CN108084950A - A kind of low modulus SPUR silane-modified resin materials and preparation method thereof - Google Patents
A kind of low modulus SPUR silane-modified resin materials and preparation method thereof Download PDFInfo
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- CN108084950A CN108084950A CN201711440541.6A CN201711440541A CN108084950A CN 108084950 A CN108084950 A CN 108084950A CN 201711440541 A CN201711440541 A CN 201711440541A CN 108084950 A CN108084950 A CN 108084950A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
- C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
Abstract
This application involves a kind of low modulus SPUR silane-modified resin materials.The application also provides a kind of method for preparing low modulus SPUR silane-modified resin materials.In the method for preparing low modulus SPUR silane-modified resin materials of the application, by the way that specific polyether polyol is selected to be reacted with organic isocyanate, base polyurethane prepolymer for use as is obtained；Then base polyurethane prepolymer for use as is made to be reacted with the silane coupling agent with different activities group to get low modulus SPUR silane-modified resin materials.The advantageous effect of the application is the low modulus SPUR silane-modified resin materials of the application, and room temperature colorless and odorless is easy to operation, in the product of the low silane-modified fluid sealants of modulus SPUR of preparation, its excellent in stability meets moisture cure crosslinking, available for PC external wall waterproof sealings.
Description
Technical field
This application involves fluid sealant technical fields.Specifically, this application involves a kind of low modulus silicane-modified polyurethanes
(SPUR) silane-modified resin material and preparation method thereof.
Background technology
2016, State Council put into effect the instruction of assembled architecture, specifies and greatly develops assembled architecture and steel
Structure key area, following assembled architecture accounting new building target and give priority to city.Plan to the year two thousand twenty assembled to build
The ratio more than 20% for accounting for new building is built, the ratio more than 50% of new building is accounted for assembled architecture in 2025.For at present,
The preferred low silane-modified fluid sealant of modulus of assembled architecture outer wall waterproof and sealing material, it is silane-modified that this allows for low modulus SPUR
The application amount of resin is greatly improved.
Japanese architecture industry is found：The use of silicone sealant brings huge maintenance cost to building trade.Because
The major structure of construction service life is more than 50 years or even upper a century；And the service life of silicone adhesive was at 20 years or so.In this way, every 20 years,
It needs to remove the old silicone adhesive on building, and needs to be coated with new silicone adhesive again.This needs that substantial amounts of manpower and materials is spent
Solve the problems, such as residual silicone adhesive, consuming is too big, this is why Japanese architecture gradually decreases the main of silicone adhesive in the market
Reason.
At the same time, the low silane-modified fluid sealants of modulus SPUR without primary coat, antiultraviolet, without solvent and silicon, no
Containing isocyanates, heat resistance is strong, the good universal performance such as non-toxic and tasteless, has won the favor of more industry manufacture fields.
In view of the above-mentioned advantage of modified silane glue, the low silane-modified glue of modulus SPUR will necessarily progressively substitute polyurethane in the long run
Glue.At present in Japan, modified silane glue is considerably beyond the market of polyurethane adhesive, and in Europe, the trend is also clearly.
In consideration of it, develop the inexorable trend that the new low silane-modified fluid sealants of modulus SPUR are historical developments.It is new
The advantages of silane-modified fluid sealants of SPUR combine silicone sealant and polyurethane sealant, for assembled architecture field, has
Effect solves assembled architecture outer wall waterproof sealing, paintability, ageing resistance and environment friendly and pollution-free etc..
Therefore, the research of low modulus SPUR silane-modified resins is badly in need of accelerating speed, adapts to the development in market.
The content of the invention
The application's is designed to provide a kind of low modulus SPUR silane-modified resin materials, so as to solve above-mentioned existing skill
The technical issues of in art.The purpose of the application, which also resides in, provides a kind of side for preparing low modulus SPUR silane-modified resin materials
Method.In the method for preparing low modulus SPUR silane-modified resin materials of the application, by selecting specific polyether polyol
It is reacted with organic isocyanate, obtains base polyurethane prepolymer for use as；Then base polyurethane prepolymer for use as and the silicon with different activities group are made
Alkane coupling agent is reacted to get low modulus SPUR silane-modified resin materials.
The low modulus SPUR silane-modified resins material of the application is free of free isocyanate, environment friendly and pollution-free.The application
The prepared silane-modified fluid sealant product of silane-modified resin material assembled architecture outer wall waterproof sealing field should
With and its it is advantageous, the shortcomings that overcoming silicone sealant and polyurethane sealant but simultaneously and remain the advantages of respective.
To achieve these goals, the application provides following technical proposals.
In the first aspect, the application provides a kind of method for preparing low modulus SPUR silane-modified resin materials, described
Method comprises the following steps：
S1：At a temperature of 60-100 DEG C, polyether polyol and organic multiple isocyanate is made to react for the first predetermined time, is obtained
To base polyurethane prepolymer for use as；And
S2：At a temperature of 60-100 DEG C, and under an inert atmosphere, make the base polyurethane prepolymer for use as and silane coupling agent anti-
It answered for the second predetermined time, obtains the low modulus SPUR silane-modified resin materials.
In a kind of embodiment of first aspect, the degree of functionality of the polyether polyol is 2, and number-average molecular weight is
16000。
In a kind of embodiment of first aspect, the GPC molecular weight distributions of the polyether polyol are 1.15.
In a kind of embodiment of first aspect, the method is additionally included in before step S1, to the polyether polyols
Alcohol carries out dehydration degassing process.
In a kind of embodiment of first aspect, dehydration degassing process is carried out to the polyether polyol and is included in vacuum
Under the conditions of and at a temperature of 100-120 DEG C by the polyether polyol handle the 3rd predetermined time.
In a kind of embodiment of first aspect, when the 3rd predetermined time is 2-5 small.
In a kind of embodiment of first aspect, when first predetermined time is 2-5 small；And/or described second is pre-
Fix time for 2-5 it is small when.
In a kind of embodiment of first aspect, the isocyanates includes methyl diphenylene diisocyanate.
In second aspect, the application provide it is a kind of by as described in relation to the first aspect to prepare low modulus SPUR silane-modified
Low modulus SPUR silane-modified resin materials prepared by the method for resin material.
In a kind of embodiment of second aspect, the low modulus SPUR silane-modified resins material with catalyst two
The modulus that dibutyl tin laurate is uniformly mixed and moisture solidification conserves gel after a week in air is less than or equal to 1.3mPa.
Compared with prior art, the advantageous effect of the application is the low modulus SPUR silane-modified resin materials of the application
Material, room temperature colorless and odorless is easy to operation, in the product for preparing the low silane-modified fluid sealants of modulus SPUR, excellent in stability,
Moisture cure crosslinking is met, available for PC external wall waterproof sealings.
Specific embodiment
Unless otherwise indicated, from context cues or the convention of the prior art is belonged to, otherwise number all in the application
Weight is all based on percentage, and test used and characterizing method are all synchronous with the submission date of the application.It is being applicable in
In the case of, any patent, patent application or disclosure involved in the application are fully incorporated in this as reference, and its
Patent families of equal value is also introduced into as reference, disclosed by these special documents in this field synthetic technology, product
With the definition of fabrication design, polymer, comonomer, initiator or catalyst etc..If the specific art disclosed in the prior art
Defining for language is inconsistent with any definition provided herein, then term provided herein of being subject to defines.
Digital scope in the application is approximation, therefore unless otherwise stated, it may include the number beyond scope
Value.Numberical range include with the increased all numerical value from lower limiting value to upper limit value of 1 unit, condition be any lower value with
There are the intervals of at least two unit between arbitrary high value.If for example, compositional, physics or other property (such as molecules
Amount, melt index (MI) etc.) it is 100 to 1000, it is meant that clearly list all single numbers, such as 100,101,102 etc., with
And all subranges, such as 100 to 166,155 to 170,198 to 200 etc..For comprising the numerical value less than 1 or comprising big
In the scope of 1 fraction (such as 1.1,1.5 etc.), then suitably regard 1 unit as 0.0001,0.001,0.01 or 0.1.
For the scope of the units comprising less than 10 (such as 1 to 5), usually regarding 1 unit as 0.1., these are only intended to table
The specific example of the content reached, and all possible combination of the numerical value between cited minimum and peak is all recognized
For clear record in this application.Numberical range in the application particularly provides various comonomers in acrylate copolymer
In content, content of the various components in photoetching compositions, temperature and these components during acrylic ester synthesizing it is each
Kind feature and property.
On chemical compound in use, unless explicitly stated otherwise, otherwise odd number includes all isomeric forms, otherwise also
So (for example, " hexane " either individually or collectively includes whole isomers of hexane).In addition, it unless explicitly stated otherwise, otherwise uses
"one", the noun that " one kind " or "the" are described also includes its plural form.
Term "comprising", " comprising ", " having " and their derivative are not excluded for any other component, step or mistake
The presence of journey, and whether disclose in this application with these other components, step or process unrelated.To eliminate any query,
Unless expressly stated, otherwise all in the application to use term "comprising"s, the composition of " comprising " or " having ", which can include, appoints
What additional additive, auxiliary material or compound.On the contrary, out to necessary to operating characteristics those, term " substantially by ...
Composition " excludes any other component, step or process outside the scope of any term description.Term " by ...
Composition " does not include any component, step or the process that do not specifically describe or list.Unless expressly stated, otherwise term "or" refers to
The separate member listed or any combination thereof.
In the first aspect, the application provides a kind of method for preparing low modulus SPUR silane-modified resin materials, described
Method comprises the following steps：
S1：At a temperature of 60-100 DEG C, polyether polyol and organic multiple isocyanate is made to react for the first predetermined time, is obtained
To base polyurethane prepolymer for use as；And
S2：At a temperature of 60-100 DEG C, and under an inert atmosphere, make the base polyurethane prepolymer for use as and silane coupling agent anti-
It answered for the second predetermined time, obtains the low modulus SPUR silane-modified resin materials.
In second aspect, the application provide it is a kind of by as described in relation to the first aspect to prepare low modulus SPUR silane-modified
Low modulus SPUR silane-modified resin materials prepared by the method for resin material.
In a kind of specific embodiment, this application provides a kind of low modulus SPUR silane-modified resins material and its systems
Preparation Method, the preparation method include the following steps：
(1) by certain molecular weight polyether polyol SD-1003 and organic multiple isocyanate mixing and react, obtain polyurethane
Performed polymer；The polyether polyols alcohol functionalities are 2, number-average molecular weight 16000；
(2) above-mentioned base polyurethane prepolymer for use as and the silane coupling agent with different activities group are carried out instead at a certain temperature
It should be to get to a kind of low modulus SPUR silane-modified resin materials.
In a kind of specific embodiment, in step (1), the polyether polyol SD-1003 is the poly- of conventional commercial
Ethoxylated polyhydric alcohol, degree of functionality 2, number-average molecular weight 16000 are preferably provided by Shanghai Dongda Chemical Co., Ltd..
In a kind of specific embodiment, in step (1), the polyether polyol GPC molecular weight distributions are 1.15.
In a kind of specific embodiment, in step (1), it is preferred that the polyether polyol needs to take off by dehydration
Gas disposal.The dehydration degassing process can be carried out according to this field routine operation：I.e. under certain stirring, pass through heating
It vacuumizes and carries out dehydration degassing.The treatment temperature of the dehydration degassing is preferably 100-120 DEG C, the processing of the dehydration degassing
Time can be this field Conventional Time, such as when 2-3 is small.
In a kind of specific embodiment, in step (1), the isocyanates is isocyanic acid commonly used in the art
Ester.It is preferred that the isocyanates is methyl diphenylene diisocyanate (MDI).The methyl diphenylene diisocyanate
(MDI) can be the MDI of the various specifications of this field conventional commercial, preferably Yantai Wanhua Polyurethane Co., Ltd's production
MDI-50.
In a kind of specific embodiment, in step (1), the reaction is generally in reaction kettle commonly used in the art
Middle progress, the reaction kettle generally are equipped with a blender, a thermocouple thermometer and a vacuum elbow, and the vacuum elbow needs
Connect the vaccum-pumping equipments such as vacuum pump.
In a kind of specific embodiment, in step (1), the temperature that the polyether polyol is mixed with isocyanates can
For this field ordinary temperature, preferably 40-55 DEG C.
In a kind of specific embodiment, in step (1), the temperature of the polyether polyol and isocyanates reaction can
It it is more preferably 80-82 DEG C for the ordinary temperature that such in this field reacts, preferably 75-85 DEG C.
In a kind of specific embodiment, in step (1), the time of the polyether polyol and isocyanates reaction can
For in this field such react Conventional Time, preferably 2-3 it is small when.
In a kind of specific embodiment, in step (1), the isocyanate group (- NCO) of the base polyurethane prepolymer for use as contains
Amount is preferably 0.6%-1.0%, and the percentage accounts for the percentage of base polyurethane prepolymer for use as gross mass for the quality of isocyanate group
Than.
In one preferred embodiment of the application, the preparation process of the base polyurethane prepolymer for use as is as follows：Under stirring, in
At 100-120 DEG C, by polyether polyol vacuumize dehydration degassing process 2-3 it is small when after, being then cooled to 40-55 DEG C and adding in has
Machine polyisocyanate compound, reactive polymeric obtain base polyurethane prepolymer for use as.
In a kind of specific embodiment, in step (2), the silane end-cappers with active group are mostly commercially available
Amino-silane terminated dose of general type.Described amino-silane terminated dose is amino silane commonly used in the art.Preferably, institute
The silane end-cappers with active group are stated as amino silane A-1100, amino silane A-1110, amino silane A-1120, amino
One or more in silane A-1170, amino silane A-2120.The amino silane A-1100, A-1110, A-1120, A-
1170, A-2120 are mostly provided by stepping figure.
In a kind of specific embodiment, in step (2), the additive amount of silane end-cappers is isocyanate group content
90%-110% is preferably 98%-105%.
In a kind of specific embodiment, in step (2), the addition temperature of silane end-cappers is 70-85 DEG C, preferably
For 78-82 DEG C.
In a kind of specific embodiment, in step (2), when the reaction time is 2-3 small after the addition of silane end-cappers.
Present invention also provides low modulus SPUR silane-modified resin materials made from above-mentioned preparation method.
Embodiment
Below in conjunction with embodiments herein, clear and complete description is carried out to the technical solution of the application.Such as nothing
It illustrates, reagent used and raw material can all be bought by commercial sources.Actual conditions is not specified in the following example
Experimental method selects according to conventional methods and conditions or according to product manual.
In following embodiments, polyether polyol SD-1003 is provided by Shanghai Dongda Chemical Co., Ltd., and degree of functionality is
2, number-average molecular weight is 16000.Methyl diphenylene diisocyanate (MDI) is given birth to for Yantai Wanhua Polyurethane Co., Ltd
The MDI-50 of production.
In following implementations, reaction in a reaction kettle equipped with blender, thermocouple thermometer and vacuum plant into
Row.
Embodiment 1
A kind of low modulus SPUR silane-modified resin materials, are made by following preparation method：
(1) 500g polyether polyol SD-1003 is put into reaction kettle, is warming up to 110 DEG C, stirring vacuumizes dehydration degassing 3
Hour, 40 DEG C are cooled to, then adds in 18.6g methyl diphenylene diisocyanates (MDI-50), under 80 DEG C of reaction temperature,
When reactive polymeric 3 is small, 418.6g base polyurethane prepolymer for use as is obtained；Wherein, the degree of functionality of polyether polyol SD-1003 is 2, and number is divided equally
Son amount is 16000；Base polyurethane prepolymer for use as-NCO content be 0.7%；
(2) by under base polyurethane prepolymer for use as stirring obtained by step (1), 19.1g amino is added dropwise under nitrogen protection
Silane A1100, at 80 DEG C react 2-3 it is small when to get.
Embodiment 2
A kind of low modulus SPUR silane-modified resin materials, are made by following preparation method：
(1) 500g polyether polyol SD-1003 is put into reaction kettle, is warming up to 110 DEG C, stirring vacuumizes dehydration degassing 3
Hour, 40 DEG C are cooled to, then adds in 18.6g methyl diphenylene diisocyanates (MDI-50), under 80 DEG C of reaction temperature,
When reactive polymeric 3 is small, 418.6g base polyurethane prepolymer for use as is obtained；Wherein, the degree of functionality of polyether polyol SD-1003 is 2, and number is divided equally
Son amount is 16000；Base polyurethane prepolymer for use as-NCO content be 0.7%；
(2) by under base polyurethane prepolymer for use as stirring obtained by step (1), 15.4g amino is added dropwise under nitrogen protection
Silane A1110, at 80 DEG C react 2-3 it is small when to get.
Embodiment 3
A kind of low modulus SPUR silane-modified resin materials, are made by following preparation method：
(1) 500g polyether polyol SD-1003 is put into reaction kettle, is warming up to 110 DEG C, stirring vacuumizes dehydration degassing 3
Hour, 40 DEG C are cooled to, then adds in 18.6g methyl diphenylene diisocyanates (MDI-50), under 80 DEG C of reaction temperature,
When reactive polymeric 3 is small, 418.6g base polyurethane prepolymer for use as is obtained；Wherein, the degree of functionality of polyether polyol SD-1003 is 2, and number is divided equally
Son amount is 16000；Base polyurethane prepolymer for use as-NCO content be 0.7%；
(2) by under base polyurethane prepolymer for use as stirring obtained by step (1), 19.1g amino is added dropwise under nitrogen protection
Silane A1120, at 80 DEG C react 2-3 it is small when to get.
Embodiment 4
A kind of low modulus SPUR silane-modified resin materials, are made by following preparation method：
(1) 500g polyether polyol SD-1003 is put into reaction kettle, is warming up to 110 DEG C, stirring vacuumizes dehydration degassing 3
Hour, 40 DEG C are cooled to, then adds in 18.6g methyl diphenylene diisocyanates (MDI-50), under 80 DEG C of reaction temperature,
When reactive polymeric 3 is small, 418.6g base polyurethane prepolymer for use as is obtained；Wherein, the degree of functionality of polyether polyol SD-1003 is 2, and number is divided equally
Son amount is 16000；Base polyurethane prepolymer for use as-NCO content be 0.7%；
(2) by under base polyurethane prepolymer for use as stirring obtained by step (1), 29.4g amino is added dropwise under nitrogen protection
Silane A1170, at 80 DEG C react 2-3 it is small when to get.
Embodiment 5
A kind of low modulus SPUR silane-modified resin materials, are made by following preparation method：
(1) 500g polyether polyol SD-1003 is put into reaction kettle, is warming up to 110 DEG C, stirring vacuumizes dehydration degassing 3
Hour, 40 DEG C are cooled to, then adds in 18.6g methyl diphenylene diisocyanates (MDI-50), under 80 DEG C of reaction temperature,
When reactive polymeric 3 is small, 418.6g base polyurethane prepolymer for use as is obtained；Wherein, the degree of functionality of polyether polyol SD-1003 is 2, and number is divided equally
Son amount is 16000；Base polyurethane prepolymer for use as-NCO content be 0.7%；
(2) by under base polyurethane prepolymer for use as stirring obtained by step (1), 17.74g amino is added dropwise under nitrogen protection
Silane A2120, at 80 DEG C react 2-3 it is small when to get.
Effect example
At 25 DEG C, the low modulus SPUR silane-modified resin viscosity of material of embodiment 1-5 is measured respectively, while tests it
With catalyst dibutyltin dilaurylate after mixing, when moisture solidification conserves the modulus of gel, surface drying after a week in air
Between, elongation at break with tensile strength, test result is as shown in the table.
The above-mentioned description to embodiment is understood that for the ease of those skilled in the art and using this Shen
Please.Person skilled in the art obviously easily can make various modifications to these embodiments, and described herein
General Principle is applied in other embodiments without paying performing creative labour.Therefore, the application is not limited to implementation here
Example, those skilled in the art make according to herein disclosed content in the case where not departing from the application scope and spirit
It improves and changes within all scope of the present application.
Claims (10)
1. a kind of method for preparing low modulus SPUR silane-modified resin materials, the described method includes following step：
S1：At a temperature of 60-100 DEG C, polyether polyol and organic multiple isocyanate is made to react for the first predetermined time, is gathered
Urethane performed polymer；And
S2：At a temperature of 60-100 DEG C, and under an inert atmosphere, the base polyurethane prepolymer for use as and silane coupling agent is made to react the
Two predetermined times obtained the low modulus SPUR silane-modified resin materials.
2. the method for low modulus SPUR silane-modified resin materials is prepared as described in claim 1, which is characterized in that described poly-
The degree of functionality of ethoxylated polyhydric alcohol is 2, number-average molecular weight 16000.
3. the method for low modulus SPUR silane-modified resin materials is prepared as described in claim 1, which is characterized in that described poly-
The GPC molecular weight distributions of ethoxylated polyhydric alcohol are 1.15.
4. the method for low modulus SPUR silane-modified resin materials is prepared as described in claim 1, which is characterized in that the side
Method is additionally included in before step S1, and dehydration degassing process is carried out to the polyether polyol.
5. the method for low modulus SPUR silane-modified resin materials is prepared as claimed in claim 4, which is characterized in that described
Polyether polyol, which carries out dehydration degassing process, to be included the polyether polyols under vacuum and at a temperature of 100-120 DEG C
Alcohol handled for the 3rd predetermined time.
6. the method for low modulus SPUR silane-modified resin materials is prepared as claimed in claim 5, which is characterized in that described
When three predetermined times were 2-5 small.
7. the method for preparing low modulus SPUR silane-modified resin materials as any one of claim 1-6, feature
It is, when first predetermined time is 2-5 small；And/or second predetermined time for 2-5 it is small when.
8. the method for preparing low modulus SPUR silane-modified resin materials as any one of claim 1-6, feature
It is, the isocyanates includes methyl diphenylene diisocyanate.
A kind of 9. method for preparing low modulus SPUR silane-modified resin materials by as any one of claim 1-8
Prepared low modulus SPUR silane-modified resin materials.
A kind of 10. low modulus SPUR silane-modified resin materials as claimed in claim 9, which is characterized in that the low modulus
SPUR silane-modified resins material be uniformly mixed with catalyst dibutyltin dilaurylate and in air moisture solidification conserve
The modulus of gel is less than or equal to 1.3mPa after a week.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111704882A (en) * | 2020-05-20 | 2020-09-25 | 宿迁市同创化工科技股份有限公司 | Low-modulus MS glue and preparation method thereof |
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| CN111704882A (en) * | 2020-05-20 | 2020-09-25 | 宿迁市同创化工科技股份有限公司 | Low-modulus MS glue and preparation method thereof |
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