CN114477069A - Micro-mechanical film structure of MEMS device and MEMS device - Google Patents
Micro-mechanical film structure of MEMS device and MEMS device Download PDFInfo
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- CN114477069A CN114477069A CN202210061114.1A CN202210061114A CN114477069A CN 114477069 A CN114477069 A CN 114477069A CN 202210061114 A CN202210061114 A CN 202210061114A CN 114477069 A CN114477069 A CN 114477069A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Micromachines (AREA)
Abstract
The invention discloses a micro-mechanical film structure of an MEMS device and the MEMS device, the micro-mechanical film structure comprises: a substrate; the anchor point seat is arranged on the substrate; the elastic membrane assembly comprises a membrane piece and a stress absorption piece, wherein the stress absorption piece is arranged on the membrane piece to absorb the stress causing the creep of the membrane piece, and one of the membrane piece and the stress absorption piece is arranged on the anchor point seat. According to the invention, the stress absorption piece is arranged to absorb the stress which causes the creep of the film piece, so that the concentrated stress on the elastic film component is released or homogenized, the creep resistance is improved, and the performance drift of the MEMS device is avoided.
Description
Technical Field
The invention relates to the field of parts of MEMS (micro-electromechanical systems) devices, in particular to a micro-mechanical film structure of an MEMS device and the MEMS device.
Background
Micromechanical thin-film structures are typical components in MEMS (micro-electro-mechanical systems) devices, and are commonly used for structure actuation, signal sensing, and the like. The micromechanical thin film structure is generally made of a metal material or a non-metal material, and for these materials (especially, metal materials), under the condition of mechanical stress in the working process, due to the creep characteristic thereof, the MEMS device may gradually generate unrecoverable deformation, so that the performance of the MEMS device may drift, and in a severe case, the MEMS device may even fail.
In order to alleviate the creep deterioration of the structure, the industry generally adopts a high-strength creep-resistant novel material to improve the performance; however, the method needs to develop and evaluate a novel material, the period is long, the risk is high, and the development result has certain unpredictability.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a micro-mechanical film structure of an MEMS device, which improves the creep resistance.
The invention also provides an MEMS device applying the micromechanical film structure, and creep resistance is improved.
According to an embodiment of the invention, a micromechanical thin film structure of a MEMS device comprises: a substrate; the anchor point seat is arranged on the substrate; an elastic membrane assembly including a membrane member and a stress absorber provided on the membrane member to absorb stress inducing creep of the membrane member, one of the membrane member and the stress absorber being provided on the anchor point seat.
According to the micromechanical membrane structure of the MEMS device, the stress absorption piece is arranged to absorb the stress which causes the creep of the membrane piece, so that the concentrated stress on the elastic membrane component is released or homogenized, the creep resistance is improved, and the performance drift of the MEMS device is avoided.
In some embodiments, the stress absorber has an absorption space, the circumferential wall of the absorption space is provided with a transition fillet, and the film member can transmit force to the stress absorber to cause the absorption space of the stress absorber to deform to absorb the stress.
Further, the absorption space is a closed space or an open space having an opening.
Still further, the open space comprises one or more subspaces, and when the open space comprises a plurality of the subspaces, the openings of any two adjacent subspaces are oppositely oriented.
Specifically, the stress absorbing member includes a main body portion, the sub-space is formed in the main body portion, wherein, when the open space includes a plurality of the sub-spaces, the main body portion includes a plurality of bent portions, each of the bent portions is formed with the sub-space, an end portion of one of any two adjacent bent portions is provided in an opening of the other one, and end portions of any two adjacent bent portions are connected through the connecting portion.
In some embodiments, the membrane member is configured as a beam or membrane.
Specifically, the beam body includes a plurality of components of a whole that can function independently roof beam, and arbitrary adjacent two be equipped with between the components of a whole that can function independently roof beam stress absorbing piece, stress absorbing piece includes the main part and establishes the accepting part at main part both ends, be formed with on the main part the absorption space, the accepting part at main part both ends is connected respectively on adjacent two components of a whole that can function independently roof beam.
More specifically, at least one of the head and the tail of the split beams is connected to the anchor point seat.
In some embodiments, the film is provided with a plurality of stress absorbing members in a circumferential direction, the stress absorbing members include a main body portion and receiving portions provided at two ends of the main body portion, the main body portion is formed with the absorbing space, the receiving portion at one end of the main body portion is connected to the anchor point seat, and the receiving portion at the other end of the main body portion is connected to the film.
A MEMS device according to an embodiment of the invention comprises the micromechanical membrane structure described above.
According to the MEMS device, the stress absorption piece is arranged to absorb the stress which causes the creep of the film piece, so that the concentrated stress on the elastic film component is released or homogenized, the creep resistance is improved, and the performance drift of the MEMS device is avoided.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a micromechanical membrane structure having two split beams according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a micromechanical membrane structure having three separate beams according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a micromechanical membrane structure having two beams according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a mass of a micromechanical membrane structure according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural view of a stress absorber according to a first embodiment of the present invention;
FIG. 6 is a schematic structural view of a stress absorber in a second embodiment of the invention;
FIG. 7 is a schematic structural view of a stress absorbing member according to a third embodiment of the present invention;
FIG. 8 is a schematic structural view of a stress absorbing member according to a fourth embodiment of the present invention;
FIG. 9 is a schematic view of a stress absorbing member applied to a beam body according to a fourth embodiment of the present invention;
fig. 10 is a schematic view showing a stress absorbing member applied to a thin film according to a third embodiment of the present invention.
Reference numerals:
100. a micromechanical membrane structure;
10. a substrate; 20. an anchor point seat;
30. an elastic membrane assembly; 311. a beam body; 3111. a split beam; 312. a film; 32. a stress absorbing member; 321. an absorption space; 322. transition fillets; 323. a main body portion; 3231. a curved portion; 3232. a connecting portion; 324. a receiving part; 40. a mass block.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.
In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A micromechanical thin-film structure 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 1, a micro-mechanical thin-film structure 100 according to an embodiment of the present invention, the micro-mechanical thin-film structure 100 includes: substrate 10, anchor 20, and elastic membrane element 30.
The elastic membrane assembly 30 comprises a membrane and a stress absorber 32, the stress absorber 32 being provided on the membrane to absorb stresses that induce creep of the membrane, one of the membrane and the stress absorber 32 being provided on the anchor point seat 20. For example, the membrane is provided on the anchor seat 20; alternatively, the stress absorbing member 32 is provided on the anchor point seat 20.
In the working process of the MEMS device, due to the influence of temperature, time and pressure, the elastic membrane assembly 30 may creep, for example, the elastic membrane assembly 30 is a double-end clamped beam, and the middle position of the double-end clamped beam may be laid down, so that the working state of the MEMS device changes, the performance of the MEMS device is affected, and the failure of the MEMS device is seriously caused. The stress absorption part 32 is arranged to absorb the stress which causes creep deformation, and the concentrated stress on the elastic membrane assembly 30 is released or homogenized, so that the creep resistance of the MEMS device is improved.
According to the micromechanical membrane structure 100 of the embodiment of the present invention, the stress absorbing member 32 is arranged to absorb the stress that induces the creep of the membrane member, so that the concentrated stress on the elastic membrane assembly 30 is released or homogenized, thereby improving the creep resistance and avoiding the performance drift of the MEMS device.
As shown in fig. 5 and 6, in some embodiments, the stress absorbing member 32 has an absorbing space 321, transition fillets 322 are provided on a circumferential wall of the absorbing space 321, and the film member can transmit force to the stress absorbing member 32 to cause the absorbing space 321 of the stress absorbing member 32 to deform to absorb stress, and the transition fillets 322 are provided to avoid stress concentration, thereby improving creep resistance. The stress absorbing member 32 is provided on the film member to absorb the stress that causes the film member to creep by deforming, and the deformation of the absorbing space 321 in the stress absorbing member 32 represents the deformation of the stress absorbing member 32, thereby absorbing the stress. Wherein, the power on the film member is transmitted to the stress absorption piece 32, and there is stress on the stress absorption piece 32 as well, and transition fillet 322 on the stress absorption piece 32 avoids stress to concentrate in transition fillet 322 position to improve creep resistance.
As shown in fig. 5 to 8, further, the absorption space 321 is a closed space or an open space having an opening. For example, the absorption space 321 is a closed space, and the creep resistance is further improved by using air in the closed space; alternatively, the absorption space 321 is an open space having an opening, facilitating the transmission of force.
As shown in fig. 5, 6, and 7, specifically, the stress absorbing member 32 has a hollow portion, and a closed space is provided in the hollow portion. It should be noted that the enclosed space in the hollow portion does not mean that the space is closed, but means that the space is surrounded by a restriction, for example, the shape of the stress absorbing member 32 is rectangular, the rectangular stress absorbing member 32 restricts the rectangular enclosed space, the shape of the stress absorbing member 32 may be circular or elliptical, the circular stress absorbing member 32 restricts the circular enclosed space, the elliptical stress absorbing member 32 restricts the elliptical enclosed space,
as shown in fig. 8, further, the open space includes one or more sub-spaces, when the open space includes a plurality of sub-spaces, the directions of the openings of any two adjacent sub-spaces are opposite, and by setting the directions of the openings of any two adjacent sub-spaces to be opposite, the stress absorbing member 32 can be deformed in different directions when being stressed, so as to avoid the excessive deformation of the stress absorbing member 32 in the same direction to cause the creep, and further improve the creep resistance. The plurality of subspaces may be two subspaces, three subspaces, or four subspaces, which is not limited herein.
For example, the open space includes two subspaces, the two subspaces are arranged left and right, the opening of the left subspace faces to the rear, and the opening of the right subspace faces to the front, so as to complete the absorption of the stress.
As shown in fig. 8, specifically, the stress absorbing member 32 includes a main body part 323, a sub-space is formed on the main body part 323, wherein, when the open space includes a plurality of sub-spaces, the main body part 323 includes a plurality of bent parts 3231 and a connecting part 3232, the plurality of bent parts 3231, a sub-space is formed on each bent part 3231, an end part of one of any two adjacent bent parts 3231 is disposed in an opening of the other, end parts of any two adjacent bent parts 3231 are connected by the connecting part 3232, and creep resistance is further improved by providing the bent parts 3231 and the connecting part 3232.
For example, as shown in fig. 8, there are two subspaces, the two subspaces are arranged in a staggered manner, there are two bending portions 3231, the two bending portions 3231 are adjacent to each other left and right, the opening of the subspace formed by the left bending portion 3231 faces rearward, the opening of the subspace formed by the right bending portion 3231 faces forward, the right end of the left bending portion 3231 is located at the opening of the right subspace, the left end of the right bending portion 3231 is located at the opening of the left subspace, a connecting portion 3232 is located between the right end of the left bending portion 3231 and the left end of the right bending portion 3231, the left end of the connecting portion 3232 is connected to the left end of the right bending portion 3231, and the right end of the connecting portion 3232 is connected to the right end of the left bending portion 3231, so that the main body portion 323 can sufficiently absorb stress while avoiding a situation of creep due to stress concentration. The bending portion 3231 may be arc-shaped, or more semicircular, or may be other bending shapes to avoid stress concentration, which is not described herein again. Of course, there may be more subspaces, for example, three, four or more subspaces, which are not described herein.
As shown in fig. 1 to 10, in some embodiments, the thin film member is configured as a beam 311 or a thin film 312, and the effect of the micromechanical thin film structure 100 is fully exerted by configuring the thin film member as the beam 311 or the thin film 312 for structure driving and signal sensing. For example, the thin film element is the beam body 311, it can be understood that the beam body 311 of the MEMS device is thin and small, and can be used as a long thin film element, and the thin film element can be a single double-end clamped beam, as shown in fig. 1 to 4, or can be a double-end clamped beam, three double-end clamped beams, and more double-end clamped beams, and of course, the thin film element can also be a single-end clamped beam, which is not described herein again. Alternatively, as shown in fig. 10, the film member is a film 312, and the film 312 may be a circular film 312 for full effectiveness. The present invention improves the versatility by constructing the membrane as the beam 311 or the membrane 312, which is commonly included in the current MEMS devices such as RF MEMS switching devices, MEMS acoustic devices.
As shown in fig. 8 and 9, specifically, the beam body 311 includes a plurality of split beams 3111, a stress absorbing member 32 is provided between any two adjacent split beams 3111, the stress absorbing member 32 includes a main body 323 and receiving portions 324 provided at both ends of the main body 323, the main body 323 has a absorbing space 321 formed therein, the receiving portions 324 at both ends of the main body 323 are respectively connected to the two adjacent split beams 3111, and by providing the plurality of split beams 3111, the stress absorbing member 32 is provided between the two adjacent split beams 3111, the plurality of stress absorbing members 32 can sufficiently absorb stress, avoid concentration of stress, and uniformize stress on the micromechanical thin-film structure 100.
As shown in fig. 1 and 3, for example, there are two split beams 3111, and a stress absorbing member 32 is disposed between the two split beams 3111, wherein the split beams 3111 may be symmetrically disposed, and the stress absorbing member 32 is disposed in the center, so as to further uniformly distribute stress on the micromechanical thin film structure 100; alternatively, as shown in fig. 2, there are three split beams 3111, and a stress absorbing member 32 is disposed between two adjacent split beams 3111, wherein the two stress absorbing members 32 may be symmetrical with respect to the spatial center of the split beam 3111, so as to further release the stress on the micromechanical thin-film structure 100. Of course, there may be more split beams 3111, which will not be described herein.
More specifically, at least one of the head and the tail of the split beams 3111 is connected to the anchor point seat 20, and the elastic film assembly 30 is supported by connecting at least one of the head and the tail of the split beams 3111 to the anchor point seat 20, so as to ensure stability. For example, there are three split beams 3111, the head and tail ends of the split beam 3111 are respectively left and right ends, the split beam 3111 at the left end may be connected to the anchor point seat 20 to form a single-end clamped beam, the split beam 3111 at the right end may be connected to the anchor point seat 20 to form a single-end clamped beam, or the split beams 3111 at the left and right ends may be connected to the anchor point seat 20 to form a double-end clamped beam. Of course, the number of the split beams 3111 may be two, four, five or more, which are the same and will not be described herein.
As shown in fig. 4, further, the micromechanical thin film structure 100 further includes a mass block 40, the mass block 40 is disposed on the thin film member, and noise is reduced by disposing the mass block 40, so as to avoid interference and improve accuracy. For example, three split beams 3111 are provided, the three split beams 3111 are provided at left, middle and right, and the mass block 40 is provided on the split beam 3111 at the middle.
As shown in fig. 10, in some embodiments, a plurality of stress absorbing members 32 are disposed in the circumferential direction of the film 312, each stress absorbing member 32 includes a main body 323 and receiving portions 324 disposed at two ends of the main body 323, the main body 323 forms an absorbing space 321, the receiving portion 324 at one end of the main body 323 is connected to the anchor seat 20, and the receiving portion 324 at the other end is connected to the film 312, so that the stress is sufficiently absorbed by the plurality of stress absorbing members 32 disposed in the circumferential direction of the film 312, thereby preventing the stress from concentrating on the film 312 and causing creep.
As shown in fig. 10, the anchor seat 20 is shaped like a frame, and the thin film 312 is disposed at the center of the frame-shaped anchor seat 20, so that the stress on the thin film 312 can be sufficiently transmitted to the anchor seat 20, and the thin film 312 is prevented from creeping.
In some embodiments, elastic membrane assembly 30 uses creep-resistant materials, such as Ni-based and/or cobalt (Co) -based superalloys, Ni-W alloys, Ni-Mn alloys, gold containing small amounts of Ni and/or Co, W, intermetallics, materials that undergo solid-state solution and/or sub-phase strengthening, and materials having a crystalline structure that inhibits plastic deformation, such as hexagonal structures or materials having low-layer fault energy. Other binary alloys including any combination of Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Ag, Ta and W are also possible.
One embodiment of a micromechanical thin-film structure 100 according to the present invention is described below with reference to fig. 1 and 5.
A micromechanical thin-film structure 100 comprising: substrate 10, anchor 20, elastic membrane assembly 30, and mass 40.
The material of the substrate 10 is silicon. The anchor seats 20 are arranged on the substrate 10, the number of the anchor seats 20 is two, and the two anchor seats 20 are distributed at intervals from left to right.
Elastic membrane subassembly 30 includes film spare and stress absorption spare 32, and the film spare is roof beam body 311, and roof beam body 311 includes two components of a whole that can function independently roof beams 3111, and two components of a whole that can function independently roof beams 3111 control and distribute, and the anchor point seat 20 of left end is connected to the components of a whole that can function independently roof beam 3111 of left end, and the anchor point seat 20 of right-hand member is connected to the components of a whole that can function independently roof beam 3111 of right-hand member. The stress absorbing member 32 is provided between the two split beams 3111, the stress absorbing member 32 includes a body 323 and receiving portions 324 provided at both ends of the body 323, and the receiving portions 324 at both ends of the body 323 are connected to the two adjacent split beams 3111, respectively. The main body part 323 is rectangular, a hollow part is arranged on the main body part 323, a rectangular closed space is arranged on the hollow part, and a transition round corner 322 is arranged on the circumferential wall of the closed space.
A MEMS device according to an embodiment of the invention comprises the micromechanical thin-film structure 100 described above.
According to the MEMS device provided by the embodiment of the invention, the stress absorption part 32 is arranged to absorb the stress which causes the creep of the film member, so that the concentrated stress on the elastic film assembly 30 is released or homogenized, the creep resistance is improved, and the performance drift of the MEMS device is avoided.
Other configurations and operations of the micromechanical thin-film structure 100 according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein. In the description herein, references to the description of the terms "embodiment," "example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A micromechanical membrane structure of a MEMS device, comprising:
a substrate;
the anchor point seat is arranged on the substrate;
an elastic membrane assembly including a membrane member and a stress absorber provided on the membrane member to absorb stress inducing creep of the membrane member, one of the membrane member and the stress absorber being provided on the anchor point seat.
2. The micromechanical membrane structure of a MEMS device according to claim 1, wherein said stress absorbing member has an absorbing space, a circumferential wall of said absorbing space is provided with a rounded transition corner, said membrane member is capable of transmitting force to said stress absorbing member to induce said absorbing space of said stress absorbing member to deform to absorb said stress.
3. Micromechanical membrane structure of a MEMS device according to claim 2, characterized in that the absorption space is a closed space or an open space with an opening.
4. The micromachined thin film structure of a MEMS device of claim 3, wherein the open space comprises one or more subspaces, and when the open space comprises a plurality of the subspaces, the openings of any two adjacent subspaces are oppositely oriented.
5. The micromechanical membrane structure of a MEMS device according to claim 4, characterized in that said stress absorbing member comprises a main body portion on which said sub-spaces are formed, wherein,
when the open space comprises a plurality of subspaces, the main body part comprises a plurality of bending parts and a connecting part, the bending parts are formed in each bending part, the subspaces are formed on each bending part, the end part of one of any two adjacent bending parts is arranged in the opening of the other bending part, and the end parts of any two adjacent bending parts are connected through the connecting part.
6. Micromechanical membrane structure of a MEMS device according to claim 2, characterized in that the membrane member is configured as a beam or membrane.
7. The micromachined film structure of the MEMS device as defined by claim 6, wherein the beam body includes a plurality of split beams, and the stress absorbing member is disposed between any two adjacent split beams, and the stress absorbing member includes a main body portion and receiving portions disposed at two ends of the main body portion, the main body portion has the absorbing space formed thereon, and the receiving portions at two ends of the main body portion are respectively connected to two adjacent split beams.
8. The micromachined membrane structure of a MEMS device of claim 7, wherein at least one of the end-to-end of the plurality of split beams is attached to the anchor mount.
9. The micromachined thin film structure of the MEMS device as claimed in claim 6, wherein a plurality of stress absorbing members are provided in a circumferential direction of the thin film, the stress absorbing members include a main body portion and receiving portions provided at both ends of the main body portion, the main body portion is formed with the absorbing space, the receiving portion at one end of the main body portion is connected to the anchor pad, and the receiving portion at the other end is connected to the thin film.
10. A MEMS device, characterized in that it comprises a micromechanical thin-film structure of a MEMS device according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210061114.1A CN114477069A (en) | 2022-01-19 | 2022-01-19 | Micro-mechanical film structure of MEMS device and MEMS device |
Applications Claiming Priority (1)
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