CN114486052A - Shell insulation type piezoelectric pressure sensor - Google Patents
Shell insulation type piezoelectric pressure sensor Download PDFInfo
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- CN114486052A CN114486052A CN202210148405.4A CN202210148405A CN114486052A CN 114486052 A CN114486052 A CN 114486052A CN 202210148405 A CN202210148405 A CN 202210148405A CN 114486052 A CN114486052 A CN 114486052A
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- 238000009413 insulation Methods 0.000 title claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 65
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000002955 isolation Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000009529 body temperature measurement Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 9
- 238000009530 blood pressure measurement Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 6
- 239000012528 membrane Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004880 explosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M9/00—Aerodynamic testing; Arrangements in or on wind tunnels
- G01M9/06—Measuring arrangements specially adapted for aerodynamic testing
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention belongs to the technical field of pulse wind tunnel tests and discloses a shell insulation type piezoelectric pressure sensor. The piezoelectric pressure sensor is of a three-layer sleeve type structure, the outer layer is a shell, the inner layer is a pressure bearing seat, and the middle layer is an upper pressure rod which is used for fixedly jacking the pressure bearing seat in the shell. The piezoelectric pressure sensor utilizes the insulating ceramic chip, the insulating ceramic ring I and the insulating ceramic ring II to isolate the pressure bearing seat from the shell, thereby realizing the insulation between the shell and the sensor measuring main body; an IEPE integrated circuit chip is adopted to amplify a weak signal of the piezoelectric pressure sensor and convert high-impedance input of the piezoelectric pressure sensor into low-impedance output; the shell is grounded, so that the influence of a severe measurement environment on a measurement result is avoided. The piezoelectric pressure sensor has the advantages of reliable structure and high measurement precision, and is suitable for pressure measurement under the environmental conditions of oil stain, water, plasma and the like.
Description
Technical Field
The invention belongs to the technical field of pulse wind tunnel tests, and particularly relates to a shell insulation type piezoelectric pressure sensor.
Background
The piezoelectric pressure sensor adopts a piezoelectric material as a sensitive element, under the action of external force, two surfaces of the piezoelectric material generate charges with equal size and opposite polarity, and the quantity of the charge quantity is in direct proportion to the size of the applied external force. The piezoelectric pressure sensor has the characteristics of high sensitivity, good linearity and high frequency response, and is mainly used for measuring dynamic pressure, such as pressure measurement in turbulence, explosion, ballistics, engine combustion and pulse wind tunnels. The housing of a conventional piezoelectric pressure sensor is in direct contact with the piezoelectric material as one electrode of the sensor, and the surface of the piezoelectric material not in contact with the housing is the other electrode. In a high enthalpy pulsed wind tunnel, the test gas flow dissociates at high temperature, creating a plasma within the shock layer, in which case the housing of a conventional pressure sensor contacts the plasma, causing the sensor to fail. In some severe measurement environments, such as a combustion field, the measurement result of the piezoelectric pressure sensor is also affected by the presence of products such as water vapor in the measurement environment.
Currently, there is a need to develop a shell-insulated piezoelectric pressure sensor.
Disclosure of Invention
The invention aims to provide a shell insulation type piezoelectric pressure sensor.
The invention relates to a shell insulation type piezoelectric pressure sensor which is characterized by comprising a shell, an upper pressure rod, a pressure bearing seat, a piezoelectric ring, a piezoelectric sheet, a conductive disc, a diaphragm, an insulating ceramic sheet, a force transmission block, an inner sleeve, an insulating ceramic ring I, an insulating ceramic ring II, a wiring seat, insulating glue, a lead and an IEPE integrated circuit chip; the piezoelectric pressure sensor is of a three-layer sleeve type structure, the outer layer is a shell, the inner layer is a pressure bearing seat, and the middle layer is an upper pressure rod which is used for fixedly jacking the pressure bearing seat in the shell;
the shell is a pipe section I, the upper section and the lower section are both cylindrical sections, the middle section is a convex hexagonal column section, the center is a step cavity I, the radius of the upper part of the step cavity I is small, the radius of the lower part of the step cavity I is large, and the lower part of the step cavity I is also provided with an internal thread; the outer shell is externally connected with a ground wire;
the upper pressure lever is a step cylindrical section with small upper part radius and large lower part radius, the upper part of the step cylindrical section is provided with an external thread matched with the internal thread of the shell, and the center of the step cylindrical section is a cylindrical cavity;
the pressure bearing seat is a pipe section II, the upper section and the lower section are cylindrical sections, the top of the upper section is provided with a cylindrical surface matched with the inner sleeve, the middle section is a convex cylindrical boss, the center of the middle section is a step cavity II, the upper part of the step cavity II is a lead hole, the lower part of the step cavity II is an inner hole, and the diameter of the inner hole is larger than that of the lead hole; an IEPE integrated circuit chip is placed in the inner hole, a lead wire of the IEPE integrated circuit chip extends upwards out of the lead hole, and a signal wire of the IEPE integrated circuit chip extends downwards out of the inner hole;
the piezoelectric ring is annular, and the conductive disc, the piezoelectric sheet, the force transmission block and the insulating ceramic sheet are all cylindrical and have the same outer diameter; sequentially stacking the piezoelectric rings, the conductive disc, the piezoelectric sheets and the force transmission block from bottom to top according to the sequence, sleeving an inner sleeve outside to obtain a combined body I, wherein the outer diameter of the combined body I is the same as the diameter of the upper section of the pressure bearing seat;
the piezoelectric pressure sensor is assembled as follows:
s1, sleeving an insulating ceramic ring I above a boss of a pressure bearing seat (3), and sleeving an insulating ceramic ring II below the boss;
s2, sleeving an inner sleeve of the assembly I on a cylindrical surface at the top of the upper section of the pressure bearing seat, and connecting a lead with a conductive disc by penetrating through a central ring of the piezoelectric ring to obtain an assembly II;
s3, penetrating the assembly II into the shell from bottom to top, enabling the insulating ceramic ring I to be in contact with the end face of the step cavity I of the shell, and enabling an isolation gap I to be formed between the outer diameter of the assembly II and the step cavity I of the shell;
s4, inserting an upper pressure rod into the isolation gap I from bottom to top, screwing the external thread of the upper pressure rod and the internal thread of the shell, and pressing the pressure-bearing seat tightly, namely pressing the insulating ceramic ring I on the end face of the step cavity I of the shell; an isolation gap II is formed between the pressure bearing seat and the upper pressure rod;
s5, filling insulating glue in the isolation gap II;
s6, installing a cylindrical insulating ceramic piece with the same diameter as the force transfer block above the force transfer block, wherein the height of the insulating ceramic piece is flush with the upper end face of the shell;
and S7, welding and packaging the diaphragm on the upper end surface of the shell, and finishing the assembly of the piezoelectric pressure sensor.
Furthermore, the piezoelectric rings and the piezoelectric sheets are made of piezoelectric crystals or piezoelectric ceramics; the insulating ceramic sheet, the insulating ceramic ring I and the insulating ceramic ring II are made of aluminum oxide or zirconium oxide.
Furthermore, the piezoelectric rings and the piezoelectric sheets are made of high-temperature piezoelectric materials, namely langasite piezoelectric crystals, YCOB piezoelectric crystals or high-temperature piezoelectric ceramics; the insulating ceramic plate, the insulating ceramic ring I and the insulating ceramic ring II are made of heat-insulating ceramic material zirconia ceramics, and the piezoelectric pressure sensor for the high-temperature measurement environment is obtained.
Furthermore, the conductive disc is made of conductive metal including metal copper, and the force transmission block is made of high-strength metal 1Cr18Ni9Ti, 17-4 stainless steel or 306L stainless steel.
Further, the membrane is a circular flat membrane.
Furthermore, the conducting disc and the piezoelectric sheet are provided with N groups, wherein N is more than or equal to 3 and less than or equal to 9, so that piezoelectric stack is formed, and the measuring sensitivity is improved.
Furthermore, a wire holder is installed at the outlet of the lower end of the inner hole, the IEPE integrated circuit chip is in circuit connection with the wire holder, and signals are transmitted through the wire holder; the wire holder is two-core sockets, and the plug that matches is LENO to connect, 2 core aviation connectors or BNC connects.
Furthermore, the IEPE integrated circuit chip in the inner hole is removed, the conducting wire is upwards connected with the conducting disc, and the inner hole of the pressure bearing seat is downwards led out, so that the charge type piezoelectric pressure sensor is obtained.
Furthermore, the insulating glue is epoxy resin glue.
Furthermore, the IEPE integrated circuit chip is a small differential charge amplifier circuit or a voltage amplifier circuit.
The shell insulation type piezoelectric pressure sensor utilizes the insulation ceramic plate, the insulation ceramic ring I and the insulation ceramic ring II to isolate the pressure bearing seat from the shell, thereby realizing the insulation between the shell and the sensor measuring main body; an IEPE integrated circuit chip is adopted to amplify a weak signal of the piezoelectric pressure sensor and convert high-impedance input of the piezoelectric pressure sensor into low-impedance output; the shell is grounded, and sensor failure caused by plasma in a measuring environment is avoided.
The shell insulation type piezoelectric pressure sensor has the advantages of reliable structure and high measurement precision, is suitable for the piezoelectric pressure sensor, has reliable structure and high measurement precision, and is suitable for pressure measurement under the environmental conditions of oil stain, water, plasma and the like.
Drawings
FIG. 1 is a schematic structural view (cross-sectional view) of a piezoelectric pressure sensor with an insulated housing according to the present invention;
FIG. 2 is a schematic structural diagram (cross-sectional view) of a combined body II in the shell insulation type piezoelectric pressure sensor according to the present invention;
fig. 3 is a schematic view (perspective view) of a housing in the piezoelectric pressure sensor of the housing insulation type according to the present invention;
fig. 4 is a schematic view (perspective view) of an upper pressure lever in the case insulation type piezoelectric pressure sensor according to the present invention;
fig. 5 is a schematic view (perspective view) of a pressure-bearing seat in the shell insulation type piezoelectric pressure sensor according to the present invention;
fig. 6 is a schematic view (cross-sectional view) of a pressure receiving seat in the shell insulation type piezoelectric pressure sensor according to the present invention;
fig. 7 is a schematic diagram (perspective view) of an inner sleeve in the case-insulated piezoelectric pressure sensor according to the present invention;
fig. 8 is a schematic view (perspective view) of a piezoelectric sheet in the shell insulation type piezoelectric pressure sensor according to the present invention;
fig. 9 is a schematic view (perspective view) of a piezoelectric ring in the case-insulated piezoelectric pressure sensor according to the present invention.
In the figure, 1. a housing; 2. an upper pressure lever; 3. a pressure bearing seat; 4. a piezoelectric ring; 5. a piezoelectric sheet; 6. a conductive plate; 7. a membrane; 8. an insulating ceramic sheet; 9. a force transfer block; 10. an inner sleeve; 12. a wire holder; 13. insulating glue; 14. a wire; an IEPE integrated circuit chip;
301. a boss; 302. a wire hole; 303. an inner bore;
1101. an insulating ceramic ring I; 1102. and an insulating ceramic ring II.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Example 1
As shown in fig. 1 and fig. 2, the shell insulation type piezoelectric pressure sensor of the present embodiment includes a shell 1, an upper pressure rod 2, a pressure-bearing seat 3, a piezoelectric ring 4, a piezoelectric sheet 5, a conductive disc 6, a diaphragm 7, an insulating ceramic sheet 8, a force transmission block 9, an inner sleeve 10, an insulating ceramic ring i 1101, an insulating ceramic ring ii 1102, a wire holder 12, an insulating glue 13, a wire 14, and an IEPE integrated circuit chip 15; the piezoelectric pressure sensor is of a three-layer sleeve type structure, the outer layer is a shell 1, the inner layer is a pressure bearing seat 3, and the middle layer is an upper pressure rod 2 which tightly supports and fixes the pressure bearing seat 3 in the shell 1;
as shown in fig. 3, the shell 1 is a pipe section i, the upper section and the lower section are both cylindrical sections, the middle section is a convex hexagonal column section, the center is a step cavity i, the radius of the upper part of the step cavity i is small, the radius of the lower part of the step cavity i is large, and the lower part of the step cavity i is also provided with an internal thread; the shell 1 is externally connected with a ground wire;
as shown in fig. 4, the upper pressure lever 2 is a stepped cylindrical section with a small upper radius and a large lower radius, the upper part of the stepped cylindrical section is provided with an external thread matched with the internal thread of the housing 1, and the center is a cylindrical cavity;
as shown in fig. 5 and 6, the pressure bearing seat 3 is a pipe section ii, the upper section and the lower section are both cylindrical sections, the top of the upper section is provided with a cylindrical surface matched with the inner sleeve 10 shown in fig. 7, the middle section is a convex cylindrical boss 301, the center is a step cavity ii, the upper part of the step cavity ii is a lead hole 302, the lower part of the step cavity ii is an inner hole 303, and the diameter of the inner hole 303 is larger than that of the lead hole 302; an IEPE integrated circuit chip 15 is placed in the inner hole 303, a lead wire 14 of the IEPE integrated circuit chip 15 extends upwards out of the lead hole 302, and a signal wire of the IEPE integrated circuit chip 15 extends downwards out of the inner hole 303;
as shown in fig. 8 and 9, the piezoelectric ring 4 is circular, and the conductive disc 6, the piezoelectric sheet 5, the force transmission block 9 and the insulating ceramic sheet 8 are all cylindrical and have the same outer diameter; sequentially stacking the piezoelectric rings 4, the conductive disc 6, the piezoelectric sheets 5 and the force transmission block 9 from bottom to top, sleeving an inner sleeve 10 on the outer part to obtain a combined body I, wherein the outer diameter of the combined body I is the same as the diameter of the upper section of the pressure bearing seat 3;
the piezoelectric pressure sensor is assembled as follows:
s1, sleeving an insulating ceramic ring I1101 above a boss 301 of a pressure bearing seat 3, and sleeving an insulating ceramic ring II 1102 below the boss 301;
s2, sleeving an inner sleeve 10 of the combination I on a cylindrical surface at the top of the upper section of the pressure bearing seat 3, and connecting a lead 14 with the conductive disc 6 after penetrating through a central ring of the piezoelectric ring 4 to obtain a combination II;
s3, penetrating the assembly II into the shell 1 from bottom to top, enabling the insulating ceramic ring I1101 to be in contact with the end face of the step cavity I of the shell 1, and enabling an isolation gap I to be formed between the outer diameter of the assembly II and the step cavity I of the shell 1;
s4, inserting the upper pressure rod 2 into the isolation gap I from bottom to top, screwing the external thread of the upper pressure rod 2 and the internal thread of the shell 1, and pressing the pressure-bearing seat 3 tightly, namely pressing the insulating ceramic ring I1101 on the end face of the step cavity I of the shell 1; an isolation gap II is formed between the pressure bearing seat 3 and the upper pressure rod 2;
s5, filling insulating glue 13 in the isolation gap II;
s6, a cylindrical insulating ceramic sheet 8 with the same diameter as the force transfer block 9 is arranged above the force transfer block 9, and the height of the insulating ceramic sheet 8 is flush with the upper end face of the shell 1;
and S7, welding and packaging the diaphragm 7 on the upper end surface of the shell 1, and finishing the assembly of the piezoelectric pressure sensor.
Furthermore, the piezoelectric rings 4 and the piezoelectric sheets 5 are made of piezoelectric crystals or piezoelectric ceramics; the insulating ceramic sheet 8, the insulating ceramic ring I1101 and the insulating ceramic ring II 1102 are made of aluminum oxide or zirconium oxide.
Furthermore, the piezoelectric rings 4 and the piezoelectric sheets 5 are made of high-temperature piezoelectric materials, such as langasite piezoelectric crystals, YCOB piezoelectric crystals or high-temperature piezoelectric ceramics; the insulating ceramic sheet 8, the insulating ceramic ring I1101 and the insulating ceramic ring II 1102 are made of heat-insulating ceramic material zirconia ceramics, and the piezoelectric pressure sensor for the high-temperature measurement environment is obtained.
Furthermore, the conductive disc 6 is made of conductive metal including copper, and the force transmission block 9 is made of high-strength metal 1Cr18Ni9Ti, 17-4 stainless steel or 306L stainless steel.
Further, the membrane 7 is a circular flat membrane.
Furthermore, the conductive disc 6 and the piezoelectric sheet 5 are provided with N groups, wherein N is more than or equal to 3 and less than or equal to 9, so that piezoelectric stack is formed, and the measurement sensitivity is improved.
Further, a wire holder 12 is installed at an outlet of the lower end of the inner hole 303, the IEPE integrated circuit chip 15 is in circuit connection with the wire holder 12, and signals are transmitted through the wire holder 12; the connector base 12 is a two-pin socket, and the matched plug is an LENO connector, a 2-pin aviation connector or a BNC connector.
Further, the IEPE ic chip 15 in the inner hole 303 is removed, the conducting wire 14 is connected to the conducting disc 6 upwards, and led out of the inner hole 303 of the pressure-bearing seat 3 downwards, so as to obtain the charge type piezoelectric pressure sensor.
Further, the insulating glue 13 is epoxy resin glue.
Further, the IEPE integrated circuit chip 15 is a small differential charge amplifier circuit or a voltage amplifier circuit.
Although the embodiments of the present invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, but it can be applied to various fields suitable for the present invention. Additional modifications and refinements of the present invention will readily occur to those skilled in the art without departing from the principles of the present invention, and therefore the present invention is not limited to the specific details and illustrations shown and described herein without departing from the general concept defined by the claims and their equivalents.
Claims (10)
1. A shell insulation type piezoelectric pressure sensor is characterized by comprising a shell (1), an upper pressure rod (2), a pressure bearing seat (3), a piezoelectric ring (4), a piezoelectric piece (5), a conductive disc (6), a diaphragm (7), an insulating ceramic piece (8), a force transmission block (9), an inner sleeve (10), an insulating ceramic ring I (1101), an insulating ceramic ring II (1102), a wire holder (12), an insulating adhesive (13), a lead (14) and an IEPE integrated circuit chip (15); the piezoelectric pressure sensor is of a three-layer sleeve type structure, the outer layer is a shell (1), the inner layer is a pressure bearing seat (3), and the middle layer is an upper pressure rod (2) which tightly supports and fixes the pressure bearing seat (3) in the shell (1);
the shell (1) is a pipe section I, the upper section and the lower section are both cylindrical sections, the middle section is a convex hexagonal column section, the center is a step cavity I, the radius of the upper part of the step cavity I is small, the radius of the lower part of the step cavity I is large, and the lower part of the step cavity I is also provided with internal threads; the shell (1) is externally connected with a ground wire;
the upper pressure lever (2) is a step cylindrical section with small upper radius and large lower radius, the upper part of the step cylindrical section is provided with an external thread matched with the internal thread of the shell (1), and the center of the step cylindrical section is a cylindrical cavity;
the pressure bearing seat (3) is a pipe section II, the upper section and the lower section are both cylindrical sections, the top of the upper section is provided with a cylindrical surface matched with the inner sleeve (10), the middle section is a convex cylindrical boss (301), the center is a step cavity II, the upper part of the step cavity II is a lead hole (302), the lower part of the step cavity II is an inner hole (303), and the diameter of the inner hole (303) is larger than that of the lead hole (302); an IEPE integrated circuit chip (15) is placed in the inner hole (303), a lead wire (14) of the IEPE integrated circuit chip (15) extends upwards out of the lead hole (302), and a signal wire of the IEPE integrated circuit chip (15) extends downwards out of the inner hole (303);
the piezoelectric ring (4) is annular, and the conductive disc (6), the piezoelectric sheet (5), the force transmission block (9) and the insulating ceramic sheet (8) are all cylindrical and have the same outer diameter; sequentially stacking a piezoelectric ring (4), a conductive disc (6), a piezoelectric sheet (5) and a force transmission block (9) from bottom to top, sleeving an inner sleeve (10) on the outside to obtain a combined body I, wherein the outer diameter of the combined body I is the same as the diameter of the upper section of the pressure bearing seat (3);
sequentially stacking a piezoelectric ring (4), a conductive disc (6), a piezoelectric sheet (5) and a force transmission block (9) from bottom to top, sleeving an inner sleeve (10) on the outside to obtain a combined body I, wherein the outer diameter of the combined body I is the same as the diameter of the upper section of the pressure bearing seat (3);
the piezoelectric pressure sensor is assembled as follows:
s1, sleeving an insulating ceramic ring I (1101) above a boss (301) of a pressure bearing seat (3), and sleeving an insulating ceramic ring II (1102) below the boss (301);
s2, sleeving an inner sleeve (10) of the assembly I on a cylindrical surface at the top of the upper section of the pressure bearing seat (3), and connecting a lead (14) with a conductive disc (6) through a central ring of the piezoelectric ring (4) to obtain an assembly II;
s3, penetrating the assembly II into the shell (1) from bottom to top, enabling the insulating ceramic ring I (1101) to be in contact with the end face of the step cavity I of the shell (1), and enabling an isolation gap I to be formed between the outer diameter of the assembly II and the step cavity I of the shell (1);
s4, inserting the upper pressure lever (2) into the isolation gap I from bottom to top, screwing the external thread of the upper pressure lever (2) and the internal thread of the shell (1), and pressing the pressure-bearing seat (3), namely pressing the insulating ceramic ring I (1101) on the end face of the step cavity I of the shell (1); an isolation gap II is arranged between the pressure bearing seat (3) and the upper pressure lever (2);
s5, filling insulating glue (13) in the isolation gap II;
s6, a cylindrical insulating ceramic sheet (8) with the same diameter as the force transfer block (9) is arranged above the force transfer block (9), and the height of the insulating ceramic sheet (8) is flush with the upper end face of the shell (1);
and S7, welding and packaging the diaphragm (7) on the upper end face of the shell (1), and finishing the assembly of the piezoelectric pressure sensor.
2. The shell-insulated piezoelectric pressure sensor according to claim 1, wherein the piezoelectric rings (4) and the piezoelectric sheets (5) are made of piezoelectric crystals or piezoelectric ceramics; the insulating ceramic sheet (8), the insulating ceramic ring I (1101) and the insulating ceramic ring II (1102) are made of aluminum oxide or zirconium oxide.
3. The piezoelectric pressure sensor of claim 1, wherein the piezoelectric rings (4) and the piezoelectric sheets (5) are made of langasite piezoelectric crystals or YCOB piezoelectric crystals; the insulating ceramic plate (8), the insulating ceramic ring I (1101) and the insulating ceramic ring II (1102) are made of zirconia ceramics, and the piezoelectric pressure sensor for the high-temperature measurement environment is obtained.
4. The piezoelectric pressure sensor according to claim 1, wherein the conductive plate (6) is made of a conductive metal including copper, and the force-transmitting block (9) is made of 1Cr18Ni9Ti, 17-4 stainless steel or 306L stainless steel.
5. The piezoelectric shell-insulated pressure sensor according to claim 1, wherein the diaphragm (7) is a disc-shaped flat diaphragm.
6. The piezoelectric shell-insulated pressure sensor according to claim 1, wherein the conductive plate (6) and the piezoelectric plate (5) have N groups, 3. ltoreq. N.ltoreq.9, forming a piezoelectric stack.
7. The case-insulated piezoelectric pressure sensor according to claim 1, wherein a wire holder (12) is installed at the outlet of the lower end of the inner hole (303), and the IEPE integrated circuit chip (15) is electrically connected to the wire holder (12) and transmits a signal through the wire holder (12); the wire holder (12) is a two-core socket, and the matched plug is an LENO connector, a 2-core aviation connector or a BNC connector.
8. The shell-insulated piezoelectric pressure sensor according to claim 1, wherein the IEPE ic chip (15) is removed from the inner hole (303), the conductive wire (14) is connected to the conductive plate (6) upward, and the inner hole (303) of the pressure receiving base (3) is led out downward, thereby obtaining a charged piezoelectric pressure sensor.
9. The piezoelectric pressure transducer of the casing insulation type according to claim 1, wherein the insulation paste (13) is epoxy paste.
10. The shell insulated piezoelectric pressure transducer of claim 1, wherein the IEPE integrated circuit chip (15) is a small differential charge amplifier circuit or a voltage amplifier circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210148405.4A CN114486052B (en) | 2022-02-18 | 2022-02-18 | Shell insulation type piezoelectric pressure sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210148405.4A CN114486052B (en) | 2022-02-18 | 2022-02-18 | Shell insulation type piezoelectric pressure sensor |
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| CN114486052A true CN114486052A (en) | 2022-05-13 |
| CN114486052B CN114486052B (en) | 2023-03-21 |
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| CN114486052B (en) | 2023-03-21 |
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