CN114461038A - Equipment temperature control method and device and cloud server - Google Patents
Equipment temperature control method and device and cloud server Download PDFInfo
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- CN114461038A CN114461038A CN202111625166.9A CN202111625166A CN114461038A CN 114461038 A CN114461038 A CN 114461038A CN 202111625166 A CN202111625166 A CN 202111625166A CN 114461038 A CN114461038 A CN 114461038A
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Abstract
The embodiment of the disclosure provides a method and a device for controlling equipment temperature and a cloud server, wherein the method comprises the following steps: receiving a program starting command, acquiring temperature information detected by a temperature sensor according to the program starting command, judging whether the temperature is less than a first preset temperature, if so, controlling the operation device to carry out operation rate adjustment, and if not, stopping the operation rate adjustment of the operation device. According to the embodiment of the application, the temperature of the operation module is sensed by the temperature sensor, so that the operation device can correspondingly adjust the operation capacity according to the temperature condition of the current module, the temperature of the equipment is indirectly controlled, and the service life of the equipment with the operation device is prolonged.
Description
Technical Field
The disclosure relates to the technical field of temperature control, in particular to a method and a device for controlling equipment temperature and a cloud server.
Background
In electronic devices with a large volume, which usually contain integrated circuits, the ambient temperature around the functional modules in the device is raised to a large extent in a short time, since the device releases a large amount of heat energy during operation. In order to ensure the normal operation of the equipment, a temperature reduction device (such as an air cooling or water cooling device) is generally used to perform a temperature reduction treatment on the surface of the equipment and the surrounding environment thereof. However, the cooling device is mounted at an extra cost, and the device is not easy to be loaded in an integrated circuit device with a small size.
Disclosure of Invention
In order to overcome at least the above disadvantages in the prior art, the present disclosure is directed to providing a method and an apparatus for controlling a device temperature, and a cloud server.
In a first aspect, the present disclosure provides a device temperature control method applied to an integrated circuit processing device, the integrated circuit processing device including an arithmetic device and a temperature sensor, the method including the steps of:
receiving a program starting command, and acquiring temperature information detected by the temperature sensor according to the program starting command;
judging whether the temperature detected by the temperature sensor is lower than a first preset temperature or not;
if the current value is less than the preset value, controlling the operation device to adjust the operation rate;
and in the process of adjusting the operation rate of the operation device, if the temperature information is not less than a first preset temperature, stopping the operation of the operation device.
In a second aspect, the present disclosure provides a device temperature control apparatus for use in an integrated circuit processing device, the integrated circuit processing device comprising an arithmetic device and a temperature sensor, the apparatus comprising:
the temperature measuring unit is used for receiving a program starting command and acquiring temperature information detected by the temperature sensor according to the program starting command;
the measurement and control unit is used for judging whether the temperature detected by the temperature sensor is lower than a first preset temperature or not;
the adjusting unit is used for controlling the operation device to adjust the operation rate when the measurement and control unit judges that the operation device is the current device;
and the control unit is used for stopping the operation rate adjustment of the operation device when the measurement and control unit judges that the operation rate adjustment is not carried out in the operation rate adjustment process of the operation device.
In a third aspect, an embodiment of the present disclosure provides a computer-readable storage medium, where instructions are stored, and when executed, cause a computer to perform the method for controlling the temperature of a device in the first aspect or any one of the possible designs of the first aspect.
In a fourth aspect, the disclosed embodiments further provide a cloud server, where the cloud server includes a processor, a machine-readable storage medium, and a network interface, where the machine-readable storage medium, the network interface, and the processor are connected through a bus system, the network interface is configured to be communicatively connected with at least one computing device, the machine-readable storage medium is configured to store a program, an instruction, or a code, and the processor is configured to execute the program, the instruction, or the code in the machine-readable storage medium to perform the device temperature control method in the first aspect or any one of the possible designs in the first aspect.
Based on any one of the above aspects, the present disclosure provides a device temperature control method, apparatus and cloud server, where the method includes: receiving a program starting command, acquiring temperature information detected by a temperature sensor according to the program starting command, judging whether the temperature is less than a first preset temperature, if so, controlling an arithmetic device to carry out arithmetic rate adjustment, and if not, stopping the arithmetic rate adjustment of the arithmetic device. According to the temperature sensor sensing operation module, the operation device can correspondingly adjust the operation capacity according to the temperature condition of the current module, so that the temperature of the equipment is indirectly controlled, and the service life of the equipment with the operation device is prolonged.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present disclosure and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings may be obtained from the drawings without inventive effort.
Fig. 1 is a schematic view of an application scenario of an apparatus temperature control system according to an embodiment of the present disclosure;
fig. 2 is a schematic flow chart of a method for controlling the temperature of equipment according to an embodiment of the present disclosure;
FIG. 3 is a functional block diagram of an apparatus temperature control device according to an embodiment of the disclosure;
fig. 4 is a schematic block diagram of a structure of a cloud server for implementing the above-mentioned device temperature control method according to an embodiment of the present disclosure.
Detailed Description
The present disclosure is described in detail below with reference to the drawings, and the specific operation methods in the method embodiments can also be applied to the device embodiments or the system embodiments.
Fig. 1 is an interactive schematic diagram of a device temperature control system 10 provided by an embodiment of the present disclosure. The device temperature control system 10 may include a cloud server 100 and a computing device 200 communicatively connected to the cloud server 100. The plant temperature control system 10 shown in fig. 1 is merely one possible example, and in other possible embodiments, the plant temperature control system 10 may include only a portion of the components shown in fig. 1 or may include other components.
In this embodiment, the computing device 200 may include a mobile device, a tablet computer, a laptop computer, or the like, or any combination thereof. In some embodiments, the mobile device may include a smart home device, a wearable device, a smart mobile device, a virtual reality device, an augmented reality device, or the like, or any combination thereof. In some embodiments, the smart home devices may include control devices of smart electrical devices, smart monitoring devices, smart televisions, smart cameras, and the like, or any combination thereof. In some embodiments, the wearable device may include a smart bracelet, a smart lace, smart glass, a smart helmet, a smart watch, a smart garment, a smart backpack, a smart accessory, or the like, or any combination thereof. In some embodiments, the smart mobile device may include a smartphone, a personal digital assistant, a gaming device, and the like, or any combination thereof. In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, virtual reality glass, a virtual reality patch, an augmented reality helmet, augmented reality glass, an augmented reality patch, or the like, or any combination thereof. For example, the virtual reality device and/or augmented reality device may include various virtual reality products and the like.
In this embodiment, the cloud server 100 and the computing device 200 in the device temperature control system 10 may cooperatively perform the device temperature control method described in the following method embodiment, and the specific steps of the cloud server 100 and the computing device 200 may refer to the detailed description of the following method embodiment.
In order to solve the technical problem in the foregoing background art, fig. 2 is a schematic flowchart of a device temperature control method provided in an embodiment of the present disclosure, and the device temperature control method provided in this embodiment may be executed by the cloud server 100 shown in fig. 1, and the device temperature control method is described in detail below.
Step S110, receiving a program starting command, and acquiring temperature information detected by the temperature sensor according to the program starting command;
step S120, judging whether the temperature detected by the temperature sensor is less than a first preset temperature;
step S130, if the current value is less than the preset value, controlling the operation device to adjust the operation rate;
step S140, in the process of adjusting the operation rate by the operation device, if the temperature information is not less than the first preset temperature, the operation of the operation device is stopped.
In one possible embodiment, step S130 further includes:
step S131, obtaining the adjustment range of the arithmetic device for adjusting the arithmetic rate last time;
step S132, judging whether the arithmetic device reaches a first threshold value of arithmetic capability currently;
and step S133, if the adjustment range is not reached, controlling the operation device to continue the adjustment range to continuously perform operation rate adjustment.
In one possible embodiment, step S130 further includes:
step S134, acquiring the current temperature control range of the arithmetic device;
step S135, if the temperature control range is smaller than a second threshold value, controlling the arithmetic device to increase the speed;
and S136, if the temperature control range is not smaller than a second threshold value, controlling the arithmetic device to reduce the speed.
In one possible embodiment, step S130 further includes:
step S137, calculating a temperature adjustment step according to the temperature information;
and step S138, controlling the arithmetic device to adjust the arithmetic rate according to the temperature adjustment step.
In a possible embodiment, step S130 is preceded by:
step S121, detecting the operation of a functional module triggering the temperature sensor;
and step S122, if the functional module is determined to be in a normal operation state, executing a step of controlling the operation device to adjust the operation rate.
Fig. 3 is a schematic diagram of functional modules of the device temperature control apparatus 300 according to an embodiment of the present disclosure, and in this embodiment, the device temperature control apparatus 300 may be divided into the functional modules according to a method embodiment executed by the cloud server 100, that is, the following functional modules corresponding to the device temperature control apparatus 300 may be used to execute each method embodiment executed by the cloud server 100. The device temperature control apparatus 300 may include a temperature measuring unit 310, a measurement and control unit 320, an adjusting unit 330, and a control unit 340, and the functions of the functional modules of the device temperature control apparatus 300 are described in detail below.
The temperature measuring unit 310 may be configured to execute the step S110, that is, to receive a program starting command, and acquire temperature information detected by the temperature sensor according to the program starting command.
The measurement and control unit 320 may be configured to perform the step S120, that is, determine whether the temperature detected by the temperature sensor is less than a first preset temperature.
The adjusting unit 330 may be configured to perform the step S130, that is, when the measurement and control unit determines that the measurement and control unit is yes, the computing device is controlled to perform the computation rate adjustment.
The control unit 340 may be configured to execute the step S140, that is, when the measurement and control unit determines that the operation rate adjustment is not performed by the operation device, the control unit stops the operation rate adjustment of the operation device.
It should be noted that the division of the modules of the above apparatus is only a logical division, and the actual implementation may be wholly or partially integrated into one physical entity, or may be physically separated. And these modules can be realized in the form of software called by processing element; or may be implemented entirely in hardware; and part of the modules can be realized in the form of calling software by the processing element, and part of the modules can be realized in the form of hardware. For example, the temperature measuring unit 310 may be a processing element separately installed, or may be integrated into a chip of the apparatus, or may be stored in a memory of the apparatus in the form of program code, and the processing element of the apparatus calls and executes the functions of the temperature measuring unit 310. Other modules are implemented similarly. In addition, all or part of the modules can be integrated together or can be independently realized. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, each step of the above method or each module above may be implemented by an integrated logic circuit of hardware in a processor element or an instruction in the form of software.
For example, the above modules may be one or more integrated circuits configured to implement the above methods, such as: one or more Application Specific Integrated Circuits (ASICs), or one or more microprocessors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs), among others. For another example, when some of the above modules are implemented in the form of a processing element scheduler code, the processing element may be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor that can call program code. As another example, these modules may be integrated together, implemented in the form of a system-on-a-chip (SOC).
Fig. 4 shows a hardware structure diagram of the cloud server 100 for implementing the control device provided by the embodiment of the present disclosure, and as shown in fig. 4, the cloud server 100 may include a processor 110, a machine-readable storage medium 120, a bus 130, and a transceiver 140.
In a specific implementation process, at least one processor 110 executes computer-executable instructions stored in the machine-readable storage medium 120 (for example, included in the device temperature control apparatus 300 shown in fig. 3), so that the processor 110 may perform the device temperature control method according to the above method embodiment, where the processor 110, the machine-readable storage medium 120, and the transceiver 140 are connected through the bus 130, and the processor 110 may be configured to control the transceiver action of the transceiver 140, so as to perform data transceiving with the aforementioned computing apparatus 200.
For a specific implementation process of the processor 110, reference may be made to the above-mentioned method embodiments executed by the cloud server 100, and implementation principles and technical effects are similar, which are not described herein again.
In the embodiment shown in fig. 4, it should be understood that the Processor may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the present invention may be embodied directly in a hardware processor, or in a combination of the hardware and software modules within the processor.
The machine-readable storage medium 120 may comprise high-speed RAM memory and may also include non-volatile storage NVM, such as at least one disk memory.
The bus 130 may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended ISA (EISA) bus, or the like. The bus 130 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, the buses in the figures of the present application are not limited to only one bus or one type of bus.
In addition, the embodiment of the disclosure also provides a readable storage medium, in which a computer executing instruction is stored, and when the processor executes the computer executing instruction, the above device temperature control method is implemented.
The readable storage medium described above may be implemented by any type of volatile or non-volatile memory device or combination thereof, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk. Readable storage media can be any available media that can be accessed by a general purpose or special purpose computer.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present disclosure, and not for limiting the same; while the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.
Claims (8)
1. A device temperature control method for an integrated circuit processing device comprising an arithmetic unit and a temperature sensor, the method comprising the steps of:
receiving a program starting command, and acquiring temperature information detected by the temperature sensor according to the program starting command;
judging whether the temperature detected by the temperature sensor is lower than a first preset temperature or not;
if the current value is less than the preset value, controlling the operation device to adjust the operation rate;
and in the process of adjusting the operation rate of the operation device, if the temperature information is not less than a first preset temperature, stopping the operation of the operation device.
2. The device temperature control method according to claim 1, wherein the step of controlling the arithmetic unit to perform arithmetic rate adjustment includes:
acquiring the adjustment amplitude of the arithmetic device for adjusting the arithmetic rate last time;
judging whether the computing device currently reaches a first threshold value of computing capability;
and if not, controlling the operation device to continue the adjustment amplitude to continuously perform operation rate adjustment.
3. The device temperature control method according to claim 1, wherein the step of controlling the arithmetic unit to perform arithmetic rate adjustment includes:
acquiring the current temperature control range of the arithmetic device;
if the temperature control range is smaller than a second threshold value, controlling the arithmetic device to increase the speed;
and if the temperature control range is not smaller than a second threshold value, controlling the arithmetic device to reduce the speed.
4. The device temperature control method according to claim 1, wherein the step of controlling the arithmetic unit to perform arithmetic rate adjustment includes:
calculating a temperature adjustment step according to the temperature information;
and controlling the arithmetic device to carry out arithmetic speed adjustment according to the temperature adjustment step.
5. The apparatus temperature control method according to claim 1, wherein before controlling the arithmetic device to perform the arithmetic rate adjustment after determining that the temperature information is less than a first preset temperature, the method further comprises:
detecting operation of a functional module triggering the temperature sensor;
and if the functional module is determined to be in a normal operation state, executing a step of controlling the operation device to adjust the operation rate.
6. An apparatus temperature control device for an integrated circuit processing apparatus, the integrated circuit processing apparatus including an arithmetic device and a temperature sensor, the apparatus comprising:
the temperature measuring unit is used for receiving a program starting command and acquiring temperature information detected by the temperature sensor according to the program starting command;
the measurement and control unit is used for judging whether the temperature detected by the temperature sensor is lower than a first preset temperature or not;
the adjusting unit is used for controlling the operation device to adjust the operation rate when the measurement and control unit judges that the operation device is the current device;
and the control unit is used for stopping the operation rate adjustment of the operation device when the measurement and control unit judges that the operation device does not perform the operation rate adjustment.
7. A computer readable storage medium storing instructions/executable code which, when executed by a processor of an integrated circuit processing device, causes the integrated circuit processing device to implement the method of any one of claims 1-5.
8. A cloud server, characterized in that the cloud server comprises a processor, a machine-readable storage medium, and a network interface, wherein the machine-readable storage medium, the network interface, and the processor are connected through a bus system, the network interface is used for being connected with at least one computing device in a communication manner, the machine-readable storage medium is used for storing programs, instructions, or codes, and the processor is used for executing the programs, instructions, or codes in the machine-readable storage medium to execute the device temperature control method according to any one of claims 1 to 5.
Priority Applications (1)
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CN202111625166.9A CN114461038A (en) | 2021-12-29 | 2021-12-29 | Equipment temperature control method and device and cloud server |
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CN202111625166.9A CN114461038A (en) | 2021-12-29 | 2021-12-29 | Equipment temperature control method and device and cloud server |
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CN114461038A true CN114461038A (en) | 2022-05-10 |
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CN202111625166.9A Withdrawn CN114461038A (en) | 2021-12-29 | 2021-12-29 | Equipment temperature control method and device and cloud server |
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