CN114545033A

CN114545033A - Plate-shaped connector, single-arm serial connector and wafer test assembly

Info

Publication number: CN114545033A
Application number: CN202011210406.4A
Authority: CN
Inventors: 谢开杰; 刘兆强; 郑孟杰; 苏伟志
Original assignee: Taiwan Zhonghua Precision Measurement Technology Co ltd
Current assignee: Taiwan Zhonghua Precision Measurement Technology Co ltd
Priority date: 2020-11-03
Filing date: 2020-11-03
Publication date: 2022-05-27

Abstract

The invention discloses a plate-shaped connector, a single-arm serial connection piece and a wafer test assembly. The plate-shaped connector includes a plurality of single-arm type serial connectors and an insulating layer, which are arranged at intervals. Each single-arm type tandem connection piece comprises a bearing body, a cantilever extending from the bearing body and arranged in a coplanar manner, and a propping column and a propping end part extending from the cantilever and positioned on opposite sides. The insulating layer is connected with the bearing bodies of the single-arm type serial connection pieces, and the abutting column of each single-arm type serial connection piece protrudes out of the insulating layer. Each single-arm type serial connection piece is respectively abutted against the two plates through the abutting column and the abutting end part. Accordingly, the wafer test assemblies can be easily separated from each other by using the plate-shaped connector, thereby facilitating subsequent inspection and maintenance.

Description

Plate-shaped connector, single-arm serial connector and wafer test assembly

Technical Field

The present invention relates to a test assembly, and more particularly to a board connector, a single-arm type serial connector thereof, and a wafer test assembly.

Background

The conventional wafer testing device comprises a testing circuit board electrically coupled to the testing machine and a signal transmission board arranged on the testing circuit board, wherein the signal transmission board is welded and fixed on the testing circuit board in the conventional wafer testing device. However, in the process of soldering and fixing the signal transmission board and the test circuit board, the conventional wafer testing device is vulnerable to thermal shock. Moreover, the signal transmission board and the test circuit board which are welded and fixed with each other are not beneficial to subsequent detection and maintenance of the signal transmission board and the test circuit board.

The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.

Disclosure of Invention

An object of the embodiments of the present invention is to provide a board connector, a single-arm serial connector thereof, and a wafer testing device, which can effectively overcome the defects possibly generated by the conventional wafer testing device.

The embodiment of the invention discloses a wafer test assembly, which comprises a signal transmission plate, a test circuit board and a plate-shaped connector. The signal transmission plate is used for connecting a probe head; the test circuit board is used for electrically coupling with a test machine; a plate-shaped connector clamped between the signal transmission plate and the test circuit board; the plate-shaped connector comprises a plurality of single-arm type serial connectors and an insulating layer. The single-arm type serial connection pieces are arranged at intervals and respectively comprise a bearing body, a cantilever, a propping column and a propping end part. A cantilever extends from the inner side wall of the bearing carrier along a first direction and is arranged in a coplanar manner with the bearing body; a propping column is formed by extending the cantilever along a second direction vertical to the first direction; a butting end part is formed by bending and extending from the tail end edge of the cantilever, and the butting end part is arranged at intervals with the butting column in the first direction; the supporting body of the single-arm type serial connection pieces is connected with an insulating layer, and the abutting column of each single-arm type serial connection piece protrudes out of the insulating layer; the abutting ends of the single-arm type serial connection pieces respectively abut against the other one of the signal transmission plate and the test circuit board; the signal transmission board and the test circuit board can be electrically coupled with each other through the board-shaped connector.

Preferably, in any one of the single-arm type serial connectors, the cantilever includes a force arm portion connected to the inner sidewall and a free end portion extending from the force arm portion, the abutting pillar is integrally connected to the free end portion, and the abutting end portion is formed by extending from the free end portion in a bending manner; wherein, the distance between the top prop and the inner side wall part extending from the top prop is 100 micrometers (mum) to 600 micrometers.

Preferably, in any one of the single-arm type connecting pieces, the arm portion is formed with an adjusting hole extending from the free end portion to the inner side wall and in a penetrating shape.

Preferably, in any one single-arm type serial connection piece, the abutting column has a thickness, which is 100% to 300% of the thickness of the free end portion, compared with the free end portion.

Preferably, the wafer test assembly further comprises a screw set, and the signal transmission plate, the plate-shaped connector and the test circuit board are fixed through the screw set to maintain the relative positions of the signal transmission plate, the plate-shaped connector and the test circuit board; any electrical transmission path between the test circuit board, the plate-shaped connector and the signal transmission board is not achieved with any solder material.

Preferably, the insulating layer is formed with a plurality of cut-off holes penetrating therethrough, each single-arm type serial connection member includes at least one residual arm extending from the outer side wall of the bearing carrier, and a free end of at least one residual arm of each single-arm type serial connection member is exposed to one cut-off hole.

Preferably, a cutoff hole is formed between any two adjacent single-arm type serial connecting pieces.

Preferably, in any one of the single-arm type serial connectors, the signal transmission board and the test circuit board are pressed against the plate-shaped connector, so that the cantilever is elastically bent, and two ends of the abutting column respectively protrude out of two opposite sides of the insulating layer.

The embodiment of the present invention also discloses a plate connector for being clamped between two plates so that the two plates can be electrically coupled to each other, the plate connector comprising: a plurality of single-arm links disposed at intervals and each including: a carrier; the cantilever extends from the inner side wall of the bearing carrier along a first direction and is arranged in a coplanar manner with the bearing carrier; a top prop formed by extending the cantilever along a second direction perpendicular to the first direction; and a butting end portion formed by extending the end edge of the cantilever in a bending manner, and the butting end portion is arranged at an interval with the butting column in the first direction; the supporting body is connected with the supporting bodies of the single-arm type serial connection pieces, and the abutting column of each single-arm type serial connection piece protrudes out of the insulating layer; the top abutting columns and the top abutting end parts of the single-arm type serial connection pieces respectively abut against the two plates.

The embodiment of the present invention further discloses a single-arm type serial connector of a plate connector, which is used for being clamped between two plates so that the two plates can be electrically coupled with each other, the single-arm type serial connector comprises: a carrier; the cantilever extends from the inner side wall of the bearing carrier along a first direction and is arranged in a coplanar manner with the bearing carrier; a top prop formed by extending the cantilever along a second direction perpendicular to the first direction; and a butting end portion formed by bending and extending from the tail end edge of the cantilever, and the butting end portion is arranged at intervals with the butting column in the first direction; the propping column of the single-arm type serial connection piece props against one of the two plates, and the propping end parts of the single-arm type serial connection pieces prop against the other one of the two plates.

In summary, the plate connector, the single-arm type serial connector and the wafer test assembly disclosed in the embodiments of the present invention elastically abut against two plates (e.g., the signal transmission plate and the test circuit board) by the abutting column and the abutting end portion cooperating with the cantilever, so that a soldering manner is not required. Furthermore, because the single-arm type serial connection piece is detachably pressed on the two plates, the components of the wafer test assembly can be easily separated from each other, so that the subsequent detection and maintenance of the wafer test assembly are facilitated.

Furthermore, in the board connector, the single-arm type serial connector and the wafer test module disclosed in the embodiments of the present invention, the cantilever is designed to be coplanar with the carrier, which is not only beneficial to improving the yield rate of production and manufacturing, but also can evenly distribute stress to the cantilever when the cantilever is stressed and bent, thereby effectively reducing the probability of the cantilever breaking from the carrier.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.

Drawings

FIG. 1 is a schematic cross-sectional view of a wafer test assembly according to an embodiment of the invention.

Fig. 2 is an exploded view of the probe head of fig. 1 without the probe head.

Fig. 3 is an enlarged schematic view of a portion III of fig. 1.

Fig. 4 is an enlarged schematic view of another embodiment of fig. 3.

Fig. 5 is a perspective view of a plate-like connector according to an embodiment of the present invention.

Fig. 6 is a top view of fig. 5.

Fig. 7 is a partial perspective view of fig. 5.

Fig. 8 is a perspective view of another embodiment of the plate-like connector according to the embodiment of the present invention.

Fig. 9 is a perspective view schematically showing still another embodiment of the plate-like connector according to the embodiment of the present invention.

Fig. 10 is a schematic top view of a plate-like connector according to still another embodiment of the present invention.

Fig. 11 is a perspective view of another embodiment of a single-arm type serial connector of a plate connector according to an embodiment of the present invention.

FIG. 12 is a schematic cross-sectional view of another embodiment of a wafer test assembly according to the present invention.

Detailed Description

The following description of the embodiments of the present disclosure relating to the "plate connector and its single arm type serial connector and wafer test assembly" is provided by specific embodiments, and those skilled in the art will understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

Please refer to fig. 1 to 12, which illustrate an embodiment of the present invention. The sizes and numbers of the elements shown in fig. 1-12 are only schematic representations, and may be adjusted and varied according to design requirements (e.g., the length of the elements is extended outward or the number of the elements is increased), and are not limited to the drawings.

As shown in fig. 1 to 4, the present embodiment discloses a chip testing assembly 100, which includes a signal transmission plate (space transformer)1, a testing circuit board 2 spaced apart from the signal transmission plate 1, a plate-shaped connector 3 located between the signal transmission plate 1 and the testing circuit board 2, a probe head 4 connected to the signal transmission plate 1, and a screw set 5.

In the embodiment, the signal transmission board 1, the board connector 3 and the test circuit board 2 are fixed by the screws 5 to maintain their relative positions, so that any electrical transmission path between the test circuit board 2, the board connector 3 and the signal transmission board 1 can be achieved without any soldering material, but the invention is not limited thereto. For example, in other embodiments not shown, the screw set 5 may be omitted from the wafer test assembly 100 or replaced with other components (e.g., the components of the wafer test assembly 100 are adhesively secured together) instead of the screw set 5.

It should be noted that, although the plate-shaped connector 3 is described in the embodiment by being matched with the signal transmission board 1, the test circuit board 2, the probe head 4 and the screw set 5, the invention is not limited thereto. For example, in other embodiments of the present invention, the plate connector 3 may be applied (e.g., sold) alone or used with other components (e.g., the plate connector 3 is used to be clamped between two plates so as to electrically couple the two plates to each other). The structure of each component of the wafer test component 100 and the connection relationship thereof in this embodiment will be described below.

As shown in fig. 1 and 2, the signal transmission plate 1 has a top surface 11 and a bottom surface 12 on opposite sides, and the top surface 11 of the signal transmission plate 1 is used to connect to the probe tip 4, while the bottom surface 12 of the signal transmission plate 1 faces the plate-shaped connector 3. The bottom surface 12 of the signal transmission board 1 is provided with a plurality of connecting pads 13, and the connecting pads 13 can be electrically coupled to the probe heads 4. Furthermore, in other embodiments of the present invention, which are not shown, the signal transmission plate 1 may also be of a multi-layered construction, such as: the signal transmission board 1 may further include a function board having an impedance matching effect.

The test circuit board 2 is configured to be electrically coupled to a test machine (not shown), and the test circuit board 2 includes a plurality of metal pads 21 disposed at intervals on a board surface (e.g., a top surface of the test circuit board 2 in fig. 2), and an arrangement of the plurality of metal pads 21 of the test circuit board 2 substantially corresponds to an arrangement of the plurality of connection pads 13 of the signal transmission board 1, but the invention is not limited thereto. Accordingly, the metal pads 21 are electrically coupled to a testing machine, so as to analyze the signal received by the testing circuit board 2 through the testing machine. It should be noted that the electrical coupling between the test circuit board 2 and the test machine can be adjusted according to the design requirement. For example, in other embodiments not shown in the present invention, the test circuit board 2 may also be directly integrated into a test machine.

The plate-shaped connector 3 is clamped between the signal transmission plate 1 and the test circuit board 2, so that the signal transmission plate 1 and the test circuit board 2 can be electrically coupled to each other through the plate-shaped connector 3. Wherein the clamping force of the plate-shaped connector 3 between the signal transmission plate 1 and the test circuit board 2 can be adjusted by the screw group 5; that is, the distance between the signal transmission board 1 and the test circuit board 2 can be adjusted by the screw set 5, so as to control the force for clamping the plate-shaped connector 3.

In more detail, as shown in fig. 2 to 4, the plate-shaped connector 3 includes a plurality of single-arm type serial connectors 31 disposed at intervals and an insulating layer 32 fixing the plurality of single-arm type serial connectors 31. It should be noted that, in the embodiment, the plate-shaped connector 3 is described by using a plurality of the single-arm type serial connectors 31 and the insulating layer 32, but the invention is not limited thereto. For example, in other embodiments not shown, the single-arm-type string 31 may be used alone (e.g., sold) or in combination with other components (e.g., the single-arm-type string 31 may be used in combination with a string of a different configuration, or the single-arm-type string 31 may be used to clamp between two plates so that the two plates can be electrically coupled to each other).

Furthermore, since the structures of the single-arm connectors 31 are substantially the same in the present embodiment, for convenience of description, only the structure of one of the single-arm connectors 31 will be described below, but the present invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the configuration of the single-arm type serial connection element 31 may be different. The configuration of the single-arm-type serial-connection member 31 when no external force is applied will be explained below.

As shown in fig. 5 to 7, the single-arm type serial connector 31 is a single-piece conductive member formed integrally in this embodiment, and the outer surface of the single-arm type serial connector 31 is preferably plated with a nickel layer, but the invention is not limited thereto. The single-arm serial connection element 31 includes a ring-shaped (e.g., square ring-shaped) supporting body 311, a cantilever 312 extending from an inner sidewall 3111 of the supporting body 311, a propping end 313 formed by bending and extending from a distal edge of the cantilever 312, a propping post 314 extending from the cantilever 312, and at least one residual arm 315 extending from the outer sidewall of the supporting body 311, but the invention is not limited thereto.

For example, in other embodiments not shown in the present disclosure, the single-arm type serial connection element 31 may omit at least one of the residual arms 315. Alternatively, as shown in fig. 8, any two adjacent cantilevers 312 are connected to the same side of the inner sidewall 3111; alternatively, as shown in fig. 9, the carrier 311 is not annular.

It should be noted that in a corresponding case, which is different from the present invention and not shown, a supporting body is connected angularly with at least one inclined cantilever, and when at least one inclined cantilever is stressed to bend, stress is concentrated on the connection of at least one inclined cantilever and the supporting body, thus easily causing at least one inclined cantilever to break from the connection.

However, in the present embodiment, as shown in fig. 5 to 7, the cantilever 312 extends from the inner sidewall 311a along a first direction D1 to be coplanar with the carrier 311; that is, the upper surface of the cantilever 312 is coplanar with the upper surface of the carrier 311, and the lower surface of the cantilever 312 is coplanar with the lower surface of the carrier 311.

Accordingly, the cantilever 312 in the present embodiment is designed to be coplanar with the carrier 311, which not only facilitates the improvement of the yield rate of production and manufacturing, but also evenly distributes the stress to the cantilever 312 when the cantilever 312 is stressed and bent, thereby effectively reducing the probability of the breakage of the cantilever 312 from the carrier 311. In other words, any cantilever that is not coplanar with the carrier is different from the cantilever 312 in the present embodiment.

More specifically, as shown in fig. 5 to fig. 7, any two adjacent cantilevers 312 are connected to the opposite side of the corresponding inner sidewall 3111 in the embodiment, and may be disposed approximately 180-fold rotationally symmetric (2-fold rotational symmetry) with the carrier 311, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, any two adjacent cantilevers 312 may have different lengths according to design requirements; alternatively, as shown in fig. 10, any two adjacent cantilevers 312 may not be aligned in a straight direction.

Furthermore, as shown in fig. 5 to 7, the abutting column 314 is formed by extending from (the upper surface of) the cantilever 312 along a second direction D2 perpendicular to the first direction D1, the abutting end portion 313 is disposed at an interval from the abutting column 314 in the first direction D1, and the abutting column 314 and the abutting end portion 313 are respectively located at two opposite sides of the cantilever 312 (e.g., the upper side and the lower side of the cantilever 312 in fig. 5), but the invention is not limited thereto.

Further, in order to enable the single-arm type serial connector 31 to correspond to the signal transmission board 1 and the test circuit board 2, and have better mechanical performance and electrical transmission effect, the single-arm type serial connector 31 preferably meets at least one of the following conditions, but the invention is not limited thereto. That is, in other embodiments of the present invention, which are not shown, the single-arm type serial connection 31 may not have any of the following conditions.

The cantilever 312 has an equal thickness and includes a force arm portion 3121 connected to the inner sidewall 3111 and a free end portion 3122 extending from the force arm portion 3121, and the force arm portion 3121 is formed with an adjustment hole 3123 extending from the free end portion 3122 to the inner sidewall 3111 and having a penetrating shape, but the invention is not limited thereto. For example, in other embodiments of the present invention not shown, the adjusting hole 3123 may be spaced apart from the free end portion 3122 (or the inner side wall 3111).

Accordingly, the arm portion 3121 is divided into two arms by the adjustment hole 3123, thereby providing better balance of the free end portion 3122. Furthermore, the force arm 3121 can effectively control the elastic force provided by the adjustment hole 3123 by changing the size and shape thereof, so as to meet different design requirements.

The abutting column 314 is integrally connected to the free end portion 3122, and the abutting column 314 is spaced from the portion of the inner sidewall 3111 where the abutting column 314 extends by a distance D314 of 100 micrometers (μm) to 600 micrometers; that is, the length of the force arm portion 3121 may be approximately between 100 micrometers and 600 micrometers, but the present invention is not limited thereto. Furthermore, the abutting column 314 has a thickness T1 compared to the free end portion 3122, and the thickness T1 is 100% to 300% of the thickness T3122 of the free end portion 3122.

Furthermore, the abutting end portion 313 is formed by extending from the free end portion 3122 in a bending manner, and the abutting end portion 313 is preferably capable of elastically deforming or swinging with respect to the cantilever 312, but the invention is not limited thereto. In the embodiment, the abutting end portion 313 is illustrated as a V-shaped or U-shaped structure extending outward from the free end portion 3122, but in other embodiments not shown in the present invention, the abutting end portion 313 may be present in other structures according to design requirements (for example, the abutting end portion 313 is formed extending inward from the free end portion 3122, so that at least a part of the abutting end portion 313 is located below the free end portion 3122).

In addition, the single-arm type serial connector 31 can respectively abut against two plates (e.g., the signal transmission board 1 and the test circuit board 2) through the abutting column 314 and the abutting end portion 313, and the end edge of the abutting column 314 for abutting against the two plates is configured as an arc surface in the present embodiment, but it can be adjusted and changed according to design requirements, and is not limited to the present embodiment. For example, in other embodiments of the present invention, which are not shown, the end edge of the abutting column 314 may be a bevel; alternatively, as shown in fig. 11, the end edge of the abutting column 314 may include a plurality of protruding structures.

The insulating layer 32 is made of a high temperature resistant material in this embodiment, for example: the insulating layer 32 may be made of plastic capable of withstanding a temperature of 300 degrees celsius or more. The insulating layer 32 connects the carrier 311 and the residual arm 315 of each single-arm type serial connection element 31. In this embodiment, the insulating layer 32 may be connected to the carrier 311 and the residual arm 315 of each single-arm type serial connection element 31 by molding or by adhesion, so that at least a portion of the carrier 311 and the residual arm 315 of each single-arm type serial connection element 31 are embedded in the insulating layer 32.

Furthermore, the abutting pillar 314 and the abutting end 313 of each single-arm type serial connection element 31 may respectively protrude out of two opposite sides of the insulation layer 32, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the abutting column 314 of each single-arm type serial connection 31 protrudes out of the insulating layer 32, but the abutting end 313 may be located in the space surrounded by the insulating layer 32.

In more detail, the insulating layer 32 is formed with a plurality of cut-off holes 321, and one cut-off hole 321 exists between any two adjacent single-arm type serial connections 31, and the free end of at least one residual arm 315 of each single-arm type serial connection 31 is exposed to one cut-off hole 321. In other words, before the insulating layer 32 of the plate-like connector 3 is formed with the plurality of cut holes 321, at least two residual arms 315 of any two adjacent single-arm type serial connectors 31 are connected to each other, thereby facilitating the production of the plurality of single-arm type serial connectors 31; then, a plurality of the cut-off holes 321 are formed in the insulating layer 32, so that at least two residual arms 315 in any two adjacent single-arm type serial connections 31 are disconnected from each other and can be electrically isolated from each other.

Above is the description of the construction of the signal transmission plate 1, the test circuit board 2 and the plate-shaped connector 3, and the connection relationship among the signal transmission plate 1, the test circuit board 2 and the plate-shaped connector 3 is described next. The abutting columns 314 of the single-arm serial connectors 31 abut against the connecting pads 13 of the signal transmission board 1, and the abutting end portions 313 of the single-arm serial connectors 31 abut against the metal pads 21 of the test circuit board 2.

In another words, the abutting column 314 of any one of the single-arm type serial connecting members 31 abuts against one of the two plates, and the abutting end 313 of any one of the single-arm type serial connecting members 31 abuts against the other one of the two plates, but the invention is not limited thereto. For example, as shown in fig. 12, a plurality of abutting columns 314 may also be formed by extending from the corresponding cantilever 312 toward different sides (e.g., upper side and lower side in fig. 12) in the second direction D2, and the abutting column 314 and the abutting end 313 of each single-arm type serial connection 31 are respectively located at two opposite sides of the cantilever 312 (e.g., upper side and lower side of the cantilever 312 in fig. 12); that is, the abutting columns 314 and the abutting end portions 313 of the single-arm type serial connectors 31 abut against two plate members (e.g., the signal transmission plate 1 and the test circuit board 2), respectively.

Furthermore, as shown in fig. 1 and fig. 2, in any one of the single-arm serial connectors 31 of the present embodiment, the signal transmission board 1 and the test circuit board 2 press the abutting columns 314 and the abutting end portions 313 of the plate-shaped connector 3, so that the cantilever 312 is elastically bent, and two ends of the abutting columns 314 respectively protrude out of the two opposite sides of the insulating layer 32 (see fig. 4), thereby effectively reducing the overall thickness of the plate-shaped connector 3, but the present invention is not limited thereto. For example, the force of the plate-shaped connector 3 pressed by the signal transmission plate 1 and the test circuit board 2 can be adjusted according to design requirements (e.g. FIG. 3).

As shown in fig. 1, the probe tip 4 is disposed on the top surface 11 of the signal transmission board 1, and the probe tip 4 can be electrically coupled to the test circuit board 2 through the signal transmission board 1 and the board connector 3. The probe head 4 includes a positioning base 41 and a plurality of conductive probes 42 passing through the positioning base 41, wherein one end of each conductive probe 42 (e.g., the bottom end of the conductive probe 42 in fig. 1) passes through the positioning base 41 and abuts against the top surface 11 of the signal transmission board 1, and the other end of each conductive probe 42 (e.g., the top end of the conductive probe 42 in fig. 1) passes through the positioning base 41 and abuts against an object to be tested (e.g., a semiconductor wafer).

It should be noted that the conductive probe 42 is a flexible strip-shaped structure that can be conducted in the present embodiment, but the conductive probe 42 of the present invention is not limited to a rectangular conductive probe, a circular conductive probe, or other conductive probes. In addition, the probe head 4 is illustrated as a vertical probe head in the embodiment, but the specific configuration of the probe head 4 can be adjusted and changed according to design requirements, and the invention is not limited herein.

[ technical effects of embodiments of the present invention ]

In summary, in the plate-shaped connector, the single-arm serial connector and the wafer test assembly disclosed in the embodiments of the present invention, the abutting column and the abutting end portion are matched with the cantilever to elastically abut against two plates (e.g., the signal transmission plate and the test circuit board), so that a soldering manner is not required. Furthermore, because the single-arm type serial connection piece is detachably pressed on the two plates, the components of the wafer test assembly can be easily separated from each other, so that the subsequent detection and maintenance of the wafer test assembly are facilitated.

The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and the drawings are included in the scope of the invention.

Claims

1. A wafer test assembly, comprising:

a signal transmission board for connecting to a probe head;

a test circuit board for electrically coupling to a test machine; and

a plate-shaped connector clamped between the signal transmission plate and the test circuit board; wherein the plate-shaped connector includes:

a plurality of single-arm serials disposed at intervals and each including:

a carrier;

the cantilever extends from the inner side wall of the bearing body along a first direction and is arranged in a coplanar manner with the bearing body;

the top prop column extends from the cantilever along a second direction vertical to the first direction; and

the abutting end part is formed by extending the tail end edge of the cantilever in a bending way, and the abutting end part and the abutting column are arranged at intervals in the first direction; and

the supporting body is connected with the supporting bodies of the single-arm type serial connectors, and the abutting column of each single-arm type serial connector protrudes out of the insulating layer;

the abutting ends of the single-arm type serial connection pieces respectively abut against the other one of the signal transmission plate and the test circuit board;

wherein the signal transmission plate and the test circuit board are electrically coupled to each other by the plate-shaped connector.

2. The wafer test assembly of claim 1, wherein in any of said single-arm interconnects, said cantilever includes a force arm connected to said inner sidewall and a free end extending from said force arm, said abutment post is integrally connected to said free end, and said abutment end is formed by extending from said free end in a curved manner; wherein, the distance between the abutting column and the inner side wall part extending from the abutting column is 100-600 microns.

3. The wafer test assembly of claim 2 wherein in any of said single-arm couplings, said force arm is formed with an adjustment hole extending therethrough from said free end portion to said inner sidewall.

4. The wafer test assembly of claim 2, wherein in any one of the single-armed serials, the abutting column has a thickness compared to the free end portion that is 100% to 300% of the thickness of the free end portion.

5. The wafer test assembly as set forth in claim 1, wherein the wafer test assembly further comprises a set of screws, and the signal transmission plate, the plate-shaped connector and the test circuit board are fixed to each other by the set of screws; any electrical transmission path between the test circuit board, the plate-shaped connector and the signal transmission board is not achieved with any solder material.

6. The wafer test assembly of claim 1, wherein the insulating layer is formed with a plurality of cut-off holes therethrough, each of the single-armed strings includes at least one residual arm extending from an outer sidewall of the carrier, and a free end of at least one of the residual arms of each of the single-armed strings is exposed through one of the cut-off holes.

7. The wafer test assembly of claim 6, wherein one of said cutoff holes exists between any two adjacent ones of said single-arm serials.

8. The wafer test assembly of claim 1 wherein in any of the single-arm serials, the signal transmission board and the test circuit board are pressed against the plate connector to make the cantilever elastically bent so that two ends of the abutting pillar respectively protrude out of two opposite sides of the insulating layer.

9. A plate-like connector for being held between two plate members so that the two plate members can be electrically coupled to each other, the plate-like connector comprising:

a plurality of single-arm links disposed at intervals and each including:

a carrier;

the abutting columns and the abutting end parts of the single-arm type serial connection pieces respectively abut against the two plates.

10. A single-armed series connection of a plate connector for clamping between two plates to enable the two plates to be electrically coupled to each other, the single-armed series connection comprising:

a carrier;

the abutting end part is formed by extending the tail end edge of the cantilever in a bending way, and the abutting end part and the abutting column are arranged at intervals in the first direction;

the abutting column of the single-arm type serial connection piece abuts against one of the two plates, and the abutting end parts of the single-arm type serial connection pieces abut against the other of the two plates.