CN114466551A - Waterproof method for electronic equipment and electronic equipment - Google Patents
Waterproof method for electronic equipment and electronic equipment Download PDFInfo
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- CN114466551A CN114466551A CN202210151289.1A CN202210151289A CN114466551A CN 114466551 A CN114466551 A CN 114466551A CN 202210151289 A CN202210151289 A CN 202210151289A CN 114466551 A CN114466551 A CN 114466551A
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- melt adhesive
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000004831 Hot glue Substances 0.000 claims abstract description 116
- 239000007787 solid Substances 0.000 claims abstract description 116
- 239000003292 glue Substances 0.000 claims abstract description 66
- 239000000853 adhesive Substances 0.000 claims abstract description 53
- 230000001070 adhesive effect Effects 0.000 claims abstract description 53
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000010309 melting process Methods 0.000 claims abstract description 7
- 239000000084 colloidal system Substances 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000004078 waterproofing Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 208000004350 Strabismus Diseases 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The application discloses waterproof method of electronic equipment and electronic equipment, and the waterproof method of the electronic equipment comprises the following steps: fixing the solid hot melt adhesive on the first surface of the middle frame; attaching the display module to the middle frame; heating the solid hot melt adhesive to melt the solid hot melt adhesive, and sealing an area between the adhesive-backed area and the adhesive dispensing area in the melting process; wherein, the gum area is pasted with gum, and the dispensing area is filled with point gum; the dispensing area is arranged on the middle frame and surrounds the back glue area.
Description
Technical Field
The application belongs to the technical field of communication, and particularly relates to a waterproof method of electronic equipment and the electronic equipment.
Background
Along with the popularization of mobile terminals, users of the mobile terminals are more and more, and correspondingly, the waterproof requirements of the users on the mobile terminals are higher and higher.
According to the waterproof scheme of the related art, a glue filling hole is usually formed in a middle frame of the mobile terminal, then the screen cover plate of the mobile terminal is attached to the middle frame through glue dispensing holes, glue is filled into the middle frame through the glue filling hole, a gap between the glue dispensing holes and the back glue is sealed, and therefore sealing between the middle frame and the screen cover plate is achieved.
On one hand, however, the corresponding position of the glue filling hole occupies the width of the back glue, and the waterproof performance of the whole mobile terminal is reduced; on the other hand, the glue filling hole influences the structural strength of the middle frame, and the reliability of the whole mobile terminal is reduced.
Disclosure of Invention
The application aims to provide a waterproof method of electronic equipment and the electronic equipment, so as to solve the technical problem that the waterproof performance of a mobile terminal in the related art is poor.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a waterproof method for an electronic device, where the method includes:
fixing the solid hot melt adhesive on the first surface of the middle frame;
attaching the display module to the middle frame;
heating the solid hot melt adhesive to melt the solid hot melt adhesive, and sealing an area between the adhesive backing area and the adhesive dispensing area in the melting process;
wherein, the gum area is pasted with gum, and the dispensing area is filled with point gum;
the dispensing area is arranged on the middle frame and surrounds the back glue area.
In a second aspect, an embodiment of the present application provides an electronic device, including:
a middle frame;
the display module is attached to the middle frame through a colloid structure;
the colloid structure comprises gum, solid hot melt adhesive and point colloid;
the back glue is pasted on the back glue area of the middle frame; the glue dispensing body is filled in the glue dispensing area of the middle frame; the solid hot melt adhesive is fixed in the area between the back adhesive area and the dispensing area;
wherein, the dispensing area is arranged around the back glue area.
In the embodiment of the application, the solid hot melt adhesive can be fixed on the first surface of the middle frame; then, the display module is attached to the middle frame; and then heating the solid hot melt adhesive to melt the solid hot melt adhesive, and sealing the area between the adhesive-backed area and the adhesive dispensing area in the melting process. Wherein the gum area is adhered with gum, and the dispensing area is filled with point gum; the dispensing area is arranged on the middle frame and surrounds the back glue area. Therefore, the waterproof method does not need to form a glue filling hole on the middle frame, ensures the structural strength of the middle frame, and improves the reliability of the whole electronic equipment; in addition, because the middle frame is not required to be provided with the glue filling hole, the requirement of the width of the back glue is met, and the waterproof performance of the electronic equipment is improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic flowchart of a waterproof method for an electronic device according to an embodiment of the present disclosure;
fig. 2 is a schematic partial structure diagram of a middle frame of an electronic device according to an embodiment of the present application;
fig. 3 is a partial cross-sectional view of a middle frame and a display module of an electronic device according to an embodiment of the present disclosure in a bonded state;
fig. 4 is an exploded view of a middle frame and a display module of an electronic device according to an embodiment of the present disclosure.
Fig. 5 is a schematic view illustrating an assembly process of a middle frame and a display module of the electronic device according to the present application.
Reference numerals:
20-middle frame, 210-colloid structure, 211-solid hot melt adhesive, 212-back adhesive, 213-point colloid, and 220-target element;
30-display module, 31-screen panel and 32-screen cover plate.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/", and generally means that the former and latter related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "vertical," "horizontal," "vertical," "clockwise," "counterclockwise," and the like refer to an orientation or positional relationship based on that shown in the drawings, which is for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The middle frame of the electronic device is generally provided with a back glue area and a dispensing area, wherein the back glue area can be used for adhering back glue, and the dispensing area can be used for dispensing (i.e., a dispensing body is selected for dispensing). Generally, a gap exists between the back glue area and the dispensing area, and a sealing body is needed to seal the gap so as to realize waterproof treatment.
Normally, a glue filling hole is formed between the middle frames to seal a gap between the back glue area and the glue dispensing area, so as to realize waterproof treatment. However, the position corresponding to the glue filling hole occupies the width of the back glue, and the waterproof performance of the whole mobile terminal is reduced; in addition, the glue filling hole can influence the structural strength of the middle frame, and the reliability of the whole mobile terminal is reduced. The embodiment that this application provided need not to set up the encapsulating hole on the center, can be sealed the gap between regional and the point of gum region, has both guaranteed the structural strength of center, has improved electronic equipment's waterproof performance again.
The waterproof method for the electronic device and the electronic device provided by the embodiment of the application are described below with reference to fig. 1 to 5.
Referring to fig. 1, fig. 1 is a flowchart illustrating a waterproof method for an electronic device according to an embodiment of the present invention, and fig. 2 to 4 are schematic structural diagrams illustrating a waterproof process for an electronic device according to an embodiment of the present invention. As shown in fig. 1, a waterproof method for an electronic device provided in an embodiment of the present invention includes:
and 101, fixing the solid hot melt adhesive on the first surface of the middle frame.
The electronic equipment in the embodiment of the application can be a mobile phone, a tablet computer, an intelligent bracelet and the like.
It is to be understood that the middle frame is the middle frame 20 of the electronic device.
In the embodiment of the application, after the solid hot melt adhesive and the middle frame are obtained, the solid hot melt adhesive can be fixed on the first surface of the middle frame.
In the embodiment of the application, the fixing mode between the solid hot melt adhesive and the middle frame can be as follows: adhesive attachment, snap attachment, or other possible attachment means.
In the embodiment of the application, electronic equipment usually includes the sound channel, can fix solid hot melt adhesive in the both sides of sound channel, so, can guarantee that sound is propagated outside electronic equipment by the sound channel.
For example, in the case where a target element (for example, a camera) is provided on the middle frame near the edge of the middle frame, the waterproof performance in the vicinity of the target element is generally weak, and in order to improve the waterproof performance, a solid hot melt adhesive may be fixed to both sides of the target element.
For example, as shown in fig. 2, a target element 220 is disposed on the middle frame in fig. 2, and the target element 220 occupies a part of the adhesive-backed area, so as to reduce the area corresponding to the adhesive-backed area 212 and affect the waterproof effect, and therefore, in fig. 2, two solid hot melt adhesives 211 are respectively disposed on the left side and the right side of the target element to improve the waterproof effect.
And 102, attaching the display module to the middle frame.
It can be understood that the display module is a display module of an electronic device. The display module is attached to the middle frame: and attaching the display module to the first surface of the middle frame.
The second surface (i.e., the surface opposite to the first surface) of the middle frame is used for being attached to a battery cover of the electronic device, that is, the side corresponding to the battery cover is the battery cover side of the electronic device.
Illustratively, as shown in fig. 3, the display module 30 includes a screen panel 31 and a screen cover 32, and a side corresponding to the screen module is a screen side of the electronic device.
And 103, heating the solid hot melt adhesive to melt the solid hot melt adhesive, and sealing an area between the adhesive-backed area and the adhesive dispensing area in the melting process.
Wherein, the gum area is pasted with gum, and the dispensing area is filled with point gum; the dispensing area is arranged on the middle frame and surrounds the back glue area.
It will be appreciated that a solid hot melt adhesive may be secured in the area between the adhesive backed area and the adhesive dispensing area.
In the embodiment of the application, the middle frame close to the position fixed with the solid hot melt adhesive can be heated, or the display module close to the position fixed with the solid hot melt adhesive can be heated.
In the embodiment of the application, the dispensing area is generally located at the edge of the middle frame, and the back glue area is located inside the dispensing area.
Exemplarily, as shown in fig. 2, fig. 2 shows a partial structure diagram of a middle frame, and in fig. 2, the dispensing area is located at an edge of the middle frame (i.e., an upper edge and a left edge of the middle frame in fig. 2); the back glue area is far away from the edge of the middle frame and is positioned on the inner side of the glue dispensing area, namely the glue dispensing area is arranged around the back glue area.
In the embodiment of the present application, the area between the back glue area and the dispensing area is: and a gap between the back adhesive area and the dispensing area.
It will be appreciated that since the dispensing region is disposed around the adhesive-backed region on the center frame, the solid hot melt adhesive can be fixed in the region between the adhesive-backed region and the dispensing region, and thus, the adhesive-backed layer 212, the solid hot melt adhesive 211, and the dispensing body 213 are sequentially disposed in the direction from the center of the center frame toward the edge of the center frame.
Example 1, as shown in fig. 3, fig. 3 is a partial cross-sectional view illustrating a state where the middle frame 20 and the screen module 30 are attached to each other, where the left side in the drawing is a central region close to the middle frame, and the right side is an edge region of the middle frame, and in fig. 3, the back adhesive 212, the solid hot melt adhesive 211, and the adhesive body 213 are disposed from left to right (i.e., the center of the middle frame is disposed in sequence toward the edge direction of the middle frame).
Example 2, in connection with example 1, a back adhesive may be attached to the left side of the solid hot melt adhesive, and a dispenser may be attached to the right side of the solid hot melt adhesive.
According to the waterproof method for the electronic equipment, the solid hot melt adhesive can be fixed on the first surface of the middle frame; then, the display module is attached to the middle frame; and then heating the solid hot melt adhesive to melt the solid hot melt adhesive, and sealing the area between the adhesive-backed area and the adhesive dispensing area in the melting process. Wherein, the gum area is pasted with gum, and the dispensing area is filled with point gum; the dispensing area is arranged on the middle frame and surrounds the back glue area. Therefore, the waterproof method does not need to provide glue filling holes on the middle frame, thereby ensuring the structural strength of the middle frame and improving the overall reliability of the electronic equipment; in addition, because the middle frame is not required to be provided with the glue filling hole, the width of the back glue is ensured, and the waterproof performance of the electronic equipment is improved.
Optionally, in this embodiment of the application, the first surface of the middle frame is provided with a blind hole, and the step 101 includes a step 101 a.
And 101a, fixing the solid hot melt adhesive in the blind holes.
The inner diameter of the exemplary blind hole is adapted to the outer diameter of the solid hot melt adhesive.
Illustratively, the shape of the blind hole may be square, rectangular, circular, or the like.
So, fix solid hot melt adhesive in the blind hole, can play the spacing effect of solid hot melt adhesive, avoided the position of solid hot melt adhesive to take place to squint and influence water-proof effects in the equipment process.
Optionally, in this embodiment of the application, after the step 101, a step 104 is further included.
And 104, pasting the back adhesive on the back adhesive area, and pasting the local part of the back adhesive on the first area of the solid hot melt adhesive.
Wherein the first region is: and the solid hot melt adhesive is close to the area on one side of the adhesive-backed area.
It can be understood that one part of the back adhesive is pasted on the middle frame, and the other part of the back adhesive is pasted on the first area of the solid hot melt adhesive, so that the solid hot melt adhesive is better fixed on the middle frame.
It is to be understood that the solid hot melt adhesive includes oppositely disposed first and second ends. The first end is the end far away from the display module and is fixed on the first surface of the middle frame; the second end is close to one end of the display module.
Illustratively, the first region is a partial region of the region corresponding to the second end, and the area of the first region may be 20% to 50% of the area of the region corresponding to the second end.
Illustratively, the first region may be flush with the adhesive backed region.
Example 3, in conjunction with example 2, and with reference to fig. 3, the left side of the adhesive backed 212 is affixed to the center frame and the right side is affixed with a first region of solid hot melt adhesive.
So, paste through the local of gum and cover the first region at solid hot melt adhesive for the gum overlaps with the local of solid hot melt adhesive, can be better fix the solid hot melt adhesive on the center, and after the solid hot melt adhesive melts, there is the overlap region between solid hot melt adhesive and the gum, has improved waterproof performance.
Optionally, in this embodiment of the application, after the step 101 and before the step 102, a step 105 is further included.
And 105, carrying out dispensing treatment on the dispensing area of the middle frame.
For example, the dispensing process may be performed directly in the dispensing area by using a dispensing body.
Exemplarily, referring to fig. 3, the dispensing body is located on the right side of the solid hot melt adhesive, and a part of the dispensing body covers the second end of the solid hot melt adhesive, so that the part of the dispensing body overlaps with the part of the solid hot melt adhesive, and the waterproof effect is further improved.
Need to be explained. Step 105 may be performed after step 104, before step 104, or in other possible orders, which is not limited in this embodiment of the present application.
Optionally, in this embodiment of the present application, the solid hot melt adhesive includes a second area, where the second area is: and the height of the second area is greater than that of the first area along the first direction in the area where the solid hot melt adhesive with the back adhesive is not pasted.
Wherein the first direction is: and the direction from the middle frame to the display module.
Generally, the gum region in the center is not at the same level with the glue dispensing region, that is, there is a coverage difference between the gum region and the glue dispensing region, and therefore, along the first direction, the height of the second region of the solid hot melt adhesive is greater than the height of the first region of the solid hot melt adhesive, so that the solid hot melt adhesive can be ensured to realize a good seal for the region between the glue dispensing and the gum, thereby improving the waterproof effect.
Illustratively, referring to fig. 3, the first direction is a bottom-up direction.
It will be appreciated that the second region is: the partial region of the region corresponding to the second end.
That is, the region corresponding to the second end is composed of the first region and the second region.
For example, the second region may be flush with the dispensing region.
Illustratively, with reference to FIG. 3, a second zone of solid hot melt adhesive 211 is located on the right side and a first zone is located on the left side, the second zone having a greater height than the first zone.
Optionally, in this embodiment of the application, a melting point of the solid hot melt adhesive is lower than a melting point of the point colloid corresponding to the dispensing.
Usually, when chooseing for use solid hot melt adhesive and some colloid, for the melting point of some colloid, solid hot melt adhesive can adopt lower melting point, so, when heating solid hot melt adhesive, can guarantee that solid hot melt adhesive is heated and melts to realize gluing the gum and gluing between sealed, can avoid the point to glue again and receive the hot melt, thereby, guaranteed water-proof effects.
As shown in fig. 3 and 4, schematic structural diagrams of electronic devices provided in embodiments of the present application are shown.
Referring to fig. 3 and 4, in an embodiment of the present application, the electronic device includes: center and display module assembly. The display module is attached to the middle frame through the colloid structure.
The colloid structure comprises gum, solid hot melt adhesive and point colloid;
the back glue is pasted on the back glue area of the middle frame; the glue dispensing body is filled in the glue dispensing area of the middle frame; the solid hot melt adhesive is fixed in the area between the back adhesive area and the dispensing area;
wherein, the dispensing area is arranged around the back glue area.
It is understood that the dispensing body is a selected body for dispensing.
Illustratively, the back adhesive may be a double-sided adhesive tape.
It can be understood that the solid hot melt adhesive is fixed on the first surface of the middle frame, and the first surface can be: the middle frame is close to (or faces) one surface of the display module.
Exemplarily, as shown in fig. 4, the upper surface of the middle frame is a first surface of the middle frame.
It will be appreciated that the dispensing body is disposed around the backing adhesive with the solid hot melt adhesive being disposed between the dispensing body and the backing adhesive.
For example, referring to fig. 3, fig. 3 is a partial cross-sectional view of a bonding state of the middle frame 20 and the screen module 30, in fig. 3, the back adhesive 212 is disposed on the left side of the solid hot melt adhesive 211, the dispensing body 213 is disposed on the right side of the solid hot melt adhesive 211, the back adhesive 212, the solid hot melt adhesive 211, and the dispensing body 213 form the above-mentioned adhesive structure 210, and the display module 30 can be bonded to the middle frame 20 through the adhesive structure 210.
The electronic equipment comprises a middle frame and a display module, wherein the display module is attached to the middle frame through a colloid structure, and the colloid structure comprises gum, a solid hot melt adhesive and point colloid; the back glue is pasted on the back glue area of the middle frame; the glue dispensing body is filled in the glue dispensing area of the middle frame; the solid hot melt adhesive is fixed in the area between the back adhesive area and the dispensing area; wherein, the dispensing area is arranged around the back glue area. Therefore, the electronic equipment does not need to be provided with the glue filling hole on the middle frame, the structural strength of the middle frame is ensured, and the reliability of the whole electronic equipment is improved; in addition, because the middle frame is not required to be provided with the glue filling hole, the requirement of the width of the back glue is met, and the waterproof performance of the electronic equipment is improved.
Optionally, in this embodiment of the application, the first surface of the middle frame is provided with a blind hole, and an opening of the blind hole faces the display module; the solid hot melt adhesive is fixed in the blind holes.
Illustratively, the arrangement of the blind holes includes, but is not limited to, the following structural forms: the blind holes can be arranged on two sides of the sound outlet channel; alternatively, the blind holes may be provided on both sides of the target element; alternatively, the blind holes may be evenly arranged along a circumference of the middle frame. The waterproof device can be specifically set according to the waterproof requirement of the electronic equipment, and the embodiment of the application does not limit the waterproof device.
Illustratively, a solid hot melt adhesive can be plugged into the blind holes.
Optionally, in this embodiment of the present application, a part of the back adhesive is attached to the first area of the solid hot melt adhesive.
The first region is: the area of one side of the solid hot melt adhesive, which is close to the adhesive-backed area.
It can be understood that one part of the back adhesive is pasted on the back adhesive area of the middle frame, and the other part of the back adhesive is pasted on the first area of the solid hot melt adhesive, so that the solid hot melt adhesive is better fixed on the middle frame.
It is to be understood that the solid hot melt adhesive includes oppositely disposed first and second ends. The first end is the end far away from the display module and is fixed on the first surface of the middle frame; the second end is close to one end of the display module.
Illustratively, the first region is a partial region of the region corresponding to the second end, for example, the area of the first region may be 20% to 50% of the area of the region corresponding to the second end.
Illustratively, the first region may be flush (i.e., at the same level) as the adhesive backed region described above.
Optionally, in this embodiment of the present application, the solid hot melt adhesive includes a second area, where the second area is: an area without a solid hot melt adhesive coated with a back adhesive; the second region has a greater height than the first region along the first direction.
Wherein the first direction is: a direction from the middle frame to the module.
It will be appreciated that the second region is: the partial region of the region corresponding to the second end.
That is, the region corresponding to the second end is composed of the first region and the second region.
Generally, the gum region in the center is not at the same level with the glue dispensing region, that is, there is a coverage difference between the gum region and the glue dispensing region, and therefore, along the first direction, the height of the second region of the solid hot melt adhesive is greater than the height of the first region of the solid hot melt adhesive, so that the solid hot melt adhesive can be ensured to realize a good seal for the region between the glue dispensing and the gum, thereby improving the waterproof effect.
Exemplarily, if the coverage difference existing between the gum region and the dispensing region is h, the height difference between the second region and the first region is h, so that the display module and the middle frame can be well attached to each other, and the sealing effect of the solid hot melt adhesive on the gap existing between the point-to-point adhesive and the gum can be ensured.
Optionally, in this embodiment of the present application, the melting point of the solid hot melt adhesive is lower than the melting point of the point colloid.
So, when heating solid hot melt adhesive, can guarantee that solid hot melt adhesive is heated and melts to realize gluing the gum and gluing between sealed, can avoid again that the point glue body receives the hot melt, thereby, guaranteed water-proof effects.
Optionally, in an embodiment of the present application, the dispensing area is groove-shaped, and a groove corresponding to the groove-shaped dispensing area includes a first groove edge and a second groove edge.
Wherein, the first recess limit is close to solid hot melt adhesive, and the second recess limit is far away from solid hot melt adhesive.
The second region is flush with the first groove edge.
Illustratively, referring to fig. 3, there is a height difference between the first groove edge and the second groove edge, and the second area is higher than the groove bottom of the groove corresponding to the groove-shaped dispensing area.
Therefore, after the solid hot melt adhesive is melted, the solid hot melt adhesive can well seal a gap between the point colloid and the back adhesive.
Optionally, in the embodiment of the present application, as shown in fig. 5, an assembly flow diagram of a middle frame and a display module of the electronic device of the present application is shown.
Exemplarily, referring to fig. 5, a blind hole is firstly formed on a first surface of a middle frame; then selecting a solid hot melt adhesive; and then fixing the solid hot melt adhesive, namely: filling the solid hot melt adhesive into the blind holes; then, sticking a back adhesive on the back adhesive area of the middle frame, and partially sticking the back adhesive on the first area of the solid hot melt adhesive so as to better fix the solid hot melt adhesive on the middle frame; then the screen module is glued and assembled, namely: dispensing to the dispensing area of the middle frame, and attaching the display module to the middle frame; finally, localized heating, i.e.: and heating the local area fixed with the solid hot melt adhesive to melt the solid hot melt adhesive, and sealing a gap between the adhesive-backed area and the adhesive dispensing area in the melting process.
It is to be noted that the electronic devices in the embodiments of the present application may include mobile electronic devices and non-mobile electronic devices. By way of example, the mobile electronic device may be a mobile terminal device, such as a mobile phone, a tablet computer, a laptop computer, a palmtop computer, a car-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a non-mobile terminal device, such as a server, a Network Attached Storage (NAS), a Personal Computer (PC), and the like, and the embodiments of the present application are not limited in particular.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A method of waterproofing an electronic device, the method comprising:
fixing the solid hot melt adhesive on the first surface of the middle frame;
attaching a display module to the middle frame;
heating the solid hot melt adhesive to melt the solid hot melt adhesive, and sealing an area between the adhesive-backed area and the adhesive dispensing area in the melting process;
wherein the gum area is adhered with gum, and the dispensing area is filled with point gum;
the dispensing area is arranged on the middle frame and surrounds the back glue area.
2. The method of claim 1, wherein the first face of the middle frame is provided with a blind hole; the solid hot melt adhesive is fixed in the blind hole.
3. The method of claim 1, wherein said securing a solid hot melt adhesive is subsequent to said securing a first side of a center frame; the method comprises the following steps:
sticking the back adhesive to the back adhesive area, and sticking the local part of the back adhesive to the first area of the solid hot melt adhesive;
the first region is: and the solid hot melt adhesive is close to the area on one side of the adhesive-backed area.
4. The method of claim 3, wherein said solid hot melt adhesive comprises a second region,
the second area is: the area of the solid hot melt adhesive not covered with the back adhesive is not pasted;
the height of the second area is greater than that of the first area along the first direction;
wherein the first direction is: and the direction from the middle frame to the display module.
5. The method of claim 1, wherein the melting point of said solid hot melt adhesive is lower than the melting point of said point colloid.
6. An electronic device, characterized in that the electronic device comprises:
a middle frame;
the display module is attached to the middle frame through a colloid structure;
the colloid structure comprises a back adhesive, a solid hot melt adhesive and a point colloid;
the back glue is adhered to the back glue area of the middle frame; the dispensing colloid is filled in the dispensing area of the middle frame; the solid hot melt adhesive is fixed in the area between the back adhesive area and the dispensing area;
and the dispensing area is arranged around the back glue area.
7. The electronic device according to claim 6, wherein a first surface of the middle frame is provided with a blind hole, and an opening of the blind hole faces the display module;
the solid hot melt adhesive is fixed in the blind hole.
8. The electronic device of claim 6, wherein a portion of said adhesive backing is applied to a first area of said solid hot melt adhesive;
the first area is: and the solid hot melt adhesive is close to the area on one side of the adhesive-backed area.
9. The electronic device of claim 8, wherein the solid hot melt adhesive comprises a second region,
the second area is: the area of the solid hot melt adhesive not covered with the back adhesive is not pasted;
the height of the second area is larger than that of the first area along the first direction;
wherein the first direction is: and the direction from the middle frame to the display module.
10. The electronic device of claim 6, wherein the melting point of the solid hot melt adhesive is lower than the melting point of the point colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210151289.1A CN114466551A (en) | 2022-02-16 | 2022-02-16 | Waterproof method for electronic equipment and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210151289.1A CN114466551A (en) | 2022-02-16 | 2022-02-16 | Waterproof method for electronic equipment and electronic equipment |
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| Publication Number | Publication Date |
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| CN114466551A true CN114466551A (en) | 2022-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210151289.1A Pending CN114466551A (en) | 2022-02-16 | 2022-02-16 | Waterproof method for electronic equipment and electronic equipment |
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| JPH06151189A (en) * | 1992-11-06 | 1994-05-31 | Matsushita Electric Ind Co Ltd | Flayback transformer and manufacture thereof |
| JP2010048910A (en) * | 2008-08-19 | 2010-03-04 | Canon Inc | Sealing structure and process cartridge |
| CN106293215A (en) * | 2016-08-03 | 2017-01-04 | 深圳市迪瑞特科技有限公司 | Full sticking touch control display screen containing center and preparation method thereof and contactor control device |
| WO2018120418A1 (en) * | 2016-12-27 | 2018-07-05 | 华为技术有限公司 | Mounting structure of display screen, electronic device, and method for mounting display screen |
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