CN114523743B - 定位开启包装袋用复合膜生产工艺 - Google Patents
定位开启包装袋用复合膜生产工艺 Download PDFInfo
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Abstract
本发明涉及定位开启包装袋用复合膜生产工艺,步骤:表面印刷、定位模切制得具有第一切线的印刷膜;满版涂布防粘连涂料、定位模切制得具有第二切线的复合内膜;定位复合印刷膜与复合内膜;熟化、分切。本发明在复合内膜的第二切线以内镂空开口,第二切线以内的复合内膜与第一切线以内的印刷膜复合形成开合片,印刷膜与复合内膜之间且位于第二切线边缘处形成与开合片边缘配合的搭接面,搭接面的表层为防粘连涂层,开合片边缘表层为水性压敏胶,开合片平整搭在搭接面上实现密封而又可以拉开实现开口;由于是水性压敏胶和防粘连涂层,既便利易揭又可反复多次开合,无需借助拉链等其他机械启闭件,成本低,可用于制作袋面开袋的镀铝复合包装袋。
Description
技术领域
本发明属于包材技术领域,具体涉及一种定位开启包装袋用复合膜生产工艺。
背景技术
镀铝复合包装膜由于美观、密封性较好、水蒸汽透过量和氧气透过量等物理性能良好等优点,广泛应用于食品及药品包装。现有的镀铝复合膜多为三层,表面的油墨印刷层、中间的镀铝层和底面的热封层,制袋封口时一般是在袋子的两端留出口子再利用封口设备热封成密封空间,或者将两端热封并在其中一端设置可重复利用的密封拉链。不论是前者还是后者,包装袋的袋面完整密封,且包装袋内容物的取放口都是在袋体端部。
而随着生活水平的提高,消费者不满足于这种常规的开袋方式,出现了希望在包装袋的袋面启口取放的开袋需求。但目前的袋面开袋式包装袋一般是先制作整张完整的复合膜,然后后期切割出开口再在开口处人工胶封一片胶带,无法实现自动化生产且基于胶带成本考虑则开口不能大。
发明内容
鉴于现有技术的不足,本发明所要解决的技术问题是提供一种定位开启包装袋用复合膜生产工艺,可机械化连续生产,用于制作袋面开袋的镀铝复合包装袋。
为解决上述技术问题,本发明采用的技术方案是:
定位开启包装袋用复合膜生产工艺,具体包括如下步骤:表面印刷、定位模切制得具有第一切线的印刷膜;满版涂布防粘连涂料、定位模切制得具有第二切线的复合内膜,复合内膜由热封膜与镀铝膜复合形成;定位复合印刷膜与复合内膜,第二切线以内的复合内膜与第一切线以内的印刷膜复合形成开合片;熟化、分切。
优选地,所述印刷膜为表面电晕后的BOPP薄膜;所述BOPP薄膜的表面电晕值为40-50达因;所述BOPP薄膜的厚度为30微米~50微米。
优选地,所述复合内膜由PE膜与镀铝聚酯膜复合形成。
优选地,所述满版涂布防粘连涂料步骤是在复合内膜的镀铝面涂布,其版辊雕刻工艺要求:网点深度需达到45~50μm、雕刻线数70线、网角45,雕针130、铬层硬度800~900HV。
优选地,所述第二切线小于第一切线;所述第一切线和第二切线形状为U型结构。
优选地,所述定位复合印刷膜与复合内膜步骤采用的胶黏剂为水性压敏胶。
优选地,所述定位复合印刷膜与复合内膜步骤为干式复合。
与现有技术相比,本发明具有以下有益效果:
本发明复合膜生产工艺包括分别制得带有表印图层和第一切线的印刷膜以及带有防粘连涂层和第二切线的复合内膜,然后定位复合上述印刷膜和复合内膜,使得第二切线以内的复合内膜与第一切线以内的印刷膜复合形成开合片,而复合内膜的第二切线以内则镂空开口,印刷膜与复合内膜之间且位于第二切线边缘处形成与开合片边缘配合的搭接面,搭接面的表层为防粘连涂层,开合片边缘表层为水性压敏胶,开合片平整搭在搭接面上实现密封而又可以拉开开合片实现开口。
本发明生产工艺可实现机械化连续生产,提高生产效率,而袋面开口可以根据需求设计大小和位置;另由于是水性压敏胶和防粘连涂层,既便利易揭又可反复多次开合,无需借助拉链等其他机械启闭件,成本低,可用于制作袋面开袋的镀铝复合包装袋。
具体实施方式
实施例1
本实施例提供一种定位开启包装袋用复合膜生产工艺,具体包括如下步骤:
S1、表面印刷、定位模切制得具有第一切线的印刷膜:取BOPP薄膜,厚度为30微米,表面电晕值为40达因,采用凹版印刷工艺在BOPP薄膜表面表面印刷获得表印图层;印刷后在模切机上对BOPP薄膜进行定位模切形成第一切线,第一切线的形状为U型结构,第一切线贯穿BOPP薄膜上下面。
S2、满版涂布防粘连涂料、定位模切制得具有第二切线的复合内膜:先在复合机A上采用干式复合工艺使得热封膜与镀铝膜复合形成复合内膜,热封膜选用PE膜,镀铝膜选用高附着力VMPET膜;复合内膜的上下面分别为镀铝面和热封面,利用涂布机在复合内膜的镀铝面上满版涂布防粘连涂料以形成防粘连涂层,涂布速度100m/min,涂布防粘连涂料的版辊雕刻工艺要求为:网点深度需达到45μm、雕刻线数70线、网角45,雕针130、铬层硬度900HV;然后上模切机对复合内膜进行定位模切形成第二切线,第二切线也为U型结构,第二切线小于第一切线。
S3、利用SOP 1250-PⅡ电脑控制干式复合机完成定位复合印刷膜与复合内膜,复合用的胶黏剂为水性压敏胶,具体为陶氏INVISU 3851,复合工艺参数为速度为40m/min,烘箱长度大于12米,各段温度分别达到75℃、85℃、95℃、105℃。复合后第二切线以内的复合内膜与第一切线以内的印刷膜复合形成开合片,所述印刷膜与复合内膜之间且位于第二切线边缘处形成与开合片边缘配合的搭接面,开合片平整搭在搭接面上。
S4、在45℃放置48小时完成熟化,然后分切得复合膜。
实施例2
本实施例提供一种定位开启包装袋用复合膜生产工艺,具体包括如下步骤:
S1、表面印刷、定位模切制得具有第一切线的印刷膜:取BOPP薄膜,厚度为40微米,表面电晕值为42达因,采用凹版印刷工艺在BOPP薄膜表面表面印刷获得表印图层;印刷后在模切机上对BOPP薄膜进行定位模切形成第一切线,第一切线的形状为U型结构,第一切线贯穿BOPP薄膜上下面。
S2、满版涂布防粘连涂料、定位模切制得具有第二切线的复合内膜:先在复合机A上采用湿法复合工艺使得热封膜与镀铝膜复合形成复合内膜,热封膜选用PE膜,镀铝膜选用高附着力VMPET膜;复合内膜的上下面分别为镀铝面和热封面,利用涂布机在复合内膜的镀铝面上满版涂布防粘连涂料以形成防粘连涂层,涂布速度100m/min,涂布防粘连涂料的版辊雕刻工艺要求为:网点深度需达到45μm、雕刻线数70线、网角45,雕针130、铬层硬度800HV;然后上模切机对复合内膜进行定位模切形成第二切线,第二切线也为U型结构,第二切线小于第一切线。
S3、利用SOP 1250-PⅡ电脑控制干式复合机完成定位复合印刷膜与复合内膜,复合用的胶黏剂为水性压敏胶,具体为陶氏INVISU 3851,复合工艺参数为速度为60m/min,烘箱长度大于12米,各段温度分别达到70℃、80℃、90℃、100℃。复合后第二切线以内的复合内膜与第一切线以内的印刷膜复合形成开合片,所述印刷膜与复合内膜之间且位于第二切线边缘处形成与开合片边缘配合的搭接面,开合片平整搭在搭接面上。
S4、在40℃℃放置50小时完成熟化,然后分切得复合膜。
实施例3
本实施例提供一种定位开启包装袋用复合膜生产工艺,具体包括如下步骤:
S1、表面印刷、定位模切制得具有第一切线的印刷膜:取BOPP薄膜,厚度为35微米,表面电晕值为45达因,采用凹版印刷工艺在BOPP薄膜表面表面印刷获得表印图层;印刷后在模切机上对BOPP薄膜进行定位模切形成第一切线,第一切线的形状为U型结构,第一切线贯穿BOPP薄膜上下面。
S2、满版涂布防粘连涂料、定位模切制得具有第二切线的复合内膜:先在复合机A上采用干式复合工艺使得热封膜与镀铝膜复合形成复合内膜,热封膜选用PE膜,镀铝膜选用高附着力VMPET膜;复合内膜的上下面分别为镀铝面和热封面,利用涂布机在复合内膜的镀铝面上满版涂布防粘连涂料以形成防粘连涂层,涂布速度100m/min,涂布防粘连涂料的版辊雕刻工艺要求为:网点深度需达到50μm、雕刻线数70线、网角45,雕针130、铬层硬度850HV;然后上模切机对复合内膜进行定位模切形成第二切线,第二切线也为U型结构,第二切线小于第一切线。
S3、利用SOP 1250-PⅡ电脑控制干式复合机完成定位复合印刷膜与复合内膜,复合用的胶黏剂为水性压敏胶,具体为陶氏INVISU 3851,复合工艺参数为速度为50m/min,烘箱长度大于12米,各段温度分别达到70℃、80℃、90℃、100℃。复合后第二切线以内的复合内膜与第一切线以内的印刷膜复合形成开合片,所述印刷膜与复合内膜之间且位于第二切线边缘处形成与开合片边缘配合的搭接面,开合片平整搭在搭接面上。
S4、在50℃放置48小时完成熟化,然后分切得复合膜。
以上显示和描述了本发明创造的基本原理和主要特征及本发明的优点,本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明创造精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内,本发明要求保护范围由所附的权利要求书及其等效物界定。
Claims (6)
1.定位开启包装袋用复合膜生产工艺,其特征在于,具体包括如下步骤:
表面印刷、定位模切制得具有第一切线的印刷膜;
满版涂布防粘连涂料、定位模切制得具有第二切线的复合内膜,复合内膜由热封膜与镀铝膜复合形成;
定位复合印刷膜与复合内膜,第二切线以内的复合内膜与第一切线以内的印刷膜复合形成开合片;
熟化、分切;
所述第二切线小于第一切线;
所述定位复合印刷膜与复合内膜步骤为干式复合,采用的胶黏剂为水性压敏胶;
所述满版涂布防粘连涂料步骤是在复合内膜的镀铝面涂布,其版辊雕刻工艺要求:网点深度需达到45~50μm、雕刻线数70线、网角45,雕针130、铬层硬度800~900HV;
复合内膜的第二切线以内为镂空开口,印刷膜与复合内膜之间且位于第二切线边缘处形成与开合片边缘配合的搭接面,搭接面的表层为防粘连涂层,开合片边缘表层为水性压敏胶。
2.根据权利要求1所述的定位开启包装袋用复合膜生产工艺,其特征在于:所述印刷膜为表面电晕后的BOPP薄膜。
3.根据权利要求2所述的定位开启包装袋用复合膜生产工艺,其特征在于:所述BOPP薄膜的表面电晕值为40-50达因。
4.根据权利要求2所述的定位开启包装袋用复合膜生产工艺,其特征在于:所述BOPP薄膜的厚度为30微米~50微米。
5.根据权利要求1所述的定位开启包装袋用复合膜生产工艺,其特征在于:所述复合内膜由PE膜与镀铝聚酯膜复合形成。
6.根据权利要求1所述的定位开启包装袋用复合膜生产工艺,其特征在于:所述第一切线和第二切线形状为U型结构。
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