CN114526569B - Cooling device for chip production and manufacture - Google Patents
Cooling device for chip production and manufacture Download PDFInfo
- Publication number
- CN114526569B CN114526569B CN202210160332.0A CN202210160332A CN114526569B CN 114526569 B CN114526569 B CN 114526569B CN 202210160332 A CN202210160332 A CN 202210160332A CN 114526569 B CN114526569 B CN 114526569B
- Authority
- CN
- China
- Prior art keywords
- limiting
- transmission
- cooling
- plate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 102
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 230000000694 effects Effects 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 58
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 13
- 238000005057 refrigeration Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005192 partition Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D25/00—Charging, supporting, and discharging the articles to be cooled
- F25D25/02—Charging, supporting, and discharging the articles to be cooled by shelves
- F25D25/027—Rotatable shelves
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a cooling device for chip production and manufacturing, which belongs to the technical field of chip processing and comprises a limiting frame, wherein an air cooling mechanism for cooling a chip is arranged in the limiting frame, and a cooling mechanism is also arranged in the limiting frame; the cooling device has the advantages of simple structure and convenient use, and can efficiently cool the chip placed in the device without dead angles through the linkage and the cooperation of multiple structures during use, so that the cooling effect of the cooling device on the chip is better, the time consumed by a user during the chip cooling can be effectively reduced, and the processing efficiency of the user is improved.
Description
Technical Field
The invention belongs to the technical field of chip processing, and particularly relates to a cooling device for chip production and manufacturing.
Background
The chip is a general name of a semiconductor element product, and is widely applied to a plurality of electronic devices such as mobile phones, computers and the like, so that the electronic devices can realize complex and various data processing, the chip can generate heat in the production and manufacturing process, and cooling equipment is needed to cool the chip at the moment;
the traditional cooling device for chip production and manufacturing comprises a support plate, a fixed rod, a fan, a motor, a rotating rod and the like, and has the advantages that the cooling of a chip can be realized;
however, when the cooling device is used, the chip at the bottom of the device cannot be efficiently cooled, so that the cooling device needs to spend a long time when cooling the chip, the cooling effect of the cooling device on the chip is not ideal, and the popularization and the use of the cooling device are not facilitated.
Disclosure of Invention
The invention aims to provide a cooling device for chip production and manufacturing, which solves the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a cooling device for chip manufacturing, includes spacing frame, spacing frame's inside is provided with the division board, spacing frame's inside is provided with the forced air cooling mechanism that is used for playing the cooling effect to the chip, spacing frame's inside still is provided with cooling body, cooling body is including being used for playing the placing assembly of placing with the cooling effect to the chip, be used for coordinating spacing frame and playing the altitude mixture control subassembly of altitude mixture control effect to placing the subassembly, be used for coordinating spacing frame and placing the position control subassembly that the subassembly played the altitude mixture control effect to the forced air cooling mechanism, altitude mixture control subassembly sets up the one end of keeping away from the division board placing the subassembly, position control subassembly sets up the one side at altitude mixture control subassembly.
As a further scheme of the invention: the forced air cooling mechanism includes the cooler bin, and the input of cooler bin is provided with the fan, and the output of cooler bin is provided with the gas-supply pipe, and the both sides of cooler bin are provided with jet-propelled pipe, and jet-propelled pipe is provided with coupling hose with the junction of gas-supply pipe, and one side interval of jet-propelled pipe is provided with the spacing slide rail corresponding with spacing frame, and the side of jet-propelled pipe is provided with the spacing slide with spacing slide rail sliding connection.
As a still further scheme of the invention: the both ends of cooler bin are provided with the refrigeration piece that is used for playing the cooling action to the cooler bin, and the refrigeration piece is semiconductor refrigeration piece or heat dissipation fan.
As a still further scheme of the invention: the placing assembly comprises a limiting supporting plate, a driver is arranged in the middle of the limiting supporting plate, a driving gear is arranged at one end of the driver, a transmission shaft is arranged at the other end of the driver, a plurality of placing plates are arranged at intervals at one end, away from the driver, of the transmission shaft, storage boxes are arranged at two ends of the placing plates, and limiting grooves corresponding to the storage boxes are formed in two ends of the placing plates.
As a still further scheme of the invention: one side interval of transmission shaft is provided with the first spacing sleeve pipe of being connected with the division board rotation, and the one end of transmission shaft is provided with the spacing square pole with first spacing sleeve pipe sliding connection.
As a still further scheme of the invention: the height adjusting assembly comprises a driven gear connected with the driving gear in a meshed mode, a transmission rod is arranged in the middle of the side face of the driven gear, one end of the transmission rod is connected with a second limiting sleeve fixed with the limiting support plate in a rotating mode, one end, far away from the driven gear, of the transmission rod is provided with a transmission disc, a first transmission column is arranged on one side of the transmission disc at an interval, one end of the first transmission column is provided with a first limiting plate fixedly connected with a limiting frame, and the side face of the transmission disc is provided with a first transmission column used for being matched with a third limiting sleeve to play a height adjusting role in the limiting support plate.
As a still further scheme of the invention: and one end of the third limiting sleeve, which is far away from the first limiting plate, is provided with a second limiting plate which is in sliding connection with the limiting supporting plate.
As a still further scheme of the invention: the position adjusting assembly comprises a fifth limiting plate, a fourth limiting plate is movably connected to one end of the fifth limiting plate, a transmission toothed plate used for achieving height adjustment of the jet pipe is arranged on one side of the fourth limiting plate at intervals, a transmission part meshed with the transmission toothed plate is arranged at one end of the fourth limiting plate, a third limiting plate fixedly connected with a limiting supporting plate is arranged on one side of the fourth limiting plate, and a second transmission column used for adjusting the inclination angle of the fourth limiting plate is arranged on the side face of the third limiting plate.
As a still further scheme of the invention: one end of the transmission toothed plate is provided with an elastic driving piece corresponding to the limiting frame, and the elastic driving piece is an elastic rubber belt or a spring.
As a still further scheme of the invention: the both ends of spacing frame are provided with the warning board that is used for playing the warning effect.
Compared with the prior art, the invention has the beneficial effects that: the cooling device has the advantages of simple structure, convenience in use, low cost and low fault rate, and the cooling device can efficiently and uniformly cool the chip placed in the device without dead angles through linkage and cooperation of multiple structures during use, so that the cooling effect of the cooling device on the chip is better, the time consumed by a user during chip cooling can be effectively reduced, the processing efficiency of the user is improved, and the cooling device is worthy of popularization and use.
Drawings
FIG. 1 is a schematic structural diagram of a cooling apparatus for chip manufacturing;
FIG. 2 is a schematic diagram of a cooling mechanism in a cooling apparatus for chip manufacturing;
FIG. 3 is a schematic diagram of a placement tray in a cooling apparatus for chip manufacturing;
FIG. 4 is a schematic structural diagram of a height adjustment assembly in a cooling apparatus for chip manufacturing;
FIG. 5 is a schematic structural diagram of a position adjusting assembly in a cooling apparatus for chip manufacturing;
in the figure: 1-separation plate, 2-limit frame, 3-cooling mechanism, 4-air cooling mechanism, 5-warning plate, 31-placing component, 32-height adjusting component, 33-position adjusting component, 311-placing plate, 312-storage box, 313-driving gear, 314-driver, 315-limit supporting plate, 316-driving shaft, 317-first limit sleeve, 318-limit square rod, 319-limit groove, 321-driving rod, 322-driven gear, 323-second limit sleeve, 324-first limit plate, 325-first driving column, 326-third limit sleeve, 327-driving plate, 328-second limit plate, 331-third limit plate, 332-second driving limit plate column, 333-fourth limit plate, 334-fifth limit plate, 335-elastic driving piece, 336-driving toothed plate, 337-driving piece, 41-limit sliding plate, 42-limit sliding rail, 43-air injection pipe, 44-connecting hose, 45-air pipe, 46-refrigeration piece, 47-cooling box and 48-fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed.
The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1, the embodiment provides a cooling device for chip manufacturing, including a limiting frame 2, a partition plate 1 is disposed inside the limiting frame 2, an air cooling mechanism 4 for cooling a chip is disposed inside the limiting frame 2, a cooling mechanism 3 is further disposed inside the limiting frame 2, the cooling mechanism 3 includes a placement component 31 for placing and cooling the chip, a height adjusting component 32 for matching the limiting frame 2 to adjust the height of the placement component 31, and a position adjusting component 33 for matching the limiting frame 2 and the placement component 31 to adjust the height of the air cooling mechanism 4, the height adjusting component 32 is disposed at one end of the placement component 31 far away from the partition plate 1, and the position adjusting component 33 is disposed at one side of the height adjusting component 32;
referring to fig. 1, in an embodiment, in order to make the air cooling mechanism 4 have a better cooling effect on the chip, in this embodiment, preferably, the air cooling mechanism 4 includes a cooling box 47, an input end of the cooling box 47 is provided with a fan 48, an output end of the cooling box 47 is provided with an air pipe 45, two sides of the cooling box 47 are provided with air injection pipes 43, a connection hose 44 is provided at a connection position between the air injection pipes 43 and the air pipe 45, one side of the air injection pipes 43 is provided with limit slide rails 42 corresponding to the limit frame 2 at intervals, a limit slide plate 41 slidably connected with the limit slide rails 42 is provided on a side surface of the air injection pipes 43, two ends of the cooling box 47 are provided with refrigeration pieces 46 for cooling the cooling box 47, and the refrigeration pieces 46 are semiconductor refrigeration pieces or heat dissipation fans;
when the cooling device is used, air is blown into the cooling box 47 through the fan 48, the cooling box 47 is cooled through the refrigerating piece 46 at the moment, so that the temperature of the air in the cooling box 47 is lower, then the air in the cooling box 47 is conveyed through the air conveying pipe 45 and the connecting hose 44 and then is sprayed out through the air spraying pipe 43 to cool the chip, and the cooling effect of the device on the chip is better;
in another embodiment, the air cooling mechanism 4 comprises a cooling box 47, a fan 48 is arranged at the input end of the cooling box 47, an air pipe 45 is arranged at the output end of the cooling box 47, air injection pipes 43 are arranged at two sides of the cooling box 47, a connecting hose 44 is arranged at the connecting position of the air injection pipes 43 and the air pipe 45, a limiting slide rail 42 corresponding to the limiting frame 2 is arranged at one side of the air injection pipes 43 at intervals, a limiting slide plate 41 connected with the limiting slide rail 42 in a sliding manner is arranged at the side surface of the air injection pipes 43, and cooling water tanks for cooling the cooling box 47 are arranged at two ends of the cooling box 47;
referring to fig. 2 and 3, in an embodiment, in order to facilitate a user to cool and replace chips, in this embodiment, preferably, the placing assembly 31 includes a limiting support plate 315, a driver 314 is disposed in the middle of the limiting support plate 315, the driver 314 is a motor or a pneumatic motor, a driving gear 313 is disposed at one end of the driver 314, a transmission shaft 316 is disposed at the other end of the driver 314, a plurality of placing trays 311 are disposed at intervals at one end of the transmission shaft 316 away from the driver 314, storage boxes 312 are disposed at two ends of the placing trays 311, limiting grooves 319 corresponding to the storage boxes 312 are disposed at two ends of the placing trays 311, when in use, chips to be cooled are placed in the storage boxes 312 for cooling, the storage boxes 312 are convenient for the user to replace chips in batches, and the storage boxes 312 rotate along with the placing trays 311 to cool the chips without dead corners, so that the device has a better cooling effect on the chips;
referring to fig. 2, in an embodiment, in order to make the placing assembly 31 more reliable in use, in this embodiment, preferably, a first limiting sleeve 317 rotatably connected to the partition plate 1 is disposed at an interval on one side of the transmission shaft 316, and a limiting square rod 318 slidably connected to the first limiting sleeve 317 is disposed at one end of the transmission shaft 316;
in another embodiment, the placing assembly 31 includes a limiting support plate 315, a driver 314 is disposed in the middle of the limiting support plate 315, the driver 314 is a motor or a pneumatic motor, a transmission shaft 316 is disposed at an output end of the driver 314, and a plurality of placing grooves for storing chips are disposed on an upper surface of the transmission shaft 316;
referring to fig. 4, in an embodiment, in order to make the use of the height adjusting assembly 32 more environment-friendly and reliable, in this embodiment, preferably, the height adjusting assembly 32 includes a driven gear 322 engaged with the driving gear 313, a transmission rod 321 is disposed in the middle of a side surface of the driven gear 322, one end of the transmission rod 321 is rotatably connected to a second limiting sleeve 323 fixed to the limiting support plate 315, one end of the transmission rod 321 away from the driven gear 322 is provided with a transmission disc 327, one side of the transmission disc 327 is provided with first transmission columns 325 at intervals, one end of the first transmission columns 325 is provided with a first limiting plate 324 fixedly connected to the limiting frame 2, and a side surface of the transmission disc 327 is provided with a first transmission column 325 for cooperating with the third limiting sleeve 326 to perform a height adjusting function on the limiting support plate 315;
when the device is used, the driving rod 321 is driven through the meshing connection of the driving gear 313 and the driven gear 322, so that the driving disc 327 rotates along with the driving rod 321, and the height of the third limiting sleeve 326 is fixed, so that when the driving disc 327 rotates, the driving disc 327 can vertically reciprocate under the cooperation of the first driving column 325, so that the limiting support plate 315 vertically reciprocates, so that the device can cool a chip without a dead angle, and one end, far away from the first limiting plate 324, of the third limiting sleeve 326 is provided with a second limiting plate 328 in sliding connection with the limiting support plate 315;
in another embodiment, the height adjusting assembly 32 includes a first mounting substrate fixed on the upper surface of the position-limiting support plate 315, and a first electric telescopic rod for adjusting the height of the position-limiting support plate 315 is disposed on a side surface of the first mounting substrate;
referring to fig. 2 and 5, in an embodiment, in order to make the use of the position adjusting assembly 33 more environment-friendly and reliable, in the embodiment, preferably, the position adjusting assembly 33 includes a fifth limiting plate 334, the fifth limiting plate 334 is fixedly connected with the limiting frame 2, one end of the fifth limiting plate 334 is movably connected with a fourth limiting plate 333, one side of the fourth limiting plate 333 is provided with a driving toothed plate 336 at intervals for adjusting the height of the gas nozzle 43, one end of the fourth limiting plate 333 is provided with a driving member 337 engaged with the driving toothed plate 336, one side of the fourth limiting plate 333 is provided with a third limiting plate 331 fixedly connected with the limiting support plate 315, a side of the third limiting plate 331 is provided with a second driving post 332 for adjusting the inclination angle of the fourth limiting plate 333, one end of the driving toothed plate 336 is provided with an elastic driving member 335 corresponding to the limiting frame 2, the elastic driving member 335 is an elastic rubber belt or a spring, and the elastic driving member 335 is arranged to prevent the gas nozzle 43 from accidentally dropping down;
when the limiting support plate 315 vertically reciprocates, the third limiting plate 331 vertically reciprocates along with the limiting support plate 315, and at this time, the transmission member 337 drives the transmission toothed plate 336 to vertically reciprocate, so that when the limiting support plate 315 moves upwards, the transmission toothed plate 336 drives the air injection pipe 43 to move downwards, and when the limiting support plate 315 moves downwards, the transmission toothed plate 336 drives the air injection pipe 43 to move upwards, so that the reverse motion of the storage box 312 and the air injection pipe 43 is realized, and the device can sufficiently cool the chip without dead angles;
in another embodiment, the position adjusting assembly 33 includes a second mounting substrate, the second mounting substrate is fixed on one end of the upper surface of the limiting support plate 315, and a second electric telescopic rod for adjusting the height of the gas nozzle 43 is disposed on a side surface of the second mounting substrate;
referring to fig. 1, in an embodiment, in order to improve the warning effect of the cooling device, in the embodiment, it is preferable that warning plates 5 for warning are disposed at two ends of the limiting frame 2, and the warning plates 5 are light reflecting plates or fluorescent plates.
The working principle and the using process of the invention are as follows: when the cooling device is used, a chip to be cooled is placed in the storage box 312, then the storage box 312 containing the chip is placed on the placing plate 311, then the driver 314 drives the transmission shaft 316 to rotate, meanwhile, the power supply of the fan 48 is switched on, so that the fan 48 blows air into the cooling box 47, and then the air is sprayed out through the air spraying pipe 43 to cool the chip;
when the transmission shaft 316 rotates, the transmission shaft 316 drives the placing disc 311 to rotate, so that the chip can be uniformly cooled, and a cooling dead angle is avoided;
in addition, when spacing backup pad 315 carries out vertical reciprocating motion, position control subassembly 33 is in operating condition and adjusts the height of jet-propelled pipe 43, make jet-propelled pipe 43 and spacing backup pad 315 carry out reverse motion, thereby further hoisting device is to the cooling homogeneity of chip, avoid having cooling dead angle and the inhomogeneous phenomenon of cooling, make cooling device can carry out the high efficiency to the chip, the even cooling at no dead angle, make cooling device better to the cooling effect at chip, and can effectively reduce the time that the user consumes when cooling the chip, promote user's machining efficiency, be worth promoting and using.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.
Claims (6)
1. The utility model provides a cooling device for chip manufacturing, includes spacing frame, spacing frame's inside is provided with division board, its characterized in that: the air cooling mechanism comprises a cooling box, the input end of the cooling box is provided with a fan, the output end of the cooling box is provided with a gas pipe, the two sides of the cooling box are provided with gas injection pipes, and the connecting part of the gas injection pipes and the gas pipe is provided with a connecting hose, the device comprises an air injection pipe, a plurality of placing plates, a height adjusting assembly and a plurality of positioning components, wherein limiting slide rails corresponding to a limiting frame are arranged on one side of the air injection pipe at intervals, limiting slide plates connected with the limiting slide rails in a sliding manner are arranged on the side surface of the air injection pipe, the placing components comprise limiting support plates, drivers are arranged in the middle of the limiting support plates, driving gears are arranged at one ends of the drivers, transmission shafts are arranged at the other ends of the drivers, a plurality of placing plates are arranged at intervals on one ends of the transmission shafts away from the drivers, storage boxes are arranged at two ends of the placing plates, limiting grooves corresponding to the storage boxes are arranged at two ends of the placing plates, the height adjusting assembly comprises driven gears connected with the driving gears in a meshing manner, transmission rods are arranged in the middle of the side surfaces of the driven gears, one ends of the transmission rods are rotatably connected with second limiting sleeves fixed with the limiting support plates, transmission plates are arranged at one ends of the transmission rods away from the driven gears, and first transmission columns are arranged at intervals on one sides of the transmission plates, one end of the first transmission column is provided with the first limiting plate fixedly connected with the limiting frame, the side of the transmission disc is provided with the first transmission column which is used for matching a third limiting sleeve to play a height adjusting role in the limiting supporting plate, the position adjusting assembly comprises a fifth limiting plate, one end of the fifth limiting plate is movably connected with a fourth limiting plate, one side of the fourth limiting plate is provided with a transmission toothed plate which is used for playing a height adjusting role in the air injection pipe at intervals, one end of the fourth limiting plate is provided with a transmission part meshed with the transmission toothed plate, one side of the fourth limiting plate is provided with a third limiting plate fixedly connected with the limiting supporting plate, and the side of the third limiting plate is provided with a second transmission column which is used for adjusting the inclination angle of the fourth limiting plate.
2. The cooling apparatus for chip production according to claim 1, wherein: the both ends of cooler bin are provided with the refrigeration piece that is used for playing the cooling action to the cooler bin, and the refrigeration piece is semiconductor refrigeration piece or heat dissipation fan.
3. The cooling device for chip production and manufacture according to claim 2, wherein: one side interval of transmission shaft is provided with the first spacing sleeve pipe of being connected with the division board rotation, and the one end of transmission shaft is provided with the spacing square pole with first spacing sleeve pipe sliding connection.
4. The cooling apparatus for chip production according to claim 3, wherein: and one end of the third limiting sleeve, which is far away from the first limiting plate, is provided with a second limiting plate which is in sliding connection with the limiting supporting plate.
5. The cooling device for chip production and manufacture according to claim 4, wherein: one end of the transmission toothed plate is provided with an elastic driving piece corresponding to the limiting frame, and the elastic driving piece is an elastic rubber belt or a spring.
6. The cooling apparatus for chip production according to any one of claims 1 to 5, wherein: the both ends of spacing frame are provided with the warning board that is used for playing the warning effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210160332.0A CN114526569B (en) | 2022-02-22 | 2022-02-22 | Cooling device for chip production and manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210160332.0A CN114526569B (en) | 2022-02-22 | 2022-02-22 | Cooling device for chip production and manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114526569A CN114526569A (en) | 2022-05-24 |
| CN114526569B true CN114526569B (en) | 2023-03-14 |
Family
ID=81624660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210160332.0A Active CN114526569B (en) | 2022-02-22 | 2022-02-22 | Cooling device for chip production and manufacture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114526569B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107084567A (en) * | 2017-06-27 | 2017-08-22 | 盐城市宁润玻璃制品有限公司 | A kind of glass processing cooling device |
| CN211147072U (en) * | 2019-12-23 | 2020-07-31 | 陈印川 | Cooling device for chemical production |
| CN112212564A (en) * | 2020-10-14 | 2021-01-12 | 张桂云 | Intelligent self-adjusting cold chain fresh-keeping storage system |
| CN215571434U (en) * | 2021-05-11 | 2022-01-18 | 郑州国锋耐火材料有限公司 | Quick cooling device of light-duty fire-resistant composite brick |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL225007A0 (en) * | 2013-02-28 | 2013-06-27 | M S T Creative Thinking Ltd | Rapid cooling device |
-
2022
- 2022-02-22 CN CN202210160332.0A patent/CN114526569B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107084567A (en) * | 2017-06-27 | 2017-08-22 | 盐城市宁润玻璃制品有限公司 | A kind of glass processing cooling device |
| CN211147072U (en) * | 2019-12-23 | 2020-07-31 | 陈印川 | Cooling device for chemical production |
| CN112212564A (en) * | 2020-10-14 | 2021-01-12 | 张桂云 | Intelligent self-adjusting cold chain fresh-keeping storage system |
| CN215571434U (en) * | 2021-05-11 | 2022-01-18 | 郑州国锋耐火材料有限公司 | Quick cooling device of light-duty fire-resistant composite brick |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114526569A (en) | 2022-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202498546U (en) | Novel rotation manipulator | |
| CN102528800A (en) | Novel rotary manipulator | |
| US10211363B2 (en) | Transfer printing template and transfer printing device of micro light-emitting diode | |
| CN114526569B (en) | Cooling device for chip production and manufacture | |
| CN218940473U (en) | Box switch board with heat dissipation function | |
| CN113510870A (en) | Semiconductor wafer cutting device | |
| CN112928656B (en) | Intelligent low-voltage power distribution cabinet | |
| CN106974059B (en) | Ice cream 3D printer | |
| CN211565432U (en) | Grinding device is used in production of plastic mould | |
| WO2023130289A1 (en) | Movable solar pre-cooling box for use on farmland | |
| CN212986587U (en) | High strength intelligence panel computer all-in-one support | |
| CN206134156U (en) | Energy -saving LED (light emitting diode) electronic screen | |
| CN209920990U (en) | Refrigerator car evaporimeter convenient to installation and dismantlement | |
| CN107241894A (en) | A kind of use for electronic products heat-dissipating casing | |
| CN220436849U (en) | Cooling device of ice cream production line | |
| CN217800566U (en) | Economical and environment-friendly sawtooth cooling device | |
| CN220977232U (en) | Water cooling device for growth of large kilogram of sapphire crystals | |
| CN221839423U (en) | Portable liftable spectrum therapeutic instrument case | |
| CN221820942U (en) | Conveying device for automobile water pump production | |
| CN221123159U (en) | Energy-saving control device of cooling tower | |
| CN209857424U (en) | Air cooling temperature control platform for semiconductor TEC | |
| CN218483043U (en) | Flexible circuit board pastes dress components and parts device | |
| CN219063917U (en) | Intelligent continuous cooling device for vinasse | |
| CN220998280U (en) | Turnover basket transportation equipment for feeding and discharging of vacuum cooler | |
| CN212070797U (en) | Novel code printer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |