CN114456425A - Photosensitive dry film and preparation method thereof - Google Patents
Photosensitive dry film and preparation method thereof Download PDFInfo
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- CN114456425A CN114456425A CN202111595489.8A CN202111595489A CN114456425A CN 114456425 A CN114456425 A CN 114456425A CN 202111595489 A CN202111595489 A CN 202111595489A CN 114456425 A CN114456425 A CN 114456425A
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- dry film
- photosensitive dry
- alkali
- soluble resin
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 17
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000003999 initiator Substances 0.000 claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 14
- 230000000996 additive effect Effects 0.000 claims abstract description 14
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 12
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 12
- NQSLZEHVGKWKAY-UHFFFAOYSA-N 6-methylheptyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C(C)=C NQSLZEHVGKWKAY-UHFFFAOYSA-N 0.000 claims abstract description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 10
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 claims abstract description 10
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 6
- 239000003112 inhibitor Substances 0.000 claims abstract description 4
- 239000003513 alkali Substances 0.000 claims description 6
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 238000010557 suspension polymerization reaction Methods 0.000 claims description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 3
- 150000004056 anthraquinones Chemical class 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 238000012719 thermal polymerization Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2433/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A photosensitive dry film and a preparation method thereof comprise the following components in parts by weight: 35-45 parts of modified acrylic resin, 30-40 parts of solvent, 1-3 parts of photopolymerization initiator and 40-55 parts of alkali-soluble resin, wherein the alkali-soluble resin is composed of 5-10 parts of methacrylic acid, 10-20 parts of tetrahydrofurfuryl methacrylate and 10-25 parts of isooctyl methacrylate, the modified acrylic resin, the photopolymerization initiator and an alkali-soluble resin additive are dissolved in the solvent according to the set proportion, stirred for 4 hours at 25 ℃, and impurities are removed by a 500-mesh filter to obtain a photosensitive dry film solution; and coating the stirred and filtered photosensitive dry film solution on a PET (polyethylene terephthalate) film, and drying to obtain a photosensitive dry film finished product. The invention has higher adhesive force and strong corrosion inhibitor.
Description
Technical Field
The invention relates to a photosensitive dry film, in particular to a photosensitive dry film and a preparation method thereof.
Background
The photosensitive dry film is a high-molecular functional photoinduced imaging film, has the characteristics of ultraviolet photosensitivity and easy dissolution of alkali liquor, and is used for manufacturing precise circuit board patterns. The manufacture of the circuit board is a complex process which can be completed only by professional personnel and needs a plurality of working procedures. Wherein, only the manufacture of the circuit pattern comprises the following steps: firstly, covering a layer of corrosion-resistant chemical film (screen printing or film pasting) on a clean copper-clad plate, then carrying out film ultraviolet exposure, developing to form a pattern by using a sodium carbonate solution, electroplating by using electroplating liquid, etching by using etching solutions such as ammonium persulfate and the like to remove unnecessary metal copper, finally removing the exposed etching-resistant film by using a strong alkali sodium hydroxide solution, completing the circuit pattern preparation, and finally carrying out the next steps of solder resistance, characters, tin spraying, appearance and the like. At present, a great number of manufacturers in the printed circuit board industry at home still adopt a screen printing mode for manufacturing circuit patterns, namely, a photosensitive wet film is printed on a copper-clad plate, and then the photosensitive wet film is dried to be exposed, developed, electroplated, etched and demoulded.
The existing photosensitive dry film has poor viscosity on one hand and poor film forming property in the preparation process on the other hand.
Disclosure of Invention
In order to solve the technical problems, the invention provides a photosensitive dry film and a preparation method thereof.
In order to solve the technical problems, the invention adopts the following technical scheme:
a photosensitive dry film comprises the following components in parts by weight:
35-45 parts of modified acrylic resin, 30-40 parts of solvent, 1-3 parts of photopolymerization initiator and 40-55 parts of alkali-soluble resin, wherein the alkali-soluble resin is composed of 5-10 parts of methacrylic acid, 10-20 parts of tetrahydrofurfuryl methacrylate and 10-25 parts of isooctyl methacrylate.
The photopolymerization initiator is a mixture consisting of one or more of benzoin ether, benzophenone and derivatives thereof, thioxanthone series compounds, anthraquinone and derivatives thereof, thioxanthone series compounds and hexaarylbisimidazole series compounds according to any proportion.
The alkali-soluble resin has a weight average molecular weight of 120000-140000 and a PDI of less than 2.1.
The dye-sensitized solar cell panel also comprises an additive, wherein the additive is 1-2 parts of a tackifier, a plasticizer, a pigment, a light irradiation chromophoric dye, a thermal polymerization inhibitor, an antioxidant or a leveling agent.
The solid content of the modified acrylic resin is 45 percent, the viscosity is Z3-Z4, the acid value is 60mgKOH/g, and the molecular weight is 100000-108000.
A preparation method of a photosensitive dry film comprises the following steps:
dissolving modified acrylic resin, a photopolymerization initiator and an alkali-soluble resin additive in a solvent according to a set proportion, stirring for 4 hours at 25 ℃, and removing impurities by using a 500-mesh filter to obtain a photosensitive dry film solution;
and coating the stirred and filtered photosensitive dry film solution on a PET (polyethylene terephthalate) film, and drying to obtain a photosensitive dry film finished product.
The alkali soluble resin is obtained by mixing methacrylic acid, tetrahydrofurfuryl methacrylate and isooctyl methacrylate and then carrying out suspension polymerization.
The invention has higher adhesive force and strong corrosion inhibitor, is beneficial to improving the yield of production and is not easy to damage in the application process.
Detailed Description
The following describes embodiments of the present invention in detail.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like, if any, are used in an orientation or positional relationship indicated for convenience and simplicity of description, and do not indicate or imply that the device or element so referred to must be in a particular orientation, constructed and operated in a particular orientation, and therefore should not be considered as limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example one
A photosensitive dry film comprises the following components in parts by weight:
35 parts of modified acrylic resin, 30 parts of solvent, 1 part of photopolymerization initiator and 40 parts of alkali-soluble resin, wherein the alkali-soluble resin is obtained by suspension polymerization of 5 parts of methacrylic acid, 10 parts of tetrahydrofurfuryl methacrylate and 10 parts of isooctyl methacrylate.
The photopolymerization initiator is benzoin ether.
The alkali-soluble resin had a weight average molecular weight of 120000 and a PDI of 2.0.
The adhesive also comprises an additive, wherein the additive is 1 part of tackifier.
The solid content of the modified acrylic resin is 45%, the viscosity Z3, the acid value is 60mgKOH/g, and the molecular weight is 100000.
Dissolving modified acrylic resin, a photopolymerization initiator and an alkali-soluble resin additive in a solvent according to a set proportion, stirring for 4 hours at 25 ℃, and removing impurities by using a 500-mesh filter to obtain a photosensitive dry film solution;
and coating the stirred and filtered photosensitive dry film solution on a PET (polyethylene terephthalate) film, and drying to obtain a photosensitive dry film finished product.
Example two
A photosensitive dry film comprises the following components in parts by weight:
40 parts of modified acrylic resin, 35 parts of solvent, 2 parts of photopolymerization initiator and 48 parts of alkali-soluble resin, wherein the alkali-soluble resin is composed of 7 parts of methacrylic acid, 15 parts of tetrahydrofurfuryl methacrylate and 20 parts of isooctyl methacrylate.
The photopolymerization initiator is a mixture of benzoin ether, benzophenone and derivatives thereof.
The alkali-soluble resin had a weight average molecular weight of 130000 and a PDI of 1.8.
The adhesive also comprises an additive, wherein the additive is 2 parts of a plasticizer.
The solid content of the modified acrylic resin is 45%, the viscosity Z4, the acid value is 60mgKOH/g, and the molecular weight is 106000.
Dissolving modified acrylic resin, a photopolymerization initiator and an alkali-soluble resin additive in a solvent according to a set proportion, stirring for 4 hours at 25 ℃, and removing impurities by using a 500-mesh filter to obtain a photosensitive dry film solution;
and coating the stirred and filtered photosensitive dry film solution on a PET (polyethylene terephthalate) film, and drying to obtain a photosensitive dry film finished product.
The alkali soluble resin is obtained by mixing methacrylic acid, tetrahydrofurfuryl methacrylate and isooctyl methacrylate and then carrying out suspension polymerization.
EXAMPLE III
A photosensitive dry film comprises the following components in parts by weight:
45 parts of modified acrylic resin, 40 parts of solvent, 3 parts of photopolymerization initiator and 55 parts of alkali-soluble resin, wherein the alkali-soluble resin is composed of 10 parts of methacrylic acid, 20 parts of tetrahydrofurfuryl methacrylate and 25 parts of isooctyl methacrylate.
The photopolymerization initiator is a mixture of benzoin ether, benzophenone and derivatives thereof, thioxanthone compounds, anthraquinone and derivatives thereof.
The alkali-soluble resin had a weight average molecular weight of 140000 and a PDI of 1.5.
The additive is 2 parts of antioxidant.
The solid content of the modified acrylic resin is 45%, the viscosity Z4, the acid value is 60mgKOH/g, and the molecular weight is 108000.
Dissolving modified acrylic resin, a photopolymerization initiator and an alkali-soluble resin additive in a solvent according to a set proportion, stirring for 4 hours at 25 ℃, and removing impurities by using a 500-mesh filter to obtain a photosensitive dry film solution;
and coating the stirred and filtered photosensitive dry film solution on a PET (polyethylene terephthalate) film, and drying to obtain a photosensitive dry film finished product.
The alkali soluble resin is obtained by mixing methacrylic acid, tetrahydrofurfuryl methacrylate and isooctyl methacrylate and then carrying out suspension polymerization.
Although the present invention has been described in detail with reference to the embodiments, it will be apparent to those skilled in the art that modifications, equivalents, improvements, and the like can be made in the technical solutions of the foregoing embodiments or in some of the technical features of the foregoing embodiments, but those modifications, equivalents, improvements, and the like are all within the spirit and principle of the present invention.
Claims (7)
1. The photosensitive dry film is characterized by comprising the following components in parts by weight:
35-45 parts of modified acrylic resin, 30-40 parts of solvent, 1-3 parts of photopolymerization initiator and 40-55 parts of alkali-soluble resin, wherein the alkali-soluble resin is composed of 5-10 parts of methacrylic acid, 10-20 parts of tetrahydrofurfuryl methacrylate and 10-25 parts of isooctyl methacrylate.
2. A photosensitive dry film according to claim 1, wherein the photopolymerization initiator is a mixture of one or more of benzoin ether, benzophenone and a derivative thereof, a thioxanthone-based compound, anthraquinone and a derivative thereof, a thioxanthone-based compound, and a hexaarylbisimidazole-based compound in any ratio.
3. A photosensitive dry film according to claim 1, wherein the alkali-soluble resin has a weight average molecular weight of 120000-140000 and a PDI of less than 2.1.
4. The photosensitive dry film of claim 1, further comprising an additive which is 1 to 2 parts of a tackifier, a plasticizer, a pigment, a light irradiation chromophoric dye, a thermal polymerization inhibitor, an antioxidant or a leveling agent.
5. The photosensitive dry film of claim 1, wherein the modified acrylic resin has a solid content of 45%, a viscosity of Z3-Z4, an acid value of 60mgKOH/g, and a molecular weight of 100000-108000.
6. The preparation method of the photosensitive dry film is characterized by comprising the following steps:
dissolving modified acrylic resin, a photopolymerization initiator and an alkali-soluble resin additive in a solvent according to a set proportion, stirring for 4 hours at 25 ℃, and removing impurities by using a 500-mesh filter to obtain a photosensitive dry film solution;
and coating the stirred and filtered photosensitive dry film solution on a PET (polyethylene terephthalate) film, and drying to obtain a photosensitive dry film finished product.
7. The method according to claim 6, wherein the alkali soluble resin is obtained by suspension polymerization of methacrylic acid, tetrahydrofurfuryl methacrylate, and isooctyl methacrylate after mixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111595489.8A CN114456425A (en) | 2021-12-23 | 2021-12-23 | Photosensitive dry film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111595489.8A CN114456425A (en) | 2021-12-23 | 2021-12-23 | Photosensitive dry film and preparation method thereof |
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| Publication Number | Publication Date |
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| CN114456425A true CN114456425A (en) | 2022-05-10 |
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| CN202111595489.8A Pending CN114456425A (en) | 2021-12-23 | 2021-12-23 | Photosensitive dry film and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105573056A (en) * | 2015-12-18 | 2016-05-11 | 杭州福斯特光伏材料股份有限公司 | Light-sensing dry film resist |
| CN108983550A (en) * | 2018-08-03 | 2018-12-11 | 广东泰亚达光电有限公司 | A kind of water soluble light-sensitive dry film and preparation method thereof |
| CN112099312A (en) * | 2020-10-19 | 2020-12-18 | 河源诚展科技有限公司 | Photoresist dry film and preparation method thereof |
| WO2021036538A1 (en) * | 2019-08-29 | 2021-03-04 | 浙江福斯特新材料研究院有限公司 | Photosensitive resin composition and application thereof |
-
2021
- 2021-12-23 CN CN202111595489.8A patent/CN114456425A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105573056A (en) * | 2015-12-18 | 2016-05-11 | 杭州福斯特光伏材料股份有限公司 | Light-sensing dry film resist |
| CN108983550A (en) * | 2018-08-03 | 2018-12-11 | 广东泰亚达光电有限公司 | A kind of water soluble light-sensitive dry film and preparation method thereof |
| WO2021036538A1 (en) * | 2019-08-29 | 2021-03-04 | 浙江福斯特新材料研究院有限公司 | Photosensitive resin composition and application thereof |
| CN112099312A (en) * | 2020-10-19 | 2020-12-18 | 河源诚展科技有限公司 | Photoresist dry film and preparation method thereof |
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