CN114513643A

CN114513643A - Aerial imaging device and manufacturing method thereof

Info

Publication number: CN114513643A
Application number: CN202110817107.5A
Authority: CN
Inventors: 郭生文
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-11-17
Filing date: 2021-07-20
Publication date: 2022-05-17

Abstract

The invention relates to an aerial imaging device and a manufacturing method thereof, comprising at least one optical waveguide array, wherein the optical waveguide array is composed of a first transparent plate and a second transparent plate with two optical surfaces, and a substrate positioned between the two transparent plates, the first transparent plate and/or the second transparent plate are wedge-shaped surfaces or planes, a plurality of strip-shaped grooves are respectively arranged on two surfaces of the substrate, the inner walls of the strip-shaped grooves are provided with reflecting surfaces, the reflecting surfaces of the inner walls of the strip-shaped grooves on the two surfaces of the substrate are orthogonally arranged, the bottom parts of the strip-shaped grooves on the two surfaces of the substrate are communicated, so that the substrate forms an upper optical waveguide array unit and a lower optical waveguide array unit, and the optical waveguide array and an object to be projected are in a corresponding relationship. According to the invention, the imaging resolution is improved, high-quality imaging is realized, the simplification of the structure is realized, the process difficulty and the cost are reduced, stray light is eliminated, the optical fiber laser imaging device can be manufactured to be very thin, the display effect and the product experience are better, and the application requirements of various scenes are met.

Description

Aerial imaging device and manufacturing method thereof

Technical Field

The invention relates to the field of optics, in particular to an aerial imaging device and a manufacturing method of the aerial imaging device.

Background

With the development of imaging display technology, the requirements for imaging characteristics are continuously increasing. The aerial imaging technology is to make the mirror image of the object to be projected form a real image in the air on the other side of the optical lens by reflecting the light emitted from the object to be projected arranged on one side of the optical lens on the mirror surface in the optical lens and simultaneously transmitting the plane of the optical lens. However, the imaging of the conventional optical lens structure is limited by the imaging angle or imaging direction, so that the structure with aerial imaging can only see aerial images at one angle within the effective viewing angle range when viewed from different angles, and cannot see aerial images at other angles. Further, since the structure of the three-dimensional image is required to be arranged or assembled with high precision, there is a problem that the structure is complicated and the cost is increased, and the brightness and the definition of the three-dimensional image are also limited.

Disclosure of Invention

The invention aims to overcome the defects in the prior art, provides an aerial imaging device and a manufacturing method thereof, and solves the defects in the prior art, wherein the aerial imaging device has high brightness, high imaging resolution, high-quality imaging, good product experience, simple structure, thinness and low process difficulty and cost.

In order to achieve the purpose, the technical scheme of the invention is as follows:

the utility model provides an aerial image device, includes at least one optical waveguide array, optical waveguide array is by first transparent plate, the second transparent plate that has two optical surfaces to and be located a base plate between two transparent plates and constitute, first transparent plate and/or second transparent plate are wedge face or plane, the base plate two sides is equipped with a plurality of rectangular shape recesses respectively, rectangular shape recess inner wall is equipped with the plane of reflection, the plane of reflection quadrature of the rectangular shape recess inner wall of base plate two sides arranges, the rectangular shape recess bottom part on base plate two sides communicates with each other, makes the base plate forms glazing waveguide array unit and lower optical waveguide array unit, optical waveguide array and by the relation that corresponds between the projection thing.

The utility model provides an aerial image device, includes at least one optical waveguide array, optical waveguide array is by first transparent plate, the second transparent plate that has two optical surfaces to and be located a base plate between two transparent plates and constitute, first transparent plate and/or second transparent plate are plane or wedge face, the base plate one side is equipped with a plurality of rectangular shape recesses rectangular shape recess bottom is equipped with a plurality of through-holes, the inner wall of rectangular shape recess inner wall and recess bottom through-hole is equipped with the plane of reflection respectively, the plane of reflection of the rectangular shape recess inner wall of base plate one side is arranged with the inner wall plane of reflection quadrature of recess bottom through-hole, makes the base plate forms glazing waveguide array element and lower optical waveguide array element, optical waveguide array and the relation that is corresponding between the projected thing.

The elongated grooves on the substrate are arranged in parallel or obliquely relative to the side surface of the substrate.

The first transparent plate or the second transparent plate or the substrate is a plane, a wedge-shaped surface or a spherical surface.

The strip-shaped groove on the substrate is vertical or inclined, or one surface of the strip-shaped groove is vertical to the other surface and inclined to the surface of the substrate.

The substrate is transparent or non-transparent, the heights of the strip-shaped grooves on the two surfaces of the substrate are the same or gradually decrease from the center to the two sides, the distances between the strip-shaped grooves on the two surfaces of the substrate are equal or gradually decrease or increase from the center to the edge of the substrate, the depths of the strip-shaped grooves on the two surfaces of the substrate are equal or unequal, and the bottoms of the strip-shaped grooves on the two surfaces of the substrate are communicated or not communicated.

A method of manufacturing an aerial imaging device, the method comprising:

a step 1 of processing a substrate made of a transparent or opaque material into a desired size;

step 2, taking the front and back surfaces of the substrate as etching or photoetching or stamping or machining surfaces in the step 2;

a 3 rd step, in the 3 rd step, the front and back surfaces of the substrate are processed into a plurality of strip-shaped grooves by etching, photoetching, punching or machining, the strip-shaped grooves on the front and back surfaces of the substrate are orthogonally arranged, and the bottom parts of the strip-shaped grooves on the front and back surfaces of the substrate are communicated with each other, so that the upper optical waveguide array unit and the lower optical waveguide array unit are formed on the substrate;

step 4, in the step 4, all surfaces of the substrate are processed, and then the inner walls of the strip-shaped grooves on the front and back surfaces of the substrate are polished and/or plated with reflecting films;

and a 5 th step of adding a first transparent plate and a second transparent plate to the front and rear surfaces of the substrate in the 5 th step.

A method of manufacturing an aerial imaging device, comprising:

a step 1, in the step 1, designing a surface structure of a substrate, respectively designing a plurality of strip-shaped grooves on the front and back surfaces of the substrate, orthogonally arranging the plurality of strip-shaped grooves on the front and back surfaces of the substrate, and communicating the bottom parts of the strip-shaped grooves on the front and back surfaces of the substrate to form an upper optical waveguide array unit and a lower optical waveguide array unit on the substrate;

a 2 nd step of manufacturing a template or a mold from the substrate structure in the 2 nd step;

a 3 rd step of trial molding a template or a mold to form a substrate;

In the step 4, the reflective film is a reflective film having a high reflectance, a metal film, an aluminum film, or the like.

And in the step 5, the substrate is glued with the first transparent plate and the second transparent plate by using photosensitive glue or thermosensitive glue.

Compared with the prior art, the aerial imaging device and the manufacturing method thereof have the following beneficial effects:

the utility model provides a manufacturing approach of aerial image device and aerial image device, includes at least one optical waveguide array, the optical waveguide array comprises first transparent plate, the second transparent plate that has two optical surfaces to and be located a base plate between two transparent plates and constitute, first transparent plate and/or second transparent plate are plane or wedge face, the base plate two sides is equipped with a plurality of rectangular shape recesses respectively, rectangular shape recess inner wall is equipped with the plane of reflection, the plane of reflection quadrature of the rectangular shape recess inner wall of base plate two sides is arranged, the rectangular shape recess bottom part on base plate two sides communicates with each other, makes the base plate forms light waveguide array unit and lower optical waveguide array unit, optical waveguide array and by being the relation that corresponds between the projection thing. According to the invention, the imaging resolution is improved, high-quality imaging is realized, the simplification of the structure is realized, the process difficulty and the cost are reduced, stray light is eliminated, the optical fiber laser imaging device can be manufactured to be very thin, the display effect and the product experience are better, and the application requirements of various scenes are met.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a schematic structural diagram of an aerial imaging device according to an embodiment of the invention;

FIG. 2 is a schematic structural diagram of an optical waveguide array in which a first transparent plate and a second transparent plate of an aerial imaging device according to an embodiment of the invention are planar;

FIG. 3 is a schematic structural diagram of an optical waveguide array in which a first transparent plate and a second transparent plate of an aerial imaging device according to an embodiment of the invention are wedge-shaped surfaces;

FIG. 4 is a partial structural diagram of an optical waveguide array unit on two sides of a substrate of an aerial imaging device according to an embodiment of the present invention;

FIG. 5 is a schematic view of a structure of an aerial imaging device according to an embodiment of the present invention, in which the reflecting surfaces are perpendicular to each other;

FIG. 6 is a schematic diagram of the internal optical path of an aerial imaging device according to an embodiment of the present invention;

FIG. 7 is a schematic view of an aerial imaging device according to an embodiment of the invention;

FIG. 8 is a schematic view of a light shielding plate of an aerial imaging device according to an embodiment of the present invention;

FIG. 9 is a partial structural diagram of an optical waveguide array unit on two sides of a substrate of an aerial imaging device according to another embodiment of the present invention;

FIG. 10 is a schematic diagram showing the structure of the exposed area and the unexposed area in the step 2 of the method for fabricating an aerial imaging device according to the embodiment of the present invention;

FIG. 11 is a schematic diagram of the method for manufacturing an aerial imaging device according to the embodiment of the invention, wherein the front and back surfaces of the substrate are processed into a strip-shaped groove structure in the steps 3 and 4;

FIG. 12 is a partial schematic structural diagram of FIG. 11 in accordance with an embodiment of the present invention;

fig. 13 is a schematic view of the structure of the 5 th process optical waveguide array of the method for manufacturing an aerial imaging device according to the embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.

Referring to fig. 1, 2 and 3, an aerial imaging device and a method for manufacturing the aerial imaging device according to an embodiment of the present invention includes: the multi-viewpoint aerial image display optical system a is one of real-mirror image imaging optical systems, and includes four optical waveguide arrays 5 and four objects to be projected O, and the four objects to be projected O are arranged corresponding to the four optical waveguide arrays 5. The light waveguides in the four light waveguide arrays 5 all face to the point of the upper-air focusing imaging of the centers of the four light waveguide arrays 5, the inclination angles of the parts of the substrate 11 in the light waveguide arrays 5 corresponding to the first transparent plate 1 and the second transparent plate 2 are adjusted, the positions and the orientations of the four objects to be projected O are adjusted, so that images P formed in 4 directions are superposed, light emitted from the objects to be projected O is reflected by the light waveguides in the light waveguide arrays 5 and then simultaneously transmits the plane of the light waveguide arrays 5, and the mirror image of the objects to be projected O is imaged as a real mirror image P in the space on the other side of the light waveguide arrays 5.

The number of the optical waveguide arrays 5 constituting the aerial imaging device is arbitrary, and may be 1, 2, 3, 4, 5, 6, 7, 8, or the like, and as the number thereof increases, the continuity of the image in switching of the optical waveguide arrays 5 for imaging an aerial image by viewpoint movement becomes more natural, and a problem due to primary reflection light in the optical waveguide arrays 5 is not easily caused. The thickness of the substrate 11 is between 0.05mm and 4mm, stray light can appear when the thickness is too low, and the loss of the incident light can be increased when the thickness is too thick. The strip-shaped grooves 6 on the two surfaces of the substrate 11 are arranged in parallel or obliquely relative to the side surfaces of the substrate, a plurality of strip-shaped grooves 6 are processed on the two surfaces of the substrate 11 respectively by etching or photoetching or stamping or machining methods, the substrate 11 with the strip-shaped grooves 6 can be produced and processed by a template or a die at one time through any one of injection molding, injection, rolling, imprinting, electroforming and the like, the width of the strip-shaped grooves 6 on the two surfaces of the substrate 11 is 0.05-4 mm, the distance between the grooves 6 and the grooves 6 is 0.05-4 mm, the smaller the distance between the grooves 6 and the grooves 6 is, the better the imaging brightness and the imaging resolution are improved, high-quality imaging is realized, the light transmission amount is reduced when the distance is less than 0.05mm, the integral brightness of the image is reduced, and total reflection is not easy to occur when the distance is more than 4 mm. The inside of the groove 6 may be air or vacuum or filled with transparent gas or liquid or filled with optical glass or transparent resin or the like as necessary. The heights of the strip-shaped grooves 6 on the two surfaces of the substrate 11 are the same or gradually decrease from the center to the two sides, and the strip-shaped grooves 6 on the two surfaces of the substrate 11 are arranged at equal intervals, but can be arranged at different intervals, or can be arranged at intervals gradually decreasing or increasing from the center to the edge of the substrate. The inner walls of the strip-shaped grooves 6 on the two sides of the substrate 11 are coated with a reflective film 7 or the reflective surface 7 is formed by other processes, and the reflective surface 7 includes but is not limited to a reflective film or a reflective sheet or a metal coating layer, etc. for reflecting light to realize the change of the propagation direction of the light in the optical waveguide array imaging element. One side of the inner wall of the groove 6 is provided with a reflecting surface, and the other side is provided with a non-reflecting surface or both reflecting surfaces. The substrate 11 may be used by stacking several substrates in close contact with each other as needed. The first transparent plate 1 and/or the second transparent plate 2 or the substrate 11 are plane or wedge-shaped or spherical. The optical waveguide array forming the aerial imaging device can be one optical waveguide array, or a plurality of optical waveguide arrays spliced together, or upper optical waveguide array units and lower optical waveguide array units on a plurality of substrates spliced together to form a larger optical waveguide array, so that larger imaging can be realized. An optical waveguide array may also be cut to the desired size as desired.

As shown in fig. 8, a light shielding plate 8 may be provided between the two objects to be projected O. By providing such a light shielding plate 8, an unintended image can be prevented from being viewed as being imaged at an unintended position. Further, a viewing angle adjusting film 9 is attached to the upper surface of each of the light waveguide arrays 5 so as to transmit light beams in each specific direction and block light beams in other specific directions. Specifically, the optical film 9 prevents the light emitted from the object O from directly passing through the light guide arrays 5 from reaching the viewpoints V1 and V2, thereby preventing the object O from being directly observed from the viewpoints V1 and V2 through the light guide arrays 5, while allowing only the light reflected twice by the light guide arrays 5 and passing through the light guide arrays 5 to pass through, thereby allowing only the real image P of the object O to be observed from the viewpoints V1 and V2.

Hereinafter, a specific structure will be described, an embodiment of the present invention is shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8, and includes four optical waveguide arrays 5, each optical waveguide array 5 is composed of a first transparent board 1 having two optical surfaces, a second transparent board 2, and a substrate 11 located between the two transparent boards, the first transparent board 1 and/or the second transparent board 2 is a plane or a wedge-shaped surface, the thickness of the substrate 11 is between 0.05mm and 4mm, a plurality of strip-shaped grooves 6 are respectively provided on two sides of the substrate 11, the width of the strip-shaped groove 6 on two sides of the substrate 11 is between 0.05mm and 4mm, the distance between the groove 6 and the groove 6 is between 0.05mm and 4mm, the strip-shaped groove 6 is perpendicular to the surface of the substrate 11, the strip-shaped groove 6 is arranged in parallel or inclined at 45 degrees with respect to the side surface of the substrate 11, the inner walls of the strip-shaped grooves 6 are provided with reflecting surfaces 7, the reflecting surfaces 7 are chemically or electrolytically polished and/or plated high-reflectivity aluminum reflecting films and are used for reflecting light, the reflecting surfaces 7 on the inner walls of the strip-shaped grooves 6 on the two surfaces of the substrate 11 are mutually vertical, the depth of the strip-shaped grooves 6 on the two surfaces of the substrate 11 is more than or equal to half of the thickness of the substrate 11, the bottom parts of the strip-shaped grooves 6 on the two surfaces of the substrate 11 are communicated, the substrate 11 forms an upper light waveguide array unit 3 and a lower light waveguide array unit 4, the bottom parts of the strip-shaped grooves 6 on the two surfaces of the substrate 11 are communicated, the imaging brightness and the imaging resolution can be improved, high-quality imaging is realized, the upper light waveguide array unit 3 and the lower light waveguide array unit 4 on the two surfaces of the substrate 11 in the light waveguide array 5 are arranged in parallel to or inclined with the first transparent plate 1 and the second transparent plate 2, the images from all directions can be overlapped by adjusting the inclination angle, the optical waveguides in each optical waveguide array 5 face the same direction, the optical waveguides in each optical waveguide array 5 all focus towards a specified point, the included angle between each optical waveguide array 5 and the object to be projected O is set to be less than or equal to 90 degrees, and the images from all directions can be overlapped by adjusting the included angle. Each optical waveguide array 5 is in one-to-one correspondence with each object to be projected O. The scattered light emitted from any point light source, planar light source and stereo light source will be refocused and imaged at the same position on the other side of the lens after passing through the lens with the special structure, refer to fig. 6 and 7.

Fig. 6 shows the working principle of the light path:

on the micrometer structure, a reflecting layer mirror surface structure which is orthogonal with each other is used for orthogonal decomposition of any optical signal, an original signal is decomposed into two paths of mutually orthogonal signals of a signal X and a signal Y, the signal X is totally reflected on the mirror surface according to a reflection angle which is the same as an incident angle on a first physical layer, the signal Y is kept parallel to the first physical layer at the moment, after passing through the first physical layer, the signal Y is totally reflected on the mirror surface according to a reflection angle which is the same as the incident angle on a second physical layer surface, and a reflected optical signal which is formed by the reflected signal Y and the signal X is mirror-symmetrical with the original optical signal. Therefore, the light rays in any direction can realize mirror symmetry through the lens, the divergent light of any light source can be refocused and imaged at a symmetrical position through the lens, the imaging distance is the same as the distance between the holographic reflection layer and the light source, the imaging is carried out at equal distance, the image is positioned in the air, a specific carrier is not needed, and the real image is directly imaged in the air. Therefore, the image in the space seen by the user is the light emitted by the actual object.

After the original light source passes through the optical lens structure, the above processes are performed on the optical lens structure, the focused and imaged incident angles are beta 1, beta 2, beta 3, beta 4 ….. beta.n, and the distance L between the image and the optical lens structure is such that the image is imaged on the optical lens structure

At equal distance L from the original light source, the viewing angle epsilon is 2 times max (beta), so if the size of the lens is small, the image can be seen only at a certain distance from the front; the lenses are combined together to focus the light beams guided out by the lenses towards a specified point, so that people can view aerial images in a range of multiple viewpoints, and if the size of the plate is increased, a larger imaging distance can be realized, and the visual field rate is increased.

In another embodiment, as shown in fig. 2, 3 and 9, an aerial imaging device and a method for manufacturing an aerial imaging device includes at least one optical waveguide array 5, where the optical waveguide array 5 includes a first transparent board 1 having two optical surfaces, a second transparent board 2, and a substrate 11 located between the two transparent boards, the first transparent board 1 and/or the second transparent board 2 is a plane or a wedge-shaped surface, the thickness of the substrate 11 is 0.05-4 mm, one surface of the substrate 11 is provided with a plurality of strip-shaped grooves 6, the width of the strip-shaped groove 6 on one surface of the substrate 11 is 0.05-4 mm, the distance between the groove 6 and the groove 6 is 0.05-4 mm, the strip-shaped groove 6 is perpendicular to the surface of the substrate 11, the strip-shaped groove 6 is arranged in parallel or inclined at 45 degrees with respect to the side surface of the substrate 11, the bottom of the strip-shaped groove 6 is provided with a plurality of through holes 12, the bottom of the strip-shaped groove 6 is provided with a plurality of through holes 12 to improve the imaging brightness and the imaging resolution ratio, so as to realize high-quality imaging, the inner walls of the strip-shaped groove 6 and the groove bottom through hole 12 are respectively provided with a reflecting surface 7, the reflecting surface 7 is an aluminum reflecting film with high reflectivity chemically or electrolytically polished and/or plated for reflecting light, the reflecting surface 7 of the strip-shaped groove 6 inner wall of the substrate 11 is perpendicular to the inner wall reflecting surface 7 of the groove bottom through hole 12, so that the substrate 11 forms an upper optical waveguide array unit 3 and a lower optical waveguide array unit 4, and the optical waveguide array 5 is in corresponding relation with a projected object. Scattered light emitted by any point light source, the plane light source and the three-dimensional light source passes through the lens with the special structure and then is focused again at the same position on the other side of the lens for imaging. The through holes 12 at the bottom of the strip-shaped groove 6 are square holes or rectangular holes. Other parts of this embodiment are the same as those of the above embodiment, and are not described again.

Preferably, the elongated grooves on the substrate are arranged in parallel or obliquely relative to the side surface of the substrate.

Preferably, the elongated grooves on the substrate are formed by etching, photolithography, stamping, machining, or the like.

Preferably, the substrate and the strip-shaped groove on the substrate are processed at a time by injection molding or rolling or stamping or electroforming with a template or a mold.

Preferably, the first transparent plate or the second transparent plate or the substrate is a plane, a wedge-shaped surface or a sphere.

Preferably, the strip-shaped groove on the substrate is vertical or inclined or one surface is vertical to the other surface and inclined to the surface of the substrate.

Preferably, one side of the inner wall of the elongated groove on the substrate is provided with a reflecting surface, and the other side is provided with a non-reflecting surface or both reflecting surfaces.

Preferably, the reflecting surface is a high-reflectivity reflecting film or a metal film or an aluminum film or a high-reflectivity surface formed by other processes.

Preferably, all of the optical waveguides in the optical waveguide array are focused toward a predetermined point.

Preferably, the substrate is transparent or opaque, the heights of the strip-shaped grooves on the two sides of the substrate are the same or gradually decrease from the center to the two sides, the depths of the strip-shaped grooves on the two sides of the substrate are equal or unequal, and the bottoms of the strip-shaped grooves on the two sides of the substrate are communicated or not communicated.

Preferably, the thickness of the substrate is between 0.05 and 4mm, stray light can occur when the thickness is too low, and the loss of the absorbed light can be increased when the thickness is too thick.

Preferably, the width of the strip-shaped grooves on the two sides of the substrate is 0.05-4 mm, the distance between the grooves is 0.05-4 mm, the smaller the distance between the grooves is, the better the distance between the grooves is, the imaging brightness and imaging resolution can be improved, high-quality imaging is realized, the light transmission amount is reduced when the distance is less than 0.05mm, the integral brightness of an image is reduced, and the total reflection is not easy to occur when the distance is more than 4 mm.

Preferably, the elongated grooves on both sides of the substrate are arranged at equal intervals, but may be arranged at different intervals, or may be arranged at intervals gradually decreasing or increasing from the center to the edge of the substrate. The substrate can be used by stacking a plurality of substrates according to the requirement.

Preferably, the optical waveguide array forming the aerial imaging device may be one optical waveguide array, or may be formed by splicing several optical waveguide arrays, or may be formed by splicing upper optical waveguide array units and lower optical waveguide array units on several substrates, so that a larger optical waveguide array formed by splicing can realize larger imaging. An optical waveguide array may also be cut to the desired size as desired.

Hereinafter, a method for manufacturing an aerial imaging device according to an embodiment of the present invention will be described in further detail, and as shown in fig. 10, 11, 12, and 13, the method for manufacturing an aerial imaging device according to an embodiment of the present invention includes the following steps:

a step 1, in the step 1, processing a substrate 11 of a flat plate material with a transparent or non-transparent front surface and a non-transparent back surface parallel to each other into a required size, wherein the thickness of the substrate 11 is between 0.05 and 4 mm;

a step 2, in the step 2, taking the front and back surfaces of the substrate 11 as etching surfaces, and carrying out degreasing → water washing → etching → water washing → drying → screen printing → water immersion for 2-3 min, wherein the exposed areas and the unexposed areas of the front and back surfaces of the substrate 11 are both strip-shaped, the strip-shaped areas are arranged by inclining 45 degrees relative to the side of the substrate 11, the exposed areas and the strip-shaped areas of the front and back surfaces of the substrate 11 are arranged at intervals, and the exposed areas and the strip-shaped areas of the front and back surfaces of the substrate 11 are arranged orthogonally;

a 3 rd step, in the 3 rd step, processing a plurality of strip-shaped grooves 6 on the front and back surfaces of the substrate 11 by etching, after etching, performing water washing → ink removal → water washing → acid washing → water washing treatment on the substrate 11, wherein the width of the strip-shaped grooves 6 on the front and back surfaces of the substrate 11 is between 0.05 and 4mm, the distance between the grooves 6 and the grooves 6 is between 0.05 and 4mm, the strip-shaped grooves 6 are perpendicular to the front and back surfaces of the substrate 11, the depth of the strip-shaped grooves 6 is not less than half of the thickness of the substrate 11, so that the bottom parts of the strip-shaped grooves 6 on the front and back surfaces of the substrate 11 are communicated, the substrate 11 forms the upper light waveguide array unit 3 and the lower light waveguide array unit 4, and the bottom parts of the strip-shaped grooves 6 on the front and back surfaces of the substrate 11 are communicated, thereby improving the imaging brightness and the imaging resolution and realizing high-quality imaging;

a 4 th step of treating all surfaces of the substrate 11 and then polishing and/or plating the inner walls of the elongated grooves 6 on the front and rear surfaces of the substrate 11 with the reflective films 7;

and a 5 th step of adding the first transparent board 1 and the second transparent board 2 to the front and rear surfaces of the new substrate 11 in the 5 th step.

The photoetching, stamping or machining manufacturing method comprises the following steps:

a step 1 of processing a substrate 11 of a flat plate material having a transparent or opaque front and back surfaces parallel to each other into a desired size, wherein the thickness of the substrate 11 is 0.05 to 4 mm;

a 2 nd step of taking the front and rear surfaces of the substrate 11 as a lithographic or stamping or machining surface;

a 3 rd step, in the 3 rd step, the substrate 11 is placed, a plurality of strip-shaped grooves 6 are formed on the front and rear surfaces of the substrate 11, the strip-shaped grooves 6 are arranged at an angle of 45 degrees with respect to the edges of the substrate 11, the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 are orthogonally arranged, the width of the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 is 0.05-4 mm, the distance between the grooves 6 and the grooves 6 is 0.05-4 mm, the strip-shaped grooves 6 are perpendicular to the front and rear surfaces of the substrate 11, the depth of the strip-shaped grooves 6 is not less than half of the thickness of the substrate 11, the bottom portions of the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 are communicated with each other, the substrate 11 forms the upper light waveguide array unit 3 and the lower light waveguide array unit 4, the bottom portions of the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 are communicated with each other to improve the imaging brightness and the imaging resolution, high-quality imaging is realized;

The mold forming manufacturing method comprises the following steps:

a step 1, in the step 1, designing a surface structure of a substrate 11, wherein the thickness of the substrate 11 is between 0.05 and 4mm, a plurality of strip-shaped grooves 6 are designed on the front and rear surfaces of the substrate 11, the strip-shaped grooves 6 are arranged at an angle of 45 degrees relative to the edges of the substrate 11, the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 are orthogonally arranged, the width of the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 is between 0.05 and 4mm, the distance between the grooves 6 is between 0.05 and 4mm, the strip-shaped grooves 6 are perpendicular to the front and rear surfaces of the substrate 11, the depth of the strip-shaped grooves 6 is more than or equal to half of the thickness of the substrate 11, so that the bottom portions of the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 are communicated, the substrate 11 is formed with an upper optical waveguide array unit 3 and a lower optical waveguide array unit 4, the bottom portions of the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 are communicated with each other to improve imaging brightness and imaging resolution, high-quality imaging is realized;

a 2 nd step of manufacturing a template or a mold according to the structure of the substrate 11 in the 2 nd step;

a 3 rd step, wherein the process flow of the substrate 11 molding technique comprises the following steps: template or mold mounting → trial mold → production substrate 11 → substrate 11 molding → inspection → packaging;

a 4 th step of treating all surfaces of the substrate 11 and plating the inner walls of the strip-shaped grooves 6 on the front and rear surfaces of the substrate 11 with the reflective films 7;

and a 5 th step of adding a first transparent plate 1 and a second transparent plate 2 to the front and rear surfaces of the substrate 11 in the 5 th step.

In the step 4, the reflective film 7 is an aluminum film having a high reflectance.

And in the step 5, the new substrate 11 is glued with the first transparent plate 1 and the second transparent plate 2 by using photosensitive glue or thermosensitive glue.

Preferably, the reflective film is a reflective film with high reflectivity or a metal film or an aluminum film or a high reflective film formed by other processes.

Preferably, the elongated grooves on the front and rear surfaces of the substrate are arranged in parallel or obliquely with respect to the side surfaces of the substrate.

Preferably, one side of the inner wall of the elongated groove on the front and back surfaces of the substrate is provided with a reflecting surface, and the other side is provided with a non-reflecting surface or both reflecting surfaces.

Preferably, the substrate and the first transparent plate and the second transparent plate are glued by using photosensitive glue or thermosensitive glue, or an outer frame or other binding modes can be adopted instead of gluing.

Preferably, the substrate is a planar or wedge-shaped surface.

Preferably, the width of the strip-shaped grooves on the front surface and the back surface of the substrate is 0.05-4 mm, the distance between the grooves is 0.05-4 mm, the smaller the distance between the grooves is, the better the distance between the grooves is, the imaging brightness and the imaging resolution can be improved, high-quality imaging is realized, the light transmission amount is reduced when the distance is less than 0.05mm, the integral brightness of an image is reduced, and the total reflection is not easy to occur when the distance is more than 4 mm.

Preferably, the heights of the strip-shaped grooves on the two surfaces of the substrate are the same or gradually decrease from the center to the two sides, and the strip-shaped grooves on the two surfaces of the substrate are arranged at equal intervals, but may be arranged at different intervals, or may be arranged at intervals gradually decreasing or increasing from the center to the edge of the substrate. The substrate can be used by stacking a plurality of substrates according to the requirement.

In summary, the present invention can greatly reduce the individual difference between the conventional processing of the strip optical waveguides, and processes the strip optical waveguides by etching, photolithography, stamping, machining, or making a template or a mold in injection molding, rolling, stamping, electroforming, etc., so that each unit has uniform size processing and small error, and can be manufactured very thin, thereby avoiding the assembly error of the system. The processing size of each imaging unit of the optical waveguide array can be reduced to micron level, the imaging resolution of the optical waveguide array can be greatly improved, high-quality imaging is realized, and the process difficulty and the cost are reduced. Meanwhile, due to the fact that the system machining error is extremely small, imaging distortion is extremely small, three-dimensional display characteristics and naked eye three-dimensional holographic display requirements are met, and the purpose of clear three-dimensional imaging is really achieved.

The foregoing is only a partial embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and embellishments can be made without departing from the principle of the present invention, and these should also be construed as the scope of the present invention.

Claims

1. The utility model provides an aerial image device, its characterized in that, includes at least one optical waveguide array, optical waveguide array is by first transparent plate, the second transparent plate that has two optical surfaces to and be located a base plate component between two transparent plates, first transparent plate and/or second transparent plate are wedge face or plane, the base plate two sides is equipped with a plurality of rectangular shape recesses respectively, rectangular shape recess inner wall is equipped with the plane of reflection, the plane of reflection quadrature of the rectangular shape recess inner wall of base plate two sides is arranged, the rectangular shape recess bottom part on base plate two sides communicates with each other, makes the base plate forms glazing waveguide array unit and lower optical waveguide array unit, optical waveguide array and the relation that is corresponding between the projected thing.

2. The utility model provides an aerial image device, its characterized in that, includes at least one optical waveguide array, optical waveguide array is by first transparent plate, the second transparent plate that has two optical surfaces to and be located a base plate between two transparent plates and constitute, first transparent plate and/or second transparent plate are plane or wedge face, the base plate one side is equipped with a plurality of rectangular shape recesses rectangular shape recess bottom is equipped with a plurality of through-holes, the inner wall of rectangular shape recess inner wall and recess bottom through-hole is equipped with the plane of reflection respectively, the plane of reflection of the rectangular shape recess inner wall of base plate one side is arranged with the inner wall plane of recess bottom through-hole plane quadrature, makes the base plate forms light waveguide array unit and lower optical waveguide array unit, optical waveguide array and by being the relation that corresponds between the projection thing.

3. An aerial imaging device as claimed in claim 1 or 2, wherein the elongate grooves on the substrate are arranged parallel or diagonally to the substrate side.

4. An aerial imaging device as claimed in claim 1 or 2, wherein the first or second transparent plates or substrates are planar or wedge-faced or spherical.

5. An aerial imaging device as claimed in claim 1 or 2, wherein the elongate recesses in the substrate are perpendicular or oblique or one face perpendicular to the other face is oblique to the substrate surface.

6. An aerial imaging device as claimed in claim 1 or 2, wherein the substrate is transparent or opaque, the heights of the strip-shaped grooves on the two sides of the substrate are the same or gradually decrease from the center to the two sides, the distances between the strip-shaped grooves on the two sides of the substrate are equal or gradually decrease or increase from the center to the edge of the substrate, the depths of the strip-shaped grooves on the two sides of the substrate are equal or unequal, and the bottoms of the strip-shaped grooves on the two sides of the substrate are communicated or not communicated.

7. A method of manufacturing an aerial imaging device, comprising:

8. A method of manufacturing an aerial imaging device, the method comprising:

a 3 rd step of trial molding a template or a mold to form a substrate;

9. A method for manufacturing an aerial imaging device according to claim 7 or 8, wherein the reflective film in the 4 th step is a reflective film with high reflectivity, a metal film, an aluminum film, or the like.

10. A method for manufacturing an aerial imaging device as claimed in claim 7 or 8, wherein in the step 5, the substrate is glued with the first transparent plate and the second transparent plate by using photosensitive glue or thermosensitive glue.