CN114536176A - Target R-angle semi-automatic polishing system device, polishing method and application - Google Patents
Target R-angle semi-automatic polishing system device, polishing method and application Download PDFInfo
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- CN114536176A CN114536176A CN202210320253.1A CN202210320253A CN114536176A CN 114536176 A CN114536176 A CN 114536176A CN 202210320253 A CN202210320253 A CN 202210320253A CN 114536176 A CN114536176 A CN 114536176A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a semi-automatic polishing system device, a polishing method and application of an R angle of a target, wherein the system device comprises a base, at least one polishing unit is arranged on the surface of the base, the polishing unit comprises at least two polishing components, at least one first sliding groove is formed in the surface of the base, the polishing components move in the first sliding groove and comprise a body and a base which are rotationally connected, and at least two polishing wheels are arranged on the body. The invention can effectively remove the oxide on the side edge of the target, improve the working efficiency, reduce the physical output of personnel, save the operation time and realize that the R angle polishing of the aluminum target enters semi-automation.
Description
Technical Field
The invention belongs to the technical field of magnetron sputtering coating, relates to target polishing, and particularly relates to a target R-angle semi-automatic polishing system device, a polishing method and application.
Background
The sputtering target is used for magnetron sputtering coating, and the sputtering coating is a novel Physical Vapor Deposition (PVD) mode. An orthogonal magnetic field and an electric field are added between a sputtered target pole (cathode) and an anode, required inert gas (usually Ar gas) is filled in a high vacuum chamber, the Ar gas is ionized into positive ions and electrons under the action of the electric field, certain negative high voltage is added on the target, the ionization probability of the electrons emitted from the target pole under the action of the magnetic field and working gas is increased, high-density plasma is formed near the cathode, the Ar ions accelerate to fly to the target surface under the action of Lorentz force, and bombard the target surface at high speed, so that atoms sputtered from the target fly to a substrate by high kinetic energy according to a momentum conversion principle to deposit a film.
In the manufacture of modern TFT-LCD (thin film transistor liquid crystal display), the molybdenum film is mainly used for a barrier layer of Al in a conductive film and is partially used for a barrier layer of Cu, and the main requirements of the TFT-LCD on the conductive film are as follows: low resistivity, good uniformity, smooth profile, good adhesion, good step coverage, minimal stress, minimal anomalous protrusions, minimal electron mobility, etc., and thus, it is desirable to polish the surface thereof to improve the uniformity of the outer surface.
CN204195523U discloses a polishing machine with a fine adjustment mechanism of a polishing device, which comprises a machine base and a polishing device, wherein a workpiece table is arranged below the polishing device, a rotating device is arranged on the machine base, a rotating end of the rotating device is provided with a rotating frame plate, the rotating frame plate is provided with the fine adjustment mechanism, the fine adjustment mechanism comprises a sliding seat and a sliding plate i arranged on the sliding seat, a sliding guide rail i is arranged between the sliding seat and the sliding plate i, and the polishing device is fixed on the sliding plate i.
CN203092298U discloses a polishing device capable of changing polishing direction, which comprises a beam, wherein an installation plate is arranged at the end of the beam, a tray is installed at the bottom of the installation plate, a rotating seat is arranged on the tray, a connecting rod is arranged at the left side of the rotating seat, a turnover plate is connected to the rotating seat through a bearing, the right end of the turnover plate is connected with a polishing arm, and the left end of the turnover plate is provided with a cylinder fixing plate; the polishing arm is characterized in that a transmission disc and a grinding wheel belt mounting disc a are arranged at the end of the polishing arm, the transmission disc drives the grinding wheel belt mounting disc a to rotate, a fixing block is arranged on one side of the polishing arm and fixed with one end of an air cylinder a, and the other end of the air cylinder a is connected with a grinding wheel belt mounting disc b through a connecting block.
CN205497169U discloses a hand-held polishing machine with a protective cover, which comprises a machine body, an extension part, a belt pulley a, a belt pulley b, a belt, a grinding head, a protective cover and screws; the extension part comprises an extension plate, an iron bar and a fixing screw; the belt pulley a is fixed on an output shaft of the machine body, and the belt pulley b is fixed on an iron bar; the belt pulley a drives the belt pulley b to rotate through the belt; the extension plate is detachably connected and fixed with the iron bar through the fixing screw; the grinding head is rotatably arranged on the rotating shaft of the belt pulley b; the protective cover is fixed on the extension plate through screws.
However, the conventional polishing of the target R corner still adopts a manual sand paper grinding mode, the physical output is large, and the manual output is limited, so that the improvement of the manual grinding of the target R corner to reduce the manual physical output is very important.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a semi-automatic polishing system device, a polishing method and application of an R angle of a target, which can effectively remove the oxide on the side edge of the target, improve the working efficiency, reduce the physical output of personnel, save the operation time and realize the semi-automation of the R angle polishing of the aluminum target.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a target R-angle semi-automatic polishing system device, which comprises a base, wherein at least one polishing unit is arranged on the surface of the base, the polishing unit comprises at least two polishing assemblies, at least one first sliding groove is formed in the surface of the base, the polishing assemblies move in the first sliding groove, each polishing assembly comprises a body and a base which are rotatably connected, and at least two polishing wheels are arranged on the body.
The semi-automatic polishing system device for the R angle of the target, provided by the invention, can effectively remove the oxide on the side edge of the target, can adjust the polishing angle, improves the working efficiency, reduces the physical output of personnel, saves the operation time, and realizes that the R angle of the aluminum target is polished to enter semi-automation.
As a preferred technical solution of the present invention, the polishing unit includes a driving assembly, the driving assembly includes a first motor and a second motor, the first motor is used for driving the substrate to move in the first sliding slot, and the second motor is used for driving the body to rotate.
Preferably, the first motor is fixed on the surface of the base, and the second motor is fixed on the surface of the substrate.
As a preferable technical scheme of the invention, the bottom of the base is provided with a gear, and a rack is arranged in the first sliding groove.
Preferably, a first rotating shaft is arranged between the first motor and the gear, and the first rotating shaft is driven by the first motor to rotate and drive the gear and the rack to be meshed with each other to drive the substrate to move in the first sliding groove.
As a preferable technical scheme of the invention, the surface of the body is provided with at least two fixing grooves, the fixing grooves are respectively provided with a bracket, and the bracket is connected with the polishing wheel.
Preferably, the at least two polishing wheels include at least one fine polishing wheel and at least one coarse polishing wheel.
Preferably, the polishing wheel comprises any one of a grinding wheel, a cloth wheel or a nylon wheel or a combination of at least two of the grinding wheel, the cloth wheel and the nylon wheel.
It should be noted that, in the invention, polishing wheels of different types can be adopted, so that the integration of rough polishing and fine polishing is realized, the process is simplified, the production efficiency is improved, the uniformity of the product is improved, the appearance is smooth, and abnormal bulges are reduced.
As a preferred technical solution of the present invention, the polishing assembly further comprises a supporting arm, one end of the supporting arm is connected to the body, and the other end of the supporting arm is abutted to the substrate.
Preferably, a second sliding groove is formed in the surface of the base, and the support arm moves in the second sliding groove by taking the base as a rotation center.
Preferably, a second rotating shaft is arranged in the supporting arm, one end of the second rotating shaft is connected with a second motor, the other end of the second rotating shaft is connected with one side surface of the polishing wheel far away from the body, and the second motor drives the second rotating shaft to drive the body to rotate.
As a preferable technical scheme of the invention, one side of the base, which is far away from the polishing unit, is provided with at least one positioning unit, the positioning unit comprises two support columns, and the bottoms of the two support columns are respectively provided with a directional wheel and a universal wheel.
Preferably, a limiting part is arranged above the universal wheel and used for positioning the universal wheel.
Preferably, the surface of the base is further provided with a handle, and the handle is used for pushing the base.
It should be noted that, in the invention, the base is adjusted to a required position and angle by the universal wheel, the position is determined by the position-limiting member, the base is pushed by the handle, and the base can horizontally move along the same direction in the whole polishing process under the action of the orientation wheel, so that uneven polishing caused by the offset of the polishing component is avoided.
In a second aspect, the present invention provides a target R-angle semi-automatic polishing method, where the polishing method uses the system apparatus of the first aspect to perform polishing, and the polishing method includes:
based on the position at target R angle, the adjustment base removes along first spout with polishing subassembly, rotates the body simultaneously, the rotation of body drives the throwing aureola and polishes the R angle in proper order.
As a preferred technical solution of the present invention, the polishing method specifically comprises the steps of:
(1) based on the position of the target R, the base is pushed by the handle, the angle of the base is adjusted by the universal wheel, and then the limiting piece is adjusted downwards to be positioned;
(2) starting a first motor to rotate a first rotating shaft, wherein the rotation of the first rotating shaft drives a gear at the bottom of the substrate to rotate and is meshed with a rack in a first sliding groove to realize the movement of the substrate;
(3) manually moving the body to a first polishing point along a second chute of the substrate, starting a second motor to rotate a second rotating shaft, and driving the body to rotate by the rotation of the second rotating shaft to perform primary polishing;
(4) finishing primary polishing, manually moving the body to a second polishing point along a second chute of the substrate, starting a second motor to rotate a second rotating shaft, and driving the body to rotate by the rotation of the second rotating shaft to perform secondary polishing so as to realize semi-automatic polishing of the R angle.
As a preferred technical scheme of the invention, the semi-automatic polishing of the angle R is that at least one fine polishing wheel and at least one rough polishing wheel are used for alternative polishing.
Preferably, the alternating polishing comprises: and moving the body to a first polishing point, polishing the rough polishing wheel for the first time along with the rotation of the body, finishing the polishing for the first time, moving the body to a second polishing point, and polishing the fine polishing wheel for the second time along with the rotation of the body.
Preferably, the at least one fine polishing wheel and the at least one coarse polishing wheel reciprocate in the same direction.
Preferably, the fine polishing wheel has a rotation speed of 360-400 rpm, such as 360rpm, 365rpm, 370rpm, 375pm, 380rpm, 385rpm, 390rpm, 395rpm or 400rpm, but not limited to the recited values, and other values not recited in the range of values are also applicable.
Preferably, the rough polishing wheel rotates at 280-320 rpm, such as 280rpm, 285rpm, 290rpm, 295pm, 300rpm, 310rpm, 315rpm, or 320rpm, but not limited to the recited values, and other values not recited in the recited values are also applicable.
Preferably, the substrate is moved at a speed of 20 to 32m/s, for example, 20m/s, 21m/s, 22m/s, 24m/s, 25m/s, 26m/s, 28m/s, 30m/s or 32m/s, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
In a third aspect, the invention provides a use of the target R-angle semi-automatic polishing system device of the first aspect, which is used for R-angle polishing of an aluminum target.
The recitation of numerical ranges herein includes not only the above-recited numerical values, but also any numerical values between non-recited numerical ranges, and is not intended to be exhaustive or to limit the invention to the precise numerical values encompassed within the range for brevity and clarity.
The system refers to an equipment system, or a production equipment.
Compared with the prior art, the invention has the beneficial effects that:
the semi-automatic polishing system device, the polishing method and the application of the R corner of the target provided by the invention can effectively polish and remove the oxide on the side edge of the target, can adjust the polishing angle, improve the working efficiency, reduce the physical output of personnel, save the operation time, realize the semi-automation of the R corner polishing of the aluminum target, simplify the process, improve the production efficiency, improve the uniformity of the product, have smooth appearance and reduce abnormal bulges.
Drawings
Fig. 1 is a schematic structural diagram of a target R-corner semi-automatic polishing system apparatus according to an embodiment of the present invention.
Wherein, 1-a base; 2-a polishing unit; 3-a substrate; 4-body; 5-a polishing wheel; 6-a first chute; 7-a handle; 8-a support arm; 9-a first motor; 10-a second motor; 11-a pillar; 12-a stop.
Detailed Description
It is to be understood that in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
It should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In a specific embodiment, the present invention provides a target R-angle semi-automatic polishing system device, as shown in fig. 1, the system device includes a base 1, at least one polishing unit 2 is disposed on a surface of the base 1, the polishing unit 2 includes at least two polishing assemblies, at least one first sliding slot 6 is disposed on the surface of the base 1, the polishing assemblies move in the first sliding slot 6, the polishing assemblies include a body 4 and a substrate 3, which are rotatably connected, and at least two polishing wheels 5 are disposed on the body 4.
Further, the polishing unit 2 comprises a driving assembly, the driving assembly comprises a first motor 9 and a second motor 10, the first motor 9 is used for driving the substrate 3 to move in the first chute 6, and the second motor 10 is used for driving the body 4 to rotate. The first motor 9 is fixed on the surface of the base 1, and the second motor 10 is fixed on the surface of the substrate 3.
Further, a gear is arranged at the bottom of the base 3, and a rack is arranged in the first sliding groove 6. First motor 9 and gear between be provided with first pivot, first pivot be in rotate under the drive of first motor 9, and drive gear and rack intermeshing drives basement 3 remove in first spout 6.
Furthermore, the surface of the body 4 is provided with at least two fixing grooves, the fixing grooves are respectively provided with a bracket, and the bracket is connected with the polishing wheel 5. The at least two polishing wheels 5 include at least one fine polishing wheel 5 and at least one coarse polishing wheel 5. The polishing wheel 5 comprises any one of a grinding wheel, a cloth wheel or a nylon wheel or a combination of at least two of the grinding wheel, the cloth wheel and the nylon wheel. The polishing wheels 5 with different models can be adopted in the invention, so that the integration of rough polishing and fine polishing is realized, the process is simplified, the production efficiency is improved, the uniformity of the product is improved, the appearance is smooth, and the abnormal bulge is reduced.
Further, the polishing assembly further comprises a supporting arm 8, one end of the supporting arm 8 is connected with the body 4, and the other end of the supporting arm 8 is butted with the substrate 3. The surface of the base 3 is provided with a second sliding groove, and the supporting arm 8 moves in the second sliding groove by taking the base 3 as a rotating center. The support arm 8 in be provided with the second pivot, the one end of second pivot connect second motor 10, the other end is connected body 4 keeps away from the side surface of throwing aureola 5, second motor 10 drive second pivot drive body 4 and rotate.
Further, one side of the base 1, which is far away from the polishing unit 2, is provided with at least one positioning unit, the positioning unit comprises two support columns 11, and the bottoms of the two support columns 11 are respectively provided with an orientation wheel and a universal wheel. A limiting part 12 is arranged above the universal wheel, and the limiting part 12 is used for positioning the universal wheel. The surface of the base 1 is also provided with a handle 7, and the handle 7 is used for pushing the base 1. According to the invention, the base 1 is firstly adjusted to a required position and angle by the universal wheel, the limiting piece 12 is used for positioning, the handle 7 is used for pushing the base 1, and the base 1 can horizontally move along the same direction in the whole polishing process under the action of the directional wheel, so that the polishing assembly is prevented from being deviated to cause uneven polishing.
In another embodiment, the present invention provides a method for semi-automatically polishing an R-angle of a target, wherein the method for polishing is performed by using the system apparatus of one embodiment, and the method specifically includes the following steps:
(1) based on the position of the target R, the base 1 is pushed by the handle 7, the angle of the base 1 is adjusted by the universal wheels, and then the position limiting piece 12 is adjusted downwards for positioning;
(2) starting a first motor 9 to rotate a first rotating shaft, wherein the rotation of the first rotating shaft drives a gear at the bottom of the substrate 3 to rotate and is meshed with a rack in the first chute 6, so that the substrate 3 moves, and the moving speed of the substrate 3 is 20-32 m/s;
(3) manually moving the body 4 to a first polishing point along a second chute of the substrate 3, starting a second motor 10 to rotate a second rotating shaft, and driving the body 4 to rotate by the rotation of the second rotating shaft for polishing for the first time;
(4) finishing the primary polishing, manually moving the body 4 to a second polishing point along a second chute of the substrate 3, starting a second motor 10 to rotate a second rotating shaft, and driving the body 4 to rotate by the rotation of the second rotating shaft to perform secondary polishing, thereby realizing the semi-automatic polishing of the R angle.
Further, the semi-automatic polishing of the angle R is performed by alternately polishing with at least one fine polishing wheel 5 and at least one rough polishing wheel 5. The alternating polishing comprises: and moving the body 4 to a first polishing point, polishing the rough polishing wheel 5 for the first time along with the rotation of the body 4, finishing the first polishing, moving the body 4 to a second polishing point, and polishing the fine polishing wheel 5 for the second time along with the rotation of the body 4.
The at least one fine polishing wheel 5 and the at least one coarse polishing wheel 5 reciprocate in the same direction. The rotating speed of the fine polishing wheel 5 is 360-400 rpm, and the rotating speed of the rough polishing wheel 5 is 280-320 rpm.
Example 1
The embodiment provides a semi-automatic polishing system device for an R angle of a target, which comprises a base 1, wherein two polishing units 2 are arranged on the surface of the base 1, each polishing unit 2 comprises two polishing components, each polishing component independently comprises a body 4 and a substrate 3 which are rotatably connected, and a rough polishing wheel 5 and a fine polishing wheel 5 are respectively arranged on the body 4.
The bottom of basement 3 is provided with the gear, sets up the rack in the first spout 6. Two fixed slots have been seted up on the surface of body 4, are provided with the support in the fixed slot respectively, and rough polishing wheel 5 and fine polishing wheel 5 are connected respectively to the support, and two kinds of polishing wheels 5 are the emery wheel.
The polishing unit 2 comprises a driving assembly, the driving assembly comprises a first motor 9 and a second motor 10, the first motor 9 is fixed on the surface of the base 1, and the second motor 10 is fixed on the surface of the substrate 3. A first rotating shaft is arranged between the first motor 9 and the gear, the first rotating shaft is driven by the first motor 9 to rotate and drive the gear and the rack to be meshed with each other, and the substrate 3 moves in the first sliding groove 6.
The polishing component further comprises a supporting arm 8, one end of the supporting arm 8 is connected with the body 4, the other end of the supporting arm is butted with the substrate 3, a second sliding groove is formed in the surface of the substrate 3, and the supporting arm 8 moves in the second sliding groove by taking the substrate 3 as a rotation center. A second rotating shaft is arranged in the supporting arm 8, one end of the second rotating shaft is connected with a second motor 10, the other end of the second rotating shaft is connected with one side surface of the polishing wheel 5 far away from the body 4, and the second motor 10 drives the second rotating shaft to drive the body 4 to rotate.
One side that polishing unit 2 was kept away from to base 1 sets up two positioning unit, and positioning unit includes two pillars 11, and the bottom of two pillars 11 is provided with directional wheel and universal wheel respectively, and the top of universal wheel is provided with locating part 12 for fix a position the universal wheel, and the surface of base 1 still is provided with handle 7, is used for promoting base 1.
Application example 1
In this application example, the semi-automatic polishing system device for the R angle of the target provided in embodiment 1 is used to polish the R angle of an aluminum target, and specifically includes the following steps:
(1) based on the position of the target R, the base 1 is pushed by the handle 7, the angle of the base 1 is adjusted by the universal wheels, and then the position limiting piece 12 is adjusted downwards for positioning;
(2) starting a first motor 9 to rotate a first rotating shaft, wherein the rotation of the first rotating shaft drives a gear at the bottom of the substrate 3 to rotate and is meshed with a rack in the first sliding groove 6, so that the substrate 3 is moved, and the moving speed of the substrate 3 is 25 m/s;
(3) manually moving the body 4 to the first polishing point along the second chute of the substrate 3, starting the second motor 10 to rotate the second rotating shaft, driving the body 4 to rotate by the rotation of the second rotating shaft, polishing the rough polishing wheel 5 for one time along with the rotation of the body 4, wherein the rotating speed of the rough polishing wheel 5 is 300 rpm;
(4) the body 4 is manually moved to a second polishing point along a second chute of the substrate 3, the second motor 10 is started to rotate the second rotating shaft, the body 4 is driven to rotate by the rotation of the second rotating shaft, the fine polishing wheel 5 performs primary polishing along with the rotation of the body 4, and the rotating speed of the fine polishing wheel 5 is 380 rpm.
In the application example, the roughness of the R angle of the polished aluminum target material is 0.4 μm.
Application example 2
In this application example, the semi-automatic polishing system device for the R angle of the target provided in embodiment 1 is used to polish the R angle of the aluminum target, and specifically includes the following steps:
(1) based on the position of the target R, the base 1 is pushed by the handle 7, the angle of the base 1 is adjusted by the universal wheels, and then the position limiting piece 12 is adjusted downwards for positioning;
(2) starting a first motor 9 to rotate a first rotating shaft, wherein the rotation of the first rotating shaft drives a gear at the bottom of the substrate 3 to rotate and is meshed with a rack in the first chute 6, so that the substrate 3 moves, and the moving speed of the substrate 3 is 20 m/s;
(3) manually moving the body 4 to a first polishing point along a second chute of the substrate 3, starting a second motor 10 to rotate a second rotating shaft, driving the body 4 to rotate by the rotation of the second rotating shaft, polishing the rough polishing wheel 5 for one time along with the rotation of the body 4, wherein the rotating speed of the rough polishing wheel 5 is 280 rpm;
(4) the body 4 is manually moved to a second polishing point along a second chute of the substrate 3, a second motor 10 is started to rotate a second rotating shaft, the body 4 is driven to rotate by the rotation of the second rotating shaft, the fine polishing wheel 5 performs primary polishing along with the rotation of the body 4, and the rotating speed of the fine polishing wheel 5 is 360 rpm.
In the application example, the roughness of the polished R angle of the aluminum target material is 0.5 μm.
Application example 3
In this application example, the semi-automatic polishing system device for the R angle of the target provided in embodiment 1 is used to polish the R angle of the aluminum target, and specifically includes the following steps:
(1) based on the position of the target R, the base 1 is pushed by the handle 7, the angle of the base 1 is adjusted by the universal wheels, and then the position limiting piece 12 is adjusted downwards for positioning;
(2) starting a first motor 9 to rotate a first rotating shaft, wherein the rotation of the first rotating shaft drives a gear at the bottom of the substrate 3 to rotate and is meshed with a rack in the first sliding groove 6, so that the substrate 3 moves, and the moving speed of the substrate 3 is 23 m/s;
(3) manually moving the body 4 to the first polishing point along the second chute of the substrate 3, starting the second motor 10 to rotate the second rotating shaft, driving the body 4 to rotate by the rotation of the second rotating shaft, polishing the rough polishing wheel 5 once along with the rotation of the body 4, wherein the rotating speed of the rough polishing wheel 5 is 290 rpm;
(4) the body 4 is manually moved to a second polishing point along a second chute of the substrate 3, the second motor 10 is started to rotate the second rotating shaft, the body 4 is driven to rotate by the rotation of the second rotating shaft, the fine polishing wheel 5 performs primary polishing along with the rotation of the body 4, and the rotating speed of the fine polishing wheel 5 is 370 rpm.
In the application example, the roughness of the polished R angle of the aluminum target material is 0.5 μm.
Application example 4
In this application example, the semi-automatic polishing system device for the R angle of the target provided in embodiment 1 is used to polish the R angle of the aluminum target, and specifically includes the following steps:
(1) based on the position of the target R, the base 1 is pushed by the handle 7, the angle of the base 1 is adjusted by the universal wheels, and then the position limiting piece 12 is adjusted downwards for positioning;
(2) starting a first motor 9 to rotate a first rotating shaft, wherein the rotation of the first rotating shaft drives a gear at the bottom of the substrate 3 to rotate and is meshed with a rack in the first sliding groove 6, so that the substrate 3 moves, and the moving speed of the substrate 3 is 28 m/s;
(3) manually moving the body 4 to the first polishing point along the second chute of the substrate 3, starting the second motor 10 to rotate the second rotating shaft, driving the body 4 to rotate by the rotation of the second rotating shaft, polishing the rough polishing wheel 5 for one time along with the rotation of the body 4, wherein the rotating speed of the rough polishing wheel 5 is 310 rpm;
(4) manually move the body 4 to a second polishing point along a second chute of the substrate 3, start the second motor 10 to rotate a second rotating shaft, the rotation of the second rotating shaft drives the body 4 to rotate, the fine polishing wheel 5 performs primary polishing along with the rotation of the body 4, and the rotating speed of the fine polishing wheel 5 is 390 rpm.
In the application example, the roughness of the polished R angle of the aluminum target material is 0.6 μm.
Application example 5
In this application example, the semi-automatic polishing system device for the R angle of the target provided in embodiment 1 is used to polish the R angle of the aluminum target, and specifically includes the following steps:
(1) based on the position of the target R, the base 1 is pushed by the handle 7, the angle of the base 1 is adjusted by the universal wheels, and then the position limiting piece 12 is adjusted downwards for positioning;
(2) starting a first motor 9 to rotate a first rotating shaft, wherein the rotation of the first rotating shaft drives a gear at the bottom of the substrate 3 to rotate and is meshed with a rack in the first chute 6, so that the substrate 3 moves, and the moving speed of the substrate 3 is 32 m/s;
(3) manually moving the body 4 to the first polishing point along the second chute of the substrate 3, starting the second motor 10 to rotate the second rotating shaft, driving the body 4 to rotate by the rotation of the second rotating shaft, polishing the rough polishing wheel 5 once along with the rotation of the body 4, wherein the rotating speed of the rough polishing wheel 5 is 320 rpm;
(4) the body 4 is manually moved to a second polishing point along a second chute of the substrate 3, a second motor 10 is started to rotate a second rotating shaft, the body 4 is driven to rotate by the rotation of the second rotating shaft, the fine polishing wheel 5 performs primary polishing along with the rotation of the body 4, and the rotating speed of the fine polishing wheel 5 is 400 rpm.
In the application example, the roughness of the polished R angle of the aluminum target material is 0.4 μm.
The system device can adjust the polishing angle, improve the working efficiency, reduce the physical output of personnel, save the operation time, realize that the base 1 horizontally moves along the same direction in the whole polishing process, and avoid uneven polishing caused by the deviation of the polishing assembly.
The polishing method provided by the invention can effectively remove the oxide on the side edge of the target material, realizes semi-automation of R-angle polishing of the aluminum target material, simplifies the process, improves the production efficiency, improves the uniformity of the product, has smooth appearance and reduces abnormal bulges.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (10)
1. The utility model provides a semi-automatic polishing system device of target R angle, its characterized in that, the system device include the base, the surface of base sets up at least one polishing unit, polishing unit include two at least polishing subassemblies, at least one first spout has been seted up on the surface of base, polishing subassembly removes in the first spout, polishing subassembly include body and the basement of rotating the connection, the body on set up two at least polishing wheels.
2. The system-assembly of claim 1, wherein the polishing unit includes a drive assembly, the drive assembly including a first motor and a second motor, the first motor for driving the substrate within the first slot, the second motor for driving the body to rotate;
preferably, the first motor is fixed on the surface of the base, and the second motor is fixed on the surface of the substrate.
3. The system device according to claim 1 or 2, wherein a gear is arranged at the bottom of the base, and a rack is arranged in the first chute;
preferably, a first rotating shaft is arranged between the first motor and the gear, and the first rotating shaft is driven by the first motor to rotate and drive the gear and the rack to be meshed with each other to drive the substrate to move in the first sliding groove.
4. The system device according to any one of claims 1 to 3, wherein the body has at least two fixing grooves formed on a surface thereof, and each of the fixing grooves has a bracket connected to the polishing wheel;
preferably, the at least two polishing wheels comprise at least one fine polishing wheel and at least one coarse polishing wheel;
preferably, the polishing wheel comprises any one of a grinding wheel, a cloth wheel or a nylon wheel or a combination of at least two of the grinding wheel, the cloth wheel and the nylon wheel.
5. The system-assembly of any one of claims 1-4, wherein the polishing assembly further comprises a support arm, one end of the support arm being coupled to the body and the other end of the support arm abutting the base;
preferably, a second sliding groove is formed in the surface of the base, and the support arm moves in the second sliding groove by taking the base as a rotation center;
preferably, a second rotating shaft is arranged in the supporting arm, one end of the second rotating shaft is connected with a second motor, the other end of the second rotating shaft is connected with one side surface of the polishing wheel far away from the body, and the second motor drives the second rotating shaft to drive the body to rotate.
6. The system device according to any one of claims 1 to 5, wherein at least one positioning unit is arranged on one side of the base away from the polishing unit, the positioning unit comprises two pillars, and the bottoms of the two pillars are respectively provided with a directional wheel and a universal wheel;
preferably, a limiting piece is arranged above the universal wheel and used for positioning the universal wheel;
preferably, the surface of the base is further provided with a handle, and the handle is used for pushing the base.
7. A semi-automatic polishing method for an R-angle of a target, wherein the polishing method is performed by using the system apparatus of any one of claims 1 to 6, and the polishing method comprises:
based on the position at target R angle, the adjustment base removes along first spout with polishing subassembly, rotates the body simultaneously, the rotation of body drives the throwing aureola and polishes the R angle in proper order.
8. The polishing method according to claim 7, characterized in that the polishing method comprises in particular the steps of:
(1) based on the position of the target R, the base is pushed by the handle, the angle of the base is adjusted by the universal wheel, and then the limiting piece is adjusted downwards to be positioned;
(2) starting a first motor to rotate a first rotating shaft, wherein the rotation of the first rotating shaft drives a gear at the bottom of the substrate to rotate and is meshed with a rack in a first sliding groove to realize the movement of the substrate;
(3) manually moving the body to a first polishing point along a second chute of the substrate, starting a second motor to rotate a second rotating shaft, and driving the body to rotate by the rotation of the second rotating shaft to perform primary polishing;
(4) finishing primary polishing, manually moving the body to a second polishing point along a second chute of the substrate, starting a second motor to rotate a second rotating shaft, and driving the body to rotate by the rotation of the second rotating shaft to perform secondary polishing so as to realize semi-automatic polishing of the R angle.
9. The polishing method according to claim 7 or 8, wherein the R-angle semi-automatic polishing is alternate polishing using at least one fine polishing wheel and at least one coarse polishing wheel;
preferably, the alternating polishing comprises: moving the body to a first polishing point, polishing the rough polishing wheel for the first time along with the rotation of the body, finishing the polishing for the first time, moving the body to a second polishing point, and polishing the fine polishing wheel for the second time along with the rotation of the body;
preferably, the at least one fine polishing wheel and the at least one coarse polishing wheel reciprocate in the same direction;
preferably, the rotation speed of the fine polishing wheel is 360-400 rpm;
preferably, the rotating speed of the rough polishing wheel is 280-320 rpm;
preferably, the moving speed of the substrate is 20-32 m/s.
10. Use of the target R-corner semi-automatic polishing system apparatus according to any one of claims 1 to 6, wherein the target R-corner semi-automatic polishing system apparatus is used for R-corner polishing of aluminum targets.
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| CN202210320253.1A CN114536176A (en) | 2022-03-29 | 2022-03-29 | Target R-angle semi-automatic polishing system device, polishing method and application |
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| CN202210320253.1A CN114536176A (en) | 2022-03-29 | 2022-03-29 | Target R-angle semi-automatic polishing system device, polishing method and application |
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