CN114518526A - Automatic testing machine control system suitable for PCB board ICT - Google Patents
Automatic testing machine control system suitable for PCB board ICT Download PDFInfo
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- CN114518526A CN114518526A CN202210132075.XA CN202210132075A CN114518526A CN 114518526 A CN114518526 A CN 114518526A CN 202210132075 A CN202210132075 A CN 202210132075A CN 114518526 A CN114518526 A CN 114518526A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
Abstract
The invention provides an ICT automatic testing machine control system suitable for a PCB, which comprises: an image acquisition module: the system is used for positioning the PCB, performing all-dimensional surrounding image acquisition on the PCB, acquiring an image of the PCB, and testing an ICT module: the device is used for automatically identifying the PCB image, performing region segmentation according to the device, determining the partition of the device, performing automatic comparison and difference calculation with the partition image of the standard device, generating a partition automatic test result, and the test result feedback module: the invention is used for receiving the automatic test results of the subareas, summarizing the automatic test results of all the subareas, and generating a total result for feedback.
Description
Technical Field
The invention relates to the technical field of automatic testers, in particular to an ICT automatic tester control system suitable for a PCB
Background
At present, the manufacturing industry of electronic information products in China is huge, microelectronic products are rapidly developed along with the rise of the electronic manufacturing industry, production test equipment of the microelectronic products is gradually matured, PCB detection is one of important detections of the microelectronic products, and factories can adopt different detection methods and devices according to different PCB boards.
Common detection methods as mentioned in the paper Gil, I, Femadez-Garcia, R.Electromagetic interference reduction in printed circuit boards by using metals a reduction and a radial image analysis [ J ]. journal of Electromagetic Waves and Applications 2014, Pages 378-: (1) the manual detection method is characterized in that whether a PCB is qualified or not is detected by a worker through a microscope, and whether equipment calibration is needed or not is detected by the worker, however, the detection method is high in labor cost and subjectivity of the worker; (2) the automatic optical detection adopts an optical theory, combines the technologies of images, computers and the like, finds out the produced defective elements, and the detection method is used before the electrical test, thereby saving the cost and having poor short circuit identification effect; (3) the automatic online test is a necessary detection flow in the manufacturing process of the PCB, but the automatic online test is limited by the model and specification of the product and cannot test the products of different models, so that in the process of detecting the PCB, the partition test is carried out by identifying different components on the PCB so as to test the PCB of different types, which is a direction that people need to research.
Disclosure of Invention
The invention provides an automatic tester control system suitable for an ICT (information communication technology) of a PCB (printed circuit board), which is used for solving the problem that when the PCB is detected, the testing of various types of PCBs can be carried out
An automatic test machine control system suitable for a PCB (printed circuit board) ICT (information communication technology), comprising:
an image acquisition module: the system is used for positioning the PCB, carrying out all-around image acquisition on the PCB and acquiring an image of the PCB;
ICT test module: the device is used for automatically identifying the PCB image, performing region segmentation according to the device, determining the device partition, and performing automatic comparison and difference calculation with the standard device partition image to generate a partition automatic test result;
a test result feedback module: and the automatic test system is used for receiving the automatic test results of the partitions, summarizing the automatic test results of all the partitions, and generating a total result for feedback.
As an embodiment of the invention: the image acquisition module comprises:
PCB board positioning unit: the infrared coordinate system is established on the PCB placing table, the PCB is positioned, and the vertex coordinates of the PCB are input;
PCB board fixed cell: the camera holder is used for fixing the edge of the PCB through the gripper and moving the camera holder to carry out moving shooting;
PCB board image acquisition unit: the PCB image acquisition system is used for acquiring images at intervals of equal interval time and storing the PCB images to a PCB gallery.
As an embodiment of the present invention: the ICT test module comprises:
an ICT identification unit: the ICT parameter acquisition module is used for scanning the image of the PCB and determining the ICT parameter of the PCB; wherein, the ICT parameters comprise: the outline size, the positions of components, circuit wiring and fusion welding points of the PCB;
ICT partition unit: the device comprises a front side and a side surface of a PCB, a plurality of image processing modules and a plurality of image processing modules, wherein the front side and the side surface of the PCB are subjected to rectangular division by taking the position of a component as a center, the partition of the component is confirmed, the partition of the component is combined, whether the combined image is complete or not is detected, if the image is complete, the partition automatic test is carried out, and if not, the partition of the area is carried out again;
and the partition testing unit is used for summarizing all component partition images on the front side and the side surface of the PCB, constructing a three-dimensional image of the component partition, performing primary automatic detection and accurate automatic detection on the three-dimensional image and a standard component partition image, performing automatic fusion welding point comparison on the back surface of the PCB, and grading comparison results.
As an embodiment of the invention: the preliminary automatic detection includes:
standard image subunit: the device comprises a storage unit, a processing unit and a processing unit, wherein the storage unit is used for storing a standard component partition image of a PCB and a reverse sample image of the PCB;
the component primary detection subunit: the device parameter determination module is used for determining device parameters by comparing the device parameters with the standard device partition images to generate partition device test results; wherein, the components and parts parameter includes: component model, component label, component shape, and component surface;
the circuit preliminary detection subunit: the device is used for detecting whether wiring of the partitioned circuit is correct or not by comparing with the partitioned image of the standard component, and generating a test result of the partitioned circuit;
a welding spot preliminary detection subunit: and the method is used for detecting whether the reverse welding spot of the PCB is correctly welded or not by comparing the reverse image of the standard component, and generating a welding spot test result.
As an embodiment of the present invention: the accurate automatic detection comprises:
accurate detection subunit of components and parts: the device testing system is used for classifying the components in the test result list of the partitioned components, determining the defect types of the partitioned components, generating test results of the partitioned components, marking the defect positions and generating a defect image; wherein the component defect types include: wrong model of the component, wrong label of the component, damaged shape of the component and smudged surface of the component;
the circuit accurately detects the secondary unit: the test system is used for analyzing the test result of the partitioned circuit, determining the defect type of the partitioned circuit, generating the test result of the partitioned circuit, marking the defect position and generating a defect image; wherein the circuit defect types include: short circuit and open circuit;
accurate detection subunit of solder joint: receiving the fusion welding point test result, and when welding is correct, grading the welding process according to the sample image to generate a fusion welding grade result;
and when the fusion welding point has defects, analyzing the type and the reason of the welding defects, marking the defects at the image defects, and generating a subarea welding test result.
As an embodiment of the present invention: the test result feedback module comprises:
a test result summarizing unit: the test system is used for receiving the test results of the partitioned components, the test results of the partitioned circuits and the test results of the partitioned welding, summarizing the test results of all the partitions of the PCB, generating the automatic test results of the PCB, summarizing the defect images and generating the defect image set.
As an embodiment of the present invention: the image acquisition module further comprises image processing:
target extraction subunit: the ICT object is used for extracting the ICT object of the acquired image, deleting the non-ICT object of the acquired image and generating the ICT image;
image color processing subunit: the color adjusting module is used for adjusting the color of the purified image by changing the color weight of the image;
image gray scale adjustment subunit: and acquiring a gray value of the acquired image, performing difference with the gray value of the standard image to acquire a difference value, and performing gray adjustment on the acquired image when the difference value exceeds a threshold value.
As an embodiment of the present invention: the precise detection subunit of the welding spot comprises:
welding defect judging subunit: the defect type is determined by comparing the reverse image of the PCB with the defect image; wherein the defect types include: cold welding, cold welding and tip drawing;
a defective welding picture processing subunit: and the method is used for carrying out pixel marking on the defective welding photo to generate a defective welding photo.
As an embodiment of the present invention: the automatic control machine further comprises:
a shooting brightness control unit: the light-compensating device is used for monitoring the field light brightness in real time through the light sensor, presetting the minimum light brightness value, and when the field light brightness is lower than the preset minimum light brightness value, automatically starting the field shooting lamp to shoot the light supplement.
As an embodiment of the present invention: the automatic testing step comprises:
the method comprises the following steps: acquiring a PCB image, and performing region segmentation on the PCB image to generate component partitions;
step two: automatically testing components and circuits on the front and side surfaces of the component partitions, detecting welding spots on the back surfaces of the component partitions, and generating corresponding test results and defect images;
step three: and summarizing the test results of all the subareas to generate a total test result and a defect image set of the whole PCB.
The invention has the beneficial effects that: the automatic tester control system automatically tests the PCB by acquiring the image of the PCB, continuously transmits the image of the PCB for one circle by using a rotary hand when the image of the PCB is acquired, continuously shoots the image of the PCB in the process, ensures that all-dimensional images of the PCB are acquired, constructs a three-dimensional image of the PCB, prevents a single image from generating a visual error, and can accurately observe the original shape of the PCB by shooting a plurality of groups.
The method and the device perform image segmentation, decompose the complete PCB, automatically test the ICT of each partition, finally collect the automatic test result of each partition, generate the final automatic test result of the PCB, partition the PCB, break through the constraint of the type and specification of the PCB, and test various types of PCBs as long as the standard diagram of the partition exists in the system.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
In the drawings:
FIG. 1 is a schematic diagram of a control system of an automatic test machine suitable for a PCB ICT according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an image acquisition module of an automatic tester control system suitable for a PCB ICT according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an automatic testing procedure of an automatic testing machine control system suitable for a PCB panel ICT in an embodiment of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example 1
The embodiment of the invention provides an automatic tester control system suitable for a PCB ICT, which comprises the following components as shown in figure 1:
an image acquisition module: the system is used for positioning the PCB, carrying out all-around image acquisition on the PCB and acquiring an image of the PCB;
ICT test module: the device is used for automatically identifying the PCB image, performing region segmentation according to the device, determining the device partition, and performing automatic comparison and difference calculation with the standard device partition image to generate a partition automatic test result;
a test result feedback module: and the automatic test system is used for receiving the automatic test results of the partitions, summarizing the automatic test results of all the partitions, and generating a total result for feedback.
The working principle of the technical scheme is as follows:
in the prior art, when the PCB is shot by the PCB automatic detector, the multi-camera technology is adopted for shooting so as to achieve the purpose of overall shooting, but the multi-camera shooting cost is high, when the ICT test of the PCB is carried out, the image recognition technology is adopted for carrying out dislocation search on the PCB or a visual system is established by a computer for carrying out displacement detection on the whole PCB, but the method can only carry out comparison test on the PCB storing a standard sample in the system, once the position or the model of a certain component of the PCB is changed, the PCB cannot be effectively tested, the invention obtains the overall image of the PCB by continuously shooting the PCB by rotating the PCB, carries out ICT extraction and color adjustment on the overall image of the PCB, carries out image segmentation on the image by taking a main component as a unit, and carries out segmentation calculation on the standard PCB according to the principle of image segmentation, and calculating the most reasonable segmentation method, segmenting, performing automatic comparison test on the component partitions, automatically testing all the partitions at the same time, finding out the PCB defect types according to picture comparison, performing reason analysis and summarizing automatic test results.
The beneficial effects of the above technical scheme are: according to the invention, the PCB is rotated to take a picture comprehensively, so that the detection cost is saved, more comprehensive pictures than those taken by a plurality of cameras can be obtained, the factor that ICT cannot acquire the whole picture due to taking one picture is reduced, and the front side and the side surface of the PCB are reasonably divided. The PCB is automatically tested in a partitioning mode, and all partitions can be automatically tested simultaneously, so that the detection efficiency is improved, and the test time is saved.
Example 2
As an embodiment of the present invention: as shown in fig. 2, the image acquisition module includes:
PCB board positioning unit: the infrared coordinate system is established on the PCB placing table, the PCB is positioned, and the vertex coordinates of the PCB are input;
PCB board fixed cell: the camera holder is used for fixing the edge of the PCB through the gripper and moving the camera holder to carry out moving shooting;
PCB board image acquisition unit: the PCB image acquisition system is used for acquiring images at intervals of equal interval time and storing the PCB images to a PCB gallery.
The working principle of the technical scheme is as follows:
in the prior art of the invention, the PCB is fixed by installing the PCB magnetic adsorption device on the placing table of the PCB, the PCB placing table is inclined and rotated to shoot and obtain the PCB image, but the specifications of the PCBs are inconsistent, some PCBs are lighter and can be tightly adsorbed by magnetic force without shaking and displacement, some PCBs are heavier, the position of the placing table may be moved when the placing table is tilted and rotated, which may cause a situation that the picture photographing is blurred or the PCB board cannot be photographed, the present invention recognizes the PCB board through the PCB board recognition device, an infrared coordinate system is established on the PCB placing table, the edge of the PCB is fixed through a gripper, and a camera pan-tilt is moved to carry out moving shooting, in the process, the edge distance is calculated by acquiring the coordinates of four vertexes of the PCB, and all images of the PCB are stored in a PCB gallery.
The beneficial effects of the above technical scheme are: according to the invention, the vertex coordinates of the PCB are obtained through the infrared coordinate system of the placing table, the edge of the PCB is fixed through the gripper, the camera holder is moved to shoot the PCB in a moving way, a plurality of cameras are not required to be placed to shoot pictures, and the omnibearing pictures of the PCB can be obtained only by setting the motion track of the camera holder.
Example 3
As an embodiment of the present invention: the ICT test module comprises:
an ICT identification unit: the ICT parameter acquisition module is used for scanning the image of the PCB and determining the ICT parameter of the PCB; wherein, the ICT parameters comprise: the outline size, the positions of components, the circuit wiring and the position of a fusion welding point of the PCB;
ICT partition unit: the device comprises a front side and a side surface of a PCB, a plurality of image processing modules and a plurality of image processing modules, wherein the front side and the side surface of the PCB are subjected to rectangular division by taking the position of a component as a center, the partition of the component is confirmed, the partition of the component is combined, whether the combined image is complete or not is detected, if the image is complete, the partition automatic test is carried out, and if not, the partition of the area is carried out again;
and the partition testing unit is used for summarizing all component partition images on the front side and the side surface of the PCB, constructing a three-dimensional image of the component partition, performing primary automatic detection and accurate automatic detection on the three-dimensional image and a standard component partition image, performing automatic fusion welding point comparison on the back surface of the PCB, and grading comparison results.
The working principle of the technical scheme is as follows:
in the prior art, an image of a PCB is scanned, a standard PCB of a sample library is called, main components and circuit structures of the PCB are compared one by one, if the image is consistent with the sample, the test is qualified, if the image is inconsistent with the sample, the PCB needs to be further processed, in the invention, all ICT information of the PCB is obtained by scanning the image of the PCB, the components are partitioned on the front side and the side of the PCB according to a system partitioning algorithm, the components are partitioned and combined firstly, the original image of the PCB can be generated after the combination is detected by a system, then the components are automatically tested in a partitioning mode, all partitioned images of components of the PCB are collected after the components are confirmed, and a three-dimensional image of the components is constructed through an image synthesis technology.
The beneficial effects of the above technical scheme are: according to the method, the ICT information of the PCB is acquired by scanning the images of the PCB, the PCB is partitioned and divided by a partition algorithm to acquire the front and side component partitions of each PCB, the front and side component partitions and the standard component partition images are subjected to preliminary automatic detection and accurate automatic detection, all partitions are synchronously subjected to automatic test, all the images of the component partitions of the PCB are collected, the three-dimensional images of the component partitions are constructed by an image synthesis technology, and multi-angle picture marking can be clearly and clearly performed during subsequent defect marking.
Example 4
As an embodiment of the present invention: the preliminary automatic detection includes:
standard image subunit: the device comprises a storage unit, a processing unit and a processing unit, wherein the storage unit is used for storing a standard component partition image of a PCB and a reverse sample image of the PCB;
the component primary detection subunit: the device parameter determination module is used for determining device parameters by comparing the device parameters with the standard device partition images to generate partition device test results; wherein, the components and parts parameter includes: component model, component label, component shape, and component surface;
circuit preliminary detection subunit: the device is used for detecting whether wiring of the partitioned circuit is correct or not by comparing with the partitioned image of the standard component, and generating a test result of the partitioned circuit;
a welding spot preliminary detection subunit: and the method is used for detecting whether the reverse welding spot of the PCB is correctly welded or not by comparing the reverse image of the standard component, and generating a welding spot test result.
The working principle of the technical scheme is as follows:
in the prior art, a standard PCB is shot to obtain a standard image of the PCB, the standard image is uploaded to a sample library, the PCB to be tested is placed on a test platform for feature extraction, and then is compared with a sample with the same specification in the sample library to test whether the PCB to be tested is qualified or not, the invention carries out item classification test on a component partition, firstly carries out preliminary automatic detection, compares the type, label, shape and surface of the component by comparing with the partition image of the standard component, detects whether the label is wrongly pasted, the geometric shape is defective or not, the surface of the component is defective or not, carries out circuit detection by comparing with the partition image of the standard component, generates a partition circuit test result when the partition circuit test result is inconsistent with the standard image, enters accurate automatic detection, the reverse side of the PCB does not need to be partitioned, and is directly compared with the sample image of the PCB, and when the welding points on the reverse side of the PCB are correct, grading the welding points, and if the welding points are wrong, generating a welding point test result and carrying out accurate automatic detection.
The beneficial effects of the above technical scheme are: the automatic testing is divided into two steps, firstly, the preliminary automatic detection is carried out on all the component partitions, the two categories of qualified testing and unqualified testing are carried out on all the component partitions through the preliminary automatic detection, the unqualified component partitions and the reverse side image of the PCB are screened out, and further defect classification is carried out.
Example 5
As an embodiment of the present invention: the accurate automatic detection comprises:
accurate detection subunit of components and parts: the device is used for classifying the components in the test result list of the partitioned components, determining the defect types of the partitioned components, generating test results of the partitioned components, marking the defect positions and generating defect images; wherein the component defect types include: wrong model of the component, wrong label of the component, damaged shape of the component and smudged surface of the component;
the circuit accurately detects the secondary unit: the test system is used for analyzing the test result of the partitioned circuit, determining the defect type of the partitioned circuit, generating the test result of the partitioned circuit, marking the defect position and generating a defect image; wherein the circuit defect types include: short circuit and open circuit;
accurate detection subunit of solder joint: receiving the fusion welding point test result, and when the welding is correct, grading the welding process according to the sample image to generate a fusion welding grade result;
and when the fusion welding point has defects, analyzing the type and the reason of the welding defects, marking the defects at the image defects, and generating a subarea welding test result.
The working principle of the technical scheme is as follows:
in the prior art, through carrying out integral contrast test on a PCB, when one part is detected to be inconsistent with a standard component sample, the detection is stopped, and a system report is carried out, but the detection efficiency is not high, and more than one problem of the PCB is possible, but as long as one problem is detected, the detection is stopped by a tester.
The beneficial effects of the above technical scheme are: the accurate automatic detection of the invention carries out further defect analysis on the defective component partitions and the reverse pictures of the PCB, searches the causes of the defects and marks the pictures, thereby being beneficial to conveniently finding the positions of the defects when the subsequent PCB is corrected and carrying out effective modification.
Example 6
As an embodiment of the present invention: the test result feedback module comprises:
a test result summarizing unit: the test system is used for receiving the test results of the partitioned components, the test results of the partitioned circuits and the test results of the partitioned welding, summarizing the test results of all the partitions of the PCB, generating the automatic test results of the PCB, summarizing the defect images and generating the defect image set.
The working principle of the technical scheme is as follows:
in the prior art, when the condition that the images of the element partitions of the PCB are inconsistent with the images of the partition partitions of the standard elements is detected, the detection is immediately stopped, and the system is informed.
The beneficial effects of the above technical scheme are: the invention can carry out integral test collection on the PCB by generating the test results of the components, the circuit and the welding spots on the back surface of the PCB, can directly find out corresponding problems and marked images by three classifications, and is troublesome to find out if all the problems are collected in one result report.
Example 7
As an embodiment of the present invention: the image acquisition module further comprises image processing:
target extraction subunit: the ICT object is used for extracting the ICT object of the acquired image, deleting the non-ICT object of the acquired image and generating a purified image;
image color processing subunit: the color adjusting module is used for adjusting the color of the purified image by changing the color weight of the image;
image gray scale adjustment subunit: and acquiring a gray value of the acquired image, performing difference with the gray value of the standard image to acquire a difference value, and performing gray adjustment on the acquired image when the difference value exceeds a threshold value.
The working principle of the technical scheme is as follows:
in the prior art, contrast color is formed by background color and colors of a PCB in image processing, the ICT extraction of the PCB is carried out through light and shade contrast, and then image pixel processing is carried out to obtain an image with the best test effect.
The beneficial effects of the above technical scheme are: according to the invention, through technical processing of the shot image, the color and the gray level of the test image are adjusted to be similar to those of the sample image, and a basis is provided for the subsequent comparison test with the sample image.
As an embodiment of the present invention:
the shot PCB image can be effectively compared with the standard image by the following steps:
the method comprises the following steps: firstly, not only ICT objects but also image backgrounds exist in shot images, and the ICT images are extracted from original images through preset pixels:
when P is greater than 0, the pixel at the position is larger than the preset pixel, and the ICT image is formed;
when P is less than 0, the pixel at the position is smaller than the preset pixel, and the image is a background image;
wherein P is the difference between the image pixel and the preset pixel, epsilon represents the pixel, x represents the position, epsilonxIndicating the pixel at the position, epsilonvRepresenting a preset pixel;
the main purpose of the above formula is to distinguish between the ICT image and the background image by presetting pixels.
Step two: and (3) carrying out color weight adjustment on the ICT image:
wherein, M is the weight Q, W, E of the ICT image after adjustment, which is the weight of red, green and blue components in the ICT image, 0.3, 0.6 and 0.2 are the weight of red, green and blue components, G (x, y) represents the coordinate of each point in the image, n represents the pixel number of the image, i represents the width of the image, and k represents the length of the image;
the main purpose of the above formula is to adjust the color weights of the ICT image to be consistent with the sample image by changing the weights of the red, green and blue components.
Step three: adjusting the gray value of the ICT image to be consistent with the sample image:
wherein (x)i，yi) Representing each coordinate in the image, J (x)i，yi) Representing the final gray value of the image, K the length of the image, H the length of the image,
the gray value of the ith pixel point on the X axis is represented,
expressing the gray value of the ith pixel point on the Y axis, and expressing the gray difference value of the measured image and the sample image by delta T;
the main purpose of the above formula is to adjust the gray value of the ICT image by the gray difference value, so that the gray value of the ICT image is consistent with the sample image.
The working principle and the beneficial effects of the technical scheme are as follows: in the whole calculation process, firstly, images ICT and backgrounds are distinguished through preset pixel values, ICT images are extracted, color weights and gray values of the ICT images are adjusted through a system algorithm to enable the color weights and the gray values of the ICT images to be consistent with those of sample images, and the algorithm can adjust all parameters of the images in a self-adaptive mode.
Example 8
As an embodiment of the present invention: the precise detection subunit of the welding spot comprises:
a welding defect judgment subunit: the defect type is determined by comparing the reverse image of the PCB with the defect image; wherein the defect types include: cold welding, cold tip drawing and cold tip drawing;
a defective welding picture processing subunit: and the method is used for carrying out pixel marking on the defective welding photo to generate a defective welding photo.
The working principle of the technical scheme is as follows:
in the prior art, each fusion welding point is detected through sample image comparison, and when the position of the PCB is detected to be inconsistent with the position of the sample image, the detection is stopped and the system is notified.
The beneficial effects of the above technical scheme are: the method further analyzes and compares the defect welding on the reverse side of the PCB to find out the welding defect type, and marks the defect, thereby being beneficial to searching the defect position of the PCB and improving the welding of the PCB according to the defect type.
Example 9
As an embodiment of the present invention: the automatic control machine further comprises:
a shooting brightness control unit: the light-compensating device is used for monitoring the field light brightness in real time through the light sensor, presetting the minimum light brightness value, and when the field light brightness is lower than the preset minimum light brightness value, automatically starting the field shooting lamp to shoot the light supplement.
The working principle of the technical scheme is as follows:
in the prior art, the color of the shot picture is adjusted through a light processing algorithm in the system, but the method has a limited range of over-adjustment and cannot adjust the brightness greatly, and the shot picture cannot be identified in a dim environment.
The beneficial effects of the above technical scheme are: according to the invention, the scene shooting environment is detected through the light sensor, when the scene brightness is lower than the threshold value of the light sensor, the shooting lamp is automatically turned on to supplement light for shooting, and the brightness of the image is adjusted by adjusting the brightness of the light, so that the color adjustment is carried out without setting a color adjustment algorithm in the system, and the situation that the image comparison cannot be carried out due to unqualified image shooting is effectively prevented.
As an embodiment of the present invention:
the shooting brightness control unit further comprises the following steps when the field light is detected:
the method comprises the following steps: firstly, grading the brightness of the scene shooting, and determining the brightness grade of the scene shooting:
Di＝D0(0.89*σ)
wherein i represents a count, DiRepresenting the ith field brightness value, D0Representing the brightness of the scene, and sigma representing the illumination of the scene shooting environment;
the main purpose of the above formula is to detect the illumination of the scene shooting environment through the light sensor and determine the real-time scene brightness value.
Step two: determining the brightness level:
Ir＝I[(I5<Di<I4)I4<Di<I3)I3<Di<I2)I2<Di<I1)]
wherein r represents the grade, IrDenotes the brightness level, r ∈ {1,2,3,4,5}
The primary purpose of the above formula is to determine the field brightness level based on the field brightness value.
Step three: determining whether to turn on a scene shooting lamp according to the scene brightness level:
wherein, T represents that the switch of the shooting lamp is put at high level and the shooting lamp is turned on.
The working principle and the beneficial effects of the technical scheme are as follows: and in the shooting brightness control unit, the illumination of the field shooting environment is detected by the line sensor, a real-time field brightness value is determined, the field real-time brightness value is subjected to grade comparison to generate a corresponding brightness grade, and when the brightness grade is less than 2, the shooting lamp is turned on, so that the waste of electric quantity is avoided.
Example 10
As an embodiment of the present invention: as shown in fig. 3, the automatic testing step includes:
the method comprises the following steps: acquiring a PCB image, and performing region segmentation on the PCB image to generate component partitions;
step two: automatically testing components and circuits on the front side and the side surfaces of the component partitions, detecting welding spots on the back sides of the component partitions, and generating corresponding test results and defect images;
step three: and summarizing the test results of all the subareas to generate a total test result and a defect image set of the whole PCB.
The working principle of the technical scheme is as follows:
in the prior art, a PCB image is directly scanned and acquired for detection, and is compared with a standard sample image to detect the displacement of the PCB, the detection of the PCB can be completed only by carrying out a large number of repeated tests, the images of the PCB are acquired, the images of the PCB are partitioned, the partitioned images are gathered, a three-dimensional image of a component partition is constructed by an image synthesis technology, defect marking can be carried out on the three-dimensional image, a comprehensive test result of the PCB is determined by carrying out preliminary automatic detection and accurate automatic detection on the images, and final result feedback is carried out.
The beneficial effects of the above technical scheme are: according to the invention, through automatic detection of the subareas, the whole PCB can be tested in a short time, the defect types are summarized in the final result feedback, and the defect marking is also carried out on the three-dimensional subarea image, so that the time is saved for the workers to find the defect positions, and the working efficiency of the workers is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. The utility model provides an automatic testing machine control system suitable for PCB board ICT which characterized in that includes:
an image acquisition module: the system is used for positioning the PCB, carrying out all-around image acquisition on the PCB and acquiring an image of the PCB;
ICT test module: the device is used for automatically identifying the PCB image, performing region segmentation according to the device, determining the partition of the device, and performing automatic comparison and difference calculation with the partition image of the standard device to generate a partition automatic test result;
a test result feedback module: and the automatic test system is used for receiving the automatic test results of the partitions, summarizing the automatic test results of all the partitions, and generating a total result for feedback.
2. The system of claim 1, wherein the image capturing module comprises:
PCB board positioning unit: the infrared coordinate system is established on the PCB placing table, the PCB is positioned, and the vertex coordinates of the PCB are input;
PCB board fixed cell: the camera holder is used for fixing the edge of the PCB through the gripper and moving the camera holder to carry out moving shooting;
PCB board image acquisition unit: the PCB image acquisition system is used for acquiring images at intervals of equal interval time and storing the PCB images to a PCB gallery.
3. The ICT control system of claim 1, wherein the ICT test module comprises:
an ICT identification unit: the ICT parameter acquisition module is used for scanning the image of the PCB and determining the ICT parameter of the PCB; wherein, the ICT parameters comprise: the outline size, the positions of components, the circuit wiring and the position of a fusion welding point of the PCB;
ICT partition unit: the device comprises a front side and a side surface of a PCB, a plurality of image processing modules and a plurality of image processing modules, wherein the front side and the side surface of the PCB are subjected to rectangular division by taking the position of a component as a center, the partition of the component is confirmed, the partition of the component is combined, whether the combined image is complete or not is detected, if the image is complete, the partition automatic test is carried out, and if not, the partition of the area is carried out again;
and the partition testing unit is used for summarizing all component partition images on the front side and the side surface of the PCB, constructing a three-dimensional image of the component partition, performing primary automatic detection and accurate automatic detection on the three-dimensional image and a standard component partition image, performing automatic fusion welding point comparison on the back surface of the PCB, and grading comparison results.
4. The control system of claim 3, wherein the preliminary automatic detection comprises:
standard image subunit: the device comprises a storage unit, a processing unit and a processing unit, wherein the storage unit is used for storing a standard component partition image of a PCB and a reverse sample image of the PCB;
the component primary detection subunit: the device parameter determination module is used for determining device parameters by comparing the device parameters with the standard device partition images to generate partition device test results; wherein, the components and parts parameter includes: component model, component label, component shape, and component surface;
circuit preliminary detection subunit: the device is used for detecting whether wiring of the partitioned circuit is correct or not by comparing with the partitioned image of the standard component, and generating a test result of the partitioned circuit;
a welding spot preliminary detection subunit: and the method is used for detecting whether the reverse welding spot of the PCB is correctly welded or not by comparing the reverse image of the standard component, and generating a welding spot test result.
5. The automatic test machine control system for the ICT of PCB boards according to claim 3, wherein the precise automatic detection comprises:
accurate detection subunit of components and parts: the device is used for classifying the components in the test result list of the partitioned components, determining the defect types of the partitioned components, generating test results of the partitioned components, marking the defect positions and generating defect images; wherein the component defect types include: wrong model of the component, wrong label of the component, damaged shape of the component and smudged surface of the component;
the circuit accurately detects the secondary unit: the test system is used for analyzing the test result of the partitioned circuit, determining the defect type of the partitioned circuit, generating the test result of the partitioned circuit, marking the defect position and generating a defect image; wherein the circuit defect types include: short circuit and open circuit;
accurate detection subunit of solder joint: receiving the fusion welding point test result, and when the welding is correct, grading the welding process according to the sample image to generate a fusion welding grade result;
and when the fusion welding point has defects, analyzing the type and the reason of the welding defects, marking the defects at the image defects, and generating a subarea welding test result.
6. The system of claim 1, wherein the test result feedback module comprises:
a test result summarizing unit: the test system is used for receiving the test results of the partitioned components, the test results of the partitioned circuits and the test results of the partitioned welding, summarizing the test results of all the partitions of the PCB, generating the automatic test results of the PCB, summarizing the defect images and generating the defect image set.
7. The system of claim 1, wherein the image capturing module further comprises an image processing module for:
target extraction subunit: the ICT object is used for extracting the ICT object of the acquired image, deleting the non-ICT object of the acquired image and generating the ICT image;
image color processing subunit: the color adjusting module is used for adjusting the color of the purified image by changing the color weight of the image;
image gray scale adjustment subunit: and acquiring a gray value of the acquired image, performing difference with the gray value of the standard image to acquire a difference value, and performing gray adjustment on the acquired image when the difference value exceeds a threshold value.
8. The automatic test machine control system for PCB ICT of claim 5, wherein the precise detection subunit of the solder joint comprises:
a welding defect judgment subunit: the defect type is determined by comparing the reverse image of the PCB with the defect image; wherein the defect types include: cold welding, cold tip drawing and cold tip drawing;
a defective welding picture processing subunit: and the method is used for carrying out pixel marking on the defective welding photo to generate a defective welding photo.
9. The system as claimed in claim 1, wherein the automatic controller further comprises:
a shooting brightness control unit: the light-compensating device is used for monitoring the field light brightness in real time through the light sensor, presetting the minimum light brightness value, and when the field light brightness is lower than the preset minimum light brightness value, automatically starting the field shooting lamp to shoot the light supplement.
10. The control system of claim 1, wherein the automatic testing step comprises:
the method comprises the following steps: acquiring a PCB image, and performing region segmentation on the PCB image to generate component partitions;
step two: automatically testing components and circuits on the front side and the side surfaces of the component partitions, detecting welding spots on the back sides of the component partitions, and generating corresponding test results and defect images;
step three: and summarizing the test results of all the subareas to generate a total test result and a defect image set of the whole PCB.
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| CN202210132075.XA CN114518526A (en) | 2022-02-14 | 2022-02-14 | Automatic testing machine control system suitable for PCB board ICT |
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| CN202210132075.XA CN114518526A (en) | 2022-02-14 | 2022-02-14 | Automatic testing machine control system suitable for PCB board ICT |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115372793A (en) * | 2022-08-09 | 2022-11-22 | 铜陵威博电子科技有限公司 | Circuit detection method for integrated circuit |
| CN117151556A (en) * | 2023-11-01 | 2023-12-01 | 南方电网科学研究院有限责任公司 | Hardware comparison method and device for power equipment |
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2022
- 2022-02-14 CN CN202210132075.XA patent/CN114518526A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115372793A (en) * | 2022-08-09 | 2022-11-22 | 铜陵威博电子科技有限公司 | Circuit detection method for integrated circuit |
| CN117151556A (en) * | 2023-11-01 | 2023-12-01 | 南方电网科学研究院有限责任公司 | Hardware comparison method and device for power equipment |
| CN117151556B (en) * | 2023-11-01 | 2024-01-30 | 南方电网科学研究院有限责任公司 | Hardware comparison method and device for power equipment |
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