CN114481331B

CN114481331B - Method for improving roller belt liquid etching

Info

Publication number: CN114481331B
Application number: CN202210076630.1A
Authority: CN
Inventors: 陈天令; 曹其伟; 谢耀辉; 曾玉婷; 杨加俊; 张鹏
Original assignee: Jiangxi Zhonghong Jingneng Technology Co ltd
Current assignee: Jiangxi Zhonghong Jingneng Technology Co ltd
Priority date: 2022-01-24
Filing date: 2022-01-24
Publication date: 2023-06-13
Anticipated expiration: 2042-01-24
Also published as: CN114481331A

Abstract

The invention discloses a method for improving the liquid etching and over-etching of a roller, which relates to the field of silicon wafer etching and comprises the steps of adding a flat plate, installing an inductor, adjusting a liquid coating component, alarming the inductor and etching the silicon wafer, wherein the liquid coating component comprises a plurality of sliding grooves formed in the top of the flat plate, sliding blocks are arranged in the sliding grooves, and liquid coating sponge is fixed on the top of the sliding blocks. According to the invention, the liquid coating assembly is arranged, when the silicon wafer is placed on the roller, a user moves the liquid coating sponge, the liquid coating sponge can drive the sliding block to slide in the sliding groove, when the liquid coating sponge is contacted with two sides of the silicon wafer, the user screws the fixing bolt into the bolt hole to fix the sliding block, so that the sliding block is prevented from randomly driving the liquid coating sponge to move, and after the liquid coating sponge adsorbs a solution, the liquid coating sponge can coat the solution on two sides of the silicon wafer when the silicon wafer moves, and the two sides of the silicon wafer are prevented from being removed without etching the solution.

Description

Method for improving roller belt liquid etching

Technical Field

The invention relates to the field of silicon wafer etching, in particular to a method for improving the liquid etching and over-etching of a roller.

Background

The currently adopted wet etching technology mainly comprises a water bleaching technology and a roller liquid carrying technology, sulfuric acid is needed to be used in the water bleaching technology so as to achieve the buoyancy of the silicon wafer bleaching on the liquid level, but the sulfuric acid pollution is larger, and the use amount of the sulfuric acid is gradually reduced at present; in the roller liquid carrying technology, a silicon wafer is not directly contacted with a solution, but a part of a threaded roller is submerged in the solution, the side edge and the back surface of the silicon wafer are etched by utilizing liquid carried by the roller during rotation, the technology has higher requirement on the horizontal type of the roller, and a water film is paved on the upper surface of the silicon wafer during production, so that the upper surface is prevented from being etched.

In the existing method for improving the liquid-carrying etching of the roller, the threaded roller only can carry out liquid-coating etching on the bottom of the silicon wafer in the moving process of the silicon wafer, but the side edge of the silicon wafer is difficult to contact with the solution and is etched, so that the integral etching effect on the silicon wafer is reduced, and the silicon wafer is conveyed out without being completely etched; meanwhile, as the roller can move left and right in the rotation process, the roller is difficult to coat the solution on the bottom of the silicon wafer and etch the silicon wafer, so that the etching efficiency of the silicon wafer is reduced and the conveying effect of the silicon wafer is affected.

Disclosure of Invention

Based on the above, the invention aims to provide a method for improving the liquid etching process of the roller, so as to solve the technical problems that two sides of a silicon wafer are difficult to contact with a solution and are easy to shake left and right due to etching and the roller, and further the etching effect on the bottom of the silicon wafer is affected.

In order to achieve the above purpose, the present invention provides the following technical solutions: the method for improving the roller belt liquid etching over-etching comprises the steps of adding a flat plate, installing an inductor, adjusting a coating liquid component, alarming the inductor and etching a silicon wafer, and comprises the following specific implementation steps:

step one: install dull and stereotyped additional

A flat plate is additionally arranged under the roller of the roller liquid etching equipment, and the outer surface and the back of the roller are contacted with the limiting component;

step two: mounting inductor

An inductor is arranged in the mounting groove, and the top of the inductor is contacted with the roller;

step three: adjusting coating liquid component

Placing a silicon wafer on a roller, and adjusting the position of a coating liquid component according to the size of the silicon wafer so that the coating liquid component is contacted with two sides of the silicon wafer;

step four: sensor alarm

If the roller is not attached to the flat plate, the sensor sends out an alarm signal;

step five: silicon wafer etching

The back of the silicon wafer is etched by using liquid carried by the roller during rotation of the roller, the roller can drive the silicon wafer to move during rotation of the roller, and the liquid coating component can etch two sides of the silicon wafer.

By adopting the technical scheme, the bottom and two sides of the silicon wafer are etched conveniently, and the etching efficiency of the silicon wafer is improved.

Further, in step one, the spacing subassembly is including seting up in a plurality of recesses of dull and stereotyped top both sides, and a plurality of the spring is all installed to the inside of recess, the top of spring is connected with the movable block, the top of movable block is fixed with the spacing post that extends to the recess outside.

Through adopting above-mentioned technical scheme, spacing post can be spacing to the gyro wheel, prevents that the gyro wheel from controlling the removal, has improved the stability of gyro wheel then.

Further, in step three, the masking liquid subassembly is including seting up in a plurality of spouts at dull and stereotyped top, the inside of spout is provided with the slider, the top of slider is fixed with the masking liquid sponge, a plurality of bolt holes have been seted up to the inside below of spout, fixing bolt that extends to the inside of a bolt hole is installed at the top of slider.

By adopting the technical scheme, the liquid-coating sponge can etch the two sides of the silicon wafer, so that the two sides of the silicon wafer are prevented from being effectively etched.

Further, the limiting column is in sliding connection with the groove through the movable block, and the limiting column is in contact with the roller.

Through adopting above-mentioned technical scheme, can make spacing post reciprocate, can drive the movable block and remove when spacing post removes, can make the movable block extrude or extension spring then.

Further, one side of the liquid coating sponge is contacted with the silicon wafer, and the liquid coating sponge is in sliding connection with the sliding groove through the sliding block.

By adopting the technical scheme, the solution can be coated on the two sides of the silicon wafer by the coating sponge, and then the two sides of the silicon wafer can be coated.

Further, in the third step, the number of sensors under each roller is the same as the number of a row of silicon wafers advancing simultaneously, and the positions of the sensors are the middle positions of the silicon wafers passing under the corresponding positions.

Through adopting above-mentioned technical scheme, whether the inductor can respond to the gyro wheel and laminate mutually with the flat board, the gyro wheel of being convenient for then adjusts.

Further, the opening ratio of the flat plate ranges from 5% to 25%, a plurality of through holes penetrate through the flat plate, and the distances among the through holes are the same.

By adopting the technical scheme, the liquid flows through the through holes to exchange and mix the solutions on the flat plate, and various anomalies caused by uneven exchange and mixing of the solutions are avoided.

Further, in the first step, the outer wall of the roller is provided with threads, and a part of the roller is submerged in the solution.

By adopting the technical scheme, the silicon wafer is convenient to convey, and meanwhile, when the roller rotates, the solution can be coated at the bottom of the silicon wafer, so that the bottom of the silicon wafer is etched.

Further, in the first step, the bottom of the roller is attached to the flat plate, and the roller and the mounting groove are perpendicular to each other.

Through adopting above-mentioned technical scheme to detect whether the gyro wheel is laminated with the flat board, if the gyro wheel is not laminated with the flat board, the inductor then can send alarm signal, avoids simultaneously because the excessive etching that the gyro wheel is uneven causes the efficiency reduction condition because excessive etching in the etching process, and the outward appearance bad condition that excessive etching caused.

In summary, the invention has the following advantages:

1. according to the invention, the liquid coating assembly is arranged, after the silicon wafer is placed on the roller, a user moves the liquid coating sponge, the liquid coating sponge can drive the sliding block to slide in the sliding groove, after the liquid coating sponge is contacted with two sides of the silicon wafer, the user screws the fixing bolt into the bolt hole to fix the sliding block, so that the sliding block is prevented from randomly driving the liquid coating sponge to move, after the liquid coating sponge adsorbs a solution, the liquid coating sponge can coat the solution on two sides of the silicon wafer when the silicon wafer moves, the two sides of the silicon wafer are prevented from being removed without being etched by the solution, and the etching efficiency of the two sides of the silicon wafer is improved;

2. according to the invention, the limiting assembly is arranged, the limiting column can limit the roller, so that the roller is prevented from moving left and right, the stability of the roller is improved, the roller can only rotate, the roller can conveniently convey the silicon wafer and apply the solution to the silicon wafer, the coating efficiency of the roller on the silicon wafer is improved, meanwhile, when the limiting column moves up and down, the limiting column can drive the movable block to move, and then the movable block can squeeze or stretch the spring, so that the limiting column moves into the groove or moves out of the groove.

Drawings

FIG. 1 is a schematic overall perspective view of the present invention;

FIG. 2 is a schematic top view of a partial structure of a flat panel according to the present invention;

FIG. 3 is a schematic side sectional partial structure of a flat panel of the present invention;

fig. 4 is an enlarged view of fig. 3 a in accordance with the present invention.

In the figure: 1. a flat plate; 2. a roller; 3. a through hole; 4. a mounting groove; 5. an inductor; 6. a silicon wafer; 7. a coating liquid component; 701. a chute; 702. bolt holes; 703. a slide block; 704. a fixing bolt; 705. a liquid-coating sponge; 8. a limit component; 801. a limit column; 802. a movable block; 803. a groove; 804. and (3) a spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

Hereinafter, an embodiment of the present invention will be described in accordance with its entire structure.

The method for improving the roller belt liquid etching over-etching comprises the steps of adding a flat plate 1, installing an inductor 5, adjusting a coating liquid component 7, alarming the inductor 5 and etching a silicon wafer 6, and comprises the following specific implementation steps of:

step one: plate 1 is additionally arranged

A flat plate 1 is additionally arranged under a roller 2 of the roller liquid etching equipment, and the outer surface and the back of the roller 2 are contacted with a limit component 8;

step two: mounting inductor 5

An inductor 5 is arranged in the mounting groove 4, and the top of the inductor 5 is contacted with the roller 2;

step three: adjusting the applicator assembly 7

Placing a silicon wafer 6 on the roller 2, and adjusting the position of the coating liquid component 7 according to the size of the silicon wafer 6 to enable the coating liquid component 7 to be in contact with two sides of the silicon wafer 6;

step four: sensor 5 alarm

If the roller 2 is not attached to the flat plate 1, the sensor 5 sends out an alarm signal;

step five: etching of silicon wafer 6

Through rotating gyro wheel 2 to carry out the sculpture to the back of silicon chip with the liquid that takes up when utilizing gyro wheel 2 to rotate, and gyro wheel 2 can drive silicon chip 6 when rotating and remove, and scribble liquid subassembly 7 can carry out the sculpture to the both sides of silicon chip 6, is convenient for carry out the sculpture to the bottom and the both sides of silicon chip 6, and then has improved the sculpture efficiency to silicon chip 6.

In step one, spacing subassembly 8 is including seting up in a plurality of recesses 803 of dull and stereotyped 1 top both sides, a plurality of bolt holes 702 have all been installed to the inside of a plurality of recesses 803, the top of spring 804 is connected with movable block 802, the top of movable block 802 is fixed with the spacing post 801 that extends to the recess 803 outside, spacing post 801 can carry out spacingly to gyro wheel 2, prevent gyro wheel 2 from controlling the removal, and then improved gyro wheel 2's stability, in step three, the masking liquid subassembly 7 is including seting up in a plurality of spouts 701 at dull and stereotyped 1 top, the inside of spout 701 is provided with slider 703, the top of slider 703 is fixed with masking liquid sponge 705, a plurality of bolt holes 702 have been setted up to the inside below of spout 701, fixing bolt 704 that extends to a bolt hole 702 is installed at the top of slider 703, masking liquid sponge 705 can carry out the sculpture to the both sides of silicon chip 6, avoid the both sides of silicon chip 6 not by effective sculpture.

The spacing post 801 is through movable block 802 and recess 803 sliding connection, spacing post 801 contacts with gyro wheel 2, can make spacing post 801 reciprocate, can drive movable block 802 when spacing post 801 removes, then can make movable block 802 extrude or extension spring 804, and the one side of masking liquid sponge 705 contacts with silicon chip 6, and masking liquid sponge 705 passes through slider 703 and spout 701 sliding connection, and masking liquid sponge 705 can brush the both sides of silicon chip 6 with the solution, can brush the both sides of silicon chip 6 in turn.

In the third step, the number of the sensors 5 under each roller 2 is the same as the number of a row of silicon wafers 6 advancing simultaneously, the positions of the sensors 5 are the middle positions of the silicon wafers 6 passing through the corresponding lower parts, and the sensors 5 can sense whether the rollers 2 are attached to the flat plate 1 or not, so that the rollers 2 can be conveniently adjusted; the aperture ratio of the flat plate 1 ranges from 5% to 25%, a plurality of through holes 3 penetrate through the flat plate 1, and the intervals among the through holes 3 are the same; the liquid flows through the through holes 3 to exchange and mix the solutions on the upper and lower sides of the flat plate 1, and various anomalies caused by uneven exchange and mixing of the solutions are avoided.

In the first step, threads are arranged on the outer wall of the roller 2, a part of the roller 2 is submerged in the solution, so that the silicon wafer 6 is convenient to convey, and meanwhile, the solution can be coated on the bottom of the silicon wafer 6 when the roller 2 rotates, so that the bottom of the silicon wafer 6 is etched; in step one, the bottom of the roller 2 is attached to the flat plate 1, and the roller 2 is perpendicular to the mounting groove 4, so as to detect whether the roller 2 is attached to the flat plate 1, and if the roller 2 is not attached to the flat plate 1, the sensor 5 can send an alarm signal, and meanwhile, the excessive etching caused by uneven roller is avoided, the efficiency reduction caused by excessive etching in the etching process is reduced, and the appearance defect caused by excessive etching is reduced.

Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.

Claims

1. A method for improving the liquid etching and over-etching of a roller is characterized by comprising the following steps: including installing dull and stereotyped (1) additional, installation inductor (5), adjusting scribble liquid subassembly (7), inductor (5) warning and silicon chip (6) sculpture, and scribble liquid subassembly (7) including seting up in a plurality of spouts (701) at dull and stereotyped (1) top, the inside of spout (701) is provided with slider (703), the top of slider (703) is fixed with scribbles liquid sponge (705), a plurality of bolt holes (702) have been seted up to the inside below of spout (701), fixing bolt (704) that extend to the inside of a bolt hole (702) are installed at the top of slider (703), and the concrete implementation step is as follows:

step one: additional flat board (1)

A flat plate (1) is additionally arranged under a roller (2) of the roller liquid etching equipment, and the outer surface and the back of the roller (2) are contacted with a limiting component (8);

step two: installation inductor (5)

An inductor (5) is arranged in the mounting groove (4), and the top of the inductor (5) is contacted with the roller (2);

step three: adjustable coating liquid component (7)

Placing a silicon wafer (6) on the roller (2), and adjusting the position of the coating liquid component (7) through the size of the silicon wafer (6) to enable the coating liquid component (7) to be in contact with two sides of the silicon wafer (6);

step four: sensor (5) alarm

If the roller (2) is not attached to the flat plate (1), the sensor (5) sends out an alarm signal;

step five: etching the silicon wafer (6)

The roller (2) is rotated to etch the back of the silicon wafer by utilizing liquid carried up when the roller (2) rotates, the roller (2) can drive the silicon wafer (6) to move when rotating, and the liquid coating component (7) can etch the two sides of the silicon wafer (6).

2. A method of improving a roll belt etch process as claimed in claim 1, wherein: in step one, spacing subassembly (8) are including seting up in a plurality of recesses (803) of dull and stereotyped (1) top both sides, and a plurality of spring (804) are all installed to the inside of recess (803), the top of spring (804) is connected with movable block (802), the top of movable block (802) is fixed with spacing post (801) that extend to the outside of recess (803).

3. A method of improving a roll-on belt fluid etch as claimed in claim 2, wherein: the limiting column (801) is connected with the groove (803) in a sliding mode through the movable block (802), and the limiting column (801) is in contact with the roller (2).

4. A method of improving a roll belt etch process as claimed in claim 1, wherein: one side of the liquid coating sponge (705) is contacted with the silicon wafer (6), and the liquid coating sponge (705) is connected with the chute (701) in a sliding way through the sliding block (703).

5. A method of improving a roll belt etch process as claimed in claim 1, wherein: in the third step, the number of the sensors (5) under each roller (2) is the same as the number of the silicon wafers (6) advancing simultaneously in one row, and the positions of the sensors (5) are the middle positions of the silicon wafers (6) passing under the corresponding positions.

6. A method of improving a roll belt etch process as claimed in claim 1, wherein: the opening ratio of the flat plate (1) ranges from 5% to 25%, a plurality of through holes (3) penetrate through the flat plate (1), and the distances among the through holes (3) are the same.

7. A method of improving a roll belt etch process as claimed in claim 1, wherein: in the first step, threads are arranged on the outer wall of the roller (2), and a part of the roller (2) is submerged in the solution.

8. A method of improving a roll belt etch process as claimed in claim 1, wherein: in the first step, the bottom of the roller (2) is attached to the flat plate (1), and the roller (2) and the mounting groove (4) are arranged in a mutually perpendicular mode.