CN114539622A - Preparation method and application of epoxy resin foam bonding auxiliary agent - Google Patents
Preparation method and application of epoxy resin foam bonding auxiliary agent Download PDFInfo
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- CN114539622A CN114539622A CN202210075076.5A CN202210075076A CN114539622A CN 114539622 A CN114539622 A CN 114539622A CN 202210075076 A CN202210075076 A CN 202210075076A CN 114539622 A CN114539622 A CN 114539622A
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- epoxy resin
- resin foam
- auxiliary agent
- polyisocyanate
- temperature
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 33
- 239000006260 foam Substances 0.000 title claims abstract description 27
- 239000012752 auxiliary agent Substances 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 238000005187 foaming Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004202 carbamide Substances 0.000 claims abstract description 7
- 239000004005 microsphere Substances 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 17
- 239000005056 polyisocyanate Substances 0.000 claims description 14
- 229920001228 polyisocyanate Polymers 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- CTKINSOISVBQLD-VKHMYHEASA-N (S)-Glycidol Chemical compound OC[C@H]1CO1 CTKINSOISVBQLD-VKHMYHEASA-N 0.000 claims description 11
- 239000007822 coupling agent Substances 0.000 claims description 11
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000013638 trimer Substances 0.000 claims description 4
- TZZGHGKTHXIOMN-UHFFFAOYSA-N 3-trimethoxysilyl-n-(3-trimethoxysilylpropyl)propan-1-amine Chemical compound CO[Si](OC)(OC)CCCNCCC[Si](OC)(OC)OC TZZGHGKTHXIOMN-UHFFFAOYSA-N 0.000 claims description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 claims description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- YXRKNIZYMIXSAD-UHFFFAOYSA-N 1,6-diisocyanatohexane Chemical compound O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O YXRKNIZYMIXSAD-UHFFFAOYSA-N 0.000 claims description 2
- RWLDCNACDPTRMY-UHFFFAOYSA-N 3-triethoxysilyl-n-(3-triethoxysilylpropyl)propan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCNCCC[Si](OCC)(OCC)OCC RWLDCNACDPTRMY-UHFFFAOYSA-N 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 2
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 claims description 2
- KOVKEDGZABFDPF-UHFFFAOYSA-N n-(triethoxysilylmethyl)aniline Chemical compound CCO[Si](OCC)(OCC)CNC1=CC=CC=C1 KOVKEDGZABFDPF-UHFFFAOYSA-N 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims description 2
- 239000002318 adhesion promoter Substances 0.000 claims 4
- 239000000498 cooling water Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 230000006378 damage Effects 0.000 abstract description 3
- 125000003700 epoxy group Chemical group 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- RBFRSIRIVOFKDR-UHFFFAOYSA-N [C].[N].[O] Chemical group [C].[N].[O] RBFRSIRIVOFKDR-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- -1 siloxane structure Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0014—Use of organic additives
- C08J9/0042—Use of organic additives containing silicon
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
- C07F7/1872—Preparation; Treatments not provided for in C07F7/20
- C07F7/1892—Preparation; Treatments not provided for in C07F7/20 by reactions not provided for in C07F7/1876 - C07F7/1888
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/22—Expandable microspheres, e.g. Expancel®
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a preparation method and application of an epoxy resin foam bonding auxiliary agent. And (3) uniformly mixing the epoxy resin with the prepared bonding auxiliary agent under the conditions of a curing agent, a urea promoter and foaming microspheres at normal temperature, preserving the heat for 50min at the temperature of 150 ℃, and finally foaming and forming to prepare the modified epoxy resin foam. The epoxy resin foam modified by the method has the advantages that the bonding performance is greatly improved, the bonding strength is about 3 times that of the unmodified epoxy resin foam, and the damage degree of the surface of the base material is greatly reduced.
Description
Technical Field
The invention belongs to the technical field of epoxy resin, and particularly relates to a preparation method and application of an epoxy resin foam bonding auxiliary agent.
Background
The epoxy resin foam is prepared by taking epoxy resin as a main body and compounding a foaming agent through heating and curing, has the advantages of light density, high strength and the like, and is widely applied to materials needing weight reduction.
At present, the bonding effect of epoxy resin foam and glass and other materials is poor, and the market generally adopts a method of directly adding a silane coupling agent or pre-treating a base material. Because the silane coupling agent is directly added, the molecular weight of the silane coupling agent is smaller, the silicon-oxygen-carbon bond is less, the silane coupling agent which needs to be added is more if the better effect is achieved, and because the silane coupling agent which contains the epoxy group generally only contains one epoxy group, the epoxy group plays a role in inhibiting polymerization in the epoxy curing process, and the bulk strength of the epoxy resin foam is reduced by adding a large amount of the epoxy silane coupling agent in order to achieve the good bonding effect. If the substrate is previously treated with the treating agent, the field operation is complicated.
Disclosure of Invention
The invention aims to provide a preparation method and application of an epoxy resin foam bonding auxiliary agent for improving the defects of the prior art.
The technical scheme adopted by the invention is as follows: a preparation method of an epoxy resin foam bonding auxiliary agent comprises the following specific steps:
(1) adding polyisocyanate into a container, adding a solvent, then placing the container into cold water, and stirring under the protection of inert gas;
(2) dropwise adding an aminosilane coupling agent into the solution obtained in the step (1) in a water bath under the protection of inert gas, then stirring for the first time, and then placing the container in warm water for stirring again;
(3) and (3) adding S-glycidol into the solution obtained in the step (2), reacting under the protection of inert gas, and removing the solvent after the reaction is finished to prepare the bonding auxiliary agent.
Preferably, the temperature of the cold water in the step (1) is 0-20 ℃, and the stirring time in the step (1) is 10-20 min.
Preferably, the temperature of the water bath in the step (2) is 0-20 ℃, the temperature of the warm water in the step (2) is 70-80 ℃, the primary stirring time in the step (2) is 30-60min, and the secondary stirring time in the step (2) is 30-60 min.
Preferably, the reaction temperature in the step (3) is 60-65 ℃, and the reaction time in the step (3) is 2-3 h.
Preferably, the solvent in the step (1) is one of ethyl acetate, butyl acetate, butanone, dimethyl carbonate and toluene, and the polyisocyanate in the step (1) is one of HDI biuret, HDI trimer, TDI trimer and IPDI trimer.
Preferably, the aminosilane coupling agent in step (2) is one or more of bis (3-trimethoxysilylpropyl) amine, bis [3- (triethoxysilyl) propyl ] amine, gamma-aminopropyltriethoxysilane, gamma-aminopropyltrimethoxysilane, N-phenyl-gamma-aminopropyltrimethoxysilane and N-phenylaminomethyltriethoxysilane.
Preferably, the molar ratio of the polyisocyanate to the aminosilane coupling agent to the S-glycidol is 1: (1.5-2.5): (0.5-1.5), wherein the molar ratio of the polyisocyanate to the sum of the aminosilane coupling agent and the S-glycidol is 1:3, and the using amount of the solvent is 80-150% of that of the polyisocyanate.
The application of the epoxy resin foam bonding auxiliary agent comprises the following specific steps: and (3) uniformly mixing the epoxy resin with the bonding auxiliary agent under the conditions of a curing agent, a urea promoter and foaming microspheres, preserving heat for 30-60min at the temperature of 130-150 ℃, and finally foaming and molding.
Preferably, the epoxy resin, the curing agent, the urea accelerator, the foaming microspheres and the bonding auxiliary agent are mixed according to the mass ratio of 100 (9-11) to (2-3) to (3-5): (0.5-3).
Compared with the prior art, the invention has the following advantages:
1. according to the invention, an aminosilane coupling agent is adopted to react with polyisocyanate to prepare an adhesion auxiliary agent containing isocyanate groups, and further reacts with S-glycidol to prepare an adhesion auxiliary agent containing epoxy groups, urethane groups, urea groups and a large amount of siloxane, and after the adhesion auxiliary agent is added into epoxy resin foam, on one hand, the epoxy groups participate in main chain reaction, and on the other hand, a siloxane structure in the adhesion auxiliary agent forms better adhesion strength with the surfaces of base materials such as glass, anodized aluminum and the like in the curing process.
2. The invention prepares the bonding auxiliary agent containing epoxy group and a plurality of carbon-oxygen-nitrogen structures by S-glycidol (containing micromolecules of an epoxy group and a hydroxyl group), the epoxy group participates in the reaction with the curing agent and is grafted to the main chain after being added into the epoxy resin foam, and the carbon-oxygen-nitrogen structures mainly play a role in bonding.
3. The molar ratio of the polyisocyanate to the sum of the aminosilane coupling agent and the S-glycidol is 1:3, because the polyisocyanate has 3 functionality and both the aminosilane coupling agent and the S-glycidol contain active hydrogen, complete reaction can be ensured to the greatest extent by adopting the molar ratio of 1:3, and the service performance of the bonding auxiliary agent is improved.
4. According to the invention, the solvent is used for dissolving the polyisocyanate in advance, so that the problem that the prepared bonding auxiliary agent has large molecular weight dispersion and is difficult to achieve the optimal bonding effect due to the fact that the viscosity is increased quickly and the stirring is difficult to be uniform in the later reaction period is avoided, and the obtained final product has small molecular weight dispersion and is better in bonding effect.
Detailed Description
In order that those skilled in the art will be able to better understand the technical solutions provided by the present invention, the following description is provided in connection with specific embodiments.
Example 1: adding 239g of N100 (HDI biuret) into a 1000mL four-neck flask, adding 239g of butyl acetate as a solvent, placing the four-neck flask into cold water at the temperature lower than 20 ℃, starting a stirring paddle to rotate at the speed of 200r/min, and stirring for 10 minutes under the protection of nitrogen to dissolve to obtain a solution A; adding 341g of bis (3-trimethoxysilylpropyl) amine into the solution A in a water bath at a temperature lower than 20 ℃ under the protection of nitrogen, continuously stirring for 30 minutes after the addition is finished, adjusting the rotating speed to 200r/min, placing the four-neck flask into 70 ℃ water, and continuously stirring for 1 hour to obtain a solution B; adding 37g of S-glycidol into the solution B, reacting for 2 hours at 60 ℃ under the protection of nitrogen, vacuumizing to remove the solvent, pouring into a glass bottle, and sealing for storage to prepare the bonding auxiliary agent.
E51 type epoxy resin foam is uniformly mixed with the prepared bonding auxiliary agent at the normal temperature according to the mass ratio of 100:11:3:5:2.5 under the condition that dicyandiamide is used as a curing agent, UR300 is used as a urea promoter and Expancel 461DU40 is used as foaming microspheres, the mixture is subjected to heat preservation at the temperature of 150 ℃ for 50min, and finally, the foaming performance is shown in table 1.
Comparative example 1: uniformly mixing E51 type epoxy resin with dicyandiamide as a curing agent, UR300 as a urea promoter and Expancel 461DU40 foaming microspheres in a mass ratio of 100:11:3:5 at normal temperature, keeping the temperature at 150 ℃ for 50min, and finally foaming and forming, wherein the foaming performance is shown in Table 1.
TABLE 1 bonding Strength of epoxy resin foams
| Sample (I) | Adhesive Strength (MPa) | Form of destruction |
| Example 1 | 6.3 | 2% interfacial failure |
| Comparative example 1 | 2.0 | 67% interfacial failure |
As can be seen from Table 1: compared with the epoxy resin foam prepared in the comparative example 1, the modified epoxy resin foam prepared in the example 1 has the advantages that the bonding performance is greatly improved, the bonding strength is about 3 times that of the unmodified epoxy resin foam, the damage degree of the surface of the base material is greatly reduced, and the modification purpose is achieved.
Claims (10)
1. The preparation method of the epoxy resin foam bonding auxiliary agent is characterized by comprising the following steps:
(1) adding polyisocyanate into a container, adding a solvent, then placing the container into cold water, and stirring under the protection of inert gas;
(2) dropwise adding an aminosilane coupling agent into the solution obtained in the step (1) in a water bath under the protection of inert gas, then stirring for the first time, and then placing the container in warm water for stirring again;
(3) and (3) adding S-glycidol into the solution obtained in the step (2), reacting under the protection of inert gas, and removing the solvent after the reaction is finished to prepare the bonding auxiliary agent.
2. The method for preparing an epoxy resin foam adhesion promoter as claimed in claim 1, wherein the temperature of the cooling water in the step (1) is 0-20 ℃, and the stirring time in the step (1) is 10-20 min.
3. The method of claim 1, wherein the water bath temperature in step (2) is 0-20 ℃, the warm water temperature in step (2) is 70-80 ℃, the primary stirring time in step (2) is 30-60min, and the secondary stirring time in step (2) is 30-60 min.
4. The method for preparing an epoxy resin foam adhesive auxiliary according to claim 1, wherein the reaction temperature in the step (3) is 60-65 ℃, and the reaction time in the step (3) is 2-3 h.
5. The method of claim 1, wherein the solvent in step (1) is one of ethyl acetate, butyl acetate, methyl ethyl ketone, dimethyl carbonate and toluene, and the polyisocyanate in step (1) is one of HDI biuret, HDI trimer, TDI trimer and IPDI trimer.
6. The method of claim 1, wherein the aminosilane coupling agent in step (2) is one or more selected from bis (3-trimethoxysilylpropyl) amine, bis [3- (triethoxysilyl) propyl ] amine, γ -aminopropyltriethoxysilane, γ -aminopropyltrimethoxysilane, N-phenyl- γ -aminopropyltrimethoxysilane, and N-phenylaminomethyl triethoxysilane.
7. The method of claim 1, wherein the molar ratio of the polyisocyanate to the aminosilane coupling agent to the S-glycidol is 1: (1.5-2.5): (0.5-1.5), wherein the molar ratio of the polyisocyanate to the sum of the aminosilane coupling agent and the S-glycidol is 1:3, and the using amount of the solvent is 80-150% of that of the polyisocyanate.
8. An epoxy resin foam adhesion promoter, characterized in that the adhesion promoter is obtained by the method according to any one of claims 1 to 7.
9. The use of an epoxy foam adhesion promoter according to claim 8, comprising the steps of: and (3) uniformly mixing the epoxy resin foam with the bonding auxiliary agent under the conditions of a curing agent, a urea promoter and foaming microspheres, and then preserving heat for 30-60min at the temperature of 130-150 ℃, and finally foaming and molding.
10. The application of the epoxy resin foam adhesive auxiliary agent as claimed in claim 9, wherein the epoxy resin, the curing agent, the urea accelerator, the foaming microspheres and the adhesive auxiliary agent are mixed in a mass ratio of 100 (9-11) to (2-3) to (3-5): (0.5-3).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210075076.5A CN114539622A (en) | 2022-01-22 | 2022-01-22 | Preparation method and application of epoxy resin foam bonding auxiliary agent |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210075076.5A CN114539622A (en) | 2022-01-22 | 2022-01-22 | Preparation method and application of epoxy resin foam bonding auxiliary agent |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115637096A (en) * | 2022-10-31 | 2023-01-24 | 深圳市航天新材科技有限公司 | High-wear-resistance masking liquid composition and preparation method thereof |
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| CN113896852A (en) * | 2021-09-03 | 2022-01-07 | 巩义市泛锐熠辉复合材料有限公司 | Bonding auxiliary agent for foamed plastic, preparation method and application |
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- 2022-01-22 CN CN202210075076.5A patent/CN114539622A/en active Pending
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| JP2005015644A (en) * | 2003-06-26 | 2005-01-20 | Yokohama Rubber Co Ltd:The | New compound and curable resin composition containing the same |
| JP2008111032A (en) * | 2006-10-30 | 2008-05-15 | Yokohama Rubber Co Ltd:The | Urethane adhesive composition |
| CN105176439A (en) * | 2015-08-28 | 2015-12-23 | 上海蒂姆新材料科技有限公司 | Adhesive used adhesion promoter, and synthetic method and applications thereof |
| CN113896852A (en) * | 2021-09-03 | 2022-01-07 | 巩义市泛锐熠辉复合材料有限公司 | Bonding auxiliary agent for foamed plastic, preparation method and application |
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