CN114464454A - Method for manufacturing electronic component - Google Patents
Method for manufacturing electronic component Download PDFInfo
- Publication number
- CN114464454A CN114464454A CN202111041164.5A CN202111041164A CN114464454A CN 114464454 A CN114464454 A CN 114464454A CN 202111041164 A CN202111041164 A CN 202111041164A CN 114464454 A CN114464454 A CN 114464454A
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- electronic component
- conductive paste
- outer peripheral
- application roller
- peripheral surface
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 230000002093 peripheral effect Effects 0.000 claims abstract description 116
- 239000003985 ceramic capacitor Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 description 37
- 238000000576 coating method Methods 0.000 description 37
- 238000007747 plating Methods 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The invention provides a method for manufacturing an electronic component, which can coat conductive paste on a desired position of an electronic component blank with good precision. A method for manufacturing an electronic component by applying a conductive paste to a part of the surface of an electronic component blank having a rectangular parallelepiped shape, comprising: a step (S2) for sequentially supplying conductive paste of an amount corresponding to one electronic component blank onto the outer peripheral surface of the application roller; and a step (S3) of applying the conductive paste to the surface of the electronic component blank by bringing the surface of the electronic component blank conveyed along the conveyance path into contact with the conductive paste supplied to the outer peripheral surface of the application roller. In the step of applying the conductive paste (S2), the transfer speed of the electronic component blanks along the transfer path and the rotational speed of the application roller are controlled so that the conductive paste is sequentially applied to the surfaces of the plurality of electronic component blanks.
Description
Technical Field
The present invention relates to a method for manufacturing an electronic component in which external electrodes are formed on a surface of an electronic component body.
Background
As a method for manufacturing an electronic component in which external electrodes are formed on a surface of an electronic component blank, such as a multilayer ceramic capacitor, there is known a method in which a conductive paste is applied to the surface of the electronic component blank, then the electronic component blank is baked to form a base electrode layer, and a plating layer is formed thereon to form external electrodes.
As one of the methods for applying the conductive paste to the surface of the electronic component blank, patent document 1 discloses a method in which a rectangular parallelepiped electronic component blank is conveyed toward an application roller to the outer peripheral surface of which the conductive paste is supplied, and the end face of the electronic component blank is brought into contact with the outer peripheral surface of the application roller, thereby applying the conductive paste to the end face.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open publication No. 2019-135752
However, in the method described in patent document 1, the conductive paste is continuously adhered to the outer peripheral surface of the application roller along the rotation direction thereof. Therefore, in the case of manufacturing an electronic component in which the conductive paste is applied only to the end face of the electronic component body and the ground electrode layer is formed only on the end face of the electronic component body, if the conductive paste is applied by the method described in patent document 1, the conductive paste adheres not only to the end face of the electronic component body but also to the side face when the end face of the electronic component body is brought into contact with the outer peripheral surface of the application roller.
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above problems, and an object thereof is to provide a method for manufacturing an electronic component, which can apply a conductive paste to a desired position of an electronic component blank with high accuracy.
Means for solving the problems
The method for manufacturing an electronic component of the present invention is a method for applying a conductive paste to a part of a surface of an electronic component blank having a rectangular parallelepiped shape, the method comprising:
sequentially supplying the conductive paste to an outer peripheral surface of an application roller in an amount corresponding to one of the electronic component green bodies; and
applying the conductive paste to the surface of the electronic component blank by bringing the surface of the electronic component blank conveyed along a conveying path into contact with the conductive paste supplied onto the outer peripheral surface of the application roller,
in the step of applying the conductive paste, the transfer speed of the electronic component green bodies along the transfer path and the rotational speed of the application roller are controlled so that the conductive paste is sequentially applied to the surfaces of the plurality of electronic component green bodies.
Effects of the invention
According to the method for manufacturing an electronic component of the present invention, the conductive paste is applied to the surface of the electronic component green body by sequentially supplying the conductive paste to the outer peripheral surface of the application roller in an amount corresponding to one electronic component green body, and bringing the surface of the electronic component green body conveyed along the conveyance path into contact with the outer peripheral surface of the application roller so that the conductive paste supplied to the outer peripheral surface of the application roller adheres to the surface of the electronic component green body. Therefore, for example, when the conductive paste is applied to the end face of the electronic component body, the conductive paste can be prevented from being applied to the side face of the electronic component body.
Drawings
Fig. 1 is a perspective view schematically showing an external shape of a multilayer ceramic capacitor as an example of an electronic component manufactured by the method for manufacturing an electronic component according to the present invention.
Fig. 2 is a schematic cross-sectional view of the laminated ceramic capacitor shown in fig. 1 taken along line II-II.
Fig. 3 is a schematic cross-sectional view of the laminated ceramic capacitor shown in fig. 1, taken along the line III-III.
Fig. 4 is a flowchart for explaining a method of manufacturing an electronic component in embodiment 1.
Fig. 5 is a side view schematically showing the structure of the coating apparatus 100 in embodiment 1.
Fig. 6 is a plan view showing the shape of the 1 st concave portion provided on the outer peripheral surface of the 1 st feed roller.
Fig. 7 is a side view schematically showing the structure of a coating apparatus in embodiment 2.
Fig. 8 is a flowchart for explaining a method of manufacturing an electronic component according to embodiment 2.
Description of the reference numerals
10: a laminated ceramic capacitor;
11: an electronic component blank;
12: a dielectric layer;
13 a: 1 st internal electrode;
13 b: 2 nd inner electrode;
14 a: 1 st external electrode;
14 b: a 2 nd external electrode;
15 a: the 1 st end face of the electronic component blank;
15 b: the 2 nd end face of the electronic component blank;
100: a coating device;
101 a: the 1 st coating mechanism;
101 b: a 2 nd coating mechanism;
102 a: a 1 st conductive paste tank;
102 b: a 2 nd conductive paste groove;
103 a: 1 st feeding roller;
103 b: a 2 nd supply roller;
104 a: 1 st coating roller;
104 b: a 2 nd coating roller;
105 a: the 1 st scraper;
105 b: a 2 nd scraper;
106: conveying the carrier tape;
120: a conductive paste;
131 a: 1 st recess;
131 b: a 2 nd recess;
141 a: 1 st base electrode layer;
141 b: the 2 nd base electrode layer;
142 a: 1 st intermediate electrode layer;
142 b: a 2 nd intermediate electrode layer;
143 a: 1 st plating layer;
143 b: and 2 nd plating layer.
Detailed Description
The features of the present invention will be specifically described below by showing embodiments of the present invention. In the following description, a two-terminal multilayer ceramic capacitor is taken as an example of an electronic component manufactured by the method for manufacturing an electronic component according to the present invention, but the type of the electronic component is not particularly limited as long as it is an electronic component having external electrodes formed on the surface of an electronic component body, such as a piezoelectric component, a thermistor, and an inductor.
< embodiment 1 >
(Structure of electronic parts)
Fig. 1 is a perspective view schematically showing an external shape of a multilayer ceramic capacitor 10 as an example of an electronic component manufactured by the method for manufacturing an electronic component according to the present invention. Fig. 2 is a schematic cross-sectional view of the multilayer ceramic capacitor 10 shown in fig. 1 cut along line II-II. Fig. 3 is a schematic cross-sectional view of the multilayer ceramic capacitor 10 shown in fig. 1 cut along the line III-III.
As shown in fig. 1 to 3, the multilayer ceramic capacitor 10 is an electronic component having a rectangular parallelepiped shape as a whole, and includes an electronic component body 11 and a pair of external electrodes 14a and 14b, and the electronic component body 11 has a rectangular parallelepiped shape. As shown in fig. 1, the pair of external electrodes 14a and 14b are disposed to face each other.
Here, a direction in which the dielectric layer 12 and the internal electrodes 13a and 13b described later are stacked is defined as a stacking direction T of the multilayer ceramic capacitor 10, a direction in which the pair of external electrodes 14a and 14b face each other is defined as a longitudinal direction L, and a direction perpendicular to both the longitudinal direction L and the stacking direction T is defined as a width direction W. Two of the longitudinal direction L, the stacking direction T, and the width direction W are orthogonal to each other. The stacking direction T may be referred to as a thickness direction.
The electronic component blank 11 has a 1 st end face 15a and a 2 nd end face 15b opposed to each other in the longitudinal direction L, a 1 st main face 16a and a 2 nd main face 16b opposed to each other in the stacking direction T, and a 1 st side face 17a and a 2 nd side face 17b opposed to each other in the width direction W.
The electronic component blank 11 is preferably rounded at the corner and ridge portions. Here, the corner portion is a portion where three surfaces of the electronic component blank 11 intersect, and the ridge portion is a portion where two surfaces of the electronic component blank 11 intersect. The rectangular parallelepiped shape also includes a shape in which at least one of the corner portions and the ridge line portions is rounded.
As shown in fig. 2 and 3, the electronic component blank 11 includes a plurality of dielectric layers 12 and a plurality of internal electrodes 13a and 13b stacked. The internal electrodes 13a, 13b include a 1 st internal electrode 13a and a 2 nd internal electrode 13 b. More specifically, the electronic component blank 11 has a structure in which a plurality of 1 st internal electrodes 13a and 2 nd internal electrodes 13b are alternately stacked with dielectric layers 12 interposed therebetween in the stacking direction T.
The 1 st internal electrode 13a and the 2 nd internal electrode 13b contain, for example, a metal such as Ni, Cu, Ag, Pd, and Au, or an alloy of Ag and Pd. The 1 st internal electrode 13a and the 2 nd internal electrode 13b preferably contain, as a common material, the same ceramic material as the dielectric ceramic contained in the dielectric layer 12.
The 1 st internal electrode 13a is drawn out to the 1 st end face 15a of the electronic component body 11. The 2 nd internal electrode 13b is drawn out to the 2 nd end face 15b of the electronic component body 11.
The 1 st external electrode 14a is formed over the 1 st end surface 15a of the electronic component body 11, and is formed so as to extend from the 1 st end surface 15a to the 1 st main surface 16a, the 2 nd main surface 16b, the 1 st side surface 17a, and the 2 nd side surface 17 b. The 1 st external electrode 14a is electrically connected to the 1 st internal electrode 13a exposed at the 1 st end face 15 a.
The 2 nd external electrode 14b is formed over the entire 2 nd end surface 15b of the electronic component body 11, and is formed so as to extend from the 2 nd end surface 15b to the 1 st main surface 16a, the 2 nd main surface 16b, the 1 st side surface 17a, and the 2 nd side surface 17 b. The 2 nd external electrode 14b is electrically connected to the 2 nd internal electrode 13b exposed at the 2 nd end face 15 b.
The 1 st external electrode 14a includes a 1 st underlying electrode layer 141a, a 1 st intermediate electrode layer 142a, and a 1 st plating layer 143 a. The 2 nd external electrode 14b includes a 2 nd underlying electrode layer 141b, a 2 nd intermediate electrode layer 142b, and a 2 nd plating layer 143 b.
The 1 st underlying electrode layer 141a is provided only on the 1 st end face 15a of the electronic component body 11. Further, the 2 nd underlying electrode layer 141b is provided only on the 2 nd end face 15b of the electronic component body 11. The 1 st underlying electrode layer 141a and the 2 nd underlying electrode layer 141b contain, for example, a metal such as Ni, Cu, Ag, Pd, an Ag-Pd alloy, or Au. The 1 st underlying electrode layer 141a and the 2 nd underlying electrode layer 141b preferably contain, as a common material, the same ceramic material as the dielectric ceramic contained in the dielectric layer 12.
The 1 st intermediate electrode layer 142a is provided so as to cover the 1 st underlying electrode layer 141a and to extend around the 1 st main surface 16a, the 2 nd main surface 16b, the 1 st side surface 17a, and the 2 nd side surface 17 b. The 2 nd intermediate electrode layer 142b is provided so as to cover the 2 nd underlying electrode layer 141b and to go around to the 1 st main surface 16a, the 2 nd main surface 16b, the 1 st side surface 17a, and the 2 nd side surface 17 b. The 1 st intermediate electrode layer 142a and the 2 nd intermediate electrode layer 142b may be resin electrode layers containing conductive particles and a thermosetting resin, for example, or may be layers containing the same material as the 1 st base electrode layer 141a and the 2 nd base electrode layer 141 b.
The 1 st plating layer 143a is provided to cover the 1 st intermediate electrode layer 142 a. Further, a 2 nd plating layer 143b is provided to cover the 2 nd intermediate electrode layer 142 b. The 1 st plating layer 143a and the 2 nd plating layer 143b may be one layer or a plurality of layers. As an example, the 1 st plating layer 143a and the 2 nd plating layer 143b include a Ni plating layer and a Sn plating layer formed on the Ni plating layer, respectively.
In the laminated ceramic capacitor 10 having the above-described structure, the 1 st base electrode layer 141a connected to the 1 st internal electrode 13a is provided only on the 1 st end face 15a of the electronic component body 11, and the 2 nd base electrode layer 141b connected to the 2 nd internal electrode 13b is provided only on the 2 nd end face 15b, so that the size can be reduced at the same capacitance as compared with a laminated ceramic capacitor having a structure in which the base electrode layers are wound around the main faces 16a, 16b and the side faces 17a, 17b of the electronic component body 11. Further, by providing the 1 st underlying electrode layer 141a and the 2 nd underlying electrode layer 141b, the 1 st intermediate electrode layer 142a and the 2 nd intermediate electrode layer 142b can be formed as thin as possible.
(method for manufacturing electronic Components)
Fig. 4 is a flowchart for explaining a method of manufacturing an electronic component in embodiment 1. A method for manufacturing a multilayer ceramic capacitor 10 as an example of an electronic component will be described with reference to fig. 4.
In step S1, the electronic component blank 11 is prepared. The electronic component body 11 can be manufactured by a known method, and the manufacturing method will be briefly described below.
First, a plurality of ceramic green sheets and raw material sheets on the surfaces of which conductive paste for internal electrodes is printed are prepared, a predetermined number of ceramic green sheets are stacked, then a predetermined number of raw material sheets are stacked, and a predetermined number of ceramic green sheets are stacked thereon and pressure bonded to form a mother block. Next, the mother block is cut and singulated to produce a plurality of laminated chips.
Next, the laminated chip is barrel-polished to form round corners and ridge portions, and then fired. Thereby, the dielectric material and the conductive material included in the laminated chip are fired, and the electronic component blank 11 including the plurality of dielectric layers 12 and the plurality of internal electrodes 13a and 13b is formed. The firing temperature may be appropriately set depending on the dielectric material and the conductive material, and is preferably 900 ℃ to 1300 ℃.
Next, external electrodes are formed on a part of the surface of the electronic component blank 11, specifically, on the entire 1 st end face 15a and the 2 nd end face 15b and a part of the 1 st main face 16a, the 2 nd main face 16b, the 1 st side face 17a, and the 2 nd side face 17 b.
Here, before describing the step of forming the external electrodes, the coating apparatus 100 used in forming the external electrodes will be described with reference to fig. 5. Fig. 5 is a side view schematically showing the structure of the coating apparatus 100 in embodiment 1.
As shown in fig. 5, the coating apparatus 100 includes a 1 st coating mechanism 101a and a 2 nd coating mechanism 101b which are located at positions spaced apart from each other. The 1 st coating mechanism 101a is used for coating the 1 st end surface 15a of the electronic component blank 11 with the conductive paste 120, and the 2 nd coating mechanism 101b is used for coating the 2 nd end surface 15b of the electronic component blank 11 with the conductive paste 120. Hereinafter, the configuration of the 1 st coating mechanism 101a will be described, but the configuration of the 2 nd coating mechanism 101b is also the same.
The 1 st coating mechanism 101a includes a 1 st conductive paste tank 102a, a 1 st supply roller 103a, a 1 st coating roller 104a, and a 1 st doctor blade 105 a. The 2 nd coating mechanism 101b includes a 2 nd conductive paste tank 102b, a 2 nd supply roller 103b, a 2 nd coating roller 104b, and a 2 nd doctor blade 105 b.
The 1 st conductive paste tank 102a stores a conductive paste 120. The conductive paste 120 is a conductive paste for forming the 1 st underlying electrode layer 141a of the 1 st external electrode 14a, and includes, for example, metal powder such as Ni, Cu, Ag, Pd, Ag — Pd alloy, or Au, a binder such as an acrylic resin binder, a solvent, glass, and a dispersant for improving dispersion of the metal powder.
The content of the solvent contained in the conductive paste 120 is preferably 30 vol% or more and 90 vol% or less with respect to the entire conductive paste 120. By including the solvent in the conductive paste 120, the gap between molecules increases, and thus the force by which the molecules pull each other can be reduced. By increasing the content of the solvent, the viscosity of the conductive paste 120 can be reduced. As a result, the linear extension of the conductive paste 120 can be suppressed.
The viscosity of the conductive paste 120 is preferably 10Pa · s or more and 90Pa · s or less. The viscosity of the conductive paste 120 is more preferably 20Pa · s or more and 90Pa · s or less. When the viscosity of the conductive paste 120 is less than 10Pa · s, it becomes difficult to hold the conductive paste 120 in a fixed shape, and it becomes difficult to apply the conductive paste 120 with high accuracy. When the viscosity of the conductive paste 120 is greater than 90Pa · s, there is a possibility that the conductive paste 120 is not discharged from the 1 st concave portion 131a of the 1 st supply roller 103a described later when the electronic component blank 11 is coated with the conductive paste 120.
In the present embodiment, a plurality of 1 st concave portions 131a are provided at predetermined intervals along the rotation direction on the outer circumferential surface of the 1 st supply roller 103 a.
Fig. 6 is a plan view showing the shape of the 1 st recess 131 a. As will be described later, the conductive paste 120 in the 1 st concave portion 131a of the 1 st supply roller 103a is transferred to the outer peripheral surface of the 1 st application roller 104a, and then adheres to the 1 st end surface 15a of the electronic component blank 11. In the present embodiment, as shown in fig. 6, 1 st concave part 131a has a rectangular shape when viewed in a direction perpendicular to bottom surface 1310a of 1 st concave part 131 a. In order to form the 1 st underlying electrode layer 141a only on the 1 st end surface 15a, the size of the 1 st recessed portion 131a when viewed in the direction orthogonal to the bottom surface 1310a of the 1 st recessed portion 131a is set to be equal to or smaller than the size of the 1 st end surface 15a of the electronic component blank 11 which is a region to which the conductive paste 120 is applied. The size of the 1 st recess 131a is equal to or smaller than the size of the 1 st end surface 15a of the electronic component blank 11, which means that the size of the bottom surface 1310a of the 1 st recess 131a is the same as the size of the 1 st end surface 15a of the electronic component blank 11, or as shown in fig. 6, the size of the bottom surface 1310a of the 1 st recess 131a is smaller than the size of the 1 st end surface 15a of the electronic component blank 11.
The depth of the 1 st recess 131a is determined by the thickness of the conductive paste 120 applied to the 1 st end face 15a of the electronic component blank 11. The thickness of the conductive paste 120 applied to the 1 st end face 15a is, for example, 10 μm or more and 100 μm or less.
The 1 st supply roller 103a is partially immersed in the 1 st conductive paste tank 102a, whereby the conductive paste 120 adheres to the outer circumferential surface.
The 1 st doctor blade 105a scrapes off and removes the excess conductive paste 120 adhering to the portion other than the 1 st concave portion 131a in the outer circumferential surface of the 1 st supply roller 103 a. Therefore, when the extra conductive paste 120 is removed by the 1 st blade 105a, the conductive paste 120 is attached only to the 1 st concave portion 131a in the outer peripheral surface of the 1 st supply roller 103 a.
The outer peripheral surface of the 1 st supply roller 103a and the outer peripheral surface of the 1 st application roller 104a are in rolling contact. Specifically, as shown in fig. 5, the 1 st supply roller 103a and the 1 st application roller 104a are rotated in opposite directions to each other, whereby the outer peripheral surfaces are brought into contact with each other. Thereby, the conductive paste 120 in the 1 st concave portion 131a of the 1 st supply roller 103a is transferred to the outer peripheral surface of the 1 st application roller 104 a. In fig. 5, the conductive paste 120 transferred to the outer peripheral surface of the first application roller 104a is illustrated as being blackened in view of improving visibility.
Here, the 1 st application roller 104a includes a columnar main body portion and an elastic body portion covering the outer periphery of the main body portion. The main body portion includes aluminum, but the material of the main body portion is not limited to aluminum, and may be other metals such as iron. The elastomer portion is made of silicone rubber, but the material of the elastomer portion is not limited to silicone rubber, and may be other elastomers having appropriate deformation resistance, such as composite materials such as CFRP (Carbon Fiber Reinforced Plastics).
The conductive paste 120 supplied to the outer peripheral surface of the 1 st application roller 104a is in an amount corresponding to one electronic component blank 11, more specifically, in an amount applied to the 1 st end surface 15a of one electronic component blank 11. The conductive paste 120 supplied to the outer peripheral surface of the first application roller 104a is applied to the 1 st end surface 15a of the electronic component blank 11 by being in contact with the 1 st end surface 15 a.
As described above, the 2 nd coating mechanism 101b has the same configuration as the 1 st coating mechanism 101a, and thus a detailed description thereof is omitted here.
The explanation is continued by returning to the flowchart of fig. 4. In step S2 subsequent to step S1, an amount of conductive paste corresponding to one electronic component blank 11 is sequentially supplied onto the outer circumferential surface of the application roller. In the present embodiment, the step of supplying the conductive paste to the outer circumferential surface of the application roller (step S2) includes: a step of adhering a conductive paste to the outer peripheral surface of the supply roller (step S21); a step (step S22) of removing excess conductive paste adhering to the parts of the supply roller other than the recessed parts; and a step (step S23) of transferring the conductive paste in the recessed portion of the supply roller to the outer peripheral surface of the application roller.
In step S21, a part of the supply roller provided with a plurality of concave portions on the outer peripheral surface is immersed in a conductive paste tank storing a conductive paste, and the conductive paste is attached to the outer peripheral surface of the supply roller. Specifically, a part of the 1 st supply roller 103a provided with the plurality of 1 st concave portions 131a on the outer peripheral surface is immersed in the 1 st conductive paste tank 102a storing the conductive paste 120, and the conductive paste 120 is attached to the outer peripheral surface of the 1 st supply roller 103 a. Further, a part of the 2 nd supply roller 103b provided with a plurality of 2 nd concave portions 131b on the outer peripheral surface is immersed in the 2 nd conductive paste tank 102b storing the conductive paste 120, and the conductive paste 120 is attached to the outer peripheral surface of the 2 nd supply roller 103 b.
In step S22, excess conductive paste adhering to portions other than the recessed portions in the outer peripheral surface of the supply roller is removed. Specifically, the 1 st doctor blade 105a scrapes off and removes the excess conductive paste 120 adhering to the portion other than the 1 st concave portion 131a in the outer peripheral surface of the 1 st supply roller 103 a. In addition, the extra conductive paste 120 adhering to the portion other than the 2 nd concave portion 131b in the outer peripheral surface of the 2 nd supply roller 103b is scraped off and removed by the 2 nd doctor blade 105 b.
In step S23, the outer peripheral surface of the supply roller from which the excess conductive paste has been removed is brought into contact with the outer peripheral surface of the application roller, whereby the conductive paste in the recessed portion of the supply roller is transferred to the outer peripheral surface of the application roller. Specifically, the outer peripheral surface of the 1 st supply roller 103a from which the excess conductive paste 120 is removed is brought into contact with the outer peripheral surface of the 1 st application roller 104a, whereby the conductive paste 120 in the 1 st concave portion 131a of the 1 st supply roller 103a is transferred to the outer peripheral surface of the 1 st application roller 104 a. Further, the outer peripheral surface of the 2 nd supply roller 103b from which the excess conductive paste 120 has been removed is brought into contact with the outer peripheral surface of the 2 nd application roller 104b, whereby the conductive paste 120 in the 2 nd concave portion 131b of the 2 nd supply roller 103b is transferred to the outer peripheral surface of the 2 nd application roller 104 b.
That is, the conductive paste 120 is supplied to the outer circumferential surfaces of the 1 st application roller 104a and the 2 nd application roller 104b in an amount corresponding to one electronic component blank 11. Since the 1 st supply roller 103a is provided with the 1 st recesses 131a along the rotation direction, the conductive paste 120 is intermittently supplied to the outer peripheral surface of the 1 st application roller 104a along the rotation direction in an amount corresponding to one electronic component blank 11 at predetermined intervals. Similarly, the conductive paste 120 is intermittently supplied to the outer peripheral surface of the 2 nd application roller 104b at predetermined intervals along the rotation direction in an amount corresponding to one electronic component blank 11.
In step S3 subsequent to step S2, the surface of the electronic component blank 11 conveyed along the conveyance path is brought into contact with the conductive paste supplied onto the outer peripheral surface of the application roller, thereby applying the conductive paste to the surface of the electronic component blank 11.
Specifically, as shown in fig. 5, the plurality of electronic component blanks 11 are conveyed in sequence so as to pass between the 1 st application roller 104a and the 2 nd application roller 104 b. In the present embodiment, a plurality of electronic component blanks 11 are held by a carrier tape 106 as a conveying member and conveyed in a conveying direction indicated by an arrow 107. The plurality of electronic component blanks 11 are held by the carrier tape 106 in a state where the pair of end faces 15a, 15b are exposed and located on opposite sides of each other in the width direction of the carrier tape 106 orthogonal to the longitudinal direction.
When the electronic component blank 11 passes between the 1 st application roller 104a and the 2 nd application roller 104b, the outer peripheral surface of the 1 st application roller 104a and the outer peripheral surface of the 2 nd application roller 104b are sandwiched therebetween. That is, the 1 st end face 15a of the electronic component blank 11 is pressed in contact with the outer peripheral surface of the 1 st application roller 104a, and the 2 nd end face 15b is pressed in contact with the outer peripheral surface of the 2 nd application roller 104 b. At this time, the timing is controlled so that the 1 st end face 15a of the electronic component blank 11 comes into contact with the conductive paste 120 supplied onto the outer peripheral surface of the 1 st application roller 104a, and the 2 nd end face 15b comes into contact with the conductive paste 120 supplied onto the outer peripheral surface of the 2 nd application roller 104 b.
That is, the conveyance speed of the electronic component element blanks 11 along the conveyance path and the rotation speed of the application roller are controlled so that the conductive paste 120 is sequentially applied to the surfaces of the plurality of electronic component element blanks 11. In the present embodiment, the conveyance speed of the carrier tape 106 and the rotation speeds of the 1 st application roller 104a and the 2 nd application roller 104b are controlled such that the conductive paste 120 supplied to the outer peripheral surface of the 1 st application roller 104a is transferred to the 1 st end surface 15a of the electronic component blank 11, and the conductive paste 120 supplied to the outer peripheral surface of the 2 nd application roller 104b is transferred to the 2 nd end surface 15b of the electronic component blank 11.
In this way, the conductive paste 120 is applied to a part of the surface of the electronic component blank 11, specifically, the 1 st end face 15a and the 2 nd end face 15b of the electronic component blank 11. The conductive paste 120 is preferably applied so as to cover all the 1 st internal electrodes 13a exposed at the 1 st end face 15a and all the 2 nd internal electrodes 13b exposed at the 2 nd end face 15 b. The plurality of electronic component blanks 11 held by the carrier tape 106 are passed between the 1 st application roller 104a and the 2 nd application roller 104b, whereby the conductive paste 120 is sequentially applied to the 1 st end face 15a and the 2 nd end face 15b of the plurality of electronic component blanks 11.
The electronic component blank 11 may be heated before the conductive paste 120 is applied to a part of the surface of the electronic component blank 11. For example, a heater is provided upstream of the coating device 100 in the transport direction of the electronic component green body 11, and the electronic component green body 11 is heated by the heater.
In step S4 subsequent to step S3, the conductive paste 120 applied to the electronic component blank 11 is fired. Thereby, the 1 st underlying electrode layer 141a is formed on the 1 st end surface 15a of the electronic component blank 11, and the 2 nd underlying electrode layer 141b is formed on the 2 nd end surface 15 b.
Then, the 1 st intermediate electrode layer 142a and the 2 nd intermediate electrode layer 142b are formed, and the 1 st plating layer 143a and the 2 nd plating layer 143b are formed.
Through the above steps, the multilayer ceramic capacitor 10 is obtained.
According to the method of manufacturing an electronic component in embodiment 1, the conductive paste 120 is applied to the surface of the electronic component blank 11 by sequentially supplying the conductive paste 120 in an amount corresponding to one electronic component blank 11 to the outer peripheral surfaces of the 1 st application roller 104a and the 2 nd application roller 104b, and bringing the 1 st application roller 104a and the 2 nd application roller 104b into contact with the surface of the electronic component blank 11. That is, when the 1 st application roller 104a is brought into contact with the 1 st end face 15a of the electronic component blank 11, the conductive paste 120 adheres only to the 1 st end face 15a, and can be prevented from spreading to the 1 st main face 16a, the 2 nd main face 16b, the 1 st side face 17a, and the 2 nd side face 17 b. Similarly, when the 2 nd application roller 104b is brought into contact with the 2 nd end face 15b of the electronic component blank 11, the conductive paste 120 adheres only to the 2 nd end face 15b, and can be prevented from being wound around the 1 st main face 16a, the 2 nd main face 16b, the 1 st side face 17a, and the 2 nd side face 17 b.
In the present embodiment, a part of the 1 st supply roller 103a having a plurality of 1 st concave portions 131a on the outer peripheral surface thereof is immersed in the 1 st conductive paste tank 102a in which the conductive paste 120 is stored, so that the conductive paste 120 is attached to the outer peripheral surface of the 1 st supply roller 103a, and then the excess conductive paste 120 attached to the portion other than the 1 st concave portion 131a is removed, and then the outer peripheral surface of the 1 st supply roller 103a is brought into contact with the outer peripheral surface of the 1 st application roller 104a, so that the conductive paste 120 in the 1 st concave portion 131a is transferred to the outer peripheral surface of the 1 st application roller 104 a. The same applies to the transfer of the conductive paste 120 to the 2 nd application roller 104 b. With this method, the conductive paste 120 can be intermittently supplied to the outer peripheral surface of the 1 st application roller 104a and the outer peripheral surface of the 2 nd application roller 104b in an amount corresponding to one electronic component blank 11 with high accuracy.
< embodiment 2 >
Fig. 7 is a side view schematically showing the structure of a coating apparatus 100A in embodiment 2. In the coating apparatus 100 according to embodiment 1, a plurality of 1 st recesses 131a are provided on the outer peripheral surface of the 1 st supply roller 103a, and a plurality of 2 nd recesses 131b are provided on the outer peripheral surface of the 2 nd supply roller 103 b.
In contrast, in the coating apparatus 100A according to embodiment 2, a plurality of 1 st concave portions 131a are provided on the outer peripheral surface of the 1 st coating roller 104a, and a plurality of 2 nd concave portions 131b are provided on the outer peripheral surface of the 2 nd coating roller 104 b. Further, no concave portion is provided on the outer circumferential surfaces of the 1 st supply roller 103a and the 2 nd supply roller 103 b. In the coating apparatus 100A shown in fig. 7, the structures of the 1 st supply roller 103a, the 2 nd supply roller 103b, the 1 st coating roller 104a, and the 2 nd coating roller 104b and the structures other than the arrangement positions of the 1 st blade 105a and the 2 nd blade 105b are the same as those of the coating apparatus 100 shown in fig. 5.
Fig. 8 is a flowchart for explaining a method of manufacturing an electronic component according to embodiment 2. The steps for performing the same processing as in the flowchart shown in fig. 4 are denoted by the same step numbers, and detailed description thereof is omitted.
In step S2, the conductive paste is sequentially supplied to the outer peripheral surface of the application roller in an amount corresponding to one electronic component blank 11. In the present embodiment, the step of supplying the conductive paste to the outer circumferential surface of the application roller (step S2) includes: a step of adhering a conductive paste to the outer peripheral surface of the supply roller (step S31); a step (step S32) of transferring the conductive paste on the outer peripheral surface of the supply roller to the outer peripheral surface of the application roller; and a step (step S33) of removing excess conductive paste adhering to the portion other than the concave portion of the application roller.
In step S31, a part of the supply roller is immersed in a conductive paste tank storing a conductive paste, and the conductive paste is attached to the outer circumferential surface of the supply roller. Specifically, a part of the 1 st supply roller 103a is immersed in the 1 st conductive paste tank 102a in which the conductive paste 120 is stored, and the conductive paste 120 is attached to the outer peripheral surface of the 1 st supply roller 103 a. Further, a part of the 2 nd supply roller 103b is immersed in the 2 nd conductive paste tank 102b in which the conductive paste 120 is stored, and the conductive paste 120 is attached to the outer peripheral surface of the 2 nd supply roller 103 b. As shown in fig. 7, in the present embodiment, no concave portion is provided on the outer circumferential surfaces of the 1 st supply roller 103a and the 2 nd supply roller 103 b.
In step S32, the conductive paste adhering to the outer peripheral surface of the supply roller is transferred to the outer peripheral surface of the application roller by bringing the outer peripheral surface of the supply roller into contact with the outer peripheral surface of the application roller having a plurality of recesses formed in the surface thereof. Specifically, the outer peripheral surface of the 1 st supply roller 103a is brought into contact with the outer peripheral surface of the 1 st application roller 104a, whereby the conductive paste 120 adhering to the outer peripheral surface of the 1 st supply roller 103a is transferred to the outer peripheral surface of the 1 st application roller 104 a. Further, the outer peripheral surface of the 2 nd supply roller 103b is brought into contact with the outer peripheral surface of the 2 nd application roller 104b, whereby the conductive paste 120 adhering to the outer peripheral surface of the 2 nd supply roller 103b is transferred to the outer peripheral surface of the 2 nd application roller 104 b.
A plurality of 1 st concave portions 131a are provided at a given interval in the rotation direction on the outer circumferential surface of the 1 st application roller 104 a. The shape and size of the 1 st concave portion 131a are the same as those of the 1 st concave portion 131a provided on the outer peripheral surface of the 1 st supply roller 103a in embodiment 1. Further, a plurality of 2 nd concave portions 131b are provided at a given interval in the rotation direction on the outer circumferential surface of the 2 nd application roller 104 b.
In step S33, an excess of the conductive paste transferred to the outer peripheral surface of the application roller, which adheres to the portions other than the recessed portions, is removed. In the present embodiment, the 1 st doctor blade 105a scrapes off and removes the excess conductive paste 120 adhering to the portion other than the 1 st concave portion 131a in the outer peripheral surface of the 1 st application roller 104 a. In addition, the excess conductive paste 120 adhering to the portion other than the 2 nd concave portion 131b in the outer peripheral surface of the 2 nd application roller 104b is scraped off and removed by the 2 nd doctor blade 105 b. Thereby, the conductive paste 120 is attached only in the 1 st concave portion 131a of the 1 st application roller 104a and the 2 nd concave portion 131b of the 2 nd application roller 104 b.
The conductive paste 120 present in the 1 st concave portion 131a of the 1 st application roller 104a and the 2 nd concave portion 131b of the 2 nd application roller 104b is in an amount corresponding to one electronic component blank 11.
The steps S3 and S4 subsequent to step S2 are the same as those of steps S3 and S4 in the flowchart shown in fig. 4. In step S3, the electronic component blank 11 is sandwiched between the 1 st application roller 104a and the 2 nd application roller 104b, whereby the conductive paste 120 in the 1 st concave portion 131a of the 1 st application roller 104a is transferred to the 1 st end surface 15a of the electronic component blank 11, and the conductive paste 120 in the 2 nd concave portion 131b of the 2 nd application roller 104b is transferred to the 2 nd end surface 15b of the electronic component blank 11. At this time, the conveyance speed of the carrier tape 106 and the rotation speeds of the 1 st application roller 104a and the 2 nd application roller 104b are controlled so that the conductive paste 120 in the 1 st concave portion 131a of the 1 st application roller 104a is transferred to the 1 st end surface 15a of the electronic component blank 11, and the conductive paste 120 in the 2 nd concave portion 131b of the 2 nd application roller 104b is transferred to the 2 nd end surface 15 b.
In the method for manufacturing an electronic component according to embodiment 2 as well, similarly to the method for manufacturing an electronic component according to embodiment 1, the conductive paste 120 is sequentially supplied to the outer peripheral surface of the 1 st application roller 104a in an amount corresponding to one electronic component blank 11, and when the 1 st end surface 15a of the electronic component blank 11 is brought into contact with the 1 st application roller 104a, the conductive paste 120 adheres only to the 1 st end surface 15a, and therefore, the applied conductive paste 120 can be prevented from being wound around the 1 st main surface 16a, the 2 nd main surface 16b, the 1 st side surface 17a, and the 2 nd side surface 17 b. Similarly, the conductive paste 120 is sequentially supplied to the outer peripheral surface of the 2 nd application roller 104b in an amount corresponding to one electronic component blank 11, and when the 2 nd end surface 15b of the electronic component blank 11 is brought into contact with the 2 nd application roller 104b, the conductive paste 120 adheres only to the 2 nd end surface 15b, and therefore, the applied conductive paste 120 can be prevented from being wound around the 1 st main surface 16a, the 2 nd main surface 16b, the 1 st side surface 17a, and the 2 nd side surface 17 b.
In the present embodiment, the conductive paste 120 is attached to the outer peripheral surface of the 1 st supply roller 103a by immersing a part of the 1 st supply roller 103a in the 1 st conductive paste tank 102a, and the conductive paste 120 is transferred to the outer peripheral surface of the 1 st application roller 104a by bringing the outer peripheral surface of the 1 st supply roller 103a into contact with the outer peripheral surface of the 1 st application roller 104a provided with the plurality of 1 st recesses 131a on the surface, and then the excess conductive paste 120 attached to the portions other than the inside of the 1 st recess 131a of the 1 st application roller 104a is removed. The same applies to the method of adhering the conductive paste 120 to the inside of the 2 nd concave portion 131b of the 2 nd application roller 104 b. With this method, the conductive paste 120 can be intermittently supplied to the outer peripheral surface of the 1 st application roller 104a and the outer peripheral surface of the 2 nd application roller 104b in an amount corresponding to one electronic component blank 11 with high accuracy.
The present invention is not limited to the above-described embodiments, and various applications and modifications can be made within the scope of the present invention.
For example, in the manufacturing method of the above-described embodiment, the description has been made on the assumption that the electronic component blank 11 is sandwiched between the 1 st application roller 104a and the 2 nd application roller 104b, and the conductive paste 120 supplied to the outer peripheral surfaces of the 1 st application roller 104a and the 2 nd application roller 104b is applied to the 1 st end surface 15a and the 2 nd end surface 15b of the electronic component blank 11 at the same time. However, the coating device 100 may be configured to have only one coating roller, and the conductive paste 120 may be applied to the surface of the electronic component green body 11 by bringing the electronic component green body 11 into contact with one coating roller.
In the above-described embodiment, the description has been made on the assumption that the conductive paste 120 adhering to the outer peripheral surface of the 1 st supply roller 103a is transferred to the outer peripheral surface of the 1 st application roller 104a by the outer peripheral surface of the 1 st application roller 104a coming into contact with the outer peripheral surface of the 1 st supply roller 103 a. However, the first supply roller 103a may not be provided, and the conductive paste 120 may be intermittently supplied to the outer peripheral surface of the first application roller 104a in an amount corresponding to one electronic component blank 11. Similarly, the 2 nd supply roller 103b may not be provided, and the conductive paste 120 may be intermittently supplied to the outer peripheral surface of the 2 nd application roller 104b in an amount corresponding to one electronic component green body 11.
Claims (7)
1. A method for manufacturing an electronic component, in which a conductive paste is applied to a part of a surface of an electronic component blank having a rectangular parallelepiped shape, comprising:
sequentially supplying the conductive paste to an outer peripheral surface of an application roller in an amount corresponding to one of the electronic component green bodies; and
applying the conductive paste to the surface of the electronic component blank by bringing the surface of the electronic component blank conveyed along a conveying path into contact with the conductive paste supplied onto the outer peripheral surface of the application roller,
in the step of applying the conductive paste, the transfer speed of the electronic component green bodies along the transfer path and the rotational speed of the application roller are controlled so that the conductive paste is sequentially applied to the surfaces of the plurality of electronic component green bodies.
2. The method for manufacturing an electronic component according to claim 1,
the step of sequentially supplying the conductive paste includes:
a step of immersing a part of a supply roller having a plurality of concave portions on an outer peripheral surface thereof in a conductive paste tank storing the conductive paste, thereby attaching the conductive paste to the outer peripheral surface of the supply roller;
removing an excess of the conductive paste adhering to a portion of the outer peripheral surface of the supply roller other than the recessed portion; and
and a step of bringing the outer peripheral surface of the supply roller from which the excess conductive paste has been removed into contact with the outer peripheral surface of the application roller, thereby transferring the conductive paste in the recessed portion to the outer peripheral surface of the application roller.
3. The method for manufacturing an electronic component according to claim 1,
the step of sequentially supplying the conductive paste includes:
a step of immersing a part of a supply roller in a conductive paste tank in which the conductive paste is stored, thereby attaching the conductive paste to an outer peripheral surface of the supply roller;
a step of transferring the conductive paste adhering to the outer peripheral surface of the supply roller to the outer peripheral surface of the application roller by bringing the outer peripheral surface of the supply roller into contact with the outer peripheral surface of the application roller having a plurality of concave portions formed on the surface thereof; and
and removing an excess of the conductive paste adhering to a portion other than the recessed portion from the conductive paste transferred to the outer peripheral surface of the application roller.
4. The method for manufacturing an electronic component according to claim 2 or 3,
the size of the recess when viewed in a direction orthogonal to the bottom surface of the recess is equal to or smaller than the size of the region to which the conductive paste is applied, among the surfaces of the electronic component blank.
5. The method for manufacturing an electronic component according to any one of claims 1 to 4,
in the step of sequentially supplying the conductive pastes, the conductive pastes are sequentially supplied to the outer circumferential surface of the 1 st application roller in an amount corresponding to one of the electronic component blanks, and the conductive pastes are sequentially supplied to the outer circumferential surface of the 2 nd application roller in an amount corresponding to one of the electronic component blanks,
in the step of applying the conductive paste to the surface of the electronic component blank, the electronic component blank is sandwiched between the first application roller 1 and the second application roller 2, and the conductive paste supplied to the outer peripheral surfaces of the first application roller 1 and the second application roller 2 is transferred to the surface of the electronic component blank.
6. The method for manufacturing an electronic component according to claim 5,
in the step of applying the conductive paste to the surface of the electronic component element, the plurality of electronic component elements held by the conveyance member are conveyed between the 1 st application roller and the 2 nd application roller, and the plurality of electronic component elements are sequentially sandwiched between the 1 st application roller and the 2 nd application roller.
7. The method for manufacturing an electronic component according to any one of claims 1 to 6,
the electronic component is a laminated ceramic capacitor in which external electrodes are formed on a surface of the electronic component blank having a structure in which internal electrodes and dielectric layers are alternately laminated.
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|---|---|---|---|
| JP2020185541A JP2022075023A (en) | 2020-11-06 | 2020-11-06 | Manufacturing method of electronic component |
| JP2020-185541 | 2020-11-06 |
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| CN114464454A true CN114464454A (en) | 2022-05-10 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1421280A (en) * | 2001-11-19 | 2003-06-04 | 株式会社村田制作所 | Size coating apparatus and size coating method |
| CN1892939A (en) * | 2005-06-03 | 2007-01-10 | 株式会社村田制作所 | Paste coating device and method for manufacturing sliced electronic component |
| CN105690985A (en) * | 2014-12-15 | 2016-06-22 | 株式会社村田制作所 | Electronic member manufacture device |
| CN106904016A (en) * | 2015-12-21 | 2017-06-30 | 株式会社村田制作所 | The manufacture method of galley, the printing equipment for possessing the galley and laminated ceramic electronic component |
| JP2019135752A (en) * | 2018-02-05 | 2019-08-15 | 株式会社村田製作所 | Method of manufacturing electronic component |
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2020
- 2020-11-06 JP JP2020185541A patent/JP2022075023A/en active Pending
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2021
- 2021-09-06 CN CN202111041164.5A patent/CN114464454A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1421280A (en) * | 2001-11-19 | 2003-06-04 | 株式会社村田制作所 | Size coating apparatus and size coating method |
| CN1892939A (en) * | 2005-06-03 | 2007-01-10 | 株式会社村田制作所 | Paste coating device and method for manufacturing sliced electronic component |
| CN105690985A (en) * | 2014-12-15 | 2016-06-22 | 株式会社村田制作所 | Electronic member manufacture device |
| CN106904016A (en) * | 2015-12-21 | 2017-06-30 | 株式会社村田制作所 | The manufacture method of galley, the printing equipment for possessing the galley and laminated ceramic electronic component |
| JP2019135752A (en) * | 2018-02-05 | 2019-08-15 | 株式会社村田製作所 | Method of manufacturing electronic component |
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