CN114494131A - Method for detecting defects of salient points on ink surface of PCB - Google Patents
Method for detecting defects of salient points on ink surface of PCB Download PDFInfo
- Publication number
- CN114494131A CN114494131A CN202111596205.7A CN202111596205A CN114494131A CN 114494131 A CN114494131 A CN 114494131A CN 202111596205 A CN202111596205 A CN 202111596205A CN 114494131 A CN114494131 A CN 114494131A
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- pcb
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- algorithm
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- 230000007547 defect Effects 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 claims description 13
- 238000012360 testing method Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
- G06T2207/10012—Stereo images
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a method for detecting defects of salient points on an ink surface of a PCB (printed circuit board), which comprises the following steps of: step one, establishing a detection system; secondly, collecting a PCB image; thirdly, performing operation processing on the image of the PCB; step four, information display; the invention can replace the mode of checking by human eyes by using a software system to automatically detect the PCB, thereby reducing the defect of checking by human eyes, improving the detection efficiency of the PCB, reducing the cost of manual detection and manual management and avoiding the phenomenon of missing detection of the PCB.
Description
Technical Field
The invention relates to the technical field of PCB detection, in particular to a method for detecting defects of salient points on an ink surface of a PCB.
Background
Pcb (printed circuit board), i.e. printed wiring board, printed circuit board for short, is one of the important parts in the electronics industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a bonding pad for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate; aiming at the defects of ink protrusions of a PCB, due to the fact that the PCB is multiple in types, high in cost, high in development difficulty and the like, an effective detection method does not exist at present, and the problem that the nail top often has the defects is complained by customers of the nail top, so that the nail top urgently needs detection equipment to replace human eyes to check the defects of the bumps, and due to the fact that the human eyes check the defects, the problems of high labor intensity, difficulty in management, low efficiency, multiple omission and the like exist, the defect detection method for the ink surface bumps of the PCB is provided.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a method for detecting the defects of the salient points on the ink surface of the PCB.
In order to achieve the purpose, the invention adopts the following technical scheme:
a defect detection method for bumps on an ink surface of a PCB comprises the following steps:
step one, establishing a detection system: creating a PCB ink protrusion defect 3D detection software system, wherein the system consists of a communication module, an algorithm module and a display module;
step two, collecting a PCB image: after the PCB is placed in the detection equipment, receiving a picture collecting signal sent by a PLC of a lower computer through a communication module, and starting picture collection by a 3D camera;
step three, performing operation processing on the image of the PCB: the 3D camera sends the collected pictures to the algorithm module through the communication module, and the algorithm module carries out operation processing on the received 3D pictures;
step four, information display; the algorithm module displays the detection result after the picture processing to the display module, and stores the processed result picture on the storage module.
As further preferable in the present technical solution: in the first step, an image algorithm is built in the algorithm module.
As further preferable in the present technical solution: in the first step, the communication module is used for setting and storing the server IP and the port number, and receiving and sending the test data.
As further preferable in the present technical solution: in the second step, after the lower computer PLC sends out the image acquisition signal, the 3D camera is opened by the upper computer, then the 3D camera acquires images, and after the 3D camera finishes acquiring images, the upper computer takes out images from the memory of the 3D camera and places the images in the memory of the upper computer.
Compared with the prior art, the invention has the beneficial effects that:
the invention can replace the mode of checking by human eyes by using a software system to automatically detect the PCB, thereby reducing the defect of checking by human eyes, improving the detection efficiency of the PCB, reducing the cost of manual detection and manual management and avoiding the phenomenon of missing detection of the PCB.
Drawings
FIG. 1 is a flow chart of a method for detecting defects of bumps on an ink surface of a PCB according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1, a method for detecting defects of bumps on an ink surface of a PCB comprises the following steps:
step one, establishing a detection system: creating a PCB ink protrusion defect 3D detection software system, wherein the system consists of a communication module, an algorithm module and a display module, an image algorithm is arranged in the algorithm module, and the communication module is used for setting and storing an IP (Internet protocol) and a port number of a server and receiving and sending test data;
step two, collecting a PCB image: after the PCB is placed in the detection equipment, the lower computer PLC sends out a picture collecting signal through the communication module, the 3D camera is opened by the upper computer, then the 3D camera collects pictures, and after the 3D camera finishes picture collecting, the upper computer takes out pictures from the memory of the 3D camera and places the pictures in the memory of the upper computer;
step three, performing operation processing on the image of the PCB: the 3D camera sends the collected pictures to the algorithm module through the communication module, and the algorithm module carries out operation processing on the received 3D pictures by utilizing the image algorithm of the algorithm module;
step four, information display; the algorithm module displays the detection result after the picture processing to the display module, and stores the processed result picture on the storage module.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (4)
1. A defect detection method for bumps on an ink surface of a PCB is characterized by comprising the following steps:
step one, establishing a detection system: creating a PCB ink protrusion defect 3D detection software system, wherein the system consists of a communication module, an algorithm module and a display module;
step two, collecting a PCB image: after the PCB is placed in the detection equipment, receiving a drawing signal sent by a lower computer PLC through a communication module, and starting drawing by a 3D camera;
step three, performing operation processing on the image of the PCB: the 3D camera sends the collected pictures to the algorithm module through the communication module, and the algorithm module carries out operation processing on the received 3D pictures;
step four, information display; the algorithm module displays the detection result after the picture processing to the display module, and stores the processed result picture on the storage module.
2. The method as claimed in claim 1, wherein in the first step, the algorithm module is embedded with an image algorithm.
3. The method for detecting the defects of the ink surface salient points of the PCB as claimed in claim 1, wherein in the first step, the communication module is used for setting and storing an IP (Internet protocol) and a port number of a server and receiving and sending test data.
4. The method for detecting the defects of the salient points on the ink surface of the PCB as claimed in claim 1, wherein in the second step, after the lower computer PLC sends out a picture-taking signal, the 3D camera is opened by the upper computer, then the 3D camera takes pictures, and after the 3D camera finishes picture-taking, the upper computer takes pictures out of the memory of the 3D camera and puts the pictures into the memory of the upper computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111596205.7A CN114494131A (en) | 2021-12-24 | 2021-12-24 | Method for detecting defects of salient points on ink surface of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111596205.7A CN114494131A (en) | 2021-12-24 | 2021-12-24 | Method for detecting defects of salient points on ink surface of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114494131A true CN114494131A (en) | 2022-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111596205.7A Pending CN114494131A (en) | 2021-12-24 | 2021-12-24 | Method for detecting defects of salient points on ink surface of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114494131A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106651849A (en) * | 2016-12-27 | 2017-05-10 | 广东锐视智能检测有限公司 | Area-array camera-based PCB bare board defect detection method |
| CN110579479A (en) * | 2019-08-09 | 2019-12-17 | 康代影像科技(苏州)有限公司 | PCB maintenance system and maintenance method based on false point defect detection |
| CN113466261A (en) * | 2021-07-26 | 2021-10-01 | 鸿安（福建）机械有限公司 | PCB board automatic checkout device |
| JP2021180309A (en) * | 2020-05-15 | 2021-11-18 | 清華大学Tsinghua University | Two-dimensional pcb appearance defect real-time automatic detection technology based on deep learning |
-
2021
- 2021-12-24 CN CN202111596205.7A patent/CN114494131A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106651849A (en) * | 2016-12-27 | 2017-05-10 | 广东锐视智能检测有限公司 | Area-array camera-based PCB bare board defect detection method |
| CN110579479A (en) * | 2019-08-09 | 2019-12-17 | 康代影像科技(苏州)有限公司 | PCB maintenance system and maintenance method based on false point defect detection |
| JP2021180309A (en) * | 2020-05-15 | 2021-11-18 | 清華大学Tsinghua University | Two-dimensional pcb appearance defect real-time automatic detection technology based on deep learning |
| CN113466261A (en) * | 2021-07-26 | 2021-10-01 | 鸿安（福建）机械有限公司 | PCB board automatic checkout device |
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