CN114536628A - Rapid hot-pressing device and hot-pressing method for preparing polymer microstructure - Google Patents
Rapid hot-pressing device and hot-pressing method for preparing polymer microstructure Download PDFInfo
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- CN114536628A CN114536628A CN202210062508.9A CN202210062508A CN114536628A CN 114536628 A CN114536628 A CN 114536628A CN 202210062508 A CN202210062508 A CN 202210062508A CN 114536628 A CN114536628 A CN 114536628A
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- 238000007731 hot pressing Methods 0.000 title claims abstract description 61
- 229920000642 polymer Polymers 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims description 16
- 229920000307 polymer substrate Polymers 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 229910001369 Brass Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010951 brass Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 description 13
- 238000011160 research Methods 0.000 description 9
- 238000010023 transfer printing Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004113 cell culture Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a rapid hot-pressing device and a hot-pressing method for preparing a polymer microstructure, wherein the rapid hot-pressing device comprises a support, an upper die plate, a lower die plate and a heating temperature control assembly; the support comprises an upper fixed plate, a lower fixed plate, a movable plate, support columns and linear guide rails, wherein two ends of the linear guide rails and the support columns are respectively connected with the upper fixed plate and the lower fixed plate; the upper die plate and the lower die plate are positioned between the movable plate and the lower fixed plate, the upper die plate and the lower die plate are arranged oppositely, a microstructure is processed on the surface of at least one of the upper die plate and the lower die plate, and a blank polymer matrix to be transferred is placed between the upper die plate and the lower die plate; the side of the movable plate and the side of the lower fixed plate are respectively provided with an accommodating hole, and the heating temperature control assembly is placed in the accommodating holes.
Description
Technical Field
The invention relates to the technical field of hot-pressing dies, in particular to a rapid hot-pressing device and a hot-pressing method for preparing a polymer microstructure.
Background
With the development of material technology, polymers are being applied to more and more occasions. The microstructure is prepared on the surface of the polymer, and can be applied to various application occasions. Such as optical lenses, biological cell culture dishes, etc. Currently, mainstream polymer microstructure preparation processes include laser melting, injection molding, photocuring, hot stamping, and the like.
In order to efficiently produce polymer imprint structures, imprint molds and imprint apparatuses play an important role therein. One set of device that can be used for quick hot stamping can provide important experimental condition and data source for the research of hot stamping technique, has important meaning to polymer thermoforming research.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a quick hot-pressing device for preparing a polymer microstructure, which can realize quick replacement of a hot-pressing die.
The invention also aims to provide a hot-pressing method of the rapid hot-pressing device for preparing the polymer microstructure.
The technical scheme of the invention is as follows: a rapid hot-pressing device for preparing a polymer microstructure comprises a bracket, an upper die plate, a lower die plate and a heating temperature control assembly;
the support comprises an upper fixed plate, a lower fixed plate, a movable plate, support columns and linear guide rails, wherein two ends of the support columns are respectively connected with the upper fixed plate and the lower fixed plate;
the upper die plate and the lower die plate are positioned between the movable plate and the lower fixed plate, the upper die plate and the lower die plate are arranged oppositely, a microstructure is processed on the surface of at least one of the upper die plate and the lower die plate, and a blank polymer matrix to be transferred is placed between the upper die plate and the lower die plate;
and the side surface of the movable plate and the side surface of the lower fixed plate are respectively provided with an accommodating hole, and the heating temperature control assembly is placed in the accommodating holes.
The rapid hot-pressing device for preparing the polymer microstructure can rapidly transfer the microstructure on the surface of the mold to the surface of the polymer, and can be widely applied to relevant experimental researches of a hot-pressing process in a laboratory. The hot-pressing die plate can be replaced quickly aiming at the large number of samples in laboratory research and the need of frequent replacement of the hot-pressing die plate, so that the hot-pressing process research with low cost and multiple parameters is realized.
Furthermore, still include a plurality of springs, a plurality of spring bushings are located the support column outside and are located between fly leaf and the bottom plate. Through setting up the spring, after the impression was accomplished, the spring was supplementary with fly leaf lifting, makes the mould board break away from the base member fast on the messenger, realizes quick drawing of patterns.
Further, the bottom surface of fly leaf and the top surface of bottom plate have seted up the mould board mounting groove respectively, and cope match-plate pattern and bed match-plate pattern are installed respectively to the mould board mounting groove in. Through setting up the mould board mounting groove for the installation of counterpointing more easily when changing upper die plate and lower die plate improves change efficiency.
Further, the side of fly leaf and bottom plate has seted up the installation breach respectively, installation breach and mould board mounting groove intercommunication. Through setting up the installation breach, the convenience is to the dismantlement installation of cope match-plate pattern and bed match-plate pattern.
Further, the heating temperature control assembly comprises a heating rod and a thermocouple, and the heating rod and the thermocouple are respectively installed in the accommodating hole. The heating rod and the thermocouple are respectively electrically connected with an external temperature controller, and the heating temperature is set through the temperature controller.
Further, still include supplementary briquetting, the upper fixed plate runs through and sets up the trompil, and supplementary briquetting is located the trompil, and the one end of supplementary briquetting is connected with the top surface of fly leaf, and the other end passes the trompil. Through the arrangement of the auxiliary pressing block, the external pressing machine can directly apply pressure to the auxiliary pressing block to press the movable plate downwards.
Furthermore, the upper die plate and the lower die plate are both provided with boss structures, the boss structures of the upper die plate and the lower die plate are arranged oppositely, and the surface of the boss structure of at least one of the upper die plate and the lower die plate is processed with a microstructure. The microstructure is processed on the surface of the boss structure of at least one of the upper die plate and the lower die plate, and the microstructure is transferred to the surface of the polymer by using a micro-imprinting technology, so that the method is efficient and rapid.
Further, the upper die plate and the lower die plate are made of red copper, brass, stainless steel or C5191 materials.
The other technical scheme of the invention is as follows: according to the hot pressing method of the rapid hot pressing device for preparing the polymer microstructure, the upper die plate is mounted to the movable plate, the lower die plate is mounted to the lower fixing plate, the upper die plate and the lower die plate are heated to the set temperature T1, a blank polymer matrix to be subjected to transfer printing is placed on the lower die plate, the press presses the movable plate to move downwards to pressurize the blank polymer matrix, pressure is maintained for a certain time, the heating temperature control assembly is closed, the pressurizing state of the press is kept, compressed air is used for forcing the upper die plate and the lower die plate to dissipate heat, after the blank polymer matrix is cooled to the demolding temperature T2, the press stops pressurizing, the movable plate is lifted, a sample subjected to transfer printing is taken out, and one-time hot pressing transfer printing work is completed.
The other technical scheme of the invention is as follows: the hot pressing method of the rapid hot pressing device for preparing the polymer microstructure comprises the steps of preheating a whole support, assembling an upper die plate, a lower die plate and a blank polymer matrix to be subjected to transfer printing into a whole die, clamping the blank polymer matrix to be subjected to transfer printing between the upper die plate and the lower die plate, putting the assembled whole die on a lower fixing plate of the support, preheating to a set temperature T1, pressing a movable plate downwards by a press to pressurize the whole die, maintaining the pressure for a certain time, stopping pressurizing by the press, lifting the movable plate, taking out the whole die, cooling the whole die to a demolding temperature T2 by compressed air, separating the polymer matrix from the upper die plate and the lower die plate, and completing one-time hot pressing transfer printing work.
Compared with the prior art, the invention has the following beneficial effects:
the rapid hot-pressing device for preparing the polymer microstructure can rapidly transfer the microstructure on the surface of the mold to the surface of the polymer, and can be widely applied to relevant experimental researches of a hot-pressing process in a laboratory. The hot-pressing die plate can be replaced quickly aiming at the large number of samples in laboratory research and the need of frequent replacement of the hot-pressing die plate, so that the hot-pressing process research with low cost and multiple parameters is realized.
According to the rapid hot-pressing device for preparing the polymer microstructure, the upper die plate and the lower die plate are both provided with the heating rods and the thermocouples, so that the upper die plate and/or the lower die plate can be independently heated or simultaneously heated, and the rapid hot-pressing device is used for researching isothermal/non-isothermal/upper-lower temperature difference and other hot-pressing processes. Meanwhile, the microstructure can be arranged on the surface of the upper die plate and/or the lower die plate, so that the method is suitable for the research of various hot stamping processes.
Drawings
Fig. 1 is a schematic structural diagram of a rapid hot-pressing apparatus for preparing a polymer microstructure according to the present invention.
Fig. 2 is another schematic structural diagram of the rapid hot-pressing apparatus for preparing a polymer microstructure according to the present invention.
Fig. 3 is a schematic structural view of a lower mold plate according to embodiment 1 of the present invention.
Fig. 4 is a schematic structural view of an upper mold plate according to embodiment 2 of the present invention.
Fig. 5 is a schematic structural view of a lower mold plate according to embodiment 2 of the present invention.
The support frame 1, the upper fixing plate 11, the opening 111, the lower fixing plate 12, the movable plate 13, the support pillar 14, the linear guide rail 15, the linear bearing 16, the mold plate mounting groove 17, the mounting notch 18, the accommodating hole 19, the upper mold plate 2, the lower mold plate 3, the spring 4, the auxiliary pressing block 5, the heating rod 61 and the thermocouple 62.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
Example 1
As shown in fig. 1 and fig. 2, the rapid hot-pressing apparatus for preparing a polymer microstructure in this embodiment includes a support 1, an upper mold plate 2, a lower mold plate 3, a heating temperature control assembly, a spring 4, and an auxiliary pressing block 5.
As shown in fig. 1 and 2, the support includes an upper fixing plate 11, a lower fixing plate 12, a movable plate 13, support columns 14 and linear guide rails 15, two ends of the plurality of support columns are respectively connected with the upper fixing plate and the lower fixing plate, two ends of the linear guide rails are respectively connected with the upper fixing plate and the lower fixing plate, the movable plate is located between the upper fixing plate and the lower fixing plate, the support columns and the linear guide rails both penetrate through the movable plate, the movable plate is slidably connected with the linear guide rails through linear bearings 16, and the plurality of spring sleeves are located outside the support columns and between the movable plate and the lower fixing plate. Through setting up the spring, after the impression was accomplished, the spring was supplementary with fly leaf lifting, makes the mould board break away from the base member fast on the messenger, realizes quick drawing of patterns.
As shown in fig. 1 and 2, in the present embodiment, the upper mold plate is connected to the bottom surface of the movable plate, the lower mold plate is connected to the top surface of the lower fixed plate, the upper mold plate and the lower mold plate are disposed opposite to each other, and a microstructure is processed on a surface of at least one of the upper mold plate and the lower mold plate. In this embodiment, the bottom surface of the movable plate and the top surface of the lower fixing plate are respectively opened with a mold plate mounting groove 17, and the upper mold plate and the lower mold plate are respectively mounted in the mold plate mounting grooves. Through setting up the mould board mounting groove for the installation of counterpointing more easily when changing upper die plate and lower die plate improves change efficiency. The side surfaces of the movable plate and the lower fixed plate are respectively provided with an installation notch 18, the installation notches are communicated with the die plate installation grooves, and the width of each installation notch is 10mm, and the depth of each installation notch is 1 mm. Through setting up the installation breach, the convenience is to the dismantlement installation of cope match-plate pattern and bed match-plate pattern.
As shown in fig. 1, 2 and 3, the upper and lower mold plates are made of copper, brass, stainless steel or C5191 material. The upper die plate and the lower die plate are both provided with boss structures, the boss structures of the upper die plate and the lower die plate are arranged oppositely, and the surface of the boss structure of at least one of the upper die plate and the lower die plate is provided with a microstructure. The microstructure is processed on the surface of the boss structure of at least one of the upper die plate and the lower die plate, and the microstructure is transferred to the surface of the polymer by using a micro-imprinting technology, so that the method is efficient and rapid. In this embodiment, go up the bolt hole that is 3.2mm in diameter that is equipped with all around of template and bed die board, the bolt hole that corresponds template and bed die board in the template mounting groove of fly leaf and bottom plate is equipped with the mounting hole, through the bolt with template and bed die board fixed to the template mounting groove in. The microstructure on the surface of the boss structure can be obtained by adopting the modes of linear cutting, etching or laser processing and the like.
As shown in fig. 1 and 2, the side surface of the movable plate and the side surface of the lower fixing plate are respectively provided with receiving holes 19, and the heating temperature control assembly is placed in the receiving holes and used for heating the upper mold plate and the lower mold plate. The heating temperature control assembly comprises a heating rod 61 and a thermocouple 62, and the heating rod and the thermocouple are respectively installed in the accommodating holes. The heating rod and the thermocouple are respectively electrically connected with an external temperature controller, and the heating temperature is set through the temperature controller. The containing hole is positioned in the horizontal projection range of the upper die plate and the lower die plate. In this example, the heating rod was set in a receiving hole having a diameter of 8mm from the surface of the die plate and the thermocouple was set in a receiving hole having a diameter of 4mm from the surface of the die plate by 5.5 mm.
As shown in fig. 1 and 2, the upper fixing plate is provided with an opening 111 through which the auxiliary pressing block is located, one end of the auxiliary pressing block is connected to the top surface of the movable plate, and the other end of the auxiliary pressing block passes through the opening. Through the arrangement of the auxiliary pressing block, the external pressing machine can directly apply pressure to the auxiliary pressing block to press the movable plate downwards.
The bottom surface of bottom plate is connected with the mica plate of 5mm thick, reduces the bottom plate and contacts the calorific loss that leads to with the external world.
According to the hot pressing method of the rapid hot pressing device for preparing the polymer microstructure, the upper die plate adopts a blank plate, and the lower die plate is provided with the microstructures with the depth and the width of 0.3mm and 0.4mm respectively and the interval of 0.6 mm. The upper die plate is mounted to the movable plate, the lower die plate is mounted to the lower fixed plate, the heating temperature control assembly is opened, the upper die plate and the lower die plate are heated to a set temperature T1, a blank polymer matrix to be transferred is placed on the lower die plate, the movable plate is pressed by the press to move downwards to pressurize the blank polymer matrix, the pressure is maintained for 90 seconds, the heating temperature control assembly is closed, the pressurizing state of the press is maintained, the upper die plate and the lower die plate are forced to dissipate heat by compressed air, after the blank polymer matrix is cooled to a demolding temperature T2, the press stops pressurizing and rises, the movable plate is separated from the upper surface of the matrix along with the press due to the elasticity of a spring, a sample after transfer printing is taken out, and one-time hot-pressing transfer printing work is completed.
Example 2
As shown in fig. 4 and 5, the difference between the present embodiment and embodiment 1 is that microstructures are processed on both the upper mold plate and the lower mold plate in the present embodiment, the microstructures on the upper mold plate are dot matrix dots, the microstructures on the lower mold plate are V-shaped grooves, the base material is PMMA, and the present embodiment is used for imprinting the double-sided microstructures of the light guide plate.
Example 3
The difference between this embodiment and embodiment 1 is that, in the hot pressing method of the rapid hot pressing apparatus for preparing a polymer microstructure, firstly, the entire support is preheated, the upper mold plate, the lower mold plate and the blank polymer substrate to be transferred are assembled into a mold whole, the blank polymer substrate to be transferred is clamped between the upper mold plate and the lower mold plate, the assembled mold whole is placed on the lower fixing plate of the support to be preheated to the set temperature T1, the press presses the movable plate to move downward to pressurize the mold whole, the pressure is maintained for 90 seconds, the press stops pressurizing, the movable plate is lifted, the mold whole is taken out, the mold whole is cooled to the demolding temperature T2 by using compressed air, the polymer substrate is separated from the upper mold plate and the lower mold plate, and a hot pressing transfer work is completed.
Different from the mode that traditional little hot-pressing needs to heat up earlier to the device wholly, cool down again, heat up again, the hot pressing method that this paper provided benefits from the whole high-efficient separation of mould, and the cooling process only needs to carry out local cooling after wholly breaking away from the support with the mould can. Meanwhile, after the die is integrally separated from the support, the integral hot pressing of another die can be carried out, and the hot pressing efficiency is improved.
As mentioned above, the present invention can be better realized, and the above embodiments are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; all equivalent changes and modifications made according to the present disclosure are intended to be covered by the scope of the claims of the present invention.
Claims (10)
1. A rapid hot-pressing device for preparing a polymer microstructure is characterized by comprising a bracket, an upper die plate, a lower die plate and a heating temperature control assembly;
the support comprises an upper fixed plate, a lower fixed plate, a movable plate, support columns and linear guide rails, wherein two ends of the support columns are respectively connected with the upper fixed plate and the lower fixed plate;
the upper die plate and the lower die plate are positioned between the movable plate and the lower fixed plate, the upper die plate and the lower die plate are arranged oppositely, a microstructure is processed on the surface of at least one of the upper die plate and the lower die plate, and a blank polymer matrix to be transferred is placed between the upper die plate and the lower die plate;
and the side surface of the movable plate and the side surface of the lower fixed plate are respectively provided with an accommodating hole, and the heating temperature control assembly is placed in the accommodating holes.
2. The rapid hot-pressing device for preparing a polymer microstructure according to claim 1, further comprising a plurality of springs, wherein the springs are sleeved outside the supporting column and located between the movable plate and the lower fixing plate.
3. The rapid hot-pressing apparatus according to claim 1, wherein the bottom surface of the movable plate and the top surface of the lower fixed plate are respectively provided with a mold plate mounting groove, and the upper mold plate and the lower mold plate are respectively mounted in the mold plate mounting grooves.
4. The rapid hot-pressing device for preparing a polymer microstructure according to claim 3, wherein mounting notches are respectively formed in the side surfaces of the movable plate and the lower fixed plate, and the mounting notches are communicated with the die plate mounting groove.
5. The rapid hot-pressing device for preparing the polymer microstructure according to claim 1, wherein the heating and temperature control assembly comprises a heating rod and a thermocouple, and the heating rod and the thermocouple are respectively installed in the accommodating holes.
6. The rapid hot-pressing device for preparing a polymer microstructure according to claim 1, further comprising an auxiliary pressing block, wherein the upper fixing plate is provided with an opening in a penetrating manner, the auxiliary pressing block is located in the opening, one end of the auxiliary pressing block is connected with the top surface of the movable plate, and the other end of the auxiliary pressing block penetrates through the opening.
7. The rapid hot-pressing apparatus according to claim 1, wherein the upper mold plate and the lower mold plate are provided with a boss structure, the boss structure of the upper mold plate and the boss structure of the lower mold plate are disposed opposite to each other, and a microstructure is processed on the surface of the boss structure of at least one of the upper mold plate and the lower mold plate.
8. The rapid hot-pressing apparatus for polymer microstructure preparation according to claim 1, wherein the upper and lower mold plates are made of red copper, brass, stainless steel or C5191 material.
9. The hot-pressing method of a rapid hot-pressing apparatus for making polymer microstructures according to any one of claims 1 to 8, wherein the upper mold plate is mounted to a movable plate, the lower mold plate is mounted to a lower fixed plate, the upper mold plate and the lower mold plate are heated to a predetermined temperature T1, the blank polymer substrate to be transferred is placed on the lower mold plate, the movable plate is pressed by a press to move downward to pressurize the blank polymer substrate, the blank polymer substrate is maintained for a predetermined time, the heating temperature control assembly is closed, the pressurized state of the press is maintained, the upper mold plate and the lower mold plate are forced to dissipate heat by compressed air, after cooling to a mold release temperature T2, the press stops pressurizing, the movable plate is raised, and the transferred sample is taken out to complete a hot-pressing transfer operation.
10. The hot-pressing method of a rapid hot-pressing apparatus for making a polymer microstructure according to any one of claims 1 to 8, wherein the entire frame is first preheated, the upper mold plate, the lower mold plate and the blank polymer substrate to be transferred are assembled into a mold assembly, the blank polymer substrate to be transferred is clamped between the upper mold plate and the lower mold plate, the assembled mold assembly is then placed on the lower fixing plate of the frame to be preheated to the set temperature T1, the movable plate is pressed by the press to move downward to pressurize the mold assembly, the pressure is maintained for a certain time, the press stops pressurizing, the movable plate is lifted to take out the mold assembly, the mold assembly is cooled to the demoldability temperature T2 by compressed air, the polymer substrate is separated from the upper mold plate and the lower mold plate, and a hot-pressing transfer work is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210062508.9A CN114536628A (en) | 2022-01-19 | 2022-01-19 | Rapid hot-pressing device and hot-pressing method for preparing polymer microstructure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210062508.9A CN114536628A (en) | 2022-01-19 | 2022-01-19 | Rapid hot-pressing device and hot-pressing method for preparing polymer microstructure |
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| CN106938534A (en) * | 2017-04-05 | 2017-07-11 | 华南理工大学 | The quick heat pressing forming device and method of a kind of micro- arch lens array of macro surface |
| CN212770784U (en) * | 2020-07-13 | 2021-03-23 | 上海众邦制版科技有限公司 | Leather embossing machine |
| CN214820862U (en) * | 2021-04-09 | 2021-11-23 | 东莞市欧亚轩装饰建材有限公司 | Surface grain forming die of artificial stone |
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Application publication date: 20220527 |