Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
According to a first aspect of the embodiments of the present invention, there is provided a method for testing sensitivity of a wireless transceiver chip, optionally, as shown in fig. 1, the method includes:
s102, outputting a test modulation radio frequency signal by a radio frequency vector signal source;
s104, sending the test modulation radio frequency signal to a target power divider, and dividing the test modulation radio frequency signal into multiple paths of test radio frequency signals by the target power divider;
s106, each path of test radio frequency signal in the multi-path test radio frequency signals is connected with one interface on the wireless transceiving chip parallel test pin card, wherein each interface is connected with one wireless transceiving chip to be tested;
s108, determining that the wireless transceiver chip passes a sensitivity test under the condition that the output signal of the wireless transceiver chip contains a square wave signal with a specific frequency;
and S110, determining that the wireless transceiver chip fails the sensitivity test under the condition that the output signal of the wireless transceiver chip does not contain the square wave signal with the specific frequency.
Optionally, in this embodiment, the rf vector signal source is an electronic measurement instrument used in the field of electronic and communication technologies, and can output an interference-free modulated rf signal. The power divider, also called power divider, is a device that divides one path of input signal energy into two or more paths to output equal or unequal energy. The wireless transceiver chip parallel test pincard is used for testing the sensitivity of the wireless transceiver chip.
Optionally, in this embodiment, the radio frequency vector signal source is connected to the one-to-many power divider through a coaxial cable, the other end of the one-to-many power divider is connected to one interface on the wireless transceiver chip parallel test pin, each interface at the other end of the wireless transceiver chip parallel test pin is connected to one wireless transceiver chip to be tested, an interference-free test modulation radio frequency signal is generated by the radio frequency vector signal source, the signal is sent to the one-to-many power divider with a specific frequency communication number rate, the signal is divided into multiple paths of test radio frequency signals, each path of test radio frequency signal in the multiple paths of test radio frequency signals provides a test radio frequency signal for the wireless transceiver chip to be tested, if the output signal of the wireless transceiver chip to be tested contains a square wave signal with a specific frequency, that is, the test machine can read out the signal with the specific frequency, the test result is passed, and if the output signal of the wireless transceiver chip to be tested does not contain the square wave signal with the specific frequency, that is, the test machine cannot read out the signal with the specific frequency, the test result is not passed.
Optionally, in this embodiment, because in the above method, a specific interference-free test modulated radio frequency signal is generated by using a radio frequency vector signal source, a plurality of paths of test modulated radio frequency signals are equally divided by a power divider with one division to a plurality of paths, and then the test modulated radio frequency signals are sent to an interface of a parallel test pincard of a wireless transceiver chip through a coaxial cable to provide test radio frequency signals for the wireless transceiver chip to be tested, if an output signal of the wireless transceiver chip to be tested includes a square wave signal with a specific frequency, a sensitivity test is passed, and if the output signal of the wireless transceiver chip to be tested does not include the square wave signal with the specific frequency, the sensitivity test is not passed. Therefore, the purposes of reducing the testing time of a single wireless transceiver chip and reducing the production cost are achieved, and the technical problems that a plurality of wireless transceiver chips cannot simultaneously test the sensitivity in parallel, the testing time is long and the testing cost is high are solved.
As an alternative example, outputting the test modulated radio frequency signal by the radio frequency vector signal source comprises:
the method comprises the steps that a radio frequency vector signal source outputs a test modulation radio frequency signal with the amplitude as a first value, the communication number rate as a second value and the frequency deviation as a third value, wherein the first value is the sum of the chip sensitivity of a wireless transceiver chip, a target attenuation value and a margin value, the target attenuation value is the maximum value in an attenuation value group of a test device, and the margin value is a preset parameter.
Optionally, in this embodiment, the first value is a sum of a chip sensitivity of the wireless transceiver chip, a target attenuation value and a margin value, the chip sensitivity of the wireless transceiver chip is a sensitivity to be tested, the target attenuation value is a maximum value in an attenuation value set obtained by calibrating the test device, and the margin value is a margin required to be given for production consistency, for example, the chip sensitivity of the wireless transceiver chip is-111 dBm, the target attenuation value obtained by calibrating the test device is 19.7dBm, the margin value is 1.3dBm, the first value is-90 dBm, the second value is 20Kbps, the third value is 20kHz, the amplitude of the test modulated radio frequency signal output by the radio frequency vector signal source is-90 dBm, the communication number rate is 20Kbps, and the frequency offset is 20 kHz.
As an optional example, the method further includes:
determining a set of attenuation values for the test device from the first set of attenuation values, the second set of attenuation values, and the first attenuation value;
the maximum value in the set of attenuation values is determined as the target attenuation value.
Optionally, in this embodiment, the target attenuation value is a maximum value in an attenuation value group obtained by calibrating the testing device, the attenuation value group is determined by the first attenuation value group, the second attenuation value group, and the first attenuation value, the number of data in the first attenuation value group and the second attenuation value group is determined by the power divider, and if the power divider is a 1-to-8 power divider, the number of data in the first attenuation value group and the second attenuation value group is 8.
As an alternative example, determining the first set of attenuation values includes:
outputting a first modulation radio frequency signal with an amplitude value of zero by a radio frequency vector signal source;
sending the first modulation radio frequency signal to a target power divider, and dividing the first modulation radio frequency signal into multiple paths of first radio frequency signals by the target power divider;
and each path of first radio frequency signal in the multiple paths of first radio frequency signals is connected with the frequency spectrograph, and a first attenuation value group of the testing device is recorded.
Optionally, in this embodiment, the spectrum analyzer is an apparatus for studying a spectrum structure of the electrical signal, and is configured to measure a distortion degree, a modulation degree, and a spectrum purity of the signal. The method comprises the steps that a radio frequency vector signal source is connected with a one-branch multi-target power divider through a coaxial cable, the other end of the one-branch multi-target power divider is connected with a frequency spectrograph, a first modulation radio frequency signal with a zero amplitude value is generated through the radio frequency vector signal source, the signal is sent to the one-branch multi-target power divider, the signal is divided into multi-path modulation radio frequency signals, each path of modulation radio frequency signals in the multi-path modulation radio frequency signals provides modulation radio frequency signals for the frequency spectrograph, a first attenuation value group of a testing device is recorded, if the one-branch multi-target power divider is a 1-branch 8 power divider, the first attenuation value group is recorded as eight groups of data, for example, the first attenuation value group of the testing device is recorded as X1=14.2dBm, X2=14.0dBm, X3=13.9dBm, X4=14.2dBm, X5=14.3dBm, X6=14.1dBm, X7=14.5dBm, and X8=13.8 dBm.
As an alternative example, determining the first attenuation value comprises:
outputting a second modulation radio frequency signal with an amplitude value of zero by the radio frequency vector signal source;
and sending the second modulation radio frequency signal to the frequency spectrograph, and recording the first attenuation value of the testing device.
Optionally, in this embodiment, the rf vector signal source is connected to the spectrometer through a coaxial cable, and the rf vector signal source generates a second modulated rf signal with an amplitude value of zero, which provides the modulated rf signal to the spectrometer, and records a first attenuation value of the testing apparatus, for example, the first attenuation value of the testing apparatus is Y1=4 dBm.
As an alternative example, determining the second set of attenuation values includes:
outputting a third modulation radio frequency signal with an amplitude value of zero by the radio frequency vector signal source;
sending the third modulated radio frequency signal to a target power divider, and dividing the third modulated radio frequency signal into multiple paths of third radio frequency signals by the target power divider;
each path of third radio frequency signal in the multiple paths of third radio frequency signals is connected with the frequency spectrograph;
the frequency spectrograph is connected with an interface on the wireless transceiver chip parallel test pin card, and records a second attenuation value group of the test device.
Optionally, in this embodiment, the radio frequency vector signal source is connected to the one-branch multi-target power divider through a coaxial cable, the other end of the one-branch multi-target power divider is connected to the spectrometer, the other end of the spectrometer is connected to an interface on the wireless transceiver chip parallel test pin, a third modulated radio frequency signal with zero amplitude value is generated by the radio frequency vector signal source, the third modulated radio frequency signal is sent to the one-branch multi-target power divider, the signal is divided into multiple modulated radio frequency signals, each of the multiple modulated radio frequency signals provides a modulated radio frequency signal to the wireless transceiver chip parallel test pin through the spectrometer, a second attenuation value set of the test apparatus is recorded, if the one-branch multi-target power divider is a 1-branch 8 power divider, the second attenuation value set is recorded as eight sets, for example, the second attenuation value set of the test apparatus is recorded as W1=8.8dBm, W2=9.1dBm, w3=8.9dBm, W4=9.4dBm, W5=9.3dBm, W6=8.7dBm, W7=9.2dBm, W8=8.9 dBm.
As an alternative example, determining the set of attenuation values for the test device from the first set of attenuation values, the second set of attenuation values, and the first attenuation value comprises:
obtaining the difference value between each value in the second attenuation value group and the first attenuation value to obtain a middle attenuation value group;
and summing each value in the intermediate attenuation value group with each corresponding value in the first attenuation value group to obtain the attenuation value group of the testing device.
Optionally, in this embodiment, a difference between each value in the second attenuation value set and the first attenuation value is obtained, so as to obtain an intermediate attenuation value set, for example, the intermediate attenuation value set is obtained as Z1= W1-Y1=8.8dBm-4dBm =4.4dBm, and so on, as Z2=5.1dBm, Z3=4.9dBm, Z4=5.4dBm, Z5=5.3dBm, Z6=4.7dBm, Z7=5.2dBm, Z8=4.9dBm, and each value in the intermediate attenuation value set is summed with a corresponding value in each of the first attenuation value set, so as to obtain an attenuation value set of the test apparatus, as ATT1= X1+ Z1=14.2+4.8=19dBm, so as to obtain ATT2=19.1dBm, ATT3=18.8dBm, ATT = 19.19 dBm = 19.8 dBm, and so on.
As an alternative example, obtaining the difference of each of the second attenuation value sets from the first attenuation value, resulting in an intermediate attenuation value set comprises:
taking each value in the second attenuation value group as a current value, and taking the difference value between the current value and the first attenuation value as a value in the middle attenuation value group under the condition that the wireless transceiver chip is a single-ended input signal;
and under the condition that the wireless transceiving chip is a differential input signal, acquiring the difference value between the current value and the first attenuation value, summing the difference value and the differential value, and taking the sum as the value in the intermediate attenuation value group.
Optionally, in this embodiment, each value in the second attenuation value set is used as a current value, and if the wireless transceiver chip to be tested is a single-ended input signal, a difference between the current value and the first attenuation value is used as a value in an intermediate attenuation value set, for example, a value z1-z 8. If the wireless transceiver chip to be tested is a differential input signal, the difference value is summed with the differential value, the sum is used as a value in the intermediate attenuation value group, the differential value is a preset value, which may be 3, the differential intermediate attenuation value group is obtained as Z1= Z1+3=7.4dBm, and by analogy, Z2=8.1dBm, Z3=7.9dBm, Z4=8.4dBm, Z5=8.3dBm, Z6=7.7dBm, Z7=8.2dBm, and Z8=8.9 dBm.
Optionally, in this embodiment, a radio frequency vector signal source is used to generate a specific non-interference working frequency point, a 20Kbps communication data rate is added, a modulated radio frequency signal of FSK (frequency offset 20 kHz) is equally divided into 8 channels of modulated radio frequency signals of FSK (frequency offset 20 kHz) through a 50 ohm coaxial cable and a 1-to-8 power divider, the modulated radio frequency signals are respectively added to SMA interfaces of the parallel test pincards of the wireless transceiver chips through the 50 ohm coaxial cable, test radio frequency signals are provided for the plurality of wireless transceiver chips, the wireless transceiver chips respectively output 20Kbps of data, that is, 10kHz square wave signals, a test machine is used to read out whether 10kHz signals exist, if so, the test is passed, if not, the test is failed, and a circuit block diagram of the method for parallel testing the sensitivity of the whole wireless transceiver chip is shown in fig. 2.
Optionally, in this embodiment, the specific implementation steps are as follows:
1. the selection of the test working frequency point is that a 300 KHz-3 GHz frequency spectrograph is used, the working frequency range of a wireless transceiver chip to be tested is larger than that of the wireless transceiver chip to be tested, the maximum holding function is opened when the frequency spectrograph tests interference signals, meanwhile, a broadband antenna is used, the working frequency range of the broadband antenna is larger than or equal to that of the wireless transceiver chip to be tested, a clean working frequency point in the working frequency range of the wireless transceiver chip to be tested is selected in the frequency spectrograph, so that the interference signals are effectively avoided, the sensitivity test of the wireless transceiver chip is consistent and reliable, and the working frequency points are different due to different frequency points of a test factory.
2. One end of a power divider channel 1-8 is connected with 50 ohm coaxial cables B1,2 and 3 … 8, the other end is connected with 50 ohm coaxial cable A1, the 50 ohm coaxial cable A1 is connected with a radio frequency vector signal source, and the radio frequency vector signal source generates a frequency point carrier signal which is 0dBm and has no interference; a calibration block diagram of attenuation values for connecting 50 ohm coax cables B1,2,3 … 8,50 ohm coax cables B898, 2,3, …,50 ohm coax cables and a power divider in sequence with a spectrometer is shown in fig. 3, and records a first set of attenuation values for the test apparatus:
X1=14.2dBm,X2=14.0dBm,X3=13.9dBm,X4=14.2dBm,
X5=14.3dBm,X6=14.1dBm,X7=14.5dBm,X8=13.8dBm。
the method comprises the following steps that a radio frequency vector signal source generates a frequency point carrier signal which is 0dBm and has no interference, the radio frequency vector signal source, a 50 ohm coaxial cable and a spectrometer are sequentially butted, a first attenuation value of a testing device is recorded as Y1(dBm), then the 50 ohm coaxial cable of the radio frequency vector signal source is connected with a 1-to-8 power divider, as shown in figure 3, one end of the radio frequency vector signal source is connected with a 50 ohm load, the other end of the radio frequency vector signal source is connected with a wireless transceiving chip parallel testing pin card, in order to avoid damaging a testing pin, a flat copper sheet is welded on a core wire of the 50 ohm coaxial cable of the spectrometer, and a second attenuation value set of the testing device is measured:
W1=8.8dBm,W2=9.1dBm,W3=8.9dBm,W4=9.4dBm,
W5=9.3dBm,W6=8.7dBm,W7=9.2dBm,W8=8.9dBm。
if the tested wireless transceiver chip is a differential input signal, the wireless transceiver chip tests the probe card to the wireless transceiver chip in parallel, the differential intermediate attenuation value of the testing device is recorded as Z1,2,3 … 8, and the calculation formula is as follows:
z1,2,3 … 8= W1,2,3 … n-Y1 +3(dBm) (differential intermediate attenuation value)
Z1=7.4dBm,Z2=8.1dBm,Z3=7.9dBm,Z4=8.4dBm,
Z5=8.3dBm,Z6=7.7dBm,Z7=8.2dBm,Z8=8.9dBm。
If the wireless transceiver chip to be tested is a single-ended input signal, the wireless transceiver chip tests the probe card to the wireless transceiver chip in parallel, the calibration block diagram is shown in fig. 4, the single-ended intermediate attenuation value of the testing device is recorded as z1,2,3 … 8, and the calculation formula is as follows:
z1,2,3 … 8= W1,2,3 … 8-Y1 (dBm) (single-ended intermediate attenuation value)
z1=4.4dBm,z2=5.1dBm,z3=4.9dBm,z4=5.4dBm,
z5=5.3dBm,z6=4.7dBm,z7=5.2dBm,z8=4.9dBm。
4. The attenuation value group of the testing device obtained according to the steps is as follows:
ATT1=X1+Z1=14.2+4.8=19dBm,ATT2=X2+Z2=14.0+5.1=19.1dBm,
ATT3=X3+Z3=13.9+4.9=18.8dBm,ATT4=X4+Z4=14.2+5.4=19.6dBm,
ATT5=X5+Z5=14.3+5.3=19.6dBm,ATT6=X6+Z6=14.1+4.7=18.8dBm,
ATT7=X7+Z7=14.5+5.2=19.7dBm,ATT8=X8+Z8=13.8+4.9=18.7dBm;
the sensitivity of the wireless transceiver chip to be tested is-111 dBm, the signal output amplitude of the radio frequency vector signal source = chip sensitivity + ATT1, 2,3 … 8 (the maximum value in the attenuation value group of the test device) = -111+19.7= -91.3dBm, and 1.3dB margin is provided for production consistency, so the signal output amplitude of the radio frequency vector signal source is-90 dBm.
The wafer of the wireless transceiver chip is placed in a wafer test bench, the wireless transceiver chip is placed in a parallel test pin card, the signal output amplitude of a radio frequency vector signal source is set to be-90 dBm, the communication data rate of 20Kbps, and a radio frequency signal is modulated by FSK (frequency offset of 20 kHz), and 8 coaxial cables of 50 ohms are respectively connected with the interface of a power divider of 1 to 8 and the interface of SMA on the wireless transceiver chip parallel test pin card, as shown in figure 2.
The testing machine configures CMT2300 testing parameters, sends receiving instructions to CMT2300, detects whether 10KHz square wave signals exist or not in parallel on I/O ports of CH _ GPIO _1, CH _ GPIO _2, CH _ GPIO _3, CH _ GPIO _4, CH _ GPIO _5, CH _ GPIO _6, CH _ GPIO _7 and CH _ GPIO _8 of the testing machine, the CMT2300 demodulation output passes through buffer amplification U (AD8601),3 and 4 8 on I/O ports of 107A/B/C, 207A/B/C807A/B/C, and the I/O ports of CH _ GPIO _1, CH _ GPIO _2, CH _ GPIO _3, CH _ GPIO _4, CH _ GPIO _5, CH _ GPIO _6, CH _ GPIO _7 and CH _ GPIO _8 connected to the testing machine are shown in FIG. 4.
Optionally, in this embodiment, the total sensitivity test time is about 28ms, that is, the test time of a single chip is =28/8=3.5ms, so the cost of the sensitivity parallel test of the wireless transceiver chip is =140RMB/(3600s/0.0035s) =0.000136 RMB.
It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the invention. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required by the invention.
According to another aspect of the embodiments of the present application, there is also provided a device for testing sensitivity of a wireless transceiver chip, as shown in fig. 5, including:
an output module 502, configured to output a test modulation radio frequency signal from the radio frequency vector signal source;
a sending module 504, configured to send the test modulated radio frequency signal to a target power divider, where the target power divider divides the test modulated radio frequency signal into multiple paths of test radio frequency signals;
the processing module 506 is used for connecting each path of test radio frequency signal in the multi-path test radio frequency signal with one interface on the wireless transceiver chip parallel test pin card, wherein each interface is connected with one wireless transceiver chip to be tested;
a first determining module 508, configured to determine that the wireless transceiver chip passes a sensitivity test when an output signal of the wireless transceiver chip includes a square wave signal with a specific frequency;
the second determining module 510 is configured to determine that the wireless transceiver chip fails the sensitivity test when the output signal of the wireless transceiver chip does not include a square wave signal with a specific frequency.
Optionally, in this embodiment, the rf vector signal source is an electronic measurement instrument used in the field of electronic and communication technologies, and can output an interference-free modulated rf signal. The power divider, also called power divider, is a device that divides one path of input signal energy into two or more paths to output equal or unequal energy. The wireless transceiver chip parallel test pincard is used for testing the sensitivity of the wireless transceiver chip.
Optionally, in this embodiment, the radio frequency vector signal source is connected to the one-to-many power divider through a coaxial cable, the other end of the one-to-many power divider is connected to one interface on the wireless transceiver chip parallel test pin, each interface at the other end of the wireless transceiver chip parallel test pin is connected to one wireless transceiver chip to be tested, an interference-free test modulation radio frequency signal is generated by the radio frequency vector signal source, the signal is sent to the one-to-many power divider with a specific frequency communication number rate, the signal is divided into multiple paths of test radio frequency signals, each path of test radio frequency signal in the multiple paths of test radio frequency signals provides a test radio frequency signal for the wireless transceiver chip to be tested, if the output signal of the wireless transceiver chip to be tested contains a square wave signal with a specific frequency, that is, the test machine can read out the signal with the specific frequency, the test result is passed, and if the output signal of the wireless transceiver chip to be tested does not contain the square wave signal with the specific frequency, that is, the test machine cannot read out the signal with the specific frequency, the test result is not passed.
Optionally, in this embodiment, because in the above method, a specific interference-free test modulated radio frequency signal is generated by using a radio frequency vector signal source, a plurality of paths of test modulated radio frequency signals are equally divided by a power divider with one division to a plurality of paths, and then the test modulated radio frequency signals are sent to an interface of a parallel test pincard of a wireless transceiver chip through a coaxial cable to provide test radio frequency signals for the wireless transceiver chip to be tested, if an output signal of the wireless transceiver chip to be tested includes a square wave signal with a specific frequency, a sensitivity test is passed, and if the output signal of the wireless transceiver chip to be tested does not include the square wave signal with the specific frequency, the sensitivity test is not passed. Therefore, the purposes of reducing the testing time of a single wireless transceiver chip and reducing the production cost are achieved, and the technical problems that a plurality of wireless transceiver chips cannot simultaneously test the sensitivity in parallel, the testing time is long and the testing cost is high are solved.
As an alternative example, the output module includes:
the first processing unit is used for outputting a test modulation radio frequency signal with amplitude as a first value, communication number rate as a second value and frequency deviation as a third value by a radio frequency vector signal source, wherein the first value is the sum of chip sensitivity of a wireless transceiver chip, a target attenuation value and a margin value, the target attenuation value is the maximum value in an attenuation value group of the test device, and the margin value is a preset parameter.
Optionally, in this embodiment, the first value is a sum of a chip sensitivity of the wireless transceiver chip, a target attenuation value and a margin value, the chip sensitivity of the wireless transceiver chip is a sensitivity to be tested, the target attenuation value is a maximum value in an attenuation value set obtained by calibrating the test device, and the margin value is a margin required to be given for production consistency, for example, the chip sensitivity of the wireless transceiver chip is-111 dBm, the target attenuation value obtained by calibrating the test device is 19.7dBm, the margin value is 1.3dBm, the first value is-90 dBm, the second value is 20Kbps, the third value is 20kHz, the amplitude of the test modulated radio frequency signal output by the radio frequency vector signal source is-90 dBm, the communication number rate is 20Kbps, and the frequency offset is 20 kHz.
As an optional example, the apparatus further includes:
a third determination module for determining a set of attenuation values for the test device from the first set of attenuation values, the second set of attenuation values, and the first attenuation values;
a fourth determining module for determining a maximum value of the set of attenuation values as the target attenuation value.
Optionally, in this embodiment, the target attenuation value is a maximum value in an attenuation value group obtained by calibrating the testing device, the attenuation value group is determined by the first attenuation value group, the second attenuation value group, and the first attenuation value, the number of data in the first attenuation value group and the second attenuation value group is determined by the power divider, and if the power divider is a 1-to-8 power divider, the number of data in the first attenuation value group and the second attenuation value group is 8.
As an optional example, the third determining module comprises:
the first output unit is used for outputting a first modulation radio frequency signal with an amplitude value of zero by the radio frequency vector signal source;
a first sending unit, configured to send the first modulated radio frequency signal to a target power divider, where the target power divider divides the first modulated radio frequency signal into multiple first radio frequency signals;
and the first recording unit is used for connecting each path of first radio-frequency signal in the multiple paths of first radio-frequency signals with a frequency spectrograph and recording the first attenuation value group of the testing device.
Optionally, in this embodiment, the spectrum analyzer is an apparatus for studying a spectrum structure of the electrical signal, and is configured to measure a distortion degree, a modulation degree, and a spectrum purity of the signal. The method comprises the steps that a radio frequency vector signal source is connected with a one-branch multi-target power divider through a coaxial cable, the other end of the one-branch multi-target power divider is connected with a frequency spectrograph, a first modulation radio frequency signal with a zero amplitude value is generated through the radio frequency vector signal source, the signal is sent to the one-branch multi-target power divider, the signal is divided into multi-path modulation radio frequency signals, each path of modulation radio frequency signals in the multi-path modulation radio frequency signals provides modulation radio frequency signals for the frequency spectrograph, a first attenuation value group of a testing device is recorded, if the one-branch multi-target power divider is a 1-branch 8 power divider, the first attenuation value group is recorded as eight groups of data, for example, the first attenuation value group of the testing device is recorded as X1=14.2dBm, X2=14.0dBm, X3=13.9dBm, X4=14.2dBm, X5=14.3dBm, X6=14.1dBm, X7=14.5dBm, and X8=13.8 dBm.
As an optional example, the third determining module comprises:
the second output unit is used for outputting a second modulation radio frequency signal with an amplitude value of zero by the radio frequency vector signal source;
and the second recording unit is used for sending the second modulated radio frequency signal to the frequency spectrograph and recording the first attenuation value of the testing device.
Optionally, in this embodiment, the rf vector signal source is connected to the spectrometer through a coaxial cable, and the rf vector signal source generates a second modulated rf signal with an amplitude value of zero, which provides the modulated rf signal to the spectrometer, and records a first attenuation value of the testing apparatus, for example, the first attenuation value of the testing apparatus is Y1=4 dBm.
As an optional example, the third determining module comprises:
the third output unit is used for outputting a third modulation radio frequency signal with an amplitude value of zero by the radio frequency vector signal source;
a second sending unit, configured to send the third modulated radio frequency signal to a target power divider, where the target power divider divides the third modulated radio frequency signal into multiple third radio frequency signals;
the second processing unit is used for connecting each path of third radio frequency signal in the multiple paths of third radio frequency signals with the frequency spectrograph;
and the third recording unit is used for connecting the frequency spectrograph and one interface on the wireless transceiver chip parallel test pin card and recording the second attenuation value group of the test device.
Optionally, in this embodiment, the radio frequency vector signal source is connected to the one-branch multi-target power divider through a coaxial cable, the other end of the one-branch multi-target power divider is connected to the spectrometer, the other end of the spectrometer is connected to an interface on the wireless transceiver chip parallel test pin, a third modulated radio frequency signal with zero amplitude value is generated by the radio frequency vector signal source, the third modulated radio frequency signal is sent to the one-branch multi-target power divider, the signal is divided into multiple modulated radio frequency signals, each of the multiple modulated radio frequency signals provides a modulated radio frequency signal to the wireless transceiver chip parallel test pin through the spectrometer, a second attenuation value set of the test apparatus is recorded, if the one-branch multi-target power divider is a 1-branch 8 power divider, the second attenuation value set is recorded as eight sets, for example, the second attenuation value set of the test apparatus is recorded as W1=8.8dBm, W2=9.1dBm, w3=8.9dBm, W4=9.4dBm, W5=9.3dBm, W6=8.7dBm, W7=9.2dBm, W8=8.9 dBm.
As an optional example, the third determining module comprises:
the obtaining unit is used for obtaining the difference value between each value in the second attenuation value group and the first attenuation value to obtain a middle attenuation value group;
and the calculating unit is used for summing each value in the intermediate attenuation value group and each corresponding value in the first attenuation value group to obtain the attenuation value group of the testing device.
Optionally, in this embodiment, a difference between each value in the second attenuation value set and the first attenuation value is obtained, so as to obtain an intermediate attenuation value set, for example, the intermediate attenuation value set is obtained as Z1= W1-Y1=8.8dBm-4dBm =4.4dBm, and so on, as Z2=5.1dBm, Z3=4.9dBm, Z4=5.4dBm, Z5=5.3dBm, Z6=4.7dBm, Z7=5.2dBm, Z8=4.9dBm, and each value in the intermediate attenuation value set is summed with a corresponding value in each of the first attenuation value set, so as to obtain an attenuation value set of the test apparatus, as ATT1= X1+ Z1=14.2+4.8=19dBm, so as to obtain ATT2=19.1dBm, ATT3=18.8dBm, ATT = 19.19 dBm = 19.8 dBm, and so on.
As an alternative example, the acquiring unit includes:
the processing subunit is used for taking each value in the second attenuation value group as a current value, and taking the difference value between the current value and the first attenuation value as a value in the middle attenuation value group under the condition that the wireless transceiving chip is a single-ended input signal;
and the calculating subunit is used for acquiring the difference value between the current value and the first attenuation value under the condition that the wireless transceiving chip is a differential input signal, summing the difference value and the differential value, and taking the sum as the value in the intermediate attenuation value group.
Optionally, in this embodiment, each value in the second attenuation value set is used as a current value, and if the wireless transceiver chip to be tested is a single-ended input signal, a difference between the current value and the first attenuation value is used as a value in an intermediate attenuation value set, for example, a value z1-z 8. If the wireless transceiver chip to be tested is a differential input signal, the difference value is summed with the differential value, the sum is used as a value in the intermediate attenuation value group, the differential value is a preset value, which may be 3, the differential intermediate attenuation value group is obtained as Z1= Z1+3=7.4dBm, and by analogy, Z2=8.1dBm, Z3=7.9dBm, Z4=8.4dBm, Z5=8.3dBm, Z6=7.7dBm, Z7=8.2dBm, and Z8=8.9 dBm.
For other examples of this embodiment, please refer to the above examples, which are not described herein.
Fig. 6 is a block diagram of an alternative electronic device according to an embodiment of the present invention, as shown in fig. 6, including a processor 602, a communication interface 604, a memory 606, and a communication bus 608, where the processor 602, the communication interface 604, and the memory 606 communicate with each other through the communication bus 608, where,
a memory 606 for storing computer programs;
the processor 602, when executing the computer program stored in the memory 606, implements the following steps:
outputting a test modulation radio frequency signal by a radio frequency vector signal source;
sending the test modulation radio frequency signal to a target power divider, and dividing the test modulation radio frequency signal into multiple paths of test radio frequency signals by the target power divider;
each path of test radio frequency signal in the multi-path test radio frequency signals is connected with one interface on the wireless transceiving chip parallel test pin card, wherein each interface is connected with one wireless transceiving chip to be tested;
determining that the wireless transceiver chip passes a sensitivity test under the condition that an output signal of the wireless transceiver chip contains a square wave signal with a specific frequency;
and under the condition that the output signal of the wireless transceiver chip does not contain the square wave signal with the specific frequency, determining that the wireless transceiver chip does not pass the sensitivity test.
Alternatively, in this embodiment, the communication bus may be a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The communication bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is shown in FIG. 6, but that does not indicate only one bus or one type of bus. The communication interface is used for communication between the electronic equipment and other equipment.
The memory may include RAM, and may also include non-volatile memory (non-volatile memory), such as at least one disk memory. Alternatively, the memory may be at least one memory device located remotely from the processor.
As an example, the memory 606 may include, but is not limited to, the output module 502, the transmitting module 504, the processing module 506, the first determining module, and the second determining module 510 of the wireless transceiver chip sensitivity testing apparatus. In addition, the module may further include, but is not limited to, other module units in the processing apparatus of the request, which is not described in this example again.
The processor may be a general-purpose processor, and may include but is not limited to: a CPU (Central Processing Unit), an NP (Network Processor), and the like; but also a DSP (Digital Signal Processing), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array) or other Programmable logic device, discrete Gate or transistor logic device, discrete hardware component.
Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments, and this embodiment is not described herein again.
It can be understood by those skilled in the art that the structure shown in fig. 6 is only an illustration, and the device implementing the method for testing the sensitivity of the wireless transceiver chip may be a terminal device, and the terminal device may be a terminal device such as a smart phone (e.g., an Android phone, an iOS phone, etc.), a tablet computer, a palm computer, a Mobile Internet Device (MID), a PAD, and the like. Fig. 6 is a diagram illustrating a structure of the electronic device. For example, the electronic device may also include more or fewer components (e.g., network interfaces, display devices, etc.) than shown in FIG. 6, or have a different configuration than shown in FIG. 6.
Those skilled in the art will appreciate that all or part of the steps in the methods of the above embodiments may be implemented by a program instructing hardware associated with the terminal device, where the program may be stored in a computer-readable storage medium, and the storage medium may include: flash disk, ROM, RAM, magnetic or optical disk, and the like.
According to still another aspect of the embodiments of the present invention, there is also provided a computer-readable storage medium, in which a computer program is stored, wherein the computer program is executed by a processor to perform the steps of the method for testing the sensitivity of the wireless transceiver chip.
Alternatively, in this embodiment, a person skilled in the art may understand that all or part of the steps in the methods of the foregoing embodiments may be implemented by a program instructing hardware associated with the terminal device, where the program may be stored in a computer-readable storage medium, and the storage medium may include: flash disks, Read-Only memories (ROMs), Random Access Memories (RAMs), magnetic or optical disks, and the like.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
The integrated unit in the above embodiments, if implemented in the form of a software functional unit and sold or used as a separate product, may be stored in the above computer-readable storage medium. Based on such understanding, the technical solution of the present invention may be essentially or partially contributed by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes several instructions for causing one or more computer devices (which may be personal computers, servers, or network devices, etc.) to execute all or part of the steps of the method according to the embodiments of the present invention.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the several embodiments provided in the present application, it should be understood that the disclosed client may be implemented in other manners. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one type of division of logical functions, and there may be other divisions when actually implemented, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, units or modules, and may be in an electrical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.