CN114517017B - Heat-conductive silicone grease composition - Google Patents
Heat-conductive silicone grease composition Download PDFInfo
- Publication number
- CN114517017B CN114517017B CN202210168621.5A CN202210168621A CN114517017B CN 114517017 B CN114517017 B CN 114517017B CN 202210168621 A CN202210168621 A CN 202210168621A CN 114517017 B CN114517017 B CN 114517017B
- Authority
- CN
- China
- Prior art keywords
- heat
- parts
- silicone grease
- grease composition
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2272—Ferric oxide (Fe2O3)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a heat-conducting silicone grease composition which comprises the following raw materials in parts by weight: 80-120 parts of vinyl-containing high molecular weight polysiloxane; 1-10 parts of a surface treating agent; 800-2400 parts of heat-conducting filler; 0.5-20 parts of a hydrogen-containing crosslinking agent; 0.2-5 parts of polymerization-inhibiting capsules; 1-10 parts of a heat-resistant additive; 0.01-2 parts of a retarder; and 0.01-5 parts of platinum catalyst. According to the heat-conducting silicone grease composition, the polymerization-inhibiting capsules are added and matched with other raw materials, so that the heat-conducting silicone grease composition has the advantages of long-term high-temperature aging resistance and the like, the hardness and the surface viscosity are basically unchanged or slightly changed under the long-term high-temperature aging condition, the elongation change is small and is kept to be more than 100%, and the problems of large colloid hardness, small elongation and poor surface viscosity of the conventional heat-conducting silicone grease under the long-term high-temperature aging condition are solved.
Description
Technical Field
The invention relates to the technical field of heat conduction materials, in particular to a heat conduction silicone grease composition.
Background
Along with the development of electronic technology, the integrated level of heating components and parts is higher and higher, and the chip size is also bigger and larger, and the high power chip generate heat and the deformation of whole pcb board that brings from this brings the negative influence to the planarization of interface, and the heat conduction material if can not follow the emergence and warp, will lead to heat conduction interface local cavity, layering etc..
As the silicone grease for heat conduction and heat dissipation, the traditional non-crosslinked silicone grease is baked at high temperature for a long time (such as high-temperature aging at 150 ℃ for 1000H), the seepage of polysiloxane causes the drying of colloid, the hardening and cracking are difficult to avoid, the surface thermal resistance is rapidly increased, the heat transfer effect is difficult to continuously play for some high-power chips, and the occasions with large deformation and low thermal resistance cannot be met.
For the existing siloxane heat-conducting composition, the surface viscosity of the colloid is adjusted by adding the powder after surface treatment, so that the lasting wetting capacity on the heat transfer surface is achieved, and the problems of the contact thermal resistance reduction, the delamination of the colloid from the upper surface and the lower surface and the like caused by the phenomena of hardness increase, elongation reduction and surface viscosity reduction of the colloid under the long-term 150 ℃ high-temperature aging condition are not considered.
Disclosure of Invention
The invention aims to provide a heat-conducting silicone grease composition resistant to long-term high-temperature aging.
The technical scheme adopted by the invention for solving the technical problems is as follows: the heat-conducting silicone grease composition comprises the following raw materials in parts by weight:
preferably, the vinyl group-containing high molecular weight polysiloxane is a long-chain polysiloxane having two or more vinyl groups in one molecule; the kinematic viscosity of the vinyl-containing high molecular weight polysiloxane is 20 to 200000.
Preferably, the surface treatment agent is a linear polysiloxane containing at least one alkoxy group at one end and a methyl or vinyl group at the other end, and has an average molecular weight of 200 to 12000.
Preferably, the heat-conducting filler comprises at least one of aluminum oxide, aluminum powder and silver powder; the powder of the heat-conducting filler is spherical or non-spherical powder, and the particle size of the powder is 0.1-120 um.
Preferably, each molecule of the hydrogen-containing cross-linking agent at least contains two or more hydrosilation structures; the kinematic viscosity of the hydrogen-containing crosslinking agent is 1-1000.
Preferably, the hydrogen-containing cross-linking agent is hydrogen-containing silicone oil, wherein the mass percent of hydrogen is 0.05-0.5%, and the molar ratio of silicon hydrogen to silicon vinyl is 0.8-2.5.
Preferably, the polymerization-resistant capsule is capsule type powder with a core-shell structure; in the core-shell structure, the shell is paraffin, and the core is 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide; the capsule powder has a particle size of 0.05-100 um.
Preferably, the capsule type powder is prepared by the following method: melting paraffin and spraying the melted paraffin to the surface of the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide powder to form a core-shell structure in the process of stirring the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide powder at a high speed.
Preferably, the heat-resistant additive is iron oxide or cerium oxide, and the particle size of the heat-resistant additive is 0.05-100 μm.
Preferably, the retarder is one or more of 3-methyl-1-butyn-3-ol, 1-ethynyl-1-cyclohexanol, ethyl maleate and allyl maleate.
According to the heat-conducting silicone grease composition, the polymerization-inhibiting capsules are added and matched with other raw materials, so that the heat-conducting silicone grease composition has the advantages of long-term high-temperature aging resistance and the like, the hardness and the surface viscosity are basically unchanged or slightly changed under the long-term high-temperature aging condition, the elongation change is small and is kept to be more than 100%, and the problems of large colloid hardness, small elongation and poor surface viscosity of the conventional heat-conducting silicone grease under the long-term high-temperature aging condition are solved.
The heat-conducting silicone grease composition is suitable for occasions with large deformation and low thermal resistance requirements, and can continuously play a role in heat transfer for high-power chips.
Detailed Description
The heat-conducting silicone grease composition comprises the following raw materials in parts by weight:
wherein the vinyl-containing high molecular weight polysiloxane is a long-chain polysiloxane having two or more vinyl groups in one molecule; the kinematic viscosity of the vinyl-containing high molecular weight polysiloxanes is from 20 to 200000, preferably from 50 to 5000. If the kinematic viscosity of the vinyl-containing high molecular weight polysiloxane is greater than 200000, the viscosity of the entire heat-conductive silicone grease composition becomes too high to facilitate the extrusion operation; if the kinematic viscosity of the vinyl group-containing high molecular weight polysiloxane is less than 20, this may result in too many unreacted small molecules in the heat conductive silicone grease composition and in severe colloidal oil bleeding.
The surface treatment agent is a linear polysiloxane containing at least one alkoxy group at one end and a methyl or vinyl group at the other end, and has an average molecular weight of 200-12000, preferably 400-2000. If the molecular weight of the linear polysiloxane is too large, too long molecular chain will result in too many polar groups of hydroxyl groups remaining on the powder surface due to steric hindrance, and if the molecular weight is too small, the compatibility of the powder and the polysiloxane will be poor.
The heat conducting filler comprises at least one of aluminum oxide, aluminum powder and silver powder. The powder of the heat-conducting filler is spherical or non-spherical powder, and the particle size of the powder is 0.1um-120um, preferably 0.5um-30um. In the thermally conductive filler, one particle size may be present, and a plurality of particle sizes may be present. The heat-conducting filler is preferably mixed with different particle sizes so as to improve the heat conductivity coefficient and reduce the viscosity of the system.
The hydrogen-containing cross-linking agent at least contains two or more silicon-hydrogen (Si-H) structures per molecule (polysiloxane molecule); the hydrogen-containing crosslinking agent has a kinematic viscosity of 1 to 1000. Specifically, in the hydrogen-containing cross-linking agent, the polysiloxane molecule containing the silicon-hydrogen structure may be a straight chain or a branched chain, and may be a structure containing silicon and hydrogen at both ends or a structure containing silicon and hydrogen only in the middle.
The hydrocrosslinker has a kinematic viscosity of from 1 to 1000, preferably from 20 to 500. Alternatively, the hydrogen-containing cross-linking agent is hydrogen-containing silicone oil, wherein the mass percent of hydrogen is 0.05-0.5%, and the molar ratio of silicon hydrogen to silicon vinyl is 0.8-2.5, preferably 0.6-1.5.
The polymerization-inhibiting capsule is capsule type powder with a core-shell structure; in the core-shell structure, the shell is paraffin and the core is 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. The capsule powder has a particle size of 0.05um to 100um, preferably 0.5um to 50um.
The core-shell structure of the capsule powder is mainly formed by a spraying method, and specifically can be prepared by the following steps: melting paraffin and spraying the melted paraffin to the surface of the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide powder to form a core-shell structure in the process of stirring the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide powder at a high speed.
In the application process, the polymerization-inhibiting capsule is broken under the action of high temperature, the polymerization-inhibiting component wrapped in the polymerization-inhibiting capsule is diffused into the heat-conducting silicone grease composition and is coordinated with the platinum catalyst, so that platinum is inactivated, further residual silicon hydrogen groups and silicon ethylene groups in the heat-conducting silicone grease composition are prevented from further reacting, and further the effect of preventing hardening is achieved.
The heat-resistant additive is iron oxide or cerium oxide, and has a particle size of 0.05-100 μm, preferably 5-40 μm.
The retarder is one or more of 3-methyl-1-butyn-3 alcohol, 1-ethynyl-1-cyclohexanol, ethyl maleate and allyl maleate.
The platinum catalyst is a catalyst prepared by Karstedt's method, and further preferably a platinum catalyst in which the platinum content is 5000 ppm.
The heat-conducting silicone grease composition has the elongation at break of more than 100 percent and the surface viscosity (characterized by tensile force) of more than 30N.
When the heat-conducting silicone grease composition is prepared, a planetary mixer can be adopted, and a kneader or a Banbury mixer (internal mixer) can also be adopted for preparation. The preparation process is carried out in two stages of curing, wherein the first stage is a low-temperature curing stage (for example, curing at 25 ℃ for 12 hours), and the second stage is a high-temperature platinum inactivation stage (for example, baking at 150 ℃ for 1 hour).
In the heat conductive silicone grease composition of the present invention, colorants, anti-uv agents, and the like may be added as needed to increase the corresponding effects.
The present invention is further illustrated by the following specific examples.
Example 1
100g of terminal vinylpolysiloxane having a viscosity of 500cs and 3g of terminal trimethoxypolysiloxane having a viscosity of 100cs were put in a 2L kneader and stirred at normal temperature for 5 minutes, then 1000g of spherical alumina having an average particle size of 20 μm, 250g of spherical alumina having an average particle size of 5 μm and 100g of spherical alumina having an average particle size of 0.5 μm were added in portions, and 5g of iron oxide was added. Mixing for 1 hour at normal temperature, mixing for 2 hours at 150 ℃ under vacuum at high temperature, reducing the temperature to normal temperature after mixing, respectively adding 10g of hydrogen-containing silicone oil with the hydrogen mass percentage content of 0.1% and the viscosity of 100cs, adding 0.5g of polymerization-inhibiting capsules, 0.05g of 1-ethynyl-1-cyclohexanol, adding 0.1g of Karstedt method catalyst with the platinum content of 5000ppm, mixing for 30 minutes at normal temperature, discharging, vulcanizing for 12 hours at 25 ℃ on a flat vulcanizing machine to obtain a sheet with the thickness of 120mm, 120mm and 2mm, and then testing the hardness, the elongation and the surface viscosity of the sheet; after a portion of the sheet was placed in an oven at 150 ℃ and baked for 3000 hours, the hardness, elongation and surface tackiness were measured, and the results are shown in table 1 below.
Example 2
100g of terminal vinylpolysiloxane having a viscosity of 100cs and 3g of terminal trimethoxy polysiloxane having a viscosity of 100cs were put into a 2L kneader and stirred at normal temperature for 5 minutes, and then 1000g of spherical alumina having an average particle size of 20 μm, 250g of spherical alumina having an average particle size of 5 μm and 100g of spherical alumina having an average particle size of 0.5 μm were added in portions, respectively, and 5g of iron oxide was added. Mixing for 1 hour at normal temperature, performing vacuum mixing for 2 hours at high temperature of 150 ℃, reducing the temperature to normal temperature after mixing, respectively adding 12g of hydrogen-containing silicone oil with the hydrogen mass percentage content of 0.1% and the viscosity of 100cs, adding 0.8g of polymerization-inhibiting capsule, 0.05g of 1-ethynyl-1-cyclohexanol, adding 0.1g of Karstedt method catalyst with the platinum content of 5000ppm, mixing for 30 minutes at normal temperature, discharging, vulcanizing for 12 hours at 25 ℃ on a flat vulcanizing machine to obtain sheets of 120mm x 2mm, and then testing the hardness, the elongation and the surface viscosity of the sheets; after a portion of the sheet was placed in a 150 degree oven and baked for 1000 hours, the hardness, elongation and surface tack were measured and the results are shown in table 1 below.
Example 3
100g of terminal vinylpolysiloxane having a viscosity of 500cs and 3g of terminal trimethoxypolysiloxane having a viscosity of 15cs were put into a 2L kneader and stirred at normal temperature for 5 minutes, and then 1000g of spherical aluminum having an average particle size of 20 μm, 180g of spherical alumina having an average particle size of 5 μm and 150g of spherical alumina having an average particle size of 0.5 μm were added in portions, respectively, and 5g of iron oxide was added. Mixing for 1 hour at normal temperature, performing vacuum mixing for 2 hours at high temperature of 150 ℃, reducing the temperature to normal temperature after mixing, respectively adding 10g of hydrogen-containing silicone oil with the hydrogen mass percentage content of 0.1% and the viscosity of 100cs, adding 0.6g of polymerization-inhibiting capsule, 0.05g of 1-ethynyl-1-cyclohexanol, adding 0.1g of Karstedt method catalyst with the platinum content of 5000ppm, mixing for 30 minutes at normal temperature, discharging, vulcanizing for 12 hours at 25 ℃ on a flat vulcanizing machine to obtain sheets of 120mm x 2mm, and then testing the hardness, the elongation and the surface viscosity of the sheets; after a portion of the sheet was placed in an oven at 150 ℃ and baked for 3000 hours, the hardness, elongation and surface tackiness were measured, and the results are shown in table 1 below.
Comparative example 1
100g of terminal vinylpolysiloxane having a viscosity of 500cs and 3g of terminal trimethoxypolysiloxane having a viscosity of 15cs were charged into a 2L kneader and stirred at normal temperature for 5 minutes, and then 1000g of spherical aluminum having an average particle size of 20 μm, 280g of spherical aluminum having an average particle size of 5 μm and 150g of spherical aluminum having an average particle size of 0.5 μm were added in portions, respectively, and 5g of iron oxide was further added. Mixing for 1 hour at normal temperature, performing vacuum mixing for 2 hours at high temperature of 150 ℃, reducing the mixture to normal temperature after the mixture is completely mixed, respectively adding 10g of hydrogen-containing silicone oil with the hydrogen mass percentage content of 0.1% and the viscosity of 50cs and 0.05g of 1-ethynyl-1-cyclohexanol, adding 0.1g of Karstedt method catalyst with the platinum content of 5000ppm, mixing for 30 minutes at normal temperature, discharging, vulcanizing for 12 hours at 25 ℃ on a flat vulcanizing machine to obtain a sheet material with the thickness of 120mm x 2mm, and then testing the hardness, the elongation and the surface viscosity of the sheet material; after a portion of the sheet was placed in an oven at 150 ℃ and baked for 1000 hours, the hardness, elongation and surface tackiness were measured, and the results are shown in Table 1 below.
Comparative example 2
100g of terminal vinylpolysiloxane having a viscosity of 100cs and 3g of terminal trimethoxypolysiloxane having a viscosity of 100cs were put in a 2L kneader and stirred at normal temperature for 5 minutes, then 1000g of spherical alumina having an average particle size of 20 μm, 250g of spherical alumina having an average particle size of 5 μm and 100g of spherical alumina having an average particle size of 0.5 μm were added in portions, and 5g of iron oxide was added. Mixing for 1 hour at normal temperature, performing vacuum mixing for 2 hours at high temperature of 150 ℃, reducing the temperature to normal temperature after mixing, respectively adding 12g of hydrogen-containing silicone oil with the hydrogen mass percentage content of 0.1% and the viscosity of 100cs, adding 0.08g of polymerization-inhibiting capsule, 0.05g of 1-ethynyl-1-cyclohexanol, adding 0.1g of Karstedt method catalyst with the platinum content of 5000ppm, mixing for 30 minutes at normal temperature, discharging, vulcanizing for 12 hours at 25 ℃ on a flat vulcanizing machine to obtain sheets of 120mm x 2mm, and then testing the hardness, the elongation and the surface viscosity of the sheets; after a portion of the sheet was placed in an oven at 150 ℃ and baked for 3000 hours, the hardness, elongation and surface tackiness were measured, and the results are shown in table 1 below.
The results of the viscosity values measured by the Antopa rheometer in examples 1 to 3 and comparative examples 1 to 2 described above; the particle size refers to the average particle size, and is the D50 particle size measured by a laser diffraction method; the hardness is tested by a Shore OO hardness tester, and the test method is ASTM D2240; the hardness, tensile strength and elongation at break are measured by a tensile machine according to ASTM D412, the thermal conductivity is measured by a Rayleigh thermal conductivity tester according to ASTM D5470. Surface adhesion test a 1mm thick test piece of 25mm x 25mm in length and width was clamped between two aluminum grips of 25mm x 1cm in size, and the test was performed using a tensile machine, and the magnitude of the tensile force was recorded.
TABLE 1
From the results shown in Table 1, it is understood that the sheets of examples 1 to 3 of the present invention, when an appropriate amount of the polymerization inhibiting capsules were added as compared with comparative examples 1 and 2, were subjected to long-term high-temperature aging (150 ℃ C./3000H), and were substantially unchanged or minimally changed in hardness and surface tackiness and were kept at 100% or more in elongation (elongation at break). On the other hand, the sheets of comparative examples 1 and 2, after long-term high-temperature aging (150 ℃ C./3000H), had a hardness increased by about one time or more, a surface tackiness decreased (the decrease width was extremely large), and an elongation decreased significantly (much less than 100%).
In conclusion, the heat-conducting silicone grease composition has the advantages of long-term high-temperature aging resistance and the like, and solves the problems of large colloid hardness, small elongation and poor surface viscosity of the conventional heat-conducting silicone grease under long-term high-temperature aging.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The heat-conducting silicone grease composition is characterized by comprising the following raw materials in parts by weight:
80-120 parts of vinyl-containing high molecular weight polysiloxane;
1-10 parts of a surface treating agent;
800-2400 parts of heat-conducting filler;
0.5-20 parts of hydrogen-containing cross-linking agent;
0.2-5 parts of polymerization-inhibiting capsules;
1-10 parts of a heat-resistant additive;
0.01-2 parts of a retarder; and
0.01-5 parts of platinum catalyst;
the surface treating agent is linear polysiloxane with one end containing at least one alkoxy group and the other end being methyl or vinyl, and the average molecular weight of the surface treating agent is 200-12000;
the polymerization-resistant capsule is capsule type powder with a core-shell structure; in the core-shell structure, the shell is paraffin, and the core is 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide; the capsule powder has a particle size of 0.05-100 um.
2. The heat-conductive silicone grease composition according to claim 1, wherein the vinyl group-containing high molecular weight polysiloxane is a long-chain polysiloxane having two or more vinyl groups in one molecule; the kinematic viscosity of the vinyl-containing high molecular weight polysiloxane is 20 to 200000.
3. The heat conductive silicone grease composition according to claim 1, wherein the heat conductive filler comprises at least one of alumina, aluminum powder, silver powder; the powder of the heat-conducting filler is spherical or non-spherical powder, and the particle size of the powder is 0.1-120 um.
4. The heat conductive silicone grease composition according to claim 1, wherein the hydrogen-containing cross-linking agent contains at least two or more hydrosilation structures per molecule; the kinematic viscosity of the hydrogen-containing cross-linking agent is 1-1000.
5. The heat-conducting silicone grease composition according to claim 4, wherein the hydrogen-containing cross-linking agent is hydrogen-containing silicone oil, wherein the mass percent of hydrogen is 0.05-0.5%, and the molar ratio of silicon hydrogen to silicon vinyl is 0.8-2.5.
6. The heat conductive silicone grease composition according to claim 1, wherein the capsule type powder is prepared by the following method: melting paraffin and spraying the melted paraffin to the surface of the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide powder to form a core-shell structure in the process of stirring the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide powder at a high speed.
7. The heat conductive silicone grease composition according to claim 1, wherein the heat resistant additive is iron oxide or cerium oxide, and the particle size thereof is 0.05 μm to 100 μm.
8. The heat conductive silicone grease composition of claim 1, wherein the retarder is one or more of 3-methyl-1-butyn-3 ol, 1-ethynyl-1-cyclohexanol, ethyl maleate and allyl maleate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210168621.5A CN114517017B (en) | 2022-02-23 | 2022-02-23 | Heat-conductive silicone grease composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210168621.5A CN114517017B (en) | 2022-02-23 | 2022-02-23 | Heat-conductive silicone grease composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114517017A CN114517017A (en) | 2022-05-20 |
| CN114517017B true CN114517017B (en) | 2023-02-07 |
Family
ID=81598723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210168621.5A Active CN114517017B (en) | 2022-02-23 | 2022-02-23 | Heat-conductive silicone grease composition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114517017B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115558293B (en) * | 2022-10-12 | 2023-06-16 | 杭州之江有机硅化工有限公司 | Heat-conducting silicone grease composition and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013168291A1 (en) * | 2012-05-11 | 2013-11-14 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
| CN108102207A (en) * | 2018-01-12 | 2018-06-01 | 合肥工业大学 | A kind of halogen-free flameproof thin-walled oil resistant cable insulating manufactured by multiple cross-linked technique and sheath and its manufacturing method and application |
| CN110128998A (en) * | 2019-05-10 | 2019-08-16 | 矽时代材料科技股份有限公司 | A kind of allyl organic silicon potting adhesive and preparation method thereof |
-
2022
- 2022-02-23 CN CN202210168621.5A patent/CN114517017B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013168291A1 (en) * | 2012-05-11 | 2013-11-14 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
| CN108102207A (en) * | 2018-01-12 | 2018-06-01 | 合肥工业大学 | A kind of halogen-free flameproof thin-walled oil resistant cable insulating manufactured by multiple cross-linked technique and sheath and its manufacturing method and application |
| CN110128998A (en) * | 2019-05-10 | 2019-08-16 | 矽时代材料科技股份有限公司 | A kind of allyl organic silicon potting adhesive and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114517017A (en) | 2022-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI786207B (en) | Granulated curable silicone composition, cured body and manufacturing process thereof | |
| JP6149831B2 (en) | Silicone composition | |
| US9328242B2 (en) | Polysiloxane composition and cured product thereof | |
| CN110291155B (en) | Addition-curable silicone composition | |
| KR102176435B1 (en) | Thermally conductive silicone composition | |
| TWI821238B (en) | Polysilicone composition | |
| KR102479137B1 (en) | thermally conductive composition | |
| WO2018207696A1 (en) | Thermally conductive silicone composition | |
| JP2013089619A (en) | Method for forming conducting circuit | |
| CN114517017B (en) | Heat-conductive silicone grease composition | |
| CN114846084A (en) | Heat conductive silicone composition | |
| CN114437546A (en) | High-thermal-conductivity organic silicon gel and preparation method thereof | |
| WO2020026760A1 (en) | Silicone gel composition and cured product thereof, and power module | |
| TW202116879A (en) | Organopolysiloxane and method for producing same, and heat-conductive silicone composition | |
| CN114874442A (en) | Si-H polymer, heat-conducting silica gel composition, and preparation method and application thereof | |
| EP2910606A1 (en) | Thermosetting resin composition | |
| JP7359761B2 (en) | One-part curable silicone composition | |
| TWI724223B (en) | Thermally conductive silicone resin composition and its hardening method | |
| CN116004014A (en) | Thermally conductive silicone composition | |
| CN118139930A (en) | Curable thermally conductive composition containing diamond particles | |
| EP4203012A1 (en) | Curable organopolysiloxane composition, thermally conductive member and heat dissipation structure | |
| JP2021105116A (en) | Heat conductive silicone resin composition | |
| KR20200135992A (en) | Silicone composition | |
| CN107541075A (en) | Heat molten type organopolysiloxane composition, fluorophor sheet material and semiconductor devices | |
| JP2023044473A (en) | Thermally conductive silicone composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |