CN114501202A - Loudspeaker module and intelligent terminal equipment - Google Patents

Abstract

The application relates to a speaker module and intelligent terminal equipment, include: the radiating assembly is installed on the main body part, at least part of the main board is arranged on the radiating assembly, the radiating assembly comprises a first radiating piece and a second radiating piece, the first radiating piece is embedded in the side wall of the main body part, the main board is located on one side, away from the main body part, of the first radiating piece, the second radiating piece is located on one side, away from the first radiating piece, of the main board, the second radiating piece is located on the outer side of the main body part, and the second radiating piece is connected with the main board. This application is favorable to reduceing the shared space of radiator unit to be favorable to reducing the volume of whole speaker module, and then be favorable to the design of speaker module compactification, be favorable to promoting the radiating effect of speaker module simultaneously, the cavity and the mainboard high temperature's of having reduced speaker module possibility, help reducing the ageing speed of speaker module, the life of extension speaker module.

Description

Loudspeaker module and intelligent terminal equipment

Technical Field

The application relates to the technical field of speakers, in particular to a speaker module and intelligent terminal equipment.

Background

Along with the development of technique, the application of speaker is more and more extensive, and in prior art, the speaker can produce a large amount of heats at the during operation, however because the structural feature of speaker self, it is little to lead to the heat dissipation space, and the heat is difficult for effluvium to the too high condition of speaker temperature can appear, influence the performance that the speaker normally worked, and can accelerate the ageing speed of speaker, reduce its life, current speaker does not also do benefit to design portablely, miniaturized simultaneously.

Disclosure of Invention

The application provides a speaker module and intelligent terminal equipment for solve the bad problem of speaker module heat dissipation, and be favorable to the miniaturized design of speaker.

The application provides a speaker module, include:

a main body portion;

a heat dissipating component mounted to the main body portion;

the mainboard is at least partially arranged on the heat dissipation assembly;

the heat dissipation assembly comprises a first heat dissipation piece and a second heat dissipation piece, the first heat dissipation piece is embedded in the side wall of the main body portion, the mainboard is located on one side of the main body portion, the first heat dissipation piece is located on one side of the main body portion, the second heat dissipation piece is located on the outer side of the main body portion, and the second heat dissipation piece is connected with the mainboard.

In one possible embodiment, the heat dissipation assembly includes heat conduction members located on opposite sides of the main board in a thickness direction of the main board, and the first heat dissipation member is connected to the main board through the heat conduction members;

the mainboard comprises a chip, and the position of the heat conducting piece is arranged corresponding to the position of the chip;

the heat conducting piece is any one of heat conducting silicone grease, heat conducting gel and a heat conducting pad.

In one possible embodiment, the first heat dissipation element comprises a metal element and/or a heat spreader.

In one possible embodiment, the first heat dissipation element includes a metal element, at least a portion of which is embedded in the main body;

the metal piece is provided with a first protruding part, the width direction or/and the length direction of the metal piece are/is followed, the first protruding part is located the relative both sides of metal piece, the lateral wall of main part is provided with a first cooperation portion, first cooperation portion can with the cooperation of first protruding part.

In a possible embodiment, the metal piece comprises a plurality of extending parts, and the extending parts extend to one side far away from the main board along the thickness direction of the metal piece;

the extension is located the metalwork is kept away from one side of mainboard, follows the width direction of metalwork, the extension sets gradually, just be provided with the interval between the extension.

In a possible implementation manner, the first heat dissipation element further comprises a heat equalizing element, the heat equalizing element is located on one side of the metal element close to the main board, and the heat equalizing element is embedded in the metal element;

soaking piece includes the second bellying, follows soaking piece's width or/and length direction, the second bellying is located soaking piece's relative both sides, the metalwork is provided with second cooperation portion, second cooperation portion can with the cooperation of second bellying.

In a possible embodiment, the first heat dissipation element includes a heat spreader, a groove is formed in a side wall of the main body portion, the side wall being close to the main board, and the heat spreader is installed in the groove.

In a possible embodiment, the soaking member is a flat plate-shaped structure, the soaking member is provided with third protruding portions, the third protruding portions are located on two opposite sides of the soaking member along the width direction or/and the length direction of the soaking member, the side wall of the main body portion is provided with third matching portions, and the third protruding portions can be matched with the third matching portions.

In a possible embodiment, the first heat sink includes a plurality of heat equalizing members, the heat equalizing members are tubular structures, and the heat equalizing members can be sequentially arranged along a length direction or a width direction of the main board.

The application also provides an intelligent terminal device, including:

a base;

a housing;

the loudspeaker module, the loudspeaker module install in the base, the shell cover is located the loudspeaker module, the loudspeaker module include as above arbitrary loudspeaker module.

The application provides a speaker module and intelligent terminal equipment, include: the radiating assembly is installed on the main body portion, at least part of the main board is arranged on the radiating assembly, the radiating assembly comprises a first radiating piece and a second radiating piece, the first radiating piece is embedded in the side wall of the main body portion, the main board is located the first radiating piece is far away from one side of the main body portion, the second radiating piece is located on one side of the main board far away from the first radiating piece, the second radiating piece is located on the outer side of the main body portion, and the second radiating piece is connected with the main board. The embodiment of the application is favorable for reducing the occupied space of the first heat dissipation assembly, thereby being favorable for reducing the volume of the whole loudspeaker module, and further being favorable for the compact design of the loudspeaker module, and simultaneously, the mainboard is arranged between the first heat dissipation assembly and the second heat dissipation assembly, so that the first heat dissipation assembly and the second heat dissipation assembly jointly play a heat dissipation role, the heat dissipation effect of the loudspeaker module is favorable for being promoted, and the heat dissipation efficiency is improved, thereby reducing the cavity of the loudspeaker module and the possibility of overhigh temperature of the mainboard, and further reducing the possibility of damage of the loudspeaker module due to high temperature, thereby being favorable for reducing the aging speed of the loudspeaker module, and prolonging the service life of the loudspeaker module.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

Fig. 1 is an exploded schematic view of a speaker module according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a heat dissipation assembly of a speaker module according to an embodiment of the present disclosure;

fig. 3 is a schematic view of a heat dissipation assembly provided in the present application in a first embodiment;

fig. 4 is a schematic view of a heat dissipation assembly provided in an embodiment of the present application in a second embodiment;

fig. 5 is a schematic view of a heat dissipation assembly provided in the present application in a third embodiment;

fig. 6 is a schematic view of a heat dissipation assembly provided in the present application in a fourth embodiment;

fig. 7 is a schematic view of a soaking member provided in an embodiment of the present application, the soaking member being disposed along a length direction of a main plate;

fig. 8 is a schematic view of a soaking member provided in the embodiment of the present application, the soaking member being disposed along a width direction of a main plate;

fig. 9 is an exploded schematic view of an intelligent terminal device provided in an embodiment of the present application;

fig. 10 is a cross-sectional view of an intelligent terminal device provided in an embodiment of the present application;

fig. 11 is a sectional view taken along a-a in fig. 10.

Reference numerals:

1-a body portion;

11-a first mating portion;

12-a groove;

13-a third mating portion;

2-a heat dissipation assembly;

21-a first heat sink;

211-a metal piece;

212-heat spreader;

213-a first boss;

214-an extension;

215-a second boss;

216-a second mating portion;

217-third boss;

218-a heat pipe;

22-a second heat sink;

23-a thermally conductive member;

3, a main board;

31-a chip;

4-a base;

5-a loudspeaker;

6-a housing;

7-high pitch loudspeaker module;

8-microphone board.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

Detailed Description

For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.

As shown in fig. 1 and 2, an embodiment of the present application provides a speaker module, including: main part 1, radiator unit 2 and mainboard 3, radiator unit 2 installs in main part 1, at least part of mainboard 3 sets up in radiator unit 2, wherein, radiator unit 2 includes first radiating piece 21 and second radiating piece 22, first radiating piece 21 inlays and locates the lateral wall of main part 1, mainboard 3 is located one side that main part 1 was kept away from to first radiating piece 21, second radiating piece 22 is located one side that first radiating piece 21 was kept away from to mainboard 3, and second radiating piece 22 is located the outside of main part 1, second radiating piece 22 is connected with mainboard 3.

The speaker module may include a main body portion 1, a heat dissipation assembly 2 and a main board 3, the speaker module may further be provided with a speaker 5, specifically, the inside of the main body portion 1 may form a cavity, so the main body portion 1 may be a sound cavity of the speaker module, the heat dissipation assembly 2 is installed in the main body portion 1, the heat dissipation assembly 2 includes a first heat dissipation member 21 and a second heat dissipation member 22, at least a part of the main board 3 may be disposed in the heat dissipation assembly 2, specifically, the first heat dissipation member 21 may be located on one side of the main board 3 close to the speaker module, the second heat dissipation member 22 may be located on one side of the main board 3 far away from the main body portion 1, that is, the main board 3 may be located between the first heat dissipation member 21 and the second heat dissipation member 22. The first heat dissipation element 21 is embedded in the side wall of the main body 1, and the second heat dissipation element 22 is connected to the main board 3, specifically, the second heat dissipation element 22 may be a metal plate such as an aluminum plate or a copper plate, and the second heat dissipation element 22 may be connected to the main board 3 by a screw thread. At the in-process of speaker module work, mainboard 3 can produce a large amount of heats, because speaker module is airtight structure usually, the heat dissipation space is less, need through setting up radiator unit 2, distribute out the heat rapidly to reduce the possibility that inside cavity of speaker module and mainboard 3 damaged because of the high temperature, be favorable to prolonging the life of speaker module. Meanwhile, the first heat dissipation part 21 is arranged on the side wall of the main body part 1 in an embedded mode, so that the occupied space of the first heat dissipation part 21 is reduced, the compactness of the overall design of the loudspeaker module is improved, the heat dissipation effect of the loudspeaker module is improved, and the stable work of the loudspeaker module is facilitated.

In the prior art, the mode that generally adopts one side of mainboard 3 keeping away from speaker module to set up radiating fin comes to dispel the heat to speaker module, however radiating fin's radiating effect is relatively poor, in order not to influence speaker module's normal work operation, and guarantee speaker module's pronunciation effect, also can't use the fan to improve radiating fin's radiating effect, because the air current that the fan produced can disturb speaker module vibration production, thereby bring harmful effects to speaker module, and simultaneously, because of radiating fin's extending direction extends to the direction of keeping away from mainboard 3, thereby also can increase speaker module holistic volume, be unfavorable for speaker module's compactification, the design of dexterity.

Compared with the prior art, the loudspeaker module provided by the embodiment of the application embeds the first heat dissipation component 21 on the side wall of the main body part 1, which is beneficial to reducing the space occupied by the first heat dissipation component 2, thereby being beneficial to reducing the volume of the whole loudspeaker module, thereby being beneficial to the compact design of the speaker module, and simultaneously, the mainboard 3 is arranged between the first heat dissipation member 21 and the second heat dissipation member 22, so that the first heat dissipation member 21 and the second heat dissipation member 22 can play a role of heat dissipation together, thereby being beneficial to improving the heat dissipation effect of the speaker module, and improves the heat dissipation efficiency, thereby reducing the possibility of overhigh temperature of the cavity of the loudspeaker module and the mainboard 3, thereby improving the performance or sound effect of the speaker module, reducing the possibility of damage of the speaker module due to high temperature, therefore, the aging speed of the loudspeaker module is reduced, and the service life of the loudspeaker module is prolonged.

In one possible embodiment, as shown in fig. 2, the heat dissipation assembly 2 includes a heat conduction member 23, the heat conduction member 23 is located on two opposite sides of the main board 3 along the thickness direction of the main board 3, the first heat dissipation member 21 is connected to the main board 3 through the heat conduction member 23, the main board 3 includes a chip 31, the position of the heat conduction member 23 corresponds to the position of the chip 31, and the heat conduction member 23 is any one of heat-conductive silicone grease, heat-conductive gel and heat-conductive pad

The main board 3 includes a chip 31, and when the speaker module operates, the chip 31 generates heat, resulting in an increase in temperature of the speaker module. The heat dissipation assembly 2 further comprises a heat conducting member 23, the heat conducting member 23 is located on two opposite sides of the main board 3, the position of the heat conducting member 23 corresponds to the position of the chip 31, specifically, the heat conducting member 23 can be a heat conducting pad, and can also be other materials such as heat conducting silicone grease or heat conducting gel, and the heat conducting member 23 can play a role in quick heat conduction. The first heat dissipation member 21 is connected to the motherboard 3 through the heat conduction member 23, when the chip 31 generates heat, the heat can be rapidly transmitted to the first heat dissipation member 21 and the second heat dissipation member 22 through the heat conduction members 23 on both sides of the motherboard 3, and the first heat dissipation member 21 and the second heat dissipation member 22 can dissipate heat in time, so that the possibility of the temperature of the motherboard 3 being too high is reduced.

Through setting up the heat-conducting piece 23, and correspond the setting with the position of heat-conducting piece 23 and chip 31's position, be favorable to realizing the heat conduction effect to heat-conducting piece 23 to chip 31, thereby be favorable to promoting the heat conduction effect of heat-conducting piece 23, make the heat conduct to first radiating element 21 and second radiating element 22 fast, first radiating element 21 and second radiating element 22 can realize the heat dissipation function, consequently, set up the radiating effect who also is favorable to promoting first radiating element 21 and second radiating element 22 like this, help prolonging the life of speaker module.

In one possible embodiment, the first heat sink 21 includes a metal piece 211 and/or a heat spreader 212.

The first heat dissipation element 21 may include a metal element 211 and/or a heat spreader 212, and specifically, the metal element 211 may be made of a metal with a high thermal conductivity, such as aluminum, copper, a metal alloy, and the like. The soaking piece 212 can be a flat plate or a tubular structure, a cavity is arranged in the soaking piece 212, cooling liquid is arranged in the cavity, and heat dissipation is carried out by utilizing the principle of liquid gasification heat absorption. The soaking part 212 and the metal part 211 can both generate a rapid heat dissipation effect, compared with the metal part 211, the soaking part 212 has higher cost and better heat dissipation effect, and the first heat dissipation part 21 can select between the metal part 211 and the soaking part 212 according to the requirement of the speaker module, or can combine the two parts.

The design is favorable to improving the flexibility that first radiating piece 21 designed like this, makes first radiating piece 21 more accord with the demand of speaker module to still be favorable to improving the radiating effect of first radiating piece 21, thereby be favorable to prolonging the life of speaker module.

As shown in fig. 3, in one possible embodiment, the first heat dissipating element 21 includes a metal piece 211, at least a portion of the metal piece 211 is embedded in the main body portion 1, the metal piece 211 is provided with a first protruding portion 213, the first protruding portion 213 is located on two opposite sides of the metal piece 211 along a width direction or/and a length direction of the metal piece 211, a side wall of the main body portion 1 is provided with a first matching portion 11, and the first matching portion 11 can be matched with the first protruding portion 213.

The first heat dissipation element 21 may include a metal piece 211, at least a portion of the metal piece 211 is embedded in a sidewall of the main body portion 1, and specifically, a thickness of the metal piece 211 may be the same as a thickness of the sidewall of the main body portion 1. The metal member 211 is provided with a first protrusion 213, the first protrusion 213 is located on two opposite sides of the metal member 211, the sidewall of the main body 1 is provided with a first matching portion 11, the first matching portion 11 and the first protrusion 213 may be tooth-shaped structures, and the first matching portion 11 may be matched with the first protrusion 213, so that the metal member 211 is embedded in the sidewall of the main body 1.

Through setting up first cooperation portion 11 and first bellying 213, make metalwork 211 and main part 1 can closely cooperate, be favorable to reducing the shared space of first radiator unit 2, still be favorable to improving the stability of metalwork 211 installation, reduce the possibility that metalwork 211 drops from the lateral wall of main part 1, help first heat sink 21 to play the radiating effect, also be favorable to improving loudspeaker unit's leakproofness simultaneously, and then be favorable to promoting loudspeaker unit's sound effect.

As shown in fig. 4, in one possible embodiment, the metal part 211 includes a plurality of extending portions 214, the extending portions 214 extend toward a side away from the main board 3 along a thickness direction of the metal part 211, the extending portions 214 are located at a side of the metal part 211 away from the main board 3, the extending portions 214 are sequentially arranged along a width direction of the metal part 211, and a space is provided between the extending portions 214.

The metal part 211 may include a plurality of extending portions 214, the extending portions 214 are located on one side of the metal part 211 away from the main board 3, and extend to one side away from the main board 3 along the thickness direction of the metal part 211, that is, the extending portions 214 are located in the cavity formed by the main body portion 1, and the metal part 211 is embedded in the side wall of the main body portion 1. The plurality of extending portions 214 are sequentially arranged along the width direction of the metal member 211, and a space is provided between adjacent extending portions 214.

Through setting up extension 214, be favorable to increasing the area of contact of metalwork 211 with the inside air of main part 1 to be favorable to increasing the heat dissipation capacity of metalwork 211, and then be favorable to promoting radiator unit 2's radiating effect, the life of extension speaker module. In the prior art, the speaker module is usually cooled by arranging the heat dissipating fins on the side of the main board 3 away from the speaker module, and the heat dissipating fins extend to the outside of the main body 1, so that the overall size of the speaker module is increased, which is not beneficial to the compact and smart design of the speaker module, and meanwhile, when the speaker module is applied to a small-sized intelligent terminal device, such as an intelligent audio device or a small-sized handheld audio device, the heat dissipating fins extending outwards will increase the overall size of the intelligent terminal device, and meanwhile, the heat dissipating fins exposed out of the main body 1 will also adversely affect the aesthetic property of the intelligent terminal device, therefore, the extending part 214 can be arranged inside the main body 1, and the metal part 211 can fully dissipate heat by using the inner space of the main body 1, thereby being beneficial to saving the size of the whole speaker module, and then be favorable to the design of speaker module miniaturization, compactification, also be favorable to promoting the aesthetic property simultaneously to be favorable to promoting user's use and feel.

As shown in fig. 5, in a possible embodiment, the first heat sink 21 further includes a heat spreader 212, that is, the first heat sink is provided with both the heat spreader 212 and the metal piece 211, the heat spreader 212 is located on one side of the metal piece 211 close to the motherboard 3, the heat spreader 212 is embedded in the metal piece 211, the heat spreader 212 includes a second protrusion 215, the second protrusion 215 is located on two opposite sides of the heat spreader 212 along the width or/and the length direction of the heat spreader 212, the metal piece 211 is provided with a second matching portion 216, and the second matching portion 216 can be matched with the second protrusion 215.

The first heat sink 21 may include both the soaking member 212 and the metal member 211, and the soaking member 212 is located on a side of the metal member 211 close to the motherboard 3, that is, the soaking member 212 is connected to the heat conducting member 23. The soaking element 212 is embedded in the metal element 211, and specifically, the soaking element 212 may be a soaking plate, or may be a tubular or flat tubular heat pipe 218, and compared with the heat pipe 218, the soaking plate has a better heat dissipation effect, a higher heat dissipation efficiency, and a higher cost. The soaking part 212 comprises a second protruding portion 215, the second protruding portion 215 can be located on two opposite sides of the soaking part 212 along the width or/and length direction of the soaking part 212, the second protruding portion can also be arranged along the circumferential direction of the soaking part 212, the metal part 211 is provided with a second matching portion 216, and the second matching portion 216 can be matched with the second protruding portion 215, so that the soaking part 212 is embedded in the metal part 211, specifically, when the soaking part 212 is a heat pipe 218, the soaking part 212 can be connected with the metal part 211 in a covering or welding mode. The second heat dissipation element 22 may also be provided with a heat spreader 212, meanwhile, the second heat dissipation element 22 may also be provided with a plurality of extension portions 214 on a side away from the motherboard 3, and the metal element 211 may also be provided with a plurality of extension portions 214 on a side away from the motherboard 3, by providing the extension portions 214 on both the metal element 211 and the second heat dissipation element 22, the contact area between the whole heat dissipation assembly 2 and the air is favorably increased, and the heat spreader 212 may be embedded in both the metal element 211 and the second heat dissipation element 22, thereby further improving the heat dissipation effect.

Through combining soaking piece 212 and metalwork 211 together, be favorable to further improving first radiator unit 2's radiating effect to be favorable to reducing the too high possibility of speaker module temperature, and then be favorable to prolonging the life of speaker module.

In one possible embodiment, as shown in fig. 6, the first heat sink 21 includes a heat spreader 212, the side wall of the main body portion 1 is provided with a recess 12 on a side close to the main board 3, and the heat spreader 212 is mounted in the recess 12.

The first heat sink 21 includes a heat spreader 212, the sidewall of the main body 1 is formed with a groove 12, and the heat spreader 212 may be installed in the groove 12. Soaking piece 212's intensity is relatively weak, installs soaking piece 212 in recess 12 and is favorable to reducing soaking piece 212 and takes place the possibility of buckling, simultaneously, sends the vibration when speaker module during operation, and main part 1 also can receive the influence of vibration, through setting up recess 12, not only is favorable to reducing the shared space of first heat radiation component 2, is favorable to reducing the harmful effects of vibration to soaking piece 212 in addition to reduce soaking piece 212 and take place the possibility of damaging, be favorable to improving soaking piece 212's intensity.

As shown in fig. 6, in one possible embodiment, the soaking member 212 is a flat plate-shaped structure, the soaking member 212 is provided with third protruding portions 217, the third protruding portions 217 are located on opposite sides of the soaking member 212 in the width direction or/and the length direction of the soaking member 212, the side wall of the main body portion 1 is provided with third engaging portions 13, and the third protruding portions 217 can be engaged with the third engaging portions 13.

The thermal spreader 212 may be a plate-like structure, i.e., a thermal spreader, preferably having a thickness of 0.3mm to 1 mm. The soaking piece 212 is provided with a third protruding part 217, the third protruding part 217 can be located on two opposite sides of the soaking piece 212 along the width direction or/and the length direction of the soaking piece 212, the third protruding part 217 can be arranged along the circumferential direction of the soaking piece 212, the side wall of the main body part 1 is provided with a third matching part 13, and the third protruding part 217 can be matched with the third matching part 13, so that the soaking piece 212 is installed in the groove 12.

Through setting up soaking piece 212, be favorable to improving the heat dispersion of speaker module, be favorable to reducing the shared space of first heat radiation component 2 simultaneously, thereby be favorable to the design of speaker module compactification, and through setting up third bellying 217 and third cooperation portion 13, be favorable to improving the stability of soaking piece 212 installation, reduce the possibility that soaking piece 212 dropped from recess 12, make soaking piece 212 can exert the radiating effect, and still be favorable to improving speaker module's leakproofness, thereby be favorable to speaker module's use, and then be favorable to prolonging speaker module's life.

As shown in fig. 7 and 8, in one possible embodiment, the first heat dissipation element 21 includes a plurality of heat equalization members 212, the heat equalization members 212 are of a tubular or flat tubular structure, and the heat equalization members 212 can be arranged in sequence in the longitudinal direction or the width direction of the main board 3.

The heat spreader 212 may also be a heat pipe 218, the first heat dissipation element 21 may be provided with a plurality of heat pipes 218, the heat pipes 218 may be sequentially arranged along the length direction or the width direction of the motherboard 3, specifically, the preferred thickness of the heat pipe 218 is 0.2mm to 1mm, and the heat pipe 218 may connect the heat spreader 212 and the groove 12 by means of pasting or welding. The heat pipe 218 is advantageous in reducing the cost and improving the heat dissipation performance of the first heat sink 21, compared to the flat soaking member 212.

As shown in fig. 9 to 11, an embodiment of the present application further provides an intelligent terminal device, including: base 4, shell 6 and speaker module, speaker module install in base 4, and shell 6 overlaps in the outside of speaker module, and the speaker module includes like above arbitrary speaker module.

The intelligent terminal device can be an intelligent sound box, the intelligent terminal device can comprise a base 4 and a loudspeaker module, and particularly, the loudspeaker module can be a bass loudspeaker module. The intelligent terminal equipment can also comprise a shell 6, a high pitch loudspeaker module 7 and a microphone board 8. The intelligent terminal equipment that this application embodiment provided is favorable to promoting heat dispersion to be favorable to prolonging intelligent terminal equipment's life, still be favorable to reducing the volume of equipment simultaneously, reduce energy consumption, thereby be favorable to realizing intelligent terminal equipment's portability, and reduce its cost of production and use.

The embodiment of the application provides a speaker module and intelligent terminal equipment, include: main part 1, radiator unit 2 and mainboard 3, radiator unit 2 installs in main part 1, at least part of mainboard 3 sets up in radiator unit 2, wherein, radiator unit 2 includes first radiating piece 21 and second radiating piece 22, first radiating piece 2 inlays and locates the lateral wall of main part 1, mainboard 3 is located one side that main part 1 was kept away from to first radiating piece 21, second radiating piece 22 is located one side that first radiating piece 21 was kept away from to mainboard 3, and second radiating piece 22 is located the outside of main part 1, second radiating piece 22 is connected with mainboard 3. The embodiment of the application embeds the first radiating piece 21 in the side wall of the main body part 1, which is beneficial to reducing the space occupied by the first radiating component 2, thereby being beneficial to reducing the volume of the whole loudspeaker module, and further being beneficial to the design of the compactness of the loudspeaker module, and simultaneously, the mainboard 3 is arranged between the first radiating piece 21 and the second radiating piece 22, so that the first radiating piece 21 and the second radiating piece 22 play a role of radiating together, which is beneficial to improving the radiating effect of the loudspeaker module, and improving the radiating efficiency, thereby reducing the possibility of overhigh temperature of the cavity and the mainboard 3 of the loudspeaker module, and further reducing the possibility of the loudspeaker module being damaged due to high temperature, thereby being beneficial to reducing the aging speed of the loudspeaker module, and prolonging the service life of the loudspeaker module.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A speaker module, comprising:

a main body (1);

a heat sink (2), wherein the heat sink (2) is attached to the main body (1);

a main board (3), at least part of the main board (3) is arranged on the heat dissipation component (2);

wherein, radiator unit (2) include first heat dissipation spare (21) and second heat dissipation spare (22), first heat dissipation spare (21) are inlayed and are located the lateral wall of main part (1), mainboard (3) are located first heat dissipation spare (21) are kept away from one side of main part (1), second heat dissipation spare (22) are located mainboard (3) are kept away from one side of first heat dissipation spare (21), just second heat dissipation spare (22) are located the outside of main part (1), second heat dissipation spare (22) with mainboard (3) are connected.

2. A loudspeaker module according to claim 1, wherein the heat sink assembly (2) comprises a heat conducting member (23), the heat conducting member (23) is located on opposite sides of the main board (3) in a thickness direction of the main board (3), and the first heat dissipating member (21) is connected to the main board (3) through the heat conducting member (23);

the main board (3) comprises a chip (31), and the position of the heat conducting piece (23) is arranged corresponding to the position of the chip (31);

the heat conducting piece (23) is any one of heat conducting silicone grease, heat conducting gel and a heat conducting pad.

3. A loudspeaker module according to claim 2, wherein the first heat dissipation element (21) comprises a metal element (211) and/or a heat spreader (212).

4. A loudspeaker module according to claim 3, wherein the first heat dissipation element (21) comprises a metal piece (211), at least part of the metal piece (211) being embedded in the main body portion (1);

metalwork (211) are provided with first bellying (213), follow the length or/and the width direction of metalwork (211), first bellying (213) are located the relative both sides of metalwork (211), the lateral wall of main part (1) is provided with first cooperation portion (11), first cooperation portion (11) can with first bellying (213) cooperation.

5. A loudspeaker module according to claim 4, wherein the metal piece (211) comprises a plurality of extensions (214), the extensions (214) extending in the thickness direction of the metal piece (211) to a side away from the main board (3);

the extension parts (214) are located on one side, away from the main board (3), of the metal piece (211), and along the width direction of the metal piece (211), the extension parts (214) are sequentially arranged, and intervals are arranged among the extension parts (214).

6. The speaker module as claimed in claim 4, wherein the first heat sink (21) further comprises a heat spreader (212), the heat spreader (212) is located on one side of the metal member (211) close to the main board (3), and the heat spreader (212) is embedded in the metal member (211);

soaking piece (212) includes second bellying (215), follows the width or/and the length direction of soaking piece (212), second bellying (215) are located the relative both sides of soaking piece (212), metalwork (211) are provided with second cooperation portion (216), second cooperation portion (216) can with second bellying (215) cooperate.

7. A loudspeaker module according to claim 3, wherein the first heat sink (21) comprises a heat spreader (212), the side walls of the main body portion (1) being provided with a recess (12) at a side adjacent to the main board (3), the heat spreader (212) being mounted in the recess (12).

8. The speaker module according to claim 7, wherein the soaking member (212) has a flat plate-like structure, the soaking member (212) is provided with third protruding portions (217), the third protruding portions (217) are located on two opposite sides of the soaking member (212) along the width direction or/and the length direction of the soaking member (212), the side wall of the main body portion (1) is provided with third engaging portions (13), and the third protruding portions (217) can be engaged with the third engaging portions (13).

9. A loudspeaker module according to claim 7, wherein the first heat sink (21) comprises a plurality of heat spreaders (212), the heat spreaders (212) being of tubular construction, the heat spreaders (212) being sequentially arrangeable in the length or width direction of the motherboard (3).

10. An intelligent terminal device, comprising:

a base (4);

a housing (6);

a speaker module mounted to the base (4), the housing (6) being nested within the speaker module, the speaker module comprising the speaker module of any of claims 1-9.

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