CN114480848A - Smelting treatment method for waste circuit board - Google Patents
Smelting treatment method for waste circuit board Download PDFInfo
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- CN114480848A CN114480848A CN202111661431.9A CN202111661431A CN114480848A CN 114480848 A CN114480848 A CN 114480848A CN 202111661431 A CN202111661431 A CN 202111661431A CN 114480848 A CN114480848 A CN 114480848A
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- smelting
- circuit board
- waste circuit
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- copper
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- 238000003723 Smelting Methods 0.000 title claims abstract description 83
- 239000002699 waste material Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000011282 treatment Methods 0.000 title claims abstract description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000010949 copper Substances 0.000 claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 43
- 238000000197 pyrolysis Methods 0.000 claims abstract description 38
- 239000000203 mixture Substances 0.000 claims abstract description 36
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 31
- 239000001301 oxygen Substances 0.000 claims abstract description 31
- 229910052742 iron Inorganic materials 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000002893 slag Substances 0.000 claims abstract description 25
- RHZUVFJBSILHOK-UHFFFAOYSA-N anthracen-1-ylmethanolate Chemical compound C1=CC=C2C=C3C(C[O-])=CC=CC3=CC2=C1 RHZUVFJBSILHOK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000003830 anthracite Substances 0.000 claims abstract description 15
- 238000010791 quenching Methods 0.000 claims abstract description 10
- 230000000171 quenching effect Effects 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims description 10
- 238000005266 casting Methods 0.000 claims description 8
- OBOXTJCIIVUZEN-UHFFFAOYSA-N [C].[O] Chemical compound [C].[O] OBOXTJCIIVUZEN-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000011575 calcium Substances 0.000 claims description 4
- 235000013980 iron oxide Nutrition 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 235000012255 calcium oxide Nutrition 0.000 claims description 3
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 claims description 3
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 238000011084 recovery Methods 0.000 abstract description 21
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000010793 electronic waste Substances 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
- C22B7/004—Dry processes separating two or more metals by melting out (liquation), i.e. heating above the temperature of the lower melting metal component(s); by fractional crystallisation (controlled freezing)
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0026—Pyrometallurgy
- C22B15/0056—Scrap treating
Abstract
The invention discloses a smelting treatment method of a waste circuit board, which comprises the following steps: carrying out primary pyrolysis on the waste circuit board to obtain a pyrolysis product of the waste circuit board; uniformly mixing a pyrolysis product of a waste circuit board, matte, water quenching slag, an iron-containing auxiliary material and anthracite to obtain a smelting mixture; and (3) carrying out oxygen-enriched smelting on the smelting mixture at 1300-1400 ℃, leading out lower-layer materials after smelting and layering, cooling and recovering to obtain a crude copper ingot. According to the invention, by introducing the matte, the water quenching slag and the iron-containing auxiliary materials, the pyrolysis product of the waste circuit board is easier to fully react under the condition of unchanged smelting temperature, and the recovery rate of copper in the waste circuit board is obviously improved; meanwhile, the method realizes comprehensive recovery treatment of multiple wastes and obviously improves the recovery utilization rate.
Description
Technical Field
The invention relates to the technical field of solid waste recycling, in particular to a waste circuit board smelting treatment method.
Background
With the continuous development of the electronic and information industries, the total amount of electronic waste materials is increased in an expansion mode, and electronic waste materials not only contain a large amount of valuable metals such as copper, tin, iron, aluminum and other precious metals, but also contain a large amount of materials such as plastics, resins, ceramics and the like, so that the electronic waste materials have high resource recycling value, and particularly, printed circuit boards, serving as basic products of the electronic industry, are indispensable components of various electronic products. The printed circuit board mainly comprises organic reinforced resin, glass fiber, copper foil and electronic components, wherein the content of metals such as copper, gold, silver, platinum, palladium, lead, tin, nickel, iron, aluminum and the like is more than 95%, and the printed circuit board has extremely high recovery value. However, the circuit board is complex in composition and many in element types, so that the comprehensive treatment of the circuit board is difficult.
In the prior art, a high-temperature smelting mode is usually adopted to recycle waste circuit boards, but when the waste circuit boards are smelted in a traditional smelting mode at 1100-1400 ℃, because pyrolysis products of the waste circuit boards are complex mixtures of metal simple substances, metal oxides and other components, metal copper and copper oxides are difficult to fully melt and react in the actual smelting process, and are mixed and solidified with other metal components too early, so that the recovery rate of copper is limited. It is therefore desirable to provide a new process for solving the above-mentioned existing problems.
Disclosure of Invention
The invention aims to provide a waste circuit board smelting treatment method, which is used for solving the problem that the copper recovery rate is limited because the copper component is difficult to be subjected to full melting reaction by the existing process method for treating the waste circuit board by high-temperature smelting.
In order to solve the technical problem, the invention provides a waste circuit board smelting treatment method, which comprises the following steps: carrying out primary pyrolysis on the waste circuit board to obtain a pyrolysis product of the waste circuit board; uniformly mixing the pyrolysis product of the waste circuit board, the matte, the water quenching slag, the iron-containing auxiliary material and the anthracite to obtain a smelting mixture; and (3) carrying out oxygen-enriched smelting on the smelting mixture at 1300-1400 ℃, conducting smelting layering, then guiding out lower-layer materials, cooling and then recovering to obtain a crude copper ingot.
Preferably, the smelting mixture comprises the following raw materials in percentage by mass: 15-30% of circuit board pyrolysis products, 20-35% of scrap copper, 10-20% of water-quenched slag, 5-15% of iron-containing auxiliary materials and 15-35% of anthracite.
Preferably, the copper content of the matte is 20-50%, and the iron content is 10-30%.
Preferably, the temperature of the primary pyrolysis is 250-800 ℃, and the pyrolysis time is 1-2 h.
Preferably, the iron-containing auxiliary material is any one or a mixture of two of copper sulfide slag and industrial iron mud.
Preferably, the water quenching slag is smelting slag containing silicon, calcium and iron oxides produced in the industrial copper and lead smelting process.
Preferably, in the oxygen-enriched smelting process, the smelting time is 1.5-3 h.
Preferably, in the oxygen-enriched smelting process, the oxygen concentration in the oxygen-enriched air is 50-75%, the oxygen-carbon ratio is 1.9-2.8, and the oxygen-carbon ratio is the ratio of the oxygen volume to the mass of carbon in the anthracite.
Preferably, the smelting mixture is subjected to oxygen-enriched smelting in an oxygen-enriched side-blown smelting pool, and after smelting and layering, the lower-layer material is led out to a steel casting mold for water-cooling ingot casting to obtain a crude copper ingot.
Preferably, the mass percentage of the metal copper in the crude copper ingot is more than 90%.
The invention has the beneficial effects that: the waste circuit board pyrolysis product is easy to fully react under the condition of unchanged smelting temperature by introducing matte, water quenching slag and iron-containing auxiliary materials, so that the recovery rate of copper in the waste circuit board is obviously improved; meanwhile, the method realizes comprehensive recovery treatment of multiple wastes and obviously improves the recovery utilization rate.
Drawings
FIG. 1 is a process flow diagram of an embodiment of the method for smelting waste circuit boards according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1, the present invention provides a method for smelting waste circuit boards, comprising the following steps:
s1, carrying out primary pyrolysis on the waste circuit board to obtain a pyrolysis product of the waste circuit board. In the step, the temperature of the primary pyrolysis is 250-800 ℃, and the pyrolysis time is 1-2 h.
S2, uniformly mixing the pyrolysis product of the waste circuit board, the matte, the water quenching slag, the iron-containing auxiliary material and the anthracite to obtain a smelting mixture. In the step, the smelting mixture comprises the following raw materials in percentage by mass: 15-30% of circuit board pyrolysis products, 20-35% of scrap copper, 10-20% of water-quenched slag, 5-15% of iron-containing auxiliary materials and 15-35% of anthracite. Wherein the copper content in the matte is 20-50%, and the iron content is 10-30%; the iron-containing auxiliary material is any one or a mixture of two of copper sulfide slag and industrial iron mud; the water quenching slag is smelting slag containing silicon, calcium and iron oxides produced in the industrial smelting process of copper and lead.
And S3, carrying out oxygen-enriched smelting on the smelting mixture at 1300-1400 ℃, conducting smelting layering, then guiding out lower-layer materials, cooling and then recovering to obtain the crude copper ingot. In the step, oxygen-enriched smelting is carried out on the smelting mixture in an oxygen-enriched side-blown smelting pool, after smelting and layering, lower-layer materials are led out to a steel casting die for water-cooling ingot casting, a crude copper ingot is obtained, and the mass percentage of metal copper in the crude copper ingot is more than 90%; the oxygen-enriched smelting time is 1.5-3 h, the oxygen concentration in the oxygen-enriched air is 50-75%, the oxygen-carbon ratio is 1.9-2.8, and the oxygen-carbon ratio is the ratio of the oxygen volume to the mass of carbon in the anthracite.
The mechanism of the invention is that the matte with lower Cu and Fe grades is introduced, so that the condition of melting reaction of metal copper and copper oxide in the melting mixture is reduced, the full reaction is easier under the condition of unchanged melting temperature, the enrichment of Cu at high temperature is promoted, and the recovery rate of copper in the waste circuit board is further improved; adjusting the slag form of the smelting mixture by introducing water-quenched slag to reach a state suitable for a melting reaction, and separating out an iron component in the form of iron oxide after oxygen-enriched smelting and separating the iron component from a molten copper component; in addition, the method treats the waste circuit board pyrolysis product and simultaneously treats the industrial waste materials such as water-quenched slag and industrial iron mud, so that the comprehensive recovery treatment of multiple waste materials is realized, and the recovery utilization rate is obviously improved.
In the following examples, matte and anthracite with the same chemical composition are adopted, and specifically, the copper content in the matte is 40%, and the iron content is 15%; in percentage by mass, the anthracite has a fixed carbon content of 81.58%, an ash content of 11.58%, a volatile component of 6.3% and a sulfur content of 0.45%.
Example 1
The steps of the smelting treatment of the waste circuit board in the embodiment are as follows:
(1) and carrying out preliminary pyrolysis on the waste circuit board, wherein the temperature of the preliminary pyrolysis is 600 ℃, and the pyrolysis time is 1h, so as to obtain a pyrolysis product of the waste circuit board.
(2) According to the mass percentage, 18% of waste circuit board pyrolysis products, 35% of matte, 12% of water quenching slag, 10% of industrial iron mud and 25% of anthracite are uniformly mixed to obtain a smelting mixture.
(3) And (2) carrying out oxygen-enriched smelting on the smelting mixture in an oxygen-enriched side-blown smelting pool at 1350 ℃, wherein the oxygen-enriched smelting time is 2 hours, the oxygen concentration in oxygen-enriched air is 50%, and the molar ratio of oxygen to carbon is 2, and after smelting and layering, guiding the lower-layer material to a steel casting die for water-cooling ingot casting to obtain a crude copper ingot.
Example 2
The present embodiment is based on the processing steps of embodiment 1, and the difference is that the mixture ratio of each raw material in the smelting mixture is different, specifically, the mixture ratio of each raw material in the smelting mixture in the present embodiment is: 28% of waste circuit board pyrolysis product, 27% of matte, 18% of water-quenched slag, 8% of industrial iron mud and 19% of anthracite, and other processing steps and parameters are consistent with those of example 1.
Example 3
The present embodiment is based on the processing steps of embodiment 1, and the difference is that the mixture ratio of each raw material in the smelting mixture is different, specifically, the mixture ratio of each raw material in the smelting mixture in the present embodiment is: 33% of pyrolysis product of waste circuit boards, 24% of matte, 15% of water-quenched slag, 6% of industrial iron mud and 22% of anthracite, and other processing steps and parameters are consistent with those of example 1.
Comparative example 1
The present example is based on the processing steps of example 1, with the difference that no matte component is added to the raw materials of the smelting mix, other components and proportions are the same as in example 1, and other processing steps and parameters are also the same as in example 1.
The pyrolysis products of the waste circuit boards in examples 1 to 3 and comparative example 1 were subjected to composition analysis, and the specific component contents are shown in table 1.
TABLE 1
| Components | Cu/％ | Al/％ | Si/％ | Ca/％ | Fe/％ | Zn/％ | Sn/％ | C/％ |
| Pyrolysis product of waste circuit board | 18.47 | 4.96 | 6.31 | 3.65 | 8.5 | 1.7 | 3.88 | 13.66 |
The crude copper ingots obtained after the treatments in examples 1 to 3 and comparative example 1 were subjected to component analysis, and the corresponding recovery rates were counted, with the results shown in table 2. As can be seen from the data in Table 2, in all the examples 1 to 3, the content of Cu in the prepared crude copper ingot reaches more than 90%, and the recovery rate of copper reaches more than 99%; in contrast, in comparative example 1, no matte is introduced, and both the content of Cu in the prepared crude copper ingot and the copper recovery rate are lower than those in examples 1 to 3, it is proved that the copper recovery rate can be improved after adding matte under the condition that the melting temperature is not changed. In addition, comparing the data of examples 1-2 in table 2 with the data of example 3, it can be found that the content of Cu and the copper recovery rate of the blister copper ingot prepared in example 3 are lower than those of examples 1-2, because the raw material components of the melting mixture in examples 1-2 are all within the above-mentioned limited range, and the pyrolysis product of the circuit board in example 3 exceeds the above-mentioned limited range, which results in that the content of the pyrolysis product of the circuit board in example 3 is higher and the content of matte is lower, and the amount of introduced matte is not enough to match the pyrolysis product of the circuit board to achieve a better effect of promoting the melting reaction, thus indicating that the raw materials in the melting mixture need to achieve a better copper recovery effect under the above-mentioned limited proportioning condition.
TABLE 2
The waste circuit board pyrolysis product is easy to fully react under the condition of unchanged smelting temperature by introducing matte, water quenching slag and iron-containing auxiliary materials, so that the recovery rate of copper in the waste circuit board is obviously improved; meanwhile, the method realizes comprehensive recovery treatment of multiple wastes and obviously improves the recovery utilization rate.
It should be noted that the above embodiments belong to the same inventive concept, and the description of each embodiment has a different emphasis, and reference may be made to the description in other embodiments where the description in individual embodiments is not detailed.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A smelting treatment method for a waste circuit board is characterized by comprising the following steps:
carrying out primary pyrolysis on the waste circuit board to obtain a pyrolysis product of the waste circuit board;
uniformly mixing the pyrolysis product of the waste circuit board, the matte, the water quenching slag, the iron-containing auxiliary material and the anthracite to obtain a smelting mixture;
and (3) carrying out oxygen-enriched smelting on the smelting mixture at 1300-1400 ℃, conducting smelting layering, then guiding out lower-layer materials, cooling and then recovering to obtain a crude copper ingot.
2. The method for smelting and processing the waste circuit board as claimed in claim 1, wherein the smelting mixture comprises the following raw materials in parts by mass:
15-30% of circuit board pyrolysis products, 20-35% of scrap copper, 10-20% of water-quenched slag, 5-15% of iron-containing auxiliary materials and 15-35% of anthracite.
3. The method for smelting and treating the waste circuit board as claimed in claim 1, wherein the copper content of the matte is 20-50% and the iron content is 10-30%.
4. The method for smelting and processing the waste circuit board as claimed in claim 1, wherein the temperature of the primary pyrolysis is 250-800 ℃, and the pyrolysis time is 1-2 h.
5. The method for smelting and treating the waste circuit board as claimed in claim 1, wherein the iron-containing auxiliary material is any one or a mixture of two of copper sulfide slag and industrial iron mud.
6. The method for smelting and processing the waste circuit board as claimed in claim 1, wherein the water-quenched slag is smelting slag containing silicon, calcium and iron oxides produced in the industrial copper and lead smelting process.
7. The scrap wire board smelting treatment method according to claim 1, wherein in the oxygen-enriched smelting process, the smelting time is 1.5-3 hours.
8. The method for smelting and processing the waste circuit board as claimed in claim 1, wherein in the oxygen-enriched smelting process, the oxygen concentration in the oxygen-enriched air is 50-75%, the oxygen-carbon ratio is 1.9-2.8, and the oxygen-carbon ratio is the ratio of the oxygen volume to the mass of carbon in the anthracite.
9. The method for smelting and processing the waste circuit board as claimed in claim 1, wherein the smelting mixture is subjected to oxygen-enriched smelting in an oxygen-enriched side-blown smelting tank, and after smelting and layering, a lower layer material is led out to a steel casting mold for water-cooling ingot casting to obtain the blister copper ingot.
10. The method for smelting and processing waste circuit boards as claimed in claim 8, wherein the mass percentage of metallic copper in the blister copper ingot is greater than 90%.
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| 艾光华等: "《铜矿选矿技术与实践》", vol. 1, 31 December 2017, 冶金工业出版社, pages: 268 * |
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