp the flexible circuit board borne by the first bearing clamp, and the flexible circuit board is subjected to pre-forming at a first temperature at which the flexible circuit board does not generate plastic deformation; and
and a second forming jig which clamps the flexible circuit board, which has been subjected to the pre-forming and is supported by the second supporting jig, together with a second supporting jig, and forms the flexible circuit board at a second temperature which is higher than the first temperature and at which the flexible circuit board is plastically deformed.
2. The apparatus of claim 1, wherein said second forming fixture is warmed to said second temperature prior to said forming.
3. The forming apparatus of flexible circuit board according to claim 1 or 2,
the first temperature is from about 20 c to about 30 c,
the second temperature is from about 120 ℃ to about 200 ℃.
4. A forming apparatus of a flexible circuit board according to any one of claims 1 to 3,
the second forming jig includes:
the forming block and the second bearing clamp the flexible circuit board together;
a support portion supporting the forming block;
a thermocouple for measuring the temperature of the flexible circuit board clamped by the second bearing clamp and the forming block; and
a heater heating the shaped block.
5. The apparatus of any of claims 1-4, wherein the second carrier chuck comprises a heater.
6. The apparatus as claimed in any one of claims 1 to 5, further comprising a restraining jig for maintaining a bent state of the flexible circuit board carried by the second carrying jig.
7. The apparatus of claim 6, further comprising a restraining jig stopper fixing the restraining jig, which maintains the bent state of the flexible circuit board carried by the second carrying jig, to the second carrying jig.
8. The apparatus as claimed in claim 6 or 7, wherein the limiting jig further comprises an opening for abutting the second forming jig against the flexible circuit board.
9. The apparatus as claimed in any one of claims 1 to 8, wherein the first and second carrying jigs are different carrying jigs.
10. The apparatus of any of claims 1-8, wherein the first and second carrier fixtures are identical carrier fixtures.
11. The apparatus for forming a flexible circuit board according to any one of claims 1 to 10, wherein the thermoplastic resin contains a liquid crystal polymer.
12. A forming apparatus for a flexible circuit board, which forms a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated on each other,
the forming device of the flexible circuit board comprises:
the first forming clamp and the first bearing clamp the flexible circuit board borne by the first bearing clamp together, and the flexible circuit board is formed at a first temperature at which the flexible circuit board is subjected to plastic deformation; and
and a second forming jig which clamps the flexible circuit board, which has been subjected to the forming and is supported by the second supporting jig, together with a second supporting jig, and performs post-forming on the flexible circuit board at a second temperature which is lower than the first temperature and at which the flexible circuit board does not undergo plastic deformation.
13. The apparatus of claim 12, wherein the flexible circuit board is formed by a die,
the first forming jig is warmed to the first temperature before the forming is performed,
the second forming jig is cooled to the second temperature before the post-forming.
14. The apparatus of claim 12 or 13,
the first temperature is from about 120 c to about 200 c,
the second temperature is from about 20 ℃ to about 50 ℃.
15. A forming apparatus for a flexible circuit board, which forms a flexible circuit board including a plurality of insulating layers containing a thermoplastic resin laminated on each other,
the forming device of the flexible circuit board comprises:
the first forming clamp and the first bearing clamp the flexible circuit board borne by the first bearing clamp, and the flexible circuit board is subjected to pre-forming at a first temperature at which the flexible circuit board does not generate plastic deformation;
a second forming jig for clamping the flexible circuit board, which has been subjected to the pre-forming and is carried by the second carrying jig, together with a second carrying jig, and forming the flexible circuit board at a second temperature higher than the first temperature at which the flexible circuit board is plastically deformed; and
and a third forming clamp which clamps the flexible circuit board which is subjected to the forming and is borne by the third bearing clamp together with a third bearing clamp, and carries out post-forming on the flexible circuit board at a third temperature which is lower than the second temperature and does not generate plastic deformation.
16. The apparatus of claim 15, wherein the flexible circuit board is formed by a die,
the second forming jig is warmed to the second temperature before the forming is performed,
the third forming jig is cooled to the third temperature before the post-forming.
17. The apparatus of claim 15 or 16,
the first temperature is from about 20 c to about 30 c,
the second temperature is from about 120 c to about 200 c,
the third temperature is from about 20 ℃ to about 50 ℃.
18. The apparatus of any of claims 15-17, wherein at least one of the first, second, and third load-bearing clamps is a different load-bearing clamp than the other load-bearing clamps.
19. The apparatus of any of claims 15-17, wherein the first, second, and third load-bearing clamps are identical load-bearing clamps to each other.
20. The apparatus as claimed in any one of claims 1 to 19, wherein the plurality of insulating layers of the flexible circuit board are laminated with each other via an adhesive layer.
21. A method of forming a flexible circuit board, which comprises a plurality of insulating layers containing a thermoplastic resin laminated on each other,
the forming method of the flexible circuit board comprises the following steps:
a first step of clamping the flexible circuit board loaded on the first loading clamp by using a first loading clamp and a first forming clamp, and performing pre-forming on the flexible circuit board at a first temperature at which the flexible circuit board does not generate plastic deformation; and
and a second step of clamping the flexible circuit board, which has been subjected to the pre-forming and is supported by the second support jig, by a second support jig and a second molding jig, and molding the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board is plastically deformed.
22. A method of forming a flexible circuit board, which comprises a plurality of insulating layers containing a thermoplastic resin laminated on each other,
the forming method of the flexible circuit board comprises the following steps:
a first step of clamping the flexible circuit board loaded on the first loading clamp by using a first loading clamp and a first forming clamp, and forming the flexible circuit board at a first temperature at which the flexible circuit board is plastically deformed; and
and a second step of clamping the flexible circuit board, which has been subjected to the forming and is carried by the second carrier jig, by a second carrier jig and a second forming jig, and post-forming the flexible circuit board at a second temperature lower than the first temperature and at which the flexible circuit board is not plastically deformed.
23. A method of forming a flexible circuit board, which comprises a plurality of insulating layers containing a thermoplastic resin laminated on each other,
the forming method of the flexible circuit board comprises the following steps:
a first step of clamping the flexible circuit board loaded on the first loading clamp by using a first loading clamp and a first forming clamp, and performing pre-forming on the flexible circuit board at a first temperature at which the flexible circuit board does not generate plastic deformation;
a second step of clamping the flexible circuit board, which has been subjected to the pre-forming and is carried by the second carrier jig, by a second carrier jig and a second forming jig, and forming the flexible circuit board at a second temperature higher than the first temperature and at which the flexible circuit board is plastically deformed; and
and a third step of clamping the flexible circuit board, which has been subjected to the forming and is carried by the third carrier jig, by a third carrier jig and a third forming jig, and post-forming the flexible circuit board at a third temperature lower than the second temperature and at which the flexible circuit board is not plastically deformed.
CN202110968931.0A 2020-11-26 2021-08-23 Flexible circuit board forming device and flexible circuit board forming method Pending CN114554677A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020196206A JP2022084366A (en) 2020-11-26 2020-11-26 Flexible circuit board forming apparatus and forming method
JP2020-196206 2020-11-26

Publications (1)

Publication Number Publication Date
CN114554677A true CN114554677A (en) 2022-05-27

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Application Number Title Priority Date Filing Date
CN202110968931.0A Pending CN114554677A (en) 2020-11-26 2021-08-23 Flexible circuit board forming device and flexible circuit board forming method

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CN (1) CN114554677A (en)
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JP2022084366A (en) 2022-06-07

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