CN114481672A - Method for manufacturing aramid paper reinforced base material for copper-clad plate - Google Patents

Method for manufacturing aramid paper reinforced base material for copper-clad plate Download PDF

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Publication number
CN114481672A
CN114481672A CN202210104693.3A CN202210104693A CN114481672A CN 114481672 A CN114481672 A CN 114481672A CN 202210104693 A CN202210104693 A CN 202210104693A CN 114481672 A CN114481672 A CN 114481672A
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paper
aramid
pulp
base material
reinforced base
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CN114481672B (en
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常小斌
尹盛东
董晓亮
李永锋
蒋泉洪
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Ganzhou Longbang Material Technology Co ltd
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Ganzhou Longbang Material Technology Co ltd
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    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21FPAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER THEREON
    • D21F11/00Processes for making continuous lengths of paper, or of cardboard, or of wet web for fibre board production, on paper-making machines
    • D21F11/06Processes for making continuous lengths of paper, or of cardboard, or of wet web for fibre board production, on paper-making machines of the cylinder type
    • D21F11/08Processes for making continuous lengths of paper, or of cardboard, or of wet web for fibre board production, on paper-making machines of the cylinder type paper or board consisting of two or more layers
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10Organic non-cellulose fibres
    • D21H13/20Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26Polyamides; Polyimides
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H15/00Pulp or paper, comprising fibres or web-forming material characterised by features other than their chemical constitution
    • D21H15/02Pulp or paper, comprising fibres or web-forming material characterised by features other than their chemical constitution characterised by configuration
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H25/00After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
    • D21H25/04Physical treatment, e.g. heating, irradiating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/64Paper recycling

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paper (AREA)

Abstract

The invention discloses a method for manufacturing aramid fiber paper reinforced base material for copper clad laminate, belonging to the technical field of synthetic fiber paper preparation, comprising the steps of defibering 80 wt% of para-aramid fiber in a hydraulic defibering machine according to the weight concentration of 1.5% to prepare paper pulp A, defibering aramid fiber 1414 fibrids in a hydraulic pulper according to the weight concentration of 20% to prepare pulp B, mixing the pulp B with the paper pulp A, adding polyoxyethylene to make the concentration of the pulp 0.02%, feeding the pulp into a pulp box of a cylinder screen through a square cone pipe pulp distributor, and uniformly distributing the pulp onto a paper making forming cylinder screen after the pulp is homogenized through a partition plate in the pulp box; drying; hot rolling by a hot rolling mill; and drying in the drying tunnel to obtain the finished aramid paper. The method adopts a multi-cylinder mould superposition technology and a plurality of heat treatment technologies, can manufacture the para-aramid paper with equal fiber distribution of X-Y axes in the plane of the paper, good uniformity, low density and high strength, strength reduction in acetone solvent of no more than 50 percent, excellent performance, and can be used as an excellent circuit board base material after copper is coated.

Description

Method for manufacturing aramid paper reinforced base material for copper-clad plate
Technical Field
The invention relates to the technical field of preparation of synthetic fiber paper, in particular to a method for manufacturing an aramid fiber paper reinforced base material for a copper-clad plate.
Background
The PCB substrate is usually called copper clad laminate, which is prepared by impregnating reinforcing material with resin, coating copper foil on one side or both sides, and hot pressing. Commonly used reinforcing materials include wood pulp paper, glass fiber cloth, synthetic fiber cloth, non-woven cloth and composite materials, and commonly used resins include phenolic resin, epoxy resin, bismaleimide triazine resin and polyimide resin. Different reinforcing materials and resins are generally selected as desired, with the possibility of adding different fillers or flame retardants to meet specific requirements.
The synthetic fiber paper serving as a substrate of a circuit board, which is reported at present, mainly focuses on components, and is formed by using high-heat-resistant and high-modulus fibers as structural fibers and high-temperature-resistant meta-aramid fibrids or resin as an adhesive through a wet method or a dry method, and the synthetic fiber paper disclosed by the patent publication comprises the following steps:
patent application No. 00810718.1 discloses a wholly aromatic polyamide fiber paper of dupont company formed by liquid crystal spinning of 60 to 97 wt% of para-aramid fiber and 3 to 40 wt% of a binder using meta-aramid fiber, which has good dimensional stability and a thermal expansion coefficient in the thickness direction of 50 to 400 ppm/c.
Patent application No. 99125156.3 discloses a wholly aromatic polyamide fiber synthetic paper sheet made up of 70-96% by weight of an aromatic polyamide short fiber component containing 30% by weight or more of para-type CN104674594A specification page 32/6 4 aromatic polyamide short fibers and 4-30% by weight of a binder, which is a resin binder and/or a heat-resistant fibrid, and having two or more annular protrusions per fiber, which are mainly used to increase the strength of the paper.
The application No. 98807237.8 discloses an aramid paper for dupont consisting essentially of 45-97% by weight poly (-p-phenylene terephthalamide) short fibers, 3-30% poly (-m-phenylene isophthalamide) fibrids and 0-35% quartz fibers for making laminates with improved solvent resistance and dimensional stability, which paper is heat treated at least 280 ℃ for at least 20 seconds and at 330 ℃ for no more than 20 seconds for improved solvent resistance and dimensional stability.
Patent application No. 02816985.9 discloses a solid sheet material from dupont that is particularly suitable for use in circuit boards, the sheet material comprising a nonwoven fabric made of short high tensile modulus fibers and a thermoplastic polymer matrix resin having low moisture absorption, the nonwoven fabric of the patent being composed of high tensile modulus staple fibers.
The patent application with the application number of CN103215843A discloses a preparation method of a para-aramid paper-based composite material for a printed circuit substrate of Shanxi university of science and technology, which comprises the steps of firstly uniformly mixing para-aramid chopped fiber slurry, polyester fiber slurry and para-fibrid slurry, then defibering, then adding a polyoxyethylene dispersant for dispersion, adding water for adjusting the concentration of paper pulp, and obtaining slurry suspension; then, carrying out papermaking forming and hot pressing on the obtained pulp suspension to obtain para-aramid paper base raw paper; and finally, soaking the obtained para-aramid paper-based base paper in polyimide resin glue solution, and then drying to obtain the para-aramid paper-based composite material for the printed circuit board.
The patent application No. CN201710302432.1 discloses a manufacturing method of high-performance para-aramid insulating paper for circuit boards of south China university and super China technology, which is technically characterized by comprising the following steps: (1) shearing aramid fibers; (2) preparing a pretreatment solution; (3) a pretreatment process; (4) introducing fiber surface active groups; (5) a papermaking process; (6) drying the paper; (7) high-pressure process; the method for manufacturing the high-performance para-aramid insulating paper for the circuit board is simple in process, excellent in product performance, environment-friendly and low in cost.
In the patents, the main simplicity focuses on the types and manufacturing processes of the components of the synthetic paper, and the manufacturing difficulty of the aramid paper serving as the reinforced base material for the copper-clad plate is not overcome.
Disclosure of Invention
The invention aims to provide a method for manufacturing a reinforced aramid paper base material for a copper-clad plate, which aims to solve the technical problem that the manufacturing difficulty of the reinforced aramid paper base material for the copper-clad plate is not overcome in the prior art.
The invention provides a method for manufacturing an aramid paper reinforced base material for a copper-clad plate, which comprises the following steps:
sp 1: papermaking;
sp 1-1: preparing slurry: defibering 80 weight percent of para-aramid fiber in a hydro-defibering machine according to the weight concentration of 1.5 percent to prepare paper pulp A, defibering aramid 1414 fibrids in a hydro-pulper according to the weight concentration of 20 percent, pulping by a disc mill, and controlling the pulping degree to be about 75 degrees SR to prepare pulp B;
sp 1-2: adjusting the pulp concentration: uniformly mixing the pulp A and the pulp B in a proportioning pool to form papermaking pulp which can be added to a front box of a papermaking net, and adding polyoxyethylene into a pulp stabilizing box to enable the concentration of the polyoxyethylene to be 0.02%;
sp 1-3: paper forming: the pulp stabilizing box is used for adjusting the pulp entering pressure head, the pulp enters the pulp flowing box of the circular screen through the square taper pipe pulp distributor, the pulp is uniformly distributed on the papermaking forming circular screen after being homogenized through the partition plate in the pulp flowing box, and the redundant pulp overflows to the white water tank through the overflow groove;
sp 1-4: and (3) drying: when the slurry runs along the forming wire, water is filtered out of the paper pulp under the action of a couch roll, the wet paper leaves the wire surface, the wet paper is placed on a water absorption felt, the water is further removed through wet pressing in a vacuum box, and then the wet paper enters a drying part of a paper machine, so that dry aramid paper is obtained;
sp 2: heat treatment;
sp 2-1: hot rolling: hot rolling the dried aramid fiber paper by a hot rolling mill;
sp 2-2: drying tunnel heat treatment: and (3) feeding the hot-rolled aramid fiber paper into a drying tunnel, wherein the paper feeding speed is 8m/min, the temperature in the drying tunnel is 320 ℃, the length is 2m, and the aramid fiber paper is obtained through the drying tunnel.
Further, in the paper forming stage, more than 4 round screens are used for forming the para-aramid paper, and the forming ration of a single round screen is 6-12 g/square meter. In the aramid paper manufacturing, a specially designed high-position multi-outlet pulp stabilizing box and a square taper pipe pulp distribution are adopted, and a cylinder head box is specially designed, so that the upper pulp speed and the net speed can reach 1:1, and the fiber distribution of the aramid paper in the mechanical direction and the fiber distribution perpendicular to the mechanical direction are equal, so that the fiber distribution in the X-Y direction in the plane of the aramid paper is even, the CTE in the X-Y direction in the plane of the copper-clad plate is also equal, and the reliability of PCB design is greatly enhanced.
Further, the single cylinder mould forming speed is 5-15 m/min.
Furthermore, the para-aramid paper in the paper forming stage is composed of para-aramid chopped fibers and bonding fibers, wherein the bonding fibers can be one or a mixture of para-aramid pulp, para-aramid fibrid and meta-aramid fibrid, and the proportion of the bonding fibers is 60-100% of the mass fraction of the para-aramid chopped fibers.
Further, the interleaving index of the para-aramid paper in the paper forming stage is less than or equal to 1.0 g/square meter.
Further, the length of the para-aramid chopped fiber in the paper forming stage is 3-8mm, and the fineness is 1-3D. In the method, a plurality of circular nets are used for forming, the sizing concentration can be as low as five per hundred thousand, the uniformity of the formed paper sheet is better than that of an inclined net and a long net, and the dielectric property and the heat resistance of the copper-clad plate are improved.
Further, the beating degree of the bonding fiber in the paper forming stage is 40-80 DEG SR.
Further, the beating degree of the binding fiber in the paper forming stage is 75 ° SR. The beating degree of the binding fiber is preferably 75 degrees SR, so that the proportion of the fiber in a finished product is high and is more than 70 percent, and meanwhile, the para-aramid fibrid with high beating degree enables the finished product to have low density and high strength.
Further, the hot rolling temperature in the hot rolling stage is 275-300 ℃. The hot rolling temperature is preferably 285 ℃.
Further, the drying tunnel heat treatment temperature is 300 to 330 ℃. The heat treatment temperature is preferably 320 ℃. The para-aramid paper is subjected to high-temperature hot rolling and heat treatment, wherein the hot rolling is carried out on paper sheets by adopting a double-temperature double-nip hot rolling process, the pressure of a hot rolling line of a first group is 25kg/cm, the surface temperature of a roller is 290 ℃, the rolling speed is 8m/min, the aramid paper enters a drying tunnel after being subjected to hot rolling, the speed is 8m/min, the temperature is 320 ℃, the length is 2m, precipitated fibers in the aramid paper are promoted to be connected with crystals, and the solvent resistance of the aramid paper is improved.
Compared with the prior art, the invention has the beneficial effects that:
first, the disclosed technology mainly focuses on the kind and manufacturing process of the synthetic paper components, but does not overcome the manufacturing difficulty of the reinforced base material aramid paper for the copper-clad plate, aiming at the difficulty in the manufacturing process of para-aramid paper, a multi-cylinder mould stacking technology and a plurality of heat treatment technologies are adopted, can produce para-aramid paper with equal distribution of fibers of X-Y axes in the plane of the paper, the difference of tensile strength of the X-Y axes in the plane less than or equal to 0.5KN/m, good uniformity, interweaving index less than or equal to 1.0 g/square meter, density of 0.65g/cm3, tensile strength greater than or equal to 1.5KN/m, and strength reduction in acetone solvent less than or equal to 50 percent, the para-aramid paper can be used as a main weight component of synthetic fiber paper of a circuit board substrate, has excellent performance, and can be used as an excellent circuit board base material after copper is coated.
Secondly, in the invention, in the aramid fiber paper manufacturing, a specially designed high-position multi-outlet pulp stabilizing box and a square taper pipe pulp distribution are adopted, and a cylinder head box is specially designed, so that the upper pulp speed and the net speed can reach 1:1, and the fiber distribution of the aramid fiber paper in the mechanical direction and the fiber distribution perpendicular to the mechanical direction are equal, therefore, the fiber distribution of the aramid fiber paper in the X-Y direction in the plane is even, the CTE of the copper-clad plate in the X-Y direction is also more equal, and the reliability of PCB design is greatly enhanced.
And thirdly, in the invention, a plurality of circular nets are adopted for forming, the sizing concentration can be as low as five hundred thousandths, the uniformity of the formed paper sheet is better than that of an inclined net and a long net, and the dielectric property and the heat resistance of the copper-clad plate are improved.
Fourthly, according to the para-aramid paper subjected to high-temperature hot rolling and heat treatment, the hot rolling is performed on paper sheets by adopting a double-temperature double-nip hot rolling process, wherein the pressure of a first group of hot rolling lines is 25kg/cm, the surface temperature of a roller is 290 ℃, the rolling speed is 8m/min, the aramid paper enters a drying tunnel after being subjected to hot rolling, the speed is 8m/min, the temperature is 320 ℃, the length is 2m, the precipitated fiber crystal connection in the aramid paper is promoted, and the solvent resistance of the aramid paper is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic representation of a paper making process of the present invention;
FIG. 2 is a schematic view of a multi-cylinder mold according to the present invention;
FIG. 3 is a schematic view of a single cylinder mold according to the present invention;
FIG. 4 is a schematic view of the structure of the heat treatment in the present invention.
Reference numerals:
1. a cylinder mould; 2. an overflow trough; 3. a head box; 4. a partition plate; 5. a square conical tube; 6. a single cylinder mould; 7. aramid paper; 8. a pulp stabilizing box; 9. a hot rolling mill; 10. and (4) a drying channel.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment of the invention provides a method for manufacturing an aramid paper reinforced base material for a copper-clad plate, which is shown by combining figures 1 to 4 and comprises the following steps: sp 1: papermaking; sp 1-1: preparing slurry: defibering 80 weight percent of para-aramid fiber in a hydro-defibering machine according to the weight concentration of 1.5 percent to prepare paper pulp A, defibering aramid 1414 fibrids in a hydro-pulper according to the weight concentration of 20 percent, pulping by a disc mill, and controlling the pulping degree to be about 75 degrees SR to prepare pulp B; sp 1-2: adjusting the pulp concentration: uniformly mixing the pulp A and the pulp B in a proportioning pool to form papermaking pulp which can be added to a front box of a papermaking net, and adding polyoxyethylene into a pulp stabilizing box 8 to enable the concentration of the polyoxyethylene to be 0.02%; sp 1-3: paper forming: the pulp stabilizing box 8 is used for adjusting the pulp entering a pulp feeding pressure head, the pulp enters a pulp flowing box 3 of the circular screen 1 through a pulp distributor of a square taper pipe 5, the pulp is uniformly distributed on the papermaking forming circular screen 1 after being homogenized through a partition plate 4 in the pulp flowing box 3, and the redundant pulp overflows to a white water tank through an overflow groove 2; sp 1-4: and (3) drying: when the slurry runs along the forming wire, water is filtered out of the paper pulp under the action of a couch roll, the wet paper leaves the wire surface, the wet paper is placed on a water absorption felt, the water is further removed through wet pressing in a vacuum box, and then the wet paper enters a drying part of a paper machine, so that dry aramid paper 7 is obtained; sp 2: heat treatment; sp 2-1: hot rolling: hot rolling the dried aramid paper 7 by a hot rolling mill 9; sp 2-2: drying tunnel heat treatment: the hot rolled aramid fiber paper enters a drying tunnel 10, the paper feeding speed is 8m/min, the temperature in the drying tunnel 10 is 320 ℃, the length is 2m, and the finished aramid fiber paper 7 is obtained through the drying tunnel 10.
In the disclosed technology, the main emphasis is simply on the types and the manufacturing process of the components of the synthetic paper, but the manufacturing difficulty of the reinforced base material aramid paper 7 for the copper-clad plate is not overcome, in the method, aiming at the difficulty in the manufacturing process of the para-aramid paper 7, a multi-cylinder mould 1 overlapping technology and a plurality of heat treatment technologies are adopted, can produce the para-aramid paper 7 with equal distribution of fibers of X-Y axes in the plane of the paper, the difference of tensile strength of the X-Y axes in the plane less than or equal to 0.5KN/m, good uniformity, interweaving index less than or equal to 1.0 g/square meter, density of 0.65g/cm3, tensile strength more than or equal to 1.5KN/m, strength reduction in acetone solvent less than or equal to 50 percent, the para-aramid paper 7 can be used as a main weight component of synthetic fiber paper of a circuit board substrate, has excellent performance, and can be used as an excellent circuit board substrate after copper is coated.
Specifically, in the paper forming stage, the para-aramid paper 7 is formed by more than 4 round screens 1, and the forming ration of a single round screen 61 is 6-12 g/square meter. In the manufacturing of the aramid paper 7, a specially designed high-position multi-outlet pulp stabilizing box 8 and a square taper pipe 5 are adopted for pulp distribution, and a cylinder mould 1 pulp flowing box 3 is specially designed, so that the upper pulp speed and the net speed can reach 1:1, and the fiber distribution of the aramid paper 7 in the mechanical direction and the fiber distribution perpendicular to the mechanical direction are equal, therefore, the fiber distribution of the aramid paper 7 in the X-Y direction in the plane is even, the CTE of the copper-clad plate in the X-Y direction is also more equal, and the reliability of PCB design is greatly enhanced.
Specifically, the forming speed of the single cylinder mould 61 is 5-15 m/min.
Specifically, the para-aramid paper 7 in the paper forming stage is composed of para-aramid chopped fibers and bonding fibers, wherein the bonding fibers can be one or a mixture of para-aramid pulp, para-aramid fibrids and meta-aramid fibrids, and the proportion of the bonding fibers is 60-100% of the mass fraction of the para-aramid chopped fibers.
Specifically, the 7 interweaving index of the para-aramid paper in the paper forming stage is less than or equal to 1.0g per square meter.
Specifically, the length of the para-aramid chopped fiber in the paper forming stage is 3-8mm, and the fineness is 1-3D. In the method, the multi-cylinder net 1 is adopted for molding, the sizing concentration can be as low as five hundred thousandths, the uniformity of the formed paper sheet is better than that of an inclined net and a long net, and the dielectric property and the heat resistance of the copper-clad plate are improved.
Specifically, the beating degree of the binding fiber in the paper forming stage is 40-80. And SR.
Specifically, the degree of beating of the binder fibers at the paper-making stage was 75. And SR. The degree of beating of the binder fibers is preferably 75. SR, make the fibrous proportion in the finished product high, above 70%, simultaneously, the para-aramid fibrid of high beating degree makes finished product para-aramid paper 7 density low while intensity is higher.
Specifically, the hot rolling temperature in the hot rolling stage is 275-300 ℃. The hot rolling temperature is preferably 285 ℃.
Specifically, the drying tunnel heat treatment temperature is 300 to 330 ℃. The heat treatment temperature is preferably 320 ℃. The para-aramid paper 7 is subjected to high-temperature hot rolling and heat treatment, wherein the hot rolling is carried out on paper sheets by adopting a double-temperature double-nip hot rolling process, the pressure of a first group of hot rolling lines is 25kg/cm, the surface temperature of a roller is 290 ℃, the rolling speed is 8m/min, the aramid paper 7 enters a drying tunnel 10 after being subjected to hot rolling, the speed is 8m/min, the temperature is 320 ℃, the length is 2m, precipitated fibers in the aramid paper 7 are promoted to be connected with crystals, and the solvent resistance of the aramid paper 7 is improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A method for manufacturing aramid paper reinforced base material for copper-clad plate is characterized by comprising the following steps: the method comprises the following steps:
sp 1: papermaking;
sp 1-1: preparing slurry: defibering 80 weight percent of para-aramid fiber in a hydro-defibering machine according to the weight concentration of 1.5 percent to prepare paper pulp A, defibering aramid 1414 fibrids in a hydro-pulper according to the weight concentration of 20 percent, pulping by a disc mill, and controlling the pulping degree to be about 75 degrees SR to prepare pulp B;
sp 1-2: adjusting the pulp concentration: uniformly mixing the pulp A and the pulp B in a proportioning pool to form papermaking pulp which can be added to a front box of a papermaking net, and adding polyoxyethylene into a pulp stabilizing box (8) to enable the concentration of the polyoxyethylene to be 0.02%;
sp 1-3: paper forming: the upper wire pressure head of the pulp is adjusted by a pulp stabilizing box (8), the pulp enters a pulp flowing box (3) of a circular screen (1) through a pulp distributor of a square taper pipe (5), the pulp is uniformly distributed on the papermaking forming circular screen (1) after being homogenized by a clapboard (4) in the pulp flowing box (3), and the redundant pulp overflows to a white water tank through an overflow groove (2);
sp 1-4: and (3) drying: when the slurry runs along the forming wire, water is filtered out of the paper pulp under the action of a couch roll, the wet paper leaves the wire surface, the wet paper is placed on a water absorption felt, the water is further removed through wet pressing in a vacuum box, and then the wet paper enters a drying part of a paper machine, so that dry aramid paper (7) is obtained;
sp 2: heat treatment;
sp 2-1: hot rolling: hot rolling the dried aramid paper (7) by a hot rolling mill (9);
sp 2-2: drying tunnel heat treatment: and (3) feeding the hot-rolled aramid fiber paper into a drying channel (10), wherein the paper feeding speed is 8m/min, the temperature in the drying channel (10) is 320 ℃, the length is 2m, and the finished aramid fiber paper (7) is obtained through the drying channel (10).
2. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 1, wherein the aramid paper reinforced base material comprises the following steps: in the paper forming stage, more than 4 round screens (1) are used for forming the para-aramid paper (7), and the forming quantitative of a single round screen (6) is 6-12 g/square meter.
3. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 2, wherein the aramid paper reinforced base material comprises the following steps: the forming speed of the single rotary screen (6) is 5-15 m/min.
4. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 1, wherein the aramid paper reinforced base material comprises the following steps: the para-aramid paper (7) in the paper forming stage is composed of para-aramid chopped fibers and bonding fibers, wherein the bonding fibers can be one or a mixture of para-aramid pulp, para-aramid fibrids and meta-aramid fibrids, and the proportion of the bonding fibers is 60-100% of the mass fraction of the para-aramid chopped fibers.
5. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 1, which is characterized in that: the interweaving index of the para-aramid paper (7) in the paper forming stage is less than or equal to 1.0g per square meter.
6. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 1, wherein the aramid paper reinforced base material comprises the following steps: the length of the para-aramid chopped fiber in the paper forming stage is 3-8mm, and the fineness is 1-3D.
7. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 1, wherein the aramid paper reinforced base material comprises the following steps: the beating degree of the bonding fiber in the paper forming stage is 40-80 DEG SR.
8. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 7, wherein the aramid paper reinforced base material comprises the following steps: the beating degree of the binding fiber in the paper forming stage is 75 DEG SR.
9. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 1, wherein the aramid paper reinforced base material comprises the following steps: the hot rolling temperature in the hot rolling stage is 275-300 ℃.
10. The method for manufacturing the aramid paper reinforced base material for the copper-clad plate according to claim 1, wherein the aramid paper reinforced base material comprises the following steps: the drying tunnel heat treatment temperature is 300 to 330 ℃.
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