CN114459267B - Uniform temperature plate device and manufacturing method thereof - Google Patents
Uniform temperature plate device and manufacturing method thereof Download PDFInfo
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- CN114459267B CN114459267B CN202011238222.9A CN202011238222A CN114459267B CN 114459267 B CN114459267 B CN 114459267B CN 202011238222 A CN202011238222 A CN 202011238222A CN 114459267 B CN114459267 B CN 114459267B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims description 128
- 229920002120 photoresistant polymer Polymers 0.000 claims description 46
- 238000005192 partition Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 22
- 238000000926 separation method Methods 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 6
- 210000001503 joint Anatomy 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000003032 molecular docking Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 239000000463 material Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
- F28F9/262—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention relates to a temperature equalization plate device and a manufacturing method thereof, wherein the temperature equalization plate device comprises a shell and a plurality of independent cavities; the shell comprises a first plate part and a second plate part which are oppositely arranged; the cavity is formed between the first plate part and the second plate part; each cavity is internally provided with an actuating liquid, at least one flow guide lug and a capillary structure, the flow guide lug is formed on the inner surface of the second plate part, and the capillary structure is arranged at one tail end of the flow guide lug; because each cavity is independent of each other and is provided with the actuating liquid, when the temperature-equalizing plate device is vertically arranged on the side of a heat source, the actuating liquid still exists in the cavity above the temperature-equalizing plate device, and the actuating liquid is not completely concentrated below the temperature-equalizing plate device, so that the contact area is increased, and the heat dissipation efficiency is improved.
Description
Technical Field
The present invention relates to a temperature equalizing plate device and a manufacturing method thereof, and more particularly to a temperature equalizing plate device with a plurality of independent cavities and a manufacturing method thereof.
Background
The temperature equalizing plate is a common heat dissipation device. The temperature equalizing plate comprises a flat shell with a vacuum closed cavity, and a capillary tissue and a heat dissipation fluid are arranged in the vacuum closed cavity of the shell. One side of the flat shell is used for contacting a heat source, such as a Central Processing Unit (CPU) of an intelligent device, and the heat energy of the heat source is absorbed by heat dissipation fluid in the temperature equalization plate to evaporate into vapor phase, and the heat dissipation is carried out on the side of the flat shell opposite to the side contacting the heat source to condense back into liquid phase, so that the purpose of heat dissipation is achieved.
However, the heat dissipation fluid in the temperature equalizing plate is affected by gravity and concentrated at the bottom of the closed cavity, so the temperature equalizing plate is generally horizontally arranged above the heat source, and the heat dissipation fluid can be close to the heat source sufficiently, thereby improving the heat dissipation efficiency.
However, when the heat source moves or turns over, the temperature equalization plate, which is originally horizontally disposed above the heat source, may turn over to be vertically disposed at the side of the heat source. At this time, the heat dissipation fluid in the temperature equalizing plate is concentrated under the influence of gravity and cannot sufficiently approach the heat source, which results in incomplete contact and poor heat dissipation efficiency.
Disclosure of Invention
In view of the above, the present invention provides a temperature equalizing plate device and a manufacturing method thereof, which can solve the problems of incomplete contact between a heat dissipating fluid and a heat source and poor heat dissipating efficiency when the temperature equalizing plate is vertically contacted with the heat source.
The temperature equalization plate device comprises a shell and a plurality of independent cavities; the shell comprises a first plate part and a second plate part which are oppositely arranged; each cavity is formed between the first plate part and the second plate part; wherein each cavity is respectively provided with an actuating liquid, at least one flow guide lug and a capillary structure, the flow guide lug is formed on an inner surface of the second plate part, and the capillary structure is arranged at one end of the flow guide lug.
In an embodiment of the invention, the housing of the temperature equalizing plate device further includes at least one partition wall, the partition wall is disposed between the first plate portion and the second plate portion, two opposite ends of the partition wall are respectively connected to the first plate portion and the second plate portion, and the partition plate can separate the cavities, so that the cavities are independent from each other.
The manufacturing method of the temperature equalization plate device comprises the following steps: providing a first substrate; forming a first annular convex part, at least a first separation convex part and a plurality of diversion convex blocks on the first substrate; wherein each of the flow guiding protrusions is separated by the first separation protrusion; wherein the first partition convex part partitions an inner side area of the first annular convex part into a plurality of first chambers; a capillary structure is respectively arranged at one tail end of each flow guiding convex block; providing a second substrate; forming a second annular convex part and at least one second partition convex part on the second substrate; docking the first substrate with the second substrate; wherein the first annular protrusion of the first substrate is in butt joint with the second annular protrusion of the second substrate, and the first partition protrusion of the first substrate is in butt joint with the second partition protrusion of the second substrate; injecting an actuating fluid into the first chamber in the inner region of the first annular protrusion of the first substrate, and vacuumizing the first chamber; and pressing the first substrate and the second substrate, so that one end of the first annular convex part of the first substrate is in close fit with one end of the second annular convex part of the second substrate, and one end of the first separation convex part of the first substrate is in close fit with one end of the second separation convex part of the second substrate.
In an embodiment of the invention, the method for manufacturing the temperature equalizing plate device further includes the following steps: after the capillary structure is respectively arranged at the tail end of each flow guide convex block, a plurality of through pipes are further arranged at the tail end of the first annular convex part; wherein each through pipe is respectively communicated with one first accommodating chamber in the inner side area of the first annular convex part; when the actuating liquid is injected into the first containing chamber of the inner side area of the first annular protruding part of the first substrate, the actuating liquid is injected into the first containing chamber of the inner side area of the first annular protruding part of the first substrate through the through pipe, and the first containing chamber is vacuumized through the through pipe; after the first base plate and the second base plate are pressed together, the exposed part of the through pipe is further cut off.
In an embodiment of the invention, the method for manufacturing the temperature equalizing plate device further includes the following steps: after forming the first annular convex part, the first separation convex part and the diversion convex part on the first substrate, forming a plurality of first joint parts at the tail end of the first annular convex part; forming a plurality of second joint parts at the tail end of the second annular convex part after forming the second annular convex part and the second separation convex part on the second substrate; when the first substrate and the second substrate are abutted, the first joint part at the tail end of the first annular convex part of the first substrate is further abutted with the second joint part at the tail end of the second annular convex part of the second substrate.
In an embodiment of the present invention, the step of forming the first annular protrusion, the first separation protrusion and the diversion protrusions on the first substrate in the manufacturing method of the temperature equalizing plate device further includes: forming a first patterned photoresist layer on the first substrate, wherein the first patterned photoresist layer is provided with a plurality of first patterned opening areas; etching the first substrate in the first patterned opening region; removing the first patterned photoresist layer to form the first annular protrusion, the first separation protrusion and the flow guide protrusion on the first substrate.
In an embodiment of the present invention, the step of forming the first joint portion at the end of the first ring protrusion in the manufacturing method of the temperature equalizing plate device further includes: forming a second patterned photoresist layer on the first substrate, wherein the second patterned photoresist layer is provided with a plurality of second patterned opening areas; wherein the second patterned opening region corresponds to an end of the first annular protrusion; etching the end of the first annular protrusion in the second patterned opening region; the second patterned photoresist layer is removed to form the first junction at the end of the first annular protrusion.
In an embodiment of the present invention, the step of forming the second annular protrusion and the second partition protrusion on the second substrate in the manufacturing method of the temperature equalizing plate device further includes: forming a third patterned photoresist layer on the second substrate, wherein the third patterned photoresist layer is provided with a plurality of third patterned opening areas; etching the second substrate in the third patterned opening region; removing the third patterned photoresist layer to form the second annular protrusion and the second partition protrusion on the second substrate.
In an embodiment of the present invention, the step of forming the second joint portions at the end of the second ring protrusion in the manufacturing method of the temperature equalizing plate device further includes: forming a fourth patterned photoresist layer on the second substrate, wherein the fourth patterned photoresist layer has a plurality of fourth patterned opening regions; wherein the fourth patterned opening region corresponds to an end of the second annular protrusion; forming the second joint parts in the fourth graphical opening area; and removing the fourth patterned photoresist layer to form the second joint part at the tail end of the second ring convex part.
In an embodiment of the invention, the manufacturing method of the temperature equalizing plate device, wherein the second joint portion is formed by electroplating.
Based on the above, in the temperature equalization plate device and the manufacturing method thereof of the invention, the temperature equalization plate device is provided with a plurality of independent cavities, and each cavity is internally provided with the actuating liquid, when the temperature equalization plate device is used, the second plate part is horizontally arranged above a heat source, and the actuating liquid in each independent cavity is utilized to dissipate heat of the heat source. When the heat source moves or overturns to cause the temperature equalizing plate device to overturn to be vertically arranged on the side edge of the heat source, as the cavities are independent and not communicated with each other, and the actuating liquid is arranged in each cavity, the actuating liquid is only concentrated under each cavity under the influence of gravity and is not fully concentrated under the temperature equalizing plate device. That is, when the temperature equalizing plate device is vertically disposed at the side of the heat source, the actuating liquid still exists in the cavity above the temperature equalizing plate device, thereby increasing the contact area and improving the heat dissipation efficiency.
Drawings
The following drawings are only for purposes of illustration and explanation of the present invention and are not intended to limit the scope of the invention. Wherein:
FIG. 1A is a schematic side view of a horizontal arrangement of a cryopanel apparatus according to an embodiment of the present invention;
FIG. 1B is a schematic top view of a temperature uniformity plate apparatus according to an embodiment of the present invention;
FIG. 1C is another schematic top view of a cryopanel apparatus according to one embodiment of the present invention;
FIG. 1D is a schematic side view of a temperature uniformity plate apparatus according to an embodiment of the present invention when it is vertically placed;
fig. 2A to 2F and fig. 2F' are schematic cross-sectional views of a first substrate of a method for manufacturing a temperature equalization plate device according to an embodiment of the invention;
FIG. 3 is a schematic top view of a first substrate corresponding to the steps of FIGS. 2F and 2F' in a method for manufacturing a temperature uniformity plate apparatus according to an embodiment of the present invention;
fig. 4A to 4E are cross-sectional views of a second substrate of a method for manufacturing a temperature uniformity plate device according to an embodiment of the present invention;
fig. 5A, 5A' to 5E are schematic cross-sectional views of a method for manufacturing a temperature equalization plate device according to an embodiment of the invention, which combines a first substrate and a second substrate.
Detailed Description
For a clearer understanding of the technical solutions, objects and effects of the present invention, specific embodiments of the present invention will now be described with reference to the accompanying drawings.
Fig. 1A to 1D are schematic side and top sectional views of a temperature uniformity plate apparatus according to an embodiment of the present invention.
Referring to fig. 1A, 1B and 1C, in the present embodiment, the apparatus 10 includes a housing 11 and a plurality of independent cavities 12. The housing 11 includes a first plate 111 and a second plate 112 disposed opposite to each other. The cavity 12 is formed between the first plate portion 111 and the second plate portion 112. Each of the cavities 12 is provided with an actuating fluid 121, at least one flow guiding protrusion 122 and a capillary structure 123, wherein the flow guiding protrusion 122 is formed on an inner surface 1121 of the second plate 112, and the capillary structure 123 is disposed at an end 1221 of the flow guiding protrusion 122.
In addition, the housing 11 of the temperature equalization plate device 10 further includes at least one partition wall 113, the partition wall 113 is disposed between the first plate portion 111 and the second plate portion 112, and two opposite ends of the partition wall 113 are respectively connected to the first plate portion 111 and the second plate portion 112, and the partition wall 113 can separate each cavity 12, so that each cavity 12 is independent from each other.
Referring to fig. 1A and fig. 1D, since the temperature equalizing plate device 10 has a plurality of independent cavities 12, each cavity 12 is provided with an actuating fluid 121. As shown in fig. 1A, when the temperature equalizing plate device 11 is used, the second plate portion 112 is horizontally disposed above a heat source 20, and the heat source 20 is radiated by the actuating fluid 121 in each independent cavity 12. As shown in fig. 1D, when the heat source 20 moves or turns over, the temperature-equalizing plate device 10 turns over to be vertically disposed at the side of the heat source 20, since the cavities 12 are independent and do not communicate with each other, and the actuating liquid 121 is disposed in each cavity 12, the actuating liquid 121 is only concentrated under each cavity 12 under the influence of gravity, but not all of the actuating liquid is concentrated under the temperature-equalizing plate device 10. When the temperature equalizing plate device 10 is vertically disposed at the side of the heat source 20, the actuating liquid 121 still exists in the cavity 12 above the temperature equalizing plate device 10, thereby increasing the contact area and improving the heat dissipation efficiency.
Fig. 2A to 2F and fig. 2F' are schematic cross-sectional views of a first substrate of a method for manufacturing a temperature equalization plate device according to an embodiment of the invention.
Referring to fig. 2A and 2B, in the present embodiment, a first substrate 21 is provided, and a first patterned photoresist layer 2101 is formed on the first substrate 21, where the first patterned photoresist layer 2101 has a plurality of first patterned opening regions 2102. In some embodiments, the material of the first substrate 21 is a metal or metal alloy with good thermal conductivity, such as copper or its alloy. The first patterned photoresist layer 2101 and the first patterned opening 2102 can be formed by spin coating (spin coating), patterning a dry film type photosensitive dielectric material, and the like, forming a photoresist layer on the first substrate 21, and patterning the photoresist layer by exposing and developing to form the first patterned photoresist layer 2101 and the first patterned opening 2102.
Referring to fig. 2B, the first substrate 21 in the first patterned opening 2102 is etched, and the first patterned photoresist layer 2101 is removed, so as to form a first annular protrusion 211, at least one first partition protrusion 212 and a plurality of diversion bumps 213 on the first substrate 21. Each of the flow guiding protrusions 213 is separated by the first separating protrusion 212, and the first separating protrusion 212 separates an inner area 2111 of the first ring protrusion 211 into a plurality of first chambers 2112.
Referring to fig. 2C, a second patterned photoresist layer 2103 is formed on the first substrate 21, and the second patterned photoresist layer 2103 has a plurality of second patterned opening regions 2104. The second patterned opening 2104 corresponds to an end 2113 of the first ring protrusion 211. In this embodiment, the method for forming the second patterned photoresist layer 2103 and the second patterned opening 2104 is similar to the method for forming the first patterned photoresist layer 2101 and the first patterned opening 2102, and thus will not be described in detail.
Referring to fig. 2D, the ends 2113 of the first ring protrusions 211 within the second patterned opening 2104 are etched.
Referring to fig. 2E, the second patterned photoresist layer 2103 is removed to form a plurality of first bonding portions 2114 at the ends 2113 of the first ring protrusions 211.
Referring to fig. 2F, a capillary structure 214 is disposed at a distal end 2131 of each of the flow-guiding protrusions 213, that is, a capillary structure 214 is disposed in each of the first chambers 2112. And the capillary structure 214 is not only formed at the end 2131 of each of the flow-guiding protrusions 213, but the capillary structure 214 covers the corresponding whole first chamber 2112.
Referring to fig. 2F', a plurality of through pipes 215 are further disposed at the distal end 2113 of the first ring protrusion 211 in the region where the first joint portion 2114 is not formed at the distal end 2113 of the first ring protrusion 211. Each of the through pipes 215 is respectively connected to one of the first chambers 2112 in the inner area 2111 of the first ring protrusion 211. In this embodiment, the material of the through pipe 215 is the same as that of the first substrate 21, and is also a metal or metal alloy with good thermal conductivity, such as copper or its alloy.
Fig. 3 is a schematic top view of a first substrate 21 corresponding to the steps of fig. 2F and 2F' in a manufacturing method of a temperature uniformity plate apparatus according to an embodiment of the present invention.
Referring to fig. 3, in the present embodiment, the first ring protrusion 211 surrounds a plurality of first chambers 2112, and the first separation protrusions 212 are formed between the first chambers 2112 to separate the first chambers 2112, so that the first chambers 2112 are independent and do not communicate with each other. Each of the first engaging portions 2114 is formed of a plurality of long grooves, and each of the long grooves and the end 2113 of the first ring protrusion 211 together form a surrounding pattern and surround each of the first chambers 2112, and in addition, each of the long grooves of the same first engaging portion 2114 has a space therebetween for the arrangement of the through pipe 215. That is, the tube 215 is not disposed above the long groove 2114. In this embodiment, the number of the first engaging portions 2114 is plural and in a concentric pattern, and the first engaging portions 2114 are formed to surround each of the first chambers 2112, for example, the number of the first engaging portions 2114 is two, the first engaging portions 2112 are formed to surround each of the first chambers 2112 in a "back" shape, or the number of the first engaging portions 2114 is three or four, and the first engaging portions 2112 are formed to surround each of the first chambers 2112. In the present embodiment, two first engaging portions 2114 are described as an example, but not limited thereto.
Fig. 4A to 4E are schematic cross-sectional views of a second substrate of a method for manufacturing a temperature equalization plate device according to an embodiment of the present invention.
Referring to fig. 4A, a second substrate 22 is provided, and a third patterned photoresist layer 2201 is formed on the second substrate 22, wherein the third patterned photoresist layer 2201 has a plurality of third patterned opening regions 2202. In this embodiment, the method for forming the third patterned photoresist layer 2201 and the third patterned opening 2202 is similar to the method for forming the first patterned photoresist layer 2101 and the first patterned opening 2102, and thus will not be described in detail.
Referring to fig. 4B, the second substrate 22 in the third patterned opening region 2202 is etched, and the third patterned photoresist layer 2201 is removed, so as to form a second annular protrusion 221 and at least one second partition protrusion 222 on the second substrate. The second partition protrusion 222 divides an inner area 2211 of the second ring protrusion 221 into a plurality of second chambers 2212.
Referring to fig. 4C, a fourth patterned photoresist layer 2203 is formed on the second substrate 22, and the fourth patterned photoresist layer 2203 has a plurality of fourth patterned opening regions 2204. The fourth patterned opening 2204 corresponds to the end 2213 of the second ring protrusion 221. In this embodiment, the method for forming the fourth patterned photoresist layer 2203 and the fourth patterned opening 2204 is similar to the method for forming the first patterned photoresist layer 2101 and the first patterned opening 2102, and thus will not be described in detail.
Referring to fig. 4D, a plurality of second bonding portions 2214 are formed in the fourth patterned opening region 2204. In the present embodiment, the method for forming the second joint portion 2214 is, for example, but not limited to, electroplating.
Referring to fig. 4E, the fourth patterned photoresist layer 2203 is removed to form the second joint portion 2214 at the end 2213 of the second ring protrusion 221.
Fig. 5A, 5A' to 5E are schematic cross-sectional views of a method for manufacturing a temperature equalization plate device according to an embodiment of the invention, which combines a first substrate and a second substrate.
Referring to fig. 5A, the first substrate 21 and the second substrate 22 are abutted. The first annular convex portion 211 of the first substrate 21 is abutted with the second annular convex portion 221 of the second substrate 22, and the first partition convex portion 212 of the first substrate 21 is abutted with the second partition convex portion 222 of the second substrate 22, and further the first joint portion 2114 of the end 2113 of the first annular convex portion 211 of the first substrate 21 is abutted with the second joint portion 2214 of the end 2213 of the second annular convex portion 221 of the second substrate 22. In the present embodiment, the first annular protrusion 211 of the first substrate 21 and the second annular protrusion 221 of the second substrate 22 have the same shape, and the first partition protrusion 212 of the first substrate 21 and the second partition protrusion 222 of the second substrate 22 have the same shape. In addition, the number and shape of the first engaging portions 2114 of the end 2113 of the first ring protrusion 211 of the first substrate 21 are matched with the second engaging portions 2214 of the end 2213 of the second ring protrusion 221 of the second substrate 22. For example, the first engaging portion 2114 may be a plurality of engaging recesses, and the second engaging portion 2214 may be a plurality of engaging protrusions, but not limited thereto, as long as the first engaging portion 2114 and the second engaging portion 2214 are in a concave-convex structure capable of being mated with each other.
In the present embodiment, the first joint portion 2114 and the second joint portion 2214 are designed into an uneven microstructure, so as to increase the contact area between the first substrate 21 and the second substrate 22, thereby improving the sealing performance and effectively reducing the thermal resistance. And the thermal resistance is effectively reduced, so that the temperature of the welding process is reduced, and the selectivity of the material is improved. In this embodiment, pure copper material is selected and used, and this material can avoid the situation of metal precipitation after heat treatment of the composite alloy material, and greatly reduce the problem of tightness.
Please refer to fig. 5A', which is another cross-sectional view different from fig. 5A, mainly the through pipe 215 can be seen.
Referring to fig. 5B, the first substrate 21 and the second substrate 22 are abutted.
Referring to fig. 5C, the actuating liquid 121 is injected into the first chamber 2112 of the inner region 2111 of the first annular protrusion 211 of the first substrate 21 through the pipe 215, and the first chamber 2112 is evacuated through the pipe 215.
Referring to fig. 5D, the first substrate 21 and the second substrate 22 are pressed together, such that one end 2113 of the first annular protrusion 211 of the first substrate 21 is in close contact with one end 2213 of the second annular protrusion 221 of the second substrate 22, and such that one end of the first partition protrusion 212 of the first substrate 21 is in close contact with one end of the second partition protrusion 222 of the second substrate 22.
In the present embodiment, the bonding method of the first substrate 21 and the second substrate 22 is performed by a soldering process, and the first substrate 21 and the second substrate 22 are bonded by heating and pressurizing.
Referring to fig. 5E, the exposed portion of the through tube 215 is cut away.
Since in the present embodiment, the shape and the number of the second ring protrusion 221, the second partition protrusion 222 and the second chamber 2212 are the same as the shape and the number of the ring protrusion 211, the first partition protrusion 212 and the first chamber 2112, respectively, and the positions are also corresponding to each other. In this way, after the first substrate 21 and the second substrate 22 are abutted, each first chamber 2112 and each second chamber 2212 can form the cavities 12 together, and the cavities 12 are independent and do not communicate with each other. The first substrate 21 and the second substrate 22 are combined to form the housing 11, and the first substrate 21 is the second plate portion 112 of the housing 11, and the second substrate 22 is the first plate portion 111 of the housing 11.
In addition, the manufacturing method of the temperature equalization plate device uses a yellow light process to manufacture, the graphical design can be directly used for manufacturing the whole large plate surface, the plate can be divided into a plurality of independent temperature equalization plate devices to design and arrange plates, and then the plate can be applied according to different requirements to cut into a plurality of required temperature equalization plate devices.
That is, the manufacturing method of the temperature equalizing plate device can design and manufacture the size and the shape of each heat source, has high matching degree, can match the shape of the heat source, and can achieve high fitting so as to increase the heat dissipation efficiency. And because the temperature equalizing plate device is provided with a plurality of independent cavities, when the temperature equalizing plate is in the vertical direction, the actuating liquid still exists in the cavity above to perform heat exchange with the heat source, and the heat exchange effect above can not be poor because the actuating liquid is concentrated to the bottom. The appearance structure of the temperature equalizing plate device can be various shapes such as square, round and the like so as to match the sizes and the shapes of different heat sources.
The present invention is not limited to the above-mentioned embodiments, but is intended to be limited to the above-mentioned embodiments, and any person skilled in the art, having the benefit of the present disclosure, can make a few changes or modifications to the equivalent embodiments without departing from the scope of the present invention, and any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical matter of the present invention fall within the scope of the present invention.
Claims (10)
1. A temperature equalization plate device, characterized in that the temperature equalization plate device comprises:
a shell comprising a first plate part and a second plate part which are oppositely arranged;
a plurality of independent cavities, each cavity formed between the first plate portion and the second plate portion;
wherein each cavity is internally provided with:
an actuating fluid;
at least one flow guiding lug formed on one inner surface of the second plate;
the capillary structure is arranged at one end of the flow guide convex block.
2. The isopipe apparatus of claim 1, wherein the housing further comprises:
at least one partition wall, the partition wall is set up between the first board portion and the second board portion, and the two opposite ends of the partition wall connect the first board portion and the second board portion separately, the partition wall can separate each said cavity, make each said cavity independent each other.
3. The manufacturing method of the temperature equalization plate device is characterized by comprising the following steps:
providing a first substrate;
forming a first annular convex part, at least a first separation convex part and a plurality of diversion convex blocks on the first substrate; wherein each of the flow guiding protrusions is separated by the first separation protrusion; wherein the first partition convex part partitions an inner side area of the first annular convex part into a plurality of first chambers;
a capillary structure is respectively arranged at one tail end of each flow guiding convex block;
providing a second substrate;
forming a second annular convex part and at least one second partition convex part on the second substrate;
docking the first substrate with the second substrate; wherein the first annular protrusion of the first substrate is in butt joint with the second annular protrusion of the second substrate, and the first partition protrusion of the first substrate is in butt joint with the second partition protrusion of the second substrate;
injecting an actuating liquid into the first chamber in the inner region of the first annular convex part of the first substrate, and vacuumizing the first chamber;
pressing the first substrate and the second substrate to enable one end of the first annular convex part of the first substrate to be in close fit with one end of the second annular convex part of the second substrate, and enable one end of the first separation convex part of the first substrate to be in close fit with one end of the second separation convex part of the second substrate.
4. The method for manufacturing a temperature equalization plate device according to claim 3, further comprising:
after the capillary structure is respectively arranged at the tail end of each flow guide convex block, a plurality of through pipes are further arranged at the tail end of the first annular convex part; wherein each through pipe is respectively communicated with one of the first accommodating chambers in the inner side area of the first annular convex part;
when the actuating liquid is injected into the first containing chamber of the inner side area of the first annular protruding part of the first substrate, the actuating liquid is injected into the first containing chamber of the inner side area of the first annular protruding part of the first substrate through the through pipe, and the first containing chamber is vacuumized through the through pipe;
after the first base plate and the second base plate are pressed together, the exposed part of the through pipe is further cut off.
5. The method for manufacturing a temperature equalization plate device according to claim 3, further comprising:
after forming the first annular convex part, the first separation convex part and the diversion convex part on the first substrate, forming a plurality of first joint parts at the tail end of the first annular convex part;
forming a plurality of second joint parts at the tail end of the second annular convex part after forming the second annular convex part and the second separation convex part on the second substrate;
when the first substrate and the second substrate are abutted, the first joint part of the tail end of the first annular convex part of the first substrate is further abutted with the second joint part of the tail end of the second annular convex part of the second substrate.
6. The method of manufacturing a temperature uniformity plate apparatus according to claim 3, wherein the step of forming the first annular protrusion, the first partition protrusion and the flow guiding protrusion on the first substrate further comprises:
forming a first patterned photoresist layer on the first substrate, wherein the first patterned photoresist layer is provided with a plurality of first patterned opening areas;
etching the first substrate in the first patterned opening region;
removing the first patterned photoresist layer to form the first annular protrusion, the first separation protrusion and the flow guide protrusion on the first substrate.
7. The method of manufacturing a temperature equalization plate device according to claim 5, wherein the step of forming the first joint portion at the end of the first ring protrusion further comprises:
forming a second patterned photoresist layer on the first substrate, wherein the second patterned photoresist layer is provided with a plurality of second patterned opening areas; wherein the second patterned opening region corresponds to an end of the first annular protrusion;
etching the end of the first annular protrusion in the second patterned opening region;
the second patterned photoresist layer is removed to form the first junction at the end of the first annular protrusion.
8. The method of manufacturing a temperature uniformity plate device according to claim 3, wherein forming said second annular protrusion and said second partition protrusion on said second substrate further comprises:
forming a third patterned photoresist layer on the second substrate, wherein the third patterned photoresist layer is provided with a plurality of third patterned opening areas;
etching the second substrate in the third patterned opening region;
removing the third patterned photoresist layer to form the second annular protrusion and the second partition protrusion on the second substrate.
9. The method of manufacturing a temperature equalization plate device according to claim 5, wherein the step of forming said second joint portion at the end of said second ring protrusion further comprises:
forming a fourth patterned photoresist layer on the second substrate, wherein the fourth patterned photoresist layer has a plurality of fourth patterned opening regions; wherein the fourth patterned opening region corresponds to an end of the second annular protrusion;
forming the second joint parts in the fourth graphical opening area;
and removing the fourth patterned photoresist layer to form the second joint part at the tail end of the second ring convex part.
10. The method of manufacturing a cryopanel apparatus of claim 9, wherein the second joint is formed by electroplating.
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