CN114505478A - TiN-Ni gradient functional material and preparation method and application thereof - Google Patents
TiN-Ni gradient functional material and preparation method and application thereof Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 179
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 84
- 239000000919 ceramic Substances 0.000 claims abstract description 34
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 66
- 239000000843 powder Substances 0.000 claims description 62
- 238000005245 sintering Methods 0.000 claims description 42
- 238000005452 bending Methods 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 14
- 238000002490 spark plasma sintering Methods 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 11
- 238000004321 preservation Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 248
- 238000005520 cutting process Methods 0.000 description 86
- 229910052759 nickel Inorganic materials 0.000 description 75
- 235000012431 wafers Nutrition 0.000 description 58
- 239000012071 phase Substances 0.000 description 22
- 238000013001 point bending Methods 0.000 description 19
- 230000003647 oxidation Effects 0.000 description 18
- 238000007254 oxidation reaction Methods 0.000 description 18
- 239000002131 composite material Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 238000001035 drying Methods 0.000 description 9
- 238000000498 ball milling Methods 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000002609 medium Substances 0.000 description 6
- 239000002612 dispersion medium Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007873 sieving Methods 0.000 description 5
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 239000008204 material by function Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000000280 densification Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/16—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on nitrides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0068—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only nitrides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
- B22F2003/1051—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding by electric discharge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Abstract
The invention relates to a TiN-Ni gradient functional material and a preparation method and application thereof, wherein the TiN-Ni gradient functional material comprises the following components: a Ni matrix phase and a TiN ceramic phase distributed in the Ni matrix phase in a gradient way; the content of the TiN ceramic phase is less than or equal to 65wt%, and preferably 35-65 wt%.
Description
Technical Field
The invention relates to a TiN-Ni gradient functional material and a preparation method and application thereof, belonging to the field of titanium nitride enhanced nickel-based gradient functional materials.
Background
The titanium nitride reinforced nickel-based composite material (TiN-Ni composite material) has the comprehensive properties of high-temperature creep resistance and thermal vibration resistance of ceramic, high-temperature oxidation resistance and high thermal conductivity of metal and the like, so that the titanium nitride reinforced nickel-based composite material has unique properties different from pure ceramic and pure metal, and the reliability of the titanium nitride reinforced nickel-based composite material in the engineering application field is greatly improved. In addition, the TiN/Ni composite material combines the characteristics of metal and ceramic, has the advantages of high temperature resistance, oxidation resistance, corrosion resistance and the like, and is widely applied to the fields of aerospace, energy, industry and the like as a high-temperature structural material.
Although the TiN-Ni composite material has multiple advantages, the structure is single, and the TiN-Ni composite material can only be applied to a single environment and cannot be applied to a complex environment in most cases, such as the situation that the environments on the left side and the right side of the material are not consistent. For example, in the fields of energy and aviation, the working atmospheres on two sides of a device are different, one side is air, the other side is reducing atmosphere, and TiN-Ni with a single proportion can only be applied to a single environment and cannot meet the requirement of complex atmosphere environment. In addition, in order to obtain high oxidation resistance of the TiN-Ni composite material, the content of Ni must be increased to meet the requirement, and meanwhile, the thermal expansion coefficient is obviously increased, so that the excellent performances of low thermal expansion and high oxidation resistance cannot be obtained.
Disclosure of Invention
Aiming at the defects of the existing TiN-Ni composite material in terms of performance, the invention aims to provide a TiN-Ni gradient functional material which has high oxidation resistance and controllable thermal expansion coefficient and can be suitable for different environments, and a preparation method and application thereof.
In one aspect, the present invention further provides a TiN-Ni gradient functional material, comprising: a Ni matrix phase and a TiN ceramic phase distributed in the Ni matrix phase in a gradient way; the content of the TiN ceramic phase is less than or equal to 65wt%, and preferably 35-65 wt%.
In the disclosure, the TiN-Ni material is designed and prepared into TiN-Ni multilayer and gradient functional materials with different concentrations, so that the material with low thermal expansion and high oxidation resistance can be obtained, and the material can be preferably divided into an A/B/A symmetrical structure and an A/B/C asymmetrical structure according to the difference of the multilayer structure.
Preferably, the TiN-Ni gradient functional material has an A/B/A symmetrical structure; the content of the TiN ceramic phase in the A is more than that of the TiN ceramic phase in the B.
In the invention, the outer layer A adopts high oxidation resistant TiN-Ni powder (composite powder with high Ni phase content), and the intermediate layer B can adopt low expansion coefficient TiN-Ni powder (composite powder with high TiN ceramic phase content) so as to regulate and control the thermal expansion coefficient of the whole material, reduce cracks generated by thermal stress and improve mechanical properties.
In addition, preferably, the content of the TiN ceramic phase in the A is 35-45 wt%; the content of the TiN ceramic phase in the B is 45-55 wt%.
In addition, the content of B in the TiN-Ni gradient functional material is preferably 25 to 75wt%, and more preferably 30 to 60 wt%. In one embodiment of the invention, the mass ratio of the intermediate layer B in the integral gradient functional material A/B/A structure can be regulated and controlled, and the thermal expansion coefficient of the integral material can be controlled in a certain range, so that the TiN-Ni gradient functional material with high oxidation resistance and controllable thermal expansion coefficient is obtained.
Preferably, the TiN-Ni gradient functional material has an A/B/C asymmetric structure; the content of the TiN ceramic phase in the A is less than that of the TiN ceramic phase in the B and less than that of the TiN ceramic phase in the C.
In the invention, the outer layer A adopts high-oxidation-resistance TiN-Ni powder, the middle layer B can adopt low-expansion-coefficient TiN-Ni powder, or the outer layer C adopts lower-expansion-coefficient TiN-Ni powder, so that the thermal expansion coefficient of the whole material is regulated, cracks generated by thermal stress are reduced, the mechanical property is improved, the performances of two ends of the material are mainly improved, and the material can be suitable for the working environment with asymmetric atmosphere.
Preferably, the content of the TiN ceramic phase in the A is 35-45 wt%, the content of the TiN ceramic phase in the B is 45-55 wt%, and the content of the TiN ceramic phase in the C is 55-65 wt%.
In addition, the content of B in the TiN-Ni gradient functional material is preferably 25 to 75wt%, and more preferably 30 to 60 wt%. In one embodiment of the invention, the mass ratio of the intermediate layer B in the integral gradient functional material A/B/C structure can be regulated and controlled, and the thermal expansion coefficient of the integral material can be controlled in a certain range, so that the TiN-Ni gradient functional material with high oxidation resistance and controllable thermal expansion coefficient can be obtained, the performances of two ends of the material can be improved, and the TiN-Ni gradient functional material is suitable for a working environment with asymmetric atmosphere.
Preferably, the density of the TiN-Ni gradient functional material is 96-99%, the bending strength is 820-1150 MPa, and the thermal conductivity is 31-47W/m.K.
On the other hand, the invention also provides a preparation method of the TiN-Ni gradient functional material, which comprises the following steps:
weighing TiN powder and Ni powder with different mass ratios according to the composition of the TiN-Ni gradient functional material and mixing to obtain TiN-Ni powder with different components;
laying and compacting the obtained TiN-Ni powder with different components in layers to obtain a gradient green compact;
and sintering the obtained gradient green compact by discharge plasma to obtain the TiN-Ni gradient functional material.
In the present disclosure, the sintering process for the densification of the TiN-Ni gradient functional material by the present inventors is mainly a hot pressing sintering method (HP) or a spark plasma sintering method (SPS). The high sintering temperature and the long sintering time of the hot-pressing sintering method are not beneficial to the rapid molding of the layered material, and the excessive pressure can also influence the diffusion of liquid phase in the layering, so that the concentration gradient is not obvious. The sintering temperature of the spark plasma sintering method is low, the sintering time is short, the rapid densification of the layered material, particularly the conductive material is facilitated, the pressure is moderate, the material can be ensured to present a certain concentration gradient, the integral performance of the gradient functional material is not influenced, and the preparation requirement can be met.
Preferably, the grain size of the TiN powder is 0.5-2 mu m, and the purity is more than or equal to 99.9%; the particle size of the Ni powder is 1-3 mu m, and the purity is more than or equal to 99.9%.
Preferably, the process parameters of spark plasma sintering include: the sintering temperature is 1230-1300 ℃, and the heat preservation time is 10-15 min; sintering pressure is 35-40 MPa; the sintering atmosphere is vacuum, and the vacuum degree is less than or equal to 4.7 multiplied by 10-3Pa。
On the other hand, the invention also provides the application of the TiN-Ni gradient functional material in the aerospace field and the energy field.
Has the advantages that:
the TiN-Ni gradient functional material prepared by the invention has high density, adjustable thermal expansion coefficient, high-temperature oxidation resistance, high thermal conductivity and strength and various structures. The method is spark plasma sintering, and the excellent performances of oxidation resistance, mechanics, adjustable thermal expansion coefficient and the like are suitable for the fields of energy, aerospace and the like.
Drawings
FIG. 1 is a schematic diagram of A/B/A symmetrical structure of TiN-Ni gradient functional material;
FIG. 2 is a schematic diagram of A/B/C symmetrical structure of TiN-Ni gradient functional material;
FIG. 3 shows the thermal expansion coefficients of TiN-Ni gradient functional materials in different embodiments, and it can be seen from FIG. 3 that the thermal expansion coefficients are linear, and the thermal expansion coefficients of the composite material can be effectively controlled by controlling the phase ratios and contents of different layers.
Detailed Description
The present invention is further illustrated by the following examples, which are to be understood as merely illustrative and not restrictive.
In the present disclosure, a TiN-Ni gradient functional material includes a matrix Ni and a ceramic phase TiN. Wherein the content of the TiN ceramic phase is less than or equal to 65wt%, and preferably 40-65 wt%. The content of the Ni material is more than or equal to 35wt percent, and preferably 35 to 60wt percent. The TiN-Ni gradient functional material has the advantages of high oxidation resistance, high strength and thermal conductivity, capability of realizing double regulation and control of thermal expansion coefficients and the like. And the structure diversity can design different symmetrical structures and asymmetrical structures according to the actual working environment, can meet the performance requirements under various complex environments, and can be applied to the fields of aerospace, energy sources and the like.
In the method, the TiN-Ni material is prepared into a gradient structure, and the layered formula and the mass ratio are reasonably designed, so that the system at the two outer sides of the material can be effectively controlled, and the application of the material in different atmospheres is realized. In addition, the Ni content in the TiN-Ni powder for preparing the gradient functional material is more than or equal to 35wt percent, preferably 35 to 60wt percent; when the Ni content is lower than 35 wt%, technological parameters such as required sintering temperature, sintering pressure and the like can influence the layered bonding effect of the gradient functional material, cracking and the like can occur after sintering, and when the Ni content is higher than 60wt%, the metal content in the TiN-Ni powder is too high, severe diffusion can occur in the sintering process, so that concentration gradient cannot be formed, and the overall performance of the gradient functional material is influenced, so that the Ni content is preferably 35-60 wt% in consideration of comprehensive theoretical and experimental effects.
In one embodiment of the invention, the TiN-Ni gradient functional material has an A/B/A symmetric structure and an A/B/C asymmetric structure, and can meet the service requirements of complex environments with different environments and asymmetric material sides. The composite material has the advantages of high density, high thermal conductivity, high bending strength, high oxidation resistance, adjustable thermal expansion coefficient and the like, can meet the performance requirements of various complex environments, and also solves the problem that the TiN-Ni composite material has low thermal expansion and high oxidation resistance which are difficult to be shared.
Specifically, the TiN-Ni gradient functional material can be designed into an A/B/A symmetrical structure, such as a symmetrical structure of TiN/60 wt% Ni-TiN/48 wt% Ni-TiN/60 wt% Ni, the middle layer adopts low-expansion TiN/48 wt% Ni to bond high-expansion and high-oxidation-resistance TiN/60 wt% Ni at two sides, the problem that the mechanical property of the material is reduced due to thermal stress concentration caused by temperature change is favorably regulated, the thermal expansion coefficient of the whole material is favorably regulated by controlling the volume ratio of each layer, the high-oxidation-resistance performance is ensured at two end side faces of the work of the material, the whole material has low-expansion characteristics, and the requirement of a special complex environment is met.
Specifically, the TiN-Ni gradient functional material structure can also be designed into an A/B/C asymmetric structure, such as TiN/60 wt% Ni-TiN/48 wt% Ni-TiN/35 wt% Ni, the asymmetric structure is favorable for forming a concentration gradient, so that two working end faces of the material have different attributes, the material can adapt to a reducing atmosphere and an oxidizing atmosphere, the material can isolate different atmospheres in the energy field, such as a baffle plate of a cathode-anode material, and the material can also be used as a baffle plate of a sealing device in the aerospace field.
In the disclosure, the preparation method of the TiN-Ni gradient functional material comprises the following steps: preparing TiN-Ni powder and preparing a gradient green compact. Wherein, the raw material consists of TiN ceramic phase and Ni metal phase. Then the material is prepared by a discharge plasma sintering method. The following is an exemplary description of the preparation method of the TiN-Ni gradient functional material provided by the invention.
And (4) preparing TiN-Ni powder. TiN powder with the mass percent of 40-65 wt% and Ni powder with the mass percent of 35-60 wt% are used as raw materials, absolute ethyl alcohol is used as a dispersion medium, and the TiN-Ni powder with different Ni contents is obtained by ball milling and mixing, drying and sieving with a 100-mesh sieve. Wherein the solid content of the slurry of the TiN-Ni powder is more than or equal to 42wt percent, and preferably 42 to 47wt percent. The ball milling medium is WC balls, and the particle size is 3-6 mu m. The ball milling time is 3-6 hours. The TiN powder has a particle size of 0.5-2 μm and a purity of not less than 99.9%. The particle size of the Ni powder is 1-3 mu m, and the purity is more than or equal to 99.9%.
Selecting TiN-Ni powder with different Ni contents, and laying in layers to prepare a gradient green compact. The prepared TiN-Ni powder is laid in layers in a mould for spark plasma sintering, TiN-Ni powder with different Ni contents is laid, and the mass ratio and the formula of each layer are controlled to obtain gradient green compacts with different structures.
And (4) obtaining the TiN-Ni gradient functional material by adopting a discharge plasma sintering method for the gradient green body. And sintering the obtained gradient green body at high temperature in a vacuum atmosphere by a discharge plasma sintering method to obtain the TiN-Ni gradient functional materials with different structures. Wherein the temperature of the spark plasma sintering can be 1230-1300 ℃, and the heat preservation time is 10-15 min; the sintering pressure is 35-40 MPa. The sintering atmosphere is vacuum sintering, and the vacuum degree is less than or equal to 4.7 multiplied by 10-3Pa。
In one embodiment of the invention, the purpose of regulating the thermal expansion coefficient of the TiN-Ni gradient functional material can be achieved by controlling the mass ratio of each layered part (especially the intermediate layer B) of the gradient green body and regulating the formula (content of TiN ceramic phase) of TiN-Ni powder of each layered part, so that the average CTE is (10.2-12.5) × 10 in a temperature range of 20-1000 DEG C-6Controllable in the range of/K.
In the invention, the TiN-Ni powder is prepared into a gradient structure, which can be realizedThe composite material has the excellent performances of high oxidation resistance, high thermal conductivity, high bending strength, adjustable thermal expansion coefficient, suitability for complex environments and the like. The density of the obtained TiN-Ni gradient functional material is 96-99% of the theoretical density. The bending strength of the obtained TiN-Ni gradient functional material is 860-1100 MPa. The thermal conductivity of the obtained TiN-Ni gradient functional material is 34-42W/m.K. The average thermal expansion coefficient of the obtained TiN-Ni gradient functional material is (10.2-12.5) × 10 in the temperature range of 20-1000 DEG C-6Controllable in the range of/K.
The present invention will be described in detail by way of examples. It is also to be understood that the following examples are illustrative of the present invention and are not to be construed as limiting the scope of the invention, and that certain insubstantial modifications and adaptations of the invention by those skilled in the art may be made in light of the above teachings. The specific process parameters and the like of the following examples are also only one example of suitable ranges, i.e., those skilled in the art can select the appropriate ranges through the description herein, and are not limited to the specific values exemplified below.
Example 1
Firstly, 100g of TiN and Ni (accounting for 60 wt%) is prepared, 127g of absolute alcohol is used as a dispersion medium, 200g of WC balls is used as a ball milling medium, and the mass ratio of the grain diameter of the WC balls to the grain diameter of the WC balls is 2: 1. The TiN powder has a particle size of 0.5-2 μm. The particle size of the Ni powder is 1-3 mu m. A planetary ball mill is used as a mixing instrument, the mixing time is 5 hours, and the rotating speed is 300 r/min. Then drying and drying the powder, and sieving the powder by a 100-mesh sieve to obtain TiN-Ni powder with the Ni content of 60 wt%. In the same manner as described above, TiN-Ni powder having a Ni content of 48 wt% was obtained. And secondly, preparing a gradient green compact, namely adding 15g of TiN/60 wt% Ni powder into the first layer in a special mould for spark plasma sintering, tiling and compacting, continuously adding 15g of TiN/48 wt% Ni powder into the second layer on the basis, tiling and compacting, continuously adding 15g of TiN/60 wt% Ni powder into the third layer on the basis, tiling and compacting to obtain the gradient green compact with an A/B/A symmetrical structure. Sintering the obtained gradient green compact in a vacuum atmosphere by adopting a spark plasma sintering method, wherein the sintering temperature is 1230 ℃, the heat preservation time is 15min,the sintering pressure is 35MPa, and the A/B/A symmetrical structure TiN-Ni gradient functional material of TiN/60 wt% Ni (15g) -TiN/48 wt% Ni (15g) -TiN/60 wt% Ni (15g) is obtained. The density of the obtained TiN-Ni gradient functional material measured by an Archimedes drainage method is 99 percent of the theoretical density. The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is 1100MPa measured by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, wherein the thermal conductivity of the wafer is 44W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 12.5 × 10 within a temperature range of 20-1000 DEG C-6/K。
Example 2
Firstly, 100g of TiN and Ni (accounting for 48 wt%) is prepared, 127g of absolute ethyl alcohol is used as a dispersion medium, 200g of WC balls are used as a ball milling medium, and the mass ratio of the grain diameter of the WC balls to the grain diameter of 5 microns to the grain diameter of 3 microns is 2: 1. The TiN powder has a particle size of 0.5-2 μm. The particle size of the Ni powder is 1-3 mu m. A planetary ball mill is used as a mixing instrument, the mixing time is 5 hours, and the rotating speed is 300 r/min. Then drying and drying the powder, and sieving the powder by a 100-mesh sieve to obtain TiN-Ni powder with the Ni content of 48 wt%. In the same manner as described above, TiN-Ni powder having a Ni content of 60wt% was obtained. And secondly, preparing a gradient green compact, namely adding 10g of TiN/60 wt% Ni powder into the first layer in a special mould for spark plasma sintering, tiling and compacting, continuously adding 20g of TiN/48 wt% Ni powder into the second layer on the basis, tiling and compacting, continuously adding 10g of TiN/60 wt% Ni powder into the third layer on the basis, tiling and compacting to obtain the gradient green compact with an A/B/A symmetrical structure. Sintering the obtained gradient green compact in a vacuum atmosphere by adopting a discharge plasma sintering method, wherein the sintering temperature is 1260 ℃, the heat preservation time is 10min, and the sintering pressure is 37MPa, so that the A/B/A symmetrical structure TiN-Ni gradient functional material of TiN/60 wt% Ni (10g) -TiN/48 wt% Ni (20g) -TiN/60 wt% Ni (10g) is obtained. The density of the obtained TiN-Ni gradient functional material measured by an Archimedes drainage method is 97% of the theoretical density. Cutting the obtained gradient functional material into pieces with the size of 3mm multiplied by 4mm multiplied by 36m by a numerical control linear cutting machinem test bars, and the bending strength of the TiN-Ni gradient functional material measured by a three-point bending method is 980 MPa. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to obtain 39W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 11.8 × 10 in a temperature range of 20-1000 DEG C-6/K。
Example 3
Firstly, 100g of TiN and Ni (accounting for 35 wt%) is prepared, 127g of absolute ethyl alcohol is used as a dispersion medium, 200g of WC balls are used as a ball milling medium, and the mass ratio of the grain diameter of the WC balls to the grain diameter of 5 microns to the grain diameter of 3 microns is 2: 1. The TiN powder has a particle size of 0.5-2 μm. The particle size of the Ni powder is 1-3 mu m. A planetary ball mill is used as a mixing instrument, the mixing time is 5 hours, and the rotating speed is 300 r/min. Then drying and drying the powder, and sieving the powder by a 100-mesh sieve to obtain TiN-Ni powder with the Ni content of 48 wt%. In the same manner as above, TiN-Ni powder having Ni content of 60wt% and TiN-Ni powder having Ni content of 48 wt% were obtained. And secondly, preparing a gradient green compact, namely adding 15g of TiN/60 wt% Ni powder into the first layer in a special mould for spark plasma sintering, tiling and compacting, continuously adding 15g of TiN/48 wt% Ni powder into the second layer on the basis, tiling and compacting, continuously adding 15g of TiN/35 wt% Ni powder into the third layer on the basis, tiling and compacting to obtain the gradient green compact with the A/B/C asymmetric structure. Sintering the obtained gradient green compact in a vacuum atmosphere by adopting a discharge plasma sintering method, wherein the sintering temperature is 1280 ℃, the heat preservation time is 12min, and the sintering pressure is 40MPa, so that the A/B/C asymmetric-structure TiN-Ni gradient functional material of TiN/60 wt% Ni (15g) -TiN/48 wt% Ni (15g) -TiN/35 wt% Ni (15g) is obtained. The density of the obtained TiN-Ni gradient functional material measured by an Archimedes drainage method is 98 percent of the theoretical density. The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured by a three-point bending method to be 910 MPa. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to be 37W/m.K. Cutting into 4mm × 4mm × 25mm test strips with DIL 420C NETZSCH by using a numerically controlled wire cutting machineThe average thermal expansion coefficient of the material measured by a thermal expansion instrument in a temperature range of 20-1000 ℃ is 10.9 multiplied by 10-6and/K. The prepared TiN-Ni gradient functional material is processed into a pattern required by a solid oxide fuel cell connecting plate by a numerical control machine, and is connected with the cathode and the anode of a single cell to play a role in supporting and transmitting current; the working environment of the material is 800 ℃, air and hydrogen atmosphere are respectively arranged on two sides, after the material works for 500 hours, the bending strength of the TiN-Ni gradient functional material still reaches 470MPa, and the conductivity still reaches 10 measured by a direct current four-terminal method4The service life is more than S/cm, and the method can be well applied to the actual service environment.
Experimental example 4
Firstly, 100g of TiN and Ni (accounting for 35 wt%) is prepared, 127g of absolute ethyl alcohol is used as a dispersion medium, 200g of WC balls are used as a ball milling medium, and the mass ratio of the grain diameter of the WC balls to the grain diameter of 5 microns to the grain diameter of 3 microns is 2: 1. The TiN powder has a particle size of 0.5-2 μm. The particle size of the Ni powder is 1-3 mu m. A planetary ball mill is used as a mixing instrument, the mixing time is 5 hours, and the rotating speed is 300 r/min. Then drying and drying the powder, and sieving the powder by a 100-mesh sieve to obtain TiN-Ni powder with the Ni content of 48 wt%. In the same manner as above, TiN-Ni powder having Ni content of 60wt% and TiN-Ni powder having Ni content of 48 wt% were obtained. And secondly, preparing a gradient green compact, namely adding 10g of TiN/60 wt% Ni powder into the first layer in a special mould for spark plasma sintering, tiling and compacting, continuously adding 20g of TiN/48 wt% Ni powder into the second layer on the basis, tiling and compacting, continuously adding 10g of TiN/35 wt% Ni powder into the third layer on the basis, tiling and compacting to obtain the gradient green compact with the A/B/C asymmetric structure. Sintering the obtained gradient green compact in a vacuum atmosphere by adopting a discharge plasma sintering method, wherein the sintering temperature is 1300 ℃, the heat preservation time is 10min, and the sintering pressure is 40MPa, so that the A/B/C asymmetric structure TiN-Ni gradient functional material of TiN/60 wt% Ni (10g) -TiN/48 wt% Ni (20g) -TiN/35 wt% Ni (10g) is obtained. The density of the obtained TiN-Ni gradient functional material measured by an Archimedes drainage method is 96 percent of the theoretical density. The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured by a three-point bending method to be 860 MPa. And use numerical controlThe wafer with the thickness of 2mm is cut by a linear cutting machine, and the thermal conductivity of the wafer is 34W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 10.2 × 10 in a temperature range of 20-1000 DEG C-6/K。
Example 5
The TiN-Ni gradient functional material of the embodiment 5 is prepared by referring to the embodiment 1, except that: the TiN-Ni gradient functional material is an A/B/A symmetrical structure of TiN/60 wt% Ni (12.25g) -TiN/48 wt% Ni (22.5g) -TiN/60 wt% Ni (12.25 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is 950MPa measured by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to obtain the wafer with the thermal conductivity of 36W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 10.8 × 10 in a temperature range of 20-1000 DEG C-6/K。
Example 6
The TiN-Ni gradient functional material of the embodiment 6 is prepared by referring to the embodiment 1, except that: the TiN-Ni gradient functional material is an A/B/A symmetrical structure of TiN/60 wt% Ni (7.5g) -TiN/48 wt% Ni (30g) -TiN/60 wt% Ni (7.5 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured to be 895MPa by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to obtain 38W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 11.9 × 10 in a temperature range of 20-1000 DEG C-6/K。
Example 7
The TiN-Ni gradient functional material of the embodiment 7 is prepared by referring to the embodiment 1, except that: the TiN-Ni gradient functional material is an A/B/A symmetrical structure of TiN/60 wt% Ni (16.8g) -TiN/48 wt% Ni (11.4g) -TiN/60 wt% Ni (16.8g)And cutting the obtained gradient functional material into test strips with the sizes of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and measuring the bending strength of the TiN-Ni gradient functional material to be 1050MPa by a three-point bending method. And cutting the wafer into a wafer with the phi 12 thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to obtain the wafer with the thermal conductivity of 43W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 12.9 × 10 in a temperature range of 20-1000 DEG C-6/K。
Example 8
The TiN-Ni gradient functional material of the embodiment 8 is prepared by referring to the embodiment 1, except that: the TiN-Ni gradient functional material is an A/B/A symmetrical structure of TiN/65 wt% Ni (15g) -TiN/45 wt% Ni (15g) -TiN/60 wt% Ni (15 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is 1080MPa measured by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, wherein the thermal conductivity of the wafer is 41W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 12.1 × 10 in a temperature range of 20-1000 DEG C-6/K。
Example 9
The TiN-Ni gradient functional material of the embodiment 9 is prepared by referring to the embodiment 3, except that: the TiN-Ni gradient functional material is an A/B/C symmetrical structure of TiN/60 wt% Ni (12.25g) -TiN/48 wt% Ni (22.5g) -TiN/35 wt% Ni (12.25 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is 925MPa measured by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, wherein the thermal conductivity of the wafer is 35W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by using a numerical control linear cutting machine, and measuring the average thermal expansion coefficient of the test strips to be 10.1 × 10 within a temperature range of 20-1000 ℃ by using a DIL 420C NETZSCH thermal expansion instrument-6/K。
Example 10
Example 10The preparation process of the medium TiN-Ni gradient functional material refers to the example 3, and the difference is that: the TiN-Ni gradient functional material is an A/B/C symmetrical structure of TiN/60 wt% Ni (7.5g) -TiN/48 wt% Ni (30g) -TiN/35 wt% Ni (7.5 g). The obtained gradient functional material is cut into test strips with the sizes of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured by a three-point bending method to be 965 MPa. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to be 37W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 11.3 × 10 in a temperature range of 20-1000 DEG C-6/K。
Example 11
The TiN-Ni gradient functional material of the embodiment 11 is prepared by referring to the embodiment 3, except that: the TiN-Ni gradient functional material is an A/B/C symmetrical structure of TiN/60 wt% Ni (16.8g) -TiN/48 wt% Ni (11.4g) -TiN/60 wt% Ni (16.8 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured by a three-point bending method to be 820 MPa. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, wherein the thermal conductivity of the wafer is 31W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 9.4 × 10 within a temperature range of 20-1000 DEG C-6/K。
Example 12
The TiN-Ni gradient functional material of the embodiment 12 is prepared by referring to the embodiment 3, except that: the TiN-Ni gradient functional material is an A/B/C symmetrical structure of TiN/65 wt% Ni (15g) -TiN/50 wt% Ni (15g) -TiN/40 wt% Ni (15 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured to be 848MPa by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, wherein the thermal conductivity of the wafer is 33W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by using a numerically controlled wire cutting machine, and measuring by using DIL 420C NETZSCH thermal expansion instrumentThe average thermal expansion coefficient of the material is 10.8 multiplied by 10 within the temperature range of 20-1000 DEG C-6/K。
Comparative example 1
The TiN-Ni gradient functional material of the comparative example 1 is prepared by referring to the example 3, and the difference is that: the TiN-Ni gradient functional material is TiN/60 wt% Ni. The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured by a three-point bending method to be 1220 MPa. And cutting the wafer into a wafer with the phi 12 thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to be 46W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 13.2 × 10 within a temperature range of 20-1000 DEG C-6/K。
Comparative example 2
The TiN-Ni gradient functional material of the comparative example 2 is prepared by referring to the example 3, and the difference is that: the TiN-Ni gradient functional material is TiN/48 wt% Ni. The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is 932MPa through a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to obtain 38W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 11.4 × 10 in a temperature range of 20-1000 DEG C-6/K。
Comparative example 3
The TiN-Ni gradient functional material of the comparative example 3 is prepared by referring to the example 3, and the difference is that: the TiN-Ni gradient functional material is TiN/35 wt% Ni. The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured by a three-point bending method to be 815 MPa. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, wherein the thermal conductivity of the wafer is 32W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by using a numerically controlled linear cutting machine, and measuring at 20-1000 deg.C by using DIL 420C NETZSCH thermal expansion instrumentHas an average thermal expansion coefficient of 9.2X 10 in a temperature range-6/K。
Comparative example 4
The TiN-Ni gradient functional material of the comparative example 4 is prepared by referring to the example 1, except that: the TiN-Ni gradient functional material is an A/B/A symmetrical structure of TiN/60 wt% Ni (20g) -TiN/48 wt% Ni (5g) -TiN/60 wt% Ni (20 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured to be 1200MPa by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, wherein the thermal conductivity of the wafer is 45W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 13.0 × 10 within a temperature range of 20-1000 DEG C-6and/K. At the moment, the comprehensive performance of the gradient functional material under the formula is similar to that of TiN/60 wt% Ni, so that the material can not obtain high oxidation resistance and low thermal expansion coefficient.
Comparative example 5
The TiN-Ni gradient functional material of the comparative example 4 is prepared by referring to the example 1, except that: the TiN-Ni gradient functional material is an A/B/A symmetrical structure of TiN/60 wt% Ni (2.5g) -TiN/48 wt% Ni (40g) -TiN/60 wt% Ni (2.5 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is 940MPa measured by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to obtain 39W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 11.1 × 10 in a temperature range of 20-1000 DEG C-6and/K. At the moment, the comprehensive performance of the gradient functional material under the formula is similar to that of TiN/48 wt% Ni, so that the material can not obtain high oxidation resistance and low thermal expansion coefficient.
Comparative example 6
Comparative example 4 preparation of TiN-Ni gradient functional Material referring to example 1, differenceThe method comprises the following steps: the TiN-Ni gradient functional material is an A/B/C symmetrical structure of TiN/60 wt% Ni (20g) -TiN/48 wt% Ni (5g) -TiN/60 wt% Ni (20 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is 670MPa by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, and measuring the thermal conductivity of the wafer by using a laser thermal conductivity method to obtain 21W/m.K. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 10.7 × 10 in a temperature range of 20-1000 DEG C-6and/K is used. At the moment, the comprehensive performance of the gradient functional material in the formula is poor, and the mechanical property of the material is poor due to the fact that the content of the middle layer B is small and the good temperature transition and bonding effects cannot be achieved in the sintering process.
Comparative example 7
The TiN-Ni gradient functional material of the comparative example 4 is prepared by referring to the example 1, except that: the TiN-Ni gradient functional material is an A/B/A symmetrical structure of TiN/60 wt% Ni (2.5g) -TiN/48 wt% Ni (20g) -TiN/60 wt% Ni (2.5 g). The obtained gradient functional material is cut into test strips with the size of 3mm multiplied by 4mm multiplied by 36mm by a numerical control linear cutting machine, and the bending strength of the TiN-Ni gradient functional material is measured to be 895MPa by a three-point bending method. And cutting the wafer into phi 12 wafers with the thickness of 2mm by using a numerical control linear cutting machine, wherein the thermal conductivity of the wafer is 35W/m.K measured by a laser thermal conductivity method. Cutting into 4mm × 4mm × 25mm test strips by a numerical control linear cutting machine, and measuring by a DIL 420C NETZSCH thermal expansion instrument that the average thermal expansion coefficient is 11.7 × 10 in a temperature range of 20-1000 DEG C-6and/K. At the moment, the comprehensive performance of the gradient functional material under the formula is similar to that of TiN/48 wt% Ni, so that the material can not obtain high oxidation resistance and low thermal expansion coefficient, and the surface properties of two ends of the material can not be effectively improved, so that the gradient functional material can not be applied to an environment with asymmetric atmosphere.
Table 1 shows the composition and performance parameters of the TiN-Ni gradient functional material prepared by the invention:
Claims (10)
1. a TiN-Ni gradient functional material, comprising: a Ni matrix phase and a TiN ceramic phase distributed in the Ni matrix phase in a gradient way; the content of the TiN ceramic phase is less than or equal to 65wt%, and preferably 35-65 wt%.
2. The TiN-Ni gradient functional material of claim 1, wherein the TiN-Ni gradient functional material has an a/B/a symmetric structure; the content of the TiN ceramic phase in the A is less than that of the TiN ceramic phase in the B; preferably, the content of the TiN ceramic phase in the A is 35-45 wt%; the content of the TiN ceramic phase in the B is 45-55 wt%.
3. The TiN-Ni gradient functional material according to claim 2, wherein the content of B in the TiN-Ni gradient functional material is 25 to 75wt%, preferably 30 to 60 wt%.
4. The TiN-Ni gradient functional material of claim 1, wherein the TiN-Ni gradient functional material has an ABC asymmetric structure; the content of the TiN ceramic phase in the A is less than that of the TiN ceramic phase in the B and less than that of the TiN ceramic phase in the C; preferably, the content of the TiN ceramic phase in the A is 35-45 wt%, the content of the TiN ceramic phase in the B is 45-55 wt%, and the content of the TiN ceramic phase in the C is 55-65 wt%.
5. The TiN-Ni gradient functional material according to claim 4, wherein the content of B in the TiN-Ni gradient functional material is 25 to 75wt%, preferably 30 to 60 wt%.
6. The TiN-Ni gradient functional material according to any one of claims 1 to 5, wherein the TiN-Ni gradient functional material has a compactness of 96% to 99%, a bending strength of 860 to 1100MPa, and a thermal conductivity of 34 to 42W/m-K.
7. A method for preparing TiN-Ni gradient functional material according to any one of claims 1 to 6, comprising:
weighing TiN powder and Ni powder with different mass ratios according to the composition of the TiN-Ni gradient functional material and mixing to obtain TiN-Ni powder with different components;
laying and compacting the obtained TiN-Ni powder with different components in layers to obtain a gradient green compact;
and sintering the obtained gradient green compact by discharge plasma to obtain the TiN-Ni gradient functional material.
8. The preparation method according to claim 7, wherein the TiN powder has a particle size of 0.5-2 μm and a purity of not less than 99.9%; the particle size of the Ni powder is 1-3 mu m, and the purity is more than or equal to 99.9%.
9. The method according to claim 7 or 8, wherein the process parameters of spark plasma sintering include: the sintering temperature is 1230-1300 ℃, and the heat preservation time is 10-15 min; sintering pressure is 35-40 MPa; the sintering atmosphere is vacuum, and the vacuum degree is less than or equal to 4.7 multiplied by 10-3Pa。
10. Use of a TiN-Ni gradient functional material according to any of claims 1 to 6 in the aerospace and energy fields.
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| CN105478777A (en) * | 2015-12-14 | 2016-04-13 | 中国航空工业集团公司北京航空制造工程研究所 | Metal/ceramic gradient material and preparation method thereof |
| CN106058291A (en) * | 2016-07-01 | 2016-10-26 | 中国科学院上海硅酸盐研究所 | Connector material for solid oxide fuel cell and preparation method of connector material |
| CN107486559A (en) * | 2017-09-01 | 2017-12-19 | 中南大学 | A kind of aluminium base density gradient material and its preparation method and application |
| CN110834098A (en) * | 2018-08-15 | 2020-02-25 | 鲁东大学 | Gradient nano composite metal ceramic cutter material and sintering process thereof |
| CN110465669A (en) * | 2019-09-09 | 2019-11-19 | 山东大学 | A kind of graded composite cubic boron nitride material and its preparation process and application |
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