CN114535861B - High-adhesion lead-free solder paste for packaging and preparation method thereof - Google Patents
High-adhesion lead-free solder paste for packaging and preparation method thereof Download PDFInfo
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- CN114535861B CN114535861B CN202210246158.1A CN202210246158A CN114535861B CN 114535861 B CN114535861 B CN 114535861B CN 202210246158 A CN202210246158 A CN 202210246158A CN 114535861 B CN114535861 B CN 114535861B
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- soldering paste
- soldering
- stirring
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 title claims description 55
- 238000005476 soldering Methods 0.000 claims abstract description 144
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 128
- 238000003756 stirring Methods 0.000 claims abstract description 79
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 230000004907 flux Effects 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 30
- 239000012190 activator Substances 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 26
- 238000003860 storage Methods 0.000 claims description 21
- 238000002156 mixing Methods 0.000 claims description 19
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid group Chemical group C(CC(O)(C(=O)O)CC(=O)O)(=O)O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 12
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000013008 thixotropic agent Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 9
- 239000011259 mixed solution Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000011135 tin Substances 0.000 claims description 9
- 229910052718 tin Inorganic materials 0.000 claims description 9
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910000969 tin-silver-copper Inorganic materials 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 241000220223 Fragaria Species 0.000 claims description 6
- 235000016623 Fragaria vesca Nutrition 0.000 claims description 6
- 235000011363 Fragaria x ananassa Nutrition 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 6
- 229960004889 salicylic acid Drugs 0.000 claims description 6
- 229940023462 paste product Drugs 0.000 claims description 5
- 239000011265 semifinished product Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 150000003949 imides Chemical class 0.000 claims description 3
- FEPCMSPFPMPWJK-OLPJDRRASA-N maleopimaric acid Chemical compound C([C@]12C=C([C@H](C[C@@H]11)[C@H]3C(OC(=O)[C@@H]23)=O)C(C)C)C[C@@H]2[C@]1(C)CCC[C@@]2(C)C(O)=O FEPCMSPFPMPWJK-OLPJDRRASA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 150000007524 organic acids Chemical group 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 11
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a lead-free soldering paste with high adhesive force for packaging and a preparation method thereof, and relates to the technical field of soldering paste, in order to solve the technical problems that in the preparation process of the lead-free soldering paste, soldering paste and tin powder are respectively directly put into a stirring barrel, and as the soldering paste and the tin powder are put into a bundling manner, the soldering paste and the tin powder are put into the stirring barrel and are mixed unevenly partially, so that the use effect of a final lead-free soldering paste finished product is poor.
Description
Technical Field
The invention relates to the technical field of soldering paste, in particular to lead-free soldering paste with high adhesive force for packaging and a preparation method thereof.
Background
Solder paste is also called solder paste, and is called a holder paste. Solder paste is a novel solder material which is generated along with SMT, and is a paste mixture formed by mixing soldering powder, soldering flux, other surfactants, thixotropic agents and the like. The solder is mainly used for soldering electronic components such as PCB surface resistance, capacitance, IC and the like in SMT industry.
Solder paste is a new type of solder material that has been developed with SMT. Solder paste is a complex system, which is a paste mixed from solder powder, flux and other additives. The solder paste has certain viscosity at normal temperature, can be used for initially adhering the electronic components at a given position, and is used for welding the components to be welded with the printed circuit pads together to form permanent connection along with the volatilization of the solvent and part of the additives at the welding temperature.
However, in the existing preparation process of the lead-free solder paste, the soldering paste and the tin powder are respectively and directly put into a stirring barrel and then are stirred, and as the soldering paste and the tin powder are put into a bundle, the soldering paste and the tin powder are put into the bundle, and the soldering paste and the tin powder are not uniformly mixed partially, so that the use effect of the final lead-free solder paste finished product is poor.
To solve the above problems. Therefore, a lead-free solder paste with high adhesive force for packaging and a preparation method thereof are provided.
Disclosure of Invention
The invention aims to provide a high-adhesion lead-free solder paste for packaging and a preparation method thereof, wherein a soldering paste conveying pump is used for conveying soldering paste from a soldering paste conveying piece to the upper side of a stirring barrel, and a tin powder conveying pump is used for conveying tin powder from the tin powder conveying piece to the upper side of the stirring barrel; then, starting the driving assembly to drive the uniform feeding mechanism to rotate, and sequentially spreading soldering paste and tin powder layer by layer in the stirring barrel by the uniform feeding mechanism; after the soldering paste and the tin powder are tiled, starting a stirring mechanism to stir, and starting a vacuum machine to vacuumize the stirring barrel; after stirring for a certain time, the lead-free solder paste semi-finished product is discharged, and secondary stirring is carried out, so that the problems in the background technology can be solved.
In order to achieve the above purpose, the present invention provides the following technical solutions: the lead-free soldering paste with high adhesive force for packaging comprises tin-silver-copper alloy powder and soldering flux;
wherein the silver-copper alloy powder accounts for 75-90 wt% and the soldering flux accounts for 10-25 wt%;
the tin-silver-copper alloy powder comprises three components of tin, silver and copper, wherein the tin accounts for 94-96 wt%, the silver accounts for 3-4 wt% and the copper accounts for 1-2 wt%;
the soldering flux comprises an activator, a thixotropic agent and resin, wherein the activator is an organic acid activator, the proportion of the activator is 5-12 wt%, the resin is modified rosin, the proportion of the resin is 10-25 wt%, and the proportion of the thixotropic agent is 5-15 wt%;
wherein the activator can be citric acid, strawberry acid or salicylic acid, and at least two of the activators can be selected from the group consisting of citric acid, strawberry acid and salicylic acid;
the resin may be Ma Haisuan, maleopimaric acid and dimaleurone acid imide, and at least two.
The invention provides another technical scheme that: the preparation method of the lead-free solder paste with high adhesive force for packaging comprises the following steps:
s101: mixing and stirring the proportioned tin, silver and copper powder to obtain solder powder, preparing the solder powder into tin powder, simultaneously, independently mixing two or more resins, independently mixing two or more activators, and adding proper solvents when the activators are mixed;
s102: cooling and stirring the resin mixed solution and the activator mixed solution, wherein the stirring temperature is lower than 45 ℃, and simultaneously adding a thixotropic agent into the mixed solution to obtain soldering paste;
s103: cooling the soldering paste to room temperature, and refrigerating at 3-9deg.C;
s104: mixing and stirring the finished soldering paste and the finished tin powder in a vacuum stirrer to prepare a semi-finished soldering paste;
s105: and (5) automatically packaging the semi-finished solder paste product by injecting nitrogen, thereby obtaining the finished solder paste product.
Further, the vacuum mixer includes the support frame and sets up the agitator in the support frame upper end, and one side of agitator is provided with the vacuum machine, and the vacuum machine is linked together with the agitator, and the upper end of agitator is provided with the soldering paste and carries the piece, and the middle part of agitator is provided with tin powder and carries the piece, and the outside of agitator is provided with artifical platform, and the inboard of agitator is provided with rabbling mechanism, and the inboard of agitator still is provided with drive assembly, and the inboard upper end of agitator is provided with even feeding mechanism, and drive assembly is connected with even feeding mechanism meshing.
Further, the specific steps of S104 are as follows:
s1041: the soldering paste is conveyed to the upper side of the stirring barrel from the soldering paste conveying piece through a soldering paste conveying pump, and the tin powder is conveyed to the upper side of the stirring barrel from the tin powder conveying piece through a tin powder conveying pump;
s1042: then, starting the driving assembly to drive the uniform feeding mechanism to rotate, and sequentially spreading soldering paste and tin powder layer by layer in the stirring barrel by the uniform feeding mechanism;
s1043: after the soldering paste and the tin powder are tiled, starting a stirring mechanism to stir, and starting a vacuum machine to vacuumize the stirring barrel;
s1044: and (3) after stirring for a certain time, discharging the lead-free solder paste semi-finished product, and performing secondary stirring.
Further, the stirring mechanism comprises a first servo motor and stirring blades arranged at the upper end of the first servo motor;
the driving assembly comprises a second servo motor and a driving gear arranged at the lower end of the second servo motor.
Further, even feeding mechanism includes and hangs the head and set up the joint piece in hanging the head lower extreme, and the outside of joint piece is provided with the connecting rod, and the one end that the connecting rod kept away from the joint piece is provided with driven gear, and driven gear and driving gear meshing are connected, and the upper end of joint piece is provided with feeding part.
Further, the feeding component comprises a soldering paste sealing plate and a soldering paste guide pipe arranged at the lower end of the soldering paste sealing plate, and a soldering paste uniform feeding component is arranged at the lower end of the soldering paste guide pipe;
the feeding component further comprises a tin powder sealing disc and a tin powder guide pipe arranged at the lower end of the tin powder sealing disc, and a tin powder uniform feeding component is arranged at the lower end of the tin powder guide pipe.
Further, the upper end of the stirring barrel is provided with a soldering flux temporary storage groove, the upper end of the stirring barrel positioned at the inner side of the soldering flux temporary storage groove is provided with a tin powder temporary storage groove, the soldering flux sealing plate corresponds to the soldering flux temporary storage groove, and the tin powder sealing plate corresponds to the tin powder temporary storage groove.
Further, the flux paste uniform feeding component comprises a flux paste closed shell and a flux paste discharging head arranged at the lower end of the flux paste closed shell, and the inner side of the flux paste closed shell is provided with the flux paste uniform discharging component;
the even row of soldering paste subassembly is including rotating the post and setting up the row's of post outside material blade, and the both ends of rotating the post are provided with the rotation plug, are provided with reset spring on the rotation plug, and reset spring keeps away from the one end of rotation plug and is provided with the joint, and the joint corresponds with the recess of seting up of soldering paste seal shell inboard.
Further, the even reinforced subassembly of tin powder includes the tin powder enclosure and sets up the third servo motor in the tin powder enclosure inboard, and the drive end of third servo motor is provided with the drive lead screw, and the outside of drive lead screw is provided with first even material piece and the even material piece of pushing of second, is provided with the sieve in the tin powder enclosure that is located the drive lead screw lower extreme, and the lower extreme of sieve is provided with the stock guide.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the lead-free soldering paste with high adhesive force for encapsulation and the preparation method thereof, the second servo motor is started to drive the driving gear to rotate, the driving gear drives the driven gear to rotate, the connecting block is driven to rotate, the feeding component is driven to rotate, the soldering paste conveying pump and the tin powder conveying pump are simultaneously opened at the moment, materials in the soldering paste temporary storage groove and the tin powder temporary storage groove are pressurized at the moment, during the rotation of the feeding component, soldering paste continuously flows into the soldering paste uniform feeding component from the soldering paste guide pipe and flows out from the outlet of the soldering paste uniform feeding component, the tin powder continuously flows into the tin powder uniform feeding component from the tin powder guide pipe and flows out from the outlet of the tin powder uniform feeding component, so that after a layer of soldering paste is tiled, a layer of tin powder is tiled at the upper end, the soldering paste and the tin powder are mixed more uniformly in the later stirring process, and the use effect of the lead-free soldering paste is improved.
2. According to the lead-free soldering paste with high adhesive force for packaging and the preparation method thereof, when the soldering paste flows out from the soldering paste flow guide pipe, the soldering paste continuously falls into the upper end of the discharge blade, when the gravity of the soldering paste flow guide pipe gathered at the upper end of the discharge blade is larger than the clamping friction force of the soldering paste flow guide pipe, the rotating column rotates at the moment, the upper end of the whole discharge blade is uniformly filled with the soldering paste at the moment, and when the discharge blade rotates, the soldering paste uniformly flows out from the soldering paste discharge head, so that the soldering paste can uniformly flow into the stirring barrel, and the mixing effect of the soldering paste and tin powder is improved.
3. According to the lead-free solder paste with high adhesive force for packaging and the preparation method thereof, when the tin powder flows out of the tin powder guide pipe, the tin powder flows into the upper end of the screen plate, and at the moment, the third servo motor is started to drive the first uniform pushing sheet and the second uniform pushing sheet to move reversely, so that the tin powder is spread out to two sides and flows out from holes of the screen plate, and then the tin powder uniformly flows out of the tin powder sealing shell by matching with the material guide plate, so that the tin powder is spread on the soldering paste, and the mixing effect of the soldering paste and the tin powder is further improved in an auxiliary manner.
Drawings
FIG. 1 is a schematic illustration of a process for preparing a high adhesion lead-free solder paste for encapsulation according to the present invention;
FIG. 2 is a schematic diagram of the working flow of the vacuum mixer of the high adhesion lead-free solder paste for encapsulation of the present invention;
FIG. 3 is a schematic diagram showing a perspective view of a vacuum mixer side of the high adhesion lead-free solder paste for encapsulation of the present invention;
FIG. 4 is a schematic view of another side of the vacuum mixer of the high adhesion lead-free solder paste for encapsulation of the present invention;
FIG. 5 is a schematic view of the internal plan structure of a stirring barrel of the high-adhesion lead-free solder paste for packaging of the invention;
FIG. 6 is a schematic view showing the structure of the upper end of the inner side of the stirring barrel of the high-adhesion lead-free solder paste for packaging according to the invention;
FIG. 7 is a schematic perspective view of a mechanism for uniformly feeding high-adhesion lead-free solder paste for packaging according to the present invention;
FIG. 8 is a schematic perspective view of a charging member of the high adhesion lead-free solder paste for encapsulation of the present invention;
FIG. 9 is a schematic view of the inner side plan view of a paste uniform feed assembly of the high adhesion lead-free solder paste for encapsulation of the present invention;
fig. 10 is a schematic perspective view of a paste uniform discharging assembly of the high adhesion lead-free solder paste for encapsulation according to the present invention;
fig. 11 is a schematic view of the inner plane structure of a tin powder uniform feeding component of the high-adhesion lead-free solder paste for packaging.
In the figure: 1. a support frame; 2. a stirring barrel; 21. a temporary storage groove for soldering paste; 22. a tin powder temporary storage groove; 3. a vacuum machine; 4. a paste feed member; 5. a tin powder conveying member; 6. a manual station; 7. a stirring mechanism; 71. a first servo motor; 72. stirring the leaves; 8. a drive assembly; 81. a second servo motor; 82. a drive gear; 9. a uniform feeding mechanism; 91. a suspension head; 92. a joint block; 93. a connecting rod; 94. a driven gear; 95. a charging member; 951. a flux paste closing plate; 952. soldering paste flow guiding pipe; 953. a flux paste uniform feeding component; 9531. a flux paste enclosure; 9532. paste flux discharging head; 9533. a flux paste uniform discharging component; 95331. rotating the column; 95332. discharging blades; 95333. rotating the plug; 95334. a return spring; 95335. a clamping joint; 954. a tin powder sealing disc; 955. tin powder flow guiding pipe; 956. a tin powder uniform feeding component; 9561. a tin powder closed shell; 9562. a third servo motor; 9563. driving a screw rod; 9564. a first uniform pushing sheet; 9565. a second uniform pushing sheet; 9566. a sieve plate; 9567. and a material guiding plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to solve the technical problems that in the existing lead-free solder paste preparation process, soldering paste and tin powder are respectively directly put into a stirring barrel and then are stirred, and as the soldering paste and the tin powder are put into a bundle, the soldering paste and the tin powder are put into the bundle, and the use effect of the final lead-free solder paste finished product is poor due to the fact that the soldering paste and the tin powder are not uniformly mixed partially; referring to fig. 1-8, the following technical schemes are provided:
the lead-free soldering paste with high adhesive force for packaging comprises tin-silver-copper alloy powder and soldering flux;
wherein the silver-copper alloy powder accounts for 75-90 wt% and the soldering flux accounts for 10-25 wt%;
the tin-silver-copper alloy powder comprises three components of tin, silver and copper, wherein the tin accounts for 94-96 wt%, the silver accounts for 3-4 wt% and the copper accounts for 1-2 wt%;
the soldering flux comprises an activator, a thixotropic agent and resin, wherein the activator is an organic acid activator, the proportion of the activator is 5-12 wt%, the resin is modified rosin, the proportion of the resin is 10-25 wt%, and the proportion of the thixotropic agent is 5-15 wt%;
wherein the activator can be citric acid, strawberry acid or salicylic acid, and at least two of the activators can be selected from the group consisting of citric acid, strawberry acid and salicylic acid;
the resin may be Ma Haisuan, maleopimaric acid and dimaleurone acid imide, and at least two.
The invention provides another technical scheme that: the preparation method of the lead-free solder paste with high adhesive force for packaging comprises the following steps:
s101: mixing and stirring the proportioned tin, silver and copper powder to obtain solder powder, preparing the solder powder into tin powder, simultaneously, independently mixing two or more resins, independently mixing two or more activators, and adding proper solvents when the activators are mixed;
s102: cooling and stirring the resin mixed solution and the activator mixed solution, wherein the stirring temperature is lower than 45 ℃, and simultaneously adding a thixotropic agent into the mixed solution to obtain soldering paste;
s103: cooling the soldering paste to room temperature, and refrigerating at 3-9deg.C;
s104: mixing and stirring the finished soldering paste and the finished tin powder in a vacuum stirrer to prepare a semi-finished soldering paste;
s105: and (5) automatically packaging the semi-finished solder paste product by injecting nitrogen, thereby obtaining the finished solder paste product.
The vacuum mixer includes support frame 1 and sets up agitator 2 in support frame 1 upper end, one side of agitator 2 is provided with vacuum machine 3, vacuum machine 3 is linked together with agitator 2, the upper end of agitator 2 is provided with the soldering paste and carries piece 4, the middle part of agitator 2 is provided with tin powder and carries piece 5, the outside of agitator 2 is provided with artifical platform 6, the inboard of agitator 2 is provided with rabbling mechanism 7, the inboard of agitator 2 still is provided with actuating assembly 8, the inboard upper end of agitator 2 is provided with even feeding mechanism 9, actuating assembly 8 and even feeding mechanism 9 meshing are connected.
The specific steps of S104 are:
s1041: the soldering paste is conveyed to the upper side of the stirring barrel 2 from the soldering paste conveying member 4 by a soldering paste conveying pump, and the tin powder is conveyed to the upper side of the stirring barrel 2 from the tin powder conveying member 5 by a tin powder conveying pump;
s1042: then, the driving assembly 8 is started to drive the uniform feeding mechanism 9 to rotate, and at the moment, the uniform feeding mechanism 9 sequentially flatly tiles the soldering paste and the tin powder in the stirring barrel 2 layer by layer;
s1043: after the soldering paste and the tin powder are tiled, starting a stirring mechanism 7 to stir, and starting a vacuum machine 3 to vacuumize the stirring barrel 2;
s1044: and (3) after stirring for a certain time, discharging the lead-free solder paste semi-finished product, and performing secondary stirring.
The upper end of the stirring barrel 2 is provided with a soldering flux temporary storage groove 21, the upper end of the stirring barrel 2 positioned at the inner side of the soldering flux temporary storage groove 21 is provided with a tin powder temporary storage groove 22, a soldering flux sealing plate 951 corresponds to the soldering flux temporary storage groove 21, and a tin powder sealing plate 954 corresponds to the tin powder temporary storage groove 22.
The stirring mechanism 7 comprises a first servo motor 71 and a stirring blade 72 arranged at the upper end of the first servo motor 71; the driving assembly 8 includes a second servo motor 81 and a driving gear 82 provided at a lower end of the second servo motor 81.
The even feeding mechanism 9 comprises a hanging head 91 and a connecting block 92 arranged at the lower end of the hanging head 91, a connecting rod 93 is arranged on the outer side of the connecting block 92, a driven gear 94 is arranged at one end, far away from the connecting block 92, of the connecting rod 93, the driven gear 94 is connected with the driving gear 82 in a meshed mode, and a feeding part 95 is arranged at the upper end of the connecting block 92.
The feeding part 95 comprises a soldering paste sealing plate 951 and a soldering paste guiding pipe 952 arranged at the lower end of the soldering paste sealing plate 951, wherein a soldering paste uniform feeding component 953 is arranged at the lower end of the soldering paste guiding pipe 952; the feeding member 95 further includes a tin powder closing plate 954, a tin powder guide pipe 955 provided at a lower end of the tin powder closing plate 954, and a tin powder uniform feeding assembly 956 provided at a lower end of the tin powder guide pipe 955.
Specifically, the second servo motor 81 is started to drive the driving gear 82 to rotate, the driving gear 82 drives the driven gear 94 to rotate, and then drives the connecting block 92 to rotate, the connecting block 92 drives the feeding part 95 to rotate, at the moment, the soldering paste conveying pump and the tin powder conveying pump are simultaneously opened, at the moment, the materials in the soldering paste temporary storage groove 21 and the tin powder temporary storage groove 22 are pressurized, in the process of rotating the feeding part 95, soldering paste can continuously flow into the soldering paste uniform feeding component 953 from the soldering paste guide pipe 952 and flow out from the outlet of the soldering paste uniform feeding component 953, the tin powder continuously flows into the tin powder uniform feeding component 956 from the tin powder guide pipe 955 and flows out from the outlet of the tin powder uniform feeding component 956, and then after one layer of soldering paste is paved, a layer of tin powder is paved at the upper end, so that the soldering paste and the tin powder are mixed more uniformly in the stirring of the later stage, and the use effect of the lead-free solder paste is improved.
In order to further improve the mixing effect of the flux paste and the tin powder, please refer to fig. 8-10, the following technical schemes are provided:
the paste uniform feed member 953 includes a paste closing case 9531 and a paste discharge head 9532 provided at a lower end of the paste closing case 9531, and a paste uniform discharge member 9533 is provided at an inner side of the paste closing case 9531;
the paste uniform discharging assembly 9533 comprises a rotary column 95331 and a discharging blade 95332 arranged on the outer side of the rotary column 95331, rotary plugs 95333 are arranged at two ends of the rotary column 95331, a reset spring 95334 is arranged on the rotary plug 95333, a clamping connector 95335 is arranged at one end, far away from the rotary plug 95333, of the reset spring 95334, and the clamping connector 95335 corresponds to a groove formed in the inner side of the paste sealing shell 9531.
Specifically, when the soldering paste flows out from the soldering paste guide pipe 952, the soldering paste can continuously fall into the upper end of the discharge blade 95332, when the gravity of the soldering paste guide pipe 952 gathered at the upper end of the discharge blade 95332 is greater than the clamping friction force of the soldering paste guide pipe 952, the rotation column 95331 rotates, the soldering paste at this time can uniformly fill the upper end of the whole discharge blade 95332, after the discharge blade 95332 rotates, the soldering paste can uniformly flow out from the soldering paste discharge head 9532, so that the soldering paste can uniformly flow into the stirring barrel 2, and the mixing effect of the soldering paste and tin powder is improved in an auxiliary manner.
In order to further improve the mixing effect of the flux paste and the tin powder, referring to fig. 8 and 11, the following technical schemes are provided:
the tin powder uniform feeding assembly 956 comprises a tin powder sealing shell 9561 and a third servo motor 9562 arranged on the inner side of the tin powder sealing shell 9561, a driving screw rod 9563 is arranged at the driving end of the third servo motor 9562, a first uniform pushing sheet 9564 and a second uniform pushing sheet 9565 are arranged on the outer side of the driving screw rod 9563, a screen plate 9566 is arranged in the tin powder sealing shell 9561 positioned at the lower end of the driving screw rod 9563, and a material guiding plate 9567 is arranged at the lower end of the screen plate 9566.
Specifically, after the tin powder flows out from the tin powder honeycomb duct 955, the tin powder can flow into the upper end of the screen plate 9566, at this time, the third servo motor 9562 is started, and then drives the first even pushing piece 9564 and the second even pushing piece 9565 to move reversely, and then spread the tin powder to two sides, and flow out from the holes of the screen plate 9566, and then the tin powder is matched with the material guide plate 9567, so that the tin powder uniformly flows out from the tin powder sealing shell 9561, and further spreads on soldering paste, and the mixing effect of the soldering paste and the tin powder is further assisted and improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should be covered by the protection scope of the present invention by making equivalents and modifications to the technical solution and the inventive concept thereof.
Claims (6)
1. The lead-free soldering paste with high adhesive force for packaging is characterized in that the lead-free soldering paste comprises tin-silver-copper alloy powder and soldering flux;
wherein the tin-silver-copper alloy powder accounts for 75-90 wt% and the soldering flux accounts for 10-25 wt%;
the tin-silver-copper alloy powder comprises three components of tin, silver and copper, wherein the tin accounts for 94-96 wt%, the silver accounts for 3-4 wt% and the copper accounts for 1-2 wt%;
the soldering flux comprises an activator, a thixotropic agent and resin, wherein the activator is an organic acid activator, the proportion of the activator is 5-12 wt%, the resin is modified rosin, the proportion of the resin is 10-25 wt%, and the proportion of the thixotropic agent is 5-15 wt%;
wherein the activator can be citric acid, strawberry acid or salicylic acid, and at least two of the activators can be selected from the group consisting of citric acid, strawberry acid and salicylic acid;
the resin may be Ma Haisuan, maleopimaric acid and dimaleate acid imide, and at least two;
the preparation method of the lead-free solder paste with high adhesive force for packaging specifically comprises the following steps:
s101: mixing and stirring the proportioned tin, silver and copper powder to obtain solder powder, preparing the solder powder into tin powder, simultaneously, independently mixing at least two resins, independently mixing at least two activators, and adding a proper solvent when the activators are mixed;
s102: cooling and stirring the resin mixed solution and the activator mixed solution, wherein the stirring temperature is lower than 45 ℃, and simultaneously adding a thixotropic agent into the mixed solution to obtain soldering paste;
s103: cooling the soldering paste to room temperature, and refrigerating at 3-9deg.C;
s104: mixing and stirring the finished soldering paste and the finished tin powder in a vacuum stirrer to prepare a semi-finished soldering paste;
s105: automatically packaging the semi-finished solder paste product by injecting nitrogen, thereby obtaining the finished solder paste;
the vacuum stirrer comprises a support frame (1) and a stirring barrel (2) arranged at the upper end of the support frame (1), wherein a vacuum machine (3) is arranged on one side of the stirring barrel (2), the vacuum machine (3) is communicated with the stirring barrel (2), a soldering paste conveying part (4) is arranged at the upper end of the stirring barrel (2), a tin powder conveying part (5) is arranged in the middle of the stirring barrel (2), a manual platform (6) is arranged at the outer side of the stirring barrel (2), a stirring mechanism (7) is arranged at the inner side of the stirring barrel (2), a driving component (8) is further arranged at the inner side of the stirring barrel (2), a uniform feeding mechanism (9) is arranged at the upper end of the inner side of the stirring barrel (2), and the driving component (8) is in meshed connection with the uniform feeding mechanism (9);
the uniform feeding mechanism (9) comprises a hanging head (91) and a connecting block (92) arranged at the lower end of the hanging head (91), a connecting rod (93) is arranged at the outer side of the connecting block (92), a driven gear (94) is arranged at one end, far away from the connecting block (92), of the connecting rod (93), the driven gear (94) is meshed with the driving gear (82), and a feeding part (95) is arranged at the upper end of the connecting block (92);
the feeding component (95) comprises a soldering paste sealing plate (951), a soldering paste guide pipe (952) arranged at the lower end of the soldering paste sealing plate (951), and a soldering paste uniform feeding component (953) arranged at the lower end of the soldering paste guide pipe (952);
the feeding part (95) further comprises a tin powder sealing disc (954) and a tin powder guide tube (955) arranged at the lower end of the tin powder sealing disc (954), and a tin powder uniform feeding assembly (956) is arranged at the lower end of the tin powder guide tube (955).
2. The method for preparing the lead-free solder paste with high adhesion for encapsulation as claimed in claim 1, wherein the specific steps of S104 are as follows:
s1041: the soldering paste is conveyed to the upper side of the stirring barrel (2) from the soldering paste conveying piece (4) through a soldering paste conveying pump, and the tin powder is conveyed to the upper side of the stirring barrel (2) from the tin powder conveying piece (5) through a tin powder conveying pump;
s1042: then, a driving assembly (8) is started to drive a uniform feeding mechanism (9) to rotate, and at the moment, the uniform feeding mechanism (9) sequentially flatly tiles soldering paste and tin powder layer by layer in the stirring barrel (2);
s1043: after the soldering paste and the tin powder are tiled, starting a stirring mechanism (7) to stir, and starting a vacuum machine (3) to vacuumize the stirring barrel (2);
s1044: and (3) after stirring for a certain time, discharging the lead-free solder paste semi-finished product, and performing secondary stirring.
3. The method for preparing the lead-free solder paste with high adhesive force for encapsulation according to claim 2, wherein the stirring mechanism (7) comprises a first servo motor (71) and a stirring blade (72) arranged at the upper end of the first servo motor (71);
the driving assembly (8) comprises a second servo motor (81) and a driving gear (82) arranged at the lower end of the second servo motor (81).
4. The preparation method of the lead-free solder paste with high adhesive force for packaging according to claim 2, wherein a soldering flux temporary storage groove (21) is formed in the upper end of the stirring barrel (2), a tin powder temporary storage groove (22) is formed in the upper end of the stirring barrel (2) positioned on the inner side of the soldering flux temporary storage groove (21), a soldering flux sealing plate (951) corresponds to the soldering flux temporary storage groove (21), and a tin powder sealing plate (954) corresponds to the tin powder temporary storage groove (22).
5. A method for preparing a high adhesion lead-free solder paste for encapsulation as claimed in claim 2, wherein the paste uniform feeding assembly (953) comprises a paste enclosure (9531) and a paste discharge head (9532) disposed at a lower end of the paste enclosure (9531), and a paste uniform discharge assembly (9533) is disposed at an inner side of the paste enclosure (9531);
the even row of soldering paste subassembly (9533) is including rotating post (95331) and setting up row's material blade (95332) in the outside of rotating post (95331), and the both ends of rotating post (95331) are provided with rotation plug (95333), are provided with reset spring (95334) on rotation plug (95333), and reset spring (95334) keep away from the one end of rotation plug (95333) and are provided with joint (95335), and joint (95335) are corresponding with the recess of seting up of soldering paste enclosure (9531).
6. The method for preparing the lead-free solder paste with high adhesive force for encapsulation according to claim 5, wherein the tin powder uniform feeding component (956) comprises a tin powder sealing shell (9561) and a third servo motor (9562) arranged on the inner side of the tin powder sealing shell (9561), a driving screw (9563) is arranged at the driving end of the third servo motor (9562), a first uniform pushing sheet (9564) and a second uniform pushing sheet (9565) are arranged on the outer side of the driving screw (9563), a sieve plate (9566) is arranged in the tin powder sealing shell (9561) positioned at the lower end of the driving screw (9563), and a material guiding plate (9567) is arranged at the lower end of the sieve plate (9566).
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| CN202210246158.1A CN114535861B (en) | 2022-03-14 | 2022-03-14 | High-adhesion lead-free solder paste for packaging and preparation method thereof |
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| WO2021115287A1 (en) * | 2019-12-09 | 2021-06-17 | 青岛歌尔微电子研究院有限公司 | Solder flux and preparation method thereof, tin paste and preparation method thereof |
| CN214106773U (en) * | 2020-11-10 | 2021-09-03 | 江西诚志生物工程有限公司 | Mixing stirring device is used in production of a-ketoglutaric acid convenient to evenly reinforced |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202199942U (en) * | 2011-07-13 | 2012-04-25 | 东莞永安科技有限公司 | Automatic tin paste producing system |
| CN108057965A (en) * | 2017-11-29 | 2018-05-22 | 东莞永安科技有限公司 | Leadless soldering tin paste of welding quality and preparation method thereof can be improved |
| WO2021115287A1 (en) * | 2019-12-09 | 2021-06-17 | 青岛歌尔微电子研究院有限公司 | Solder flux and preparation method thereof, tin paste and preparation method thereof |
| CN111151910A (en) * | 2020-01-07 | 2020-05-15 | 杭州乔泰电子有限公司 | Lead-free soldering paste |
| CN211886395U (en) * | 2020-04-14 | 2020-11-10 | 丰城市三星食品有限公司 | Stirring device for sauce production and processing |
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| CN114535861A (en) | 2022-05-27 |
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