CN114496448A - Flexible stretchable radio frequency coil - Google Patents
Flexible stretchable radio frequency coil Download PDFInfo
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- CN114496448A CN114496448A CN202011154928.7A CN202011154928A CN114496448A CN 114496448 A CN114496448 A CN 114496448A CN 202011154928 A CN202011154928 A CN 202011154928A CN 114496448 A CN114496448 A CN 114496448A
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- adhesive film
- film layer
- frequency coil
- flexible stretchable
- flexible
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/06—Insulation of windings
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- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a flexible stretchable radio frequency coil, and relates to the technical field of radio frequency electronics. The coil includes: the first adhesive film layer, the conductor ring, the second adhesive film layer and the woven fabric layer; the conductor ring is arranged between the first adhesive film layer and the second adhesive film layer, and the woven fabric layer is arranged on one side of the first adhesive film layer, which is far away from the conductor ring; the first adhesive film layer, the second adhesive film layer and the fabric layer are made of flexible stretchable materials, and at least part of ring bodies of the conductor ring are flexible stretchable conductive ring bodies formed by printing flexible electronic paste. The embodiment of the invention provides a flexible stretchable radio-frequency coil, which not only has good flexibility, but also has certain stretchable capability, and the universality of the radio-frequency coil is improved.
Description
Technical Field
The invention belongs to the technical field of radio frequency electronics, and particularly relates to a flexible stretchable radio frequency coil.
Background
The radio frequency coil plays a key role in a plurality of fields such as wireless charging, communication antennas and medical treatment, and with the continuous development of the technology, the demand is continuously updated, and the development demand of the radio frequency coil is concentrated on wearable equipment such as flexible fabrics, so that new requirements on the flexibility and the adhesiveness of the radio frequency coil are provided.
At present, radio frequency coils are mainly manufactured by etching copper clad plates, and base materials mainly comprise PI films (polyimide), such as FPC radio frequency coils, but the coils are poor in flexibility, the comfort level of the adhesion of the PI base materials is poor, and the PI radio frequency coils do not have tensile performance, so that the universality is poor.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a flexible and stretchable rf coil, so as to solve the problem of poor universality of the rf coil in the prior art.
In some illustrative embodiments, the flexible stretchable radio frequency coil comprises: the first adhesive film layer, the conductor ring, the second adhesive film layer and the woven fabric layer; the conductor ring is arranged between the first adhesive film layer and the second adhesive film layer, and the woven fabric layer is arranged on one side of the first adhesive film layer, which is far away from the conductor ring; the first adhesive film layer, the second adhesive film layer and the fabric layer are made of flexible stretchable materials, and at least part of ring bodies of the conductor ring are flexible stretchable conductive ring bodies formed by printing flexible electronic paste.
In some optional embodiments, the first adhesive film layer and/or the second adhesive film layer is a hot melt adhesive film or a pressure sensitive adhesive film.
In some optional embodiments, the fabric layer is less stretchable than the first adhesive film layer, the second adhesive film layer, and the flexible stretchable conductive loop body in the conductor loop.
In some optional embodiments, a release film is disposed on a side of the second adhesive film layer away from the conductor ring.
In some optional embodiments, the conductor ring is a circular ring structure formed by combining at least two non-contact arc-shaped rings; the ends of the adjacent arc-shaped rings are connected through an electronic device.
In some optional embodiments, the electronic device is a capacitive signal amplifier.
In some optional embodiments, the first adhesive film layer and the fabric layer are disposed in a window structure with respect to a position area of the electronic device, for exposing the electronic device.
In some optional embodiments, the end of the arcuate ring to which the electronic device is connected is a non-stretchable structure.
In some optional embodiments, the position of the second adhesive film layer relative to the electronic device is configured as a windowing structure for exposing the electronic device.
In some optional embodiments, the position of the fabric layer relative to the electronic device is a non-stretchable structure.
Compared with the prior art, the invention has the following advantages:
the embodiment of the invention provides a flexible stretchable radio-frequency coil, which not only has good flexibility, but also has certain stretchable capability, and the universality of the radio-frequency coil is improved.
Drawings
FIG. 1 is a first example of a configuration of a flexible, stretchable radio frequency coil in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a layer structure of an example of a structure of a flexible stretchable radio frequency coil in an embodiment of the present invention;
FIG. 3 is a second example of a configuration of a flexible stretchable radio frequency coil in an embodiment of the present invention;
FIG. 4 is an exemplary structure of a flexible stretchable RF coil in an embodiment of the present invention
Fig. 5 is a layer structure diagram of a structural example three of the flexible stretchable radio frequency coil in the embodiment of the present invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments of the invention may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
In the embodiment of the invention, a flexible stretchable radio frequency coil is disclosed, and specifically, as shown in fig. 1-2, fig. 1 is a structural example one in the embodiment of the invention; fig. 2 is a schematic layer structure diagram of a first structure example in the embodiment of the present invention. The flexible stretchable radio frequency coil includes: a first glue film layer 10, a conductor ring 20, a second glue film layer 30 and a woven fabric layer 40. The conductor ring 20 is disposed between the first adhesive film layer 10 and the second adhesive film layer 30, and the fabric layer 40 is disposed on a side of the first adhesive film layer 10 away from the conductor ring 20.
The first adhesive film layer 10, the second adhesive film layer 30 and the fabric layer 40 are made of flexible stretchable materials, and at least part of ring bodies of the conductor ring 30 are flexible stretchable conductive ring bodies formed by printing flexible electronic paste.
The embodiment of the invention provides a flexible stretchable radio-frequency coil, which not only has good flexibility, but also has certain stretchable capability, and the universality of the radio-frequency coil is improved.
Preferably, the first adhesive film layer 10 and the second adhesive film layer 30 in the embodiment of the present invention are the same adhesive film, so that the subsequent stable structure is not easily delaminated. Preferably, the thickness range of the first adhesive film layer 10 and/or the second adhesive film layer 30 in the embodiment of the present invention is 30 to 100 μm, the adhesive film layer in this range has a high structural strength and can protect the inner conductor ring thereof, and if the thickness range is exceeded, a phenomenon of colloid flow easily occurs during the lamination process of the flexible stretchable radio frequency coil, which causes a severe deformation of the adhesive film layer, and further causes an excessive deformation of the flexible stretchable conductive loop body formed by printing the flexible electronic paste, whereas if the thickness range is exceeded, the thickness range is insufficient to cause an excessive deformation of the flexible stretchable conductive loop body formed by printing the flexible electronic paste during the lamination process of the radio frequency coil, thereby avoiding a problem of failure or performance degradation of the conductor ring.
Specifically, in the embodiment of the present invention, the first adhesive film layer 10 and/or the second adhesive film layer 30 may be a hot melt adhesive film or a pressure sensitive adhesive film, and is not limited to polyurethane PU, thermoplastic polyurethane TPU, thermoplastic vulcanizate TPV, silicone rubber, or the like. Preferably, the first adhesive film layer 10 and the second adhesive film layer 30 in the embodiment of the present invention are made of thermoplastic polyurethane TPU, which has better air tightness and structural strength than other materials.
The fabric layer 40 in the embodiment of the present invention includes but is not limited to fabrics such as non-woven fabrics, nylon, cotton wool, terylene, spandex and blended fabrics of various materials, so as to improve the attaching comfort of the user; preferably, the fabric layer 40 in the embodiment of the present invention has a tensile deformation amount not higher than that of the adhesive film and the flexible stretchable conductive loop body formed by printing the flexible electronic paste; specifically, the stretching deformation amount of the fabric layer 40 is not more than 30% of the original size, so that the whole stretching deformation degree of the radio frequency coil is controlled, the radio frequency coil is prevented from being irreversibly deformed due to over-stretching, and the structural stability and reliability of the radio frequency coil are improved.
On the other hand, the thickness range of the woven fabric layer 40 is selected to be between 100 μm and 300 μm, although the woven fabric layer 40 does not have the problem of fluid sliding like an adhesive film in the lamination process of the radio frequency coil, a larger deformation amount is provided in the vertical direction, and in the lamination process of the radio frequency coil, an undesired deformation is easily generated in the vertical direction of a conductor ring between the first adhesive film layer and the second adhesive film layer, so that a cross section or a fault with poor contact is generated, and the yield of the conductor ring is greatly improved in the thickness range.
As shown in fig. 3, preferably, the laminated body of the rf coil in the embodiment of the present invention is compounded by hot pressing, wherein, in order to avoid the fabric layer 40 from deforming the conductor ring 20, the second adhesive film layer 30 is placed on the mesa of the hot stage for hot pressing, and in order to avoid the second adhesive film layer 30 from directly adhering to the hot stage, a release film 50 is disposed on the side of the second adhesive film layer 30 away from the conductor ring 20, and the release film 50 is directly in contact with the mesa of the hot stage. After completion of the thermal press-compounding, the release film 50 can be removed by peeling. In this embodiment, the release film 50 may be replaced by other materials that do not adhere to the second adhesive film layer 30, in some embodiments, the hot-press lamination may be performed by using materials that do not adhere to the second adhesive film layer 30 on a hot-table, and in this embodiment, the release film 50 may be omitted.
The flexible electronic paste in the embodiment of the invention is not limited to low-melting-point metal, mixed paste of low-melting-point metal and high-molecular material, mixed paste of high-melting-point metal and high-molecular material, mixed paste of low-melting-point metal and high-molecular material; in some other embodiments, the low melting point metal and/or the high melting point metal in the mixed slurry can be replaced by a non-metal conductive material. Wherein the melting point of the low-melting-point metal is not more than 300 ℃, such as gallium, gallium-indium alloy, gallium-indium-tin alloy, indium-tin alloy and the like; the melting point of the high melting point metal is not lower than 500 ℃, such as copper, gold, nickel, silver-coated copper, and the like.
Preferably, the embodiment of the present invention provides a liquid metal electronic paste, specifically, an electronic paste including: conductive silver paste and liquid metal (low melting point metal with melting point lower than room temperature, such as gallium indium alloy, gallium indium tin zinc alloy, etc.), wherein, in the electronic paste, the weight ratio of the liquid metal to the conductive silver paste is: 1: 30-30: 1, wherein the melting point of the liquid metal is lower than room temperature; in the process of preparing the electronic paste, the conductive silver paste with fluidity and the liquid metal in the liquid state are uniformly mixed.
Illustratively, in the electronic paste, the weight ratio of the liquid metal to the conductive silver paste is 1:30, 1:25, 1:20, 1:15, 1:10, 1:5, 1:3, 1:2, 2:3, 4:5, 1:1, 5:4, 3:2, 2:1, 3:1, 5:1, 10:1, 15:1, 20:1, 25:1 or 30: 1.
The conductive silver paste is organic polymer silver electronic paste which can form a film by drying or curing, wherein the organic polymer is used as a bonding phase, and the organic polymer is resin. The conductive silver paste inevitably contains silver powder, resin, a solvent and an auxiliary agent (such as a dispersing agent, a leveling agent, an antioxidant, a stabilizing agent and the like), and the mass fraction of the silver powder in the conductive silver paste can be 40-90%, such as 40%, 50%, 60%, 70% or 80%.
The liquid metal is a simple metal or an alloy with a melting point below room temperature. Alternatively, the liquid metal is a gallium indium eutectic alloy (melting point 15.5 ℃), a gallium indium tin eutectic alloy (melting point 11 ℃) or a gallium indium tin zinc eutectic alloy (melting point 9 ℃). Of course, the liquid metal may also be doped with a suitable amount of metal particles or non-metal particles, etc., without significantly affecting the properties of the liquid metal, such as fluidity and surface tension.
The inventor finds that after the liquid metal and the conductive silver paste are mixed to obtain the electronic paste, the more the resin (provided by the conductive silver paste) in the electronic paste is, the better the stability of the electronic paste is, the more the electronic paste is not easy to layer, and the higher the fault tolerance of the process operation is. The main approaches to increasing the resin content in electronic pastes are: the content of conductive silver paste in the electronic paste is increased, but if the content of the conductive silver paste is too high, the content of liquid metal in the conductive silver paste is too low, and the flexibility and the stretchability of the circuit manufactured by the electronic paste are poor, so that the requirement cannot be met.
In addition, the inventors have found that if the content of the liquid metal in the electronic paste is too high, the electronic paste still has a large surface tension, cannot be applied to various production processes (such as screen printing, pad printing, steel screen printing, and other printing processes), and has a large selectivity for the substrate.
After the above factors are considered comprehensively, the weight ratio of the liquid metal to the conductive silver paste is selected in the embodiment of the present invention, so that the electronic paste in the embodiment of the present invention has better comprehensive performance.
When the electronic paste is used for manufacturing the circuit, patterns are formed on the base material only by a printing process, and then drying is carried out at a proper temperature, the auxiliary agent in the conductive silver paste volatilizes in the drying process, and the conductive silver paste is solidified, so that the liquid metal is still in a liquid state in the manufactured circuit because the drying temperature is inevitably higher than the room temperature.
If the conductive silver paste is used for directly manufacturing the circuit, the flexibility and the stretchability of the circuit are poor. However, if the circuit is made of pure liquid metal, the pure liquid metal cannot be applied to various production processes (such as screen printing, pad printing, steel mesh printing, and other printing processes) due to its extremely high surface tension, and has a very high selectivity for the substrate. If the liquid metal doped with the conductive particles (such as silver-coated copper powder, nickel powder, copper powder, etc.) is used, the liquid metal has low uniformity and poor fluidity, and the extruded liquid metal is converged again and shows a larger surface tension, so that the requirements cannot be met.
The melting point of the liquid metal in the electronic paste provided by the embodiment of the invention is lower than room temperature, namely the liquid metal is in a liquid state at room temperature, so that a circuit manufactured by using the electronic paste has better flexibility. In addition, in above-mentioned electronic paste's inner structure, silver powder and the mutual overlap joint of liquid metal in the electrically conductive silver thick liquid, when drawing the circuit of making by above-mentioned electronic paste, resin in the electrically conductive silver thick liquid can be stretched, in addition because liquid metal is liquid, it can have very big deflection at tensile in-process, and then guarantee interconnect between the silver powder in liquid metal and the electrically conductive silver thick liquid, make the circuit continue electrically conductive, consequently, above-mentioned circuit still has better stretchability, based on this, the circuit of making using this electronic paste has better flexibility and stretchability, be applicable to in the flexible electron field. In addition, the electronic paste has low surface tension, can be suitable for various production processes (such as screen printing, pad printing, steel mesh printing and other printing processes), and has low selectivity on a substrate.
Referring now to fig. 4-5, fig. 4 is a third structural example of the flexible stretchable radio frequency coil in the embodiment of the present invention, and fig. 5 is a third layer structural example of the flexible stretchable radio frequency coil in the embodiment of the present invention. The conductor ring 20 in this embodiment is a circular ring structure formed by combining at least two non-contact arc-shaped rings 21; the ends of the adjacent arc-shaped rings 21 are connected through an electronic device 22. Preferably, the electronic device 22 may be a capacitive signal amplifier or other electronic device. The electronic device 22 may be a packaged chip component, or may be a circuit structure, such as a PCB, an FPC, or the like. In this embodiment, the electronic device 22 is added to the conductor loop 20, so that the imaging quality of the conductor loop 20 is improved. The electronic device 22 and the end of the arc ring 21 may be connected by soldering or by conductive adhesive.
Preferably, the arc-shaped ring 21 in the conductor ring 20 includes a soldering portion 211 at both ends and a connecting portion 212 connecting the two soldering portions 211, and the soldering portion 211 is connected to the electronic device 22. In some embodiments, the soldering portions 211 of the arc-shaped ring 21 can be selected from rigid pads such as conventional copper foil, and the connection portions 212 between the soldering portions 211 are flexible, stretchable and conductive structures formed by printing flexible electronic paste. In other embodiments, it is also possible to form the arc-shaped ring 21 directly by printing flexible electronic paste, and then plate a non-stretchable metal layer at the end position by electroplating or electroless plating at both ends of the arc-shaped ring 21, which is not limited to copper, gold, silver, tin, etc. In this embodiment, the end of the arc-shaped ring 21 for connecting with the electronic device 22 is set to be a non-stretchable welding part with a stable structure, so that the connection stability of the electronic device 22 can be improved, and the problem that the connection of the electronic device 22 is loosened due to stretching in the subsequent use process can be prevented. In some embodiments, the arc ring 21 may be formed by printing flexible electronic paste only, and the end portion thereof is directly used as the welding portion 211.
In some embodiments, a window structure is disposed in a position area of the first adhesive film layer 10 and the fabric layer 40 relative to the electronic device 22 for exposing the electronic device 22. In other embodiments, a window structure may be disposed at a position of the second adhesive film layer relative to the electronic device to expose the electronic device. In this embodiment, the laminated body of the first adhesive film layer 10 and the woven fabric layer 40 is set to have a windowing structure in a position region corresponding to the electronic device 22, so that after the first adhesive film layer 10, the conductor ring 20, the second adhesive film layer 30 and the woven fabric layer 40 are integrally combined, the electronic device 22 can be mounted through a reserved windowing, and the difficulty in combining is reduced. In other embodiments, the electronic device 22 may be packaged and stacked in a mold, and the package may be hot pressed by a mold having a groove for accommodating the electronic device 22, so as to avoid damage to the electronic device 22 during the hot pressing process.
In some embodiments, a region of the electronic device 22 (or a connection between the electronic device 22 and the arc ring 21) is hardened on one side of the fabric layer 40 or on one side of the second adhesive film layer 30 to further reduce the possibility of the region being stretched and avoid local looseness. The hardening process is not limited to applying a hardening paste, a hardening agent, and setting a partially set hardening sheet.
Preferably, a hardening agent is coated on one side of the woven fabric layer 40 relative to the area of the electronic device 22, so that the position of the woven fabric layer relative to the electronic device is in a non-stretchable structure, and the hardening agent can penetrate into the interior of the woven fabric layer 40, thereby reducing the influence of the hardening agent on the flatness and the appearance of the whole.
The flexible stretchable radio frequency coil in the embodiment of the invention can be applied to wireless charging coils, magnetic resonance coils, RFID antennas, traditional antennas, NFC antennas and the like.
The present invention is not limited to the above embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A flexible stretchable radio frequency coil, comprising: the first adhesive film layer, the conductor ring, the second adhesive film layer and the woven fabric layer; the conductor ring is arranged between the first adhesive film layer and the second adhesive film layer, and the woven fabric layer is arranged on one side of the first adhesive film layer, which is far away from the conductor ring; the first adhesive film layer, the second adhesive film layer and the fabric layer are made of flexible stretchable materials, and at least part of ring bodies of the conductor ring are flexible stretchable conductive ring bodies formed by printing flexible electronic paste.
2. The flexible stretchable radio frequency coil according to claim 1, wherein the first adhesive film layer and/or the second adhesive film layer is a hot melt adhesive film or a pressure sensitive adhesive film.
3. The flexible stretchable radio frequency coil of claim 1, wherein the fabric layer is less stretchable than the first, second, and flexible stretchable conductive loop bodies in the conductor loop.
4. The flexible stretchable radio-frequency coil according to claim 1, wherein a side of the second adhesive film layer away from the conductor ring is provided with a release film.
5. The flexible stretchable radio-frequency coil according to claim 1, wherein the conductor loop is a circular ring structure composed of a combination of at least two non-contact arc-shaped loops;
the ends of the adjacent arc-shaped rings are connected through an electronic device.
6. The flexible stretchable radio frequency coil of claim 5, wherein the electronic device is a capacitive signal amplifier.
7. The flexible stretchable radio-frequency coil of claim 5, wherein the first glue film layer and the fabric layer are arranged in a windowed configuration with respect to a location area of the electronic device for exposing the electronic device.
8. The flexible stretchable radio-frequency coil of claim 5, wherein the end of the arcuate loop to which the electronics are connected is an un-stretchable structure.
9. The flexible stretchable radio-frequency coil of claim 5, wherein the second adhesive film layer is positioned in a windowed configuration relative to the electronics for exposing the electronics.
10. The flexible stretchable radio-frequency coil of claim 9, wherein the fabric layer is in a non-stretchable configuration relative to the position of the electronics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011154928.7A CN114496448A (en) | 2020-10-26 | 2020-10-26 | Flexible stretchable radio frequency coil |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011154928.7A CN114496448A (en) | 2020-10-26 | 2020-10-26 | Flexible stretchable radio frequency coil |
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| CN114496448A true CN114496448A (en) | 2022-05-13 |
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| CN202011154928.7A Pending CN114496448A (en) | 2020-10-26 | 2020-10-26 | Flexible stretchable radio frequency coil |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140002228A1 (en) * | 2011-03-24 | 2014-01-02 | Nitto Denko Corporation | Magnetic element for wireless power transmission and method for manufacturing same |
| KR20190009496A (en) * | 2017-07-19 | 2019-01-29 | 광림섬유(주) | Textile based Wireless Charging Module Using Flexible Magnetic Field Shield And Conductive Fiber |
| CN109937367A (en) * | 2016-11-23 | 2019-06-25 | 通用电气公司 | Rf coil system for MR imaging |
| CN110412487A (en) * | 2019-07-31 | 2019-11-05 | 电子科技大学 | A kind of textile type flexible compound type sensor and preparation method thereof |
| CN111427466A (en) * | 2019-01-08 | 2020-07-17 | 宝德科技股份有限公司 | Wireless charging type mouse pad and process thereof |
| CN211180858U (en) * | 2020-01-03 | 2020-08-04 | 北京梦之墨科技有限公司 | Washing electronic tag |
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2020
- 2020-10-26 CN CN202011154928.7A patent/CN114496448A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140002228A1 (en) * | 2011-03-24 | 2014-01-02 | Nitto Denko Corporation | Magnetic element for wireless power transmission and method for manufacturing same |
| CN109937367A (en) * | 2016-11-23 | 2019-06-25 | 通用电气公司 | Rf coil system for MR imaging |
| KR20190009496A (en) * | 2017-07-19 | 2019-01-29 | 광림섬유(주) | Textile based Wireless Charging Module Using Flexible Magnetic Field Shield And Conductive Fiber |
| CN111427466A (en) * | 2019-01-08 | 2020-07-17 | 宝德科技股份有限公司 | Wireless charging type mouse pad and process thereof |
| CN110412487A (en) * | 2019-07-31 | 2019-11-05 | 电子科技大学 | A kind of textile type flexible compound type sensor and preparation method thereof |
| CN211180858U (en) * | 2020-01-03 | 2020-08-04 | 北京梦之墨科技有限公司 | Washing electronic tag |
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