CN114459602A - Chopping device, chopping method and optical fiber coupling type terahertz time-domain system - Google Patents
Chopping device, chopping method and optical fiber coupling type terahertz time-domain system Download PDFInfo
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- CN114459602A CN114459602A CN202011242299.3A CN202011242299A CN114459602A CN 114459602 A CN114459602 A CN 114459602A CN 202011242299 A CN202011242299 A CN 202011242299A CN 114459602 A CN114459602 A CN 114459602A
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- terahertz
- beam expander
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000008878 coupling Effects 0.000 title claims abstract description 12
- 238000010168 coupling process Methods 0.000 title claims abstract description 12
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 12
- 239000013307 optical fiber Substances 0.000 title claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 40
- 239000010703 silicon Substances 0.000 claims abstract description 40
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 239000006096 absorbing agent Substances 0.000 claims abstract description 15
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 230000001276 controlling effect Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000010354 integration Effects 0.000 abstract description 4
- 230000007246 mechanism Effects 0.000 abstract description 2
- 230000005622 photoelectricity Effects 0.000 abstract description 2
- 230000035484 reaction time Effects 0.000 abstract description 2
- 230000004044 response Effects 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 230000003760 hair shine Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000001328 terahertz time-domain spectroscopy Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
The invention relates to the technical field of photoelectricity, in particular to a chopping device and method and an optical fiber coupling type terahertz time-domain system. The chopper apparatus includes: the device comprises a semiconductor laser, an optical beam expander, a silicon chip and a stray light absorber; the semiconductor laser and the optical beam expander are coaxial; the optical beam expander is coaxial with the stray light absorber; the semiconductor laser is used for emitting laser beams, the laser beams are expanded by the optical beam expander and then irradiate on the silicon chip, and the stray light absorber is used for absorbing reflected laser. In the invention, the semiconductor laser has small size and the output laser is simple to regulate and control; the silicon chip is modulated by the semiconductor mechanism output by the semiconductor laser, so that the purposes of simple modulation and high integration level can be realized, and the purpose of rapid chopping is realized by the characteristics of high response speed and short reaction time of the silicon chip to laser. In addition, the terahertz wave transmittance is modulated by the laser, and a rotating device is lacked, so that the purpose of smaller vibration can be realized.
Description
Technical Field
The invention relates to the technical field of photoelectricity, in particular to a chopping device, a chopping method and an optical fiber coupling type terahertz time-domain system.
Background
The optical fiber coupling type terahertz time-domain system is a system for generating and detecting terahertz pulses by using an optical fiber femtosecond laser and a photoconductive antenna, and compared with the traditional free space system, the optical fiber coupling type system has the characteristics of good environmental applicability and easiness in integration, so that the optical fiber coupling type terahertz time-domain system is widely applied to the fields of spectrum imaging, component detection and the like. The high-yield detector is a light energy detector based on photoacoustic transformation, has the characteristics of high sensitivity, no refrigeration, wide spectrum and small volume, and is widely applied to terahertz energy detection.
The detection process of the gaolet detector on the terahertz pulse needs to chop the terahertz wave beam by 5-20 Hz, and the existing chopping technology adopts a mechanical fan blade mode to chop the terahertz wave. In a traditional free space terahertz time-domain spectroscopy system, a mechanical fan can be used for chopping a pumping light path of a photoconductive antenna, and chopping equipment is far away from a terahertz source and a Gaoyi detector in the mode. In an optical fiber coupling type system, pumping light cannot be chopped, only a terahertz light path can be chopped, the chopping equipment needs to be close to a terahertz source and a tall-flea detector, and a fan blade vibrates the detector in the high-speed rotation process, so that a large amount of detection errors are introduced, and even the detector is damaged. Meanwhile, the diameter of the terahertz light beam is far larger than that of the pump light, and a mechanical fan blade with a larger size is required, so that the miniaturization and integration of the whole detection system are not facilitated.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the chopping device realizes the chopping function of the fiber coupling type terahertz time-domain spectroscopy system with adjustable chopping frequency and no vibration, and meets the detection requirement of a Gaolai detector.
The present invention provides a chopper apparatus, including: the device comprises a semiconductor laser, an optical beam expander, a silicon chip and a stray light absorber;
the semiconductor laser and the optical beam expander are coaxial;
the optical beam expander is coaxial with the stray light absorber;
the semiconductor laser is used for emitting laser beams, the laser beams are expanded by the optical beam expander and then irradiate on the silicon chip, and the stray light absorber is used for absorbing reflected laser.
Preferably, the semiconductor laser further comprises a signal source for outputting a stable square wave signal, wherein the square wave signal controls the laser output power of the semiconductor laser.
Preferably, the semiconductor laser emits a laser beam of stable power.
Preferably, the silicon chip clamp also comprises a clamp for fixing the silicon chip.
The invention provides a chopping method, which comprises the following steps:
the terahertz waves are irradiated on the silicon wafer,
regulating and controlling laser power, irradiating the laser beam on a silicon wafer after beam expansion, and realizing chopping of terahertz waves;
absorbing the reflected laser light.
Preferably, the laser power output by the semiconductor laser is regulated by a square wave signal.
The invention also provides an optical fiber coupling type terahertz time-domain system, which comprises a terahertz transmitting antenna and a Gaolai detector, and the chopping device is characterized in that a silicon wafer in the chopping device is arranged between the terahertz transmitting antenna and the Gaolai detector.
Compared with the prior art, the chopping device comprises: the device comprises a semiconductor laser, an optical beam expander, a silicon wafer and a stray light absorber; the semiconductor laser and the optical beam expander are coaxial; the optical beam expander is coaxial with the stray light absorber. In the invention, the semiconductor laser has the characteristics of small size and simple regulation and control of output laser; the silicon chip is modulated by the semiconductor mechanism output by the semiconductor laser, so that the purposes of simple modulation and high integration level can be realized, and the purpose of rapid chopping is realized by the characteristics of high response speed and short reaction time of the silicon chip to laser. In addition, the terahertz wave transmittance is modulated by the laser, and a rotating device is lacked, so that the aim of smaller vibration can be fulfilled.
Drawings
Fig. 1 is a schematic structural diagram of a chopper apparatus according to an embodiment of the present invention;
FIG. 2 shows a schematic structural diagram of a fiber-coupled terahertz time-domain system according to the present invention;
in the figure:
the device comprises a semiconductor laser 1, an optical beam expander 2, a silicon wafer 3, a stray light absorber 4, a signal source 5, a terahertz transmitting antenna 6 and a Gaolei detector 7.
Detailed Description
For a further understanding of the invention, embodiments of the invention are described below in conjunction with the examples, but it should be understood that these descriptions are included merely to further illustrate features and advantages of the invention, and are not intended to limit the invention.
An embodiment of the present invention discloses a chopper apparatus, as shown in fig. 1, including: the device comprises a semiconductor laser 1, an optical beam expander 2, a silicon chip 3 and a stray light absorber 4;
the semiconductor laser 1 and the optical beam expander 2 are coaxial;
the optical beam expander 2 is coaxial with the stray light absorber 4;
the semiconductor laser 1 is used for emitting laser beams, the laser beams are irradiated on the silicon wafer 3 after being expanded by the optical beam expander 2, and the stray light absorber 4 is used for absorbing reflected laser.
Preferably, the semiconductor laser further comprises a signal source 5 for outputting a stable square wave signal, wherein the square wave signal controls the laser output power of the semiconductor laser 1. The signal source 5 and the semiconductor laser 1 are electrically connected.
Preferably, the semiconductor laser 1 is a 450nm semiconductor laser.
Preferably, a holder for fixing the silicon wafer 3 is further included.
The utility model discloses a terahertz wave laser, including signal source output stabilization square wave signal, square wave signal control semiconductor laser's laser output, semiconductor laser sends the laser beam of stabilization power, and laser beam shines on the silicon chip after the optics beam expander expands the beam, the silicon chip receives terahertz wave's transmissivity semiconductor laser output laser power's regulation and control, when shining on the silicon chip as laser promptly, the silicon chip is minimum to terahertz wave's transmissivity, when not having laser irradiation on the silicon chip, the silicon chip is highest to terahertz wave's transmissivity, and when the laser of semiconductor wave laser transmission produced with the wave form, the terahertz intensity that sees through the silicon chip also appeared with the wave form, realized the chopper to terahertz wave through above-mentioned process. The stray light collecting body is used for absorbing reflected laser and reducing system noise.
The embodiment of the invention discloses a chopping method, which comprises the following steps:
the terahertz waves are irradiated on the silicon wafer,
regulating and controlling laser power, and irradiating a laser beam on a silicon chip after expanding the beam to realize chopping of terahertz waves;
absorbing the reflected laser light.
Terahertz wave and laser shine simultaneously on the silicon chip, when laser shines on the silicon chip, the silicon chip is minimum to the transmissivity of terahertz wave, and when no laser shines on the silicon chip, the silicon chip is the highest to the transmissivity of terahertz wave, and when the laser that semiconductor laser sent produced in the square wave form, the intensity of terahertz wave that sees through the silicon chip also appeared in the square wave form, realize the chopper to terahertz wave through above-mentioned process.
Preferably, the chopper device of the technical scheme is adopted to realize chopping and then is used for the high-yield detector.
Preferably, the laser power output by the semiconductor laser is regulated by a square wave signal.
The embodiment of the invention also discloses an optical fiber coupling type terahertz time-domain system, which comprises a terahertz transmitting antenna 6 and a golay detector 7, and further comprises: according to the chopper device in the technical scheme, the silicon wafer 3 in the chopper device is arranged between the terahertz transmitting antenna 6 and the tall rice detector 7.
The above description of the embodiments is only intended to facilitate the understanding of the method of the invention and its core idea. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A chopper apparatus, comprising: the device comprises a semiconductor laser (1), an optical beam expander (2), a silicon wafer (3) and a stray light absorber (4);
the semiconductor laser (1) and the optical beam expander (2) are coaxial;
the optical beam expander (2) is coaxial with the stray light absorber (4);
the semiconductor laser (1) is used for emitting laser beams, the laser beams are irradiated on the silicon wafer (3) after being expanded by the optical beam expander (2), and the stray light absorber (4) is used for absorbing reflected laser.
2. The chopping device according to claim 1, further comprising a signal source (5) for outputting a stable square wave signal that controls the laser output power of the semiconductor laser (1).
3. The chopping device according to claim 1, wherein the semiconductor laser (1) is a 450nm semiconductor laser.
4. The chopping device according to claim 1, further comprising a holder for holding the silicon wafer (3).
5. A chopping method, characterized by comprising the steps of:
the terahertz waves are irradiated on the silicon wafer,
regulating and controlling laser power, and irradiating a laser beam on a silicon chip after expanding the beam to realize chopping of terahertz waves;
absorbing the reflected laser light.
6. The chopping method according to claim 5, wherein the laser power output by the semiconductor laser is regulated by a square wave signal.
7. An optical fiber coupling type terahertz time-domain system comprises a terahertz transmitting antenna (6) and a Golay detector (7), and is characterized by further comprising: the chopping device according to any one of claims 1 to 4, wherein a silicon wafer (3) in the chopping device is arranged between the terahertz transmission antenna (6) and the Golay detector (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011242299.3A CN114459602A (en) | 2020-11-09 | 2020-11-09 | Chopping device, chopping method and optical fiber coupling type terahertz time-domain system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011242299.3A CN114459602A (en) | 2020-11-09 | 2020-11-09 | Chopping device, chopping method and optical fiber coupling type terahertz time-domain system |
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| Publication Number | Publication Date |
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| CN114459602A true CN114459602A (en) | 2022-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011242299.3A Pending CN114459602A (en) | 2020-11-09 | 2020-11-09 | Chopping device, chopping method and optical fiber coupling type terahertz time-domain system |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101174719A (en) * | 2007-10-23 | 2008-05-07 | 中国计量学院 | Terahertz wave switch device and method thereof |
| CN102109686A (en) * | 2010-11-03 | 2011-06-29 | 天津大学 | Terahertz wave photochopper based on silicon-based vanadium oxide thin film and using method thereof |
-
2020
- 2020-11-09 CN CN202011242299.3A patent/CN114459602A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101174719A (en) * | 2007-10-23 | 2008-05-07 | 中国计量学院 | Terahertz wave switch device and method thereof |
| CN102109686A (en) * | 2010-11-03 | 2011-06-29 | 天津大学 | Terahertz wave photochopper based on silicon-based vanadium oxide thin film and using method thereof |
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