CN114464358A - Coaxial line and method for manufacturing coaxial line - Google Patents
Coaxial line and method for manufacturing coaxial line Download PDFInfo
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- CN114464358A CN114464358A CN202210211866.1A CN202210211866A CN114464358A CN 114464358 A CN114464358 A CN 114464358A CN 202210211866 A CN202210211866 A CN 202210211866A CN 114464358 A CN114464358 A CN 114464358A
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- copper foil
- organic
- organic solder
- manufacturing
- copper
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
- H01B7/2806—Protection against damage caused by corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
- H01B13/225—Screening coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The embodiment of the invention provides a coaxial line and a manufacturing method of the coaxial line, wherein the coaxial line comprises an inner conductor, an insulating medium, a copper foil, an outer conductor and a sheath, wherein the insulating medium, the copper foil, the outer conductor and the sheath are sequentially coated on the inner conductor from inside to outside, and an organic solderability preservative film is formed on the surface of the copper foil. Therefore, the smoothness of the surface of the copper foil can be maintained through the organic solder mask, the surface of the copper foil can be prevented from being oxidized, the corrosion resistance of the copper foil is enhanced, and the reliability of coaxial line signal transmission is ensured.
Description
Technical Field
The present invention relates to the field of transmission line technology, and in particular, to a coaxial line and a method for manufacturing the same.
Background
A coaxial line is a common signal transmission line, in which an outer conductor can conduct a low level through a transmission loop and also can play a role of shielding. In order to improve the shielding performance of the outer conductor, a copper foil is usually added between the outer conductor and the insulating medium to reduce the loss of signal transmission in the coaxial line. The copper foil used in the existing coaxial line is not corrosion-resistant, and the reliability of signal transmission is influenced.
Disclosure of Invention
In view of the above, the present invention provides a coaxial cable and a method for manufacturing the coaxial cable, in which the corrosion resistance of the copper foil is enhanced by improving the structure of the copper foil.
In a first aspect, an embodiment of the present invention provides a coaxial line, where the coaxial line includes:
an inner conductor;
an insulating medium coated on an outer peripheral side of the inner conductor;
the copper foil is coated on the outer peripheral side of the insulating medium, and at least one layer of organic solder mask is formed on the surface of the copper foil;
an outer conductor coated on an outer peripheral side of the copper foil; and
and a sheath covering an outer peripheral side of the outer conductor.
Further, the inner conductor comprises a copper wire or a copper-clad aluminum wire.
Further, the inner conductor includes a silver-plated soft copper wire or a tin-plated soft copper wire.
Further, the outer conductor is of a combined structure of a woven mesh and a longitudinal wrapping aluminum-plastic composite belt.
Further, the woven mesh is made of silver-plated soft copper wires or tin-plated soft copper wires.
Further, the copper foil includes a pure copper foil or a composite copper foil.
Further, the composite copper foil comprises a copper foil layer positioned on the inner side and a composite film layer positioned on the outer side.
Further, the insulating medium is made of a high-density plastic material;
the high-density plastic material comprises a flame retardant and an anti-aging agent.
Further, the sheath is made of a thermoplastic material;
the thermoplastic plastic material comprises a flame retardant and an anti-aging agent.
Further, the thickness of the organic solder mask is 0.25-0.6 microns.
In a second aspect, an embodiment of the present invention further provides a coaxial line manufacturing method, where the manufacturing method includes:
providing an inner conductor, and coating an insulating medium on the outer periphery side of the inner conductor;
preparing an organic solder flux;
providing a copper foil, and carrying out surface treatment on the copper foil by using the organic solder mask so as to form an organic solder mask on the surface of the copper foil;
coating the copper foil with the organic solderability preservative film on the outer periphery of the insulating medium;
coating an outer conductor on the outer periphery side of the copper foil with the organic solder mask;
a sheath is coated on an outer peripheral side of the outer conductor.
Further, the surface treatment of the copper foil with the organic solder flux includes:
and covering the surface of the copper foil with the organic solder resist.
Further, covering the surface of the copper foil with the organic solder resist includes:
immersing the copper foil in the organic solder resist.
Further, covering the surface of the copper foil with the organic solder resist includes:
and uniformly spraying the organic solder resist to the surface of the copper foil.
Further, covering the surface of the copper foil with the organic solder resist includes:
and uniformly coating the organic solder flux on the surface of the copper foil.
Further, providing the copper foil includes:
and after the surface of the copper foil is subjected to oil removal and microetching treatment, the copper foil is cleaned by deionized water.
Further, the step of formulating the organic solderability preservative comprises:
providing a stock solution;
measuring and calculating the concentration of the effective components in the stock solution;
and adjusting the concentration of the effective components in the stock solution to 41.2-52.4% to prepare the organic solder-maintaining agent.
Further, the measuring and calculating the concentration of the effective components in the stock solution comprises:
detecting the absorbance of the stock solution by an optical instrument;
and calculating the concentration of the effective components in the stock solution according to the absorbance of the stock solution.
Further, the step of preparing the organic solder resist further comprises:
adding pure water when the concentration of the effective components in the organic solder flux is more than 52.4%; and
and when the concentration of the effective components in the organic solder flux is less than 47.4%, adding the concentrated solution.
Further, the step of preparing the organic solder resist further comprises:
detecting the pH value of the organic solderability preservative;
adjusting the pH value of the organic solder resist to 2.6-3.5.
Further, the step of preparing the organic solder resist further comprises:
carrying out surface treatment on a test piece by using the organic solder resist;
and measuring and calculating the thickness of the solder mask formed on the surface of the test piece.
Further, the measuring and calculating the thickness of the solder mask formed on the surface of the test piece comprises the following steps:
treating the test piece with the solder mask formed on the surface by 5% hydrochloric acid;
taking out the treated test piece, and detecting the absorbance of the residual solution by an optical instrument;
and calculating the thickness of the solderability preservative film formed on the surface of the test piece according to the absorbance of the residual solution.
The embodiment of the invention provides a coaxial line and a manufacturing method thereof, wherein the coaxial line comprises an inner conductor, an insulating medium, a copper foil, an outer conductor and a sheath, wherein the insulating medium, the copper foil, the outer conductor and the sheath are sequentially coated on the inner conductor from inside to outside, and an organic solder mask is formed on the surface of the copper foil. Therefore, the smoothness of the surface of the copper foil can be maintained through the organic solder mask, the surface of the copper foil can be prevented from being oxidized, the corrosion resistance of the copper foil is enhanced, and the reliability of coaxial line signal transmission is ensured.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 is a schematic cross-sectional view of a coaxial line provided by an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a pure copper foil according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a composite copper foil according to an embodiment of the present invention;
fig. 4 is a schematic flow chart of a coaxial line manufacturing method according to an embodiment of the present invention;
FIG. 5 is a schematic flow chart of a process for preparing an organic solder resist according to an embodiment of the present invention;
FIG. 6 is a schematic flow chart of measuring and calculating the concentration of an active ingredient in a stock solution according to an embodiment of the present invention;
FIG. 7 is a schematic view of a process for measuring and calculating the thickness of a solder mask formed on a surface of a test piece according to an embodiment of the present invention;
fig. 8 is a schematic flow chart of a method for providing a copper foil and performing a surface treatment on the copper foil using an organic solder resist according to an embodiment of the present invention.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Fig. 1 is a schematic cross-sectional view of a coaxial line according to an embodiment of the present invention, as shown in fig. 1, the coaxial line includes, from inside to outside, an inner conductor 1, an insulating medium 2 coated on an outer circumferential side of the inner conductor 1, a copper foil 3 coated on an outer circumferential side of the insulating medium 2, an outer conductor 4 coated on an outer circumferential side of the copper foil 3, and a sheath 5 coated on an outer circumferential side of the outer conductor 4. Wherein, the organic solder mask a is formed on the surface of the copper foil 3, so as to maintain the surface smoothness of the copper foil 3 and prevent the surface of the copper foil 3 from being oxidized. The copper foil 3 enhances the corrosion resistance through the organic solder mask a, thereby ensuring the reliability of coaxial line transmission signals. In one embodiment, the thickness of the organic solderability preservative film a is 0.25-0.6 microns, so that the organic solderability preservative film a can achieve excellent protection effect on the copper foil 3. As an alternative embodiment, the thickness of the organic solder mask a is 0.4 μm, and the organic solder mask a has the best protection effect on the copper foil 3.
Further, the main material of the inner conductor 1 is copper, and the inner conductor 1 conducts high level through the transmission loop. In one embodiment, the inner conductor 1 comprises a copper wire or a copper-clad aluminum wire. It should be noted that copper wires and copper-clad aluminum wires are generally applied to small cables, the copper wires have the advantages of high strength, small resistance, long service life and the like, and the copper-clad aluminum wires have the advantages of low cost, convenience in maintenance and the like.
As an alternative embodiment, the inner conductor 1 comprises a silver-plated soft copper wire or a tin-plated soft copper wire, which has superior conductivity, corrosion resistance, oxidation resistance and the like compared with a bare copper wire, and contributes to prolonging the service life of the coaxial wire.
In one embodiment, the insulating medium 2 is made of a high density plastic material (e.g., HDPE, PP, etc.) for improving interference resistance and preventing water and oxygen from corroding the inner conductor 1. Furthermore, the high-density plastic material also comprises additives such as a flame retardant, an anti-aging agent and the like. It should be noted that the flame retardant is a non-halogen flame retardant (including one or more of aluminum hydroxide, magnesium hydroxide, aluminum hydroxy oxalate, red phosphorus, borate, antimony oxide and anhydrous magnesium carbonate), and has the advantages of low addition amount, high flame retardant efficiency, low smoke, low toxicity and the like.
Note that the copper foil 3 in this embodiment includes a pure copper foil 31 or a composite copper foil 32, as shown in fig. 2 to 3. Wherein, the copper surfaces on both sides of the pure copper foil 31 are formed with a layer of organic solderability preservative film a. In one embodiment, the composite copper foil 32 includes a copper foil layer 321 on the inner side and a composite film layer 322 on the outer side, and an organic solderability preservative film a is formed on the surface of the copper foil layer 321. The composite copper foil 32 can improve the comprehensive performance of the copper foil 3 by adding a layer of composite film.
In this embodiment, the composite film layer 322 may be, but is not limited to, a PET film, and when the composite film layer is a PET film, the composite film layer may be further bonded to one side of the copper foil layer 321 by means of adhesive bonding; because the organic solderability preservative film has corrosion-resistant and anti-oxidant effect, can play the effect that reduces radiation loss and reduce it and receive external interference through setting up the PET membrane. In other embodiments, the composite film layer 322 may be, but is not limited to, an ethylene-propylene fluoride layer, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer layer, a polytetrafluoroethylene layer, or a copolymer of ethylene and tetrafluoroethylene, and the composite film layer 322 in this embodiment is mainly a fluoroplastic layer, and the fluoroplastic layer is a soft plastic layer with good temperature resistance, so as to improve the structural stability.
In one embodiment, the outer conductor 4 is a combination structure of a woven mesh and a longitudinal wrapping of an aluminum-plastic composite tape, and has the advantages of good flexibility, light weight, reliable joint and the like. The outer conductor 4 can both conduct low levels through the transmission loop and also serve as a shield. In the present embodiment, the outer conductor 4 has a reasonable composite structure, and thus the shielding performance can be effectively improved. As an alternative embodiment, the braided mesh is made of silver-plated soft copper wire or tin-plated soft copper wire, and has excellent conductivity, corrosion resistance, oxidation resistance and the like compared with bare copper wire, which helps to prolong the service life of the coaxial wire.
In one embodiment, the sheath 5 is made of a thermoplastic plastic material (e.g. PE, PP, etc.) and serves to protect the wire body. Furthermore, the thermoplastic plastic material also comprises additives such as flame retardant, anti-aging agent and the like. It should be noted that the flame retardant is a non-halogen flame retardant (including one or more of aluminum hydroxide, magnesium hydroxide, aluminum hydroxy oxalate, red phosphorus, borate, antimony oxide and anhydrous magnesium carbonate), and has the advantages of low addition amount, high flame retardant efficiency, low smoke, low toxicity and the like.
The coaxial line provided by the embodiment comprises an inner conductor 1, an insulating medium 2, a copper foil 3, an outer conductor 4 and a sheath 5, wherein the insulating medium, the copper foil 3, the outer conductor 4 and the sheath 5 are sequentially coated on the inner conductor 1 from inside to outside, and an organic solder mask a is formed on the surface of the copper foil 3. Therefore, the flatness of the surface of the copper foil 3 can be maintained through the organic solder mask a, the surface of the copper foil 3 can be prevented from being oxidized, the corrosion resistance of the copper foil 3 is enhanced, and the reliability of coaxial line signal transmission is ensured.
Fig. 4 is a schematic flow chart of a method for manufacturing a coaxial line according to an embodiment of the present invention, and as shown in fig. 4, the method for manufacturing a coaxial line includes the following steps:
and S1, providing an inner conductor, and coating an insulating medium on the outer periphery side of the inner conductor. Wherein, the main material of the inner conductor is copper. In one embodiment, the inner conductor comprises a copper wire or a copper-clad aluminum wire. It should be noted that copper wires and copper-clad aluminum wires are generally applied to small cables, the copper wires have the advantages of high strength, small resistance, long service life and the like, and the copper-clad aluminum wires have the advantages of low cost, convenience in maintenance and the like. As an alternative embodiment, the inner conductor comprises a silver-plated soft copper wire or a tin-plated soft copper wire, which has superior conductivity, corrosion resistance, oxidation resistance and the like compared with a bare copper wire, and contributes to prolonging the service life of the coaxial wire.
In one embodiment, the insulating medium is made of a high density plastic material (e.g., HDPE, PP, etc.) for improved interference resistance and to prevent water and oxygen from attacking the inner conductor. Furthermore, the high-density plastic material also comprises additives such as a flame retardant, an anti-aging agent and the like. It should be noted that the flame retardant is a non-halogen flame retardant (including one or more of aluminum hydroxide, magnesium hydroxide, aluminum hydroxy oxalate, red phosphorus, borate, antimony oxide and anhydrous magnesium carbonate), and has the advantages of low addition amount, high flame retardant efficiency, low smoke, low toxicity and the like.
S2, preparing the organic solderability preservative. Among them, in order to maintain the optimum effect of the organic solder resist, the organic solder resist needs to be adjusted so that the content of active ingredients, pH, and the like are controlled within effective ranges.
S3, providing a copper foil, and carrying out surface treatment on the copper foil by using an organic solder mask so as to form an organic solder mask on the surface of the copper foil. The organic solderability preservative can perform a complexing reaction with metal copper on the surface of the copper foil to form an organic metal bond, so that an acceptable organic solderability preservative film is formed by thickening under the action of an organic compound. The organic solder mask can prevent copper from being oxidized, and the corrosion resistance of the copper foil is enhanced. The copper foil may be pure copper foil or composite copper foil. The composite copper foil comprises a copper foil layer and a composite film layer, and the composite copper foil can improve the comprehensive performance of the copper foil by adding a layer of composite film. Therefore, the organic solder mask can be formed on both surfaces of the pure copper foil by performing surface treatment on the pure copper foil by using the organic solder mask. Similarly, the composite copper foil is subjected to surface treatment using an organic solder resist, so that an organic solder resist film is formed on the surface of the copper foil layer.
And S4, coating the copper foil with the organic solder mask on the outer periphery of the insulating medium. It should be noted that, when the copper foil is a composite copper foil, the copper foil layer of the composite copper foil faces inward, that is, the composite film layer faces outward, in order to make the manufactured coaxial cable have excellent overall performance.
And S5, coating the outer conductor on the outer periphery side of the copper foil with the organic solder mask. The outer conductor is of a combined structure of a woven mesh and a longitudinal aluminum-plastic composite belt, and has the advantages of good flexibility, light weight, reliable joint and the like. The outer conductor can effectively improve the shielding performance by adopting a reasonable composite structure. As an alternative embodiment, the braided mesh is made of silver-plated soft copper wires or tin-plated soft copper wires, and has excellent conductivity, corrosion resistance, oxidation resistance and the like compared with bare copper wires, which helps to prolong the service life of the coaxial wires.
S6, a sheath is coated on the outer periphery of the outer conductor. Wherein, the sheath is made by thermoplastic plastics material (for example PE, PP etc.), plays the effect of protection line body. Furthermore, the thermoplastic plastic material also comprises additives such as flame retardant, anti-aging agent and the like. It should be noted that the flame retardant is a non-halogen flame retardant (including one or more of aluminum hydroxide, magnesium hydroxide, aluminum hydroxy oxalate, red phosphorus, borate, antimony oxide and anhydrous magnesium carbonate), and has the advantages of low addition amount, high flame retardant efficiency, low smoke, low toxicity and the like.
Fig. 5 is a schematic flow chart of the process of preparing the organic solder resist according to the embodiment of the present invention, and as shown in fig. 5, step S2 includes:
and S21, providing a stock solution. The stock solution contains organic film-forming substances including imidazole compounds. Wherein, the imidazole compound can be imidazole, alkyl imidazole, benzimidazole or alkyl benzimidazole and derivatives thereof. The stock solution needs to be prevented from being mixed with water containing sodium, magnesium, potassium, calcium and metal ions thereof, acid, alkali or halogen and the like, and is required to be prevented from being placed in a place exposed to direct sunlight and a high-temperature and high-humidity environment so as to ensure that the stock solution can be prepared into qualified organic solderability preservative.
And S22, measuring and calculating the concentration of the effective components in the stock solution. In order to control the content of the effective component in the prepared organic solder resist within the effective range, it is necessary to measure the concentration of the effective component in the stock solution so as to perform subsequent adjustment according to the concentration of the effective component in the stock solution.
S23, adjusting the concentration of the effective components in the stock solution to 41.2-52.4% to prepare the organic solderability preservative. It is easily understood that the content of the effective component in the prepared organic solder resist is 41.2% -52.4%, and within this range, the organic solder resist can achieve excellent film forming effect. As an alternative embodiment, the concentration of the effective component in the stock solution is adjusted to 50%, so that the prepared organic solderability preservative can achieve the optimal film forming effect. It should be noted that the prepared organic solder-protecting agent needs to be contained by plastic products such as PE.
Fig. 6 is a schematic flow chart of measuring and calculating the concentration of the active ingredient in the stock solution according to the embodiment of the present invention, and as shown in fig. 6, step S22 includes:
s221, detecting the antigen by an optical instrumentAbsorbance of the solution. Wherein absorbance refers to the intensity of incident light before the light passes through the solution (I)0) Intensity of transmitted light after passing through the solution (I)t) Ratio of (i.e. I)0/It) Base 10 logarithm of (lg (I)0/It)). In the embodiment, the optical instrument is a spectrophotometer, which is also called a spectrometer, and measures the absorption spectrum of the solution by using ultraviolet light, visible light, infrared light, laser light, and the like, so as to perform qualitative and quantitative analysis on the solution by using the absorption spectrum.
In an alternative embodiment, the optical instrument is an ultraviolet-visible spectrophotometer. In the test, 1 ml of stock solution is diluted to 250 ml for subsequent test calculation. After the ultraviolet visible spectrophotometer is preheated, the testing wavelength is adjusted to 270 nanometers, and then pure water is used for zero setting. The diluted stock solution is put into the sample for detection, and the transmittance (i.e. I) can be readt/I0) Or absorbance.
And S222, calculating the concentration of the effective component in the stock solution according to the absorbance of the stock solution. It should be noted that, according to the lambert-beer law, when a beam of parallel monochromatic light is perpendicularly irradiated to a uniform, non-scattering colored sample solution, the absorbance of the solution is in a proportional relationship with the optical path (i.e., the solution layer thickness) and the solution concentration. That is, a ═ lg (1/T) ═ Kbc. Wherein A is absorbance, T is transmittance, K is a proportionality constant, b is solution thickness, and c is solution concentration. Where the K value is related to the solution properties and the wavelength of the incident light. Thus, the concentration of the active ingredient in the stock solution can be calculated from the measured absorbance.
In one embodiment, step S2 further includes:
and S24, adding pure water when the concentration of the effective components in the organic solder flux is more than 52.4%. It is easily understood that the concentration of the effective component in the organic solder resist increases due to water evaporation or the like during formulation, storage or use. When the concentration is increased to over 52.4%, the film forming effect is affected, and pure water is required to be added to reduce the concentration so as to ensure the optimal film forming effect.
And S25, when the concentration of the effective components in the organic solder flux is less than 47.4%, adding the concentrated solution. It is easily understood that the concentration of the effective component in the organic solder resist is lowered by consumption in use. When the concentration is reduced to less than 47.4%, the concentration can be increased by adding a concentrated solution to ensure that the best effect of film formation is achieved. It should be noted that when the concentration of the effective component is less than 41.2%, the organic solder resist is seriously contaminated or the effect thereof is seriously affected, and the preparation work can be carried out again.
It should be noted that the pH of the organic solderability preservative also has a decisive influence on the film-forming effect. In one embodiment, step S2 further includes:
and S26, detecting the pH value of the organic solder resist. As an alternative embodiment, the pH of the organic solder resist may be measured by using an instrument such as a pH meter.
S27, adjusting the pH value of the organic solderability preservative to 2.6-3.5. It is easily understood that the film forming effect is seriously affected when the detected pH is less than 2.6 or more than 3.5, and therefore, the pH of the organic solder resist may be adjusted to 2.6 to 3.5 by adding a conditioning agent or the like. When the pH is 3, the film forming effect of the organic solder resist is the best.
In one embodiment, step S2 further includes:
and S28, performing surface treatment on the test piece by using the organic solder resist. In this embodiment, the test piece is a standard bare copper plate. Specifically, after the test piece is subjected to oil removal, microetching, cleaning and the like, the test piece is immersed into an organic solderability preservative to carry out film forming operation, so that the film forming effect can be observed and the film forming thickness can be measured and calculated in the following process.
And S29, measuring and calculating the thickness of the solder mask formed on the surface of the test piece. If the film forming effect of the test piece is not good or the film forming thickness does not meet the requirement, the organic solder-protecting agent prepared is unqualified and needs to be prepared again; if the film forming effect of the test piece is good and the film forming thickness meets the requirement, the prepared organic solder resist can carry out film forming work on the copper foil needing surface treatment. Specifically, if the thickness of the solder mask is 0.25 to 0.6 μm, the organic solder mask is qualified.
Fig. 7 is a schematic flowchart of a process of measuring and calculating a thickness of a solder mask formed on a surface of a test piece according to an embodiment of the present invention, where, as shown in fig. 7, step S29 includes:
and S291, treating the test piece with the solder mask formed on the surface by 5% hydrochloric acid. As an alternative embodiment, the test piece with the solder mask formed on the surface is put into a clean beaker, then a certain amount of 5% hydrochloric acid is put into the beaker, the beaker is slightly shaken for a certain time, and finally the treated test piece is taken out so as to measure and calculate the residual solution.
And S292, taking out the treated test piece, and detecting the absorbance of the residual solution through an optical instrument. In an alternative embodiment, the optical instrument is an ultraviolet-visible spectrophotometer. During detection, the ultraviolet-visible spectrophotometer is preheated, the test wavelength is adjusted to 270 nanometers, and then 5% hydrochloric acid is used for zero adjustment. And (4) placing the residual solution into an instrument for detection, and reading the transmittance or absorbance.
And S293, calculating the thickness of the solderability preservative film formed on the surface of the test piece according to the absorbance of the residual solution. The thickness of the solder mask is in direct proportion to the absorbance of the remaining solution. Specifically, h ═ C × a'. Wherein h is the thickness of the solder mask, C is the film thickness coefficient, and A' is the absorbance of the remaining solution. It should be further noted that the film thickness coefficient C is inversely related to the absorbance A of the stock solution.
It should be noted that, when the measured film thickness does not meet the requirement, that is, the film thickness is less than 0.25 μm or greater than 0.6 μm, the organic solder-protecting agent needs to be adjusted or re-formulated. As an alternative embodiment, when the evaluation result shows that the film thickness is low, the film thickness may be increased by prolonging the processing time, raising the temperature of the organic solder resist, raising the pH of the organic solder resist, or raising the concentration.
As an alternative embodiment, the comparison reagent with acceptable concentration and pH value can be prepared by the method described above, and the test piece is used to perform the film thickness test by the comparison reagent. If the test is qualified, the organic solder-protecting agent for processing the copper foil is prepared according to the same steps and parameters under the same conditions, so that the organic solder-protecting agent can be prevented from being polluted when a test piece is used for testing as much as possible.
Fig. 8 is a schematic flow chart of providing a copper foil and performing a surface treatment on the copper foil using an organic solder resist according to an embodiment of the present invention, where, as shown in fig. 8, the providing of the copper foil in step S3 includes:
and S31, performing oil removal, micro etching and other treatments on the surface of the copper foil, and then cleaning the copper foil by using deionized water. Wherein, the oil removal can remove the copper surface oxide and the pollutants such as fingerprint, grease and the like to obtain a clean copper surface and avoid the uneven thickness of the formed film. In addition, microetching can form a rougher copper surface for film formation, and the thickness of the microetching directly affects the rate of film formation. The copper foil is cleaned by using deionized water, so that the organic solder mask can be prevented from being polluted, particularly sulfate ions mixed into a microetching agent can be avoided, and the organic solder mask can be ensured to continuously carry out surface treatment on other copper foils. Thus, the processed clean copper foil can be subjected to the subsequent film forming process.
In one embodiment, the surface treatment of the copper foil with the organic solder flux in step S3 includes:
s32, covering the surface of the copper foil with the organic solder resist. It is easily understood that the organic solderability preservative covers the surface of the copper foil, so that the entire surface of the copper foil is covered with the organic solderability preservative, and the copper foil can be protected in all directions while maintaining the flatness of the copper surface.
In one embodiment, step S32 includes immersing the copper foil in an organic solder flux. It should be noted that the immersion method can ensure that the organic solderability preservative is in sufficient contact with the copper foil and fully reacts with the copper foil, so that an acceptable organic solderability preservative film can be formed on the surface of the copper foil to effectively protect the copper foil. The organic solder resist may be coated on the surface of the copper foil in other ways. For example, the organic solder resist may be uniformly sprayed onto the surface of the copper foil, or the organic solder resist may be uniformly applied onto the surface of the copper foil.
As an alternative embodiment, when the spraying process is used, the organic solder mask is sprayed in a way of spraying vapor mist, so that a single or multiple layers of organic solder mask can be formed on the long film at a certain position on the surface of the copper foil in a certain proportion, thereby providing flexibility and protection effect on the manufacturing process of a manufacturer in the manufacturing process. As another alternative, when the coating process is used, the coating may be performed by an ink-jet printing method, a screen printing method, a gravure printing method, an offset printing method, a flexographic printing method, a slit coating method, a die coating method, a doctor blade coating method, or a wire bar coating method, in which case, also, a single or multiple layers of the organic solder mask may be formed on a long film at a specific portion of the surface of the copper foil in a certain ratio, and at the same time, the densification of the organic solder mask may be more greatly promoted, so that a densely-filled and strong organic solder mask may be obtained.
In the method for manufacturing the coaxial wire provided by this embodiment, the surface of the copper foil is processed by the prepared organic solder resist, so that an organic solder resist film can be formed on the surface of the copper foil. The coaxial line manufactured by the method can reduce loss and improve shielding performance through the copper foil, and the organic solder mask on the surface of the copper foil can maintain the smoothness of the surface of the copper foil, prevent the surface of the copper foil from being oxidized, enhance the corrosion resistance of the copper foil and ensure the reliability of coaxial line signal transmission.
The embodiment of the invention provides a coaxial line and a manufacturing method thereof, wherein the coaxial line comprises an inner conductor, an insulating medium, a copper foil, an outer conductor and a sheath, wherein the insulating medium, the copper foil, the outer conductor and the sheath are sequentially coated on the inner conductor from inside to outside, and an organic solder mask is formed on the surface of the copper foil. Therefore, the smoothness of the surface of the copper foil can be maintained through the organic solder mask, the surface of the copper foil can be prevented from being oxidized, the corrosion resistance of the copper foil is enhanced, and the reliability of coaxial line signal transmission is ensured.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (22)
1. A coaxial wire, characterized in that it comprises:
an inner conductor;
an insulating medium coated on an outer peripheral side of the inner conductor;
the copper foil is coated on the outer peripheral side of the insulating medium, and at least one layer of organic solder mask is formed on the surface of the copper foil;
an outer conductor coated on an outer peripheral side of the copper foil; and
and a sheath covering an outer peripheral side of the outer conductor.
2. The coaxial wire of claim 1, wherein the inner conductor comprises a copper wire or a copper-clad aluminum wire.
3. The coaxial wire of claim 2, wherein the inner conductor comprises a silver plated soft copper wire or a tin plated soft copper wire.
4. The coaxial line of claim 1, wherein the outer conductor is configured as a combination structure of a woven mesh and a longitudinal wrapping of an aluminum-plastic composite tape.
5. The coaxial line of claim 4, wherein the braided mesh is made of silver plated soft copper wire or tin plated soft copper wire.
6. The coaxial wire of claim 1, wherein the copper foil comprises a plain or composite copper foil.
7. The coaxial wire of claim 6, wherein the composite copper foil comprises an inner copper foil layer and an outer composite film layer.
8. The coaxial line of any of claims 1-7, wherein the insulating medium is made of a high density plastic material;
the high-density plastic material comprises a flame retardant and an anti-aging agent.
9. The coaxial wire of any of claims 1-7, wherein the sheath is made of a thermoplastic material;
the thermoplastic plastic material comprises a flame retardant and an anti-aging agent.
10. The coaxial wire of any of claims 1-7, wherein the organic solderability mask has a thickness of 0.25-0.6 microns.
11. A method of manufacturing a coaxial wire, the method comprising:
providing an inner conductor, and coating an insulating medium on the outer periphery side of the inner conductor;
preparing an organic solder flux;
providing a copper foil, and carrying out surface treatment on the copper foil by using the organic solder mask so as to form an organic solder mask on the surface of the copper foil;
coating the copper foil with the organic solderability preservative film on the outer periphery of the insulating medium;
coating an outer conductor on the outer periphery side of the copper foil with the organic solder mask;
a sheath is coated on an outer peripheral side of the outer conductor.
12. The method for manufacturing the coaxial wire according to claim 11, wherein the surface-treating the copper foil with the organic solder resist comprises:
and covering the surface of the copper foil with the organic solder resist.
13. The method for manufacturing a coaxial wire according to claim 12, wherein the covering of the surface of the copper foil with the organic solder resist comprises:
immersing the copper foil in the organic solder resist.
14. The method for manufacturing a coaxial wire according to claim 12, wherein the covering of the surface of the copper foil with the organic solder resist comprises:
and uniformly spraying the organic solder-protecting agent on the surface of the copper foil.
15. The method for manufacturing a coaxial wire according to claim 12, wherein the covering of the surface of the copper foil with the organic solder resist comprises:
and uniformly coating the organic solder flux on the surface of the copper foil.
16. The method of manufacturing a coaxial wire of claim 11, wherein providing a copper foil comprises:
and after the surface of the copper foil is subjected to oil removal and microetching treatment, the copper foil is cleaned by deionized water.
17. The method of manufacturing a coaxial wire of claim 11, wherein the dispensing of the organic solderability preservative comprises:
providing a stock solution;
measuring and calculating the concentration of the effective components in the stock solution;
and adjusting the concentration of the effective components in the stock solution to 41.2-52.4% to prepare the organic solder-maintaining agent.
18. The method for manufacturing a coaxial wire according to claim 17, wherein the measuring the concentration of the active ingredient in the stock solution comprises:
detecting the absorbance of the stock solution by an optical instrument;
and calculating the concentration of the effective components in the stock solution according to the absorbance of the stock solution.
19. The method of manufacturing a coaxial wire of claim 17, wherein dispensing an organic solderability preservative further comprises:
adding pure water when the concentration of the effective components in the organic solder flux is more than 52.4%; and
and when the concentration of the effective components in the organic solder flux is less than 47.4%, adding the concentrated solution.
20. The method of manufacturing a coaxial wire of claim 17, wherein dispensing an organic solderability preservative further comprises:
detecting the pH value of the organic solderability preservative;
adjusting the pH value of the organic solder resist to 2.6-3.5.
21. The method of manufacturing a coaxial wire of claim 17, wherein dispensing an organic solderability preservative further comprises:
carrying out surface treatment on a test piece by using the organic solder resist;
and measuring and calculating the thickness of the solder mask formed on the surface of the test piece.
22. The coaxial cable manufacturing method according to claim 21, wherein measuring the thickness of the solder mask formed on the surface of the test piece comprises:
treating the test piece with the solder mask formed on the surface by 5% hydrochloric acid;
taking out the treated test piece, and detecting the absorbance of the residual solution by an optical instrument;
and calculating the thickness of the solderability preservative film formed on the surface of the test piece according to the absorbance of the residual solution.
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| CN101508051A (en) * | 2009-03-11 | 2009-08-19 | 林原标 | Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method |
| CN105772989A (en) * | 2016-04-04 | 2016-07-20 | 广东工业大学 | Copper surface organic solder preservative and application thereof |
| CN109285632A (en) * | 2018-10-27 | 2019-01-29 | 江苏春鹏电气有限公司 | Coaxial cable |
| CN211530157U (en) * | 2019-12-31 | 2020-09-18 | 安徽宏源特种电缆集团有限公司 | Ultralow-loss phase-stable microwave coaxial cable |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508051A (en) * | 2009-03-11 | 2009-08-19 | 林原标 | Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method |
| CN105772989A (en) * | 2016-04-04 | 2016-07-20 | 广东工业大学 | Copper surface organic solder preservative and application thereof |
| CN109285632A (en) * | 2018-10-27 | 2019-01-29 | 江苏春鹏电气有限公司 | Coaxial cable |
| CN211530157U (en) * | 2019-12-31 | 2020-09-18 | 安徽宏源特种电缆集团有限公司 | Ultralow-loss phase-stable microwave coaxial cable |
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