CN114512062B

CN114512062B - Light-emitting module, driving method thereof and display device

Info

Publication number: CN114512062B
Application number: CN202011177680.6A
Authority: CN
Inventors: 董小乔; 韩锐; 王晓霞; 齐琪; 于洁; 李蒙; 王遥遥; 王春华; 赵铁磊; 李鹏涛
Original assignee: BOE Technology Group Co Ltd; Beijing BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Beijing BOE Optoelectronics Technology Co Ltd
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2023-09-12
Anticipated expiration: 2040-10-28
Also published as: US20220130892A1; CN114512062A; US11664408B2

Abstract

The invention provides a light emitting module, a driving method thereof and a display device, and relates to the technical field of display. According to the invention, the light-emitting substrate and the driving module are arranged in the light-emitting module, the light-emitting substrate comprises M rows and N columns of light-emitting areas, and each light-emitting area comprises a plurality of light-emitting devices connected in series; the driving module comprises at least one driving chip, each driving chip comprises a plurality of first pins and a plurality of second pins, each first pin is connected with a first end of a corresponding light-emitting area, each second pin is connected with a second end of a corresponding light-emitting area, and the total number of the second pins in the driving module is an integer multiple of N. The number of rows and columns of the luminous areas divided in the luminous substrate is reasonably set, so that the total number of the second pins in the driving module is an integral multiple of the number of columns of the luminous areas, the second pins of each driving chip can be connected with the luminous areas, the utilization rate of the pins of the driving chip is improved, and the number of the driving chips is reduced.

Description

Light-emitting module, driving method thereof and display device

Technical Field

The present invention relates to the field of display technologies, and in particular, to a light emitting module, a driving method thereof, and a display device.

Background

With the development of display technology, in order to improve the contrast of a display device, a light emitting substrate including a light emitting device may be used as a backlight source of a display panel, and in a display process of the display panel, the light emitting device in the light emitting substrate is controlled in a partition manner to control the light emitting brightness of the light emitting device in each light emitting area, so as to improve the display contrast of the display panel and improve the display image quality.

Currently, in order to drive the light emitting devices in the respective light emitting regions to emit light, a driving chip is required to provide a driving signal required to drive the light emitting devices to emit light. However, in the current light emitting module, the number of driving chips for driving the light emitting device to emit light is large, resulting in high cost of the light emitting module.

Disclosure of Invention

The invention provides a light-emitting module, a driving method thereof and a display device, which are used for solving the problem that the cost of the light-emitting module is high due to the fact that the number of driving chips for driving a light-emitting device to emit light is large in the existing light-emitting module.

In order to solve the above problems, the present invention discloses a light emitting module, comprising a light emitting substrate and a driving module;

the light-emitting substrate comprises M rows and N columns of light-emitting areas, and each light-emitting area comprises a plurality of light-emitting devices connected in series; the first end of each light-emitting area is the positive electrode of the first light-emitting device in the light-emitting areas, and the second end of each light-emitting area is the negative electrode of the last light-emitting device in the light-emitting areas; the M and the N are positive integers greater than 1;

The driving module comprises at least one driving chip, and each driving chip comprises a plurality of first pins and a plurality of second pins; each first pin is connected with a first end of a corresponding light-emitting area, and each second pin is connected with a second end of a corresponding light-emitting area;

the total number of the second pins in the driving module is an integer multiple of the N.

Optionally, each first pin is connected to a first end of a part or all of the light emitting areas in a corresponding row, and each first pin corresponds to at least one row of the light emitting areas;

each second pin is connected with the second end of part or all of the light-emitting areas in the corresponding column, and each second pin corresponds to one column of the light-emitting areas.

Optionally, the M is an integer multiple of the number of the first pins included in each driving chip.

Optionally, the number of the first pins included in each driving chip is greater than or equal to M/8, and the product of the number of the first pins and the number of the second pins included in each driving chip is greater than or equal to (mxn)/8.

Optionally, the number of the driving chips included in the driving module is 2; the number of the first pins included in each driving chip is M/2, and the number of the second pins included in each driving chip is 2N;

each first pin is connected with the first ends of all the light-emitting areas in the corresponding two adjacent rows; each column of the light emitting areas is divided into two groups, the second ends of the light emitting areas positioned in the same group are connected with the same second pins, and the second pins connected with the two groups of light emitting areas are different.

Optionally, the number of the driving chips included in the driving module is 4; the number of the first pins included in each driving chip is M/2, and the number of the second pins included in each driving chip is N;

each first pin is connected with the first ends of all the light-emitting areas in the corresponding row; each column of the light emitting areas is divided into two groups, the second ends of the light emitting areas positioned in the same group are connected with the same second pins, and the second pins connected with the two groups of light emitting areas are different.

Optionally, the plurality of second pins included in each driving chip are divided into at least two types, the second pins of different types are connected in series, and a second end of the light emitting region is connected with any one of the second pins connected in series.

Optionally, the driving module further comprises a boosting sub-module and a depressurization sub-module;

the boosting submodule is respectively connected with an external power supply input end and the driving chip and is configured to boost external power supply voltage provided by the external power supply input end to obtain driving voltage so as to provide the driving voltage for the light emitting devices in the light emitting area through the driving chip;

the voltage reduction submodule is respectively connected with the external power supply input end and the driving chip, and is configured to reduce the external power supply voltage provided by the external power supply input end to obtain working voltage, and provide the working voltage for the driving chip so that the driving chip is in a working state.

Optionally, the driving module further comprises a control sub-module;

the control submodule is respectively connected with the time sequence controller and the driving chip and is configured to control the driving chip to provide the driving voltage and driving current signals for the corresponding light emitting devices in the light emitting area according to the control signals sent by the time sequence controller;

The voltage reduction submodule is also connected with the control submodule and is configured to provide the working voltage for the control submodule so as to enable the control submodule to be in a working state.

Optionally, the light-emitting substrate includes a glass substrate, an electrode connection line disposed on the glass substrate, and the light-emitting device connected to the electrode connection line; the electrode connecting wire is also connected with the driving chip.

Alternatively, the light emitting device is a Mini LED (Mini Light Emitting Diode ) device or a Micro LED (Micro light emitting diode) device.

In order to solve the above problems, the present invention also discloses a driving method of a light emitting module, which is applied to driving the light emitting module, and the method includes:

determining pixel data of pixel units in the display partition corresponding to each light-emitting area;

and sending a control signal to the driving chip according to the pixel data so as to control whether the light emitting device in each light emitting area emits light and the light emitting brightness.

In order to solve the problems, the invention also discloses a display device which comprises the light-emitting module.

Optionally, the display device further includes a display panel and a timing controller, where the display panel is located on a light emitting side of the light emitting module;

The time schedule controller is respectively connected with the display panel and the light-emitting module.

Compared with the prior art, the invention has the following advantages:

the light-emitting module is provided with a light-emitting substrate and a driving module, wherein the light-emitting substrate comprises M rows and N columns of light-emitting areas, each light-emitting area comprises a plurality of light-emitting devices connected in series, the first end of each light-emitting area is the positive electrode of the first light-emitting device in the light-emitting area, and the second end of each light-emitting area is the negative electrode of the last light-emitting device in the light-emitting area; the driving module comprises at least one driving chip, each driving chip comprises a plurality of first pins and a plurality of second pins, each first pin is connected with a first end of a corresponding light-emitting area, each second pin is connected with a second end of a corresponding light-emitting area, and the total number of the second pins in the driving module is an integer multiple of N. Through rationally setting up the row column number of the luminous region of dividing in the luminous base plate for the total number of second pin in the drive module is the integer multiple of the column number of luminous region, thereby guarantees that every drive chip's second pin can all be connected with luminous region, guarantees that every drive chip's second pin is in the state of using promptly, and does not have the second pin that is in idle state, consequently, can improve drive chip's pin utilization ratio, and when drive chip's pin utilization ratio improves, drive chip's in the drive module quantity can correspondingly reduce, thereby reduced the cost of luminous module.

Drawings

FIG. 1 is a schematic diagram of a related light emitting module;

FIG. 2 is a schematic circuit diagram of a light emitting module according to an embodiment of the invention;

FIG. 3 is a schematic circuit diagram of another light emitting module according to an embodiment of the invention;

fig. 4 is a schematic view showing the structure of a light emitting device in one light emitting region of an embodiment of the present invention;

fig. 5 shows a circuit configuration diagram of a display device according to an embodiment of the present invention;

fig. 6 is a flowchart illustrating a driving method of a light emitting module according to an embodiment of the invention.

Detailed Description

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.

As shown in fig. 1, in the related art, the number of rows of the light emitting areas divided in the light emitting substrate is 15, the number of columns of the light emitting areas divided in the light emitting substrate is 40, and the number of the first pins MUX included in each driving chip is 5, and the number of the second pins CH included in each driving chip is 16, i.e., the specification of each driving chip is 5MUX &16CH. Therefore, 9 driving chips are required to be provided to drive each light emitting region in the light emitting substrate to emit light, and the 9 driving chips are respectively the driving chip 1, the driving chip 2, the driving chip 3, the driving chip 4, the driving chip 5, the driving chip 6, the driving chip 7, the driving chip 8, and the driving chip 9.

The driving chip 1 comprises 5 first pin MUXs, the driving chip 2 comprises 5 first pin MUXs and the driving chip 3 comprises 5 first pin MUXs, and the driving chip 1 and the driving chip 3 are respectively connected with the luminous areas of the 1 st row to the 5 th row; the driving chip 4 comprises 5 first pin MUXs, the driving chip 5 comprises 5 first pin MUXs and the driving chip 6 comprises 5 first pin MUXs, and the driving chip is respectively connected with the light-emitting areas from the 6 th row to the 10 th row; the 5 first pin muxes included in the driving chip 7, the 5 first pin muxes included in the driving chip 8, and the 5 first pin muxes included in the driving chip 9 are respectively connected with the light emitting regions of the 11 th to 15 th rows.

14 second pins CH out of 16 second pins CH included in the driving chip 1, 14 second pins CH out of 16 second pins CH included in the driving chip 4, and 14 second pins CH out of 16 second pins CH included in the driving chip 7 are connected to the light emitting regions of the 1 st to 14 th columns, respectively; 13 second pins CH out of 16 second pins CH included in the driving chip 2, 13 second pins CH out of 16 second pins CH included in the driving chip 5, and 13 second pins CH out of 16 second pins CH included in the driving chip 8 are respectively connected with the light emitting regions of the 15 th column to the 27 th column; 13 second pins CH out of 16 second pins CH included in the driving chip 3, 13 second pins CH out of 16 second pins CH included in the driving chip 6, and 13 second pins CH out of 16 second pins CH included in the driving chip 9 are connected to light emitting regions of the 28 th to 40 th columns, respectively.

It can be seen that 2 second pins CH of the driving chip 1, the driving chip 4 and the driving chip 7 are not connected to the light emitting region, i.e., 2 second pins CH of the driving chip 1, the driving chip 4 and the driving chip 7 are in an idle state; the driving chip 2, the driving chip 5, the driving chip 8, the driving chip 3, the driving chip 6 and the driving chip 9 have 3 second pins CH which are not connected with the light emitting area, i.e. the driving chip 2, the driving chip 5, the driving chip 8, the driving chip 3, the driving chip 6 and the driving chip 9 have 3 second pins CH in an idle state. That is, the pins of each driving chip are not fully utilized, so that 9 driving chips are needed to drive the 600 partitioned light emitting areas, the number of driving chips is large, and the cost of the light emitting module is high.

Therefore, the embodiment of the invention ensures that the total number of the second pins in the driving module is an integral multiple of the number of columns of the light-emitting areas by reasonably setting the number of rows and the number of columns of the light-emitting areas divided in the light-emitting substrate, thereby ensuring that the second pins of each driving chip can be connected with the light-emitting areas, namely ensuring that the second pins of each driving chip are in a use state and no second pins in an idle state exist.

Example 1

Referring to fig. 2, a schematic circuit diagram of a light emitting module according to an embodiment of the present invention is shown, and fig. 3 is a schematic circuit diagram of another light emitting module according to an embodiment of the present invention.

The embodiment of the invention provides a light-emitting module, which comprises a light-emitting substrate 21 and a driving module 22; the light emitting substrate 21 includes M rows and N columns of light emitting regions 211, each light emitting region 211 includes a plurality of light emitting devices connected in series, a first end of each light emitting region 211 is a positive electrode of a first light emitting device in the light emitting region 211, a second end of each light emitting region 211 is a negative electrode of a last light emitting device in the light emitting region 211, and M and N are positive integers greater than 1; the driving module 22 includes at least one driving chip 221, and each driving chip 221 includes a plurality of first pins and a plurality of second pins, wherein each first pin is connected with a first end of a corresponding respective light emitting region 211, and each second pin is connected with a second end of the corresponding respective light emitting region 211; wherein the total number of the second pins in the driving module 22 is an integer multiple of N.

In an actual product, the light emitting substrate 21 is divided into M rows and N columns according to the number of the first pins and the second pins of each driving chip 221, so that M rows and N columns of light emitting regions 211 are obtained, and each light emitting region 211 includes a plurality of light emitting devices connected in series.

As shown in fig. 4, each light emitting region 211 includes 4 light emitting devices, which are a light emitting device D1, a light emitting device D2, a light emitting device D3, and a light emitting device D4, respectively, the anode of the light emitting device D1, that is, the first end of the light emitting region 211, the cathode of the light emitting device D1 is connected with the anode of the light emitting device D2, the cathode of the light emitting device D2 is connected with the anode of the light emitting device D3, the cathode of the light emitting device D3 is connected with the anode of the light emitting device D4, and the cathode of the light emitting device D4, that is, the second end of the light emitting region 211.

Of course, the number of light emitting devices included in each light emitting region 211 is not limited to 4, but may be 3, 5, etc., which is not limited in the embodiment of the present invention.

And, the driving module 22 includes at least one driving chip 221, and each driving chip 221 includes a plurality of first pins and a plurality of second pins, wherein the first pins refer to pins of MUX1, MUX2 to MUX8 and the like in fig. 2 and 3, and the second pins refer to pins of CH1, CH2, CH3, CH4 to CH72 and the like in fig. 2 and 3.

The first pin of each driving chip 221 is used for providing driving voltage for the light emitting devices in the corresponding connected light emitting areas 211, so that the light emitting devices in the corresponding light emitting areas 211 are in an operating state; the second pin of each driving chip 221 is used for providing a driving current signal to the light emitting device in the corresponding connected respective light emitting region 211, the light emitting device in the corresponding respective light emitting region 211 is controlled to emit light according to the driving current signal, and the light emitting brightness of the light emitting device in each light emitting region 211 is related to the magnitude of the current output by the second pin of the corresponding connected driving chip 221.

When each light emitting region 211 includes 4 light emitting devices as shown in fig. 4, each first pin is connected to the positive electrode of the light emitting device D1 in the corresponding respective light emitting region 211, and each second pin is connected to the negative electrode of the light emitting device D4 in the corresponding respective light emitting region 211.

In an actual product, after the light-emitting substrate 21 is divided into M rows and N columns of light-emitting areas 211, the total number of the driving chips 221 in the driving module 22 is determined according to the number N of columns of the light-emitting areas 211 and the number of the second pins included in each driving chip 221, so that the total number of the second pins in the driving module 22 is an integer multiple of the number N of columns of the light-emitting areas 211. The total number of the second pins in the driving module 22 refers to the sum of the numbers of the second pins that all the driving chips 221 included in the driving module 22 have.

For example, if the light-emitting substrate 21 is divided into 16 rows and 36 columns to obtain 16 light-emitting regions 211, that is, M is 16, N is 36, and the number of the second pins included in each driving chip 221 is 72, the total number of the driving chips 221 in the driving module 22 is determined to be 2, so that the total number of the second pins in the driving module 22 is 4 times the number of columns N of the light-emitting regions 211.

By reasonably setting the row and column numbers of the light emitting areas 211 divided in the light emitting substrate 21, the total number of the second pins in the driving module 22 is an integer multiple of the number of columns of the light emitting areas 211, so that the second pins of each driving chip 221 can be connected with the light emitting areas 211, namely, the second pins of each driving chip 221 are in a use state, and the second pins in an idle state are not existed, therefore, the use rate of the pins of the driving chips 221 can be improved, and when the use rate of the pins of the driving chips 221 is improved, the number of the driving chips 221 in the driving module 22 can be correspondingly reduced, thereby reducing the cost of the light emitting module.

In the embodiment of the present invention, each first pin is connected to a first end of a part or all of the light emitting areas 211 in a corresponding row, and each first pin corresponds to at least one row of light emitting areas 211; each second lead is connected to a second end of a part or all of the light emitting regions 211 in the corresponding column, and each second lead corresponds to one column of the light emitting regions 211.

In an actual product, each first pin may be connected to a first end of all the light emitting areas 211 located in at least one row.

As shown in fig. 2, each first lead is connected to a first end of all the light emitting regions 211 in the corresponding adjacent two rows. The first pin MUX1 in the driving chip 1 is connected to the first ends of all the light emitting regions 211 in the 1 st and 2 nd rows, and the first pin MUX1 in the driving chip 2 is also connected to the first ends of all the light emitting regions 211 in the 1 st and 2 nd rows; the first pin MUX2 in the driving chip 1 is connected to the first ends of all the light emitting areas 211 in the 3 rd and 4 th rows, and the first pin MUX2 in the driving chip 2 is also connected to the first ends of all the light emitting areas 211 in the 3 rd and 4 th rows; similarly, the first pin MUX8 in the driving chip 1 is connected to the first ends of all the light emitting regions 211 in the 15 th and 16 th rows, and the first pin MUX8 in the driving chip 2 is also connected to the first ends of all the light emitting regions 211 in the 15 th and 16 th rows.

As shown in fig. 3, each first pin is connected to a first end of all the light emitting regions 211 in the corresponding row. The first pin MUX1 in the driving chip 1 is connected to the first ends of all the light emitting regions 211 in the 1 st row, and the first pin MUX1 in the driving chip 2 is also connected to the first ends of all the light emitting regions 211 in the 1 st row; the first pin MUX2 in the driving chip 1 is connected to the first ends of all the light emitting regions 211 in the 2 nd row, and the first pin MUX2 in the driving chip 2 is also connected to the first ends of all the light emitting regions 211 in the 2 nd row; similarly, the first pin MUX8 in the driving chip 1 is connected to the first end of all the light-emitting regions 211 in the 8 th row, and the first pin MUX8 in the driving chip 2 is also connected to the first end of all the light-emitting regions 211 in the 8 th row; the first pin MUX1 in the driving chip 3 is connected to the first ends of all the light emitting regions 211 in the 9 th row, and the first pin MUX1 in the driving chip 4 is also connected to the first ends of all the light emitting regions 211 in the 9 th row; similarly, the first pin MUX7 in the driving chip 3 is connected to the first end of all the light-emitting regions 211 in the 15 th row, and the first pin MUX7 in the driving chip 4 is also connected to the first end of all the light-emitting regions 211 in the 15 th row; the first pin MUX8 in the driving chip 3 is connected to the first end of all the light emitting regions 211 in the 16 th row, and the first pin MUX8 in the driving chip 4 is also connected to the first end of all the light emitting regions 211 in the 16 th row.

Of course, each first pin may also be connected to a first end of a portion of the light emitting region 211 in a corresponding row. For example, in fig. 2, the first pins MUX1 of the driving chip 1 may be connected to the light emitting regions 211 of the 1 st to 18 th columns in the 1 st row and to the first ends of the light emitting regions 211 of the 1 st to 18 th columns in the 2 nd row, respectively, while the first pins MUX1 of the driving chip 2 are connected to the light emitting regions 211 of the 19 st to 36 th columns in the 1 st row and to the first ends of the light emitting regions 211 of the 19 st to 36 th columns in the 2 nd row, respectively; in fig. 3, the first pin MUX1 of the driving chip 1 may be connected to the first ends of the light emitting regions 211 of the 1 st to 18 th columns in the 1 st row, and the first pin MUX1 of the driving chip 2 may be connected to the first ends of the light emitting regions 211 of the 19 th to 36 th columns in the 1 st row.

In an actual product, each second pin may be connected to a second end of a portion of the light emitting region 211 in a corresponding one of the columns.

As shown in fig. 2, each of the second pins is connected to a second end of the light emitting region 211 located in an odd or even row in a corresponding column. The second pin CH2 in the driving chip 1 is connected to the second end of the light emitting region 211 in the even row in the 1 st column, and since the second pin CH1 in the driving chip 1 and the second pin CH2 in the driving chip 1 are connected in series, the second pin CH1 in the driving chip 1 is also connected to the second end of the light emitting region 211 in the even row in the 1 st column through the second pin CH 2; the second pin CH4 in the driving chip 1 is connected to the second end of the light emitting region 211 in the odd row in the 1 st column, and since the second pin CH3 in the driving chip 1 and the second pin CH4 in the driving chip 1 are connected in series, the second pin CH3 in the driving chip 1 is also connected to the second end of the light emitting region 211 in the odd row in the 1 st column through the second pin CH 4; the second pin CH5 in the driving chip 1 is connected to the second end of the light emitting region 211 in the even row in the 2 nd column, and since the second pin CH5 in the driving chip 1 and the second pin CH6 in the driving chip 1 are connected in series, the second pin CH6 in the driving chip 1 is also connected to the second end of the light emitting region 211 in the even row in the 2 nd column; the second pin CH7 in the driving chip 1 is connected to the second end of the light emitting region 211 in the odd row in the 2 nd column, and since the second pin CH8 in the driving chip 1 and the second pin CH7 in the driving chip 1 are connected in series, the second pin CH8 in the driving chip 1 is also connected to the second end of the light emitting region 211 in the odd row in the 2 nd column; similarly, the second pin CH66 in the driving chip 2 is connected to the second end of the light emitting region 211 in the even row in the 35 th column, and since the second pin CH65 in the driving chip 2 and the second pin CH66 in the driving chip 2 are connected in series, the second pin CH65 in the driving chip 2 is also connected to the second end of the light emitting region 211 in the even row in the 35 th column through the second pin CH 66; the second pin CH68 in the driving chip 2 is connected to the second end of the light emitting region 211 located in the odd row in the 35 th column, and since the second pin CH67 in the driving chip 2 and the second pin CH68 in the driving chip 2 are connected in series, the second pin CH67 in the driving chip 2 is also connected to the second end of the light emitting region 211 located in the odd row in the 35 th column through the second pin CH 68; the second pin CH69 in the driving chip 2 is connected to the second end of the light emitting region 211 in the even row in the 36 th column, and since the second pin CH70 in the driving chip 2 and the second pin CH69 in the driving chip 2 are connected in series, the second pin CH70 in the driving chip 2 is also connected to the second end of the light emitting region 211 in the even row in the 36 th column through the second pin CH 69; the second pin CH71 in the driving chip 2 is connected to the second end of the light emitting region 211 in the 36 th column located in the odd row, and since the second pin CH72 in the driving chip 2 and the second pin CH71 in the driving chip 2 are connected in series, the second pin CH72 in the driving chip 2 is also connected to the second end of the light emitting region 211 in the 36 th column located in the odd row through the second pin CH 71.

As shown in fig. 3, each of the second pins is connected to the second end of the light emitting region 211 located in the 1 st to M/2 th rows in the corresponding one of the columns, or to the second end of the light emitting region 211 located in the M/2+1 th to M-th rows in the corresponding one of the columns. The second pin CH2 in the driving chip 1 is connected to the second end of the light emitting region 211 in the 1 st column located in the 1 st to 8 th rows, the second pin CH2 in the driving chip 1 and the second pin CH1 in the driving chip 1 are connected in series, and the second pin CH2 in the driving chip 3 is connected to the second end of the light emitting region 211 in the 1 st column located in the 9 th to 16 th rows, the second pin CH2 in the driving chip 3 and the second pin CH1 in the driving chip 3 are connected in series; the second pin CH4 in the driving chip 1 is connected to the second end of the light emitting region 211 in the 2 nd column located in the 1 st to 8 th rows, the second pin CH4 in the driving chip 1 and the second pin CH3 in the driving chip 1 are connected in series, and the second pin CH4 in the driving chip 3 is connected to the second end of the light emitting region 211 in the 2 nd column located in the 9 th to 16 th rows, the second pin CH4 in the driving chip 3 and the second pin CH3 in the driving chip 3 are connected in series; similarly, the second pin CH34 in the driving chip 2 is connected to the second end of the light emitting region 211 in the 35 th column from the 1 st row to the 8 th row, the second pin CH34 in the driving chip 2 is connected in series with the second pin CH33 in the driving chip 2, the second pin CH34 in the driving chip 4 is connected to the second end of the light emitting region 211 in the 35 th column from the 9 th row to the 16 th row, and the second pin CH34 in the driving chip 4 is connected in series with the second pin CH33 in the driving chip 4; the second pin CH36 in the driving chip 2 is connected to the second end of the light emitting region 211 in the 36 th column located in the 1 st to 8 th rows, the second pin CH36 in the driving chip 2 and the second pin CH35 in the driving chip 2 are connected in series, and the second pin CH36 in the driving chip 4 is connected to the second end of the light emitting region 211 in the 36 th column located in the 9 th to 16 th rows, and the second pin CH36 in the driving chip 4 and the second pin CH35 in the driving chip 4 are connected in series.

Of course, each second pin may be connected to the second ends of all the light emitting regions 211 in a corresponding one of the columns. For example, in fig. 3, the second pins CH2 in the driving chip 1 may be connected to the second ends of all the light emitting regions 211 in the 1 st column, and the second pins CH2 in the driving chip 3 may also be connected to the second ends of all the light emitting regions 211 in the 1 st column.

In the embodiment of the present invention, M is an integer multiple of the number of the first pins included in each driving chip 221.

That is, the number of rows M of the light emitting regions 211 divided by the light emitting substrate 21 is an integer multiple of the number of first pins included in each driving chip 221. For example, the number of lines M of the light emitting region 211 divided by the light emitting substrate 21 is 1, 2, 4, or 8 times the number of the first pins included in each driving chip 221, or the like.

By setting the number M of rows of the light emitting area 211 to be an integer multiple of the number of the first pins included in each driving chip 221, the first pins included in each driving chip 221 can be connected with the light emitting area 211, that is, the first pins of each driving chip 221 are guaranteed to be in a use state, and no idle first pins exist, so that the use rate of the pins of the driving chips 221 is further improved, and the number of the driving chips 221 in the driving module 22 is reduced.

Specifically, the number of the first pins included in each driving chip 221 is greater than or equal to M/8, and the product of the number of the first pins and the number of the second pins included in each driving chip 221 is greater than or equal to (mxn)/8.

Since M is an integer multiple of the number of the first pins included in each driving chip 221, and the number of the first pins included in each driving chip 221 is greater than or equal to M/8, the number of the first pins included in each driving chip 221 may be greater than or equal to M/8, and the number of the first pins included in each driving chip 221 may be less than or equal to M.

The number of the driving chips 221 in the driving module 22 of the embodiment of the present invention may be made smaller than or equal to 8 by setting the number of the first pins included in each driving chip 221 to be greater than or equal to M/8 and the product of the number of the first pins and the number of the second pins included in each driving chip 221 to be greater than or equal to (mxn)/8.

In an alternative embodiment of the present invention, as shown in fig. 2, the driving module 22 includes 2 driving chips 221; the number of the first pins included in each driving chip 221 is M/2, and the number of the second pins included in each driving chip 221 is 2N; wherein, each first pin is connected with the first ends of all the light-emitting areas 211 in the corresponding two adjacent rows; each column of light emitting regions 211 is divided into two groups, the second ends of the light emitting regions 211 located in the same group are connected with the same second pins, and the second pins connected with the two groups of light emitting regions 211 are different.

At this time, the number of rows M of the light emitting regions 211 divided by the light emitting substrate 21 is 2 times the number of the first pins included in each driving chip 221, and the total number of the second pins in the driving module 22 is 4 times the number of columns N of the light emitting regions 211.

For example, the light emitting substrate 21 includes 16 rows and 36 columns of light emitting regions 211, that is, M is 16, n is 36, and the number of first pins included in each driving chip 221 is 8, which are the first pins MUX1, the first pins MUX2 to the first pins MUX8, respectively, and the number of second pins included in each driving chip 221 is 72, which are the second pins CH1, CH2, CH3 to CH72, respectively.

In each column of the light emitting regions 211, the light emitting regions 211 located in the odd numbered rows are divided into one group, the light emitting regions 211 located in the even numbered rows are divided into another group, the second ends of the respective light emitting regions 211 located in the odd numbered rows are connected to the same second pins, for example, the second ends of the light emitting regions 211 located in the odd numbered rows in the 1 st column are connected to the second pins CH4 in the driving chip 1, and the second ends of the respective light emitting regions 211 located in the even numbered rows are connected to the same second pins, for example, the second ends of the light emitting regions 211 located in the even numbered rows in the 1 st column are connected to the second pins CH2 in the driving chip 1.

When the light emitting devices in the light emitting regions 211 of the 1 st row and the 1 st column are driven to emit light, the driving chip 1 and the driving chip 2 simultaneously provide the same driving voltage through the respective first pins MUX1, so that the light emitting devices in all the light emitting regions 211 of the 1 st row and the 2 nd row are in an operating state, at this time, the driving chip 1 provides a driving current signal to the light emitting regions 211 of the 1 st column and the odd row through the second pins CH4, and since only the light emitting regions 211 of the 1 st row in the light emitting regions 211 of the 1 st column and the odd row are in an operating state, the light emitting devices in the light emitting regions 211 of the 1 st row and the 1 st column can emit light.

In another alternative embodiment of the present invention, as shown in fig. 3, the driving module 22 includes 4 driving chips 221; the number of the first pins included in each driving chip 221 is M/2, and the number of the second pins included in each driving chip 221 is N; wherein each first pin is connected to a first end of all light emitting regions 211 in a corresponding row; each column of light emitting regions 211 is divided into two groups, the second ends of the light emitting regions 211 located in the same group are connected with the same second pins, and the second pins connected with the two groups of light emitting regions 211 are different.

For example, the light emitting substrate 21 includes 16 rows and 36 columns of light emitting regions 211, that is, M is 16, n is 36, and the number of first pins included in each driving chip 221 is 8, which are the first pins MUX1, the first pins MUX2 to the first pins MUX8, respectively, and the number of second pins included in each driving chip 221 is 36, which are the second pins CH1, CH2, CH3 to CH36, respectively.

In each column of the light emitting regions 211, the light emitting regions 211 located in the 1 st to M/2 th rows are divided into one group, the light emitting regions 211 located in the M/2+1 th to M rows are divided into another group, the second ends of the respective light emitting regions 211 located in the 1 st to M/2 th rows are connected to the same second pins, e.g., the second ends of the light emitting regions 211 located in the 1 st to 8 th rows in the 1 st column are connected to the second pins CH2 in the driving chip 1, and the second ends of the respective light emitting regions 211 located in the M/2+1 th to M rows are connected to the same second pins, e.g., the second ends of the light emitting regions 211 located in the 9 th to 16 th rows in the 1 st column are connected to the second pins CH2 in the driving chip 3.

As shown in fig. 2 and 3, the plurality of second pins included in each driving chip 221 are divided into at least two types, the second pins of different types are connected in series with each other, and the second end of the light emitting region 211 is connected to any one of the second pins connected in series.

The plurality of second pins included in each driving chip 221 are divided into categories related to a maximum current value required for the light emitting substrate 21 and a current limit value of each second pin of the driving chip 221. By connecting the different kinds of second pins in series with each other and connecting the second end of the light emitting region 211 with any one of the second pins in series, the current value of the driving current signal output by each of the second pins connected with the light emitting region 211 can be made smaller than the current limit value thereof.

Since the maximum current value required for each light emitting device is 2.35mA, the voltage value required is 6.15V, and one light emitting region 211 is obtained by connecting every 4 light emitting devices in series, the maximum current value required for each light emitting region 211 is 2.35mA, and the voltage value required is 24.6V. In fig. 2 and 3, when 8 first pins are connected to the light emitting region 211 for each driving chip 221, the maximum current value required for the light emitting substrate 21 is 2.35ma×8=18.8 mA, and the voltage value required for the light emitting substrate 21 is 24.6V.

The current limit value of each second pin in the driving chip 221 is 10mA, the voltage limit value of each first pin in the driving chip 221 is 27V, in order to ensure that the current limit value of the driving current signal outputted by each second pin connected to the light emitting region 211 is smaller than the current limit value thereof, the plurality of second pins included in each driving chip 221 are divided into two types, the second pins of different types are connected in series with each other, i.e., each two second pins are connected in series with each other, for example, the second pin CH1 and the second pin CH2 are connected in series, the second pin CH3 and the second pin CH4 are connected in series, and so on until the second pin CH71 and the second pin CH72 are connected in series, the second end of the light emitting region 211 is connected to any one of the second pins connected in series, so that the current limit value of the second pin connected to the light emitting region 211 reaches 20mA, and the maximum current value of the driving current signal required for each light emitting region 211 in the light emitting substrate 21 is 18.8mA, which is smaller than 20mA, the second pins of the driving chip 221 can support the input of the driving current signal to each light emitting region 211 in the light emitting substrate 21.

Of course, the number of the driving chips 221 included in the driving module 22 is not limited to 2 or 4, and the number of the driving chips 221 included in the driving module 22 may be 1, 3, 6, 8, or the like.

When the number of rows of the light emitting regions 211 divided by the light emitting substrate 21 is M and the number of columns is N, the number of driving chips 221 included in the driving module 22 may be 1, the number of first pins in the driving chips 221 is M, and the number of second pins in the driving chips 221 is 4N, and each first pin is connected to the first ends of all the light emitting regions 211 in the corresponding row.

For example, when the light emitting areas 211 divided by the light emitting substrate 21 are 16 rows and 36 columns, that is, M is 16, n is 36, the number of the driving chips 221 included in the driving module 22 may be 1, the number of the first pins in the driving chips 221 is 16, and the number of the second pins in the driving chips 221 is 144. Since each of the driving chips 221 has 16 first pins connected to the light emitting region 211, a maximum current value required for the light emitting substrate 21 is 2.35ma×16=37.6 mA, and a current limit value of each of the second pins in the driving chip 221 is 10mA, at this time, it is necessary to divide the plurality of second pins included in the driving chip 221 into four types, every four second pins are connected in series with each other so that the current limit value of the second pin connected to the light emitting region 211 reaches 40mA, at this time, the second end of each column of the light emitting region 211 is connected to any one of the second pins connected in series, and thus, the number of the second pins in the driving chip 221 is 36×4=144.

When the number of rows of the light emitting regions 211 divided by the light emitting substrate 21 is M and the number of columns is N, the number of driving chips 221 included in the driving module 22 may be 3, the number of first pins in each driving chip 221 is M/2, the number of second pins in each driving chip 221 is 4N/3, each first pin is connected to the first ends of all the light emitting regions 211 in the corresponding adjacent two rows, and each driving chip 221 is connected to the second ends of N/3 columns of the light emitting regions 211, that is, each driving chip 221 supports M rows and N/3 columns of the light emitting regions 211.

For example, when the light emitting areas 211 divided by the light emitting substrate 21 are 16 rows and 36 columns, that is, M is 16, n is 36, the number of the driving chips 221 included in the driving module 22 may be 3, the number of the first pins in each driving chip 221 is 8, and the number of the second pins in each driving chip 221 is 48. Since the current limiting value of each second pin in the driving chip 221 is 10mA, it is necessary that every two second pins are connected in series with each other so that the current limiting value of the second pin connected to the light emitting region 211 reaches 20mA, and since each first pin is connected to the first ends of all the light emitting regions 211 in the corresponding adjacent two rows, in order to achieve individual control of each light emitting region 211, each column of light emitting regions 211 is divided into two groups, the second ends of the light emitting regions 211 located in the same group are connected to the same second pin, and the second pins to which the two groups of light emitting regions 211 are connected are different. Each driving chip 221 is connected to the second ends of the 12 columns of light emitting areas 211, respectively, and thus the number of the second pins in each driving chip 221 is 12×2×2=48.

When the number of rows of the light emitting regions 211 divided by the light emitting substrate 21 is M and the number of columns is N, the number of driving chips 221 included in the driving module 22 may be 6, the number of first pins in each driving chip 221 is M/2, the number of second pins in each driving chip 221 is 2N/3, each first pin is connected to the first ends of all the light emitting regions 211 in the corresponding row, and each driving chip 221 is connected to the second ends of N/3 columns of the light emitting regions 211, that is, each driving chip 221 supports M/2 rows and N/3 columns of the light emitting regions 211.

For example, when the light emitting areas 211 divided by the light emitting substrate 21 are 16 rows and 36 columns, that is, M is 16, n is 36, the number of the driving chips 221 included in the driving module 22 may be 6, the number of the first pins in each driving chip 221 is 8, and the number of the second pins in each driving chip 221 is 24. Since the current limiting value of each second pin in the driving chip 221 is 10mA, it is necessary that every two second pins are connected in series with each other so that the current limiting value of the second pin connected to the light emitting region 211 reaches 20mA, and each driving chip 221 is connected to the second ends of the 12 columns of the light emitting regions 211, respectively, and thus the number of the second pins in each driving chip 221 is 12×2=24.

When the number of rows of the light emitting regions 211 divided by the light emitting substrate 21 is M and the number of columns is N, the number of driving chips 221 included in the driving module 22 may be 8, the number of first pins in each driving chip 221 is M/2, the number of second pins in each driving chip 221 is N/2, each first pin is connected to the first ends of all the light emitting regions 211 in the corresponding row, and each driving chip 221 is connected to the second ends of N/4 columns of the light emitting regions 211, that is, each driving chip 221 supports M/2 rows and N/4 columns of the light emitting regions 211.

For example, when the light emitting areas 211 divided by the light emitting substrate 21 are 16 rows and 36 columns, that is, M is 16, n is 36, the number of the driving chips 221 included in the driving module 22 may be 8, the number of the first pins in each driving chip 221 is 8, and the number of the second pins in each driving chip 221 is 18. Since the current limiting value of each second pin in the driving chip 221 is 10mA, it is necessary that every two second pins are connected in series with each other so that the current limiting value of the second pin connected to the light emitting region 211 reaches 20mA, and each driving chip 221 is connected to the second ends of the 9 columns of the light emitting regions 211, respectively, and thus the number of the second pins in each driving chip 221 is 9×2=18.

When the number of rows of the light emitting regions 211 divided by the light emitting substrate 21 is M and the number of columns is N, the number of driving chips 221 included in the driving module 22 may be 8, the number of first pins in each driving chip 221 is M/8, the number of second pins in each driving chip 221 is N, each first pin is connected to the first ends of all the light emitting regions 211 in the corresponding row, and each driving chip 221 is connected to the second ends of the N columns of the light emitting regions 211, that is, each driving chip 221 supports M/8 rows and N columns of the light emitting regions 211.

For example, when the light emitting areas 211 divided by the light emitting substrate 21 are 16 rows and 36 columns, that is, M is 16, n is 36, the number of the driving chips 221 included in the driving module 22 may be 8, the number of the first pins in each driving chip 221 is 2, and the number of the second pins in each driving chip 221 is 36. Since each driving chip 221 has 2 first pins connected to the light emitting areas 211, the maximum current value required for the light emitting substrate 21 is 2.35ma×2=4.7 mA, and the current limit value of each second pin in the driving chip 221 is 10mA, at this time, the second pins do not need to be connected in series, and each driving chip 221 is connected to the second ends of 36 columns of the light emitting areas 211, so the number of the second pins in each driving chip 221 is 36.

In summary, the embodiment of the invention can divide the light-emitting substrate 21 into 16 rows and 36 columns of light-emitting areas 211, that is, the light-emitting substrate 21 includes 576 light-emitting areas 211, and the number of the light-emitting areas 211 is not greatly reduced compared with the 600 divided light-emitting areas shown in fig. 1, but the number of the driving chips 221 for driving the 16 rows and 36 columns of light-emitting areas 211 to respectively emit light is less than or equal to 8, which is less than 9 corresponding to the driving chips in fig. 1. Therefore, the embodiment of the invention reduces the number of the driving chips 221 required by improving the use rate of the first pin and the second pin of each driving chip 221, thereby reducing the cost.

In the embodiment of the present invention, as shown in fig. 5, the driving module 22 further includes a boost submodule 222 and a buck submodule 223; a boosting sub-module 222 connected to the external power input terminal and the driving chip 221, respectively, and configured to boost an external power voltage provided from the external power input terminal to obtain a driving voltage, so as to provide the driving voltage to the light emitting devices in the light emitting region 211 through the driving chip 221; the voltage reducing sub-module 223 is connected to the external power input terminal and the driving chip 221, and is configured to reduce the external power voltage provided by the external power input terminal to obtain an operating voltage, and provide the operating voltage to the driving chip 221, so that the driving chip 221 is in an operating state.

The voltage value of the driving voltage obtained by the boosting sub-module 222 boosting the external power supply voltage of 12V provided by the external power supply input terminal is 25V, the driving voltage is provided to the driving chip 221 by the boosting sub-module 222, and the driving chip 221 provides the driving voltage to the light emitting devices in the corresponding light emitting region 211 according to the received control signal sent by the timing controller, so that the light emitting devices in the light emitting region 211 are in a working state.

And the voltage-reducing sub-module 223 reduces the external power supply voltage of 12V provided by the external power supply input terminal, the obtained voltage value of the working voltage is 3.3V, and the voltage-reducing sub-module 223 provides the working voltage to the driving chip 221, so that the driving chip 221 can work normally.

Further, the driving module 22 further includes a control sub-module 224; a control sub-module 224 connected to the timing controller and the driving chip 221, respectively, and configured to control the driving chip 221 to provide driving voltage and driving current signals to the light emitting devices in the corresponding light emitting region 211 according to the control signals transmitted from the timing controller; the voltage reducing sub-module 223 is further connected to the control sub-module 224 and configured to provide an operating voltage to the control sub-module 224 to place the control sub-module 224 in an operating state.

Specifically, a control sub-module 224 is disposed in the driving module 22, the timing controller sends a control signal to the control sub-module 224 in the driving module 22, and the control sub-module 224 controls the driving chip 221 to provide a driving voltage to the light emitting devices in the corresponding light emitting region 211 through the first pin according to the control signal, and controls the driving chip 221 to provide a driving current signal to the light emitting devices in the corresponding light emitting region 211 through the second pin, so that the light emitting devices in the corresponding light emitting region 211 emit light.

At this time, the step-down submodule 223 is further connected to the control submodule 224, and after the step-down submodule 223 steps down the external power supply voltage of 12V provided by the external power supply input end to obtain the working voltage of 3.3V, the working voltage is provided to the control submodule 224, so that the control submodule 224 can work normally.

Note that, the control sub-module 224 may not be provided in the driving module 22, and at this time, the timing controller directly provides a control signal to the driving chip 221, and the driving chip 221 provides a driving voltage and a driving current signal to the light emitting device in the corresponding light emitting region 211 according to the control signal.

In the embodiment of the present invention, the light emitting substrate 21 includes a glass substrate, electrode connection lines provided on the glass substrate, and a light emitting device connected to the electrode connection lines; the electrode connection lines are also connected to the driving chip 221.

While the conventional light emitting substrate adopts an FPC (Flexible Printed Circuit, printed circuit) substrate and a light emitting device is provided on the FPC substrate, the embodiment of the invention adopts a glass substrate and an electrode connection wire is provided on the glass substrate to connect the light emitting device and the electrode connection wire. Compared with the FPC substrate, the flatness of the glass substrate is higher, splicing is not needed, the manufacturing process precision is higher, the heat conductivity is higher, the heat dissipation performance is strong, the mass production with high precision and large size can be realized, and the cost is lower than that of the FPC substrate.

Manufacturing an electrode connecting wire on the glass substrate, wherein the electrode connecting wire can comprise an anode connecting wire and a cathode connecting wire, and the anode connecting wire and the cathode connecting wire are mutually insulated; the first end of each light emitting region 211 is connected to a positive electrode connection line, the second end of each light emitting region 211 is connected to a negative electrode connection line, and the positive electrode connection line and the negative electrode connection line in the light emitting substrate 21 are connected to the driving chip 221 through the FPC board 23. Specifically, the first end of each light emitting region 211 is connected to a first pin of the driving chip 221 through a positive connection line and the FPC board 23, and the second end of each light emitting region 211 is connected to a second pin of the driving chip 221 through a negative connection line and the FPC board 23.

In the embodiment of the invention, the light emitting device is a Mini LED device or a Micro LED device.

In actual products, the length of the Micro-LED device is less than 50 microns, preferably the Micro-LED device is 10 microns to 50 microns in length, the Mini-LED device is 50 microns to 150 microns in length, and preferably the Micro-LED device is 80 microns to 120 microns in length. When the light emitting device is a Mini LED device or a Micro LED device, since the Micro-LED device and the Mini-LED device have the characteristics of small size, high brightness, etc., the Mini LED device or the Micro LED device is adopted as the light emitting source in the light emitting substrate 21, the brightness provided by the light emitting device is higher, and the light emitting substrate is made thinner. Further, compared to general LEDs, the Mini LED device or Micro LED device has better heat dissipation performance, lower power consumption, and higher contrast ratio, so that the display device using the light emitting substrate has better image quality, while compared to OLED (Organic Electroluminescence Display, organic electroluminescent display), the Mini LED device or Micro LED device has longer lifetime and higher high temperature reliability, and therefore, the Mini LED device or Micro LED device is used as the light emitting source in the light emitting substrate 21, which can improve heat dissipation, contrast ratio, lifetime, and high temperature reliability of the light emitting substrate 21, and reduce power consumption.

In the embodiment of the invention, the number of rows and columns of the light-emitting areas divided in the light-emitting substrate is reasonably set, so that the total number of the second pins in the driving module is an integral multiple of the number of columns of the light-emitting areas, thereby ensuring that the second pins of each driving chip can be connected with the light-emitting areas, namely ensuring that the second pins of each driving chip are in a use state and no second pins in an idle state exist.

Example two

Referring to fig. 6, a flowchart of a driving method of a light emitting module according to an embodiment of the present invention is shown, and the method is applied to driving the light emitting module, and may specifically include the following steps:

in step 601, pixel data of pixel units in a display area corresponding to each light emitting area is determined.

In the embodiment of the present invention, after the light-emitting substrate 21 is subjected to area division to obtain M rows and N columns of light-emitting areas 211, the timing controller determines the display areas corresponding to each light-emitting area 211 in the display panel, and obtains the number of pixels of the pixel unit in each display area, such as the brightness data of the pixel unit.

Step 602, sending a control signal to the driving chip according to the pixel data to control whether the light emitting device in each light emitting area emits light and the light emitting brightness.

In the embodiment of the present invention, the timing controller generates a control signal according to the pixel data of the pixel unit in each display area, and sends the control signal to the driving chip 221, and the driving chip 221 controls whether the light emitting device in the corresponding light emitting area 211 emits light and the light emitting brightness according to the control signal.

When the luminance data of the pixel units in the display region corresponding to the light emitting region 211 is 0, the light emitting devices in the light emitting region 211 do not need to emit light, and the driving chip 221 does not provide a driving voltage and/or driving current signal to the light emitting region 211 according to the control signal; when the luminance data of the pixel units in the display region corresponding to the light emitting region 211 is not 0, the light emitting devices in the light emitting region 211 need to emit light, and the driving chip 221 supplies a driving voltage to the light emitting devices in the corresponding light emitting region 211 through the first pin and supplies a driving current signal to the light emitting devices in the corresponding light emitting region 211 through the second pin according to the control signal, so that the light emitting devices in the light emitting region 211 emit light.

And, the light emitting brightness of the light emitting device in the light emitting region 211 is related to the current value of the driving current signal outputted by the second pin of the corresponding connected driving chip 221, and the magnitude of the current value may be controlled by adjusting the duty ratio.

Therefore, when the luminance data of the pixel unit in the display section corresponding to the light emitting region 211 is higher, the current value of the driving current signal output by the second pin of the corresponding connected driving chip 221 is larger, so that the light emitting luminance of the light emitting device in the light emitting region 211 is higher; when the luminance data of the pixel unit in the display section corresponding to the light emitting region 211 is lower, the current value of the driving current signal output by the second pin of the corresponding connected driving chip 221 is smaller, so that the light emitting luminance of the light emitting device in the light emitting region 211 is lower.

Example III

The embodiment of the invention provides a display device, which comprises the light-emitting module.

The light emitting module includes a light emitting substrate 21, where the light emitting substrate 21 includes M rows and N columns of light emitting regions 211, and each light emitting region 211 includes a plurality of light emitting devices connected in series. In the actual use process, the light emitting devices in each light emitting area 211 in the light emitting substrate 21 can be directly used as display pixels of the display panel, and at this time, the light emitting substrate 21 can be used as the display panel, so that the light emitting module is used as a display device; the light-emitting substrate 21 may also be used as a direct-type backlight source of the display panel, for providing light to the display panel on the light-emitting side thereof, so as to further improve the contrast ratio of the display panel, and at this time, the light-emitting module is used as a backlight module corresponding to the display panel.

In addition, the specific description of the light emitting module may refer to the description in the foregoing exemplary embodiments, and will not be repeated here.

As shown in fig. 5, when the light emitting module of the embodiment of the invention is used as a backlight module corresponding to a display panel, the display device further includes a display panel 31 and a timing controller 32, where the display panel 31 is located at a light emitting side of the light emitting module; the timing controller 32 is connected to the display panel 31 and the light emitting module, respectively.

Specifically, the display panel 31 is located on the light emitting side of the light emitting substrate 21 in the light emitting module. When the driving module 22 does not include the control sub-module 224, the timing controller 32 is directly connected to all the driving chips 221 in the driving module 22, and at this time, the timing controller 32 directly sends control signals to all the driving chips 221, and the driving chips 221 provide driving voltage and driving current signals to the light emitting devices in the corresponding light emitting areas 211 according to the control signals; when the driving module 22 includes the control sub-module 224, the timing controller 32 is connected to the control sub-module 224, and the control sub-module 224 is connected to all the driving chips 221 in the driving module 22, at this time, the timing controller 32 sends a control signal to the control sub-module 224, and the control sub-module 224 controls the driving chips 221 to provide driving voltage and driving current signals to the light emitting devices in the corresponding light emitting areas 211 according to the control signal.

The control signals provided by the timing controller 32 to the light emitting module are an SPI (Serial Peripheral Interface ) signal, a VSYNC (Vertical Sync) signal, an EN (Enable) signal, etc.; the timing controller 32 provides the display panel 31 with LVDS (Low-Voltage Differential Signaling, low voltage differential signal).

The timing controller 32 controls the driving chip 221 in the light emitting module while driving the display panel 31 to display, and controls whether the light emitting devices in the corresponding light emitting areas 211 emit light and the light emitting brightness in real time according to the brightness degree of each display area in the display panel 31, so as to realize the HDR (High-Dynamic Range) function of the display device through the area dimming technology.

In addition, as shown in fig. 5, the display device further includes a voltage conversion module 33 and a power supply integration management circuit 34. The voltage conversion module 33 is used for converting the 12V external power supply voltage provided by the external power supply input terminal into VCC (Volt Current Condenser, power supply voltage) of 3.3V, and providing the VCC to the display panel 31 and the power supply integrated management circuit 34; the voltage conversion module 33 and the timing controller 32 may be provided on the same timing control board. The power integrated management circuit 34 is actually a PMIC (Power Management IC, power integrated management circuit) for supplying various required voltages, such as a VSP voltage, which is a positive voltage, and a VSN voltage, which is a negative voltage, to the display panel 31; the power integrated management circuit 34 may be provided on a circuit board, and the circuit board and the display panel 31 are connected through the FPC connection board 35.

In practical application, the display device of the embodiment of the invention can be an instrument, a rearview mirror and the like in a vehicle, at this time, the light emitting module is used as a backlight module of the display device, and the HDR function of the display device can be realized through the regional dimming technology, so that the picture of the display device has higher contrast, better color expressive force and clearer image quality, therefore, the display effect of the display device such as the instrument, the rearview mirror and the like in the vehicle is higher, and the driving safety can be improved in the environments such as night, tunnels and the like.

Of course, the display device of the embodiment of the invention can also be any product or component with display function, such as a mobile phone, a tablet computer, a display, a notebook computer, a navigator and the like.

For the foregoing method embodiments, for simplicity of explanation, the methodologies are shown as a series of acts, but one of ordinary skill in the art will appreciate that the present invention is not limited by the order of acts, as some steps may, in accordance with the present invention, occur in other orders or concurrently. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required for the present invention.

In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by differences from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.

Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.

The above description of the light emitting module, the driving method thereof and the display device provided by the invention applies specific examples to explain the principle and the implementation of the invention, and the description of the above examples is only used for helping to understand the method and the core idea of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.

Claims

1. The light-emitting module is characterized by comprising a light-emitting substrate and a driving module;

Wherein the total number of the second pins in the driving module is an integer multiple of the N;

the M is an integer multiple of the number of the first pins included in each driving chip;

the number of the first pins included in each driving chip is greater than or equal to M/8, and the product of the number of the first pins and the number of the second pins included in each driving chip is greater than or equal to (M multiplied by N)/8.

2. The light emitting module of claim 1, wherein each first pin is connected to a first end of a portion or all of the light emitting regions in a corresponding row, and each first pin corresponds to at least one row of the light emitting regions;

3. The light emitting module of claim 1, wherein the number of the driving chips included in the driving module is 2; the number of the first pins included in each driving chip is M/2, and the number of the second pins included in each driving chip is 2N;

4. The light emitting module of claim 1, wherein the number of the driving chips included in the driving module is 4; the number of the first pins included in each driving chip is M/2, and the number of the second pins included in each driving chip is N;

5. The light emitting module of claim 1, wherein the plurality of second pins included in each of the driving chips are divided into at least two types, the second pins of different types are connected in series with each other, and a second end of the light emitting region is connected to any one of the second pins connected in series.

6. The light emitting module of any one of claims 1-5, wherein the drive module further comprises a boost sub-module and a buck sub-module;

7. The lighting module of claim 6, wherein the driving module further comprises a control sub-module;

8. The light-emitting module according to claim 1, wherein the light-emitting substrate comprises a glass substrate, an electrode connection line provided on the glass substrate, and the light-emitting device connected to the electrode connection line; the electrode connecting wire is also connected with the driving chip.

9. The light emitting module of claim 1, wherein the light emitting device is a Mini LED device or a Micro LED device.

10. A driving method of a light emitting module, applied to drive the light emitting module according to any one of claims 1 to 9, the method comprising:

11. A display device comprising the light emitting module according to any one of claims 1 to 9.

12. The display device of claim 11, further comprising a display panel and a timing controller, the display panel being located on a light emitting side of the light emitting module;