CN114486879B - Material analysis method for checking analysis position and requirement of test piece through information system - Google Patents

Material analysis method for checking analysis position and requirement of test piece through information system Download PDF

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CN114486879B
CN114486879B CN202110767429.3A CN202110767429A CN114486879B CN 114486879 B CN114486879 B CN 114486879B CN 202110767429 A CN202110767429 A CN 202110767429A CN 114486879 B CN114486879 B CN 114486879B
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microscope
analysis
test piece
screen
computer
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CN114486879A (en
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柳纪纶
简文祥
姚文振
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Nanjing Fanquan Electronic Technology Co ltd
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Nanjing Fanquan Electronic Technology Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20008—Constructional details of analysers, e.g. characterised by X-ray source, detector or optical system; Accessories therefor; Preparing specimens therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20091—Measuring the energy-dispersion spectrum [EDS] of diffracted radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/227—Measuring photoelectric effect, e.g. photoelectron emission microscopy [PEEM]
    • G01N23/2273—Measuring photoelectron spectrum, e.g. electron spectroscopy for chemical analysis [ESCA] or X-ray photoelectron spectroscopy [XPS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0112—Apparatus in one mechanical, optical or electronic block

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Abstract

The invention discloses a material analysis method for checking analysis positions and analysis demands of test pieces through an information system, which is characterized in that screenshots are respectively carried out at different working sites and are respectively transmitted and stored to a designated site of a server, so that an analyst at each working site can conveniently check whether the analysis positions and analysis methods of samples to be analyzed at each working site are correct or not by utilizing the screenshots stored at each working site of the server, and the sample analysis is ensured to be error-free.

Description

Material analysis method for checking analysis position and requirement of test piece through information system
Technical Field
The invention discloses a material analysis method, and particularly relates to a material analysis method for checking analysis positions and analysis requirements of test pieces through an information system.
Background
The material analysis process generally requires processing at different working sites, including positioning and labeling the sample to be analyzed by using an optical microscope, cutting the sample to be analyzed positioned and labeled by the optical microscope by using a sample cutting microscope to form a test piece, drawing the test piece by using a test piece drawing device and placing the test piece on a carrier, loading the carrier with the test piece placed on the surface into the analysis microscope for analysis, and performing image capturing. However, images captured during processing at different working sites are currently printed or stored in computers of the working sites in a scattered manner, and an analyst at each working site cannot check whether the analysis position and the analysis requirement of the sample to be analyzed at each working site are correct.
In view of this, a material analysis method for checking the analysis position and analysis requirement of the test piece by an information system is desired in the industry.
Disclosure of Invention
The invention discloses a material analysis method for checking analysis positions and analysis requirements of a test piece through an information system, which comprises the following steps: providing a sample to be analyzed; providing an optical microscope module, wherein the optical microscope module comprises an optical microscope, a first computer and a first screen, the optical microscope, the first computer and the first screen are connected with each other, the first computer is connected with a server through the Internet, the optical microscope is used for observing the sample to be analyzed and searching the place to be analyzed of the sample to be analyzed, positioning labeling is further carried out on the place to be analyzed of the sample to be analyzed, after the images of the sample to be analyzed of the positioning labeling are synchronously presented on the first screen, the images presented on the first screen are intercepted to generate a first screenshot, and the first screenshot is transmitted and stored to a designated position of the server through the Internet by the first computer; providing a sample cutting microscope module, wherein the sample cutting microscope module comprises a sample cutting microscope, a second computer and a second screen, the sample cutting microscope, the second computer and the second screen are connected with each other, the second computer is connected with the server through the Internet, the sample to be analyzed, which is positioned and marked by the optical microscope, is cut by the sample cutting microscope to form a test piece, an image of the test piece is presented on the second screen, the image of the test piece presented on the second screen is intercepted to generate a second screenshot, and the second screenshot is transmitted and stored to the designated position of the server through the Internet by the second computer; providing a test piece drawing module, wherein the test piece drawing module comprises a test piece drawing device, a third computer and a third screen, the test piece drawing device, the third computer and the third screen are connected with each other, the third computer is connected with the server through the Internet, the test piece is drawn by the test piece drawing device and placed on a carrier, after an image of the carrier with the surface placed with the test piece is presented on the third screen, the image of the test piece presented on the third screen is intercepted to generate a third screenshot, and the third screenshot is transmitted and stored to the designated position of the server through the Internet by the third computer; and providing an analysis microscope module, wherein the analysis microscope module comprises an analysis microscope, a fourth computer and a fourth screen, the analysis microscope, the fourth computer and the fourth screen are connected with each other, the fourth computer is connected with the server through the Internet, the carrier with the test piece placed on the surface is loaded into the analysis microscope for analysis and shooting, the shot image is displayed on the fourth screen, the image of the test piece displayed on the fourth screen is intercepted to generate a fourth screenshot, and the fourth screenshot is transmitted and stored to the designated position of the server through the Internet by the fourth computer.
The above-mentioned material analysis method by checking the analysis position and analysis requirement of the test piece by the information system, and the above-mentioned optical microscope is ultra-high resolution digital microscope.
The above-mentioned material analysis method by checking the analysis position and analysis requirement of the test piece by the information system, wherein the above-mentioned ultra-high resolution digital microscope is an ultra-high resolution two micro optical microscope (2D Optical Microscope) or an ultra-high resolution three micro optical microscope (3D Optical Microscope).
The above-mentioned method for analyzing materials by checking the analysis position and analysis requirement of the test piece by an information system, and the above-mentioned sample cutting microscope is a Focused Ion Beam (FIB).
The above-mentioned analysis position and analysis requirement material analysis method by using information system to check test piece, and the above-mentioned test piece drawing device is a suction needle device.
In the material analysis method for checking the analysis position and the analysis requirement of the test piece through the information system, the carrier is a copper net.
The analysis microscope is an electron beam microscope, an ion beam microscope, a dual-particle beam microscope, an atomic force microscope, a mass spectrometer, an energy scattering spectrometer (SEM/EDS), a 3D laser confocal profiler (3D Laser confocal profile) or an X-ray photoelectron spectrometer (X-ray photoelectron spectroscopy; XPS).
The electron beam microscope is a Scanning Electron Microscope (SEM), a Transmission Electron Microscope (TEM), a scanning electron microscope/energy scattering spectrometer (SEM/EDS), or a transmission electron microscope/energy scattering spectrometer (TEM/EDS).
The method for analyzing the material by checking the analysis position and analysis requirement of the test piece by the information system is characterized in that the ion beam microscope is a focused ion beam microscope (FIB) or a plasma focused ion beam scanning electron microscope (PFIB).
The Dual-Beam microscope is a Dual-Beam focused ion Beam microscope (Dual Beam FIB) or a Dual-Beam focused ion Beam/energy scattering spectrometer (Dual Beam FIB/EDS).
Drawings
FIG. 1 is a flow chart of a method for analyzing materials by checking the analysis position and analysis requirement of a test piece through an information system according to an embodiment of the invention.
Fig. 2 is a block diagram of an optical microscope module 100 and a server 500 connected via the internet for use in a material analysis method for checking the analysis position and analysis requirement of a test piece by an information system according to an embodiment of the present invention.
FIG. 3 is a block diagram of a sample cutting microscope module 200 and a server 500 connected via the Internet for use in a material analysis method for checking the analysis position and analysis requirements of a test strip by an information system according to an embodiment of the present invention.
FIG. 4 is a block diagram of a sample cutting microscope module 300 and a server 500 connected via the Internet for use in a material analysis method for checking the analysis position and analysis requirements of a test strip by an information system according to an embodiment of the present invention.
Fig. 5 is a block diagram of an analysis microscope module 400 and a server 500 connected via the internet used in a material analysis method for checking analysis positions and analysis requirements of a test piece through an information system according to an embodiment of the present invention.
Fig. 6 is a block diagram illustrating a server 500 and first to fourth shots SS1 to SS4 transmitted to a designated location 510 stored in the server 500 used in a material analysis method for checking the analysis location and analysis requirement of a test piece by an information system according to an embodiment of the present invention.
Wherein the symbols in the drawings are briefly described as follows:
s1 step one
S2 step two
S3 step three
S4 step four
S5 step five
100. Optical microscope module
110. Optical microscope
130. First computer
150. First screen
200. Sample cutting microscope module
210. Sample cutting microscope
230. Second computer
250. Second screen
300. Test piece drawing module
310. Test piece drawing device
330. Third computer
350. Third screen
400. Analytical microscope module
410. Analytical microscope
430. First computer
450. First screen
500. Server device
510. Designated position
600. Internet network
SS1 first screenshot
SS2 second screenshot
SS3 third section
SS4 fourth screenshot
Detailed Description
For a more complete and thorough disclosure, the following illustrative descriptions of embodiments and specific examples of the present invention are presented; this is not the only form of practicing or implementing the invention as embodied. The embodiments disclosed below may be combined with or substituted for each other as desired, and other embodiments may be added to one embodiment without further description or illustration.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments below. However, embodiments of the invention may be practiced without these specific details. In other instances, well-known structures and devices are schematically depicted in order to simplify the drawings.
Examples
Referring to fig. 1 to 6, a material analysis method for checking analysis positions and analysis requirements of a test piece through an information system according to an embodiment of the invention includes the steps as shown in fig. 1, including:
step one (S1): providing a sample to be analyzed (not labeled);
step two (S2): providing an optical microscope module 100 as shown in fig. 2, wherein the optical microscope module 100 includes an optical microscope 110, a first computer 130 and a first screen 150, wherein the optical microscope 110, the first computer 130 and the first screen 150 are connected to each other, and the first computer 130 is connected to a server 500 through the internet 600, and the optical microscope 100 is used to observe the sample to be analyzed and search for the place to be analyzed, so as to perform positioning labeling on the place to be analyzed, and after the image of the sample to be analyzed with the positioning labeling is synchronously presented on the first screen 150, the image presented on the first screen 150 is intercepted to generate a first screenshot SS1, and the first screenshot SS1 is transmitted and stored to the designated location 510 of the server 500 as shown in fig. 6 through the internet 600 by the first computer 130;
step three (S3): providing a sample cutting microscope module 200 as shown in fig. 3, wherein the sample cutting microscope module 200 comprises a sample cutting microscope 210, a second computer 230 and a second screen 250, wherein the sample cutting microscope 210, the second computer 230 and the second screen 250 are connected with each other, the second computer 250 is connected with the server 500 through the internet 600, the sample to be analyzed, which is marked by the optical microscope 110, is cut by the sample cutting microscope 210 to form a test piece, an image of the test piece is presented on the second screen 250, the image of the test piece presented on the second screen 250 is cut to generate a second SS2, and the second screenshot SS2 is transmitted and stored to a designated position 510 of the server 500 as shown in fig. 6 through the second screenshot computer 230 through the internet 600;
step four (S4): providing a test strip drawing module 300 as shown in fig. 4, wherein the test strip drawing module 300 comprises a test strip drawing device 310, a third computer 330 and a third screen 350, wherein the test strip drawing device 310, the third computer 330 and the third screen 350 are connected with each other, the third computer 330 is connected with the server 500 through the internet 600, the test strip is drawn by the test strip drawing device 310 and placed on a carrier, and after the carrier image with the test strip placed on the surface is presented on the third screen 350, the image of the test strip presented on the third screen 350 is intercepted to generate a third section SS3, and the third section SS3 is transmitted and stored to a designated position 510 of the server 500 as shown in fig. 6 through the internet 600 by the third computer 330; and
step five (S5): providing an analysis microscope module 400 as shown in fig. 5, wherein the analysis microscope module 400 includes an analysis microscope 410, a fourth computer 430 and a fourth screen 450, wherein the analysis microscope 410, the fourth computer 430 and the fourth screen 450 are connected to each other, and the fourth computer 430 is connected to the server 500 through the internet 600, the carrier with the test strip placed on the surface is loaded into the analysis microscope 410 for analysis and photographing, after the photographed image is presented on the fourth screen 450, the image of the test strip presented on the fourth screen 450 is intercepted to generate a fourth screenshot SS4, and the fourth screenshot SS4 is transmitted and stored to the designated location 510 of the server 500 as shown in fig. 6 through the internet 600 by the fourth computer 430.
According to the method for analyzing the analysis position and the analysis requirement of the test piece through the information system disclosed in the present embodiment, the first screenshot S1, the second screenshot S2, the third screenshot S3 and the fourth screenshot S4 can be locally amplified, so as to facilitate the related inspection.
According to the method for analyzing the material by checking the analysis position and analysis requirement of the test piece through the information system disclosed in the present embodiment, the optical microscope 110 is an ultra-high resolution digital microscope, such as but not limited to an ultra-high resolution two-dimensional optical microscope (2D Optical Microscope) or an ultra-high resolution three-dimensional optical microscope (3D Optical Microscope).
According to the material analysis method for checking the analysis position and analysis requirement of the test piece by the information system disclosed in the present embodiment, the sample cutting microscope 210 is a Focused Ion Beam (FIB).
According to the material analysis method for checking the analysis position and analysis requirement of the test strip by the information system disclosed in the present embodiment, the test strip drawing device 310 is a suction needle device.
According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system disclosed in the embodiment, the carrier is a copper net.
According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system disclosed in the present embodiment, the analysis microscope 410 is an electron beam microscope, an ion beam microscope, a dual particle beam microscope, an atomic force microscope, a mass spectrometer, an energy scattering spectrometer (SEM/EDS), a 3D laser confocal profiler (3D Laser confocal profile) or an X-ray photoelectron spectrometer (X-ray photoelectron spectroscopy; XPS). The electron beam microscope is, for example, but not limited to, a Scanning Electron Microscope (SEM), a Transmission Electron Microscope (TEM), a scanning electron microscope/energy scattering spectrometer (SEM/EDS), or a transmission electron microscope/energy scattering spectrometer (TEM/EDS). The foregoing ion beam microscope is, for example, but not limited to, a focused ion beam microscope (FIB) or a plasma focused ion beam scanning electron microscope (PFIB). The aforementioned Dual particle Beam microscope is, for example, but not limited to, a Dual Beam focused ion Beam microscope (Dual Beam FIB), dual Beam focused ion Beam/energy scattering spectrometer (Dual Beam FIB/EDS).
According to the material analysis method for checking the analysis position and analysis requirement of the test strip through the information system disclosed in the embodiment, the analysis personnel of each work station can check whether the analysis position and analysis method of the sample to be analyzed at each work point are correct or not by using the screenshot of each work station stored at the designated location of the server, so as to ensure that the sample analysis is correct.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but may be variously modified and modified by those skilled in the art without departing from the spirit and scope of the present invention, and the scope of the present invention is defined by the appended claims.

Claims (10)

1. A material analysis method for checking an analysis position and an analysis requirement of a test piece by an information system, comprising the steps of: providing a sample to be analyzed; providing an optical microscope module, wherein the optical microscope module comprises an optical microscope, a first computer and a first screen, the optical microscope, the first computer and the first screen are connected with each other, the first computer is connected with a server through the Internet, the optical microscope is used for observing the sample to be analyzed and searching the position to be analyzed of the sample to be analyzed, positioning labeling is further carried out on the position to be analyzed of the sample to be analyzed, after the images of the sample to be analyzed with the positioning labeling are synchronously presented on the first screen, the images presented on the first screen are intercepted to generate a first screenshot, and the first screenshot is transmitted and stored to a designated position of the server through the Internet by the first computer; providing a sample cutting microscope module, wherein the sample cutting microscope module comprises a sample cutting microscope, a second computer and a second screen, the sample cutting microscope, the second computer and the second screen are connected with each other, the second computer is connected with the server through the Internet, the sample to be analyzed, which is positioned and marked by the optical microscope, is cut by the sample cutting microscope to form a test piece, an image of the test piece is presented on the second screen, the image of the test piece presented on the second screen is intercepted to generate a second screenshot, and the second screenshot is transmitted and stored to the designated position of the server through the Internet by the second computer; providing a test piece drawing module, wherein the test piece drawing module comprises a test piece drawing device, a third computer and a third screen, the test piece drawing device, the third computer and the third screen are connected with each other, the third computer is connected with the server through the Internet, the test piece is drawn by the test piece drawing device and placed on a carrier, after an image of the carrier with the surface placed with the test piece is presented on the third screen, the image of the test piece presented on the third screen is intercepted to generate a third screenshot, and the third screenshot is transmitted and stored to the designated position of the server through the Internet by the third computer; and providing an analysis microscope module, wherein the analysis microscope module comprises an analysis microscope, a fourth computer and a fourth screen, the analysis microscope, the fourth computer and the fourth screen are connected with each other, the fourth computer is connected with the server through the Internet, the carrier with the test piece placed on the surface is loaded into the analysis microscope for analysis and shooting, the shot image is displayed on the fourth screen, the image of the test piece displayed on the fourth screen is intercepted to generate a fourth screenshot, and the fourth screenshot is transmitted and stored to the designated position of the server through the Internet by the fourth computer.
2. The method for analyzing a material for a test piece according to claim 1, wherein the optical microscope is an ultra-high resolution digital microscope.
3. The method for analyzing a material for a test piece according to claim 2, wherein the ultra-high resolution digital microscope is an ultra-high resolution two-dimensional optical microscope or an ultra-high resolution three-dimensional optical microscope.
4. The method of claim 1, wherein the sample cutting microscope is a focused ion beam microscope.
5. The method of claim 1, wherein the test strip drawing device is a suction needle device.
6. The method of claim 1, wherein the carrier is a copper mesh.
7. The method according to claim 1, wherein the analysis microscope is an electron beam microscope, an ion beam microscope, a dual particle beam microscope, an atomic force microscope, a mass spectrometer, an energy scattering spectrometer, a 3D laser confocal profiler, or an X-ray photoelectron spectrometer.
8. The method according to claim 7, wherein the electron beam microscope is a scanning electron microscope, a transmission electron microscope, a scanning electron microscope/energy scattering spectrometer or a transmission electron microscope/energy scattering spectrometer.
9. The method of analyzing a specimen for analysis position and analysis requirement by an information system according to claim 7, wherein the ion beam microscope is a focused ion beam microscope or a plasma focused ion beam scanning electron microscope.
10. The method of analyzing a specimen for a position and a requirement of analysis by an information system according to claim 7, wherein the dual beam microscope is a dual beam focused ion beam microscope or a dual beam focused ion beam/energy scattering spectrometer.
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