CN114523430A - Method for detecting bonding strength of ceramic grinding wheel matrix - Google Patents
Method for detecting bonding strength of ceramic grinding wheel matrix Download PDFInfo
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- CN114523430A CN114523430A CN202210178145.5A CN202210178145A CN114523430A CN 114523430 A CN114523430 A CN 114523430A CN 202210178145 A CN202210178145 A CN 202210178145A CN 114523430 A CN114523430 A CN 114523430A
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- 238000000227 grinding Methods 0.000 title claims abstract description 111
- 239000000919 ceramic Substances 0.000 title claims abstract description 78
- 239000011159 matrix material Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 54
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 238000010304 firing Methods 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims description 15
- 238000004064 recycling Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000006061 abrasive grain Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005457 optimization Methods 0.000 abstract description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a method for detecting the bonding strength of a ceramic grinding wheel matrix, which belongs to the detection field and comprises the steps of designing a grinding tool and a matrix, firing a semi-8-shaped ceramic grinding wheel sample, processing the semi-8-shaped matrix, processing the semi-8-shaped ceramic grinding wheel sample, forming the 8-shaped sample, detecting the tensile strength, adjusting a formula and a process and the like, wherein through the steps, the method for detecting the bonding strength of the ceramic grinding wheel matrix is the same as the method for detecting the tensile strength of the ceramic grinding wheel matrix, and can calculate according to the maximum stress theory of the grinding wheel strength, so that the optimization is carried out, and the bonding effect is ensured; the detection method is close to the actual bonding process of the ceramic grinding wheel matrix, the detection result is more accurate, and the reference value is higher; the half 8-shaped block matrix can be repeatedly used by removing the adhesive through heating; under the same condition, the repeatability of the detection result is good, the influence of human factors can be better avoided, and the bonding strength of the ceramic grinding wheel matrix can be accurately characterized.
Description
Technical Field
The invention relates to the field of detection, in particular to a method for detecting the bonding strength of a ceramic grinding wheel matrix.
Background
The grinding wheel is also called a bonded abrasive tool, and is a bonded abrasive tool with certain strength and a certain shape formed by bonding common abrasive materials by using a bonding agent. It is generally composed of abrasive, bond and air holes, which are often referred to as the three elements of a bonded abrasive tool. According to different classifications of binders, ceramic grinding wheels, resin grinding wheels and rubber grinding wheels are common.
The general ceramic grinding wheel needing base body bonding mainly comprises a ceramic bond CBN grinding wheel, a ceramic bond diamond grinding wheel, a ceramic bond SG gear grinding wheel and other ceramic bond grinding wheels. The ceramic grinding wheel is applied to the condition that the requirement on the processing condition is high, and the safety performance of the grinding wheel is the premise of ensuring the grinding processing effect. Therefore, the method has very important significance for detecting the bonding strength of the ceramic grinding wheel matrix, adjusting and optimizing the bonding process and ensuring the bonding effect.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide the method for detecting the bonding strength of the ceramic grinding wheel matrix, which has accurate detection results and is beneficial to optimizing the formula and process of the adhesive.
One of the purposes of the invention is realized by adopting the following technical scheme:
a method for detecting the bonding strength of a ceramic grinding wheel matrix comprises the following steps:
designing a grinding tool and a matrix: designing and processing a half 8-shaped block ceramic grinding wheel sample forming die and a half 8-shaped block matrix;
firing a semi-8-shaped ceramic grinding wheel sample: mixing materials according to a grinding wheel formula, adopting the semi-8-shaped ceramic grinding wheel sample forming die to perform compression forming on the mixed materials, and then drying and sintering to form a semi-8-shaped ceramic grinding wheel sample;
processing a half-8-block matrix: according to the treatment process of the bonding surface of the ceramic grinding wheel matrix, carrying out slotting processing treatment on the interface surface of the semi-8-shaped matrix;
processing a semi-8-shaped ceramic grinding wheel sample: carrying out interface surface polishing treatment on the semi-8-shaped ceramic grinding wheel sample;
forming 8-block samples: bonding and curing the semi-8-shaped ceramic grinding wheel sample and the semi-8-shaped matrix by using a prepared adhesive to form an 8-shaped sample;
and (3) detecting the tensile strength: detecting the tensile strength of the 8-shaped block sample by using an electronic tensile machine;
adjusting the formula and the process: and adjusting the formula and the curing process of the adhesive according to the detection result.
Further, the half 8-shaped block base body is made of any one of aluminum alloy or steel.
Further, in the step of firing the semi-8-shaped ceramic grinding wheel sample: when the grinding wheel is a ceramic bond CBN grinding wheel or a diamond grinding wheel, WA or SG abrasive grains in the same grain size range are used for replacing materials.
Further, the method further comprises a recycling step, wherein the recycling step is located after the tensile strength detecting step, and the recycling step specifically comprises: and heating the semi-8-shaped block matrix, removing the adhesive on the surface, and cleaning for reuse.
Further, in the recycling step, the heating temperature of the semi-8-shaped block matrix is 400-450 ℃.
Further, the shape of the half 8-shaped block ceramic grinding wheel sample forming die is the same as that of the half 8-shaped block base body.
Further, in the step of firing the semi-8-shaped ceramic grinding wheel sample, the sintering temperature is 900-1000 ℃.
Further, the method for detecting the bonding strength of the ceramic grinding wheel matrix further comprises a cleaning treatment step, wherein the cleaning treatment step is positioned before the step of forming the 8-shaped block sample, and the cleaning treatment specifically comprises the following steps: and cleaning the interface surfaces of the semi-8-shaped block matrix and the semi-8-shaped block ceramic grinding wheel sample by using alcohol.
Furthermore, in the step of forming the 8-shaped block sample, after bonding, the sample is naturally cured and then heated and cured.
Furthermore, the natural curing time is 6-12 hours, the heating curing temperature is 80-150 ℃, and the heating curing time is 4-6 hours.
The method for detecting the bonding strength of the matrix of the ceramic grinding wheel is the same as the method for detecting the tensile strength of the ceramic grinding wheel, and the calculation can be carried out by referring to the maximum stress theory of the strength of the grinding wheel, so that the optimization is carried out, and the bonding effect is ensured;
the method for detecting the bonding strength of the ceramic grinding wheel matrix is close to the actual bonding process of the ceramic grinding wheel matrix, the detection result is more accurate, and the reference value is higher;
according to the method for detecting the bonding strength of the ceramic grinding wheel matrix, the adhesive of the semi-8-shaped matrix is removed through heating, and the matrix can be recycled.
The method for detecting the bonding strength of the ceramic grinding wheel matrix has the advantages that the repeatability of the detection result is good under the same condition, the influence of human factors can be better avoided, and the bonding strength of the ceramic grinding wheel matrix can be accurately represented.
Drawings
FIG. 1 is a flow chart of the method for detecting the bonding strength of the matrix of the vitrified grinding wheel according to the invention;
FIG. 2 is a structural diagram of an 8-shaped block sample in the method for detecting the bonding strength of a vitrified grinding wheel base body according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, secured by intervening elements. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
FIG. 1 is a flow chart of the method for detecting the bonding strength of the vitrified grinding wheel matrix according to the present invention, which comprises the following steps:
a method for detecting the bonding strength of a ceramic grinding wheel matrix comprises the following steps:
designing a grinding tool and a matrix: designing and processing a half 8-shaped block ceramic grinding wheel sample forming die and a half 8-shaped block matrix;
firing a semi-8-shaped ceramic grinding wheel sample: mixing materials according to a grinding wheel formula, adopting a half-8-shaped ceramic grinding wheel sample forming die to perform compression forming on the mixed materials, and then drying and sintering to form a half-8-shaped ceramic grinding wheel sample;
processing a half-8-block matrix: according to the treatment process of the bonding surface of the ceramic grinding wheel matrix, carrying out slotting processing treatment on the interface surface of the semi-8-shaped matrix;
processing a semi-8-shaped ceramic grinding wheel sample: carrying out interface surface polishing treatment on the semi-8-shaped ceramic grinding wheel sample;
forming 8-block samples: bonding and curing the semi-8-shaped ceramic grinding wheel sample and the semi-8-shaped matrix by using the prepared adhesive to form an 8-shaped sample (see figure 2);
and (3) detecting the tensile strength: detecting the tensile strength of the 8-shaped block sample by using an electronic tensile machine;
adjusting the formula and the process: and adjusting the formula and the curing process of the adhesive according to the detection result.
Specifically, the half 8-shaped block base body is made of any one of aluminum alloy or steel. In the step of firing the semi-8-shaped ceramic grinding wheel sample: when the grinding wheel is a ceramic bond CBN grinding wheel or a diamond grinding wheel, WA or SG abrasive grains in the same grain size range are used for replacing materials.
Further, the method further comprises a recycling step, wherein the recycling step is positioned after the tensile strength detection step, and the recycling step specifically comprises the following steps: and heating the semi-8-shaped block matrix, removing the adhesive on the surface, and cleaning for reuse.
Further, in the recycling step, the heating temperature of the semi-8-shaped block substrate is 400-450 ℃.
The half 8-shaped ceramic grinding wheel sample forming die is the same as the half 8-shaped matrix in shape. In the step of firing the semi-8-shaped ceramic grinding wheel sample, the sintering temperature is 900-1000 ℃.
The method for detecting the bonding strength of the ceramic grinding wheel matrix further comprises a cleaning treatment step, wherein the cleaning treatment step is positioned before the step of forming the 8-shaped block sample, and the cleaning treatment specifically comprises the following steps: and cleaning the interface surfaces of the semi-8-shaped matrix and the semi-8-shaped ceramic grinding wheel sample by using alcohol.
In the step of forming the 8-shaped block sample, after bonding, the sample is naturally cured and then is heated and cured. The natural curing time is 6-12 hours, the heating curing temperature is 80-150 ℃, and the heating curing time is 4-6 hours.
The method for detecting the bonding strength of the matrix of the ceramic grinding wheel is the same as the method for detecting the tensile strength of the ceramic grinding wheel, and the calculation can be carried out by referring to the maximum stress theory of the strength of the grinding wheel, so that the optimization is carried out, and the bonding effect is ensured;
the method for detecting the bonding strength of the ceramic grinding wheel matrix is close to the actual bonding process of the ceramic grinding wheel matrix, and has more accurate detection result and higher reference value;
according to the method for detecting the bonding strength of the ceramic grinding wheel matrix, the adhesive of the semi-8-shaped matrix is removed through heating, and the matrix can be recycled.
The method for detecting the bonding strength of the ceramic grinding wheel matrix has the advantages that the repeatability of the detection result is good under the same condition, the influence of human factors can be better avoided, and the bonding strength of the ceramic grinding wheel matrix can be accurately represented.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, variations and modifications can be made without departing from the spirit of the invention, and equivalent modifications and changes can be made to the above embodiments according to the essential technology of the invention, and these are all within the scope of the invention.
Claims (10)
1. The method for detecting the bonding strength of the ceramic grinding wheel matrix is characterized by comprising the following steps of:
designing a grinding tool and a matrix: designing and processing a half 8-shaped ceramic grinding wheel sample forming die and a half 8-shaped matrix;
firing a semi-8-shaped ceramic grinding wheel sample: mixing materials according to a grinding wheel formula, adopting the semi-8-shaped ceramic grinding wheel sample forming die to perform press forming on the mixed materials, and then performing drying and sintering to form a semi-8-shaped ceramic grinding wheel sample;
processing a half-8-block matrix: according to the treatment process of the bonding surface of the ceramic grinding wheel matrix, carrying out slotting processing treatment on the interface surface of the semi-8-shaped matrix;
processing a semi-8-shaped ceramic grinding wheel sample: carrying out interface surface polishing treatment on the semi-8-shaped ceramic grinding wheel sample;
forming 8-block samples: bonding and curing the semi-8-shaped ceramic grinding wheel sample and the semi-8-shaped matrix by using a prepared adhesive to form an 8-shaped sample;
and (3) detecting the tensile strength: detecting the tensile strength of the 8-shaped block sample by using an electronic tensile machine;
adjusting the formula and the process: and adjusting the formula and the curing process of the adhesive according to the detection result.
2. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 1, characterized in that: the half 8-shaped block matrix is made of any one of aluminum alloy or steel.
3. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 1, characterized in that: in the step of firing the semi-8-shaped ceramic grinding wheel sample: when the grinding wheel is a ceramic bond CBN grinding wheel or a diamond grinding wheel, WA or SG abrasive grains in the same grain size range are used for replacing materials.
4. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 1, characterized in that: the method further comprises a recycling step, wherein the recycling step is positioned after the tensile strength detection step, and the recycling step specifically comprises the following steps: and heating the semi-8-shaped block matrix, removing the adhesive on the surface, and cleaning for reuse.
5. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 4, characterized in that: in the recycling step, the heating temperature of the semi-8-shaped block matrix is 400-450 ℃.
6. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 1, characterized in that: and the shape of the half 8-shaped block ceramic grinding wheel sample forming die is the same as that of the half 8-shaped block base body.
7. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 1, characterized in that: in the step of firing the semi-8-shaped ceramic grinding wheel sample, the sintering temperature is 900-1000 ℃.
8. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 1, characterized in that: the method for detecting the bonding strength of the ceramic grinding wheel matrix further comprises a cleaning treatment step, wherein the cleaning treatment step is positioned before the step of forming the 8-shaped block sample, and the cleaning treatment specifically comprises the following steps: and cleaning the interface surfaces of the semi-8-shaped block matrix and the semi-8-shaped block ceramic grinding wheel sample by using alcohol.
9. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 1, characterized in that: in the step of forming the 8-shaped block sample, after bonding, the sample is naturally cured and then is heated and cured.
10. The method for detecting the bonding strength of a vitrified grinding wheel base body according to claim 9, characterized in that:
the natural curing time is 6-12 hours, the heating curing temperature is 80-150 ℃, and the heating curing time is 4-6 hours.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210178145.5A CN114523430A (en) | 2022-02-24 | 2022-02-24 | Method for detecting bonding strength of ceramic grinding wheel matrix |
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| CN202210178145.5A CN114523430A (en) | 2022-02-24 | 2022-02-24 | Method for detecting bonding strength of ceramic grinding wheel matrix |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4634453A (en) * | 1985-05-20 | 1987-01-06 | Norton Company | Ceramic bonded grinding wheel |
| DE4300417A1 (en) * | 1993-01-09 | 1994-08-11 | Finzler Schrock & Kimmel Spezi | Basic structure for abrasive wheels for rotating or oscillating grinding tools. |
| US20030041525A1 (en) * | 2001-08-31 | 2003-03-06 | Sherwood Walter J. | Ceramic bonded abrasive |
| CN201464348U (en) * | 2009-05-22 | 2010-05-12 | 昆明理工大学 | Adhesive force testing device for casting binder of molding sand |
| CN102519789A (en) * | 2011-12-31 | 2012-06-27 | 华南理工大学 | Mortar surface layer and base body tensile bonding intensity detecting clamp and detecting method |
| CN105904287A (en) * | 2016-07-01 | 2016-08-31 | 东北大学 | Method for machining narrow groove system impeller, grinding head and preparation method of grinding head |
| CN106891272A (en) * | 2017-02-23 | 2017-06-27 | 东北大学 | A kind of vitrified bond high-performance CBN emery wheels based on strong electromagnetic and preparation method thereof |
| CN109048696A (en) * | 2018-08-23 | 2018-12-21 | 沈阳中科超硬磨具磨削研究所 | A kind of Technique of Vitrified Diamond Wheels |
| CN112847168A (en) * | 2021-01-28 | 2021-05-28 | 临颍德卡特新材料有限公司 | Manufacturing method for increasing bonding strength of ultra-thin ceramic bond grinding rotor groove CBN grinding wheel |
-
2022
- 2022-02-24 CN CN202210178145.5A patent/CN114523430A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4634453A (en) * | 1985-05-20 | 1987-01-06 | Norton Company | Ceramic bonded grinding wheel |
| DE4300417A1 (en) * | 1993-01-09 | 1994-08-11 | Finzler Schrock & Kimmel Spezi | Basic structure for abrasive wheels for rotating or oscillating grinding tools. |
| US20030041525A1 (en) * | 2001-08-31 | 2003-03-06 | Sherwood Walter J. | Ceramic bonded abrasive |
| CN201464348U (en) * | 2009-05-22 | 2010-05-12 | 昆明理工大学 | Adhesive force testing device for casting binder of molding sand |
| CN102519789A (en) * | 2011-12-31 | 2012-06-27 | 华南理工大学 | Mortar surface layer and base body tensile bonding intensity detecting clamp and detecting method |
| CN105904287A (en) * | 2016-07-01 | 2016-08-31 | 东北大学 | Method for machining narrow groove system impeller, grinding head and preparation method of grinding head |
| CN106891272A (en) * | 2017-02-23 | 2017-06-27 | 东北大学 | A kind of vitrified bond high-performance CBN emery wheels based on strong electromagnetic and preparation method thereof |
| CN109048696A (en) * | 2018-08-23 | 2018-12-21 | 沈阳中科超硬磨具磨削研究所 | A kind of Technique of Vitrified Diamond Wheels |
| CN112847168A (en) * | 2021-01-28 | 2021-05-28 | 临颍德卡特新材料有限公司 | Manufacturing method for increasing bonding strength of ultra-thin ceramic bond grinding rotor groove CBN grinding wheel |
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Application publication date: 20220524 |