CN214687481U

CN214687481U - Die pressing device

Info

Publication number: CN214687481U
Application number: CN202120721038.3U
Authority: CN
Inventors: 岳胜武
Original assignee: Shenzhen Kanglibang Technology Co ltd
Current assignee: Shenzhen Kanglibang Technology Co ltd
Priority date: 2021-04-08
Filing date: 2021-04-08
Publication date: 2021-11-12
Anticipated expiration: 2031-04-08

Abstract

The utility model relates to a molding device, which comprises a frame, set up in a plurality of guide bars of frame, sliding connection is in the lift platform of guide bar, a mold, set up the lower hot plate on lift platform, set up in the fixed platform of guide bar upper end, set up the lift cylinder that upper heating plate and drive lift platform under the fixed platform removed to the direction that is close to or keeps away from the upper heating plate, the mold sets up on the hot plate down, be provided with down heat insulating board and lower buffer board down between hot plate and the lift platform down, lower buffer board fixed connection is between lower heat insulating board and the lower hot plate, be provided with heat insulating board and last buffer board between upper heating board and the fixed platform, it connects between upper heating board and the upper heating board to go up buffer board fixed connection. This application provides certain buffering for raw and other materials in the mould for the increase of raw and other materials atress size is comparatively slow, and then makes the carrying on pressfitting that raw and other materials can be better, is favorable to reducing the damage to the mould surface simultaneously.

Description

Die pressing device

Technical Field

The application relates to the field of organic silicon material production equipment, in particular to a mould pressing device.

Background

The molding press has a wide variety of types and a wide application range, and generally, a material is placed or poured on a lower mold, and a driving device drives an upper mold to extrude the lower mold, so as to form the material.

In the process of pressing down by the upper die, the upper die can rapidly generate large impact force when stamping the lower die, the surface of the die is easily damaged for a long time, and the pressing between raw materials can not be well performed, so that the processing quality of products in later period is influenced.

SUMMERY OF THE UTILITY MODEL

In order to improve the damage of impact force generated in the stamping process of a stamping machine to a die, the application provides a die pressing device.

The application provides a molding device adopts following technical scheme:

the utility model provides a molding device, includes the frame, set up in a plurality of guide bars of frame, sliding connection in the lift platform of guide bar, be used for placing the mould of treating pressfitting raw and other materials, set up lower hot plate on lift platform, set up in the fixed platform of guide bar upper end, set up in the last hot plate under the fixed platform and drive lift platform to the direction removal of being close to or keeping away from the last hot plate, the mould sets up under on the hot plate, be provided with down heat insulating board and lower buffer board down between hot plate and the lift platform, buffer board fixed connection is between lower heat insulating board and the lower hot plate down, it is provided with heat insulating board and last buffer board to go up between hot plate and the fixed platform, it fixed connection is between last heat insulating board and the last hot plate to go up the buffer board.

Through adopting above-mentioned technical scheme, start the lift cylinder, lift cylinder drive lift platform is along the length direction reciprocating motion of deflector bar, thereby make down the heater plate movable mould to the direction removal of being close to or keeping away from the hot plate, and then realize the punching press of raw and other materials in the mould, go up the buffer board and adopt soft materials with lower buffer board, for example HIPADS high temperature blotter, make lift platform drive mould in-process that rises, it provides certain buffering to go up the buffer board and provide with lower buffer board for the raw and other materials in the mould, make the increase of raw and other materials atress size comparatively slow, and then make the better pressfitting that carries on of raw and other materials ability, be favorable to reducing the damage to the mould surface simultaneously.

Preferably, a plurality of positioning rods are arranged on the lower heating plate, a plurality of positioning holes used for being in plug-in fit with the positioning rods are formed in the die, and the height of each positioning rod is smaller than or equal to the thickness of the die.

Through adopting above-mentioned technical scheme, aim at the locating lever with the locating hole on the mould to make the locating lever insert to the locating hole that corresponds, can fix a position the mould, be convenient for the installation and the dismantlement of mould when increasing the stability of mould.

Preferably, still be provided with in the frame and be used for pushing out the actuating mechanism of lift platform in order to carry out the blowing or get the material with the mould, actuating mechanism includes two interval and parallel arrangement's track board and sets up in the push cylinder of hot plate or heat insulating board down, two the track board all sets up in lift platform, two the track board is located the both sides of heat insulating board down respectively, the heat insulating board is used for and track board sliding fit down.

Through adopting above-mentioned technical scheme, the change of mould position is convenient for the blowing and is got the material, is favorable to reducing the staff and is scalded by the waste heat of hot plate and last hot plate down.

Preferably, the opposite sides of the two track plates are both provided with a sliding groove, the length direction of the sliding groove is arranged along the length direction of the track plate, and the two opposite sides of the lower heat insulation plate are used for being in sliding fit with the two sliding grooves.

Through adopting above-mentioned technical scheme, simple structure is convenient for maintain.

Preferably, actuating mechanism is still including setting up in the mounting panel of heat insulating board, lower buffer board and lower hot plate down, the mounting panel is located between two track boards, the cylinder body that promotes the cylinder sets up in the frame, the output that promotes the cylinder sets up in the mounting panel.

Through adopting above-mentioned technical scheme, be convenient for move when heat insulating board, lower buffer board and lower hot plate down, improve the stability of mould, be favorable to prolonging the life of heat insulating board, lower buffer board and lower hot plate down.

Preferably, the mold comprises a lower mold base and an upper mold base, the lower mold base is used for being arranged on the upper surface of the lower heating plate, the upper mold base is arranged above the lower mold base, one side of the upper mold base is hinged to one side of the lower mold base, and a vulcanization cavity for placing raw materials is arranged on the upper surface of the lower mold base.

Through adopting above-mentioned technical scheme, place raw and other materials in vulcanizing the intracavity, after closing the upper die base, start the lift cylinder, lift cylinder drive lift platform removes in order to realize the mould pressing to the direction that is close to fixed platform, and lower hot plate and last hot plate give the mould with heat transfer to make the raw and other materials of vulcanizing the intracavity better carry out the vulcanization process.

Preferably, the lower die holder and the upper die holder are fixedly connected with handles on the sides far away from the hinged position of the die, and the handles are sleeved with rubber sleeves.

Through adopting above-mentioned technical scheme, the staff of being convenient for gets material and blowing.

Preferably, the height of the positioning rod is greater than the thickness of the lower die holder.

Through adopting above-mentioned technical scheme, the height of locating lever is greater than the thickness of die holder to make the locating lever wear to locate the locating hole on die holder and the upper die base in proper order, and the locating lever keeps away from the one end of hot plate down in the locating hole of upper die base, in order to avoid the locating lever to interfere the punching press stroke of raw and other materials.

In summary, the present application includes at least one of the following beneficial technical effects:

1. by arranging the lower buffer plate and the upper buffer plate which are simple in structure, the upper buffer plate and the lower buffer plate provide certain buffer for raw materials in the die in the process that the lifting platform drives the die to ascend, so that the stress of the raw materials is increased slowly, the raw materials can be pressed better, and meanwhile, the damage to the surface of the die is reduced;

2. by arranging the driving mechanism, the material taking and discharging are facilitated, the stability of the die is improved, and the service lives of the lower heat insulation plate, the lower buffer plate and the lower heating plate are prolonged;

3. through setting up a plurality of locating levers, improve the stability of mould, the installation and the dismantlement of the mould of being convenient for.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the present application.

Fig. 2 is a schematic structural diagram of another view angle in the embodiment of the present application.

Description of reference numerals: 1. a frame; 2. a guide bar; 3. a lifting platform; 4. a lifting cylinder; 5. a lower heating plate; 6. a mold; 61. a lower die holder; 62. an upper die holder; 7. a fixed platform; 8. an upper heating plate; 9. a lifting channel; 10. a handle; 11. a lower heat insulation plate; 12. a lower buffer plate; 13. an upper heat insulation plate; 14. an upper buffer plate; 15. a track plate; 16. mounting a plate; 17. a push cylinder; 18. a sliding groove.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses a molding device. Referring to fig. 1, the molding device includes a frame 1, a plurality of guide rods 2, a lifting platform 3, a lifting cylinder 4, a lower heating plate 5, a mold 6, a fixing platform 7, and an upper heating plate 8, and in this embodiment, the number of guide rods 2 is not limited, which is exemplified by four guide rods 2.

Four guide bars 2 are fixed connection respectively in the position that is close to four corners of frame 1 up end, and four guide bars 2 all set up perpendicularly in frame 1 up end, and four guide bars 2 are parallel arrangement each other, and four guide bars 2 enclose into the lift passageway 9 of transversal personally submitting the rectangle. The positions, close to four corners, of the lifting platform 3 are respectively connected to the four guide rods 2 in a sliding mode, a cylinder body of the lifting cylinder 4 is fixedly connected to the rack 1, the output end of the lifting cylinder 4 is fixedly connected to the lifting platform 3, the lower heating plate 5 is arranged on the upper surface of the lifting platform 3, and the die 6 is arranged on the upper surface of the lower heating plate 5; the fixed platform 7 is fixedly connected with the upper end part of the guide rod 2, and the upper heating plate 8 is arranged on one side of the fixed platform 7 close to the lower heating plate 5; starting lifting cylinder 4, lifting cylinder 4 drive lift platform 3 is along the length direction reciprocating motion of guide bar 2 to make lower hot plate 5 drive mould 6 and remove to the direction that is close to or keeps away from upper hot plate 8, and then realize the punching press of raw and other materials.

The die 6 comprises a lower die base 61 and an upper die base 62, the lower die base 61 is used for being arranged on the upper surface of the lower heating plate 5, the upper die base 62 is positioned above the lower die base 61, and one side of the upper die base 62 is hinged with one side of the lower die base 61. The upper surface of the lower die base 61 is provided with a vulcanization cavity for placing raw materials; place raw and other materials in vulcanizing the intracavity, after closing upper die base 62, start lift cylinder 4, lift cylinder 4 drive lift platform 3 removes in order to realize the mould pressing to the direction that is close to fixed platform 7, and lower hot plate 5 and upper hot plate 8 give mould 6 with heat transfer to make the raw and other materials in vulcanizing the intracavity carry out vulcanization process better. The equal fixedly connected with handle 10 in one side that mould 6 articulated department was kept away from to die holder 61 and upper die base 62, handle 10 cover is equipped with the rubber sleeve and prevents scalding.

Lower heat insulating board 11 and lower buffer board 12 are provided with down between lower hot plate 5 and the lift platform 3, and lower heat insulating board 11 and the sliding fit of lift platform 3, lower buffer board 12 fixed connection are between lower heat insulating board 11 and lower hot plate 5, and the upper surface of lower buffer board 12 is used for the lower surface contact with lower hot plate 5, and the lower surface of lower buffer board 12 is used for the upper surface contact with lower heat insulating board 11. An upper heat insulation plate 13 and an upper buffer plate 14 are arranged between the upper heating plate 8 and the fixed platform 7, the upper heat insulation plate 13 is fixedly connected to the fixed platform 7, the upper buffer plate 14 is fixedly connected between the upper heat insulation plate 13 and the upper heating plate 8, the lower surface of the upper buffer plate 14 is used for being in contact with the upper surface of the upper heating plate 8, and the upper surface of the upper buffer plate 14 is used for being in contact with the lower surface of the upper heat insulation plate 13. Go up buffer board 14 and lower buffer board 12 and adopt soft material, go up buffer board 14 and lower buffer board 12 and exemplify with the HIPADS high temperature buffer pad of choosing to purchase from the science and technology of Ruichang star to not injecing the material of going up buffer board 14 and lower buffer board 12, can choose for use silica gel, rubber, cystosepiment etc. in other embodiments.

The in-process that lift platform 3 drove mould 6 to rise, goes up buffer board 14 and lower buffer board 12 and provides certain buffering for the raw and other materials of vulcanizing the intracavity for the increase of raw and other materials atress size is comparatively slow, and then makes the better pressfitting that carries on of raw and other materials ability, is favorable to reducing the damage to mould 6 surface simultaneously.

The upper surface of the lower heating plate 5 is fixedly connected with a plurality of positioning rods which are vertically arranged on the upper heating plate 8 and are arranged in parallel; a plurality of locating holes have been seted up to mould 6, the locating hole runs through die holder 61 and upper die base 62, the locating lever is used for inserting the locating hole, the height of locating lever is less than or equal to mould 6's thickness, the height of locating lever is greater than the thickness of die holder 61, so that the locating hole on die holder 61 and the upper die base 62 can be worn to locate in proper order by the locating lever, and the locating lever is kept away from down the one end of hot plate 5 in the locating hole of upper die base 62, in order to avoid the locating lever to interfere the stamping stroke of raw and other materials. Each positioning rod corresponds to one positioning hole, the positioning holes in the die 6 are aligned with the positioning rods, and the positioning rods are inserted into the corresponding positioning holes, so that the die 6 can be positioned. In this embodiment, the example of setting four positioning rods is taken, and the number of the positioning rods is not limited; the four positioning holes are respectively positioned at the positions of the die 6 close to the four corners.

Referring to fig. 1 and 2, a driving mechanism is further arranged on the frame 1, and is used for pushing the mold 6 out of the lifting channel 9 to discharge or take materials, and the driving mechanism includes two track plates 15, a mounting plate 16 and a pushing cylinder 17; two track boards 15 all fixed connection in lift platform 3, two track boards 15 interval and parallel arrangement, two track boards 15 are located the both sides of heat insulating board 11 down respectively, the length direction of track board 15 is perpendicular to the length direction of guide bar 2, two track boards 15 outwards extend lift passageway 9 with the one end of one side, sliding tray 18 has all been seted up to two track boards 15 relative one side, the length direction of sliding tray 18 sets up along the length direction of track board 15, the relative both sides of heat insulating board 11 are used for with two sliding tray 18 sliding fit down. The mounting plate 16 is in contact with the lower heat insulation plate 11, the lower buffer plate 12 and the lower heating plate 5, the mounting plate 16 is fixedly connected to one side of the lower heat insulation plate 11, the lower buffer plate 12 and the lower heating plate 5, and the mounting plate 16 is located between the two track plates 15. The cylinder body of the pushing cylinder 17 is fixedly connected to the frame 1, and the output end of the pushing cylinder 17 is fixedly connected to the mounting plate 16.

The pushing cylinder 17 is started to extend the piston rod, the piston rod pushes the die 6 to move in the direction away from the lifting channel 9 through the mounting plate 16 until the die 6 moves out of the lifting channel 9, and the upper die base 62 can be turned upwards to open the die 6, so that discharging or taking is performed.

The implementation principle of a molding device in the embodiment of the application is as follows: put into the vulcanization chamber with raw and other materials to upset upper die base 62 is in order to close mould 6, open lift cylinder 4, lift cylinder 4 promotes mould 6 and removes in order to carry out the punching press stroke to the direction that is close to upper heating plate 8, vulcanize the raw and other materials in the intracavity and finish the back, open and promote push cylinder 17, promote push cylinder 17 and promote mould 6 and remove to the direction of keeping away from lift passageway 9, until mould 6 breaks away from lift passageway 9, after mould 6 breaks away from lift passageway 9, upwards overturn upper die base 62 and open mould 6, can put the blowing or get the material, so circulate.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A molding apparatus, characterized in that: comprises a frame (1), a plurality of guide rods (2) arranged on the frame (1), a lifting platform (3) connected with the guide rods (2) in a sliding manner, a mould (6) used for placing raw materials to be pressed, a lower heating plate (5) arranged on the lifting platform (3), a fixed platform (7) arranged at the upper end part of the guide rods (2), an upper heating plate (8) arranged below the fixed platform (7) and a lifting cylinder (4) driving the lifting platform (3) to move towards the direction close to or away from the upper heating plate (8), wherein the mould (6) is arranged on the lower heating plate (5), a lower heating plate (11) and a lower buffer plate (12) are arranged between the lower heating plate (5) and the lifting platform (3), the lower buffer plate (12) is fixedly connected between the lower heat insulation plate (11) and the lower heat insulation plate (5), an upper buffer plate (13) and an upper buffer plate (14) are arranged between the upper heating plate (8) and the fixed platform (7), the upper buffer plate (14) is fixedly connected between the upper heat insulation plate (13) and the upper heating plate (8).

2. The embossing apparatus as set forth in claim 1, wherein: a plurality of positioning rods are arranged on the lower heating plate (5), a plurality of positioning holes used for being in plug-in fit with the positioning rods are formed in the die (6), and the height of each positioning rod is smaller than or equal to the thickness of the die (6).

3. The embossing apparatus as set forth in claim 1, wherein: still be provided with on frame (1) and be used for releasing lift platform (3) with mould (6) in order to carry out the blowing or get actuating mechanism of material, actuating mechanism includes track board (15) of two intervals and parallel arrangement and sets up in push cylinder (17) of hot plate (5) or heat insulating board (11) down, two track board (15) all set up in lift platform (3), two track board (15) are located the both sides of heat insulating board (11) down respectively, heat insulating board (11) are used for with track board (15) sliding fit down.

4. The embossing apparatus as set forth in claim 3, wherein: the two opposite sides of the track plates (15) are provided with sliding grooves (18), the length direction of each sliding groove (18) is arranged along the length direction of the track plate (15), and the two opposite sides of the lower heat insulation plate (11) are used for being in sliding fit with the two sliding grooves (18).

5. The embossing apparatus as set forth in claim 3, wherein: actuating mechanism is still including setting up in mounting panel (16) of heat insulating board (11), lower buffer board (12) and lower hot plate (5) down, mounting panel (16) are located between two track boards (15), the cylinder body that promotes cylinder (17) sets up in frame (1), the output that promotes cylinder (17) sets up in mounting panel (16).

6. The embossing apparatus as set forth in claim 2, wherein: the die (6) comprises a lower die base (61) and an upper die base (62), wherein the lower die base (61) is used for being arranged on the upper surface of the lower heating plate (5), the upper die base (62) is located above the lower die base (61), one side of the upper die base (62) is hinged to one side of the lower die base (61), and a vulcanization cavity for placing raw materials is formed in the upper surface of the lower die base (61).

7. The embossing apparatus as set forth in claim 6, wherein: the die is characterized in that a handle (10) is fixedly connected to one side, away from the hinged position of the die (6), of the lower die holder (61) and the upper die holder (62), and a rubber sleeve is sleeved on the handle (10).

8. The embossing apparatus as set forth in claim 7, wherein: the height of the positioning rod is larger than the thickness of the lower die holder (61).