CN114462363A - Electronic component summary table generation method, tool and electronic equipment - Google Patents

Electronic component summary table generation method, tool and electronic equipment Download PDF

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Publication number
CN114462363A
CN114462363A CN202111594981.3A CN202111594981A CN114462363A CN 114462363 A CN114462363 A CN 114462363A CN 202111594981 A CN202111594981 A CN 202111594981A CN 114462363 A CN114462363 A CN 114462363A
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China
Prior art keywords
bill
materials
summary table
electronic component
outputting
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CN202111594981.3A
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Inventor
张亮
涂德海
刘娟
任恒飞
张阳天
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Foundmacro Co ltd
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Foundmacro Co ltd
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Priority to CN202111594981.3A priority Critical patent/CN114462363A/en
Publication of CN114462363A publication Critical patent/CN114462363A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F40/00Handling natural language data
    • G06F40/10Text processing
    • G06F40/166Editing, e.g. inserting or deleting
    • G06F40/174Form filling; Merging
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F40/00Handling natural language data
    • G06F40/10Text processing
    • G06F40/166Editing, e.g. inserting or deleting
    • G06F40/177Editing, e.g. inserting or deleting of tables; using ruled lines
    • G06F40/18Editing, e.g. inserting or deleting of tables; using ruled lines of spreadsheets
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F40/00Handling natural language data
    • G06F40/10Text processing
    • G06F40/166Editing, e.g. inserting or deleting
    • G06F40/186Templates

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Audiology, Speech & Language Pathology (AREA)
  • Computational Linguistics (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Stored Programmes (AREA)

Abstract

The embodiment of the application provides an electronic component summary table generation method, a tool and electronic equipment, wherein the method comprises the following steps: acquiring a bill of materials of electronic components in circuit design software; summarizing the bill of materials according to the unique identifier of the electronic element device; and outputting the summarized bill of materials to a preset template to generate a summary table. The method and the device can improve the efficiency of making the summary table and reduce the error rate of making the summary table. Particularly, the format of the summary table required in the relevant standard is fixed, and the method, the tool and the electronic equipment for generating the electronic component summary table provided by the embodiment of the application can greatly improve the compiling efficiency and ensure the standardization level of the output summary table.

Description

Electronic component summary table generation method, tool and electronic equipment
Technical Field
The embodiment of the application relates to the technical field of computer software, in particular to a method, a tool and electronic equipment for generating an electronic component summary table.
Background
In the documentation of military product development projects, an electronic component summary table is often required to be compiled, the table format is fixed, and such summary table files are often required to be output in the development process. When making the summary table file by the designer, a circuit board all need derive a summary table, and when a set of equipment included more circuit board, every circuit board all need derive a summary table, still need merge the summary to it, in addition, still need count information such as quantity, specification of imported components and parts and domestic components and parts, the amount of labour is big, the mistake easily appears.
Disclosure of Invention
In order to improve efficiency and accuracy in summary table manufacturing, embodiments of the present application provide a method, a tool, and an electronic device for generating an electronic component summary table.
In a first aspect of the present application, a method for generating an electronic component summary table is provided, including:
acquiring a bill of materials of electronic components in circuit design software;
summarizing the bill of materials according to the unique identifier of the electronic element;
and outputting the summarized bill of materials to a preset template to generate a summary table.
In a possible implementation manner, the obtaining a bill of materials of electronic components in the circuit design software includes:
calling the SDK of the circuit design software, and acquiring a bill of materials of the electronic component according to the SDK of the circuit design software; or
Exporting the material information of electronic components in the circuit design software into files in txt, csv and excel formats, and reading the exported material information to obtain the bill of materials.
In a possible implementation manner, the summarizing the bill of materials according to the electronic component code includes:
and summarizing the bill of materials of all the electronic components in one or more circuit boards according to the electronic component codes.
In a possible implementation manner, the outputting the aggregated bill of materials to a preset template to generate a summary table includes:
and performing keyword replacement according to the SDK of the office software or a third-party development library based on the bill of materials to realize filling of the preset template.
In a possible implementation manner, after obtaining the bill of materials of the electronic components in the circuit design software, the method further includes:
editing the bill of materials to perfect material information and modify the information in the bill of materials.
In a possible implementation manner, after the outputting the aggregated bill of materials to the preset template to generate the summary table, the method further includes:
and calling the SDK capable of outputting the PDF, Word or Excel files, and outputting the summary table into the PDF, Word or Excel files.
In a second aspect of the present application, there is provided an electronic component summary table generation tool, including:
the acquisition module is used for acquiring a bill of materials of electronic components in the circuit design software;
the summarizing module is used for summarizing the bill of materials according to the unique identifier of the electronic component;
and the generating module is used for outputting the summarized bill of materials to a preset template so as to generate a summary table.
In one possible implementation manner, the method further includes: and the editing module is used for editing the bill of materials so as to perfect the material information and modify the information in the bill of materials.
In one possible implementation manner, the method further includes: and the output module is used for calling the SDK capable of outputting the PDF, Word or Excel files and outputting the summary table as the PDF, Word or Excel files.
In a third aspect of the present application, an electronic device is provided, comprising a memory having stored thereon a computer program and a processor implementing the method according to any of the first aspect when executing the computer program.
In the method, the tool and the electronic device for generating the summary table of the electronic component, firstly, the bill of material of the electronic component in the circuit design software is obtained, then, the bill of material is summarized according to the code of the electronic component, finally, the summarized bill of material is output to the preset template to generate the summary table, and when different summary tables are generated, different templates can be selected according to different standards to automatically generate the summary table, so that the efficiency of manufacturing the summary table can be improved, and the error rate of manufacturing the summary table can be reduced. Particularly, for the reason that the format of the summary table required in the relevant standard is fixed, the electronic component summary table generation method, the tool and the electronic device provided by the embodiment of the application can greatly improve the compiling efficiency and ensure the standardization level of the output summary table.
It should be understood that what is described in this summary section is not intended to limit key or critical features of the embodiments of the application, nor is it intended to limit the scope of the application. Other features of the present application will become apparent from the following description.
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The above and other features, advantages and aspects of various embodiments of the present application will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements, and wherein:
fig. 1 shows a flowchart of an electronic component summary table generation method according to an embodiment of the present application.
Fig. 2 illustrates a block diagram of an electronic component summary table generation tool according to an embodiment of the present application.
Fig. 3 shows a schematic structural diagram of an electronic device suitable for implementing embodiments of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
In order to facilitate understanding of the embodiments of the present application, some terms referred to in the embodiments of the present application are first explained.
Bill of Materials (BOM), a technical document describing the composition of an enterprise product, indicates the structural relationship between the product's assembly, subassemblies, components, parts, and raw Materials, as well as the quantities required, in the process capital industry.
Software Development Kit (SDK) is generally a collection of Development tools used by some Software engineers to build application Software for a particular Software package, Software framework, hardware platform, operating system, and the like. And (4) developing a library by a third party, namely the SDK of the third party.
Next, a method for generating an electronic component summary table according to an embodiment of the present application will be described. Fig. 1 shows a flowchart of an electronic component summary table generation method according to an embodiment of the present application. In some embodiments, the method may be performed by an electronic device. Referring to fig. 1, the method comprises the steps of:
step 110, a bill of materials of electronic components in the circuit design software is obtained.
In the embodiment of the present application, the electronic components include domestic electronic components and imported electronic components. The bill of materials at least comprises the code of the electronic component, the name of the electronic component, the specification and the model of the electronic component and the quantity of the electronic component.
In some alternative embodiments, a bill of materials for electronic components may be derived from circuit design software. Specifically, the bill of materials of the parts can be derived in the following two ways.
The first method is as follows: because the SDK has the function of automatically reading the bill of material of the electronic components in the circuit board in the circuit design software, the SDK of the circuit design software can be directly called to obtain the bill of material of the electronic components. It should be noted that the SDKs in different circuit design software are different.
The second method comprises the following steps: since the circuit design software can export the bill of materials into files in txt, csv, excel and other formats, the files in txt, csv, excel and other formats can be directly read to obtain the bill of materials.
It should be noted that the circuit design software in the embodiment of the present application may be an Altium Designer, cadence, or the like.
In other optional embodiments, after the bill of materials of the electronic components in the circuit board is obtained, the bill of materials may be stored in the database, and when the bill of materials needs to be used, the bill of materials may be directly called from the database. For example, when a part of the bill of materials needs to be used, the part of the bill of materials can be called from the database, and other bills of materials are stored in the database so as to be directly called when the follow-up use is facilitated.
In some embodiments, after the bill of materials is derived, the information in the bill of materials (e.g., electronic component information) may be changed after the electronic component information in the bill of materials (e.g., electronic component code, electronic component manufacturer, etc.) is changed. For example, when a certain batch of electronic component codes or electronic component manufacturers are modified, the parts information can be directly modified in batches. For example, when a batch of electronic components lacks certain attribute information, the attribute information may be improved in batches. The content changed in the file is judged and processed manually, time is consumed, errors are prone to occurring, and therefore the mode of batch modification can be used for improving efficiency and avoiding errors.
And step 120, summarizing the bill of materials according to the unique identifier of the electronic component.
In the embodiment of the application, the bill of materials is summarized, namely the number of the electronic components is counted. By way of example, the number of domestic electronic components and the number of imported electronic components can be summarized in the embodiment of the application.
In some optional embodiments, the codes of the different types of electronic components are different, so that the electronic components can be summarized by using the electronic component codes. In other alternative embodiments, other unique attributes of the electronic components may also be specified, and the electronic components may be summarized according to the unique attributes.
In this embodiment of the present application, the electronic components in a certain circuit board may be summarized, the electronic components in multiple circuit boards may be summarized, or the electronic components in all the circuit boards in a certain or multiple systems may be summarized.
Alternatively, after the electronic components in the plurality of circuit boards are aggregated, it may be counted to which circuit board each electronic component belongs.
In this application embodiment, gather the bill of materials according to electronic components code number, can enough accomplish fast and gather the operation, can avoid artifical mistake that causes of gathering again to gather, leak and gather.
And step 130, outputting the aggregated bill of materials to a preset template to generate an aggregation table.
In the embodiment of the present application, the preset template may be any template, such as a template specified in an army development process, a template specified in a civil development process, or a customized template. The following description will be made in detail by taking a template defined in a certain standard as an example.
Illustratively, the template specified in the standard includes a home page and a content page, the home page includes a device name, a document code, a total volume number, a current volume number, a total page number, a preparation unit and preparation time, the content page includes an electronic component code, an electronic component name, an electronic component number, an electronic component reference unit price, an electronic component cost, an electronic component manufacturer, an electronic component security level and remark information, and the electronic component security level includes red, purple, orange, yellow and green.
The generation of the corresponding summary table can be divided into two parts, one part is the generation of the first page, and the other part is the generation of the content page.
Generating a home page
In the first page, based on the bill of materials, keyword substitution is performed according to the SDK of the office software or a third-party development library so as to realize filling of equipment name, file code number, total book number, current book number, total page number, compilation unit and compilation time.
Generating a content page
And editing a form in the content page according to the SDK of the office software or a third party development library based on the bill of materials so as to fill in the code number, the name, the quantity, the reference unit price, the cost, the manufacturer and the safety grade of the electronic component and the remark information of the electronic component.
Because the standard has requirements on the format of the summary table, and the summary table is required to be in a PDF format, an SDK capable of outputting a PDF file can be called, and the summary table is output as the PDF file. Of course, if the summary table required to be output in other standards or requirements is a file in other format, a person skilled in the art may select the format output by the summary table according to actual needs, and only need to call the SDK or other tools capable of outputting the corresponding format.
According to the embodiment of the application, the bill of materials of the electronic components in the circuit design software is obtained firstly, then the bill of materials is collected according to the codes of the electronic components, finally the collected bill of materials is output to the preset template to generate the summary table, and when different summary tables are generated, different templates can be selected according to different standards to automatically generate the summary table, so that the efficiency of manufacturing the summary table can be improved, and the error rate of manufacturing the summary table can be reduced.
It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present application is not limited by the order of acts described, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are exemplary embodiments and that the acts and modules referred to are not necessarily required in this application.
The above is a description of method embodiments, and the embodiments of the present application are further described below by way of apparatus embodiments.
FIG. 2 illustrates a block diagram of a parts summary table generation tool according to an embodiment of the present application. In some embodiments, the tool may be implemented as, or executed by, an electronic device. Referring to FIG. 2, the tool includes an acquisition module 210, a summarization module 220, and a generation module 230.
The obtaining module 210 is configured to obtain a bill of materials of electronic components in the circuit design software.
And the summarizing module 220 is used for summarizing the bill of materials according to the code of the electronic component.
And the generating module 230 is configured to output the summarized bill of materials to a preset template to generate a summary table.
In some embodiments, the obtaining module 210 is specifically configured to: calling the SDK of the circuit design software, and acquiring a bill of materials of the electronic component according to the SDK of the circuit design software; or exporting the material information of the electronic components in the circuit design software into a file with txt, csv and excel formats, and reading the exported material information to obtain the bill of materials.
In some embodiments, the aggregation module 220 is specifically configured to: and summarizing all the electronic components in one or more circuit boards according to the electronic component codes.
In some embodiments, the generating module 230 is specifically configured to: and performing keyword replacement according to the SDK of the office software or a third-party development library based on the bill of materials to realize filling of the preset template.
In some embodiments, the tool further comprises an editing module for editing the bill of materials to modify information in the bill of materials.
In some embodiments, the tool further comprises an output module, wherein the output module is used for calling the SDK capable of outputting the PDF file and outputting the summary table as the PDF file.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working process of the described module may refer to the corresponding process in the foregoing method embodiment, and is not described herein again.
An embodiment of the present application further provides an electronic device, as shown in fig. 3, the electronic device 300 shown in fig. 3 includes: a processor 301 and a memory 303. Wherein the processor 301 is coupled to the memory 303, such as via bus 5002. Optionally, the electronic device 300 may also include a transceiver 304. It should be noted that the transceiver 304 is not limited to one in practical applications, and the structure of the electronic device 300 is not limited to the embodiment of the present application.
The Processor 301 may be a CPU (Central Processing Unit), a general-purpose Processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array) or other Programmable logic device, a transistor logic device, a hardware component, or any combination thereof. Which may implement or perform the various illustrative logical blocks, modules, and circuits described in connection with the disclosure. The processor 301 may also be a combination of computing functions, e.g., comprising one or more microprocessors, a combination of a DSP and a microprocessor, or the like.
Bus 302 may include a path that transfers information between the above components. The bus 302 may be a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The bus 302 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown in FIG. 3, but that does not indicate only one bus or one type of bus.
The Memory 303 may be a ROM (Read Only Memory) or other type of static storage device that can store static information and instructions, a RAM (Random Access Memory) or other type of dynamic storage device that can store information and instructions, an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory) or other optical Disc storage, optical Disc storage (including Compact Disc, laser Disc, optical Disc, digital versatile Disc, blu-ray Disc, etc.), a magnetic Disc storage medium or other magnetic storage device, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer, but is not limited to these.
The memory 303 is used for storing application program codes for executing the scheme of the application, and the processor 301 controls the execution. The processor 301 is configured to execute application program code stored in the memory 303 to implement the aspects illustrated in the foregoing method embodiments.
Among them, electronic devices include but are not limited to: mobile terminals such as mobile phones, notebook computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and the like, and fixed terminals such as digital TVs, desktop computers, and the like. The electronic device shown in fig. 3 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiments of the present application.
The embodiment of the present application provides a computer readable storage medium, on which a computer program is stored, and when the computer program runs on a computer, the computer is enabled to execute the corresponding content in the foregoing method embodiment. Compared with the prior art, in the embodiment of the application, the bill of material of the electronic component in the circuit design software is firstly obtained, then the bill of material is summarized according to the code of the electronic component, finally the summarized bill of material is output to the preset template to generate the summary table, and when different summary tables are generated, different templates can be selected according to different standards to automatically generate the summary table, so that the efficiency of manufacturing the summary table can be improved, and the error rate of manufacturing the summary table can be reduced.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims (10)

1. A method for generating an electronic component summary table is characterized by comprising the following steps:
acquiring a bill of materials of electronic components in circuit design software;
summarizing the bill of materials according to the unique identifier of the electronic element;
and outputting the summarized bill of materials to a preset template to generate a summary table.
2. The method of claim 1, wherein obtaining a bill of materials for electronic components in circuit design software comprises:
calling the SDK of the circuit design software, and acquiring a bill of materials of the electronic component according to the SDK of the circuit design software; or
Exporting the material information of electronic components in the circuit design software into files in txt, csv and excel formats, and reading the exported material information to obtain the bill of materials.
3. The method of claim 1, wherein the summarizing the bill of materials according to the electronic component code number comprises:
and summarizing the bill of materials of all the electronic components in one or more circuit boards according to the electronic component codes.
4. The method of claim 1, wherein outputting the aggregated bill of materials to a preset template to generate a summary table comprises:
and performing keyword replacement according to the SDK of the office software or a third-party development library based on the bill of materials to realize filling of the preset template.
5. The method of claim 1, wherein after obtaining the bill of materials of the electronic components in the circuit design software, the method further comprises:
editing the bill of materials to perfect material information and modify the information in the bill of materials.
6. The method of claim 1, wherein after outputting the aggregated bill of materials to a preset template to generate the aggregated table, the method further comprises:
and calling the SDK capable of outputting the PDF, Word or Excel files, and outputting the summary table into the PDF, Word or Excel files.
7. An electronic component summary table generation tool, comprising:
the acquisition module is used for acquiring a bill of materials of electronic components in the circuit design software;
the summarizing module is used for summarizing the bill of materials according to the unique identifier of the electronic component;
and the generating module is used for outputting the summarized bill of materials to a preset template so as to generate a summary table.
8. The tool of claim 7, further comprising:
and the editing module is used for editing the bill of materials so as to perfect the material information and modify the information in the bill of materials.
9. The tool of claim 7, further comprising:
and the output module is used for calling the SDK capable of outputting the PDF, Word or Excel files and outputting the summary table as the PDF, Word or Excel files.
10. An electronic device comprising a memory and a processor, the memory having stored thereon a computer program, wherein the processor, when executing the computer program, implements the method of any of claims 1-6.
CN202111594981.3A 2021-12-23 2021-12-23 Electronic component summary table generation method, tool and electronic equipment Pending CN114462363A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102087726A (en) * 2009-12-03 2011-06-08 鸿富锦精密工业(深圳)有限公司 System for generating bill of materials and method thereof
CN102096727A (en) * 2009-12-15 2011-06-15 鸿富锦精密工业(深圳)有限公司 System and method for generating bill of materials
CN111507609A (en) * 2020-04-13 2020-08-07 兰剑智能科技股份有限公司 Material list generation method and device and electronic equipment
CN112884413A (en) * 2021-03-02 2021-06-01 科世达(上海)机电有限公司 Method, system, equipment and storage medium for generating bill of material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102087726A (en) * 2009-12-03 2011-06-08 鸿富锦精密工业(深圳)有限公司 System for generating bill of materials and method thereof
CN102096727A (en) * 2009-12-15 2011-06-15 鸿富锦精密工业(深圳)有限公司 System and method for generating bill of materials
CN111507609A (en) * 2020-04-13 2020-08-07 兰剑智能科技股份有限公司 Material list generation method and device and electronic equipment
CN112884413A (en) * 2021-03-02 2021-06-01 科世达(上海)机电有限公司 Method, system, equipment and storage medium for generating bill of material

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