CN114481101A - Metal material obtained by method for regulating crystal face orientation of metal coating and application - Google Patents
Metal material obtained by method for regulating crystal face orientation of metal coating and application Download PDFInfo
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- CN114481101A CN114481101A CN202111535674.8A CN202111535674A CN114481101A CN 114481101 A CN114481101 A CN 114481101A CN 202111535674 A CN202111535674 A CN 202111535674A CN 114481101 A CN114481101 A CN 114481101A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/665—Composites
- H01M4/667—Composites in the form of layers, e.g. coatings
Abstract
The invention relates to a metal material obtained by a method for regulating and controlling crystal face orientation of a metal coating and application thereof. Firstly, a metal substrate which is simple, cheap and easy to obtain and has a specific crystal orientation is screened out, then the metal substrate is used as a reducing agent to carry out a chemical immersion method to plate a thin metal coating, the crystal orientation of the metal coating can be controlled by the crystal orientation of the substrate, and the method can be used for preparing a metal coating with high preference and even full preference. Finally, the coating with specific crystal orientation is successfully used for improving the deposition-stripping reversibility of the metal cathode and the activity of an electrode catalytic interface.
Description
The technical field is as follows:
the invention belongs to the technical field of metal material crystal face orientation regulation and control methods, and particularly relates to a metal material obtained by a method for regulating and controlling the crystal face orientation of a metal coating and application thereof.
Background art:
the environmental pollution problem caused by the large consumption of fossil energy has become an important factor restricting the development of modern society, and therefore, the development of renewable clean energy has become a mainstream direction of a future energy system. Renewable energy sources such as solar energy, wind energy and the like are influenced by weather conditions, energy cannot be stably output, and the convenient use of the clean energy sources is influenced, so that the development of a stable energy storage system is an important guarantee for a clean energy efficient and convenient service society. Compared with traditional mechanical energy storage such as water energy storage and the like, the electrochemical energy storage has higher energy density and energy efficiency and is the best choice for future energy storage modes. The improvement of the safety, the cycle life and the energy efficiency of the electrochemical energy storage device has important influence on the sustainable development of future economy.
Compared with the common extraction and insertion type, conversion type and alloying negative electrode materials, the secondary battery directly using metal (Li/Na/Zn/Mg) as the negative electrode has higher theoretical specific capacity and lower electrode potential, thereby realizing higher energy density and power density. However, when pure metal is used as the negative electrode, the discharge depth of the negative electrode is low, the problem of perforation and shedding in the circulation process is solved, the current collector is used for bearing limited metal negative electrode materials, and the problems can be avoided. However, the conventional copper/carbon-based current collector is prone to generate dendrites during deposition and stripping, which deteriorates battery performance, such as accelerating corrosion and side reactions of the negative electrode, reducing coulombic efficiency, and causing short circuit of the battery due to penetration of the separator. Therefore, constructing a current collector capable of guiding metal to be uniformly deposited and inhibiting the growth of metal dendrites is one of the currently important research directions. Due to differences in conductivity, lattice parameters, metal affinity and the like, different exposed crystal faces on the current collector interface can affect ion-electron exchange of metal ions at the electrode interface and nucleation and growth of metal at the electrode interface. Therefore, certain high-activity crystal faces are selectively exposed in the preparation of the current collector material, even single high-activity crystal faces are used for regulating and controlling the electrodeposition and stripping of metal, and the high-performance current collector material can be obtained.
Hydrogen evolution reactions in aqueous batteries tend to cause cell gassing and failure, thus raising the hydrogen evolution overpotential of the electrodes can inhibit the hydrogen evolution reaction, and Sn with a particular crystal orientation that can selectively deposit on the surface of commercial current collectors with a high hydrogen evolution overpotential can inhibit this process. However, in hydrogen energy storage, water electrolysis hydrogen evolution is an important reaction, low hydrogen evolution overpotential is often required in the process, a layer of precious metal such as Pt/Ag/Au with low hydrogen evolution overpotential can be deposited on the surface of an electrode such as cheap copper/iron, and the like, and the metal plating layers selectively expose crystal faces with high hydrogen evolution activity, so that the energy consumption in the water electrolysis hydrogen evolution process can be greatly reduced. The energy catalysis processes can be more efficiently regulated and controlled by the metal coating and the crystal face orientation design.
The invention content is as follows:
the invention aims to solve the problems of low reaction activity and uneven reaction of an electrode interface caused by crystal plane orientation difference, and provides a method for regulating and controlling the crystal plane orientation of a metal coating by selecting a proper substrate material so as to obtain an efficient-even electrochemical reaction interface. For metallic anodes, an electrode interface with high metal affinity and consistent orientation enables a dendrite-free anode. For the electrocatalytic process, a noble metal material with high crystal surface reactivity can be plated on a cheap metal substrate to promote the catalysis. The methods have wide application prospect.
A method for regulating and controlling crystal plane orientation of a metal coating comprises the following steps:
step one, selecting a metal material with single crystal face orientation or high preferred crystal face orientation as a substrate; the high preferred crystal plane orientation means that the proportion of one crystal plane orientation reaches more than 80 percent, preferably more than 85 percent, but not 100 percent of all crystal plane orientations;
step two, obtaining a metal coating with single crystal face orientation or high preferred crystal face orientation by using the selected substrate material through a chemical immersion plating method; the high preferred crystal orientation of the plating layer means that the proportion of a certain crystal orientation is more than 80%, preferably more than 85%, but less than 100% of all crystal orientations.
Preferably, in order to produce a coating with a highly preferred (greater than 85%) or even a fully preferred single crystal plane orientation, the dominant crystal plane orientation of the substrate coating should be selected to be in the range of 80% to 100%.
According to the method for regulating and controlling the crystal plane orientation of the metal coating, the selected base metal and the coating metal can perform metal replacement reaction and meet the Nernst process, and the crystal plane orientation of the reduction product coating metal is controlled through the crystal plane orientation of the base metal with reducibility.
Further, in the method for regulating and controlling the crystal plane orientation of the metal coating, the base metal is a metal with low electrode potential, specifically, the electrode potential is not more than 0.342V, preferably at least one of Cu, Fe, Zn, brass, Mg and Al, and the coating metal comprises at least one of Sn, Ag, Ni, Pt, Au, Cd, Mo and Mn.
The invention screens out simple, cheap and easily available metal substrates with specific crystal plane orientation, such as single crystal metal foils which are already commercially produced, or metal materials with high preferred crystal plane orientation which can be controlled by other processes.
The principle of obtaining the metal coating with the specific crystal face orientation by regulating and controlling the crystal face orientation of the substrate is as follows:
A++B→B++A (1)
as shown in fig. 1, the displacement reaction includes 3 processes, namely, firstly, the B atom on the reducing substrate loses electrons and is separated from the surface of the substrate; secondly, the reduced A atoms are adsorbed on the surface of the substrate; finally, the adsorbed atoms can also migrate on the surface of the electrode, and when the lowest surface energy is reached, the atoms are in a stable state, and the crystal plane orientation of the plating layer is formed. The crystal face of the substrate can directly influence the processes, the substrate with the highly preferred crystal face orientation can be uniformly detached and adsorbed, and the highly preferred crystal face orientation coating with the lowest surface energy can be synthesized.
The invention generally uses metals such as Cu, Fe, Zn, brass and the like which are easy to regulate crystal plane orientation and cheap as substrates and have low electrode potential, can reduce more kinds of metal plating layers with high electrode potential, such as Sn, Ag, Ni, Pt, Au and the like, and designs the required crystal plane orientation of the metal plating layer by selecting the proper exposed crystal plane of the substrate so as to realize efficient electrochemical process control.
The invention can obtain the metal coatings which are difficult to prepare and have high preferred crystal plane orientation (more than 85 percent) and even full preferred crystal plane orientation by the method, so as to obtain the high reactivity and uniformity of the special coatings. For example, a coating of tin and silver, metals of which the crystal planes are fully preferred, can be obtained on a copper substrate of which the crystal planes are fully preferred, and tin and silver metals of which the crystal planes are fully preferred are very difficult to prepare.
The plating solution for electroless plating used in the present invention may include an organic plating solution or an aqueous plating solution. The principle of enabling electroless plating is based mainly on the mechanism of the displacement reaction of the metal, which principle should satisfy the nernst equation of the displacement reaction. For example, zinc is used instead of Cu or Ag. And it is difficult to achieve the replacement of Cu with Ag for the interfacial modification.
According to the design principle of the crystal face orientation of the plating layer, the form of the reductive reactant can be the shapes of metal foil, plate, net, powder and the like, and the key point is the crystal face exposure condition of the substrate, because the crystal face exposure of the plating layer can be directly influenced.
The substrate material selected by the chemical plating needs to be firstly removed with polishing liquid and degreasing liquid to remove the oxide layer on the surface, so that the plating layer is more compact, and the polishing degreasing process is widely used in industrial production and has the advantage of large-scale production.
Preferably, the plating solution is generally selected from commercially produced products (tin plating solution, silver plating solution, nickel plating solution, copper plating solution, and the like), and can be prepared by itself. The production process of the products is mature, the stability is good, and the scale production can be completely enlarged, which is also the advantage of the invention.
Preferably, the thickness of the coating can be controlled by the length of the chemical immersion plating, and the coating thickness can meet the design principle of the crystal face orientation of the coating within 2 microns.
The chemical plating time can be flexibly grasped, and because the plating layer forming mechanism is applicable in a wide time range, metal plating layers with different thicknesses can be obtained by controlling the immersion plating time so as to meet the actual industrialization requirement.
The second purpose of the invention is to provide the application of the metal material with the single crystal face orientation or high preferred crystal face orientation coating obtained by the regulation and control in the preparation of the metal battery negative electrode current collector material.
The metal material prepared by the invention can realize the current collector material with single crystal face orientation or high preferred crystal face orientation, can greatly improve the deposition-stripping reversibility of metal on the current collector material, and keeps high coulombic efficiency. For example: the Sn (101) coating with the fully preferred single crystal face orientation is realized on the single crystal face oriented copper, the problem of uneven metal deposition caused by crystal face activity difference is solved while the insufficient metal affinity of a copper substrate is improved, the performance of the Sn (101) coating on Zn, Li and Na metal cathodes is improved well, and the Sn (101) coating can be completely used for promoting the industrialization of the metal cathode with high energy density. Test results show that the service life of the Zn half-cell can be improved by nearly 4 times by using a single crystal face oriented tin coating current collector material; the assembled zinc ion full cell can keep 85.3% of capacity retention rate after 1000 cycles, which far exceeds the random orientation current collector material.
The third purpose of the invention is to provide the application of the metal material with the coating with single crystal face orientation or high preferred crystal face orientation in the regulation and control of the catalytic activity in the electrocatalysis process. As for the electrocatalysis performance of the electrode, the electrochemical activity of the electrode interface is a key problem influencing the catalysis efficiency, the electrocatalysis activity of corresponding materials is improved or reduced by effectively adjusting the crystal face orientation of the metal coating, and hydrogen and CO are separated in electrocatalysis2The method has potential application in reduction. In addition, the noble metal coating with highly preferred crystal face orientation is successfully synthesized, and a good design idea is provided for efficiently regulating and controlling the electrochemical interface reaction. For example, a simple method of achieving a single crystal plane orientation of the Ni metal plating can reduce the hydrogen evolution overpotential by 0.32V is of great commercial value.
Compared with the prior art, the invention has the following advantages:
(1) the method uses a chemical plating mode to accurately regulate and control the crystal plane orientation of the plating layer so as to obtain the plating layer with high activity and high preferred crystal plane orientation, even full preferred crystal plane orientation, and the production process is simple and can realize large-scale production; a single crystal face oriented or high preferred crystal face oriented coating which can not be prepared by using a conventional method can be prepared; the coating design can reduce the use of noble metal to the maximum extent, but can lead the electrode material to have extremely excellent electrochemical performance.
(2) The invention applies the coating material with the preferred crystal face orientation to the regulation and control of the metal cathode, obtains excellent electrochemical performance, can be completely used for large-scale production, and has great potential value on energy physical materials.
Description of the drawings:
FIG. 1 illustrates the formation of an electroless plating layer according to the present invention;
FIG. 2 is a production flow of a fully preferred single-plane oriented tin-plated copper foil which can be mass-produced in example 1;
FIG. 3 is an XRD pattern of different copper foils plated with tin for 30s in example 1;
FIG. 4 is an XRD pattern of different copper foils plated with tin for 2min in example 1;
FIG. 5 is a reverse polarity graph of the EBSD test after tinning of the different copper foils for 2min in example 1;
FIG. 6 is a scanning electron microscope and EBSD image of the cross section of different copper foils after tin plating in example 1;
fig. 7 is a graph of coulombic efficiency of Zn half cells for commercial Cu foil in example 2;
FIG. 8 is a graph of the coulombic efficiency of the zinc half cell of the tin-plated Cu foil of example 2;
FIG. 9 shows Zn NH as a current collector after tinning of the copper foil using the preferred single crystal plane oriented tin plating (preferred tin plating overall) and commercial copper foil or commercial copper foil (general tin plating) in example 24V4O10A full battery cycle performance map;
FIG. 10 is an LSV curve of the tin plating layer having a preferred single crystal plane orientation (preferred tin plating layer) and the general tin plating layer in example 2;
fig. 11 is a coulombic efficiency plot for the Li metal half cell of example 2;
fig. 12 is a graph of coulombic efficiency of the Na metal half cell of example 2;
FIG. 13 is a silver plating XRD pattern of a different copper foil in example 3;
FIG. 14 is a LSV curve for silver plating of different copper foils in example 3;
FIG. 15 is an XRD pattern of nickel plating of different zinc foils of example 4;
fig. 16 is a plot of LSV for different nickel plated zinc foils of example 4.
The specific implementation mode is as follows:
the technical solutions of the present invention are further described below with reference to the following examples, but the present invention is not limited thereto, and any modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Example 1.
The commercialized copper foil with a non-preferential crystal face of 30 microns and the commercialized copper foil with a full-preferential single crystal face of 200 crystal faces are soaked in a dilute sulfuric acid solution for 2min to remove surface oil stains and an oxidation layer, and then the residual acidic solution is washed away by deionized water. Then soaking the copper foil in NaH2PO2.2H2O(10g L-1),CS(NH2)2(70g L-1),SnCl2.H2O(10g L-1),and HCL(2g L-1) The immersion time of the prepared tin plating solution is 30s and 2min, after the immersion is finished, the residual tin plating solution is washed away by deionized water, and the copper base material (fully preferred copper foil) with the tin metal coating with the single crystal face orientation can be obtained by drying in a drying oven at 60 ℃ for 3h, and the preparation process can also be used for simple industrial production according to a flow chart 2. The crystal plane structure of the tin plating was then characterized using XRD and back-scattered electron diffraction techniques (EBSD). As can be seen from XRD of commercial copper foil (multi-orientation copper tin plating) and special full 200 single crystal face preferred copper foil tin plating material (single orientation copper tin plating) in figures (3-4), the full preferred single crystal face is preferred whether tin plating is performed for 30s or 2minThe tin-plated layers of the copper foils only show a diffraction peak of Sn (101), while the tin-plated layers of the commercial copper foils ensure that four diffraction peaks of Sn (100), Sn (112), Sn (101) and copper-tin alloy appear, so that the copper material modified by the Sn plating layer with the total preferential single crystal face can be prepared by using the copper foil with the total preferential single crystal face. Such tin plating layer materials with a preferred single crystal plane have never been reported. The inverse pole figure of the EBSD test results in fig. 5 also fully illustrates the information of the coating of such a totally preferred single crystal plane. As can be seen from the combination of the scanning electron microscope and the energy spectrometer in fig. 6, the tin plating layer is only about 150nm and is dense, which greatly reduces the usage amount of tin, because the price of tin is much higher than that of copper, and the tin plating layer can have the ductility of copper and the physicochemical properties of tin.
Example 2.
The tin-plated copper-based material prepared in example 1 and a commercial copper foil were used as a current collector of an aqueous zinc-ion battery, which was cut to 1cm2Using 2mol ZnSO as an electrode4Assembling 2025 Zn button half-cell with electrolyte and glass fiber as separator, and setting charge and discharge parameters to 5mAcm-2-2mAhcm-2(current density and area capacity), the charge cut-off voltage is 0.5V, the correlation curves of the cycle number and the coulomb efficiency are obtained, and it is found from fig. 7-8 that the short circuit occurs only in 41h in the copper current collector material with low zinc affinity (non-tinned commercial Cu foil), and the normal coulomb efficiency of 120h can be maintained even in the tinned multi-orientation crystal plane copper current collector (multi-orientation Sn), and the cycle life of the copper current collector (single orientation Sn) material with the full-preferred single crystal plane tin coating can be prolonged by more than 380h, and the battery life is prolonged by more than 3 times. Further, the observation of the deposition morphology of zinc on these materials revealed that the deposition of zinc on the fully preferred single crystal plane tin plating was very dense and uniform, with no dendrites at all, and was very uniform even after 50 cycles, in contrast to pure copper foil and conventional tin-plated copper foil.
Further, zinc of 2mAh is plated on a current collector to serve as a negative electrode of the zinc ion battery, and NH is used4V4O10AsThe positive electrode material, 2M zinc sulfate as electrolyte, glass fiber as separator, and 1Ag for the whole cell-1The current density of the tin-plated layer with the preferred single crystal orientation is tested, and the fact that the tin-plated layer current collector with the preferred single crystal orientation can still have the capacity retention rate of 85.3% after 1000 cycles is found in fig. 9, and the capacity retention rates of the commercial copper foil and the tin-plated modified current collector with the commercial copper foil are only 9.8% and 17.1%, and the practical value of the tin-plated layer with the preferred single crystal orientation is greatly proved.
Further, an LSV test is carried out on a common copper foil tinned current collector and a full preferred single crystal face orientation tinned copper foil in a 2mol KCl aqueous solution, wherein Pt is used as a counter electrode, Ag/AgCl is used as a reference electrode, different types of tinned copper foils are used as working electrodes, and the scanning speed is 1 mV/s. Fig. 10 is the corresponding hydrogen evolution curve results, illustrating that the tin-plated copper foil with all preferred single crystal plane orientation has a higher hydrogen evolution overpotential, illustrating that higher zinc deposition efficiency can be obtained and hydrogen evolution reaction can be suppressed in an aqueous battery, which also illustrates that the hydrogen evolution reaction has a strong relationship with the crystal plane orientation.
The copper with the full-preferred single crystal face tin coating is used as a current collector material of lithium metal, a polypropylene film is used as a diaphragm, 1M lithium trifluoromethanesulfonylimide is used as electrolyte, a 2025 Li half-cell is assembled, and the charge-discharge parameter is set to be 1mAcm-2-1mAhcm-2(current density and area capacity), the charge cut-off voltage was 1V, and the half-cell coulombic efficiency and cycle life tests were performed. As can be seen from fig. 11, the tin-plated copper current collector with a preferred single crystal plane orientation can be cycled more than 300 times, while the conventional tin-plated copper current collector can be cycled less than 100 times.
Finally, the tin coating material with the preferred single crystal face is used for regulating and controlling the deposition-stripping process of the Na metal cathode, glass fiber is used as a diaphragm, 1M sodium hexafluorophosphate is used as electrolyte, a Na metal half-cell is assembled, and the charge-discharge parameter is 1mAcm-2-1mAhcm-2(current density and area capacity), the charge cut-off voltage was 1V, and the half-cell coulombic efficiency and cycle life tests were performed. As can be seen from FIG. 12, this type of crystal has a preferred single crystalThe tin-plated layer of the surface has longer cycle life, and the material is expected to be widely used as a current collector of a metal negative electrode.
Example 3.
Using commercial copper foil (multi-orientation Cu) and Cu (111) with a total preferential single crystal face and Cu (200) with a total preferential single crystal face as substrates to carry out chemical silver plating, wherein the silver plating solution is AgNO3(100gL-1) Thiourea (1 gL)-1)，PVP(0.5gL-1)HNO3(10gL-1) The composition is that dilute nitric acid is used for chemical polishing and deoiling, then deionized water is used for washing away residual acid, and after the solution is soaked in a plating solution for 2min, the solution is taken out, washed and dried. XRD was used to characterize the crystal structure of the silver plated layer. It is found from fig. 13 that, using Cu (111) of a preferred single crystal plane all as a substrate, an Ag (111) plating layer of a preferred single crystal plane all orientation can be obtained.
The influence of the silver plating layer with the preferred single crystal face on the hydrogen evolution activity of the electrode is inspected, and an LSV test is also carried out (Pt is used as a counter electrode, Ag/AgCl is used as a reference electrode, different types of silver-plated copper foils are used as working electrodes, the scanning speed is 1mV/s), and as can be seen from figure 14, the noble metal Ag plating layer with the preferred single crystal face can obviously reduce the hydrogen evolution overpotential of the electrode compared with a common silver plating layer (commercial copper foil silver plating), and has potential application on HER.
Example 4.
In order to further verify the original lithium of the coating crystal orientation design calculated by the first principle in the embodiment, commercial zinc foil and Zn foil with a preferred single crystal face are used as substrates, chemical nickel plating is carried out, a nickel plating solution consists of 22g/L of nickel sulfate, 25g/L of sodium hypophosphite, 15g/L of sodium acetate, 6g/L of malic acid, 8ml/L of lactic acid, 4mg/L of bismuth sulfate, 2mg/L of phenanthroline and 4mg/L of sodium dodecyl sulfate, the copper foil is firstly chemically polished and deoiled by using dilute nitric acid, then the residual acid is washed by using deionized water, and after the copper foil is soaked in the plating solution for 2min, the copper foil is taken out, washed and dried. Then, XRD characterization was performed, and it can be seen from FIG. 15 that Ni (200) plating layer having a preferred single crystal face can be obtained after nickel plating of (200) zinc foil having a preferred single crystal face orientation compared to conventional nickel plating layer (commercial zinc foil nickel plating). Further, it was tested that the overpotential for hydrogen evolution (deionized water as electrolyte, Pt as counter electrode, Ag/AgCl as reference electrode, different kinds of nickel-zinc-plated foils as working electrode, scan rate 1mV/s) was measured using it as cathode for electrolyzing pure water), and it can be found from fig. 16 that Ni (200) plating layer with a preferred single crystal face can achieve extremely low overpotential for hydrogen evolution compared with ordinary nickel-plated layer (commercial nickel-plated zinc foil), indicating that these specially oriented metal plating layers can achieve efficient electrochemical process control.
TABLE 1 specially oriented metallic coatings prepared using different substrates and related parameters
Claims (10)
1. A method for regulating and controlling crystal plane orientation of a metal coating is characterized by comprising the following steps:
step one, selecting a metal material with single crystal face orientation or high preferred crystal face orientation as a substrate; the high preferred crystal plane orientation means that the proportion of one crystal plane orientation reaches more than 80 percent of all crystal plane orientations, and preferably more than 85 percent;
step two, obtaining a metal coating with single crystal face orientation or high preferred crystal face orientation by using the selected substrate material through a chemical immersion plating method; the high preferred crystal plane orientation of the plating layer means that the proportion of one crystal plane orientation is more than 80 percent of all crystal plane orientations, and preferably more than 85 percent.
2. The method for regulating and controlling the crystal plane orientation of the metal coating according to claim 1, wherein the selected base metal and the coating metal can perform a metal replacement reaction and can satisfy the nernst equation.
3. The method for regulating and controlling the crystal plane orientation of the metal coating according to claim 1, wherein the base metal is selected from metals with low electrode potential, preferably at least one of Cu, Fe, Zn, brass, Mg and Al, and the coating metal comprises at least one of Sn, Ag, Ni, Pt, Au, Cd, Mo and Mn.
4. The method for regulating and controlling the crystal plane orientation of the metal coating according to claim 1, wherein the base metal is a metal foil, plate, mesh or powder; the oxide layer on the surface is preferably removed by using a polishing liquid and a degreasing liquid.
5. The method for regulating and controlling the crystal plane orientation of the metal coating according to claim 1, wherein the plating solution for the chemical immersion plating comprises an organic plating solution or an aqueous plating solution.
6. The method for regulating and controlling crystal plane orientation of the metal coating according to claim 1, wherein the coating thickness is not more than 2 μm.
7. A metal material with a coating with single crystal face orientation or high preferred crystal face orientation, which is obtained by the regulation and control of the method of any one of claims 1 to 6.
8. The use of the metal material having a single crystal plane orientation or high preferred crystal plane orientation coating as defined in claim 7 in the preparation of a metal battery negative electrode current collector material.
9. Use according to claim 8, characterized in that the metal battery comprises Zn, Li, Na, Mg, Al or K.
10. The use of the metal material having a coating with a single crystal plane orientation or a high preferred crystal plane orientation as defined in claim 7 for regulating the catalytic activity in an electrocatalytic process.
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