CN114466117A

CN114466117A - Camera module, electronic equipment and electronic system

Info

Publication number: CN114466117A
Application number: CN202011355070.0A
Authority: CN
Inventors: 王景南; 周少飞; 邓君; 邵铁垒; 徐伟; 卢旺林
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-11-09
Filing date: 2020-11-26
Publication date: 2022-05-10
Also published as: WO2022095477A1

Abstract

The application provides a module of making a video recording, electronic equipment and electronic system. The camera module comprises an image sensor and a circuit board, a first connecting structure of the image sensor is fixed to a second connecting structure of the circuit board through welding flux in a welding mode, a supporting piece is arranged between the image sensor and the circuit board, the melting point of the supporting piece is higher than that of the welding flux, and the positioning accuracy of the image sensor and the circuit board can be achieved through the supporting piece so as to improve the positioning accuracy of the photosensitive surface of the image sensor and improve the resolution capability of the camera module.

Description

Camera module, electronic equipment and electronic system

Technical Field

The application relates to the technical field of optics, in particular to a camera module, electronic equipment with the camera module and an electronic system.

Background

In recent years, the application of the camera module in the fields of consumer electronics, security, medical treatment and the like is rapidly developed, and the application scene requirements of products are more and more complex. The temperature of the security camera can reach more than 60 ℃ under the condition of sunshine insolation at noon in summer, and can be lower than-30 ℃ at night in winter in the north, and the requirement on the stability of the image resolving power of the camera module under the wide-temperature environment is very strict under the scene of huge temperature difference of the use environment.

Because the intrinsic characteristic of material, each part volume of module of making a video recording along with the temperature variation can change, lead to image sensor (sensor for short) and camera lens relative position to change, influence the module of making a video recording formation of image effect. How to reduce sensor sensitization face roughness change and the module back burnt change of making a video recording under the wide temperature environment is the key that promotes the module wide temperature environment of making a video recording and separates the image ability down.

Disclosure of Invention

The application provides a module design scheme of making a video recording, through the package assembly's between image sensor and the circuit board design, can guarantee the depth of parallelism between the photographic plane of the camera lens of the module of making a video recording and image sensor's the photosurface, can promote the resolution under the wide temperature environment of the module of making a video recording.

First aspect, the application provides a mould like module, including image sensor and circuit board, image sensor with be equipped with between the circuit board and be connected to image sensor's first connection structure, be connected to the second connection structure and the support piece of circuit board, first connection structure with second connection structure welded fastening, support piece's melting point is higher than the melting point of solder, and specifically speaking, the solder can be soldering tin, also can be for other materials that can realize the welding function. The supporting piece is used for supporting between the image sensor and the circuit board so as to improve the positioning accuracy of the light-sensitive surface of the image sensor.

In a possible implementation, the height of the support is uniform, and the height of the support refers to: and the dimension of the image sensor and the circuit board in the direction of a vertical connecting line. The assembly precision of the image sensor is guaranteed by controlling the height of the supporting piece to be consistent. In the process of manufacturing the supporting member, the requirement on the dimensional accuracy of the supporting member in the height direction is high, so that the heights are consistent, wherein the consistency refers to that the heights of any positions of the supporting member are equal, or the height difference is controlled within an allowable tolerance range, and any position of the supporting member can refer to different positions of one supporting member or any position in different supporting members, namely when the number of the supporting members is one, the consistency of the heights of the supporting members refers to that the heights of any positions on the supporting member are the same or the height difference is controlled within an allowable tolerance range; when the number of the supporting members is plural, the uniformity of the heights of the supporting members means that the heights of different supporting members are uniform, and the heights of different positions of a supporting member can also be uniform.

In a possible implementation, at least part of the supports are distributed at the position of at least three edges of the image sensor; alternatively, at least part of the supports are distributed at the positions of at least three corners of the image sensor. The image sensor is generally square, and has four edges and four corners, it is understood that three edges or three corners can define a positioning surface, and the support members are disposed at the positions of the three edges or three corners, so that an accurate positioning surface of the image sensor can be formed by the support members. Specifically, the number of the supporting members may be set to one, two or more at the position of each edge or each corner, which is not limited in the present application.

In one possible implementation, one end of the supporting member contacts the circuit board, and the other end of the supporting member contacts the image sensor. The contact between the support member and the circuit board may be surface contact or point contact, and similarly, the contact between the support member and the image sensor may be surface contact or point contact.

This application is through setting up support piece between image sensor and circuit board, and this support piece's melting point is higher than the melting point of soldering tin, or can understand: support piece's melting point is higher than reflow soldering peak value temperature, ensures among the welding process that support piece can not melt, also can not warp, with image sensor welding to the in-process of circuit board, support piece can not melt, can not warp, and its benefit lies in: the supporting piece can be used for supporting between the image sensor and the circuit board so as to improve the positioning precision of the light-sensitive surface of the image sensor, improve the parallelism between the light-sensitive surface of the image sensor and a lens mounting surface (which can be understood as the surface of the circuit board), ensure the parallelism between the light-sensitive surface of the image sensor and an imaging surface of the lens, and reduce the assembly tolerance of key components of the camera module, so that after the image sensor is mounted, the lens is mounted on the base, after the position of the lens is adjusted, the AA contraposition is not needed before the base is connected with the circuit board, the connection can be directly carried out, and under the condition that the AA contraposition is not needed, no filler is needed between the base and the circuit board, because the function of the filler is generally used for adjusting the position of the base to carry out the AA contraposition, since the accurate positioning of the image sensor is realized by the supporting piece between the image sensor and the circuit board in the application, AA alignment is not required between the base and the circuit board in a glue filling mode. Like this, for the rigid connection of the formula of not filling in glue between base and the circuit board, the module of making a video recording under the condition that ambient temperature changes, the camera lens still can keep good counterpoint, and temperature variation can not cause the influence to the power of resolving a image of the module of making a video recording, can realize the power of resolving a image of the module of making a video recording under wide temperature environment promptly. Because AA counterpoint is more complicated equipment step, its cost is also higher, consequently, this application can also reduce the equipment cost of the module of making a video recording.

In a possible implementation manner, the first connection structure includes a plurality of composite solder balls, at least a portion of the support member is located inside the composite solder balls, the composite solder balls include solder shells wrapped around the support member, the solder shells may be made of solder, the solder shells are a part or all of solder used for soldering and fixing the image sensor and the circuit board, and the composite solder balls are soldered and fixed with the second connection structure through the solder shells. It can be understood that: each composite solder ball comprises the support structure and a solder shell wrapping the periphery of the support structure, and the support structure is at least part of the support piece.

The definition of the composite solder ball in the present application does not mean that all structures in the composite solder ball are spherical, the support structure of the inner layer of the composite solder ball may be spherical, columnar or any other shape, the outer surface of the solder shell on the surface layer of the composite solder ball may also be spherical, of course, the outer surface may also be in other shapes, and the present application does not limit the specific shapes thereof.

In a possible implementation, the support structure (i.e. the support member covered by the solder shell) is spherical or cylindrical.

In a possible implementation manner, the support structure of the composite solder ball (i.e., the support member covered by the solder shell) is a cylindrical body, and the cylindrical body may be a cylinder or a square cylindrical structure or a polygonal cylindrical structure. The support structure is a framework which is symmetrically distributed by taking a central shaft as a center, the central shaft is vertical to the surface of the circuit board, the solder shell is wrapped on the periphery of the support structure, the outer surface of the solder shell is a spherical surface, and the central shaft is superposed with one diameter of the spherical surface.

In a possible implementation manner, the support structure of the composite solder ball (i.e., the support member covered by the solder shell) is also a framework symmetrically distributed with the central axis as the center, the support structure includes a main body and two support legs, the two support legs are connected to one side of the main body, the two support legs are symmetrically arranged on two sides of the central axis (the central axis is perpendicular to the circuit board), and a spacing region is formed between the two support legs, and the spacing region fills part of the solder shell, which is increased in volume, between the two support legs by arranging the two support legs at a spacing, so that the framework can enhance the welding strength between the image sensor and the circuit board, not only at the periphery of the support legs, but also includes the spacing region between the support legs having distributed solder, and after welding, the two support legs have welding spots formed between them, therefore, the welding strength can be improved. The embodiment can still ensure the positioning precision between the image sensor and the circuit board as long as the coplanarity of the ends of the two supporting legs far away from the main body is ensured.

In a possible implementation, the material of the support structure (i.e. the support member covered by the solder shell) is a metal (e.g. copper) or a ceramic or resin material.

The utility model provides a compound solder ball is different from tin ball (also called solder ball) structure commonly used, the tin ball of commonly used does not possess inside bearing structure, the compound solder ball that this application provided prepares ball core (promptly bearing structure) earlier through modes such as chemical synthesis/physical deposition/electroplating process usually, when bearing structure is globular, be called ball core, utilize the screen cloth of certain size of a dimension to screen and ensure bearing structure's diameter uniformity, electroplate preparation outer solder shell again, through technological parameters such as control electroplating time, can accurate management and control tin layer thickness, ensure the size uniformity of compound solder ball. Through the process, the core-shell structure solder ball (namely the composite solder ball) with the diameter tolerance of the ball core less than or equal to 5 mu m can be manufactured.

In a possible implementation manner, all solder balls at the bonding end (i.e., the bottom) of the image sensor are configured into a composite solder ball framework, and the top surface of the circuit board is provided with a second connection structure, where the second connection structure includes a plurality of solder pads, and the plurality of solder pads are arranged in one-to-one correspondence with the plurality of composite solder balls.

In a possible implementation manner, a part of the solder balls at the bonding end of the image sensor are configured as composite solder balls, that is, the bottom of the image sensor includes the composite solder balls and the solder balls, the number of the solder balls is large, the solder balls can be distributed in an array, the composite solder balls are located at the periphery of the solder balls, or the composite solder balls are disposed inside a row or a column of the solder balls near the edge of the image sensor, for example, one or more composite solder balls can also be disposed at four corners of the image sensor. The framework of the composite solder balls with less quantity matched with the solder balls is more favorable for controlling the dimensional tolerance of the supporting structure in the composite solder balls and is easier to master the positioning precision of the photosensitive surface of the image sensor.

In a possible implementation manner, a part of the supporting pieces are distributed on the periphery of the composite solder balls and are abutted between the image sensor and the circuit board. The specific form of the support distributed on the periphery of the composite solder ball can be spherical, columnar or other shapes, and the material of the support can be metal, ceramic or resin material. According to the embodiment, the support pieces distributed on the periphery of the composite solder ball and the support pieces inside the composite solder ball are used for realizing the assembly and positioning of the image sensor together, so that the positioning precision can be ensured more accurately.

In a possible implementation manner, the surface of the circuit board is provided with a groove, the support parts distributed at the periphery of the composite solder balls are sunk into the groove, and the bottom wall of the groove abuts against the support parts. The support pieces distributed on the periphery of the composite solder ball are support columns, and the framework has the advantages that the support columns not only have the function of accurately positioning the image sensor in the welding process, but also can position the image sensor on a circuit board before welding through the matching of the support columns and the grooves, and have the function of pre-positioning, so that other alignment structures do not need to be arranged on the circuit board, and the support columns can serve as the alignment structures.

In a possible implementation manner, bumps are disposed on the surface of the circuit board, and the supporting members distributed on the periphery of the composite solder balls are abutted against the bumps. The supporting pieces distributed on the periphery of the composite solder ball are supporting columns, the sizes of the supporting columns and the bumps can be designed to be small under the structure, the supporting columns and the bumps can be understood as the supporting columns and the bumps together filling the gap between the image sensor and the circuit board, and the size accuracy of the supporting columns and the bumps with small sizes can be easier to grasp, namely, the size accuracy of the supporting columns and the bumps can be improved, and the installation accuracy of the image sensor on the circuit board can be improved.

In a possible implementation manner, the first connection structure includes a plurality of solder balls, the solder balls are soldered and fixed to the pads of the second connection structure, and at least a portion of the supporting members are distributed on the periphery of the solder balls and abut against between the image sensor and the circuit board. The supporting parts distributed on the periphery of the solder balls are used for realizing the supporting and positioning of the image sensor, the supporting parts distributed on the periphery of the image sensor have single function and independent structure, are not combined with the solder balls, and are easier to control the precision of the image sensor in the height direction, so that the precision positioning of the image sensor is easier to grasp from the processing angle.

In a possible implementation manner, the supporting pieces distributed on the periphery of the solder ball are integrally formed on the surface of the image sensor; or the supporting pieces distributed on the periphery of the solder balls are integrally formed on the surface of the circuit board; alternatively, the supporting members distributed on the periphery of the solder balls are elements independent of the image sensor and the circuit board, and are fixed to the circuit board by soldering. The integrated molding method can be understood as that the integrated molding method is directly manufactured on the surface of the substrate through the manufacturing process of the substrate of the image sensor, or is directly manufactured on the surface of the circuit board through the manufacturing process of the circuit board. In other embodiments, the support posts may also be soldered to the circuit board as separate components, such as: the surface of the circuit board is provided with a welding pad, the support pillar welding process is fixedly connected to the welding pad, and the support pillar can be used as a component to be welded on the circuit board in the SMT welding process.

The support piece independent of the solder ball (or the composite solder ball) is arranged, the support piece is arranged at the edge area of the image sensor, and the support piece is used as a structure for accurately positioning the image sensor on a circuit board in the welding process, so that the parallelism of the photosensitive surface of the image sensor can be realized by ensuring the dimensional accuracy of the support column in the height direction.

In one possible embodiment, the circuit board includes a circuit layer and a rigid substrate layer, which are stacked, and the second connection structure is located on a surface of the circuit layer.

In a possible embodiment, the rigid substrate layer is stacked on one side of the circuit layer, and the second connection structure is located on a surface of the circuit layer facing away from the rigid substrate layer.

In a possible implementation manner, the camera module further comprises a lens provided with a base, and the base is in rigid connection with the circuit board in a non-glue filling manner.

In a possible embodiment, the base includes a first contact surface, the circuit board includes a second contact surface, and the first contact surface and the second contact surface are both annular and are butted.

In one possible embodiment, the solder is solder.

In a second aspect, the present application provides an electronic device, including a control circuit and a camera module according to any one of the possible implementation manners of the first aspect, wherein the image sensor is electrically connected to the control circuit through a trace on the circuit board. The electronic equipment can be a security camera, a vehicle-mounted camera, and a consumer electronic product (such as an intelligent screen, a mobile terminal and the like).

In a third aspect, the present application provides an electronic system, including an image transmission unit, a display unit, and an electronic device, where the image transmission unit is configured to transmit image data acquired by the camera module in the electronic device to the display unit.

The image transmission unit may be a wired transmission in the electronic device, or may be a wireless transmission, for example, a 5G transmission method. The display unit may be a display screen in the electronic device, or may be another display device independent of the electronic device. Specifically, the electronic device takes an intelligent screen or a mobile terminal as an example, the display unit is a screen of the electronic device, and image data captured by an imaging device in the electronic device is directly transmitted to the display unit through the image transmission unit. The electronic device is exemplified by a monitoring camera or a vehicle-mounted camera device, the display unit may be a remote terminal device, for example, the monitoring camera may be communicatively connected to a remote computer screen or a mobile terminal (mobile phone), and the vehicle-mounted camera device may be communicatively connected to a vehicle-mounted display screen or a mobile terminal (mobile phone).

Drawings

In order to more clearly describe the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic view of an arrangement of a camera module in a camera when an electronic device provided by the present application is a camera;

fig. 2 is a schematic diagram of an arrangement of a camera module in a mobile terminal when the electronic device provided by the present application is the mobile terminal;

fig. 3 is a schematic view illustrating an arrangement of a camera module in an intelligent screen when the electronic device provided by the present application is the intelligent screen;

fig. 4 is a schematic perspective view of a camera module according to an embodiment of the present application;

FIG. 5 is an exploded perspective view of the camera module shown in FIG. 4;

FIG. 6 is a schematic diagram of one possible implementation of an image sensor in a camera module provided herein;

FIG. 7 is a schematic diagram of another possible implementation of an image sensor in a camera module provided herein;

fig. 8 is a schematic plan exploded view of an image sensor and a circuit board in a camera module according to an embodiment of the present disclosure;

fig. 9A is a schematic structural diagram of an image sensor and a circuit board in a camera module according to an embodiment of the present disclosure;

fig. 9B is a schematic structural diagram of an image sensor and a circuit board in a camera module according to an embodiment of the present disclosure;

fig. 10 is a schematic diagram of composite solder balls of an image sensor in a camera module according to an embodiment of the present disclosure;

fig. 11 is a schematic diagram of a composite solder ball of an image sensor in a camera module according to another embodiment of the present disclosure;

fig. 12 is a schematic view of a composite solder ball of an image sensor in a camera module according to yet another embodiment of the present application;

fig. 13 is a schematic structural diagram between an image sensor and a circuit board in a camera module according to an embodiment of the present disclosure;

FIG. 14 is a schematic plan view of a solder terminal of an image sensor in a camera module according to an embodiment of the present disclosure;

fig. 15 is a schematic partial structural diagram of a camera module according to an embodiment of the present disclosure, between an image sensor and a circuit board;

fig. 16 is a schematic partial structural diagram of a camera module according to an embodiment of the present disclosure, between an image sensor and a circuit board;

fig. 17 is a schematic partial structural diagram of a camera module according to an embodiment of the present disclosure, between an image sensor and a circuit board;

fig. 18 is a schematic partial structural diagram of a camera module according to an embodiment of the present disclosure, between an image sensor and a circuit board;

fig. 19 is an exploded perspective view of a circuit board in a camera module according to an embodiment of the present disclosure;

fig. 20 is an exploded schematic plan view of a camera module according to an embodiment of the present disclosure;

FIG. 21 is a plan view of the camera module of FIG. 20;

FIG. 22 is a diagram of the imaging effect of the camera module test at normal temperature;

FIG. 23 is a diagram of the imaging effect of the camera module test in the high temperature state;

fig. 24 is a schematic diagram of an electronic system provided herein.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

For convenience of understanding, the following first explains and describes the english acronyms and related technical terms referred to in the embodiments of the present application.

Image sensor (sensor): it is a semiconductor device that acts like a film, but converts light signals into charge signals, and the tiny photosensitive substances implanted on the sensors are called pixels (pixels), and the larger the number of pixels contained in a sensor, the higher the resolution of the picture it provides.

The optical axis is a ray passing perpendicularly through the center of the lens. The lens optical axis is a line passing through the center of the lens. When light rays parallel to the optical axis enter the convex lens, the ideal convex lens is that all the light rays converge at a point behind the lens, and the point where all the light rays converge is the focal point.

And the imaging surface is positioned at the image side of all lenses in the zoom lens, and the light rays sequentially pass through all lenses in the zoom lens to form an imaging carrier surface.

The AA (Active Alignment) Alignment means that the relative position of the lens and the image sensor is ensured by precise six-axis (movement and rotation in three directions of x, y and z) focusing.

It should be understood that expressions such as "include" and "may include" that may be used in the present application indicate the presence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In the present application, terms such as "including" and/or "having" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or addition possibility of one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

Further, in this application, the expression "and/or" includes any and all combinations of the associated listed words. For example, the expression "a and/or B" may include a, may include B, or may include both a and B.

The application provides a module of making a video recording is applied to in the electronic equipment, and the module of making a video recording is connected with the control unit electricity in the electronic equipment, and the control unit can be for the control chip on the electronic equipment mainboard, and the module of making a video recording that this application provided can be used in the application scene of difference, and electronic equipment can be for security protection camera, on-vehicle camera, consumer electronics product (for example wisdom screen, mobile terminal etc.). In a possible application scenario, referring to fig. 1, the electronic device is a camera (e.g., a security camera, a surveillance camera), a camera module 1000 and a control circuit 2000 are disposed in the camera, the camera module 1000 is electrically connected to the control circuit 2000, and the control circuit 2000 acquires image data from the camera device and processes the acquired image data. In a possible application scenario, referring to fig. 2, the electronic device is a mobile terminal (e.g., a tablet, a mobile phone, etc.), a camera module 1000 and a control circuit 2000 are disposed in the mobile terminal, the camera module 1000 is electrically connected to the control circuit 2000, and the control circuit 2000 acquires image data from the camera module and processes the acquired image data. In a possible application scenario, referring to fig. 3, the electronic device is an intelligent screen, for example, a screen device for a video conference, a camera module 1000 and a control circuit 2000 are disposed in the intelligent screen, the camera module 1000 is electrically connected to the control circuit 2000, and the control circuit 2000 acquires image data from the camera device and processes the acquired image data.

Referring to fig. 4 and 5, the camera module 1000 provided by the present application includes a circuit board 10, an image sensor 20 mounted on the circuit board 10, a lens 30, and a base 40 for assembling the lens 30 and fixedly connected to the circuit board 10.

Referring to fig. 6 and 7, the image sensor 20 is a chip package structure, the image sensor 20 includes a chip 21 and a substrate 22 carrying the chip 21, and in one embodiment, as shown in fig. 6, the image sensor 20 is an LGA (Land Grid Array) package structure, that is, after the chip 21 is packaged on the top of the substrate 22, pads 23 are formed on the bottom of the substrate 22 by electroplating, and the pads 23 are used to electrically connect with corresponding pads on the circuit board 10, so as to connect the image sensor 20 to the circuit board 10; in another embodiment, as shown in fig. 7, the image sensor 20 is a CSP (Chip Scale Package) Package structure, that is, after the Chip 21 is enclosed on the top of the substrate 22, solder balls 24 are disposed on the bottom of the substrate 22 by ball-bonding, and the solder balls 24 are used to electrically connect with corresponding pads on the circuit board 10 to connect the image sensor 20 to the circuit board 10. The image sensor 20 may be assembled with the circuit board 10 through an SMT (Surface Mounted Technology) soldering process. In the two embodiments, the chip 21 and the substrate 22 in the image sensor 20 may have the same structure, and for the chip 21, the chip 21 has the photosensitive surface 211 therein, and fig. 6 and 7 schematically show the position of the photosensitive surface 211 in the chip 21, which can be understood as follows: the photosensitive surface 211 may be a functional layer inside the chip 21, and the photosensitive surface 21 may also be located on the surface of the chip 21, for example: the photosensitive surface 211 is located on a surface of the chip 21 facing away from the substrate 22 or a surface of the chip 21 facing the substrate 22. In one embodiment, the light sensing surface 211 is planar, and the light sensing surface 211 is parallel to the plane of the substrate 22, which can be understood as follows: the substrate 22 is a flat plate structure, and the photosensitive surface 211 is parallel to the surface of the substrate 22. For the camera module, the center of the light-sensing surface 211 is located on the optical axis of the camera module, that is, the light-sensing surface 211 may be a rotational symmetric structure with the optical axis as the center, and the lens 30 may also be a rotational symmetric structure with the optical axis as the center.

Referring to fig. 8, the image sensor 20 provided by the present application includes a first connection structure S1 (a portion of the structure within a dotted line frame below the substrate 22 in fig. 8 represents the first connection structure S1), the first connection structure S1 may be a pad structure or a pad-like structure, or a solder ball structure or a solder ball-like structure, and the first connection structure S1 may include other types of structures besides pads or solder balls, such as a support pillar structure (not shown in fig. 8) protruding from the surface of the substrate 22. The circuit board 10 is provided with a second connecting structure S2 (the part of the structure within the dashed line frame of the upper surface of the circuit board 10 in fig. 8 represents the second connecting structure S2), the second connecting structure S2 may be a pad or other alternative structure disposed on the surface of the circuit board 10, and it is understood that the second connecting structure S2 may include a structure (not shown in fig. 8) of a supporting pillar protruding from the surface of the circuit board 10 in addition to the pad structure. The second connection structures S1 and the second connection structures S2 may be disposed in a one-to-one correspondence, for example, the first connection structures S1 are solder balls or solder pads distributed in an array, correspondingly, the second connection structures S2 are also distributed in the same array, and the image sensor 20 is connected to the circuit board 10 by soldering and fixing the first connection structures S1 and the second connection structures S2.

By providing a support between the image sensor 20 and the circuit board 10, and the melting point of this support is higher than the melting point of the solder, the solder can be solder or other solderable material, or can be understood as: the melting point of the supporting piece is higher than the peak temperature of reflow soldering, so that the supporting piece cannot be melted and deformed in the soldering process. The height of the support is consistent, and the height of the support refers to: and the dimension of the image sensor and the circuit board in the direction of a vertical connecting line. The assembly precision of the image sensor is guaranteed by controlling the height of the supporting piece to be consistent. In the process of manufacturing the supporting member, the requirement on the dimensional accuracy of the supporting member in the height direction is high, so that the heights are consistent, wherein the consistency refers to that the heights of any positions of the supporting member are equal, or the height difference is controlled within an allowable tolerance range, and any position of the supporting member can refer to different positions of one supporting member or any position in different supporting members, namely when the number of the supporting members is one, the consistency of the heights of the supporting members refers to that the heights of any positions on the supporting member are the same or the height difference is controlled within an allowable tolerance range; when the number of the supporting members is plural, the uniformity of the heights of the supporting members means that the heights of different supporting members are uniform, and the heights of different positions of a supporting member can also be uniform.

In the process of soldering the image sensor 20 to the circuit board 10, the support member does not melt and deform, which is advantageous in that: the supporting member may be used to support the image sensor 20 and the circuit board 10 to improve the positioning accuracy of the photosensitive surface 211 of the image sensor 20, improve the parallelism between the photosensitive surface of the image sensor 20 and the lens mounting surface (which may be understood as the surface of the circuit board 10), ensure the parallelism between the photosensitive surface of the image sensor 20 and the imaging surface of the lens, and reduce the assembly tolerance of the key components of the camera module 1000, so that after the image sensor 20 is mounted, the lens is mounted to the base, after the position of the lens is adjusted, no AA alignment is required before the base 40 and the circuit board 10 are connected, the connection may be direct, and no filler is required between the base 40 and the circuit board 10 under the condition of AA alignment, since the filler is usually used to adjust the position of the base 40 to perform AA alignment, since the present application has already realized the positioning accuracy of the image sensor by the supporting member between the image sensor 20 and the circuit board 10 With accurate positioning, no adhesive is needed between the base 40 and the circuit board 10 for AA alignment. Like this, for the rigid connection of the formula of not filling in glue between base 40 and the circuit board 10, camera module 1000 is under the condition that ambient temperature changes, and camera lens 30 still can keep good counterpoint, and temperature variation can not cause the influence to camera module 1000's resolution power, can realize camera module 1000's resolution power under wide temperature environment promptly. Because AA counterpoint is more complicated assembly step, its cost is also higher, consequently, this application can also reduce the assembly cost of making a video recording module 1000.

Next, the specific structural forms and the connection relations of the supporting member, the first connection structure S1 and the second connection structure S2 are described in detail in four specific embodiments, so as to clearly describe the specific structures of the supporting member in each embodiment.

The first embodiment: the supporting members are disposed in the first connecting structure S1, and the supporting members are integrated with the solder balls in the first connecting structure S1.

Referring to fig. 9A, a first connection structure S1 is disposed on a bottom surface of the image sensor 20, the first connection structure S1 includes a plurality of composite solder balls S11, and each of the composite solder balls S11 includes a support structure S111 and a solder shell S112 covering a periphery of the support structure S111. In the present embodiment, the supporting structure S111 is a support provided in the first connecting structure S1, that is, the melting point of the supporting structure S111 is higher than that of the solder. The composite solder ball S11 in the embodiment is different from a common solder ball (also called solder ball) structure, the common solder ball does not have an internal support structure, the composite solder ball S11 provided by the application is usually prepared into a ball core (namely the support structure S111) in a chemical synthesis/physical deposition/electroplating process and other modes, when the support structure S111 is spherical, the support structure S111 is called the ball core, a screen with a certain size is utilized to screen and ensure the diameter consistency of the support structure S111, then the outer solder shell S112 is prepared by electroplating, the thickness of a tin layer can be accurately controlled by controlling the process parameters such as electroplating time, and the size consistency of the composite solder ball S11 is ensured. Through the process, the core-shell structure solder ball (namely the composite solder ball S11) with the tolerance of the diameter of the ball core less than or equal to 5 mu m can be manufactured. The diameter of a common solder ball is 0.15-0.76 mm, and when the supporting structure S111 is spherical, the diameter can be controlled to be 0.08-0.7 mm.

In this embodiment, all the solder balls at the bonding end (i.e., the bottom) of the image sensor 20 are configured as a composite solder ball S11, the top surface of the circuit board 10 is provided with a second connection structure S2, the second connection structure S2 includes a plurality of solder pads S21, the plurality of solder pads S21 and the plurality of composite solder balls S11 are disposed in a one-to-one correspondence, the solder pads S21 may be partially embedded inside the circuit board 10, and the surface or part of the solder pads S21 is exposed for soldering the composite solder balls S11. In other embodiments, the pad S21 may be disposed on the surface of the circuit board 10 in a protruding manner.

Referring to fig. 9B, in another embodiment, a part of the solder balls at the bonding end of the image sensor 20 are disposed as a composite solder ball S11, that is, the bottom of the image sensor 20 includes a composite solder ball S11 and solder balls S13, the number of the solder balls S13 is greater, and the solder balls S13 may be distributed in an array, the composite solder ball S11 is located at the periphery of the solder ball S13, or the composite solder ball S11 is disposed inside a row or a column of the solder balls S13 near the edge of the image sensor 20, for example, one or more composite solder balls S13 may also be disposed at four corners of the image sensor 20. The composite solder balls S11 with a smaller number cooperate with the solder ball S13 to control the dimensional tolerance of the support structure S111 in the composite solder ball S11, so that the positioning accuracy of the light-sensing surface of the image sensor 20 can be easily obtained.

The image sensor 20 is soldered to the circuit board 10 by an SMT process, during the soldering process, the solder shell S112 is melted (in an embodiment, the solder shell S112 and the solder ball S13 are melted), part of metal atoms (e.g., copper atoms) on the surface of the pad S21 is dissolved in the melted solder to form an alloy layer, so that a fixed connection between the image sensor 20 and the circuit board 10 can be achieved, the support structure S111 does not melt because the melting point of the support structure S111 is higher than that of the solder, and pressure is applied (also by gravity of an assembly device) to press the sensor 20 onto the circuit board, so that the solder shell S112 and the pad S21 in a molten state are pressed around the support structure S111, and the support structure S111 and the image sensor 20 and the support structure S111 and the pad S21 on the circuit board 10 are pressed, so that only a small portion of solder or no solder can remain. The supporting structure S111 is supported between the image sensor 20 and the circuit board 10, so that the positioning accuracy of the light-sensing surface of the image sensor 20 can be improved, i.e. the light-sensing surface and the surface of the circuit board 10 can maintain a good parallelism. It can be understood that, by controlling the dimensional accuracy of the supporting structure S111, after the image sensor 20 and the circuit board 10 are fixedly connected, the supporting structure S111 becomes a spacer between the image sensor 20 and the circuit board 10, that is, one end of the supporting structure S111 abuts against the image sensor 20, and the other end abuts against the circuit board 10. In this way, the distance between the circuit board 10 and the image sensor 20 is not affected by the melting of the solder, i.e., the positioning accuracy of the image sensor 20 is not affected between the support structure S111 and the image sensor 20 and between the support structure S111 and the circuit board 10 due to the small amount of solder.

The conventional process of soldering the image sensor to the circuit board is soldering using a commonly used solder ball (e.g., the structure of solder ball S13 in fig. 9B), and for the image sensor soldered by the conventional process, whether the image sensor has a tilt or not is mainly influenced by the following factors: the difference of tin amount of each welding point (namely the position of the tin ball), the collapse of the molten tin during the welding process (determined by the surface tension of the tin and the weight of a chip), and the collapse and the inclination of the tin caused by the vibration and the vibration of a chain during the welding process (the reflow welding process is that the circuit board is conveyed on the chain and heated and welded by a reflow furnace). These factors are factors that cannot be accurately controlled in the reflow soldering process. Therefore, the image sensor welded by the conventional process is inevitably inclined, and the parallelism of the photosensitive surfaces of the image sensor cannot be accurately controlled. The problem of the slope that conventional technology soldering tin difference of height leads to has been solved in this application, realizes this difference in height's management and control through bearing structure's height/diameter size preparation precision.

Referring to fig. 10, in one embodiment, the supporting structure S111 of the composite solder ball S11 is spherical, the outer surface of the solder shell S112 is also spherical, and the solder shell is uniformly wrapped outside the supporting structure S111, which is also manufactured, and the structure in which the solder shells S112 are uniformly distributed is beneficial to uniformly distributing the melted solder shells on two sides of the supporting structure S111 during the soldering process, so that the soldering is firmer. The support structure S111 in the embodiment shown in fig. 10 is spherical, it is understood that the support structure S111 may be oval spherical, or a spherical structure with a cut-away portion left, etc.

Referring to fig. 11, in one embodiment, the supporting structure S111 of the composite solder ball S11 is a column, which may be a cylinder, a square column, or a polygonal column. The supporting structure S111 is a structure symmetrically distributed around a central axis a1, the central axis a1 is perpendicular to the circuit board, the solder shell S122 is wrapped around the supporting structure S111, the outer surface of the solder shell S112 is a spherical surface, and the central axis a1 coincides with a diameter of the spherical surface, which can be understood that the solder shell S112 is also symmetrically distributed around the central axis a1, which is also beneficial to uniformly distributing the melted solder shell on two sides of the supporting structure S111 during the soldering process, so that the soldering is firmer.

Referring to fig. 12, in an embodiment, the support structure of the composite solder ball S11 is also a structure symmetrically distributed around a central axis a1, the support structure S111 includes a main body S1111 and two support legs S1112, the two support legs S1112 are connected to one side of the main body S1111, the two support legs S1112 are symmetrically disposed on two sides of the central axis a1, and a space is formed between the two support legs S1112, and the space is filled in a part of the solder shell, in this embodiment, the part of the solder shell is filled between the two support legs S1112 by disposing the two support legs S1112 disposed at a distance, that is, the volume of the solder shell is increased, such a structure can enhance the soldering strength between the image sensor 20 and the circuit board 20, not only at the periphery of the support legs S1112, but also includes solder distributed in the space between the support legs S1112, after soldering, solder joints are formed between the periphery of the support legs S1112 and the two support legs S1112, therefore, the welding strength can be improved. In this embodiment, as long as the ends of the two supporting legs S1112 far from the main body are coplanar, the positioning accuracy between the image sensor 20 and the circuit board 10 can still be ensured.

Fig. 10 to 12 only schematically illustrate the structure of the composite solder ball in three forms, in other embodiments, the composite solder ball may also be a non-centrosymmetric structure, and the support structure therein may also be in other forms, such as a truncated cone, a tooth, and the like, and the present application is not limited thereto.

The material of the support structure is metal (such as copper), ceramic or resin material, and the material of the support structure can be selected as long as the melting point of the support structure is higher than that of the soldering tin.

Second embodiment: the supporting element may be a structure provided at the periphery of the solder ball for supporting only, and in this embodiment, the supporting element may be a part of the first connection structure S1 or a separate structure independent from the first connection structure S1.

Referring to fig. 13 and 14, in one configuration, the first connection structure S1 includes a supporting pillar S12 and a solder ball S14, the supporting pillar S12 is a supporting member disposed in the first connection structure S1, and the supporting pillar S12 is taken as a part of the first connection structure S1 in this embodiment for convenience of understanding. In other embodiments, the supporting pillar S12 may be used as an independent element outside the first connection structure S1, i.e., the first connection structure S1 includes only the solder ball S14. The supporting pillars S12 are distributed around the solder balls S14, such as solder balls S14 distributed in a circular array as shown in fig. 14, supporting pillars S12 are part of a rectangular structure around the solder balls S14, it can be seen that the supporting pillars S12 are distributed around the solder balls S14, specifically, the solder balls S14 are distributed in an array, the support posts S12 may be disposed at positions between solder balls S14 of adjacent rows or adjacent columns, and the support posts S12 may be disposed at positions corresponding to the spacing between adjacent solder balls S14, in both the row and column directions, on the one hand, this position has a larger free space to facilitate the arrangement of the supporting posts S12, which does not result in an increase in the overall size of the image sensor 20 due to the arrangement of the supporting posts S12, and on the other hand, the supporting posts S12 are distributed in the corresponding areas between the adjacent solder balls S14, so that the supporting posts S12 and the solder balls S14 together form a stable supporting force to support the image sensor 20 on the circuit board 10. The distribution of support posts S12 presented in fig. 14 is only an example, and in other embodiments of the present application, the number of support posts S12 may be less than the number of support posts S12 in the example shown in fig. 14, for example: the supporting posts S12 are only required to be disposed at four corners of the bottom surface of the image sensor 20, for example, one supporting post S12 is disposed at each corner, so that the number of the supporting posts S12 is only 4 to realize the supporting and positioning between the image sensor 20 and the circuit board 10. Of course, the number of the supporting posts S12 may be three or more, and may be distributed in the edge area of the image sensor 20.

The solder ball S14 in this embodiment may be the composite solder ball described in the first embodiment, that is, a part of the support members may be independent from the solder ball, and the support members are distributed around the periphery of the solder ball to form the support posts S12 in this embodiment; the support member may also have a portion integrated with the solder ball, i.e., formed as a support structure within the composite solder ball. The solder ball in the present embodiment may have a general solder ball structure, that is, a solder ball structure made of a simple solder material.

In the embodiment shown in fig. 13 and 14, the supporting post S12 may be a protruding columnar structure formed on the surface of the substrate of the image sensor 20, and the supporting post S12 may be made of a metal, such as a copper post, or another material, such as a ceramic or resin structure similar to the plate material of the substrate. The supporting column S12 may have a cylindrical shape, a square column shape, a polygonal column shape, or the like. The supporting posts S12 may directly abut against the surface of the circuit board 10, and the surface of the circuit board 10 may be planar (as in the embodiment shown in fig. 13).

In another embodiment, referring to fig. 15, a groove 11 may be formed on the surface of the circuit board 10, the end of the supporting post S12 is sunk into the groove 11, and the supporting post S12 abuts against the bottom wall of the groove 11, which is advantageous in that the supporting post S12 not only has the function of accurately positioning the image sensor 20 during the soldering process, but also can realize the positioning of the image sensor 20 on the circuit board 10 before the soldering process through the matching of the supporting post S12 and the groove 11, and has the function of pre-positioning, so that there is no need to provide another alignment structure on the circuit board 10, and the supporting post S12 can serve as the alignment structure. In the embodiment shown in fig. 15, the first connection structure S1 includes the support pillars S12 and the composite solder balls S11, and the specific structure of the composite solder balls S11 is similar to that of the composite solder balls S11 in the first embodiment.

In other embodiments, referring to fig. 16, the supporting posts S12 may also abut against bumps (or pad structures) 12 protruding from the surface of the circuit board 10. With such a configuration, the sizes of the supporting post S12 and the bump 12 can be designed to be smaller, which can be understood as that the supporting post S12 and the bump 12 with smaller sizes can fill the gap between the image sensor 20 and the circuit board 10 together, and the size accuracy of the supporting post S12 and the bump 12 with smaller sizes can be easier to grasp, that is, the size accuracy of the supporting post S12 and the bump 12 can be improved in this embodiment, and the mounting accuracy of the image sensor 20 on the circuit board 10 can be improved. On the basis of this embodiment, an alignment structure may be disposed on the matching surface of the supporting pillar S12 and the bump 12, for example, a protrusion is disposed on the surface of the supporting pillar S12 contacting the bump 12, a groove is disposed on the surface of the bump 12 contacting the supporting pillar S12, and alignment is achieved by the cooperation of the protrusion and the groove. In the embodiment shown in fig. 16, the first connection structure S1 includes the support pillars S12 and the composite solder balls S11, and the specific structure of the composite solder balls S11 is similar to that of the composite solder balls S11 in the first embodiment.

The third embodiment: the support is disposed at one side of the circuit board, it is understood that the support is disposed in the second connection structure S2, and the support may be regarded as a partial element independent from the second connection structure, or may be regarded as a structure in the second connection structure, and for convenience of description, the support is explained as a form of a support column in the second connection structure.

Referring to fig. 17, the second connection structure S2 includes a pad S21 and a support post S22, which can be understood as follows: the supporting post S22 is a supporting member disposed in the second connecting structure S2. The number of the pads S21 is plural, the pads S21 are disposed in one-to-one correspondence with the solder balls S13 in the first connection structure S1, and the solder balls S13 in the first connection structure S1 have the same structure as the solder balls S13 in the embodiment shown in fig. 9B, and are conventional solder balls. The supporting pillars S22 are located at the periphery of the solder balls S11. The positional relationship between the supporting beams S22 and the pads S21 can refer to the relationship between the solder balls S11 and the supporting beams S12 on the image sensor 20 shown in fig. 14, and will not be described in detail. The supporting pillars S22 are formed on the surface of the circuit board 10, and can be regarded as an integrated structure with the circuit board 10, the top surface of the supporting pillar S22 abuts against the image sensor 20, and the supporting pillar S22 surrounds the first connecting structure S1, i.e., the supporting pillars S22 are spaced around the periphery of the first connecting structure S1.

In this embodiment, the supporting pillar S22 and the circuit board 10 can be directly fabricated on the surface of the circuit board 10 through the fabrication process of the circuit board 10, that is, the supporting pillar S22 and the circuit board 10 are integrated.

In another embodiment, the support post 22 and the circuit board 10 may be separate structures, such as: the surface of the circuit board 10 is provided with pads to which the support posts 22 are fixedly connected by a soldering process, and the support posts S22 can be soldered as a component on the circuit board 10 in an SMT soldering process. In this embodiment, it can be understood that the support member is independent of the first connection structure S1 and the second connection structure S2, i.e., the support member does not belong to the first connection structure S1 or the second connection structure S2, and the support member can be regarded as a separate element between the image sensor 20 and the circuit board 10.

Fourth embodiment: the support is simultaneously disposed in the first connection structure S1 and the second connection structure S2.

Referring to fig. 18, the first connection structure S1 includes a plurality of composite solder balls S11, the composite solder balls S11 are similar to the composite solder balls in the first embodiment, the composite solder balls S11 include a support structure S111 and a solder shell S112, the solder shell S112 surrounds the support structure S111, and the support structure S111 forms a portion of the support disposed on the first connection structure S1. The melting point of the support structure S111 is higher than the melting point of solder or higher than the reflow soldering peak temperature. The second linking structure S2 in the present embodiment is basically similar in structure to the second linking structure S2 in the third embodiment, and the specific configuration may be the same or different. The second connection structure S2 includes a pad S21 and a plurality of support pillars S22, the support pillars S22 are support members disposed in the second connection structure S2, and the pads S21 are disposed in a one-to-one correspondence with the pads S21 and the solder balls S11 in the first connection structure S1. In this embodiment, the supporting members include the supporting structure S111 in the composite solder ball S11 and the supporting post S22 in the second connecting structure S2, and the two supporting members with supporting and positioning functions jointly perform precise positioning in the process of assembling the image sensor 20 onto the circuit board 10, so that the light-sensing surface of the image sensor 20 and the image plane of the lens of the camera module have better parallelism or coplanarity.

The above four specific embodiments describe several specific setting modes of the supporting member, and the present application may include supporting members with other structural forms and distribution modes, as long as supporting and positioning between the image sensor 20 and the circuit board 10 in the welding process can be achieved to accurately position the image sensor 20, so that the light-sensing surface of the image sensor 20 and the image plane of the lens of the camera module have better parallelism or coplanarity.

The specific shape of the support, whether the shape of the support structure in the composite solder ball or the shape of the support column independent of the solder ball, has a consistent height, which refers to: and the dimension of the image sensor and the circuit board in the direction of a vertical connecting line. The assembly precision of the image sensor is guaranteed by controlling the height of the supporting piece to be consistent. In the process of manufacturing the supporting member, the requirement on the dimensional accuracy of the supporting member in the height direction is high, so that the heights are consistent, wherein the consistency refers to that the heights of any positions of the supporting member are equal, or the height difference is controlled within an allowable tolerance range, and any position of the supporting member can refer to different positions of one supporting member or any position in different supporting members, namely when the number of the supporting members is one, the consistency of the heights of the supporting members refers to that the heights of any positions on the supporting member are the same or the height difference is controlled within an allowable tolerance range; when the number of the supporting members is plural, the uniformity of the heights of the supporting members means that the heights of different supporting members are uniform, and the heights of different positions of a supporting member can also be uniform.

In one embodiment, a support may be provided at the edge of the image sensor, for example: at least part of the supports are distributed at the position of at least three edges of the image sensor; or at least part of the supporting parts are distributed at the positions of at least three corners of the image sensor, so that the supporting parts form the positioning surface of the image sensor, the precision of the height dimension of the supporting parts is ensured, and the precise positioning surface can be formed. The image sensor is generally square, and has four edges and four corners, it is understood that three edges or three corners can define a positioning surface, and the support members are disposed at the positions of the three edges or three corners, so that an accurate positioning surface of the image sensor can be formed by the support members. Specifically, the number of the supporting members may be set to one, two or more at the position of each edge or each corner, which is not limited in the present application.

According to the image sensor, the welding inclination of the image sensor 20 can be reduced, and the soldering tin height difference (or the distance between the image sensor and the circuit board) can be controlled within the range of less than 10um, so that the parallelism between the photosensitive surface in the image sensor 20 and the surface of the circuit board 10 is less than 0.08 degree. This application can realize: after the image sensor 20 is mounted, when the lens is assembled on the circuit board 10, AA alignment is not required, which not only improves the resolution of the camera module 1000, but also saves the manufacturing cost.

On the other hand, the stability of the form of the circuit board 10 is ensured, the rigidity of the circuit board 10 is improved, the high-temperature deformation, the assembly stress deformation and the like of the circuit board 10 can be solved, namely, the circuit board 10 is ensured not to generate the warping deformation in the temperature change or the working process, and the influence on the resolution capability of the camera module 1000 caused by the deformation of the circuit board 10 can be reduced.

Referring to fig. 19, in an embodiment, the circuit board 10 includes a circuit layer 101 and a rigid substrate layer 102, which are stacked, and the second connection structure S2 is located on a surface of the circuit layer 101, fig. 19 only schematically illustrates the second connection structure S2 with a rectangular frame, and does not represent a specific structural form of the second connection structure S2, and a specific structural form of the second connection structure S2 refers to the embodiments shown in fig. 8, 9A and 18. The rigid substrate layer 102 is stacked on one side of the circuit layer 101, and the second connection structure S2 is located on a surface of the circuit layer 101 facing away from the rigid substrate layer 102. The circuit layer 101 can be made of a conventional circuit board high polymer material, the rigidity of the rigid substrate layer 102 is higher than that of the conventional circuit board high polymer material, meanwhile, the flatness of the rigid substrate layer 102 is better than that of the conventional circuit board, and the flatness of the lens mounting surface can be improved by pressing and forming a composite structure. The overall stiffness of the circuit board 10 provided by the present application is improved. The rigid substrate layer 102 may be made of a metal plate, a ceramic substrate, or the like. The circuit structure is arranged in the circuit layer 101, and the electrical connection relationship between the image sensor 20 and other control circuits is realized through the circuit structure in the circuit layer 101, for example, the image data of the image sensor 20 is transmitted to an image processor or a controller in the electronic device through signal traces in the circuit layer 101.

Specifically, the present application may fabricate the circuit layer through a conventional circuit board fabrication process, and the rigid substrate layer 102 is laminated to the surface of the circuit layer 101. When the rigid substrate layer 102 is a metal substrate, the metal substrate can not only improve the rigidity of the circuit board 10, but also has heat dissipation capability, and can be used as a heat conductor to conduct heat generated in the circuit board 10.

In the circuit board provided by the present application, the rigid substrate layer 102 may be disposed on the surface of the circuit layer 101, or may be disposed inside the circuit layer 101, and it can be understood that the circuit layer 101 may be a multi-layer circuit board structure, and the rigid substrate layer 102 is one of the layers. Rigid substrate layer 102 may be a monolithic one-layer structure. The rigid substrate layer 102 may also include at least two daughter boards distributed at different locations on the line layer 101, for example, at least two daughter boards located at different locations on the same layer within the line layer 101, or at least two daughter boards located at different locations on different layers within the line layer 101.

This application can reduce the warp deformation and the deformation under the temperature variation of circuit board 10, and the angularity in the region of welding image sensor 20 is less than 10um on circuit board 10.

Through the setting of the support piece between image sensor 20 and the circuit board 10, combine the setting of the rigid substrate layer 102 of circuit board 10, make the structural stability of the camera module 1000 that this application provided better, make the location between image sensor 20 and the circuit board 10 accurate, like this under the condition on not installing camera lens 30 and base 40 to circuit board 10, can guarantee the depth of parallelism between the photosurface of image sensor 20 and the surface of circuit board 10 earlier, under this condition, because the photosurface has obtained accurate location, when installing the base 40 that will be connected with camera lens 30 to the surface of circuit board 10 again, need not carry out AA counterpoint step to camera lens 30, consequently, this application can promote assembly efficiency, specifically speaking, assembly efficiency can promote 80%.

Conventional module of making a video recording when equipment base to circuit board on, because the position of photosurface can't guarantee its depth of parallelism, must carry out AA counterpoint, have the clearance between base after counterpointing usually and the circuit board, fill this clearance and unable adjustment base through the mode of filling glue, nevertheless under the condition of temperature variation, the volume of glue can produce the change, leads to the mould of making a video recording formation of image unclear.

Because under the framework of this application, need not carry out AA counterpoint to the camera lens before equipment base and circuit board, the base with fixed connection mode between the circuit board is for not filling in formula rigid connection. Referring to fig. 20 and 21, the lens 30 is mounted on the base 40, specifically, before the lens 30 and the base 40 are fixedly connected, the lens 30 needs to be aligned, so that the imaging surface of the lens 30 and the bottom surface of the base 40 keep a good parallelism, that is, the alignment accuracy of the lens 30 can be determined by using the bottom surface of the base 40 as a reference. During the connection process between the base 40 and the circuit board 10, the bottom surface of the base 40 and the surface of the circuit board 10 are also positioned in contact. The alignment reference surfaces of the sample application camera module 1000 in the assembling process are consistent, so that the positioning operation is easy, and the positioning precision is well controlled. The base 40 is fastened to the surface of the circuit board 10, a receiving cavity G is formed between the base 40 and the circuit board 10, and the image sensor 20 is located in the receiving cavity G.

Specifically, the bottom surface of the base 40 includes a first contact surface 401, and the first contact surface 401 is disposed around the receiving cavity G. The top surface of the circuit board 10 includes a second contact surface 104, and the first contact surface 401 and the second contact surface 104 are both annular and are butted. The circuit board 10 and the base 40 are fixedly connected by a fixing member 50 (e.g., a screw, a pin, etc.), specifically, a through hole is provided on the circuit board 10, a threaded hole may be provided on the base 40, and the fixing member 50 passes through the through hole on the circuit board 10 and is locked in the threaded hole on the base 40. The base 40 and the circuit board 10 may also be fixedly connected in other manners, for example, a fastening structure is disposed on the base 40, a fastening hole is disposed on the circuit board 10, and the fastening passes through the fastening hole on the circuit board to fix the circuit board 10 and the circuit board.

As shown in fig. 21, the light-sensing surface 211 of the image sensor 20 is shown as a horizontally extending dotted line, and the image plane 301 of the lens 30 is also shown as a horizontally extending dotted line, so that the image pickup module provided by the present application can realize the coplanarity of the light-sensing surface 211 and the image plane 301 of the lens.

In the camera module 1000 provided by the present application, during the temperature change, the position of the image sensor 20, the position of the lens 30, and the circuit board 10 can all present a stable state, and the position change of the image sensor 20, the warp deformation of the circuit board 10, or the change of the position of the lens 30 due to the temperature change will not occur. The stable structural configuration can certainly ensure the imaging effect and the resolution capability of the camera module 1000. Therefore, the camera module 1000 provided by the present application has a good adaptability to the ambient temperature, and still has a good resolving power under the condition of a large change in the ambient temperature (for example, the temperature of the security camera in the environment of sunshine insolation in summer may reach more than 60 ℃, and the temperature of the security camera in winter in northern China may be lower than-30 ℃).

Referring to fig. 22 and 23, fig. 22 is an image effect diagram of the camera module 1000 tested in a normal temperature (25 degrees celsius) state, fig. 23 is an image effect diagram of the camera module 1000 tested in a high temperature (higher than 65 degrees celsius) state, and it can be seen from fig. 22 and 23 that the camera module provided by the present application has a better resolution capability in both normal temperature and high temperature states.

To sum up, the module of making a video recording that this application provided can promote the wide temperature environment resolving power of the module of making a video recording, promotes the module assembly efficiency of making a video recording simultaneously.

Referring to fig. 24, the electronic device 1 provided in the present application is applied to an electronic system S, which may be an image processing system, in a possible embodiment, the electronic system S includes an electronic device 1, an image transmission unit 2 and a display unit 3, the camera module 1000 in the electronic device 1 is configured to obtain image data, and the image transmission unit 2 is configured to transmit the image data obtained by the camera module 1000 in the electronic device 1 to the display unit 3. The image transmission unit 2 may be a wired transmission in the electronic device 1, or may be a wireless transmission, for example, a 5G transmission system. The display unit 3 may be a display screen in the electronic device 1, or may be another display device independent of the electronic device 1. Specifically, the electronic device 1 is exemplified by a smart screen or a mobile terminal, the display unit 2 is a screen of the electronic device 1, and image data captured by an imaging device in the electronic device 1 is directly transmitted to the display unit 3 through the image transmission unit 2. The electronic device 1 is exemplified by a monitoring camera or a vehicle-mounted camera, the display unit 3 may be a remote terminal device, for example, the monitoring camera may be communicatively connected to a remote computer screen or a mobile terminal (mobile phone), and the vehicle-mounted camera may be communicatively connected to a vehicle-mounted display screen or a mobile terminal (mobile phone).

The camera module and the electronic device provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the embodiment of the present application, and the description of the embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The utility model provides a camera module, its characterized in that, includes image sensor and circuit board, image sensor with be equipped with between the circuit board and be connected to image sensor's first connection structure, be connected to the second connection structure and the support piece of circuit board, first connection structure with second connection structure passes through solder welded fastening, support piece's melting point is higher than the melting point of solder, support piece is used for supporting image sensor with in order to promote between the circuit board image sensor's the positioning accuracy of photosurface.

2. The camera module of claim 1, wherein the height of the support member is uniform, and the height of the support member is: and the dimension of the image sensor and the circuit board in the direction of a vertical connecting line.

3. A camera module according to claim 1 or 2, characterized in that at least some of the supports are distributed at the location of at least three edges of the image sensor; alternatively, at least part of the supports are distributed at the positions of at least three corners of the image sensor.

4. The camera module of any of claims 1-3, wherein one end of the support member contacts the circuit board and the other end of the support member contacts the image sensor.

5. The camera module according to any one of claims 1 to 4, wherein the first connecting structure includes a plurality of composite solder balls, at least a portion of the support member is located inside the composite solder balls, the composite solder balls include a solder shell covering the periphery of the support member, and the solder shell is at least a portion of the solder and is used for being soldered and fixed with the second connecting structure.

6. The camera module of claim 5, wherein the support member encapsulated by the solder shell is a support structure, the support structure being spherical.

7. The camera module of claim 5, wherein the support member covered by the solder shell is a support structure, and the support structure is cylindrical and symmetrically distributed with a central axis as a center, and the central axis is perpendicular to the circuit board.

8. The camera module according to claim 5, wherein the support member covered by the solder shell is a support structure, the support structure comprises a main body and two support legs, a spacing region is formed between the two support legs, and a part of the solder shell is in the spacing region.

9. The camera module according to any one of claims 5 to 8, wherein a portion of the support members is distributed around the composite solder balls and abuts between the image sensor and the circuit board.

10. The camera module according to claim 9, wherein the surface of the circuit board is provided with a groove, and the supporting members distributed on the periphery of the composite solder balls are partially sunk into the groove and abut against the bottom wall of the groove.

11. The camera module of claim 9, wherein the surface of the circuit board is provided with bumps, and the supporting members distributed on the periphery of the composite solder balls are abutted against the bumps.

12. The camera module according to any of claims 1-4, wherein the first connecting structure comprises a plurality of solder balls, the solder balls are soldered to the pads of the second connecting structure, and at least a portion of the supporting members are distributed around the solder balls and are supported between the image sensor and the circuit board.

13. The camera module of claim 12, wherein the supporting members distributed around the solder balls are integrally formed on the surface of the image sensor; or the supporting pieces distributed on the periphery of the solder balls are integrally formed on the surface of the circuit board; alternatively, the supporting members distributed on the periphery of the solder balls are elements independent of the image sensor and the circuit board, and are fixed to the circuit board by soldering.

14. The camera module of any of claims 1-13, wherein the circuit board comprises a circuit layer and a rigid substrate layer arranged in a stack, and the second connecting structure is located on a surface of the circuit layer.

15. The camera module of claim 14, wherein the rigid substrate layer is laminated to a side of the circuit layer, and the second connecting structure is located on a surface of the circuit layer facing away from the rigid substrate layer.

16. The camera module according to any one of claims 1-15, further comprising a lens having a base, wherein the base is rigidly connected to the circuit board without a filling adhesive.

17. The camera module of claim 16, wherein the base includes a first contact surface and the circuit board includes a second contact surface, the first and second contact surfaces being annular and abutting.

18. A camera module according to any of claims 1-17, characterized in that the solder is solder.

19. An electronic device comprising a control circuit and the camera module of any of claims 1-18, wherein the image sensor is electrically connected to the control circuit via traces on the circuit board.

20. An electronic system, comprising an image transmission unit, a display unit and the electronic device of claim 19, wherein the image transmission unit is configured to transmit image data acquired by the camera module in the electronic device to the display unit.