CN114551305A - Device and method for removing and repairing Mini LED chip - Google Patents
Device and method for removing and repairing Mini LED chip Download PDFInfo
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- CN114551305A CN114551305A CN202210195042.XA CN202210195042A CN114551305A CN 114551305 A CN114551305 A CN 114551305A CN 202210195042 A CN202210195042 A CN 202210195042A CN 114551305 A CN114551305 A CN 114551305A
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- 230000008439 repair process Effects 0.000 claims abstract description 15
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Abstract
The invention discloses a device for removing and repairing a Mini LED chip, which comprises a laser, wherein the laser is used for emitting laser; the light beam adjusting structure is positioned on one side of the laser which emits laser, and comprises a light beam shaping structure and an angle adjusting structure, wherein the light beam shaping structure is used for shaping the laser emitted by the laser into a rectangular light spot or a linear light spot, and the angle adjusting structure is used for driving the light beam shaping structure to rotate so that the rectangular light spot or the linear light spot forms a specific angle; the tube mirror is positioned at one end of the light beam adjusting structure, which is far away from the laser, and is used for focusing the laser; and the objective lens is positioned at one end of the tube lens, which is far away from the light beam adjusting structure, and is used for imaging the laser. The invention has the advantages of extremely short processing time, extremely high processing efficiency, simple removal process and high repair rate.
Description
Technical Field
The invention relates to the technical field of laser micromachining application in the display industry, in particular to a device and a method for removing and repairing a Mini LED chip.
Background
The Mini LED is an LED chip with the size of 100 microns, the size of the Mini LED is between that of a small-spacing LED and that of a Micro LED, and the Mini LED is the result of the continuous reduction of the size of the small-spacing LED. The Mini LED technology is mature, the mass production is feasible, and the method has large-scale application in the fields of middle and high-end liquid crystal display screen backlight and LED display, in particular to the fields of televisions, notebooks, displays and the like.
The Mini LED has many advantages over the conventional display technology, but at the same time, the disadvantages of the Mini LED are also obvious: due to the huge conversion, the yield needs to be improved, and the repair cost is too high because the Mini LED crystal grains are too small.
The Mini LED repair method commonly used in the industry at present is: the Mini LED chip bonding pad is heated by semiconductor laser, the output power of the semiconductor laser and the temperature rise process of the semiconductor laser are controlled by a constant-temperature negative feedback control system, the Mini LED bonding pad is heated by the semiconductor laser to a set temperature, and then a single chip is removed by a physical method. The process needs to go through several stages:
1) a preheating stage: heating the welding disk by the semiconductor laser, heating to a preheating temperature, and preheating the welding disk;
2) and (3) heating: increasing laser power to raise the temperature of the bonding pad from the preheating temperature to the melting temperature of the solder paste/die bond adhesive;
3) melting: under the control of a constant-temperature negative feedback control system, monitoring the temperature of the bonding pad, controlling the output power of a laser, and keeping the temperature of the bonding pad at the melting temperature of the solder paste/die bond adhesive for a period of time to fully melt the solder paste/die bond adhesive;
4) chip removal: and removing the Mini LED chip to be repaired from the bonding pad by using a physical method, such as high-pressure air flow, probe or suction nozzle adsorption and the like.
Above traditional processing mode is great at Mini LED chip size, can dispel the Mini LED chip that needs to be restoreed when chip density is sparse relatively, still has following difficult problem:
1) the heating time is long, the repairing efficiency is low, generally, 10-20 seconds are needed from preheating to final chip removing for removing one broken Mini LED chip, and if the number of chips needing repairing is large, the repairing efficiency is difficult to improve;
2) in the chip removing process, the solder paste/die bond adhesive is in a molten state, so that the solder paste/die bond adhesive in the molten state is easily sputtered and adhered to the peripheral area of the bonding pad, further the peripheral area of the bonding pad and chips adjacent to the bonding pad are polluted, and even the solder paste/die bond adhesive of a plurality of adjacent Mini LED chips in one area is heated and melted, so that the chips in the adjacent areas are loosened, new risks are introduced, and additional heat influence can be caused to damage the bonding pad and influence the product performance;
3) aiming at Mini LED chips with different sizes, DOE lenses with corresponding sizes need to be customized to adjust the size of laser spots, the cost is high, the intersection period is long, corresponding DOE lenses need to be replaced at the same time when one product is replaced, and the product compatibility is poor.
Based on the above, the invention provides a device and a method for removing and repairing a Mini LED chip, so as to solve various problems in the prior art.
Disclosure of Invention
The present invention is directed to provide a device and a method for removing and repairing a Mini LED chip, so as to solve the problems mentioned in the background art.
In order to solve the technical problems, the invention provides the following technical scheme: an apparatus for Mini LED chip removal repair, comprising: a laser for emitting laser light; the light beam adjusting structure is positioned on one side of the laser which emits laser, and comprises a light beam shaping structure and an angle adjusting structure, wherein the light beam shaping structure is used for shaping the laser emitted by the laser into a rectangular light spot or a linear light spot, and the angle adjusting structure is used for driving the light beam shaping structure to rotate so that the rectangular light spot or the linear light spot forms a specific angle; the tube mirror is positioned at one end of the light beam adjusting structure, which is far away from the laser, and is used for focusing the laser; and the objective lens is positioned at one end of the tube lens, which is far away from the light beam adjusting structure, and is used for imaging the laser.
Preferably, the beam shaping structure comprises: a substrate; and two transverse beam shaping plates; the transverse adjusting structure is used for adjusting the opposite or reverse displacement between the two transverse beam shaping plates; the two longitudinal beam shaping plates are overlapped with the two transverse beam shaping plates; the longitudinal adjusting structure is used for adjusting the opposite or opposite displacement between the two longitudinal beam shaping plates; when the laser beam passes through the transverse beam shaping plate and the longitudinal beam shaping plate, the laser beam is shaped into a rectangular spot or a linear spot.
Preferably, the lateral adjustment structure comprises: the first motor is fixed on the substrate; the first bidirectional screw rod is connected to the output end of the first motor; the first lead screw supporting seat is fixed on the substrate and is used for supporting a first bidirectional lead screw; the two first lead screw nuts are respectively screwed on the two sections of threads of the first bidirectional lead screw and are respectively connected with the two transverse beam shaping plates; the two transverse beam shaping plates are connected to the base plate in a sliding manner; and the two first lead screw nuts are provided with first distance inductors.
Preferably, the longitudinal adjustment structure comprises: the second motor is fixed on the substrate; the second bidirectional screw rod is connected to the output end of the second motor; the second lead screw supporting seat is fixed on the base plate and used for supporting a second bidirectional lead screw; the two second lead screw nuts are respectively screwed on the two sections of threads of the second bidirectional lead screw and are respectively connected with the two longitudinal beam shaping plates; the two longitudinal beam shaping plates are connected to the base plate in a sliding manner; and the two second lead screw nuts are provided with second distance inductors.
Preferably, the angle adjusting structure includes: a platform substrate; and the rotating platform comprises a fixed part and a rotating part, the fixed part is fixedly connected with the platform substrate, the rotating part is fixedly connected with the substrate, the fixed part is connected with the rotating part through a bearing, and the rotating part is driven by a motor to rotate.
Preferably, the device for Mini LED chip removal repair further comprises: an optical attenuation structure located between the laser and the beam conditioning structure; and a mirror located between the optical attenuation structure and the beam conditioning structure.
Preferably, the device for Mini LED chip removal repair further comprises: the imaging dichroic mirror is positioned between the tube lens and the objective lens and is used for guiding in coaxial imaging laser; and the coaxial imaging structure is positioned on one side of the imaging dichroic mirror.
Preferably, the device for Mini LED chip removal repair further comprises: the laser dichroic mirror is positioned between the imaging dichroic mirror and the objective lens and is used for guiding in coaxial signal laser; and the automatic focusing structure is positioned on one side of the laser dichroic mirror.
The invention also provides the following technical scheme:
a method for Mini LED chip removal repair, comprising:
s1, placing a chip to enable a chip substrate to be located at the upper end of a chip substrate;
s2, bombarding the chip substrate by using high-energy pulse laser to separate the chip substrate and the chip electrode from the chip substrate.
Preferably, step S2 includes:
s2a, emitting high-energy pulse laser;
s2b, attenuating high-energy pulse laser;
s2c, adjusting the laser beam into a rectangular light spot or a linear light spot with the same inclination as the chip substrate;
s2d, focusing laser;
s2e, imaging the laser.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention discloses a device and a method for removing and repairing a Mini LED chip, wherein a Mini LED chip substrate is bombarded by high-energy pulse laser, so that the high-energy pulse laser interacts with substrate surface materials to generate high-temperature plasma with extremely high density; the directional local isothermal expansion emission of high-temperature plasma to the normal direction of the solid surface is realized, and because the expansion speed of the plasma in the direction opposite to the laser beam is obviously higher than that in other directions, the nonuniform expansion forms an ellipsoidal plasma, namely an elongated plasma region outwards along the normal direction of a target surface, namely a so-called plasma plume, and the directional expansion emission process is extremely short (10)-8～10-3s) having the characteristics of a momentary explosion and an axis of emission in the direction of the normal to the target surfaceThe Mini LED chip is restrained, so that shock waves are generated and are directionally transmitted to the Mini LED chip to interact with each other, and the Mini LED chip falls off from the chip substrate and is instantly popped off due to the fact that the connection force between the chip substrate and the chip electrode is weak and the welding position is broken under the shock wave oscillation effect;
2. the invention discloses a device and a method for removing and repairing a Mini LED chip.A substrate of the Mini LED chip is bombarded by one or more laser pulses in a processing process, the processing time is very short, the processing process is less than 1 second, and the Mini LED chip can be separated from the substrate and can be popped off at the moment of the bombardment of the laser pulses, so that the processing efficiency is very high;
3. the invention discloses a device and a method for removing and repairing a Mini LED chip, which are different from the traditional processing mode, the adopted processing method does not need to use high-pressure gas or parts such as a probe, a suction nozzle and the like to enable the Mini LED chip to be removed to fall off from a substrate, and the Mini LED chip to be removed can directly fall off from the substrate under the action of oscillation force generated by laser and vibrate, so that the removal process is simple;
4. the device and the method for removing and repairing the Mini LED chip can accurately bombard the damaged chip, cannot influence adjacent chips and bonding pads, and further ensure the repairing rate.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of an apparatus for Mini LED chip removal repair in embodiment 1 of the present invention;
FIG. 2 is a perspective view of a light beam adjusting structure in embodiment 1 of the present invention;
fig. 3 is a perspective view of a lateral adjustment structure in embodiment 1 of the present invention;
fig. 4 is a perspective view of a longitudinal adjustment structure in embodiment 1 of the invention;
fig. 5 is a first schematic diagram of a method for repairing the Mini LED chip removal in embodiment 2 of the present invention;
fig. 6 is a schematic diagram two of a method for repairing the Mini LED chip removal in embodiment 2 of the present invention;
in the figure:
a laser 1;
the light beam adjusting structure 2, the light beam shaping structure 21, the substrate 211, the transverse light beam shaping plate 212, the transverse adjusting structure 213, the first motor 2131, the first bidirectional screw 2132, the first screw support 2133, the first screw nut 2134, the longitudinal light beam shaping plate 214, the longitudinal adjusting structure 215, the second motor 2151, the second bidirectional screw 2152, the second screw support 2153, the second screw nut 2154, the angle adjusting structure 22, the platform substrate 221, and the rotary platform 222;
a tube mirror 3;
an objective lens 4;
an optical attenuation structure 5;
a reflector 6;
an imaging dichroic mirror 7;
a coaxial imaging structure 8;
a laser dichroic mirror 9;
an automatic focusing mechanism 10;
a chip substrate 11;
a chip substrate 12;
a chip electrode 13;
and a die bond adhesive 14.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
On the aspect of removing and repairing the Mini LED chip, the traditional processing scheme is that a bonding pad of the Mini LED chip is heated by semiconductor laser, and meanwhile, the output power and the temperature rise process of the semiconductor laser are controlled by a constant-temperature negative feedback control system, so that the Mini LED chip is removed from the substrate 211 after the Mini LED bonding pad is heated by the semiconductor laser to a set temperature and successively undergoes stages of preheating, temperature rise, melting, physical removal and the like.
Based on this, the present application provides embodiment 1, which is an optimal solution for a device for removing and repairing a Mini LED chip, and is used for removing and repairing the Mini LED chip with high efficiency, accuracy and low cost.
Specifically, in order to achieve the purpose, as shown in fig. 1, the device comprises a laser 1, wherein the laser 1 is used for emitting high-energy pulse laser; the laser is preferably 532nm laser with pulse width of about 10 ns and single pulse energy of more than 10mJ, or 355nm laser with pulse width of about 10 ns and single pulse energy of more than 15mJ, or high single pulse laser with other pulse width.
Further, as shown in fig. 1, the apparatus further includes an optical attenuation structure 5, where the optical attenuation structure 5 is located between the laser 1 and the beam adjustment structure 2, and is used for attenuating the laser power; specifically, the optical attenuation structure 5 comprises a half-wave plate for changing the polarization state of laser, a rotating motor for driving the half-wave plate to rotate, a polarization crystal for separating laser in different polarization states into orthogonal light beams, and a motor for controlling the half-wave plate to rotate, so that the linear polarization laser power transmitted from the polarization crystal can be adjusted, the output laser power can be accurately controlled to be adjusted and changed from 0.1-100.0%, and the laser power, the adjustment precision and the resolution ratio are further improved.
Further, as shown in fig. 1, the device further includes a reflector 6, the reflector 6 is located between the optical attenuation structure 5 and the beam adjustment structure 2, and the reflector 6 is used for reflecting the laser beam so as to change the laser propagation direction, so that the space occupation of the device is rationalized.
Further, as shown in fig. 1-2, the device further comprises a light beam adjusting structure 2, the light beam adjusting structure 2 is located on one side of the laser 1, which emits laser, the light beam adjusting structure 2 comprises a light beam shaping structure 21 which is used for shaping the laser emitted by the laser 1 into rectangular light spots or linear light spots, the size of the light spots can be adjusted within the range of 0.1 × 0.1mm to 6mm × 6mm, and the light beam shaping structure 21 is driven to rotate, so that the rectangular light spots or the linear light spots form an angle adjusting structure 22 with a specific angle, the angle of the light spots is consistent with the angle of a chip, and the accuracy of laser bombardment is ensured;
further, as shown in fig. 2, the beam shaping structure 21 includes a substrate 211, wherein the substrate 211 serves as a supporting structure; and two transverse beam shaping plates 212; and a lateral adjustment structure 213, wherein the lateral adjustment structure 213 is used for adjusting the displacement of the two lateral beam shaping plates 212 in the opposite direction or in the opposite direction, so that the laser light passes through between the two lateral beam shaping plates 212, thereby shaping the laser light in one dimension; and two longitudinal beam shaping plates 214, the two longitudinal beam shaping plates 214 being disposed to overlap the two lateral beam shaping plates 212; and a longitudinal adjusting structure 215, the longitudinal adjusting structure 215 is used for adjusting the displacement between the two longitudinal beam shaping plates 214, so that the laser passes through between the two longitudinal beam shaping plates 214, thereby shaping the laser in another dimension; that is, when the laser beam passes through the transverse beam shaping plate 212 and the longitudinal beam shaping plate 214, the laser beam is shaped into a rectangular spot or a linear spot in two dimensions;
further, as shown in fig. 2, since the thicknesses of the transverse beam shaping plate 212 and the longitudinal beam shaping plate 214 affect the diffraction of the laser light, in order to ensure the diffraction effect of the laser light after passing through the beam shaping structure 21, the thicknesses of the transverse beam shaping plate 212 and the longitudinal beam shaping plate 214 are 0.5 mm;
further, as shown in fig. 3, the lateral adjustment structure 213 includes a first motor 2131, the first motor 2131 is fixed on the substrate 211, and the first motor 2131 is preferably a high-resolution stepping motor, so as to ensure that the minimum movement amount of the lead screw is 6 um; the first bidirectional screw 2132 is connected to the output end of the first motor 2131 through a coupler, and the movement precision of the first bidirectional screw 2132 is +/-0.055 +5 um; the first lead screw supporting seat 2133 is fixed on the substrate 211, and supports the first bidirectional lead screw 2132 through a bearing; the two first lead screw nuts 2134 are respectively screwed on the two threads of the first bidirectional lead screw 2132, and the two first lead screw nuts 2134 are respectively connected with the two transverse beam shaping plates 212; the two transverse beam shaping plates 212 are connected to the base plate 211 in a sliding manner through sliding rail sliders; when the distance between the two transverse beam shaping plates 212 needs to be adjusted, the first motor 2131 is started to rotate to drive the first bidirectional screw 2132 to rotate, so that the two first screw nuts 2134 and the first bidirectional screw 2132 are in screw rotation, and under the limiting action of the sliding rail sliding block, the two first screw nuts 2134 are driven to displace in opposite directions or in opposite directions, so that the two transverse beam shaping plates 212 are displaced in opposite directions or in opposite directions;
further, a second distance sensor is arranged on each of the two first lead screw nuts 2134, and is used for sensing a displacement distance to form a feedback mechanism, so that the size of a light spot can be controlled conveniently and accurately;
further, as shown in fig. 4, the longitudinal adjustment structure 215 includes a second motor 2151, the second motor 2151 is fixed on the substrate 211, and the second motor 2151 is preferably a high-resolution stepping motor, so as to ensure that the minimum movement of the lead screw is 6 um; the second bidirectional screw 2152 is connected to the output end of the second motor 2151 through a coupler, and the movement precision of the second bidirectional screw 2152 is +/-0.055 +5 um; the second lead screw supporting seat 2153 is fixed on the base plate 211, and supports the second bidirectional lead screw 2152 through a bearing; the two second lead screw nuts 2154 are respectively screwed on the two threads of the second bidirectional lead screw 2152, and the two second lead screw nuts 2154 are respectively connected with the two longitudinal beam shaping plates 214; the two longitudinal beam shaping plates 214 are both connected to the base plate 211 in a sliding manner through sliding rail sliders; when the distance between the two longitudinal beam shaping plates 214 needs to be adjusted, the second motor 2151 is started to rotate to drive the second bidirectional screw 2152 to rotate, so that the two second screw nuts 2154 and the second bidirectional screw 2152 are in screw transmission, and under the limiting action of the slide rail slider, the two second screw nuts 2154 are driven to displace in the opposite or opposite directions, so that the two longitudinal beam shaping plates 214 are displaced in the opposite or opposite directions;
further, a second distance sensor is arranged on each of the two second lead screw nuts 2154 for sensing a displacement distance to form a feedback mechanism so as to conveniently and accurately control the size of the light spot;
further, as shown in fig. 2, the angle adjusting structure 22 includes a platform substrate 221, and the platform substrate 221 serves as a supporting structure; the rotating platform 222 comprises a fixed part and a rotating part, the fixed part is fixedly connected with the platform substrate 221, the rotating part is fixedly connected with the substrate 211, the fixed part is connected with the rotating part through a bearing, and the rotating part is driven by a motor to rotate; so can drive beam shaping structure 21 rotatory to the adjustment laser facula angle, wherein the center of angle modulation structure 22 is coaxial with the center of beam shaping structure 21, thereby when guaranteeing angle modulation structure 22 to rotate, the laser center is unchangeable.
Further, as shown in fig. 1, the device further includes a tube lens 3, where the tube lens 3 is located at an end of the beam adjusting structure 2 away from the laser 1, and is used for focusing laser light; the device also comprises an objective lens 4, wherein the objective lens 4 is positioned at one end of the tube lens 3 far away from the light beam adjusting structure 2 and is used for imaging laser, focusing the laser on the surface of a chip and bombarding the substrate of the chip.
Further, as shown in fig. 1, the apparatus further includes an imaging dichroic mirror 7, where the imaging dichroic mirror 7 is located between the tube lens 3 and the objective lens 4, and is used for introducing coaxial imaging laser; and the coaxial imaging structure 8, the coaxial imaging structure 8 is located on one side of the imaging dichroic mirror 7, wherein the coaxial imaging structure 8 comprises a camera and an imaging lens, and is used for observing and monitoring products and processing processes.
Further, as shown in fig. 1, the device further comprises a laser dichroic mirror 9, wherein the laser dichroic mirror 9 is located between the imaging dichroic mirror 7 and the objective lens 4 and is used for guiding the coaxial signal laser; the automatic focusing structure 10 is located on one side of the laser dichroic mirror 9, the automatic focusing structure 10 is used for measuring the distance between the Mini LED chip substrate and the laser objective lens, and further controlling the motion control system to move in the vertical direction, so that the laser focus is just focused on the chip substrate, specifically, the automatic focusing structure 10 comprises a laser diode used for emitting laser and a laser position sensor used for receiving the emitted laser to measure the distance between the Mini LED chip substrate and the objective lens.
Based on the device for removing and repairing the Mini LED chip provided in embodiment 1, the present application also provides embodiment 2, which is an optimal scheme for a method for removing and repairing the Mini LED chip, and is used to assist the device to remove and repair the Mini LED chip.
Specifically, as shown in fig. 5 to 6, a method for removing and repairing a Mini LED chip includes:
s1, placing a chip to enable a chip substrate 11 to be positioned at the upper end of a chip base plate 12;
s2, bombarding the chip substrate 11 by using high-energy pulse laser to separate the chip substrate 11 and the chip electrode 13 from the chip substrate 12;
s2a, emitting high-energy pulse laser;
s2b, attenuating high-energy pulse laser;
s2c, adjusting the laser beam to be a rectangular light spot or a linear light spot with the same inclination as the chip substrate 11;
s2d, focusing laser;
s2e, imaging the laser.
Furthermore, the removing method also comprises the steps of observing and monitoring the machining process and carrying out laser real-time focusing compensation on the laser machining process.
The principle is as follows: as shown in fig. 5-6, the Mini LED chip substrate 11 is bombarded by high-energy pulse laser, so that the high-energy pulse laser interacts with the substrate surface material to generate high-temperature plasma with extremely high density; the directional local isothermal expansion emission of high-temperature plasma to the normal direction of the solid surface is realized, and because the expansion speed of the plasma in the direction opposite to the laser beam is obviously higher than that in other directions, the nonuniform expansion forms an ellipsoidal plasma, namely an elongated plasma region outwards along the normal direction of a target surface, namely a so-called plasma plume, and the directional expansion emission process is extremely short (10)-8～10-3s) with the characteristic of instantaneous explosion and axial restraint of emission along the normal direction of the target surface, so as to generate shock waves which are directionally transmitted to the mini LED chip and generate phasesIn interaction, the chip substrate 12 and the chip electrode 13 are connected through the die bond adhesive 14, so that the connection force is relatively weak, and the welding position is broken under the shock wave oscillation effect, so that the Mini LED chip falls off from the chip substrate 12 and is instantly popped.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An apparatus for Mini LED chip removal repair, comprising:
a laser for emitting laser light;
the light beam adjusting structure is positioned on one side of the laser device for emitting laser, and comprises a light beam shaping structure for shaping the laser emitted by the laser device into a rectangular light spot or a linear light spot and an angle adjusting structure for driving the light beam shaping structure to rotate so that the rectangular light spot or the linear light spot forms a specific angle;
the tube mirror is positioned at one end, far away from the laser, of the light beam adjusting structure and is used for focusing laser;
and the objective lens is positioned at one end of the tube lens, which is far away from the light beam adjusting structure, and is used for imaging the laser.
2. The apparatus of claim 1, wherein the beam shaping structure comprises:
a substrate;
and two transverse beam shaping plates;
the transverse adjusting structure is used for adjusting the opposite or opposite displacement between the two transverse beam shaping plates;
the two longitudinal beam shaping plates are overlapped with the two transverse beam shaping plates;
the longitudinal adjusting structure is used for adjusting the opposite or opposite displacement between the two longitudinal beam shaping plates;
when the laser beam passes through the transverse beam shaping plate and the longitudinal beam shaping plate, the laser beam is shaped into a rectangular spot or a linear spot.
3. The apparatus of claim 2, wherein the lateral adjustment structure comprises:
the first motor is fixed on the substrate;
the first bidirectional screw rod is connected to the output end of the first motor;
the first lead screw supporting seat is fixed on the substrate and used for supporting the first bidirectional lead screw;
the two first lead screw nuts are respectively screwed on the two sections of threads of the first bidirectional lead screw and are respectively connected with the two transverse beam shaping plates;
the two transverse beam shaping plates are both connected to the base plate in a sliding mode.
4. The apparatus of claim 2, wherein the longitudinal adjustment structure comprises:
the second motor is fixed on the substrate;
the second bidirectional screw rod is connected to the output end of the second motor;
the second lead screw supporting seat is fixed on the substrate and used for supporting the second bidirectional lead screw;
the two second lead screw nuts are respectively screwed on the two sections of threads of the second bidirectional lead screw and are respectively connected with the two longitudinal beam shaping plates;
both of the longitudinal beam shaping plates are slidably connected to the base plate.
5. The apparatus of claim 2, wherein the angle adjustment structure comprises:
a platform substrate;
the rotary platform comprises a fixed part and a rotating part, the fixed part is fixedly connected with the platform substrate, the rotating part is fixedly connected with the substrate, the fixed part is connected with the rotating part through a bearing, and the rotating part is driven by a motor to rotate.
6. The device for Mini LED chip removal repair according to any one of claims 1 to 5, further comprising:
an optical attenuation structure located between the laser and the beam conditioning structure;
and a mirror located between the optical attenuation structure and the beam conditioning structure.
7. The device for Mini LED chip removal repair according to any one of claims 1 to 5, further comprising:
the imaging dichroic mirror is positioned between the tube lens and the objective lens and is used for guiding coaxial imaging laser;
and the coaxial imaging structure is positioned on one side of the imaging dichroic mirror.
8. The apparatus of claim 7, further comprising:
the laser dichroic mirror is positioned between the imaging dichroic mirror and the objective lens and is used for guiding coaxial signal laser;
and the automatic focusing structure is positioned on one side of the laser dichroic mirror.
9. A method for Mini LED chip removal repair, comprising:
s1, placing a chip to enable a chip substrate to be positioned at the upper end of a chip base plate;
s2, bombarding the chip substrate by using high-energy pulse laser to separate the chip substrate and the chip electrode from the chip substrate.
10. The method for Mini LED chip removal repair of claim 9, wherein said step S2 comprises:
s2a, emitting high-energy pulse laser;
s2b, attenuating high-energy pulse laser;
s2c, adjusting the laser beam into a rectangular light spot or a linear light spot with the same gradient as the chip substrate;
s2d, focusing laser;
s2e, imaging the laser.
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| CN202310772759.0A CN116799110B (en) | 2022-03-01 | Method for removing and repairing Mini LED chip | |
| CN202210195042.XA CN114551305B (en) | 2022-03-01 | 2022-03-01 | Device and method for removing and repairing Mini LED chip |
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| CN114551305B (en) | 2023-07-25 |
| CN116799110A (en) | 2023-09-22 |
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