CN114485236A

CN114485236A - Temperature equalizing plate structure and capillary layer structure thereof

Info

Publication number: CN114485236A
Application number: CN202011164538.8A
Authority: CN
Inventors: 巽昭生; 王伟国
Original assignee: Kunshan Juzhong Electronics Co ltd
Current assignee: Kunshan Juzhong Electronics Co ltd
Priority date: 2020-10-27
Filing date: 2020-10-27
Publication date: 2022-05-13

Abstract

A temperature-uniforming plate structure comprises a lower cover, an upper cover and a capillary layer; the lower cover is provided with a lower sealing edge and a lower concave area which is positioned on the inner surface of the lower cover and surrounded by the lower sealing edge, a plurality of lower grooves are arranged in the lower concave area, the upper cover is covered with the lower cover, the upper cover is provided with an upper sealing edge and an upper concave area which is positioned on the inner surface of the upper cover and surrounded by the upper sealing edge, the upper sealing edge corresponds to the lower sealing edge and tightly seals the edge, and the capillary layer is arranged between the lower concave area and the upper concave area; wherein the capillary layer is formed by etching to form a plurality of through etching holes.

Description

Temperature equalizing plate structure and capillary layer structure thereof

Technical Field

The present invention relates to a heat conduction device, and more particularly, to a vapor chamber structure and a capillary layer structure thereof.

Background

Conventionally, Heat pipes (Heat Pipe) or Vapor Chamber (Vapor Chamber) have been used in thin electronic products to provide Heat dissipation for the internal electronic heating elements. Therefore, in order to maintain the thermal conductivity in the space required for thinning, the conventional plate heat pipe or vapor chamber is required to have a certain allowable thickness.

The prior thinned temperature-equalizing plate still comprises an upper cover, a lower cover and a capillary layer, so that the working fluid is provided through the capillary layer sandwiched in the middle to have better transmission effect; the capillary layer is usually formed by a mesh grid or powder sintering, and the mesh grid is mostly used for thinning. However, although the woven mesh has a thin characteristic, the woven mesh is significantly poor in structural strength, and usually, grooves are formed in the lower cover of the temperature equalization plate by etching, and a certain capillary force can be provided between the grooves and the capillary layer formed by the woven mesh, but the density is not consistent, so that the matching effect is poor.

In view of the above, the present invention provides a method for improving and solving the above-mentioned deficiencies, which is a reasonable design and can effectively improve the above-mentioned deficiencies by studying and applying the theory.

Disclosure of Invention

The main objective of the present invention is to provide a vapor chamber structure and a capillary layer structure thereof, wherein a metal sheet is etched to form dense holes thereon, so as to match with an etching trench structure in a lower cover of the vapor chamber, thereby providing a certain structural strength and better adaptability.

In order to achieve the above object, the present invention provides a vapor chamber structure, which includes a lower cap, an upper cap, and a capillary layer; the lower cover is provided with a lower sealing edge and a lower concave area which is positioned on the inner surface of the lower cover and surrounded by the lower sealing edge, a plurality of lower grooves are arranged in the lower concave area, the upper cover is covered with the lower cover, the upper cover is provided with an upper sealing edge and an upper concave area which is positioned on the inner surface of the upper cover and surrounded by the upper sealing edge, the upper sealing edge corresponds to the lower sealing edge and tightly seals the edge, and the capillary layer is arranged between the lower concave area and the upper concave area; the capillary layer is a metal sheet, and a capillary zone is formed on the capillary layer by etching, wherein the capillary zone is formed by a plurality of etching holes penetrating through the upper surface and the lower surface of the capillary layer.

In order to achieve the above object, the present invention further provides a capillary layer structure disposed in a vapor chamber, wherein the capillary layer structure is a metal sheet and has a capillary region formed thereon by etching, and the capillary region is formed by a plurality of etching holes penetrating through upper and lower surfaces of the capillary layer structure.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

Fig. 1 is a schematic perspective exploded view of the present invention.

Fig. 2 is a partial sectional view schematically showing the internal structure of the present invention.

FIG. 3 is an enlarged, fragmentary detail of the surface of a capillary layer according to the present invention.

Fig. 4 is an enlarged detail view of a portion of the capillary layer cross-section of the present invention.

Reference numerals

1: lower cover

10 lower sealing edge

11 lower depressed area

110 lower groove

12 lower degassing end

2: upper cover

20, upper sealing edge

21 upper concave area

210 upper groove

22 upper degassing end

3 capillary layer

30 capillary zone

31 etching holes

Detailed Description

The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:

please refer to fig. 1, which is a schematic exploded view of the present invention. The invention provides a temperature-uniforming plate structure and a capillary layer structure thereof, wherein the temperature-uniforming plate structure comprises a lower cover 1, an upper cover 2 and a capillary layer 3 arranged between the lower cover 1 and the upper cover 2; wherein:

the lower cover 1 and the upper cover 2 can be made of a plate-like material such as aluminum or copper. The lower cover 1 has a lower sealing edge 10 surrounding its periphery, and a lower recessed area 11 located on the inner surface of the lower cover 1 and surrounded by the lower sealing edge 10, and a plurality of lower grooves 110 are disposed in the lower recessed area 11, and the lower grooves 110 are fully distributed in the lower recessed area 11. A lower degassing end 12 may be protruded from either side of the lower cover 1.

The upper cover 2 and the lower cover 1 are covered, the upper cover 2 has an upper sealing edge 20 surrounding the periphery thereof and an upper concave area 21 located on the inner surface of the upper cover 2 and surrounded by the upper sealing edge 20, and the upper sealing edge 20 is tightly sealed corresponding to the lower sealing edge 10 of the lower cover 1, so that the upper concave area 21 of the upper cover 2 corresponds to the lower concave area 11 of the lower cover 1, and the capillary layer 3 is located between the lower concave area 11 and the upper concave area 21; a plurality of upper grooves 210 may also be disposed in the upper concave region 21, and the upper grooves 210 are distributed in the upper concave region 21. In addition, an upper degassing end 22 may be protruded from any side of the upper lid 2 and corresponds to the lower degassing end 12 of the lower lid 1, so as to be required for degassing after sealing the edges of the lower lid 1 and the upper lid 2.

As shown in fig. 1 and 2, the capillary layer 3 is disposed between the lower cover 1 and the upper cover 2, so that the capillary layer 3 is sandwiched between the lower concave region 11 of the lower cover 1 and the upper concave region 21 of the upper cover 2. The capillary layer 3 is made of a thin metal sheet, such as a copper sheet, and a capillary region 30 is formed on the capillary layer 3 by etching (as shown in fig. 3), wherein the capillary region 30 is formed by a plurality of etching holes 31 penetrating through the upper and lower surfaces of the capillary layer 3, and the etching holes 31 are mutually communicated (as shown in fig. 4).

Referring to fig. 2, since the capillary layer 3 is disposed between the lower cap 1 and the upper cap 2, at least the capillary region 30 of the capillary layer 3 can contact the lower groove 110 of the lower cap 1, so that the etching holes 31 formed by etching can improve the capillary force between the lower cap 1 and the capillary layer 3, and the working fluid can freely flow through the etching holes 31 without being hindered by the limitation of the capillary layer 3 being plate-shaped. In addition, if the upper groove 210 is also disposed in the upper concave region 21 of the upper cap 2, the same effect as the lower cap 1 can be obtained, or the temperature equalization plate can be used without distinguishing the upper and lower positions, so as to improve the structural strength and the capillary force between the temperature equalization plate and the capillary layer 3.

Therefore, the temperature-uniforming plate structure and the capillary layer structure thereof can be obtained by the structural composition.

The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A vapor panel structure, comprising:

a lower cover having a lower sealing edge and a lower concave area located on the inner surface of the lower cover and surrounded by the lower sealing edge, and a plurality of lower grooves are arranged in the lower concave area;

an upper cover, which is covered with the lower cover and is provided with an upper sealing edge and an upper sunken area which is positioned on the inner surface of the upper cover and is surrounded by the upper sealing edge, and the upper sealing edge is tightly sealed corresponding to the lower sealing edge; and

a capillary layer arranged between the lower concave region and the upper concave region;

the capillary layer is a metal sheet, a capillary zone is formed on the capillary layer by etching, and the capillary zone is formed by a plurality of etching holes penetrating through the upper surface and the lower surface of the capillary layer.

2. The vapor-deposition plate structure of claim 1, wherein the lower cover and the upper cover are plate-shaped bodies made of aluminum or copper.

3. The vapor-deposited plate structure of claim 1, wherein said lower grooves are distributed in said lower recessed region.

4. The vapor chamber plate structure of claim 1, wherein the upper recessed area of the upper cover has a plurality of upper grooves therein.

5. The temperature-equalizing plate structure of claim 4, wherein said upper grooves are distributed in said upper recessed area.

6. The vapor-deposited sheet structure of claim 1 wherein said wicking layer is a copper sheet.

7. The vapor-deposited plate structure of claim 1, wherein the plurality of etched holes are interconnected.

8. A capillary layer structure is arranged in a temperature-uniforming plate and is characterized in that the capillary layer structure is a metal sheet, a capillary zone is formed on the metal sheet through etching, and the capillary zone is formed by a plurality of etching holes penetrating through the upper surface and the lower surface of the capillary layer structure.

9. The wicking structure of claim 8, wherein the wicking structure is a copper sheet.

10. The wicking structure of claim 8, wherein the plurality of etched pores are in communication with each other.